CN112822905B

CN112822905B - Electronic load device and load module with heat dissipation function

Info

Publication number: CN112822905B
Application number: CN201911126132.8A
Authority: CN
Inventors: 黄建兴; 刘崇琳; 周建车
Original assignee: Chroma ATE Suzhou Co Ltd
Current assignee: Chroma ATE Suzhou Co Ltd
Priority date: 2019-11-18
Filing date: 2019-11-18
Publication date: 2022-09-06
Anticipated expiration: 2039-11-18
Also published as: CN112822905A

Abstract

The application provides an electronic load device and a load module with a heat dissipation function. The main board is provided with a plurality of first ports, and the load module comprises a sub-board and a heat dissipation unit. The daughter board is provided with a second port and a pin slot, the second port is used for being connected with one of the first ports in a pluggable mode, and the pin slot is used for being connected with the power assembly. The heat radiation unit is provided with a cylindrical body and a plurality of heat radiation fins, the cylindrical body is defined with an outer surface and an opposite inner surface, and the plurality of heat radiation fins are connected with the outer surface. When the power component is connected with the pin slot, the power component contacts the inner surface.

Description

Electronic load device and load module with heat dissipation function

Technical Field

The present disclosure relates to an electronic load device and a load module, and more particularly, to a modular electronic load device and a load module with heat dissipation function.

Background

In order to meet various situations and requirements, the same product family may have models with different performance. For example, the electronic load devices may correspond to different models according to different load powers. Generally, although the electronic load devices are different in model, most cases only have differences in the number of power components, and the heat dissipation structure is not designed separately, but a heat dissipation structure capable of satisfying the highest load power is adopted. For example, assuming that 500 w, 300 w and 100 w of load power are required to be designed for the same series of electronic load devices, the industry would prefer to design the heat dissipation structure with 500 w specification and provide the heat dissipation structure for all models. The advantage of using a shared heat dissipation structure is that the shareability of the components can be improved, thereby reducing the development and manufacturing costs without affecting the working efficiency of various models.

However, while reducing costs, the above approach is associated with some disadvantages. For example, when a heat dissipation structure capable of being used for a 500 watt model is used only for a 100 watt or 300 watt model, the specification is certainly over-satisfied, and excessive resources are wasted for an excessive heat dissipation capacity, causing unnecessary burden to the environment. In addition, if a 500 watt heat dissipation structure is used for 100 watt or 300 watt, the size of 100 watt or 300 watt is too large, and the weight cannot be reduced. Therefore, there is a need for a new electronic load device and load module, which can respond to various load powers and reduce the waste of resources.

Disclosure of Invention

In view of the above, the present application provides an electronic load device having a modular load module. Thus, users can combine different numbers of load modules according to different load power requirements. Therefore, the waste of resources can be reduced, and the electronic load device with small load power can be prevented from being too heavy.

The application provides an electronic load device, which comprises a mainboard and a load module. The main board is provided with a plurality of first ports, and the load module comprises a sub-board and a heat dissipation unit. The daughter board is provided with a second port and a pin slot, the second port is used for being connected with one of the first ports in a pluggable mode, and the pin slot is used for being connected with the power assembly. The heat radiation unit is provided with a cylindrical body and a plurality of heat radiation fins, the cylindrical body is defined with an outer surface and an opposite inner surface, and the plurality of heat radiation fins are connected with the outer surface. The power component contacts the inner surface when the power component is connected to the pin slot.

In some embodiments, the electronic load device may further include a fan unit detachably connected to the load module, and an air outlet surface of the fan unit is perpendicular to the inner surface. In addition, the electronic load device further comprises a fixing rod and a stopping piece, wherein one of the plurality of radiating fins is provided with a first positioning component, the stopping piece is provided with a second positioning component, and the fixing rod penetrates through the first positioning component and the second positioning component. The stop piece can be arranged on the mainboard and at the same side of the first ports. In addition, the plurality of heat dissipation fins extend from the outer surface, and the plurality of heat dissipation fins may be in a spiral shape (helical).

In some embodiments, the second port of the daughter board may be connected to one of the first ports in a pluggable manner along a first direction, and the pin slot may be connected to the power module along a second direction, where the first direction is perpendicular to the second direction. In addition, the plurality of first ports are arranged on the surface of the main board at equal intervals along a third direction, and the third direction is perpendicular to the first direction. In addition, the inner surface of the cylindrical body can be surrounded by an accommodating space, and the sub-machine plate covers at least part of the opening of the accommodating space in the third direction.

