CN112992882A

CN112992882A - Light emitting module and display device

Info

Publication number: CN112992882A
Application number: CN201911308812.1A
Authority: CN
Inventors: 林志豪; 陈若翔; 苏信纶; 赖世伦; 梁建钦
Original assignee: Lextar Electronics Corp
Current assignee: Lextar Electronics Corp
Priority date: 2019-12-18
Filing date: 2019-12-18
Publication date: 2021-06-18

Abstract

A light emitting module comprises at least one light emitting unit, a driving circuit substrate and at least one driving element. The light emitting unit includes a connection substrate and a plurality of light emitting elements. The light emitting elements are disposed on the connection substrate. The light-emitting unit is arranged on the driving circuit substrate, and the connecting substrate is electrically connected with the light-emitting elements and the driving circuit substrate. The driving circuit substrate comprises a first connecting surface, a plurality of first connecting pads, a second connecting surface and a plurality of second connecting pads. The first pads are arranged on the first connecting surface and electrically connected with the connecting substrate. The second connecting surface is opposite to the first connecting surface. The second pads are arranged on the second connecting surface. The driving element is disposed on the second connecting surface and electrically connected to the second pads. The circuits between the first pads and the second pads do not cross each other through the through holes. A display device is also provided. The drive circuit substrate and the connection substrate of the light emitting unit of the invention can provide a light emitting module which is beneficial to manufacture.

Description

Light emitting module and display device

Technical Field

The present invention relates to an optical device, and more particularly, to a light emitting module and a display device.

Background

In display technology, flat panel display devices such as Liquid Crystal Display (LCD), Organic Light Emitting Diode (OLED) display, micro LED (mini LED) display, and micro LED (micro LED) display have been used in daily life. The display quality of these display devices, such as resolution and brightness, is also increasing.

However, with these display qualities, the display device also needs to be matched with a driving circuit board with more details, higher precision and higher complexity. However, the driving circuit board also increases the overall cost of the display device, and the manufacturing of the driving circuit board is difficult, which also reduces the yield of the overall display device. Therefore, how to provide a high-precision driving circuit board suitable for manufacturing in a display device is one of the problems to be solved in the art.

Disclosure of Invention

The light emitting module provided by the invention can provide a high-resolution light source, and the display device provided by the invention can provide a high-resolution display picture.

An embodiment of the invention provides a light emitting module, which includes at least one light emitting unit, a driving circuit substrate and at least one driving element. The light emitting unit includes a connection substrate and a plurality of light emitting elements. The light emitting elements are disposed on the connection substrate. The light-emitting unit is arranged on the driving circuit substrate, and the connecting substrate is electrically connected with the light-emitting elements and the driving circuit substrate. The driving circuit substrate comprises a first connecting surface, a plurality of first connecting pads, a second connecting surface and a plurality of second connecting pads. The first pads are arranged on the first connecting surface and electrically connected with the connecting substrate. The second connecting surface is opposite to the first connecting surface. The second pads are arranged on the second connecting surface. The driving element is disposed on the second connecting surface and electrically connected to the second pads. The circuits between the first pads and the second pads do not cross each other through the through holes.

In an embodiment of the invention, the connection substrate is a high-density interconnection printed circuit board.

In an embodiment of the invention, the light emitting module includes a plurality of light emitting units and a plurality of driving elements, and the light emitting units are respectively electrically connected to the driving elements. The second pads are divided into a plurality of second pad groups, and the second pad groups are respectively connected with the driving elements. The first pads are divided into a plurality of first pad groups, the first pad groups are respectively electrically connected with the second pad groups, and the distribution areas of the first pad groups on the first connecting surface are not overlapped with each other. The connection substrates of the light emitting units are respectively electrically connected with the first pad groups.

In an embodiment of the invention, the driving circuit substrate includes a first circuit layer, a plurality of first electrical circuits, a second circuit layer, and a plurality of second electrical circuits. The first electric circuits are arranged on the first circuit layer. The second circuit layer is configured between the first circuit layer and the second connecting surface. The second electric circuits are arranged on the second circuit layer. The first electric circuits are respectively and electrically connected with part of the first connecting pads to part of the second connecting pads. The second electric circuits are respectively and electrically connected with the other part of the first connecting pads to the other part of the second connecting pads. The second electrical lines cross the first electrical lines without passing through the vias.

