JP5522066B2 - Optical communication card module - Google Patents

Description

  The present invention relates to an optical communication card module.

  Conventionally, as a heat dissipation device for an optical transceiver mounted on an optical communication card module such as a line card, a heat sink for heat dissipation is mounted on the optical transceiver in a state where the optical transceiver is housed in a cage installed on a host board. A technique is known (for example, refer to Patent Document 1). In this prior art, by disposing a heat sink on the upper wall of the cage provided with the opening, heat is transmitted from the upper surface of the optical transceiver to the heat sink to dissipate heat. In particular, a convex portion is formed on the bottom surface of the heat sink, and the convex portion protrudes inward from the opening of the cage so that the heat sink contacts the upper surface of the optical transceiver housed in the cage. . The heat sink is divided into a plurality of parts in the longitudinal direction (insertion / extraction direction) of the optical transceiver, and each heat sink is individually pressed by an elastic member. Thereby, the convex part formed in the bottom face of each heat sink and the upper surface of the optical transceiver are brought into close contact with each other to enhance the thermal conductivity from the optical transceiver to the heat sink.

JP 2010-85805 A

  As in the prior art described above, in a structure in which heat sinks are stacked and installed in the mounting direction of the optical transceiver (substrate thickness direction) with respect to the host substrate, it is difficult to suppress the dimension in the thickness direction as a whole device. Even when a host board on which an optical transceiver is mounted is used as a card module such as a line card, it is difficult to reduce the thickness of the entire line card in consideration of the installation height of the heat sink. For this reason, for example, even if a line card is to be mounted on a chassis-type or box-type switching hub, it cannot be mounted if sufficient space cannot be secured in the thickness direction. On the other hand, if a sufficient space is secured in the thickness direction of the line card, there is a problem that the switching hub is increased in size.

  Accordingly, an object of the present invention is to provide a technique capable of efficiently cooling the heat emitted from the optical transceiver while contributing to the thinning of the entire module.

In order to solve the above problems, an aspect of the optical communication card module of the present invention includes a substrate on which an optical transceiver for optical communication is mounted on a mounting surface, and a mounting height direction of the optical transceiver with respect to the substrate. A heat conduction member that receives heat generated from the optical transceiver at a position away from the mounting surface and transfers the heat in a direction along the mounting surface; and the heat conduction at a side of the optical transceiver along the mounting surface. A heat dissipating member that releases heat transferred by the member, and the heat conducting member includes a contact region that contacts the upper surface of the optical transceiver when viewed on the mounting surface, and at least along the mounting surface from the contact region. A heat conduction region projecting toward one side of the optical transceiver, and the heat dissipation member is aligned with at least one side of the optical transceiver from the heat conduction region. Characterized in that it comprises a plurality of heat radiating fins protruding toward the serial mounting surface.

  According to the card module for optical communication of the present invention, it is possible to contribute to the reduction in thickness of the entire module and to efficiently cool the heat emitted from the optical transceiver.

It is a disassembled perspective view which shows schematically the structure of the line card of 1st Embodiment. It is the perspective view which showed the line card in the completion state. It is the perspective view which showed notionally the heat dissipation effect by a heat sink. FIG. 4 is a cross-sectional view of a cage and a heat sink taken along line IV-IV in FIG. 3. It is a disassembled perspective view which shows schematically the structure of the line card in 2nd Embodiment. It is the perspective view which showed roughly the thermal radiation effect | action by the heat sink of 2nd Embodiment. It is sectional drawing of the cage and heat sink which follow the VII-VII line | wire in FIG. It is the perspective view which showed roughly the thermal radiation effect | action of the heat sink in 3rd Embodiment. It is sectional drawing of the cage and heat sink which follow the IX-IX line in FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[First Embodiment]
FIG. 1 is an exploded perspective view schematically showing the configuration of the line card 1 of the first embodiment. FIG. 2 is a perspective view showing the line card 1 in a completed state. The line card 1 is an example of an optical communication card module mounted on a chassis type or box type switching hub (not shown). In the following embodiment, only the part related to the heat dissipation is shown in the configuration of the line card 1, and the other parts are not shown and described.