The application provides a load module with a heat dissipation function, which can be independently assembled in an electronic load device. Moreover, the load module is provided with an independent sub-machine board, so that a user can assemble the load module on the main board of the electronic load device according to different load power requirements. Therefore, the waste of resources can be reduced, and the electronic load device with small load power can be prevented from being too heavy.

The application provides a load module with a heat dissipation function, which comprises a heat dissipation unit and a sub-machine board. The heat radiation unit is provided with a cylindrical body and a plurality of heat radiation fins, the cylindrical body is defined with an outer surface and an opposite inner surface, the inner surface is surrounded with an accommodating space, and the plurality of heat radiation fins are connected with the outer surface. The daughter board is used for fixing a plurality of power components, the power components are positioned in the accommodating space, and each power component is in contact with the inner surface. The heat dissipation unit further defines a first side and a second side, the cylindrical body is located between the first side and the second side, and the sub-board shields at least part of the opening of the accommodating space on the first side.

In some embodiments, the plurality of heat dissipation fins may extend from the outer surface, and the plurality of heat dissipation fins may be helical. In addition, the inner surface may have a plurality of flat areas, each flat area is configured to contact one of the plurality of power components, and the plurality of flat areas are not coplanar.

To sum up, the electronic load device that this application provided can be according to different load power demands, makes up the load module of different quantity on the mainboard. In addition, since the load modules may use the same heat dissipation unit, not only may a cost advantage due to high degree of part sharing be enjoyed, but also an excessively large heat dissipation structure may be prevented from being used in a model of low load power.

Further effects and embodiments of the present application will be described in detail below with reference to the accompanying drawings.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic perspective view of an electronic load device according to an embodiment of the present application;

FIG. 2 is a perspective view of a motherboard according to an embodiment of the present application;

FIG. 3 is a perspective view of a load module according to an embodiment of the present application;

fig. 4 is a perspective view of a daughter board and a power assembly of a load module according to an embodiment of the present disclosure;

fig. 5 is a schematic perspective view of a heat dissipation unit of a load module according to an embodiment of the application.

Description of the symbols

1 electronic load device 10 main board

10a, 10b stopper 100 plate body

102 a-102 g first port 104 external port

12 a-12 d load module 120 sub-panel

1200 second port 1202 foot slot

1204 power assembly 122 heat sink unit

1220 cylindrical body 1222 exterior surface

1224 inner surface 1224a planar area

1226 radiator fin 1228 locating component

14 fan unit 16 fixing lever

S1 accommodating space

Detailed Description

The foregoing and other technical matters, features and effects of the present application will be apparent from the following detailed description of a preferred embodiment, which is to be read in connection with the accompanying drawings. Directional terms as referred to in the following examples, for example: up, down, left, right, front or rear, etc., are simply directions with reference to the drawings. Accordingly, the directional terminology used is intended to be in the nature of words of description rather than of limitation.

Referring to fig. 1, fig. 1 is a schematic perspective view illustrating an electronic load device according to an embodiment of the present application. As shown in fig. 1, the electronic load device 1 includes a main board 10 and a plurality of load modules 12a to 12d, and a fan unit 14 may be connected to one side of the load module 12 d. Here, although fig. 1 illustrates 4 load modules 12a to 12d, the present embodiment does not limit the actual number of load modules, for example, the electronic load device 1 may only include one load module 12a or more load modules. In addition, the load modules 12a to 12d may be set to have the same or different load powers, and for example, when the load powers are the same, the load modules may be substantially the same in appearance or size. In addition, the electronic load device 1 may also include a housing (not shown), so that the main board 10, the plurality of load modules 12a to 12d and the fan unit 14 may be disposed in the housing. Each component of the electronic load device 1 will be described below.

Referring to fig. 1 and fig. 2 together, fig. 2 is a schematic perspective view illustrating a motherboard according to an embodiment of the present application. As shown in the figure, the main plate 10 includes a plate body 100, a plurality of first ports 102a to 102g provided in the plate body 100, and an external port 104. The board body 100 may be a printed circuit board, and may have circuit traces disposed therein, which may be used to electrically connect the first ports 102 a-102 g and the external port 104. Here, as long as the first ports 102a to 102g can be electrically connected to the plurality of load modules 12a to 12d, and the external port 104 can be electrically connected to an external power source terminal or a control terminal for receiving current or a control signal, one of ordinary skill in the art can freely select the specifications of the first ports 102a to 102g and the external port 104. In addition, the present embodiment does not limit the positions of the first ports 102a to 102g and the external port 104 on the plate body 100, for example, the first ports 102a to 102g may be arranged on the plate body 100 at equal intervals in one direction (i.e., along the third direction), and the external port 104 may be located at the edge of the plate body 100.

