CN112816746B - Probe card structure - Google Patents
Probe card structure Download PDFInfo
- Publication number
- CN112816746B CN112816746B CN202110011299.0A CN202110011299A CN112816746B CN 112816746 B CN112816746 B CN 112816746B CN 202110011299 A CN202110011299 A CN 202110011299A CN 112816746 B CN112816746 B CN 112816746B
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- Prior art keywords
- probe
- circuit board
- test
- ring
- detection window
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- 239000000523 sample Substances 0.000 title claims abstract description 130
- 238000012360 testing method Methods 0.000 claims abstract description 69
- 238000001514 detection method Methods 0.000 claims abstract description 36
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The application discloses a probe card structure, and relates to the field of integrated circuits. The probe card structure comprises a circuit board, a fixed ring, a probe cantilever bearing ring and a test probe; the circuit board is provided with a detection window, and a test circuit is arranged in the circuit board; the probe cantilever bearing ring is fixed below the circuit board through the fixing ring, and the lower end of the probe cantilever bearing ring is positioned below the detection window; the top end of the test probe is welded on the back surface of the circuit board, the test probe is connected with a test circuit in the circuit board, and the lower half part of the test probe is fixed at the bottom of the probe cantilever bearing ring; the tip of the test probe is exposed below the detection window; the problem that the detection window on the traditional probe card is smaller and is difficult to be suitable for special detection conditions is solved; helping to provide a wide operating space and view field when detecting chips with a probe card.
Description
Technical Field
The application relates to the field of integrated circuits, in particular to a probe card structure.
Background
The probe card is an interface between the chip under test and the test equipment in wafer testing. The use principle of the probe card is that the probes on the probe card are directly contacted with pads (pads) or pins of a chip, so that signal transmission between the test equipment and the tested chip is realized.
Before leaving the factory, the chips on the wafer are subjected to electrical test through the probe card, so that defects of the chips can be found, and the manufacturing process of the device is convenient and improved in time. Generally, in wafer level testing, probes on a probe card are contacted with test pads of a chip to be tested, and test equipment sends a test program and receives a test result.
Currently, under some testing conditions, probes on a probe card are difficult to meet the detection requirements, and if the probe card is manufactured again for each special condition, the production cost is increased, and the testing time cost is also increased.
Disclosure of Invention
In order to solve the problems in the related art, the present application provides a probe card structure. The technical scheme is as follows:
in one aspect, the embodiment of the application provides a probe card structure, which comprises a circuit board, a fixing ring, a probe cantilever bearing ring and a test probe;
The circuit board is provided with a detection window, and a test circuit is arranged in the circuit board;
the probe cantilever bearing ring is fixed below the circuit board through the fixing ring, and the lower end of the probe cantilever bearing ring is positioned below the detection window;
the top end of the test probe is welded on the back surface of the circuit board, the test probe is connected with a test circuit in the circuit board, and the lower half part of the test probe is fixed at the bottom of the probe cantilever bearing ring;
the tip of the test probe is exposed below the detection window.
Optionally, the cross section of the probe cantilever bearing ring is in two wedge-shaped patterns.
Optionally, the fixing ring is sleeved at the edge of the detection window, the top end of the fixing ring is positioned at the front surface of the circuit board, and the bottom end of the fixing ring is positioned at the back surface of the circuit board;
The top of the probe cantilever bearing ring is fixed at the bottom end of the fixed ring.
Optionally, a bolt is disposed in the fixing ring, and the fixing ring is connected with the circuit board through the bolt.
Optionally, the lower half of the test probe is connected to the bottom of the probe cantilever load ring by an adhesive.
Optionally, the lower half of the test probe is abutted against the bottom of the probe cantilever load ring.
The technical scheme of the application at least comprises the following advantages:
The probe card structure provided by the embodiment of the application comprises a circuit board, a fixed ring, a probe cantilever bearing ring and a test probe, wherein a detection window is formed in the circuit board; the problem that the detection window on the traditional probe card is smaller and is difficult to be suitable for special detection conditions is solved; the probe card is beneficial to providing a wide operation space and an observation view field when the probe card is used for detecting the chip, and realizing the test of different modes of the chip to be detected by the same probe card.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present application, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a front view of a probe card structure according to one embodiment of the present application;
FIG. 2 is a top view of the probe card structure shown in FIG. 1;
FIG. 3 is a front view of a prior art probe card;
FIG. 4 is a top view of the probe card shown in FIG. 3;
fig. 5 is a schematic diagram of a probe card structure according to an embodiment of the present application in use.