In an embodiment of the invention, the connection substrate includes a third connection surface, a plurality of third pads, a fourth connection surface and a plurality of fourth pads. The third pads are disposed on the third connecting surface and are electrically connected to the light emitting elements respectively. The fourth connecting surface is opposite to the third connecting surface. The fourth pads are disposed on the fourth connecting surface and are electrically connected to the first pads respectively. Each fourth pad is electrically connected to the plurality of third pads.

In an embodiment of the invention, the connection substrate includes a plurality of third electrical lines and a plurality of fourth electrical lines. The third electric circuits are respectively and electrically connected with the first electrodes of the light-emitting elements to part of the first connecting pads. The fourth electric circuits are respectively and electrically connected with the second electrodes of the light-emitting elements to the other parts of the first connecting pads. The density of the third electric circuits and the fourth electric circuits is greater than that of the first electric circuits and the second electric circuits.

An embodiment of the invention provides a display device, which includes at least one light emitting unit, a driving circuit substrate and at least one driving element. The light emitting unit includes a connection substrate and a plurality of pixels. The pixels are arranged on the connecting substrate and form a pixel array. Each pixel includes a light emitting element whose light emission color is red, a light emitting element whose light emission color is green, and a light emitting element whose light emission color is blue. The light emitting unit is disposed on the driving circuit substrate. The connecting substrate is electrically connected with the light-emitting elements and the driving circuit substrate. The driving circuit substrate comprises a first connecting surface, a plurality of first connecting pads, a second connecting surface and a plurality of second connecting pads. The first pads are arranged on the first connecting surface and electrically connected with the connecting substrate. The second connecting surface is opposite to the first connecting surface. The second pads are arranged on the second connecting surface. The driving element is disposed on the second connecting surface and electrically connected to the second pads. The circuits between the first pads and the second pads do not cross each other through the through holes.

In an embodiment of the invention, the display device further includes a plurality of light emitting units and a plurality of driving elements, and the light emitting units are respectively electrically connected to the driving elements. The second pads are divided into a plurality of second pad groups, and the second pad groups are respectively connected with the driving elements. The first pads are divided into a plurality of first pad groups, and the first pad groups are respectively and electrically connected with the second pad groups. The first pad groups are not overlapped in the distribution area of the first connection surface, and the connection substrates of the light-emitting units are respectively and electrically connected with the first pad groups.

In an embodiment of the invention, the driving circuit substrate includes a first circuit layer, a plurality of first electrical circuits, a second circuit layer, and a plurality of second electrical circuits. The first electric circuits are arranged on the first circuit layer. The second circuit layer is arranged between the first circuit layer and the second connecting surface, and the second electric circuits are arranged on the second circuit layer. The first electric circuits are respectively and electrically connected with a part of the first connecting pads to a part of the second connecting pads, and the second electric circuits are respectively and electrically connected with the other part of the first connecting pads to the other part of the second connecting pads. The second electrical lines cross the first electrical lines without passing through the vias.

An embodiment of the invention provides a light emitting module, which includes at least one light emitting unit, a driving circuit substrate and at least one driving element. The light-emitting unit comprises a connecting substrate and a plurality of light-emitting elements, and the light-emitting elements are arranged on the connecting substrate. The light-emitting elements are arranged on the driving circuit substrate, and the connecting substrate is electrically connected with the light-emitting elements to the driving circuit substrate. The driving circuit substrate comprises a first connecting surface, a plurality of first connecting pads and a second connecting surface. The first pads are arranged on the first connecting surface and electrically connected with the connecting substrate. The second connecting surface is opposite to the first connecting surface. At least one driving element is arranged on the second connecting surface and electrically connected to the first connecting pads. The circuits between the first connecting pads and the driving element do not cross each other through the through holes, the connecting substrate is a high-density interconnection printed circuit board, and the driving circuit substrate is not the high-density interconnection printed circuit board.

As can be seen from the above, the light emitting module and the display device provided by the present invention can have the connection substrate and the driving circuit substrate, and the driving circuit substrate can provide signals to the light emitting elements through the connection substrate, thereby reducing the complexity of the driving circuit substrate.

