CN113054070B - Integrated package display module and repair method thereof, and display device - Google Patents

Abstract

The present application relates to an integrated packaged display module, a repair method thereof, and a display device. The integrated packaged display module repair method includes the steps of: reducing the overall adhesive surface of the integrated packaged display module to a predetermined thickness; ; Carry out repair processing on the dead point; carry out the whole surface sealing treatment on the integrated package display module. Ingeniously designed a three-step rework method of first thinning, then filling holes, and finally restoring, especially suitable for integrated package display modules with increasingly dense and even point spacing less than 1 mm, to achieve rework in a very small and limited space. With the whole surface sealing glue, it is beneficial to better ensure the overall display effect of the integrated package display module, which is not only conducive to solving the feasibility of the integrated package repair, but also helps to ensure the reliability of the repair and the consistency of the appearance and color after the repair, and improve the The repair efficiency and overall display stability are improved, and the integrated package display module can be repaired and can be mass-produced on a large scale.

Description

Integrated package display module and repair method thereof, and display device

technical field

The present application relates to the field of small-pitch LED displays, and in particular, to an integrated packaged display module, a repair method thereof, and a display device.

Background technique

With the development of indoor small-pitch LED display technology, in order to achieve smaller pixel pitch and higher reliability requirements, integrated packaged indoor small-pitch LED display products have emerged, and integrated packaged indoor small-pitch LED display products have emerged. One way is to use COB (Chip On Board, chip on board) light source. COB light source is a high-efficiency integrated surface light source technology that directly attaches LED chips to a mirror metal substrate with high reflectivity. This technology eliminates the concept of brackets, no electroplating, no reflow soldering, and no patch process, so the process is reduced by nearly three points One, the cost is also saved by one third. The COB process is first to cover the placement point of the silicon wafer with thermally conductive epoxy resin on the surface of the substrate, then place the silicon wafer directly on the surface of the substrate, heat treatment until the silicon wafer is firmly fixed on the substrate, and then use wire bonding on the silicon wafer. A direct electrical connection is established between the substrate and the substrate. Among them, the thermally conductive epoxy resin generally uses epoxy resin doped with silver particles, but the epoxy resin inevitably undergoes oxidation or aging during use, resulting in color change.

The integrated packaging technology is to directly package the LED chip on the LED driver board, eliminating the SMD packaging reflow link, and using the technology of one overall packaging to achieve integration. The products produced by this technology have the technical characteristics of simple structure, easy realization of high density, high reliability and low packaging cost. Therefore, once the integrated package display module comes out, it has received extensive attention in the industry.

However, due to the dense lines on the surface of the high-density packaging substrate and the arrangement of LED chips, the problem of dead lights and other dead pixels will inevitably occur after the integrated packaging display module is packaged. When the integrated package display module is sealed and then there is a dead spot such as a partial dead light, how to repair the dead spot has become a problem in the industry. In order to solve the above problems, an existing method is to mechanically dig out the colloid on the surface of the encapsulated colloid, including but not limited to epoxy resin, and then repair the bad point, and then make up the dug out colloid. This method is likely to cause the shape and color of the repaired colloid to be inconsistent with the original colloid, thereby causing the color of the locally emitted light source to be inconsistent with the overall color, affecting the display effect.

Another method is to remove the entire surface of the package, repair the bad points, and then re-encapsulate the entire surface. This method can solve the problem that the shape and color of the colloid are consistent, but when the whole surface is removed and re-sealed, the new colloid and the board surface of the substrate are not bonded enough, and the reliability is reduced; and the whole surface is easily removed. It is not easy to remove the glue from the whole surface, and the residual colloid and debris will cause the color of the colloid after repair to be inconsistent with the color of the colloid before the repair, which will cause the color of the reworked light source to be inconsistent with the original light source, which will affect the display effect. .

SUMMARY OF THE INVENTION

Based on this, it is necessary to provide an integrated packaged display module, a repairing method and a display device in order to solve the problem that the colloidal color change of the integrated packaged display module after repairing local dead pixels affects the display effect.

A method for repairing an integrated package display module, comprising the following steps:

When the integrated package display module has a dead point, the overall adhesive surface of the integrated package display module is thinned by a preset thickness;

Fixed-point removal of colloids at dead spots;

Repair the bad points;

The entire surface of the integrated package display module is subjected to sealing treatment.

