CN113137910A - Composite film sensor - Google Patents
Composite film sensor Download PDFInfo
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- CN113137910A CN113137910A CN202010058392.2A CN202010058392A CN113137910A CN 113137910 A CN113137910 A CN 113137910A CN 202010058392 A CN202010058392 A CN 202010058392A CN 113137910 A CN113137910 A CN 113137910A
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- film
- sensor
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- composite
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
- G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Abstract
The invention discloses a composite film sensor which comprises two film substrates, two conductive pattern layers, at least one piezoelectric film and at least one film pressure sensor. The two conductive pattern layers are respectively arranged on the inner side surfaces of the two film substrates; the piezoelectric film and the film pressure sensor are arranged between the two film substrates and are electrically connected with the two conductive pattern layers; when the film base material is stressed to bend or deform, the piezoelectric film outputs a first sensing signal in a voltage form to detect the deformation or action of the film base material, and the piezoelectric film outputs a second sensing signal in a current form to detect the change of the pressure borne by the film base material.
Description
Technical Field
The present invention relates to a composite film sensor, and more particularly, to a composite film sensor for detecting motion, displacement or pressure.
Background
As sensor technology has evolved, various types of sensors have been utilized for various products or measurement applications. The existing sensor types are quite numerous, for example: temperature, humidity, pressure, motion, etc. However, most of the existing sensors have only a single function, so when different types of parameters are to be measured, a plurality of sensors must be provided at the same time, which causes troubles in product design. Moreover, since most of the existing sensors are designed in a single body, when the sensors are arranged, wires or contacts for connecting the sensors must be additionally arranged, which causes inconvenience in arranging the sensors and limits the applications of the sensors.
For the above reasons, the disadvantages of the conventional operation and pressure sensor in use are caused, and how to solve the above problems through structural improvement has become one of the important issues to be solved by the product.
Disclosure of Invention
The technical problem to be solved by the invention is to improve the defects that the existing action sensor and pressure sensor only have single functions and are not easy to install and set.
In order to solve the above technical problems, an embodiment of the present invention provides a composite film sensor, which includes two film substrates, two conductive pattern layers, at least one film pressure sensor, at least one piezoelectric film, and a plurality of conductive traces and a plurality of circuit contacts formed on the two conductive layers, respectively. The two film substrates are respectively provided with an inner side surface and an outer side surface, and the two film substrates are mutually overlapped in a mode that the inner side surfaces are opposite to each other; the two conductive pattern layers are respectively arranged on the inner side surfaces of the two film substrates; at least one film pressure sensor is arranged between the two film substrates and is electrically connected with the two conductive pattern layers; the piezoelectric film is arranged between the two film substrates, and two side faces of the piezoelectric film are respectively bonded to one side face, opposite to the two film substrates, of the two conductive pattern layers through conductive adhesive, so that the two side faces of the piezoelectric film and the surfaces of the two conductive pattern layers are fixedly combined and electrically connected; the two conducting layers respectively form a plurality of conducting circuits and a plurality of circuit contacts, and the conducting circuits are respectively electrically connected with at least one film pressure sensor, at least one piezoelectric film and the circuit contacts, so that the at least one film pressure sensor and the at least one piezoelectric film are respectively electrically connected with the circuit contacts; the two film substrates, the at least one film pressure sensor and the at least one piezoelectric film have flexibility, the at least one film pressure sensor can output a pressure sensing signal when bearing pressure, and the at least one piezoelectric film can output a voltage signal when bearing pressure or bending deformation.
In a preferred embodiment of the present invention, the thin film pressure sensor is one of a capacitive pressure sensor, a resistive pressure sensor, or a piezoelectric pressure sensor.
In a preferred embodiment of the present invention, the piezoelectric film is a polyvinylidene fluoride film.
In a preferred embodiment of the present invention, the two film substrates are flexible polymer film substrates, and the two conductive layers are metal layers or metal oxide layers disposed on the surfaces of the film substrates.
In a preferred embodiment of the present invention, each of the conductive pattern layers is provided with at least one contact electrode at a position corresponding to at least one of the piezoelectric thin films, an area of at least one of the contact electrodes is equal to or larger than an area of at least one of the piezoelectric thin films, and two side surfaces of at least one of the piezoelectric thin films are attached to at least one of the contact electrodes through a conductive adhesive.