Detailed Description
The following description of the embodiments of the present application will be made more apparent and fully hereinafter with reference to the accompanying drawings, in which some, but not all embodiments of the application are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In the description of the present application, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, or can be communicated inside the two components, or can be connected wirelessly or in a wired way. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
In addition, the technical features of the different embodiments of the present application described below may be combined with each other as long as they do not collide with each other.
The embodiment of the application provides a probe card structure, as shown in fig. 1 and 2, which comprises a circuit board 11, a fixed ring 12, a probe cantilever bearing ring 13 and a test probe 14.
The circuit board 11 is provided with a detection window 15, and a test circuit is arranged in the circuit board 11 and used for electrical detection of the internal conditions of the chips on the wafer.
Optionally, the detection window 15 is located in the middle of the circuit board 11.
The probe cantilever bearing ring 13 is fixed below the circuit board 11 through the fixing ring 12, and the lower end of the probe cantilever bearing ring 13 is located below the detection window 15.
The lower end of the probe cantilever load ring 13 and the tip of the test probe 14 can be seen from above looking down through the detection window 15.
The top ends of the test probes 14 are soldered to the back surface of the circuit board 11, the test probes 14 are connected with test circuits in the circuit board 11, and the lower half of the test probes 14 are fixed to the bottom of the probe cantilever carrier ring 13.
The tip of the test probe 14 is not in contact with the probe cantilever load ring 13, and the tip of the test probe 14 is exposed below the detection window 15.
The probe card structurally comprises a plurality of test probes 14, and the distribution positions and the number of the test probes 14 are determined according to actual conditions.
The test probes 14 have corresponding pads on the chip to be tested, and when the test probes 14 are used to test the chip to be tested on the wafer, the tips of the test probes 14 connected to the circuit board 11 are connected to the corresponding pads on the chip to be tested.
The lower half part of the test probe 14 is supported by the probe cantilever bearing ring 13, the distance between the tip of the test probe 14 and the circuit board 11 is increased, so that a larger space is formed above the test probe tip 14, the effect of expanding the detection window 15 on the circuit board 11 is realized, and meanwhile, the connection between the tip of the test probe 14 and a bonding pad on a chip to be tested is not influenced.
As shown in fig. 1, the cross section of the probe cantilever load ring 13 is in two wedge-shaped patterns. The two wedge-shaped patterns are symmetrical patterns or the two wedge-shaped patterns are asymmetrical patterns.
The probe cantilever carrier ring 13 surrounds the detection window 15.
The fixed ring 12 is sleeved on the edge of the detection window 15, the top end of the fixed ring 12 is positioned on the front surface of the circuit board 11, and the bottom end of the fixed ring 12 is positioned on the back surface of the circuit board 11.
The top of the probe cantilever load ring 13 is secured to the bottom end of the retaining ring 12.
The cross section of the probe cantilever carrier ring 13 and the retaining ring 12 is shown in dashed box 10 of fig. 1, in one example, the interior of the retaining ring 12 is provided with bolts 17, and the retaining ring 12 is connected to the circuit board 11 by means of the bolts 17.
In one example, the lower half of the test probe 14 is attached to the bottom of the probe cantilever load ring 13 by an adhesive 18, as shown in FIG. 1. The adhesive is not conductive.
Optionally, the lower half of the test probe is abutted against the bottom of the probe cantilever load ring.
In one example, the pads 16 on the top of the test probes 14 are brought into close proximity with the bottom of the probe cantilever load ring 13 by the adhesive 18, as shown in FIG. 1.
In summary, in the probe card structure provided by the embodiment of the application, the probe cantilever bearing ring is added at the bottom of the fixing ring, the lower half part of the test probe is fixed by using the probe cantilever bearing ring, the space above the tip of the test probe is increased, and the effect of expanding the detection window on the circuit board is realized; the problem that the detection window on the traditional probe card is smaller and is difficult to be suitable for special detection conditions is solved; the probe card is beneficial to providing a wide operation space and an observation view field when the probe card is used for detecting the chip, and realizing the test of different modes of the chip to be detected by the same probe card.