The above-mentioned integrated package display module repair method cleverly designs a three-step repair method of first thinning, then filling holes, and finally restoring, especially suitable for integrated package display modules with increasingly dense and even point spacing less than 1 mm. Rework is realized in limited space. On the one hand, it avoids the problem that the whole surface is not easy to be cleaned by removing glue, and on the other hand, it avoids the problem that the shape and color of the repaired colloid and the original colloid are inconsistent with the colloid on the other hand; It is beneficial to better ensure the overall display effect of the integrated package display module, which not only helps to solve the feasibility of integrated package repair, but also helps to ensure the reliability of repair and the consistency of appearance and color after repair. In addition, the repair efficiency and overall display stability are improved, and the integrated package display module can be repaired and can be mass-produced on a large scale.

Further, in one of the embodiments, the entire surface of the integrated packaged display module is subjected to an adhesive sealing process to restore the thickness of the adhesive layer of the integrated packaged display module to its original state.

In one embodiment, performing an entire surface sealing process on the integrated package display module includes: setting repair glue according to the original glue surface of the integrated package display module, and using the repair glue to seal the integrated package The display module is subjected to the whole surface sealing treatment.

In one embodiment, the repair glue is formulated according to the original colloid component of the integrated package display module.

Further, in one embodiment, the repairing glue is formulated according to the original colloid component of the integrated package display module, and the repairing glue is subjected to accelerated aging treatment or additional pigments are added to the repairing glue to make the The color of the repair glue is the same as that of the original glue surface of the integrated package display module.

In one embodiment, reducing the overall adhesive surface of the integrated package display module to a predetermined thickness includes: using laser thinning, chemical etching thinning or mechanical thinning to thin the integrated package display module as a whole. The glue surface is thinned to a preset thickness.

In one of the embodiments, removing the colloid at the dead spot at a fixed point includes: removing the colloid at the dead spot that is slightly larger than the size of the dead spot and does not affect the normal LED chip.

In one of the embodiments, the repair process is performed on the dead pixels, including: repairing the dead pixels or replacing the LED chips.

In one embodiment, the predetermined thickness is set according to the thickness of the glue surface and the height of the LED chip.

In one of the embodiments, the assembly method of the LED chips in the integrated package display module includes: front chip, flip chip, or a combination of front chip and flip chip.

An integrated package display module, which is obtained by using any one of the integrated package display module repair methods described above.

A display device includes at least one of the integrated package display modules.

Description of drawings

FIG. 1 is a schematic flowchart of an embodiment of a method for repairing an integrated package display module according to the present application.

FIG. 2 is a schematic flowchart of another embodiment of the method for repairing the integrated package display module described in the present application.

FIG. 3 is a schematic implementation diagram of another embodiment of the method for repairing the integrated package display module described in the present application.

Detailed ways

In order to make the above objects, features and advantages of the present application more clearly understood, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or an intervening element may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical", "horizontal", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only embodiment.

Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used in the specification of the present application are for the purpose of describing specific embodiments only, and are not intended to limit the present application. As used in this specification, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In one embodiment of the present application, as shown in FIG. 1 , a method for repairing an integrated package display module includes the following steps: when there is a defective spot in the integrated package display module, the integrated package display module is glued as a whole. The surface is thinned by a preset thickness; the colloid at the dead point is removed at a fixed point; the repair process is performed on the dead point; and the entire surface of the integrated package display module is sealed with glue. The above-mentioned integrated package display module repair method cleverly designs a three-step repair method of first thinning, then filling holes, and finally restoring, especially suitable for integrated package display modules with increasingly dense and even point spacing less than 1 mm. Rework is realized in limited space. On the one hand, it avoids the problem that the whole surface is not easy to be cleaned by removing glue, and on the other hand, it avoids the problem that the shape and color of the repaired colloid and the original colloid are inconsistent with the colloid on the other hand; It is beneficial to better ensure the overall display effect of the integrated package display module, which not only helps to solve the feasibility of integrated package repair, but also helps to improve the reliability and the consistency of appearance and color after repair. The repair efficiency and overall display stability are improved, and the integrated package display module can be repaired and mass-produced on a large scale.

