CN112815921B - High-precision horizontal sensitive structure and processing method thereof - Google Patents
High-precision horizontal sensitive structure and processing method thereof Download PDFInfo
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- CN112815921B CN112815921B CN202110016886.9A CN202110016886A CN112815921B CN 112815921 B CN112815921 B CN 112815921B CN 202110016886 A CN202110016886 A CN 202110016886A CN 112815921 B CN112815921 B CN 112815921B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C9/00—Measuring inclination, e.g. by clinometers, by levels
- G01C9/18—Measuring inclination, e.g. by clinometers, by levels by using liquids
- G01C9/24—Measuring inclination, e.g. by clinometers, by levels by using liquids in closed containers partially filled with liquid so as to leave a gas bubble
- G01C9/26—Details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/003—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring position, not involving coordinate determination
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C9/00—Measuring inclination, e.g. by clinometers, by levels
- G01C9/02—Details
- G01C9/06—Electric or photoelectric indication or reading means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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- Y02E40/30—Reactive power compensation
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Abstract
The invention relates to a high-precision horizontal sensitive structure and a processing method thereof, wherein the high-precision horizontal sensitive structure comprises a bottom layer circuit board, a middle layer circuit board and an upper layer circuit board; the bottom surface of the bottom layer circuit board is grounded and used for shielding interference; the bottom layer circuit board comprises se:Sub>A bottom layer welding surface, two CDC-A pole pieces and two CDC-B pole pieces; the two CDC-A pole pieces and the two CDC-B pole pieces are symmetrically arranged; the bottom layer welding surface is provided with se:Sub>A CDC-A excitation output electrode and se:Sub>A CDC-B excitation output electrode; the CDC-A excitation output electrode and the CDC-B excitation output electrode are connected with an excitation source.
Description
Technical Field
The invention relates to a high-precision horizontal sensitive structure and a processing method thereof, belonging to the technical field of measurement.
Background
When measuring non-electrical quantities by electrical measurement, the measured non-electrical quantities must first be converted to electrical quantities and then input. The component that converts non-electrical quantities into electrical quantities is commonly referred to as a transducer; the relevant conversion device designed according to the characteristics of different non-electrical quantities is called a sensor, and the sensor for converting the measured mechanical quantity (such as displacement, force, speed and the like) into capacitance change is called a capacitance sensor.
From the viewpoint of energy conversion, the capacitive transducer is a passive transducer, and the measured mechanical quantity needs to be amplified and processed after being converted into voltage or current. Linear displacement, angular displacement, spacing, distance, thickness, stretching, compression, expansion, deformation and the like in the mechanical quantity are not closely related to the length; these quantities are again quantities measured by length or length ratio, and the methods of measurement are also closely related. In addition, under some conditions, the mechanical quantities change quite slowly, the change range is extremely small, if the measurement of extremely small distance or displacement is required, higher resolution is required, other sensors are difficult to realize the high resolution requirement, and the resolution of the differential transformer sensor commonly used in precise measurement is only 1-5 mu m; there is a capacitance micrometer whose resolution is 0.01 μm, which is improved by two orders of magnitude over the former, and whose maximum range is 100.+ -.5. Mu.m, so that it is favored in precision small displacement measurement.
For the measurement of these mechanical quantities, in particular of slow or minute quantities, it is generally appropriate to use capacitive sensors, mainly of the type having the following outstanding advantages:
(1) The measuring range is large, and the relative change rate can exceed 100 percent;
(2) The sensitivity is high, as measured by a ratio transformer bridge, and the relative variation can reach 10-7 orders of magnitude;
(3) The dynamic response is fast, and the dynamic response has small movable mass and high natural frequency, so that the high-frequency characteristic is suitable for dynamic measurement and static measurement.
(4) The stability is good because the electrode plates of the capacitor are mostly made of metal materials, and the electrode plate interlinings are mostly made of inorganic materials, such as air, glass, ceramics, quartz and the like; therefore, the device can work for a long time under high-temperature and low-temperature strong magnetic fields and strong radiation, and especially solves the detection problem under high-temperature and high-pressure environments.
