CN113341360A - Radio frequency calibration device for chip test and calibration method thereof - Google Patents
Radio frequency calibration device for chip test and calibration method thereof Download PDFInfo
- Publication number
- CN113341360A CN113341360A CN202110597170.2A CN202110597170A CN113341360A CN 113341360 A CN113341360 A CN 113341360A CN 202110597170 A CN202110597170 A CN 202110597170A CN 113341360 A CN113341360 A CN 113341360A
- Authority
- CN
- China
- Prior art keywords
- test interface
- test
- radio frequency
- calibration device
- frequency calibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
- G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The invention discloses a radio frequency calibration device for chip testing and a calibration method thereof, which are used for measuring a calibration value between a testing machine and a probe, wherein the radio frequency calibration device comprises a first substrate and a first circuit board. The first substrate includes a plurality of first lower contact pads configured to be in corresponding contact with the probes, and a plurality of first upper contact pads in corresponding conduction with the plurality of first lower contact pads. The first circuit board is provided with a plurality of first test interfaces which are respectively electrically connected with the first upper contact plates, and the first test interfaces are configured to be connected with a testing machine or a testing instrument. The radio frequency calibration device can finish measurement by adopting a simple structure, effectively reduces the manufacturing cost and can also reduce the system error.
Description
Technical Field
The invention relates to the technical field of radio frequency measurement, in particular to a radio frequency calibration device for chip testing and a calibration method thereof.
Background
The calibration of the rf path is usually required before testing of the rf chip. However, in the conventional calibration method, since the external cables of the instrument are all coaxial cables, the calibrated level can only reach the level from the interface of the tester to the loading Board (Load Board). The influence of the performance of the radio frequency wiring, the clamp and the probe thereof in the bearing plate on the radio frequency path is not considered, and especially the great difference of the standing-wave ratios of the probe under different frequency points has great influence on the accuracy of the test. In contrast, in some high-end rf chip tests, a higher-end supporting board and a probe are often required to reduce the influence, but the effect is not ideal, a large and unpredictable system error caused by the system is still not eliminated, and the test cost caused by replacing a high-end test tool is still large.
Disclosure of Invention
The invention aims to provide a radio frequency calibration device for chip testing, which is low in manufacturing cost and can reduce system errors.
Another objective of the present invention is to provide a calibration method for a radio frequency calibration apparatus, which can reduce system errors.
In order to achieve the above object, the present invention provides a radio frequency calibration apparatus for chip testing, which is used for measuring calibration values between a tester and a probe, and comprises:
a first substrate including a plurality of first lower contact pads and a plurality of first upper contact pads in corresponding conduction with the plurality of first lower contact pads, the plurality of first lower contact pads being configured to be in corresponding contact with respective probes;
the first circuit board is provided with a plurality of first test interfaces, the plurality of first test interfaces are respectively and electrically connected with the plurality of first upper contact discs, and the plurality of first test interfaces are configured to be connected with a testing machine or a testing instrument.
Preferably, the first substrate is a ceramic substrate, the ceramic substrate is formed by via hole manufacturing, polishing and thinning, double-sided copper coating and etching, and the first upper contact plate and the first lower contact plate are correspondingly formed at the plurality of via holes on the ceramic substrate.
Preferably, the size of the first substrate is equivalent to the size of the chip to be tested.
Preferably, the first test interface is an RF cable interface.
Preferably, the radio frequency calibration device further includes a second substrate, the second substrate includes a second lower contact pad and a second upper contact pad that is in corresponding conduction with the second lower contact pad, the second lower contact pad is connected with a second test interface, and the second upper contact pad is soldered on the first circuit board;
the first circuit board is also provided with a third test interface which is electrically connected with the second upper contact plate;
the second test interface and the third test interface are configured to connect with a tester or a meter instrument.
Preferably, the radio frequency calibration device further comprises a second substrate and a second circuit board;
the second substrate comprises a second lower contact disc and a second upper contact disc which is correspondingly conducted with the second lower contact disc, the second lower contact disc is connected with a second test interface, and the second upper contact disc is welded on the second circuit board;
the second circuit board is provided with a third test interface which is electrically connected with the second upper contact plate;
the second test interface and the third test interface are configured to connect with a tester or a meter instrument.
Preferably, the second test interface and the third test interface are RF cable interfaces.
Preferably, the first test interface, the second test interface, the third test interface, and the test interface of the tester are the same or cause substantially the same test error.