In one embodiment, a method for repairing an integrated package display module includes some or all of the steps in the following embodiments; that is, the method for repairing an integrated package display module includes some or all of the following technical features. In one of the embodiments, the assembly method of the LED chips in the integrated package display module includes: front chip, flip chip, or a combination of front chip and flip chip. That is, the method for repairing the integrated packaged display module is applicable to the integrated packaged display module of the above-mentioned various assembly methods. The main design of the integrated package display module repair method is to first thin the entire surface of the integrated package display module colloid before repairing, and then seal the entire surface after repairing, so that the thickness and color of the glue after sealing are restored to the state before repairing.

In one embodiment, the integrated package display module with dead pixels is obtained first; in one embodiment, it is judged whether the integrated package display module has dead pixels, and if yes, the subsequent steps are executed, namely, the integrated package display module Set the overall rubber surface thinning preset thickness. In one embodiment, when the integrated package display module has a dead pixel, the overall glue surface of the integrated package display module is thinned by a preset thickness; wherein, the glue thinning method of the overall glue surface can be any method, It can be laser thinning or chemical etching thinning or mechanical thinning. The size of the thinning can be any size. In one embodiment, the predetermined thickness is set according to the thickness of the glue surface and the height of the LED chip. Further, in one of the embodiments, the preset thickness is used to make the thickness of the encapsulation adhesive layer remaining on the LED chip thinner without affecting the normal LED chip. In one embodiment, the thickness of the remaining encapsulation adhesive layer is 0.2mm-0.25mm, and the remaining encapsulation adhesive layer must have a certain margin, but it should not be too much, as long as it does not affect the normal LED chip, that is, do not It is enough to damage the normal LED chip during the thinning process; the main advantage of this is that it can greatly reduce the thickness of the original packaging adhesive layer on the normal LED chip under the premise that the entire surface is not easily removed by removing the glue, which is conducive to the realization of The consistency of the whole surface sealant on the display surface of the reworked integrated package display module makes the effect of the glue layer after the whole surface sealant treatment on all LED chips of the integrated package display module is consistent. In one embodiment, reducing the overall adhesive surface of the integrated package display module to a predetermined thickness includes: using laser thinning, chemical etching thinning or mechanical thinning to thin the integrated package display module as a whole. The glue surface is thinned to a preset thickness. That is, a method for repairing an integrated package display module, which includes the following steps: when the integrated package display module has a defective spot, using laser thinning, chemical etching thinning or mechanical thinning to repair the integrated package display module. The whole glue surface of the group is thinned to a preset thickness; the glue at the dead spots is removed at a fixed point; the repair processing is performed on the dead spots; and the whole surface sealing treatment is performed on the integrated package display module. The rest of the embodiments are analogous. This is an important basis for the subsequent steps. Thinning the preset thickness but not damaging the normal LED chip during the thinning process avoids the problem that the entire surface is not easy to remove by removing the glue, and leaves the technical space for re-applying glue. In the subsequent steps, the entire surface of the integrated packaged display module is encapsulated, which on the one hand helps to better ensure the overall display effect of the integrated packaged display module, and on the other hand, helps to ensure the reliability of repair and the appearance color after repair. consistency.

In one of the embodiments, the colloid at the dead spot is removed at a fixed point; the colloid shape can be any shape, for example, it can be a cuboid, a hemisphere, a pyramid shape or other preset shapes, and the colloid can be any color, such as transparent , translucent, black, color or other colors, etc.; further, in one of the embodiments, removing the colloid at the dead point at a fixed point includes: taking the center of the dead point as the center of the circle, and removing the colloid similar to the shape of a cylinder by rotating Colloids, such as scooping out or ablating colloids in the shape of cylinders. In one of the embodiments, removing the colloid at the dead spot at a fixed point includes: removing the colloid at the dead spot that is slightly larger than the size of the dead spot and does not affect the normal LED chip. That is to remove the colloid that is a little bit more than the dead spot. This is because the dot pitch of each LED chip of the integrated package display module is often relatively small, especially for products with small dot pitch, the dot pitch is usually 0.5 to 2 mm, so This kind of operation is very delicate, and it is necessary to avoid accidentally injuring the normal LED chip next to it, so as not to damage it more and more. Such a design ensures that the method for repairing the integrated package display module of the present application will not cause secondary damage, which is conducive to realizing the large-scale repair and mass production of the integrated package display module under the premise of ensuring the repair efficiency and the overall display stability. .