Drawings

FIG. 1 is a block diagram of a light emitting module according to an embodiment of the present invention;

fig. 2 and 3 are schematic perspective views of a display device at different viewing angles according to an embodiment of the invention;

FIG. 4 is a schematic cross-sectional view taken along section line 4-4 of FIG. 2;

FIG. 5 is a circuit diagram of a display device according to an embodiment of the present invention;

FIG. 6 is a cross-sectional view of the connection substrate shown in FIG. 2 with the section line 6-6;

FIG. 7 is a cross-sectional view of the connection substrate according to the section line 7-7 in FIG. 2;

FIG. 8 is a cross-sectional view of the connection substrate according to section line 8-8 in FIG. 3;

FIG. 9 is a block diagram of a display device according to another embodiment of the present invention;

fig. 10 and 11 are schematic perspective views of a driving circuit substrate according to another embodiment of the invention at different viewing angles;

fig. 12 and 13 are schematic perspective views of a display device according to another embodiment of the invention at different viewing angles.

[ notation ] to show

d1 … direction

d2 … direction

10 … light emitting module

100 … display device

101 … light-emitting unit

110 … light-emitting element

110R … light-emitting element

110G … light-emitting element

110B … light-emitting element

110P … pixel

111 … first electrode

112 … second electrode

120 … connection substrate

121 … third pad

121L … third pad layer

122 … fourth pad

122L … fourth pad layer

123 … third electrical circuit

123L … third circuit layer

124 … fourth electrical circuit

124L … fourth wiring level

125 … third connecting surface

126 … fourth connecting surface

130 … driving circuit board

130G … ground plane

130P … power plane

131 … first pad

131L … first pad layer

132 … second pad

132L … second pad layer

133 … first electrical circuit

133L … first circuit layer

134 … second electrical circuit

134L … second circuit layer

135 … first connection surface

136 … second connecting surface

140 … drive element

200 … display device

230 … driving circuit substrate

231 … first pad

231G … first pad group

232 … second pad

232G … second pad group

235 … first connecting surface

236 … second connection surface

4-4 … section line

6-6 … cutting line

7-7 … cutting line

8-8 … cutting line

Detailed Description

The light-emitting module provided by the invention can be applied to a backlight module of a display device. For example, the light emitting module provided by the embodiment of the invention can be applied to a direct lit (direct lit) backlight module in a display device. For another example, the light emitting module provided in the embodiment of the invention can be applied to a backlight module having a local dimming (local dimming) function in a display device.

The display device provided by the invention can be applied to an active light-emitting display. For example, the active light emitting display may include a light emitting diode display, a sub-micro light emitting diode (mini LED) display, and a micro LED display.

It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers or sections, these elements, components, regions, layers or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a "first element," "component," "region," "layer" or "portion" discussed below could be termed a second element, component, region, layer or portion without departing from the teachings herein.

In the drawings, the thickness of layers, films, panels, regions, etc. have been exaggerated for clarity. Like reference numerals refer to like elements throughout the specification. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connections. Further, "electrically connected" or "coupled" may mean that there are additional elements between the elements.

Fig. 1 is a block diagram of a light emitting module according to an embodiment of the invention. Referring to fig. 1, in the present embodiment, a light emitting module 10 includes a light emitting unit 101, a driving circuit substrate 130 and a driving element 140. The light emitting unit 101 includes a connection substrate 120 and a plurality of light emitting elements 110 (six are illustrated in fig. 1). The light emitting elements 110 are electrically connected to the connection substrate 120, and the connection substrate 120 electrically connects the light emitting elements 110 to the driving circuit substrate 130. The driving circuit substrate 130 includes a plurality of first pads 131 and a plurality of second pads 132. The first pads 131 are disposed far away from the driving device 140, and the second pads 132 are disposed near the driving device 140. The first pads 131 are electrically connected to the connection substrate 120, and the second pads 132 are electrically connected to the driving device 140.

In the embodiment, the lines between the first pads 131 and the second pads 132 do not cross each other through the through holes. In other words, in the driving circuit substrate 130 of the present embodiment, no additional cross-line layer is disposed to provide a circuit electrically connected between the first pads 131 and the second pads 132.

For example, the driving circuit substrate 130 of the present embodiment includes a first electrical circuit 133 and a second electrical circuit 134. The first electrical traces 133 respectively electrically connect a portion of the first pads 131 (1 in fig. 1) to a portion of the second pads 132 (1 in fig. 1), and the second electrical traces 134 respectively electrically connect a portion of the first pads 131 (1 in fig. 1) to a portion of the second pads 132 (1 in fig. 1). The first electrical traces 133 and the second electrical traces 134 between the first pads 131 and the second pads 132 are not interlaced (interleaved), and all signals provided by the driving element 140 directly correspond to the first pads 131. The first pads 131 are distributed in an independent area, so that the connection substrate 120 and the driving element 140 are electrically connected one to one. Therefore, the driving circuit substrate 130 of the present embodiment has a simple structure, and can improve the manufacturing yield and reduce the manufacturing cost.