In order to achieve the above another object, the present invention provides a calibration method of a radio frequency calibration apparatus as described above, including:
connecting the radio frequency calibration device to a probe, and respectively connecting the first test interface, the second test interface and the third test interface to a tester or a test instrument;
the test machine sends excitation to each probe, and the magnitude of an output signal of the first test interface is measured to obtain an initial calibration value;
the tester sends excitation to one of the second test interface and the third test interface, and measures the magnitude of an output signal of the other of the second test interface and the third test interface to obtain a compensation value;
and obtaining a compensated calibration value according to the initial calibration value and the compensation value.
Preferably, the calibration method further comprises simulating an environment of real chip test by using the classifier to hold down the rf calibration device.
Compared with the prior art, the radio frequency calibration device integrates a plurality of first lower contact discs which are correspondingly contacted with the probes on the same first substrate, the first substrate is connected with the first circuit board through a plurality of first upper contact discs, and a plurality of first test interfaces are respectively electrically connected with the corresponding first upper contact discs to form a plurality of test paths. When the radio frequency calibration is performed, the radio frequency calibration device is installed on a base (Socket), so that each first lower contact plate can be correspondingly contacted with each probe, meanwhile, a plurality of first test interfaces are respectively connected with a testing machine or a testing instrument, and when the testing machine sends excitation to each probe, an output value can be measured through the testing machine or the testing instrument connected with each first test interface. Therefore, the radio frequency calibration device can finish measurement by adopting a simple structure, effectively reduces the manufacturing cost and can reduce the system error.
Drawings
Fig. 1 is a schematic structural diagram of a radio frequency calibration apparatus according to an embodiment of the present invention.
Fig. 2 is a side view of a radio frequency calibration device according to an embodiment of the present invention.
Fig. 3 is a side view of another embodiment of the present invention.
Fig. 4 is a flowchart illustrating a calibration method of a radio frequency calibration apparatus according to an embodiment of the invention.
Detailed Description
In order to explain technical contents and structural features of the present invention in detail, the following description is made with reference to the embodiments and the accompanying drawings.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "inside", "outside", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, and thus, are not to be construed as limiting the scope of the present invention.
Referring to fig. 1 and 2, the present invention provides a radio frequency calibration apparatus for chip testing, which is used to measure the calibration value between the tester and the probe, and includes a first substrate 1 and a first circuit board 2. The first substrate 1 includes a plurality of first lower contact pads 11 and a plurality of first upper contact pads 12 that are electrically connected to the plurality of first lower contact pads 11, and the plurality of first lower contact pads 11 are disposed to be in contact with the probes. The plurality of first upper contact pads 12 are soldered on the first circuit board 2, the first circuit board 2 is provided with a plurality of first test interfaces 21, the plurality of first test interfaces 21 are electrically connected with the plurality of first upper contact pads 12, respectively, and the plurality of first test interfaces 21 are configured to be connected with a testing machine or a testing instrument.
The radio frequency calibration device integrates a plurality of first lower contact discs 11 which are correspondingly contacted with the probes on the same first substrate 1, and connects the first substrate 1 with a first circuit board 2 through a plurality of first upper contact discs 12, and a plurality of first test interfaces 21 are respectively electrically connected with the corresponding first upper contact discs 12 to form a plurality of test paths. When performing the radio frequency calibration, the radio frequency calibration apparatus is mounted on a base (Socket), that is, each first lower contact pad 11 can be correspondingly contacted with each probe, and meanwhile, the plurality of first test interfaces 21 are respectively connected with a tester or a test instrument, and when the tester sends excitation to each probe, an output value can be measured from the first test interfaces 21. Therefore, the radio frequency calibration device can finish measurement by adopting a simple structure, effectively reduces the manufacturing cost and can reduce the system error.
Specifically, each probe is arranged on a base (Socket), the bottom of the base is connected with a bearing plate (Load Board), the bearing plate is communicated with each probe, and the bearing plate is provided with a test interface connected with a test machine or a test instrument. When the tester sends an excitation to each probe, the output value measured from the first test interface 21 covers the error of the radio frequency path caused by the radio frequency trace, the base and the probe in the bearing plate.
The following describes the radio frequency calibration apparatus in detail with reference to the accompanying drawings by taking specific embodiments as examples.
Referring to fig. 1 and 2, in some embodiments, the first substrate 1 is a ceramic substrate, the ceramic substrate is formed by via hole formation, polishing and thinning, double-sided copper coating, and etching, and a first upper contact pad 12 and a first lower contact pad 11 are correspondingly formed at a plurality of via holes 13 on the ceramic substrate.