In one of the embodiments, rework is performed on the dead pixels; in one of the embodiments, the rework is performed on the dead pixels, including: repairing the dead pixels or replacing the LED chips. Further, in one of the embodiments, the LED chips of the same batch or the same production cycle as the original LED chips of the integrated packaged display module are replaced. Further, in one of the embodiments, the LED chips that have undergone aging treatment are used for replacement. In one embodiment, the LED chips of the same batch or the same production cycle as the original LED chips of the integrated package display module are used, subjected to aging treatment, and then replaced with the dead pixels of the integrated package display module. Location. Such a design is due to the fact that the LED chips will age during the long-term use of the integrated package display module, and the use of LED chips with limited conditions is conducive to making each LED chip in the integrated package display module after repair glow. It tends to be the same or similar, which is beneficial to ensure the consistency of the display effect and the repair effect. For the integrated package display module involved in this application, the consistency of the display effect is a very important indicator. The integrated package display module includes a large number of LED chips, and a large number of LED chips are usually used when the integrated package display module is applied. For the integrated package display module, how to ensure the display consistency and uniformity of such a large number of LED chips is an important technical problem that those skilled in the art need to face. The method, together with the design of the repair glue and the design of the replacement LED chip, is conducive to maximizing the technical effect of "doing the old", rather than the easily misunderstood "doing the new", which will lead to repairing the location of the dead spot. The new LED chip "stands out from the crowd", but is "incompatible" with other LED chips that have been used for a long time, which affects the display consistency and uniformity of a large number of LED chips, and "old" can repair the new LED chips at the dead spots. It is perfectly integrated into a large number of LED chips to ensure the consistency and uniformity of the display effect, which is one of the important advantages of the present application.

In one embodiment, the integrated package display module is subjected to a whole-surface sealing process. In one embodiment, the material of the encapsulation adhesive layer for the whole surface encapsulation treatment can be any encapsulation material such as epoxy resin, silicone resin, silica gel, UV glue, etc. The form of the encapsulation adhesive layer can be black, transparent or translucent, The thickness of the adhesive layer may be of any size; further, in one embodiment, the entire surface of the integrated packaged display module is subjected to an adhesive sealing process to restore the thickness of the adhesive layer of the integrated packaged display module to its original state. In one embodiment, performing an entire surface sealing process on the integrated package display module includes: setting repair glue according to the original glue surface of the integrated package display module, and using the repair glue to seal the integrated package The display module is subjected to the whole surface sealing treatment. In one embodiment, the repair glue is formulated according to the original colloid component of the integrated package display module. Further, in one embodiment, additional pigments are added to the repair glue to make the repair glue and the original glue surface color of the integrated package display module consistent; Different from the original glue color, slightly adjust the glue and pigment ratio to make the glue color consistent. Further, in one embodiment, the repairing glue is formulated according to the original colloid component of the integrated package display module, and the repairing glue is subjected to accelerated aging treatment or additional pigments are added to the repairing glue to make the The color of the repair glue is the same as that of the original glue surface of the integrated package display module. Further, in one of the embodiments, the glue ratio and material of the repair glue are consistent with the original colloid glue ratio; and the colloid thickness of the resealing glue is consistent with the original colloid thickness; such a design, because before resealing glue, The colloid has been thinned, and then the whole surface is sealed with glue, and the thickness of the repaired colloid is relatively thin. Even if the re-equipped glue is different from the original glue, it will not be obvious because the repaired colloid is thin; that is, the upper part of the original LED chip. The adhesive layer is thin, and the colloid of the new LED chip at the original dead spot is exactly the same as the new adhesive layer, so there is no trace of repairing on the whole, which is conducive to restoring the thickness and color of the colloid of the integrated package display module to the state before repair, ensuring that The color after sealing is consistent with the color of the original glue layer that is attached to the circuit board. It is understandable that integrated package display modules are often not used alone. For large-scale display screens, the number of integrated package display modules may be large. During the long-term use of integrated package display modules, on the one hand, LED chips will Aging occurs. On the other hand, the encapsulation colloid will also age. The aging speed of the colloid is usually faster than that of the LED chip. During the repair process, if only a new LED chip and a new encapsulation colloid are used at the dead spot, it will occur. The traditional technology "repairs the bad point and then fills up the excavated colloid, which is easy to cause the shape and color of the repaired colloid to be inconsistent with the original colloid, thereby causing the color of the light source emitted locally to be inconsistent with the whole" problem, so the colloid used in repairing Design is also very important; the present application effectively improves the display consistency of the integrated packaged display module by optimizing the colloid on the one hand, and encapsulating the entire surface on the other hand.