In a preferred embodiment of the present invention, among the conductive traces, the conductive trace connected to at least one of the thin film pressure sensors and the conductive trace connected to at least one of the piezoelectric thin films are not connected to each other.
In a preferred embodiment of the present invention, at least one of the piezoelectric thin films and at least one of the thin film pressure sensors are linearly arranged on the thin film substrate to form a linear sensor array.
In a preferred embodiment of the present invention, a linear sensor array formed by a plurality of the piezoelectric thin films and a plurality of the thin film pressure sensors is disposed on the thin film substrate in a parallel manner, so as to form a planar sensor array.
In a preferred embodiment of the present invention, a linear sensor array formed by a plurality of the piezoelectric thin films and a plurality of the thin film pressure sensors is disposed on the thin film substrate in a crisscross arrangement.
In a preferred embodiment of the present invention, the piezoelectric films are arranged in a ring shape around at least one of the film pressure sensors.
For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description of the invention and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the invention.
Drawings
FIG. 1 is a schematic cross-sectional view of a composite film sensor according to an embodiment of the invention.
FIG. 2 is a schematic top view of a composite film sensor according to an embodiment of the invention.
FIG. 3 is a schematic top view of a composite film sensor according to another embodiment of the invention.
Fig. 4 to 7 are schematic top views of various embodiments of the composite film sensor according to the present invention.
FIG. 8 is a diagram illustrating the use status of the composite film sensor mounted on a mattress according to the embodiment of the present invention.
Detailed Description
The following is a description of the embodiments of the composite film sensor disclosed in the present application with reference to specific embodiments, and those skilled in the art will understand the advantages and effects of the present invention from the disclosure of the present application. The invention is capable of other and different embodiments and its several details are capable of modification and various other changes, which can be made in various details within the specification and without departing from the spirit and scope of the invention. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.
It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or from one signal to another signal. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.
Fig. 1 to 3 show an embodiment of a composite film sensor 1 according to the present invention. The composite film sensor 1 of the present invention mainly comprises: two film substrates 10, a conductive pattern layer 20 disposed on the surface of the film substrate 10, at least one piezoelectric film 30, and a film pressure sensor 40.
In this embodiment, the film substrate 10 is a flexible printed circuit board, and the conductive pattern layer 20 is a conductive circuit disposed on the flexible printed circuit board. Specifically, the film substrate 10 and the conductive pattern layer 20 may be made by other methods, for example, the film substrate 10 may be made of various types of plastics or polymer materials, such as: the conductive pattern layer 20 can be a metal layer, a metal oxide layer or other conductive materials (e.g., conductive rubber, graphite printed layer) disposed on the surface of the film substrate 10 by electroplating or printing.
The film substrates 10 respectively have an inner side and an outer side, the two film substrates 10 are mutually overlapped in a manner that the inner sides are opposite to each other, and the two conductive pattern layers 20 are respectively arranged on the inner sides of the two film substrates. At least one piezoelectric film 30 and at least one film pressure sensor 40 are sandwiched between the two film substrates 10 and electrically connected to the two conductive pattern layers 20, thereby forming a sandwich structure. The film substrate 10, the piezoelectric film 30 and the film pressure sensor 40 of the present invention all have a flexible film or sheet structure, so that the composite film sensor 1 of the present invention has a flexible structure.
As shown in fig. 2, the conductive pattern layer 20 of the composite film sensor 1 of the present invention includes a plurality of conductive traces 22, a plurality of contact electrodes 21, and a plurality of circuit pads 23 formed at one end of the film substrate 10 and connected to the conductive traces. Wherein the positions of the plurality of contact electrodes 21 of the conductive pattern layer 20 correspond to the positions of the respective piezoelectric thin films 30, and the area of each contact electrode 21 is larger than the area of the piezoelectric thin film 30. Two side surfaces of the piezoelectric film 30 are respectively adhered to the surfaces of the contact electrodes 21 through the conductive adhesive 31, so that the two side surfaces of the piezoelectric film 30 are respectively electrically connected with the contact electrodes 21 through the conductive adhesive 31.