By adopting the technical means and advanced industrial manufacturing process, the first upper contact pad 12 and the first lower contact pad 11 are better arranged on the first substrate 1, so that the loss among elements can be reduced, and the measurement is more accurate.
In some embodiments, the size of the first substrate 1 is comparable to the size of the chip to be tested. Through the technical means, the first substrate 1 can be fixed in the test area of the base, so that each first lower contact plate 11 can be better contacted with the corresponding probe, and the effect of simulating a chip to be tested can be better achieved.
In some embodiments, the first test interface 21 is an RF cable interface. Through the technical means, errors caused by wires are reduced, the practicability of the device is improved, and the device can be connected with more test machines or test instruments on the market.
In some embodiments, the rf calibration device further includes a second substrate 3, the second substrate 3 includes a second lower contact pad 31 and a second upper contact pad 32 in conductive communication with the second lower contact pad 31, the second lower contact pad 31 is connected to a second test interface 33, and the second upper contact pad 32 is soldered to the first circuit board 2. The first circuit board 2 is further provided with a third testing interface 22, and the third testing interface 22 is electrically connected with the second upper contact pad 32. The second test interface 33 and the third test interface 22 are configured to connect with a testing machine or a meter instrument.
In use, a tester or a test instrument is connected to the second test interface 33 and the third test interface 22, respectively, and when the tester sends an excitation to one of the second test interface 33 and the third test interface 22, the magnitude of the output signal of the other of the second test interface 33 and the third test interface 22 can be measured, so as to measure the compensation value of the device.
Through the technical means, a path for measuring the compensation value of the device is constructed between the second test interface 33 and the third test interface 22, the compensation value can be directly measured by being connected with a test machine or a test instrument, the method is simple and convenient, and the test efficiency is improved.
The second substrate 3 may be a substrate similar to the first substrate 1 in shape, material and size, but the second substrate 3 may not be identical to the first substrate 1 in structure and is not limited thereto.
Referring to fig. 1 and 3, in some embodiments, the rf calibration apparatus further includes a second substrate 3 and a second circuit board 4. The second substrate 3 includes a second lower contact pad 31 and a second upper contact pad 32 correspondingly conducted with the second lower contact pad 31, the second lower contact pad 31 is connected with a second test interface 33, and the second upper contact pad 32 is soldered on the second circuit board 4. The second circuit board 4 is provided with a third test interface 22, and the third test interface 22 is electrically connected to the second upper contact pad 32. The second test interface 33 and the third test interface 22 are configured to connect with a testing machine or a meter instrument.
Further, the second test interface 33 and the third test interface 22 are RF cable interfaces. Through the technical means, errors caused by wires are reduced, the practicability of the device is improved, and the device can be connected with more test machines or test instruments on the market.
Further, the first test interface 21, the second test interface 33 and the third test interface 22 are identical or cause substantially the same test error. Through the technical means, the compensation values can be obtained more accurately by using the second test interface 33, the third test interface 22, the second substrate 3 and the like, so as to compensate the system errors caused by the radio frequency calibration device.
Referring to fig. 4, the present invention further provides a calibration method of the rf calibration apparatus, which includes the following steps:
and S1, connecting the radio frequency calibration device to the probe, and connecting the plurality of first test interfaces 21, the second test interfaces 33 and the third test interfaces 22 to a tester or a test instrument respectively.
Specifically, the probe is arranged in a test area of a base (Socket), and the radio frequency calibration device is connected with the test area. The bottom of the base is connected with a bearing plate (Load Board), the bearing plate is communicated with the probes, the bearing plate is provided with a test interface connected with a test machine or a test instrument, and the test machine or the test instrument is connected with the test interface of the bearing plate to send excitation.
S2, the tester sends stimuli to each probe, and measures the magnitude of the output signal of the first test interface 21 to obtain the initial calibration value.
S3, the tester sends a stimulus to one of the second test interface 33 and the third test interface 22, and measures the magnitude of the output signal of the other of the second test interface 33 and the third test interface 22 to obtain the compensation value.
In particular, the compensation value is to compensate for systematic errors caused by the device itself.
And S4, obtaining a compensated calibration value according to the initial calibration value and the compensation value.
Specifically, the compensated calibration value is the difference between the initial calibration value and the compensation value.