On the other hand, in the light emitting module 10 of the present embodiment, the connection substrate 120 is a high density interconnected printed circuit board (hdippcb), and the driving circuit substrate 130 is not a high density interconnected pcb.

For example, the connection substrate 120 includes a plurality of third pads 121 and a plurality of fourth pads 122, and the connection substrate 120 further includes a plurality of third electrical traces 123 and a plurality of fourth electrical traces 124. The third pads 121 are electrically connected to the light emitting elements 110, and the fourth pads 122 are electrically connected to the first pads 131. The third electrical traces 123 and the fourth electrical traces 124 are respectively connected between the third pads 121 and the fourth pads 122, so that the third electrical traces 123 can electrically connect the light emitting device 110 to a portion of the first pads 131, and the fourth electrical traces 124 can electrically connect the light emitting device 110 to another portion of the first pads 131. In detail, each of the third electrical traces 123 electrically connects one of the fourth pads 122 to a plurality of the third pads 121, and the third pads 121 respectively correspond to electrodes with the same polarity in the light emitting elements 110. Meanwhile, each fourth electrical circuit 124 also electrically connects another fourth pad 122 to another third pads 121 (fig. 1 takes one as an example), and each of the third pads 121 corresponds to an electrode of another polarity in the light emitting elements 110.

The third electrical traces 123 and the fourth electrical traces 124 between the third pads 121 and the fourth pads 122 are formed by a high-precision process, so that the connection substrate 120 can provide a high-precision connection path in the light emitting module 10. Meanwhile, the density of the third and fourth

electrical lines

123, 124 is greater than the density of the first and second

electrical lines

133, 134. Therefore, the first electrical traces 133 and the second electrical traces 134 of the driving circuit substrate 130 can simplify the manufacturing process, reduce the manufacturing cost, and improve the yield. For example, the driving circuit substrate 130 may be manufactured by a negative process (drawing process), which can greatly reduce the manufacturing cost and the number of processes.

In the present embodiment, the light emitting elements 110 in the light emitting module 10 can emit lights of the same color to form a surface light source, which can be used as a backlight light source in a display device, but the invention is not limited thereto.

For example, in another embodiment, the light emitting module 10 may also be configured to emit image light, for example, the light emitting elements 110 of the present embodiment may form a plurality of pixels 110P, and each of the pixels 110P includes a plurality of light emitting elements 110. The light emitting elements 110 in each pixel 110P each have a different light emission color, such as red light, green light, and blue light. The pixels 110P emit light of different colors and brightness to form an image. The number of pixels 110P in the light emitting module 10 can be the same as the number of pixels that can be processed by the driving device 140, so that a high resolution image can be provided in a simplified circuit.

For another example, in other embodiments of the present invention, the driving element 140 may support signals of 32 × 16 pixels, and the pixels 110P formed by the light emitting elements 110 in the light emitting unit 101 are arranged in a matrix of 32 × 16, but the present invention is not limited thereto. In other embodiments, the driving element 140 may also be a driver chip supporting 16x16 pixel signals or a driver chip supporting 32x32 pixel signals.

Referring to fig. 1, since the electrical lines between the first pads 131 and the second pads 132 do not need to cross each other through vias, or cross other electrical lines through vias. The driving circuit substrate 130 can be formed with a fast, low-cost non-high-density interconnection printed circuit board.

In other embodiments, the light emitting elements 110 of the light emitting module 10 may emit image lights with different colors to display images as described above, or emit lights with the same color as a surface light source. For convenience of description, the following embodiments will be described with reference to a display device including light emitting elements 110 capable of emitting light of different colors, but those skilled in the art can appropriately change, adjust and combine the colors of the light emitted by the light emitting elements 110 of the display device in the following embodiments as required to be applied to a backlight or other suitable light emitting fields.