The conductive traces 22 are electrically connected to the thin film pressure sensor 40 and the contact electrodes 21, so that the sensing signals output by the piezoelectric thin film 30 and the thin film pressure sensor 40 can be conducted to the circuit contacts 23 through the conductive traces 22, and then connected to the signal processing circuit through the circuit contacts 23, so that the sensing signals output by the piezoelectric thin film 30 and the thin film pressure sensor 40 can be transmitted to the signal processing circuit (not shown) for signal processing.
The composite type thin film sensor 1 of the present invention is a sensor formed by combining at least one thin film pressure sensor 40 and at least one piezoelectric thin film 30. The piezoelectric film 30 and the film pressure sensor 40 are respectively configured to generate a first sensing signal and a second sensing signal. The piezoelectric film 30 is made of a polymer material having piezoelectric properties, such as polyvinyl chloride, polyvinylidene fluoride (PVDF), nylon, etc., so that when the piezoelectric film 30 is bent or deformed under pressure, opposite positive and negative charges are generated on the two side surfaces of the piezoelectric film 30, thereby outputting a voltage signal.
The film pressure sensor 40 can be selected from a resistive or capacitive film sensing component, and the film pressure sensor 40 can change its impedance when subjected to pressure, and thus can be used to detect the change in pressure.
In more detail, the composite film sensor 1 of the present invention is provided with two sensing elements having different characteristics, namely, the piezoelectric film 30 and the film pressure sensor 40, so that the output first sensing signal and the output second sensing signal can respectively detect different types of parameters. For example, when the film substrate 10 is bent, twisted or pressed, the piezoelectric film 30 deforms along with the film substrate 10, so that the piezoelectric film 30 can output the first sensing signal in advance, and the signal processing circuit can determine the information of the bending or deformation of the film substrate 10 when receiving the first sensing signal. The film pressure sensor 40 can detect the change of the pressure acting on the two sides of the film substrate 10 through the change of the impedance, so that the first sensing signal in the form of the voltage output by the piezoelectric film 30 can be used to detect any slight deformation or bending of the film substrate 10, and the second sensing signal output by the film pressure sensor 40 can be used to detect the change of the pressure or the absolute value of the pressure of the film sensor of the present invention.
Specifically, the first sensing signal and the second sensing signal outputted by the thin film pressure sensor 40 of the piezoelectric thin film 30 of the present invention belong to different types of signals, for example: the first sensing signal is a voltage signal, the second sensing signal is a current signal, and the intensity of the second sensing signal varies with the impedance of the thin film pressure sensor 40. More specifically, the signal processing circuit used in conjunction with the present invention can output an activation current through the thin film pressure sensor 40 in a continuous or discontinuous manner, and when the composite thin film sensor 1 of the present invention is subjected to a pressure and is bent or deformed, the piezoelectric thin film 30 outputs a voltage to the signal processing circuit to form a first sensing signal, and then the activation current output from the signal processing circuit to the thin film pressure sensor 40 changes in intensity due to a change in impedance of the thin film pressure sensor 40, thereby forming the second sensing signal.
One of the characteristics of the present invention is that the film substrate 10 can be designed into various shapes, the conductive pattern layer 20 can be formed on the surface of the film substrate 10 in a patterned manner, and the piezoelectric film 30 and the film pressure sensor 40 can also be disposed between the two film substrates 10 in different arrangements according to the actual requirement.
For example, as shown in fig. 2, the film substrate 10 is in a straight strip shape, the conductive traces 22 of the conductive pattern layer 20 are in a straight line shape, and the piezoelectric film 30 and the film pressure sensor 40 are disposed between the two film substrates 10 in a straight line arrangement. In particular, in the present embodiment, the number of the piezoelectric thin film 30 and the number of the thin film pressure sensors 40 are both one, but in actual use, the number of the piezoelectric thin film 30 and the number of the thin film pressure sensors 40 are not limited to those disclosed in the drawings.
In addition, the sensor arrangement of the composite film sensor 1 of the present invention has many variations, for example, in the embodiment shown in fig. 3, in the conductive pattern layer 20, the conductive traces are divided into the conductive trace 22 connected to the film pressure sensor 40 and the conductive trace 24 connected to the piezoelectric film 30, and the conductive trace 22 and the conductive trace 24 are not connected to each other, so that the sensing signals output by the film pressure sensor 40 and the piezoelectric film 30 are output through different conductive traces.