  The line card 1 includes a substrate 2 serving as a host for various mounting components. For example, the substrate 2 has a bezel 4 made of a metal plate attached to one side edge in the attachment direction (insertion direction) to the chassis. The bezel 4 has an opening 4a formed in the front as viewed in the mounting direction of the chassis, and a plurality of vent holes 4b formed on one side of the opening 4a. These openings 4 a and vent holes 4 b penetrate through the bezel 4 in the thickness direction. A pattern of connection electrodes (not shown) is formed on the other side edge of the substrate 2 along the edge. The line card 1 is mounted, for example, on a mother board of a chassis type switching hub with a connection electrode inserted in the connector, and can be fixed to the chassis by the bezel 4 (the mother board, the connector, the chassis, etc. Neither is shown.) In addition, like the known line card, electronic circuits and various elements necessary for data relay, a cooling fan, and the like (all not shown) are mounted on the substrate 2. For example, when air is taken in using a cooling fan, a flow of air is formed from the outside of the chassis to the inside of the chassis through the vent holes 4b of the bezel 4. The bezel 4 may have a flat plate shape.

  A cage 8 is mounted together with the connector 6 on the mounting surface of the substrate 2. Among these, the connector 6 is for connecting a wiring pattern (not shown) formed on the substrate 2 and the optical transceiver 10. The cage 8 is a housing for housing the optical transceiver 10, and an insertion port 8 a is formed at one end of the cage 8 as viewed in the longitudinal direction. An opening 8 b is formed on the upper surface of the mounting surface of the substrate 2 as viewed in the height (thickness) direction of the cage 8. Openings 8c and 8d are also formed on the lower surface and the side surface of the cage 8 as viewed in the height direction.

  In a state where the cage 8 is installed on the substrate 2 (a completed state of the line card 1), the connector 6 is inserted into the cage 8 through the opening 8c formed on the lower surface of the cage 8. The insertion port 8 a is disposed on the back side of the bezel 4 so as to face the opening 4 a, and its front end contacts the back surface of the bezel 4.

  In addition, the cage 8 is formed with, for example, a plurality of legs (not shown) protruding from the lower surface thereof, and these legs are through-holes (also not shown) formed in the substrate 2. It is soldered in the state inserted in The insertion port 8 a is provided with a plurality of crimp terminals (not shown) along its inner edge, and these crimp terminals are provided on the outer surface of the optical transceiver 10 in a state where the optical transceiver 10 is accommodated in the cage 8. Crimp.

  The optical transceiver 10 is a module for optical communication that transmits and receives an optical signal corresponding to a communication standard of 10 Gbps (Giga Bit Per Second), for example. The optical transceiver 10 includes, for example, an optical transmission / reception element and a photoelectric conversion element (not shown) therein, and also has a port 10a and a connector 10b as an external interface. The optical transceiver 10 can be inserted into the cage 8 from the opening 4 a of the bezel 4 through the insertion port 8 a of the cage 8, and at this time, the connector 10 b is connected to the connector 6 inside the cage 8. In the completed state shown in FIG. 2, the port 10 a of the optical transceiver 10 is exposed to the front side of the bezel 4, whereby an optical cable (not shown) can be connected to the optical transceiver 10.

  The line card 1 is provided with a heat sink 12 as a heat radiating member. The heat sink 12 includes, for example, a base plate 12a as a heat conducting member and heat radiating fins 12b as heat radiating members. Among these, the base plate 12 a is fixed to the cage 8 in a state of being disposed on the upper surface of the cage 8. At this time, a partial area (hereinafter referred to as “contact area”) of the back surface of the base plate 12 a is in close contact with the upper surface of the cage 8. A convex portion (not shown in FIGS. 1 and 2) is formed in this contact region, and this convex portion contacts the upper surface of the optical transceiver 10 through the opening 8 b of the cage 8. In addition, for the attachment between the base plate 12a and the upper surface of the cage 8, for example, a technique such as crimping using an elastic member can be used. Moreover, the form attached to the back surface of the baseplate 12a as another member may be sufficient as a convex part. The contact relationship between the convex portion and the optical transceiver 10 will be further described later using another sectional view.

  As shown in FIG. 2, the base plate 12 a is attached to the upper surface of the cage 8, and further has a region protruding to one side of the cage 8. This overhanging region (without reference numerals) extends substantially parallel to the mounting surface of the substrate 2, and a large number of heat radiation fins 12b are formed on the lower surface thereof. These heat dissipating fins 12b are arranged in a matrix at a predetermined pitch on the back surface of the protruding region portion of the base plate 12a, and all extend from the back surface of the base plate 12a toward the mounting surface of the substrate 2. Further, the heat radiating fins 12 b are arranged to face the vent holes 4 b of the bezel 4. The air flow formed by the cooling fan passes from the outside of the line card 1 around the heat radiating fins 12b through the vent holes 4b. In addition, although the prismatic heat radiation fin 12b is mentioned here as an example, the heat radiation fin 12b may be a columnar shape or a thin plate shape.