Capacitive-to-digital converters (CDCs) are currently suitable application technologies for detection. Both single channel AD7745 and dual channel AD7746 are high resolution sigma-delta capacitance-to-digital converters that can measure capacitance directly connected to the input. These devices have high resolution (21-bit effective resolution and 24-bit no missing code), high linearity (±0.01%) and high precision (factory calibration to ±4ff), and are well suited for detecting liquid level, position, pressure and other physical parameters. These devices have complete functionality, with the capacitive inputs integrating a multiplexer, excitation source, for capacitive DAC, temperature sensor, reference voltage source, clock generator, control and calibration logic, I2C compatible serial interface, and high precision converter core integrating a second order sigma-delta type charge balance modulator and a third order digital filter. The converter acts as a CDC for the capacitive input and as an ADC for the voltage input.
The measured capacitance Cx is connected between the excitation source and the sigma-delta modulator input. A square wave excitation signal is applied on Cx during the transition. The modulator will sample the charge flowing through Cx without interruption and convert it to a stream of 0 and 1. The density of the modulator output 1 is processed by a digital filter to determine the capacitance value. The filter output is scaled by the calibration coefficients. The external host can then read the final value through the serial interface.
Disclosure of Invention
It is an object of the present invention to provide a high precision level sensitive structure and a method of processing the same, based on capacitive-to-digital converter (CDC) technology, enabling the use of high performance capacitive detection in angle measurement applications.
The technical scheme adopted by the invention is as follows: the high-precision horizontal sensitive structure is characterized by comprising a bottom layer circuit board, a middle layer circuit board and an upper layer circuit board;
the bottom surface of the bottom layer circuit board is grounded and used for shielding interference; the bottom layer circuit board comprises se:Sub>A bottom layer welding surface, two CDC-A pole pieces and two CDC-B pole pieces; the two CDC-A pole pieces and the two CDC-B pole pieces are symmetrically arranged; the bottom layer welding surface is provided with se:Sub>A CDC-A excitation output electrode and se:Sub>A CDC-B excitation output electrode; the CDC-A excitation output electrode and the CDC-B excitation output electrode are connected with an excitation source;
the middle layer circuit board is hollowed out at the center and the periphery of the middle layer circuit board is a middle layer welding surface;
the upper circuit board comprises four quadrants A+, A-, B+, B-and an upper welding surface, wherein the boundary between the quadrants A+ and A-is perpendicular to the boundary between the quadrants B+ and B-; wherein the A+ quadrant and the A-quadrant are symmetrically arranged, and the B+ quadrant and the B-quadrant are symmetrically arranged; the A+ quadrant and the A-quadrant form positive and negative plates of the first sensor, and the B+ quadrant and the B-quadrant form positive and negative plates of the second sensor; the sum of the areas of the two CDC-A pole pieces is equal to the sum of the areas of the A+ quadrant and the A-quadrant; the sum of the areas of the two CDC-B pole pieces is equal to the sum of the areas of the B+ quadrant and the B-quadrant; the two CDC-A pole pieces completely correspond to se:Sub>A detection pole A+ and se:Sub>A detection pole A-, which are input by the first sensor, and the two CDC-B pole pieces completely correspond to se:Sub>A detection pole B+ and se:Sub>A detection pole B-, which are input by the second sensor;
the upper layer circuit board, the middle layer circuit board and the bottom layer circuit board are stacked and welded through the bottom layer welding surface, the middle layer welding surface and the upper layer welding surface to form a sandwich structure, and the center of the sandwich structure is a cavity; the cavity includes a volume of the liquid and the gas bubble that is less than the cavity volume.
Furthermore, locating points are arranged on the bottom layer circuit board, the middle layer circuit board and the upper layer circuit board and are used for enabling the inclination angles of the three circuit boards to be changed completely and simultaneously.
Preferably, the outer surfaces of the bottom and middle circuit boards and the sensor poles and the capacitive liquid therein are encased by the whole copper foil.
Further, the bottom circuit board is provided with a small hole (5) for injecting the capacitive liquid with the volume smaller than that of the cavity into the cavity (4).
A processing method of a high-precision horizontal sensitive structure comprises the following steps:
manufacturing a bottom layer circuit board, wherein the bottom surface of the bottom layer circuit board is grounded and used for shielding interference; the bottom layer circuit board comprises se:