In addition, the number of the first ports is not limited in the present embodiment, and although the board body 100 is shown in the drawings to be provided with 6 first ports 102a to 102g, the number of the first ports may be increased or decreased, for example, the number of the first ports may be related to the maximum load power of the electronic load device 1. For example, the greater the number of first ports, the higher the load power of the electronic load device 1 may be. In practice, each of the first ports 102 a-102 g may correspond to a load module, such as the illustrated port 102a may correspond to the load module 12a, the illustrated port 102b may correspond to the load module 12b, and so on. Assuming that each load module is measured by a load power of 100 watts, the motherboard 10 has 6 first ports 102a to 102g, so that it can be inferred that the motherboard 10 should share a model number between 100 watts and 600 watts. At this time, since the main board 10 of the electronic load device 1 shown in the present embodiment is connected to 4 load modules 12a to 12d, the electronic load device can provide a load power of 400 w. Of course, different main boards may be used for different load power models, for example, a 400 watt model may also have exactly 4 first ports, and the embodiment is not limited herein.

In addition, the first ports 102a to 102g do not necessarily have to be all connected to the load modules, for example, the number of the first ports and the number of the load modules may be different. As can be seen from the drawings, the first port 102f and the first port 102g may be left empty without being connected to a load module, although it is also possible to select other first ports to be left empty in practice, and the embodiment is not limited herein. In one example, the load power of the electronic load apparatus 1 is more related to the specification of the power component in each load module, for example, the higher the load power of the power component is, the higher the load power can be provided by the electronic load apparatus 1 when the same number of load modules are connected. It should be noted that the present embodiment merely exemplifies that the first port may have a relationship with the load power, and is not used to limit the load power range that the electronic load device 1 can use.

To explain the load module of the present embodiment in detail, please refer to fig. 1 to 5 together, fig. 3 is a schematic perspective view illustrating the load module according to an embodiment of the present application, fig. 4 is a schematic perspective view illustrating a daughter board and a power assembly of the load module according to an embodiment of the present application, and fig. 5 is a schematic perspective view illustrating a heat dissipation unit of the load module according to an embodiment of the present application. As shown in fig. 3 to fig. 5, one of the load modules 12a to 12d is selected, for example, taking the load module 12a as an example, the load module 12a may include a sub-board 120 and a heat dissipation unit 122, and the sub-board 120 has a second port 1200 and a foot slot 1202. The second port 1200 is used to connect one of the plurality of first ports 102 a-102 g in a pluggable manner, such as the first port 102a shown in fig. 2. Since the first ports 102 a-102 g may have the same specifications, it is possible for the load module 12a to be connected to other first ports as well. In one example, the daughter board 120 may be a printed circuit board as the board body 100, and may have circuit traces disposed therein, which may be used to electrically connect the second port 1200 and the pin slot 1202. Here, the pin slot 1202 may be further used to connect the power device 1204, so that the current provided by the external power source can pass through the external port 104, the board body 100 to the first port 102a, and then pass through the daughter board 120, the pin slot 1202 and the power device 1204 from the second port 1200.

As shown, the second port 1200 may be pluggable to the first port 102a in a direction perpendicular to the board body 100 (i.e., in the first direction), so that the daughter board 120 may stand on one side of the board body 100. Here, the specification of the second port 1200 is not limited in this embodiment, as long as the first port 102a and the second port 1200 can be connected to each other and transmit current or control signals, which shall be the category of the second port 1200 in this embodiment. In addition, the pin slot 1202 may include one or more through holes (via) on the daughter board 120, such that a connection pin (pin) of the power component 1204 can be inserted into the pin slot 1202, thereby electrically connecting the power component 1204 to a circuit trace inside the daughter board 120. At this time, the power component 1204 may be vertically (i.e., along the second direction) inserted into the pin slot 1202 on the daughter board 120, in other words, the pin slot 1202 may be regarded as a position where the power component 1204 is disposed. In one example, the daughter board 120 may have a plurality of pin slots 1202, for example, fig. 4 illustrates that 3 pin slots 1202 are provided in the daughter board 120, and each pin slot 1202 is connected to a power component 1204.