Fig. 2 and 3 are perspective views of a display device according to an embodiment of the invention, wherein fig. 2 is a perspective view of the light emitting element 110 at a front viewing angle, and fig. 3 is a perspective view of the driving element 140 at a bottom viewing angle. Referring to fig. 2, in the present embodiment, the display device 100 includes a light emitting unit 101, a driving circuit substrate 130 and a driving element 140. The light emitting unit 101 is disposed on the driving circuit substrate 130, the driving circuit substrate 130 includes a first connection surface 135, and the connection substrate 120 of the light emitting unit 101 is disposed on the first connection surface 135.

Further, the connection substrate 120 includes the third connection surface 125, and the light emitting elements 110 may be classified into a light emitting element 110R having a red light emitting color, a light emitting element 110G having a green light emitting color, and a light emitting element 110B having a blue light emitting color. The

light emitting elements

110R, 110G, and 110B are disposed on the third connecting surface 125. For example, the

light emitting elements

110R, 110G, 110B may form a plurality of pixels 110P on the third connection surface 125 in groups.

Referring to fig. 3, in the present embodiment, the driving element 140 is disposed on the second connecting surface 136 of the driving circuit substrate 130, wherein the second connecting surface 136 is opposite to the first connecting surface 135.

Fig. 4 is a schematic cross-sectional view according to section line 4-4 in fig. 2. Referring to fig. 4, the driving circuit substrate 130 includes a first connecting surface 135, and the first pads 131 are disposed on the first connecting surface 135. The driving circuit substrate 130 includes a second connecting surface 136, the first connecting surface 135 is opposite to the second connecting surface 136, and the second pads 132 are disposed on the second connecting surface 136. The driving element 140 is disposed on the second connecting surface 136 and electrically connected to the driving circuit substrate 130 through the second pads 132.

Further, the connection substrate 120 includes a third connection surface 125, the third pads 121 are disposed on the third connection surface 125, and the light emitting elements 110R are disposed on the third connection surface 125 and electrically connected to the connection substrate 120 through the third pads 121. The connection substrate 120 includes a fourth connection surface 126, the third connection surface 125 is opposite to the fourth connection surface 126, and the fourth pads 122 are disposed on the fourth connection surface 126.

The connection substrate 120 and the driving circuit substrate 130 are electrically connected to the first pads 131 of the first connection surface 135 of the driving circuit substrate 130 through the fourth pads 122 on the fourth connection surface 126 of the connection substrate 120.

In the embodiment, the lines between the first pads 131 and the second pads 132 do not cross each other through the through holes. In other words, all signals provided by the driving element 140 directly correspond to the first pads 131, the number of the first pads 131 is the same as the maximum number of signals that can be driven by the driving element 140, and the first pads 131 are distributed in an independent area on the first connection surface 135, so that the lines between the first pads 131 and the second pads 132 are not interlaced, so that the driving circuit substrate 130 can reduce the structural complexity. Further, the driving circuit substrate 130 may be manufactured by a negative process, which may improve the manufacturing yield and reduce the manufacturing cost.

On the other hand, in the present embodiment, the connection substrate 120 is a high-density interconnection printed circuit board. For example, the connection substrate 120 is manufactured by a semi-additive process (mSAP), so that the lines on the connection substrate 120 may have a smaller line width and a smaller line pitch, and the light emitting devices 110 may be distributed on the connection substrate 120 at a higher density. For another example, in the embodiment, the minimum line width and the line pitch of the lines in the connection substrate 120 are 30 micrometers (μm), and the minimum line width and the line pitch of the lines in the driving circuit substrate 130 are 70 μm.

Referring to fig. 2, in the present embodiment, the

light emitting elements

110R, 110G, and 110B are arranged in an array, for example, anodes of two adjacent

light emitting elements

110R and 110G in the direction d1 are connected to the same circuit, and cathodes of two adjacent light emitting elements 110R in another direction d2 are connected to the same circuit. Therefore, in the connection substrate 120, the third pads 121 can be divided into a group of third pads 121 for transmitting cathode signals and a group of third pads 121 for transmitting anode signals, each of the fourth pads 122 is electrically connected to the plurality of third pads 121 for transmitting signals with the same polarity, that is, the cathode signals can be transmitted to some of the third pads 121 through the fourth pads 122, and the anode signals can be transmitted to other of the third pads 121 through another fourth pad 122, so as to drive the light emitting elements 110R.

Fig. 5 is a circuit diagram of a display device according to an embodiment of the invention. Referring to fig. 5, the driving circuit substrate 130 includes a plurality of first electrical traces 133 and a plurality of second electrical traces 134, and the connection substrate 120 includes a plurality of third electrical traces 123 and a plurality of fourth electrical traces 124.