  FIG. 3 is a perspective view conceptually showing the heat radiation action by the heat sink 12. In FIG. 3, only the cage 8 and the heat sink 12 are shown for convenience in the configuration of the line card 1. Further, the arrows shown in FIG. 3 indicate the flow of air supplied and exhausted with the line card 1 attached.

  For example, in a chassis type switching hub on which the line card 1 is mounted, an air flow is formed around the line card 1 by a cooling fan mounted thereon. For example, the air flow is generated from the bezel 4 toward one side edge of the substrate 2 in the chassis.

  4 is a cross-sectional view of the cage 8 and the heat sink 12 taken along the line IV-IV in FIG. An arrow indicated by a solid line in FIG. 4 indicates the direction of transfer of heat released from the optical transceiver 10. Moreover, the arrow shown by the outline has shown the flow of the air mentioned above.

  As shown in FIG. 4, the convex portion 12c is provided in the contact area between the base plate 12a and the cage 8, and the convex portion 12c is in contact with the optical transceiver 10 through the opening 8b. In addition, the convex part 12c may be formed integrally with the base plate 12a.

  The heat generated by the optical transceiver 10 is first transmitted to the base plate 12a from the convex portion 12c in contact with the upper surface. Further, the heat is transmitted through the region (thermal conduction region) where the base plate 12 a protrudes, and is further transmitted to the radiation fins 12 b of the heat sink 12.

  At this time, the air flow formed by the cooling fan as described above passes around the radiating fins 12b. Therefore, the heat transmitted to the heat radiation fins 12b is taken away by the air flow, and the optical transceiver 10 is continuously cooled. Although not shown in the figure, heat is also radiated from the upper surface of the base plate 12a, so that the cooling effect can be further improved.

  In this regard, for example, if the heat sink is installed on the upper surface of the optical transceiver 10 or the cage 8 as in the prior art, the height of the cage 8 plus the heat radiating fins is the height of the line card 1 as a whole. Therefore, it is necessary to secure a space in the thickness direction of the line card 1.

  On the other hand, in the structure of the first embodiment, the heat dissipating fins 12b that mainly exhibit the heat dissipating action are arranged in a state of being arranged on one side of the optical transceiver 10 (cage 8) along the mounting surface of the substrate 2. In addition, since the radiation fins 12b do not exist in the height direction of the optical transceiver 10 or the cage 8, their overall mounting height can be kept low. Therefore, for example, the overall size of a chassis type switching hub on which a plurality of line cards 1 are mounted can be reduced.

[Second Embodiment]
Next, the optical communication card module of the second embodiment will be described. In the second embodiment, the shape of the heat sink 22 is different from the shape of the heat sink 12 in the first embodiment. Other configurations are the same as those in the first embodiment.

  FIG. 5 is an exploded perspective view schematically showing the configuration of the line card 1 in the second embodiment. Here, similarly to the configuration of the line card 1 of the first embodiment, only the part related to heat dissipation is shown, and the other parts are not shown and described. In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals in FIG.

  As in the case where the cage 8 is installed in the line card 1 of the first embodiment, the lower surface of the cage 8 is fixed on the mounting surface of the substrate 2. Similarly to the case where the optical transceiver 10 is installed in the line card 1 of the first embodiment, the optical transceiver 10 is accommodated in the cage 8 from the opening 4a of the bezel 4 through the insertion port 8a of the cage 8. .

  The base plate 22a is fixed to the cage 8 in a state of being disposed on the upper surface of the cage 8. At this time, the base plate 22 a has regions (heat conduction regions) that protrude to both sides of the cage 8. The regions projecting to the sides extend substantially parallel to the mounting surface of the substrate 2, and a large number of heat radiation fins 22b are formed on the lower surface thereof. As described above, the second embodiment is different from the first embodiment in that each of the cage 8 has an overhang region on each side, and the radiation fins 22b are formed on each of the regions. A plurality of ventilation holes 4b and 4c are formed in the bezel 4 on both sides of the opening 4a so as to face the heat radiation fins 22b formed on both sides of the cage 8.