In practice, the power elements 1204 generate high heat during operation, so the plurality of pin slots 1202 should be substantially spaced apart to prevent the power elements 1204 from contacting each other. For heat dissipation, the load module 12a further has a heat dissipating unit 122, the heat dissipating unit 122 has a cylindrical body 1220, and the cylindrical body 1220 defines an outer surface 1222 and an opposite inner surface 1224. Externally, the cylindrical body 1220 may be a hollow structure such that the inner surface 1224 encloses the receiving space S1. As can be seen from the drawings, the inner surface 1224 may be a partial boundary of the receiving space S1, but is not used for closing the receiving space S1, for example, the receiving space S1 may have openings on both sides of the cylindrical body 1220. When the daughter board 120 is assembled with the heat dissipating unit 122, the daughter board 120 is adjacent to one side of the cylindrical body 1220, each power component 1204 should contact the inner surface 1224, and the daughter board 120 covers the opening of the receiving space S1.

For the example shown in the figures, because the power elements 1204 are substantially cubic, in order to make each power element 1204 more closely contact the inner surface 1224, the inner surface 1224 has a flat area 1224a that provides the power element 1204 contact, i.e., the flat area 1224a and the power element 1204 may be in a one-to-one relationship such that one side of the power element 1204 may be in thermal communication with the inner surface 1224. In other words, the shape of the inner surface 1224 or the number of flat areas 1224a of the cylindrical body 1220 may be determined according to the number of power modules 1204 installed on the daughter board 120. For example, 3 power modules 1204 arranged in a triangle are electrically connected to the sub-board 120, so that the inner surface 1224 of the cylindrical body 1220 may be correspondingly provided with 3 flat areas 1224a that are not coplanar, so that all 3 power modules 1204 may be in flat contact with the inner surface 1224.

In addition, when the daughter board 120 and the heat dissipating unit 122 are assembled together, the present embodiment does not limit whether the daughter board 120 and the heat dissipating unit 122 are fixed together. In practice, the power component 1204 should contribute to the efficiency of heat transfer if it is closely adhered to the flat area 1224a of the inner surface 1224. For example, the power device 1204 may be adhered to the flat area 1224a of the inner surface 1224 with a thermally conductive adhesive, or the power device 1204 may be directly fastened or engaged with the flat area 1224a of the inner surface 1224. In one example, the power component 1204 may be only disposed in the accommodating space S1, such that the power component 1204 only contacts the flat area 1224a of the inner surface 1224, and the power component 1204 may not be specifically adhered or fixed to the flat area 1224a of the inner surface 1224.

On the other hand, the outer surface 1222 of the cylindrical body 1220 may be connected with a plurality of heat dissipation fins 1226, and the heat dissipation fins 1226 may have a spiral shape in appearance to increase a wind impact area. In addition, the radiator fins 1226 function as a positioning member 1228 (first positioning member) for a part of the radiator fins 1226, in addition to radiating heat. In practice, the positioning members 1228 may be disposed on the heat dissipation fins 1226 located at the corners, that is, the positioning members 1228 may be provided in plural and arranged symmetrically. Of course, the position of the positioning assembly 1228 is not limited herein, as long as the positioning assembly 1228 can be used to buckle the fixing rod 16 in fig. 1, which meets the scope of the positioning assembly 1228 in this embodiment. For practical purposes, when the load modules 12 a-12 d are connected to the first ports 102 a-102 d, respectively, the load modules 12 a-12 d may be structurally weak and unstable by simply interconnecting the first port 102a and the second port 1200. At this time, the electronic load device 1 can lock each heat dissipation unit 122 of the load modules 12a to 12d together through a plurality of fixing rods 16, so that the structure is relatively firm. Of course, the present embodiment is not limited to having the fixing bar 16, for example, the housing of the electronic load device 1 may be used to fix the relative positions of the main board 10 and the load modules 12a to 12d, so that the electronic load device 1 lacking the fixing bar 16 does not affect the function.

In addition, the main board 10 may further have

detachable stoppers

10a and 10b on the board body 100, and a user may determine the placement positions of the

stoppers

10a and 10b according to the number of the load modules. For example, as shown in fig. 1, since the main board 10 is connected to 4 load modules 12 a-12 d, the stopper 10a can be disposed on one side of the load module 12a, and the stopper 10b can be disposed on the other side of the load module 12d, such that the load modules 12 a-12 d are slightly clamped between the

stoppers

10a and 10 b. In addition, the

stoppers

10a and 10b may further have through holes (second positioning components), so that the fixing rod 16 may connect the

stoppers

10a and 10b and each heat dissipating unit 122 of the load modules 12a to 12d in series. Because the

stoppers

10a, 10b are directly fixed to the plate body 100, they may be more robust than the load modules 12 a-12 d interconnected by the first port 102a and the second port 1200. As mentioned above, the present embodiment is not limited to the

stoppers

10a and 10b, for example, the housing of the electronic load device 1 may be used to hold the load modules 12a to 12d, so that the electronic load device 1 without the

stoppers

10a and 10b does not affect the functions.