At present, the detection window on the existing probe card is smaller, as shown in fig. 3 and 4, a fixed ring 32 is fixed on the outer side of a detection window 34 on a circuit board 31, one end of a test probe 33 is connected with the back surface of the circuit board 31, the lower half part of the test probe 33 is directly connected with the bottom of the fixed ring 32, the test probe 33 is directly supported by the fixed ring 32, the distance between the test probe 33 and the circuit board 31 is smaller, and the detection window 34 is also smaller. According to the probe card structure provided by the embodiment of the application, the space above the probe tip of the test probe is increased by utilizing the probe cantilever bearing ring at the bottom of the fixing ring, and the opening of the detection window 15 on the probe card is increased, so that the chip can conveniently perform more kinds of electrical and optical detection.
In one example, as shown in fig. 5, additional pads are provided on the chip to be tested, and an additional auxiliary probe system (e.g., a cowhair pin system) is introduced, and a cowhair pin 51 enters from the inspection window 15 and is connected to the pads provided on the chip to be tested, so as to implement the relevant electrical test.
In another example, since the detection window of the probe card structure provided by the embodiment of the application provides a wider operation space and a wider observation field, the chip to be detected can be observed and analyzed from the detection window by using an optical analysis and observation device (such as EMMI, OBIRCH, MCT, inGaAs optical sensors and the like).
In an alternative embodiment based on the embodiments shown in fig. 1 and 2, the circuit board is a PCB circuit board.
The material of the probe cantilever bearing ring is an insulating material; the outer shell of the fixing ring is made of insulating materials.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the application.
Claims (3)
1. The probe card structure is characterized by comprising a circuit board, a fixed ring, a probe cantilever bearing ring and a test probe;
The circuit board is provided with a detection window, and a test circuit is arranged in the circuit board;
The probe cantilever bearing ring is fixed below the circuit board through the fixing ring, the fixing ring is sleeved on the edge of the detection window, the top end of the fixing ring is positioned on the front surface of the circuit board, the bottom end of the fixing ring is positioned on the back surface of the circuit board, a bolt is arranged in the fixing ring, and the fixing ring is connected with the circuit board through the bolt;
The top of the probe cantilever bearing ring is fixed at the bottom end of the fixed ring;
the lower end of the probe cantilever bearing ring is positioned below the detection window, and the cross section of the probe cantilever bearing ring is in two wedge-shaped patterns;
the top end of the test probe is welded on the back surface of the circuit board, the test probe is connected with a test circuit in the circuit board, and the lower half part of the test probe is fixed at the bottom of the probe cantilever bearing ring;
the tip of the test probe is exposed below the detection window.
2. The probe card structure of claim 1, wherein the lower half of the test probe is attached to the bottom of the probe cantilever carrier ring by an adhesive.
3. The probe card structure of claim 1, wherein the lower half of the test probe is abutted against the bottom of the probe cantilever load ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110011299.0A CN112816746B (en) | 2021-01-06 | 2021-01-06 | Probe card structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110011299.0A CN112816746B (en) | 2021-01-06 | 2021-01-06 | Probe card structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112816746A CN112816746A (en) | 2021-05-18 |
| CN112816746B true CN112816746B (en) | 2024-06-18 |
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ID=75857686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110011299.0A Active CN112816746B (en) | 2021-01-06 | 2021-01-06 | Probe card structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112816746B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113471103B (en) * | 2021-06-09 | 2023-10-20 | 上海华虹宏力半导体制造有限公司 | Probe module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003255023A (en) * | 2002-02-27 | 2003-09-10 | Seiko Epson Corp | Probe card and probe card test method |
| CN103185819A (en) * | 2011-12-27 | 2013-07-03 | 联咏科技股份有限公司 | Probe card and manufacturing method thereof |
| CN103543372A (en) * | 2012-07-13 | 2014-01-29 | 旺矽科技股份有限公司 | Optical detection device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW594899B (en) * | 2002-12-18 | 2004-06-21 | Star Techn Inc | Detection card for semiconductor measurement |
| TWI591348B (en) * | 2017-01-25 | 2017-07-11 | Cantilever probe card probe tip structure |
-
2021
- 2021-01-06 CN CN202110011299.0A patent/CN112816746B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003255023A (en) * | 2002-02-27 | 2003-09-10 | Seiko Epson Corp | Probe card and probe card test method |
| CN103185819A (en) * | 2011-12-27 | 2013-07-03 | 联咏科技股份有限公司 | Probe card and manufacturing method thereof |
| CN103543372A (en) * | 2012-07-13 | 2014-01-29 | 旺矽科技股份有限公司 | Optical detection device |
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| Publication number | Publication date |
|---|---|
| CN112816746A (en) | 2021-05-18 |
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