  FIG. 6 is a perspective view schematically showing the heat radiation action by the heat sink 22 of the second embodiment. Here again, it is assumed that an air flow is generated in the periphery toward one side edge of the substrate 2 through the vent holes 4b and 4c of the bezel 4 by a cooling fan (not shown).

  The heat radiating fins 22b are respectively disposed on both sides of the optical transceiver 10 along the mounting surface of the substrate 2. That is, the heat sink 22 is fixed to the cage 8 in a state of straddling the cage 8 when viewed from the insertion port 8a side.

  FIG. 7 is a cross-sectional view of the cage 8 and the heat sink 22 taken along the line VII-VII in FIG. Similarly in FIG. 7, the direction of transfer of heat released from the optical transceiver 10 is indicated by solid arrows, and the flow of air supplied and exhausted by the line card 1 is indicated by white arrows.

  The heat released from the optical transceiver 10 is first transmitted to the base plate 22a from the convex portion 22c in contact with the upper surface. Further, the heat is transmitted from the convex portion 22 c to the region (thermal conduction region) protruding to both sides of the cage 8 through the contact region of the base plate 22 a, and is transmitted to the heat radiation fins 22 b of the heat sink 22. The heat transmitted to the heat radiating fins 22b is taken away by the air flow, and the optical transceiver 10 is continuously cooled.

  Thus, the base plate 22a in the second embodiment can be expanded in area as compared with the base plate 12a in the first embodiment, and more heat radiation fins 22b can be formed accordingly. For this reason, the cooling effect can be further improved.

  Similarly to the heat dissipation structure of the optical transceiver 10 in the first embodiment, the heat dissipation fins 22b of the heatsink 22 in the second embodiment do not exist in the height direction of the optical transceiver 10 or the cage 8, and thus the overall mounting thereof. The height can be kept low. Therefore, as in the first embodiment, the overall size of the chassis type switching hub on which the plurality of line cards 1 are mounted can be reduced.

[Third Embodiment]
Next, an optical communication card module according to the third embodiment will be described. In the third embodiment, the shape of the heat sink 32 is further different from the shapes of the heat sinks 12 and 22 in the first and second embodiments. Since other configurations are the same as those in the first and second embodiments, the same reference numerals are assigned and repeated descriptions are omitted as appropriate.

  FIG. 8 is a perspective view schematically showing the heat radiation action of the heat sink 32 in the third embodiment. Here, as in the first and second embodiments, the line card 1 of the third embodiment also has a cooling fan (not shown) that generates a flow of air from the bezel 4 to one side edge of the substrate 2 in the periphery. To do.

  In the third embodiment, the base plate 32 a is formed along the upper surface and both side surfaces of the cage 8. In a state where the heat sink 32 is installed on the line card 1, the back surface of the base plate 32 a is in contact with the top surface and both side surfaces of the cage 8. At this time, on the back surface of the base plate 32 a disposed on the upper surface of the cage 8, a convex portion (not shown in FIG. 8) provided in a region of this surface has an opening 8 b formed on the upper surface of the cage 8. Through the optical transceiver 10. In addition, by providing convex portions (not shown in FIG. 8) in one area of each surface on the back surface of the base plate 32a disposed on both side surfaces of the cage 8, these are respectively provided on both side surfaces of the cage 8. You may make it contact the both sides | surfaces of the optical transceiver 10 through the formed opening 8d. In this way, the base plate 32 a can receive heat generated from the optical transceiver 10 with its back surface in contact with the top surface and both side surfaces of the optical transceiver 10. The contact relationship between the protrusions and the optical transceiver 10 will be further described later with reference to another drawing.

  The heat radiating fins 32 b are disposed on both sides of the optical transceiver 10 along the mounting surface of the substrate 2. That is, the radiating fins 32b are arranged on both surfaces of the base plate 32a as viewed from the insertion port 8a side, and extend from the surface of each side surface in a direction substantially parallel to the mounting surface of the substrate 2.

  FIG. 9 is a cross-sectional view of the cage 8 and the heat sink 32 along the line IX-IX in FIG. Similarly in FIG. 9, the direction of transfer of heat released from the optical transceiver 10 is indicated by solid arrows, and the flow of air supplied and exhausted by the line card 1 is indicated by white arrows.