In order to improve the efficiency of the heat dissipation by the heat dissipation fins 1226, the electronic load device 1 may also be provided with a fan unit 14 for generating an air flow to remove the heat from the heat dissipation fins 1226. In one example, the air outlet direction of the fan unit 14 is toward the daughter board 120, or the same as the arrangement direction of the first ports 102a to 102 g. Since the opening of one side of the cylindrical main body 1220 is shielded by the sub-machine plate 120, less air flow enters the accommodating space S1, and more air flow passes through the heat dissipation fins 1226. Although fig. 1 shows the fan unit 14 disposed above the stopper 10b, the fan unit 14 may be disposed above the other stopper 10 a. Similarly, the fan unit 14 may also have a through hole, so that the fixing rod 16 may connect the

stoppers

10a and 10b, each heat dissipating unit 122 of the load modules 12a to 12d, and the fan unit 14 in series. In an example, in the absence of the

stoppers

10a and 10b, the fan unit 14 may be directly connected to the load modules 12a to 12d via the fixing rod 16, and even the fan unit 14 may be fixed to the housing of the electronic load apparatus 1, which is not limited herein.

To sum up, the electronic load device that this application provided can be according to different load power demands, makes up the load module of different quantity on the mainboard. In addition, since the load modules can use the same heat dissipation unit, not only can the cost advantage brought by the high sharing of parts be enjoyed, but also the use of a heat dissipation structure with an excessively large volume in a model with low load power can be avoided.

The above-described embodiments and/or implementations are only illustrative of the preferred embodiments and/or implementations for implementing the technology of the present application, and are not intended to limit the implementations of the technology of the present application in any way, and those skilled in the art can make many changes or modifications to the equivalent embodiments without departing from the scope of the technology disclosed in the present application, but should still be considered as the technology or implementations substantially the same as the present application.

Claims

1. An electronic load device, comprising:

a main board with a plurality of first ports; and

a load module, comprising:

a daughter board having a second port and a pin slot, wherein the second port is used to connect with one of the first ports in a pluggable manner, and the pin slot is used to connect with a power component; and

the heat dissipation unit is provided with a cylindrical body and a plurality of heat dissipation fins, the cylindrical body is defined with an outer surface and an opposite inner surface, and the heat dissipation fins are connected with the outer surface;

when the power component is connected with the pin slot, the power component contacts the inner surface.

2. The electrical load apparatus of claim 1, further comprising a fan unit detachably connected to the load module, wherein an outlet surface of the fan unit is perpendicular to the inner surface.

3. The electronic load device of claim 1, further comprising a fixing rod and a stopping member, wherein one of the heat fins has a first positioning element, the stopping member is disposed on the motherboard and the stopping member has a second positioning element, and the fixing rod is disposed through the first positioning element and the second positioning element.

4. The electrical load apparatus of claim 1, wherein the second port of the daughter board is connected to one of the first ports in a pluggable manner along a first direction, and the pin slot is connected to the power module along a second direction, the first direction being perpendicular to the second direction.

5. The electrical load apparatus of claim 4, wherein the first ports are arranged on a surface of the motherboard at equal intervals along a third direction, the third direction being perpendicular to the first direction.

6. The electrical load apparatus as claimed in claim 5, wherein the inner surface of the cylindrical body is surrounded by a receiving space, and the sub-board covers at least a portion of an opening of the receiving space in the third direction.

7. The electrical load apparatus of claim 1, wherein the fins extend from the outer surface and the fins are helical.

8. A load module with heat dissipation function, comprising:

the heat dissipation unit is provided with a cylindrical body and a plurality of heat dissipation fins, the cylindrical body is defined with an outer surface and an opposite inner surface, the inner surface surrounds an accommodating space, and the heat dissipation fins are connected with the outer surface; and

the sub-machine plate is used for fixing a plurality of power components, the power components are positioned in the accommodating space, and each power component is contacted with the inner surface;

the heat dissipation unit further defines a first side and a second side, the cylindrical body is located between the first side and the second side, and the sub-board covers at least part of the opening of the accommodating space on the first side.

9. The load module of claim 8, wherein the fins extend from the outer surface and are helical.

10. The load module of claim 8, wherein the inner surface has a plurality of flat areas, each flat area is configured to contact one of the power devices, and the flat areas are not coplanar.