In one embodiment, after the package of the integrated package display module (referred to as the module) is completed, repair the module with dead pixels. First, the overall glue surface of the integrated package display module is thinned; Perform fixed-point removal; then repair the bad points; after the final repair is completed, the whole surface is sealed again to restore the thickness and color of the module colloid to the state before the repair. In one of the embodiments, a method for repairing an integrated package display module is shown in FIG. 2 , which includes the following steps: when the integrated package display module has defective pixels, using laser thinning, chemical etching thinning or mechanical thinning In the thin method, the overall glue surface of the integrated package display module is thinned to a preset thickness; the glue at the spot where the dead spot is slightly larger than the size of the dead spot and does not affect the normal LED chip is removed at a fixed point; the dead spot is repaired or the LED chip is replaced; The original glue surface of the integrated package display module is provided with repair glue, and the entire surface of the integrated package display module is sealed with the repair glue. The rest of the embodiments are analogous. If you do not solve the problem that the color change of the colloid after the repair of the local dead pixels affects the display effect, the repair for the integrated package display module, especially for the display screen with multiple integrated package display modules, will only make the display effect worse the more repaired , the display color cannot be accurately controlled at all, such as uneven red display or partial color cast of blue display, etc. The above design is beneficial to improve the feasibility, reliability and appearance color consistency of repair, and improve the efficiency and stability of repair. , so that the integrated package display module can be repaired and mass-produced.

In one embodiment, the integrated package display module is composed of a package substrate, electronic components such as driver chips, LED chips, and packaging colloid. First, the overall glue surface of the integrated package display module is thinned, and the thickness is reduced according to the requirements; after the thinning, the glue of the dead dots is removed at a fixed point, and the removal size can be slightly larger than that of the dead dots or other sizes; then repair the dead dots, Replace the dead points or do other processing; after the repair is completed, the whole surface is sealed again to restore the thickness of the module colloid to the state before the repair. Due to the whole surface sealing, the color of the module colloid can be kept consistent as a whole. In one embodiment, the specific implementation of the method for repairing the integrated package display module is shown in FIG. 3 . In step S10 , first prepare the integrated package display module with dead pixels, and the integrated package display module has a packaging colloid 100 . , the packaging substrate 200 , the driving control device 300 and the LED chip 400 ; one of the LED chips is a dead pixel 500 ; step S20 , reducing the overall adhesive surface of the integrated packaging display module, that is, the packaging adhesive 100 to a predetermined thickness 110 ; step S30 , leaving the remaining glue layer 120; it can be seen from FIG. 3 that the side of the remaining glue layer 120 relative to the LED chip 400 is uneven, which is the traditional technique of “removing the glue on the entire surface of the package, repairing the bad spots, and then re-integrating the whole surface. The main reason for the problem of "re-sealing" is that, on the one hand, it is not easy to remove the glue on the whole surface, leaving residues, which leads to adverse effects. Step S40, then remove the colloid 130 at the faulty position at the dead spot 500 and remove the dead spot 500 to form a repair position 140; Step S50, replace the fault-free LED chip 400 at the repair position 140; Step S60, according to the integration A repair glue is arranged on the original glue surface of the packaged display module, and the entire surface of the integrated packaged display module is sealed with the repair glue to form a repair glue layer 150 .