The first electrical traces 133 respectively electrically connect a portion of the first pads 131 (see fig. 4) to a portion of the second pads 132 (see fig. 4). The second electrical traces 134 are respectively electrically connected to another portion of the first pads 131 (see fig. 4) to another portion of the second pads 132 (see fig. 4). The second electrical lines 134 do not cross the first electrical lines 133 through vias.

The third electrical traces 123 are respectively electrically connected to some of the

light emitting elements

110R, 110G, and 110B to the driving circuit substrate 130, the fourth electrical traces 124 are respectively electrically connected to some of the

light emitting elements

110R, 110G, and 110B to the driving circuit substrate 130, and the driving element 140 transmits signals to the third electrical traces 123 and the fourth electrical traces 124 of the connecting substrate 120 through the driving circuit substrate 130.

In the present embodiment, the pixels formed by the

light emitting elements

110R, 110G, 110B of the display device 100 are arranged in a pixel array, and in the direction d2, the anodes of the

light emitting elements

110R, 110G, 110B arranged in the same row are connected to the same third electrical trace 123, and the cathodes of the light emitting elements 110B (for example) arranged in the same column in the direction d1 are connected to the same fourth electrical trace 124.

FIG. 6 is a cross-sectional view of the connection substrate according to the section line 6-6 in FIG. 2, and FIG. 7 is a cross-sectional view of the connection substrate according to the section line 7-7 in FIG. 2. Referring to fig. 6, in the direction d2, in each row of the

light emitting devices

110R, 110G, and 110B, the third electrical circuit 123 electrically connects the first electrodes 111 of the

light emitting devices

110R, 110G, and 110B to the fourth pads 122. In detail, the connection substrate 120 further includes a third circuit layer 123L, wherein the third electrical circuit 123 is disposed on the third circuit layer 123L.

Referring to fig. 7, in the direction d1, in each row of the light emitting elements 110B (for example), the fourth electrical circuit 124 electrically connects the second electrodes 112 of the light emitting elements 110B to the fourth pads 122. In detail, the connection substrate 120 further includes a fourth circuit layer 124L, wherein the fourth electrical circuit 124 is disposed on the fourth circuit layer 124L.

Specifically, in the present embodiment, the connection substrate 120 sequentially includes a third pad layer 121L, a third circuit layer 123L, a fourth circuit layer 124L and a fourth pad layer 122L, wherein the third circuit layer 123L and the fourth circuit layer 124L are disposed between the third pad layer 121L and the fourth pad layer 122L. The third pads 121 are disposed on the third pad layer 121L, and the fourth pads 122 are disposed on the fourth pad layer 122L. In the present embodiment, the density of the third electrical traces 123 and the fourth electrical traces 124 is greater than the density of the first electrical traces 133 (see fig. 5) and the second electrical traces 134 (see fig. 5), so that the

light emitting elements

110R, 110G, and 110B connected to the third electrical traces 123 and the fourth electrical traces 124 can be distributed on the connection substrate 120 with high density.

FIG. 8 is a cross-sectional view of the connection substrate according to the section line 8-8 in FIG. 3. Referring to fig. 8, in the present embodiment, the driving circuit substrate 130 includes a first circuit layer 133L, and the first electrical circuit 133 (see fig. 5) is disposed on the first circuit layer 133L. The driving circuit substrate 130 further includes a second circuit layer 134L, and the second electrical circuit 134 (see fig. 5) is disposed on the second circuit layer 134L.

The second circuit layer 134L is disposed between the first circuit layer 133L and the second connection surface 136. The first electrical lines 133 (see fig. 5) in the first circuit layer 133L electrically connect the first pads 131 to the second pads 132, the second electrical lines 134 (see fig. 5) in the second circuit layer 134L electrically connect the other first pads 131 to the other second pads 132, and the lines in the second circuit layer 134L do not interleave with the lines in the first circuit layer 133. In other words, two ends of the second electrical trace 134 (see fig. 5) are directly electrically connected to the first pad 131 and the second pad 132, and a portion of the second electrical trace 134 (see fig. 5) between the two ends is not electrically connected to a cross-line layer through a via, and is electrically connected to the second electrical trace layer 134L at another position through another via from the cross-line layer to cross the trace in the first trace layer 133.