In the embodiment shown in fig. 4, the film base material 10 is designed into a strip-shaped structure, and the plurality of piezoelectric films 30 and the film pressure sensors 40 are arranged on the film base material 10 at intervals, so that a strip-shaped linear sensor array is formed.
In the embodiment shown in fig. 5, the film base 10 is designed as a large-area planar film, and a plurality of linear sensor arrays each including the piezoelectric film 30 and the film pressure sensor 40 are arranged side by side on the film base 10, thereby forming a planar sensor array.
In the embodiment shown in fig. 6, the strip-shaped sensor arrays shown in fig. 4 are arranged in a crisscross arrangement, so that a multi-dimensional planar sensor array is formed.
In the embodiment shown in fig. 7, a plurality of piezoelectric films 30 are arranged in a ring around the film pressure sensor 40, thereby forming a sensor array in the form of a web.
As shown in fig. 8, in the embodiment of the composite film sensor 1 of the present invention, the composite film sensor 1 of the present invention is disposed on a mattress 50, so that the composite film sensor 1 of the present invention can be used to detect various actions of a human body lying on the mattress 50 for turning over or moving the body, and simultaneously detect the pressure of each part of the user's body contacting the mattress 50. The parameters measured by the composite film sensor 1 of the present invention can be used for sleep management or health management.
[ possible effects of the embodiment ]
As described above, the present invention has an advantageous effect that it is possible to detect a minute motion and a change in the pressure value applied to the sensor by the combination of the piezoelectric film 30 and the film pressure sensor 40, thereby achieving a more diversified detection object. Meanwhile, the composite film sensor 1 of the invention has a simple structure, and the structure can be changed according to requirements, so that the invention can be widely applied to various detection purposes.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, so that all equivalent technical changes made by using the contents of the present specification and the accompanying drawings are included in the scope of the present invention.
Claims (10)
1. A composite thin film sensor, comprising:
the two film substrates are respectively provided with an inner side surface and an outer side surface, and the two film substrates are mutually overlapped in a mode that the inner side surfaces are opposite to each other;
the two conductive pattern layers are respectively arranged on the inner side surfaces of the two film substrates;
at least one film pressure sensor arranged between the two film substrates and electrically connected with the two conductive pattern layers;
the piezoelectric film is arranged between the two film substrates, and two side faces of the piezoelectric film are respectively bonded to one side face, opposite to the two film substrates, of the two conductive pattern layers through conductive adhesive, so that the two side faces of the piezoelectric film and the surfaces of the two conductive pattern layers are fixedly combined and electrically connected;
the two conducting layers respectively form a plurality of conducting circuits and a plurality of circuit contacts, and the conducting circuits are respectively electrically connected with at least one film pressure sensor, at least one piezoelectric film and the circuit contacts, so that the at least one film pressure sensor and the at least one piezoelectric film are respectively electrically connected with the circuit contacts;
the two film substrates, the at least one film pressure sensor and the at least one piezoelectric film have flexibility, the at least one film pressure sensor can output a pressure sensing signal when bearing pressure, and the at least one piezoelectric film can output a voltage signal when bearing pressure or bending deformation.
2. The composite membrane sensor of claim 1, wherein said membrane pressure sensor is one of a capacitive pressure sensor, a resistive pressure sensor, or a piezoelectric pressure sensor.
3. The composite film sensor of claim 1, wherein the piezoelectric film is a polyvinylidene fluoride film.
4. The composite film sensor of claim 1, wherein the two film substrates are flexible polymer film substrates, and the two conductive layers are metal layers or metal oxide layers disposed on the surfaces of the film substrates.
5. The composite film sensor of claim 1, wherein each of the conductive pattern layers is disposed with at least one contact electrode corresponding to at least one of the piezoelectric films, the area of at least one of the contact electrodes is equal to or larger than the area of at least one of the piezoelectric films, and two side surfaces of at least one of the piezoelectric films are attached to at least one of the contact electrodes through a conductive adhesive.
6. The composite film sensor of claim 1, wherein the conductive traces connecting at least one of the film pressure sensors and the conductive traces connecting at least one of the piezoelectric films are not connected to each other.
7. The composite film sensor of claim 1, wherein at least one of the piezoelectric films and at least one of the film pressure sensors are linearly arranged on the film substrate to form a linear sensor array.