The above-mentioned integrated package display module repair method cleverly designs a three-step repair method of first thinning, then filling holes, and finally restoring, especially suitable for integrated package display modules with increasingly dense and even point spacing less than 1 mm. Rework is realized in limited space. On the one hand, it avoids the problem that the whole surface is not easy to be cleaned by removing glue, and on the other hand, it avoids the problem that the shape and color of the repaired colloid and the original colloid are inconsistent with the colloid on the other hand; It is beneficial to better ensure the overall display effect of the integrated package display module, which not only helps to solve the feasibility of integrated package repair, but also helps to ensure the reliability of repair and the consistency of appearance and color after repair. In addition, the repair efficiency and overall display stability are improved, and the integrated package display module can be repaired and can be mass-produced on a large scale.

In one embodiment, an integrated packaged display module is obtained by repairing the integrated packaged display module repairing method described in any one of the embodiments. That is, the integrated packaged display module is obtained by the rework method of the integrated packaged display module described in any one of the embodiments. Such an integrated packaged display module solves the problem of inconsistent shape and color between the repaired colloid and the original colloid, and has the advantages of Good rework reliability and consistency of appearance and color after rework, and because the overall rubber surface is thinned, fixed-point processing and whole-face sealing processing, it is easy to handle, so the rework efficiency and overall display stability are improved, and it is easy to achieve scale. Rework mass production.

In one embodiment, a display device includes at least one of the integrated packaged display modules. In one embodiment, the display device includes a plurality of the integrated packaged display modules arranged regularly. That is, in a display device that has been used for a period of time, using the integrated packaged display module obtained by rework, on the one hand, the defect of dead pixels is eliminated, and on the other hand, the display consistency after repair is guaranteed, and the display inconsistency is avoided. Uniform and inconsistent problems, so it has high practicability.

It should be noted that other embodiments of the present application also include an implementable integrated packaged display module formed by combining the technical features of the above embodiments, a repair method thereof, and a display device.

The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity, all possible combinations of the technical features in the above-described embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be regarded as the scope described in this specification.

The above-mentioned embodiments only represent several embodiments of the present application, and the descriptions thereof are relatively specific and detailed, but should not be construed as a limitation on the scope of the patent application. It should be pointed out that for those skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the scope of patent protection of the present application should be governed by the appended claims.

Claims (10)

1. A method for repairing an integrated package display module, comprising the following steps: When the integrated package display module has a dead point, the overall adhesive surface of the integrated package display module is thinned by a preset thickness; Fixed-point removal of colloids at dead spots; Repair the bad points; The entire surface of the integrated package display module is subjected to sealing treatment. 2 . The method for repairing an integrated package display module according to claim 1 , wherein performing an entire surface sealing process on the integrated package display module, comprising: setting according to the original glue surface of the integrated package display module. 3 . Repairing glue, using the repairing glue to carry out the whole surface sealing treatment of the integrated package display module. 3 . The method for repairing an integrated package display module according to claim 2 , wherein the repair glue is proportioned according to the original colloid component of the integrated package display module. 4 . 4 . The method for repairing an integrated package display module according to claim 1 , wherein reducing the overall adhesive surface of the integrated package display module to a preset thickness comprises: using laser thinning, chemical etching thinning or mechanical In the thinning method, the overall adhesive surface of the integrated package display module is thinned by a preset thickness. 5 . The method for repairing an integrated package display module according to claim 1 , wherein the colloid at the dead spot is removed at a fixed point, comprising: the colloid at the dead spot is larger than the size of the dead spot and does not affect the surrounding normal LED chips. 6 . 6 . The method for repairing an integrated package display module according to claim 1 , wherein the repairing of the dead pixels includes repairing the dead pixels or replacing the LED chips. 7 . 7 . The method for repairing an integrated package display module according to claim 1 , wherein the preset thickness is set according to the thickness of the adhesive surface and the height of the LED chip. 8 . 8 . The method for repairing an integrated package display module according to claim 1 , wherein the assembly method of the LED chips in the integrated package display module comprises: a positive chip, a flip chip, or a combination of a positive chip and a flip chip. 9 . combine. 9 . An integrated packaged display module, characterized in that, it is obtained by using the rework method for the integrated packaged display module according to any one of claims 1 to 8 . 10. A display device, comprising at least one integrated package display module according to claim 9.

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