In detail, in the present embodiment, the driving circuit substrate 130 further includes a first pad layer 131L, a second pad layer 132L, a ground layer 130G and a power layer 130P, wherein the first pads 131 are located on the first pad layer 131L, the second pads 132 are located on the second pad layer 132L, and the ground layer 130G and the power layer 130P are sequentially located between the first connection surface 135 and the first electrical circuit layer 133L. The circuit in the ground layer 130G is used for transmitting a ground signal corresponding to a portion of the first pad 131. The circuit in the power plane 130P is used for transmitting a power signal corresponding to another portion of the second pad 131.

Fig. 9 is a block diagram of a display device according to another embodiment of the invention. Referring to fig. 9, in the present embodiment, the display device 200 is similar to the display device 100 described above, and the same elements and descriptions thereof are not repeated herein. Compared to the display device 100, the display device 200 includes a plurality of light emitting units 101 and a plurality of driving elements 140. The driving elements 140 are electrically connected to the light emitting units 101 through the driving circuit substrate 230, wherein each light emitting unit 101 includes a connecting substrate 120 and a plurality of light emitting elements 110.

Fig. 10 and 11 are perspective views of the driving circuit substrate of the present embodiment, wherein the viewing angle of fig. 10 is a front viewing angle exposing the first connection surface, and the viewing angle of fig. 11 is a bottom viewing angle exposing the second connection surface. Referring to fig. 10, in the embodiment, the first pads 231 are disposed on the first connection surface 235 and are divided into a plurality of first pad groups 231G, and distribution areas of the first pad groups 231G are not overlapped with each other. For example, the first pads 231 of the present embodiment should provide 12 ground signals and 6 power signals, and thus each first pad group 231G includes 18 first pads 231.

Referring to fig. 11, in the embodiment, the second pads 232 are disposed on the second connection surface 236 and are divided into a plurality of second pad groups 232G, and the second pad groups 232G are respectively electrically connected to the first pad groups 231G (see fig. 10). It should be noted that fig. 10 and 11 only illustrate the distribution of the first pads 231 and the second pads 232, which is not intended to limit the distribution and size of the first pads 231 and the second pads 232 according to the present invention. The distribution of the first pads 231 and the second pads 232 can be adjusted by a person skilled in the art according to the requirement.

Fig. 12 and 13 are schematic perspective views of the display device of the present embodiment at different viewing angles, where the viewing angle of fig. 12 is a front viewing angle, and the viewing angle of fig. 13 is a bottom viewing angle. Referring to fig. 12, the light emitting units 101 are disposed on the first connection surface 235, and the connection substrates 120 of the light emitting units 101 are respectively electrically connected to the first pad groups 231G (see fig. 10).

Referring to fig. 13, the driving elements 140 are disposed on the second connection surfaces 236 and are respectively electrically connected to the second pad groups 232G (see fig. 11). With reference to fig. 12, in this way, the display device 200 can form a larger display surface area by the plurality of light emitting units 101. Meanwhile, referring to fig. 10 and 11, since the first pad groups 231G and the second pad groups 232G are electrically connected to each other and the first pad groups 231G are independently distributed on the first connection surface 235, the circuit in the driving circuit substrate 230 does not need to be bridged through the through holes, and thus a circuit board with lower precision and fewer layers can be formed, thereby simplifying the overall manufacturing process of the display device 200 and improving the manufacturing yield of the display device 200.

In summary, the light emitting module and the display device provided in the invention can have a connection substrate and a driving circuit substrate, and the driving circuit substrate can provide signals to the light emitting elements through the connection substrate. The circuits in the driving circuit substrate are not bridged with each other through the through hole, so that the complexity of the driving circuit substrate is reduced, and the manufacture of the light-emitting module and the display device can be simplified.

Claims

1. A light-emitting module, characterized in that the light-emitting module comprises:

At least one light-emitting unit, including:

a connection substrate; and

a plurality of light-emitting elements arranged on the connection substrate;

a driving circuit substrate, the light-emitting unit is disposed on the driving circuit substrate, the connecting substrate electrically connects the light-emitting elements to the driving circuit substrate, and the driving circuit substrate comprises:

a first connection surface;

a plurality of first pads, disposed on the first connection surface and electrically connected to the connection substrate;

a second connection surface, opposite the first connection surface; and

a plurality of second pads disposed on the second connection surface; and

At least one driving element is disposed on the second connecting surface and is electrically connected to the second pads,

The lines between the first pads and the second pads do not cross each other through the through holes.