8. The composite film sensor of claim 7, wherein the linear sensor arrays formed by the piezoelectric films and the film pressure sensors are disposed side by side on the film substrate to form a planar sensor array.
9. The composite film sensor of claim 7, wherein the linear sensor array formed by the piezoelectric films and the film pressure sensors is disposed in a grid-like arrangement on the film substrate.
10. The composite film sensor of claim 1, wherein a plurality of the piezoelectric films are disposed in a ring arrangement around at least one of the film pressure sensors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010058392.2A CN113137910A (en) | 2020-01-19 | 2020-01-19 | Composite film sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010058392.2A CN113137910A (en) | 2020-01-19 | 2020-01-19 | Composite film sensor |
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| Publication Number | Publication Date |
|---|---|
| CN113137910A true CN113137910A (en) | 2021-07-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010058392.2A Pending CN113137910A (en) | 2020-01-19 | 2020-01-19 | Composite film sensor |
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| CN (1) | CN113137910A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10148678A1 (en) * | 2001-10-02 | 2003-04-24 | Gaston Glock | Piezoelectric device |
| CN101593054A (en) * | 2008-05-29 | 2009-12-02 | 达方电子股份有限公司 | input module of electronic device and input method thereof |
| KR20110105026A (en) * | 2010-03-18 | 2011-09-26 | 한국표준과학연구원 | Manufacturing method of force or pressure sensor array, force or pressure sensor array using semiconductor strain gage and method of measuring force or pressure using force or pressure sensor array |
| CN104995494A (en) * | 2013-01-10 | 2015-10-21 | 日本写真印刷株式会社 | Adhesion layer-equipped film-shaped pressure-sensitive sensor, and touch pad, protection panel with touch input, and electronic device which uses same |
| CN106289594A (en) * | 2016-11-02 | 2017-01-04 | 吉林大学 | Three-dimension deformation-quantity and the sensor array of three-dimensional pressure high-precise synchronization measurement can be realized |
| US20170160147A1 (en) * | 2014-08-22 | 2017-06-08 | Murata Manufacturing Co., Ltd. | Piezoelectric sensor and detecting device |
| TWI653737B (en) * | 2018-02-09 | 2019-03-11 | 華一聲學股份有限公司 | Thin-film sensor |
| CN110261011A (en) * | 2018-03-12 | 2019-09-20 | 华一声学股份有限公司 | Thin film sensor |
| CN110595647A (en) * | 2019-09-09 | 2019-12-20 | 中南大学 | A multifunctional flexible strain-pressure sensor and its preparation method |
-
2020
- 2020-01-19 CN CN202010058392.2A patent/CN113137910A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10148678A1 (en) * | 2001-10-02 | 2003-04-24 | Gaston Glock | Piezoelectric device |
| CN101593054A (en) * | 2008-05-29 | 2009-12-02 | 达方电子股份有限公司 | input module of electronic device and input method thereof |
| KR20110105026A (en) * | 2010-03-18 | 2011-09-26 | 한국표준과학연구원 | Manufacturing method of force or pressure sensor array, force or pressure sensor array using semiconductor strain gage and method of measuring force or pressure using force or pressure sensor array |
| CN104995494A (en) * | 2013-01-10 | 2015-10-21 | 日本写真印刷株式会社 | Adhesion layer-equipped film-shaped pressure-sensitive sensor, and touch pad, protection panel with touch input, and electronic device which uses same |
| US20170160147A1 (en) * | 2014-08-22 | 2017-06-08 | Murata Manufacturing Co., Ltd. | Piezoelectric sensor and detecting device |
| CN106289594A (en) * | 2016-11-02 | 2017-01-04 | 吉林大学 | Three-dimension deformation-quantity and the sensor array of three-dimensional pressure high-precise synchronization measurement can be realized |
| TWI653737B (en) * | 2018-02-09 | 2019-03-11 | 華一聲學股份有限公司 | Thin-film sensor |
| CN110261011A (en) * | 2018-03-12 | 2019-09-20 | 华一声学股份有限公司 | Thin film sensor |
| CN110595647A (en) * | 2019-09-09 | 2019-12-20 | 中南大学 | A multifunctional flexible strain-pressure sensor and its preparation method |
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