  The heat emitted from the optical transceiver 10 is first transmitted to the base plate 32a from the convex portions 32c and 32d that are in contact with the upper surface and both side surfaces. The heat transmitted to the base plate 32a is transmitted to the radiation fins 32b. In addition, in the position of the both side surfaces of the cage 8 (optical transceiver 10), in addition to the heat generated from the upper surface of the optical transceiver 10, the heat generated from both side surfaces is transmitted to the base plate 32a and reaches the heat radiating fins 32b. Communicated.

  Then, the air flow formed around the radiation fins 32b by the cooling fan takes away the heat transmitted to the radiation fins 32b and continuously cools the optical transceiver 10. Further, similarly to the first and second embodiments, since the heat is radiated from the surface of the base plate 32a where the radiating fins 32b are not disposed, the cooling effect can be further improved.

  As described above, in the third embodiment, the area of the back surface of the base plate 32a that contacts the cage 8 (the optical transceiver 10) is larger than that of the base plates 12a and 22a of the first and second embodiments. The heat released from the heat can be transferred to the radiation fins 32b.

  Further, as in the first and second embodiments, although the heat radiation fins 32b exist on both sides of the optical transceiver 10 and the cage 8, they do not exist in the height direction of the optical transceiver 10 and the cage 8, so Mounting height can be kept low. Furthermore, it is possible to contribute to reducing the overall size of the chassis type switching hub on which the plurality of line cards 1 are mounted.

  The present invention is not limited to the first to third embodiments described above, and various modifications can be made. For example, in the first and second embodiments, when the plurality of cages 8 are arranged on the mounting surface of the substrate 2 in the longitudinal direction of the bezel 4, the widths of the base plates 12 a and 22 a are widened, and the plurality of cages 8. You may arrange | position in the state which covered the upper surface of. Similarly, the heat sink 32 in the third embodiment may be arranged in a state where the upper surface of the base plate 32a is widened and straddles the plurality of cages 8 arranged in series.

  In the first to third embodiments, the heat sinks 12, 22, and 32 are fixed to the cage 8. For example, the cage 8 and the heat sinks 12, 22, and 32 are separated from each other on the mounting surface of the substrate 2. You may arrange in. At this time, it is preferable to connect the cage 8 and the heat sinks 12, 22, and 32 with a heat pipe.

  The optical communication card module of the present invention may be mounted on a box-type switching hub. The optical communication card module of the present invention can be applied to a long-distance optical transmission device (media converter) in addition to a switching hub.

DESCRIPTION OF SYMBOLS 1 Line card 2 Board | substrate 8 Cage 8a Insert 10 Optical transceiver 12, 22, 32 Heat sink 12a, 22a, 32a Base plate (thermal conduction member)
12b, 22b, 32b Heat radiation fin (heat radiation member)
12c, 22c, 32c, 32d Convex part

Claims (4)

A substrate on which an optical transceiver for optical communication is mounted on the mounting surface;
A heat conducting member that receives heat generated from the optical transceiver at a position away from the mounting surface in the direction of the mounting height of the optical transceiver with respect to the substrate, and transfers heat in a direction along the mounting surface;
A heat radiating member that releases heat transferred by the heat conducting member at a side of the optical transceiver along the mounting surface ;
The heat conducting member is
A contact area in contact with the upper surface of the optical transceiver when viewed on the mounting surface;
A heat conduction region extending from the contact region along the mounting surface toward at least one side of the optical transceiver,
The heat dissipation member is
An optical communication card module comprising a plurality of heat radiation fins that are arranged at least on one side of the optical transceiver and project from the heat conduction region toward the mounting surface . The optical communication card module according to claim 1 ,
It further includes a cage having an accommodating space for accommodating the optical transceiver therein, one outer surface facing in the thickness direction fixed to the mounting surface, and an opening formed on the other outer surface,
The heat conducting member is
An optical communication card module, wherein the optical transceiver is in contact with the optical transceiver through the opening in a state where the optical transceiver is accommodated in the cage. The optical communication card module according to claim 1 or 2 ,
The heat dissipation member is
An optical communication card module, which is disposed on each side of the optical transceiver along the mounting surface. In the optical communication card module according to any one of claims 1 to 3 ,
The heat conducting member is
Receiving heat generated from the optical transceiver in contact with at least one side surface of the optical transceiver viewed from the mounting surface and at least one side surface connected to the upper surface;
The heat dissipation member is
In addition to the heat received from the upper surface of the optical transceiver by the heat conducting member, the heat received from one side of the optical transceiver is released to the side of the transceiver.

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