2 . The light-emitting module of claim 1 , wherein the connection substrate is a high-density interconnection printed circuit board. 3 .

3 . The light-emitting module of claim 1 , further comprising a plurality of the light-emitting units and a plurality of the driving elements, the light-emitting units are respectively electrically connected to the driving elements, 3 .

wherein the second pads are divided into a plurality of second pad groups, and the second pad groups are respectively connected to the driving elements;

The first pads are divided into a plurality of first pad groups, the first pad groups are respectively electrically connected to the second pad groups, and the first pad groups are on the first connection surface The distribution areas do not overlap each other, and the connection substrates of the light emitting units are electrically connected to the first pad groups respectively.

4. The light-emitting module according to claim 1, wherein the driving circuit substrate comprises:

a first circuit layer;

a plurality of first electrical circuits disposed on the first circuit layer;

a second wiring layer disposed between the first wiring layer and the second connecting surface; and

a plurality of second electrical circuits disposed on the second circuit layer,

Each of the first electrical lines is electrically connected to a portion of the first pads to a portion of the second pads, and the second electrical lines are each electrically connected to another portion of the first pads to another portion The second pads, and the second electrical lines do not cross the first electrical lines through the through holes.

5. The light-emitting module according to claim 1, wherein the connection substrate comprises:

a third connecting surface;

a plurality of third pads, disposed on the third connection surface and electrically connected to the light-emitting elements;

a fourth connection surface, opposite the third connection surface; and

a plurality of fourth pads are disposed on the fourth connection surface and are respectively electrically connected to the first pads,

Each of the fourth pads is electrically connected to a plurality of the third pads.

6. The light-emitting module according to claim 4, wherein the connection substrate comprises:

a plurality of third electrical circuits respectively electrically connecting the first electrodes of the light-emitting elements to a part of the first pads; and

a plurality of fourth electrical circuits each electrically connecting the second electrodes of the light-emitting elements to another part of the first pads;

The density of the third electrical lines and the fourth electrical lines is greater than the density of the first electrical lines and the second electrical lines.

7. A display device, characterized in that the display device comprises:

At least one light-emitting unit, including:

a connection substrate; and

a plurality of pixels arranged on the connection substrate to form a pixel array, and each of the pixels includes a light-emitting element whose emission color is red, a light-emitting element whose emission color is green, and a light-emitting element whose emission color is blue;

a first connection surface;

a second connection surface, opposite the first connection surface; and

a plurality of second pads disposed on the second connection surface; and

at least one driving element disposed on the second connection surface and electrically connected to the second pads;

8. The display device according to claim 7, wherein the connection substrate is a high density interconnection printed circuit board.

9 . The display device of claim 7 , further comprising a plurality of light-emitting units and a plurality of the driving elements, the light-emitting units are respectively electrically connected to the driving elements, 9 .

10. The display device according to claim 7, wherein the driving circuit substrate comprises:

a first circuit layer;

a plurality of first electrical circuits disposed on the first circuit layer;

a plurality of second electrical circuits disposed on the second circuit layer,

Each of the first electrical lines is electrically connected to a portion of the first pads to a portion of the second pads, and the second electrical lines are each electrically connected to another portion of the first pads to The other part of the second pads, and the second electrical lines do not cross the first electrical lines through the through holes.

11. The display device according to claim 7, wherein the connection substrate comprises:

a third connecting surface;

a fourth connection surface, opposite the third connection surface; and

a plurality of fourth pads, disposed on the fourth connection surface and electrically connected to the first pads;

12. The display device of claim 10, wherein the connection substrate comprises:

13. A light-emitting module, characterized in that the light-emitting module comprises:

At least one light-emitting unit, including:

a connection substrate; and

a plurality of light-emitting elements arranged on the connection substrate;

a driving circuit substrate, the light-emitting element is disposed on the driving circuit substrate, the connecting substrate electrically connects the light-emitting elements to the driving circuit substrate, and the driving circuit substrate comprises:

a first connection surface;

a plurality of first pads, disposed on the first connection surface and electrically connected to the connection substrate; and

a second connection surface, opposite the first connection surface; and

at least one driving element disposed on the second connection surface and electrically connected to the first pads,

The lines between the first pads and the driving element do not cross each other through through holes, and the connecting substrate is a high-density interconnection printed circuit board, and the driving circuit substrate is not a high-density interconnection printed circuit board.