By the method, the calibration value between the testing machine and the probe can be quickly obtained, the self error of the radio frequency calibration device can be corrected by utilizing the compensation value, and the calibration of the radio frequency product during testing can be greatly improved at low cost.
Further, the calibration method further comprises simulating an environment for real chip testing by using a classifier (Handler) to hold down the radio frequency calibration device.
By the method, the effect of better simulating the chip to be tested can be achieved, and the test reliability is improved.
The above disclosure is only a preferred embodiment of the present invention, and should not be taken as limiting the scope of the invention, so that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the invention.
Claims (10)
1. An RF calibration device for chip testing, which is used to measure the calibration value from the testing machine to the probe, is characterized in that it comprises:
a first substrate including a plurality of first lower contact pads and a plurality of first upper contact pads in corresponding conduction with the plurality of first lower contact pads, the plurality of first lower contact pads being configured to be in corresponding contact with respective probes;
the first circuit board is provided with a plurality of first test interfaces, the plurality of first test interfaces are respectively and electrically connected with the plurality of first upper contact discs, and the plurality of first test interfaces are configured to be connected with a testing machine or a testing instrument.
2. The radio frequency calibration device according to claim 1, wherein the first substrate is a ceramic substrate, the ceramic substrate is formed by via hole making, polishing and thinning, double-sided copper cladding and etching, and the first upper contact pad and the first lower contact pad are respectively formed at a plurality of via holes on the ceramic substrate.
3. The radio frequency calibration device according to claim 1, wherein the size of the first substrate is comparable to the size of a chip to be tested.
4. The radio frequency calibration device of claim 1, wherein the first test interface is an RF cable interface.
5. The radio frequency calibration device of claim 1,
the second substrate comprises a second lower contact disc and a second upper contact disc which is correspondingly conducted with the second lower contact disc, the second lower contact disc is connected with a second test interface, and the second upper contact disc is welded on the first circuit board;
the first circuit board is also provided with a third test interface which is electrically connected with the second upper contact plate;
the second test interface and the third test interface are configured to connect with a tester or a meter instrument.
6. The radio frequency calibration device of claim 1,
the circuit board further comprises a second substrate and a second circuit board;
the second substrate comprises a second lower contact disc and a second upper contact disc which is correspondingly conducted with the second lower contact disc, the second lower contact disc is connected with a second test interface, and the second upper contact disc is welded on the second circuit board;
the second circuit board is provided with a third test interface which is electrically connected with the second upper contact plate;
the second test interface and the third test interface are configured to connect with a tester or a meter instrument.
7. The radio frequency calibration device of claim 5 or 6, wherein the second test interface and the third test interface are RF cable interfaces.
8. The radio frequency calibration device of claim 5 or 6, wherein the first test interface, the second test interface, the third test interface, and the test interface of the tester are identical or cause substantially identical test errors.
9. A method of calibrating a radio frequency calibration device according to claim 5 or 6, comprising:
connecting the radio frequency calibration device to a probe, and respectively connecting the first test interface, the second test interface and the third test interface to a tester or a test instrument;
the test machine sends excitation to each probe, and the magnitude of an output signal of the first test interface is measured to obtain an initial calibration value;
the tester sends excitation to one of the second test interface and the third test interface, and measures the magnitude of an output signal of the other of the second test interface and the third test interface to obtain a compensation value;
and obtaining a compensated calibration value according to the initial calibration value and the compensation value.
10. The method of calibrating a radio frequency calibration device according to claim 9, further comprising:
and simulating the environment of a real chip test by using a classifier to press the radio frequency calibration device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110597170.2A CN113341360B (en) | 2021-05-28 | 2021-05-28 | Radio frequency calibration device for chip test and calibration method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110597170.2A CN113341360B (en) | 2021-05-28 | 2021-05-28 | Radio frequency calibration device for chip test and calibration method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113341360A true CN113341360A (en) | 2021-09-03 |
| CN113341360B CN113341360B (en) | 2023-05-30 |
Family
ID=77472050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110597170.2A Active CN113341360B (en) | 2021-05-28 | 2021-05-28 | Radio frequency calibration device for chip test and calibration method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113341360B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115825835A (en) * | 2023-02-09 | 2023-03-21 | 苏州联讯仪器股份有限公司 | A Low Leakage Current Calibration System |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080036469A1 (en) * | 2006-08-08 | 2008-02-14 | Credence Systems Corporation | Lrl vector calibration to the end of the probe needles for non-standard probe cards for ate rf testers |
| CN101266267A (en) * | 2007-03-16 | 2008-09-17 | 联发科技股份有限公司 | Method for determining input voltage value output to comparator and optical drive circuit |
| CN103809100A (en) * | 2014-03-07 | 2014-05-21 | 上海华虹宏力半导体制造有限公司 | Automatic test system for wafer |
| CN108291937A (en) * | 2015-11-20 | 2018-07-17 | 泰拉丁公司 | Calibrating installation for automatic test equipment |
| CN110299950A (en) * | 2018-03-22 | 2019-10-01 | 中兴通讯股份有限公司 | A kind of radio-frequency channel bearing calibration and device |
| CN110572223A (en) * | 2019-10-12 | 2019-12-13 | 成都华兴汇明科技有限公司 | Calibration method of radio frequency baseband integrated terminal automatic test system |
| CN111162154A (en) * | 2020-03-05 | 2020-05-15 | 华引芯（武汉）科技有限公司 | Ultraviolet light-emitting element and all-inorganic packaging method |
-
2021
- 2021-05-28 CN CN202110597170.2A patent/CN113341360B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080036469A1 (en) * | 2006-08-08 | 2008-02-14 | Credence Systems Corporation | Lrl vector calibration to the end of the probe needles for non-standard probe cards for ate rf testers |
| CN101266267A (en) * | 2007-03-16 | 2008-09-17 | 联发科技股份有限公司 | Method for determining input voltage value output to comparator and optical drive circuit |
| CN103809100A (en) * | 2014-03-07 | 2014-05-21 | 上海华虹宏力半导体制造有限公司 | Automatic test system for wafer |
| CN108291937A (en) * | 2015-11-20 | 2018-07-17 | 泰拉丁公司 | Calibrating installation for automatic test equipment |
| CN110299950A (en) * | 2018-03-22 | 2019-10-01 | 中兴通讯股份有限公司 | A kind of radio-frequency channel bearing calibration and device |
| CN110572223A (en) * | 2019-10-12 | 2019-12-13 | 成都华兴汇明科技有限公司 | Calibration method of radio frequency baseband integrated terminal automatic test system |
| CN111162154A (en) * | 2020-03-05 | 2020-05-15 | 华引芯（武汉）科技有限公司 | Ultraviolet light-emitting element and all-inorganic packaging method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115825835A (en) * | 2023-02-09 | 2023-03-21 | 苏州联讯仪器股份有限公司 | A Low Leakage Current Calibration System |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113341360B (en) | 2023-05-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6856154B2 (en) | Test board for testing IC package and tester calibration method using the same | |
| JP2014515095A (en) | Wireless probe card verification system and method | |
| JP2008082734A (en) | Electric contact device, high frequency measuring system, and high frequency measuring method | |
| US7307427B2 (en) | Method and apparatus for engineering a testability interposer for testing sockets and connectors on printed circuit boards | |
| JP2014219406A (en) | Test socket providing mechanical stabilization for pogo pin connections | |
| CN113341360B (en) | Radio frequency calibration device for chip test and calibration method thereof | |
| KR20100069300A (en) | Probe card, and apparatus and method for testing semiconductor device | |
| TW202405439A (en) | Connecting probe card | |
| JP2009270835A (en) | Inspection method and device for semiconductor component | |
| US20080061812A1 (en) | Component-attach test vehicle | |
| JP3730340B2 (en) | Semiconductor test equipment | |
| CN117894696A (en) | Power calibration adapter, measurement application system and method | |
| KR100257584B1 (en) | Apparatus and Method for Setting Height of Jet Shaft in Wafer Test System | |
| JP2005315775A (en) | Four-terminal inspection method and four-terminal inspection jig using single-sided transfer probe | |
| JPH1144709A (en) | Probe card | |
| US11761983B2 (en) | Probe card integrated with a hall sensor | |
| CN215728605U (en) | Probe apparatus | |
| US12094789B2 (en) | Analog sense points for measuring circuit die | |
| JP2005049314A (en) | Probing test method and probe state detection device | |
| CN217116490U (en) | PCB and probe card | |
| KR102548942B1 (en) | Multi pin test device | |
| TWI604204B (en) | Testing device for testing electrical property of probe head and testing method thereof | |
| KR20050068118A (en) | Method for testing the needle of probe card | |
| CN119667429A (en) | A method and system for establishing a wafer test temperature environment | |
| CN114745843A (en) | PCB and probe card |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |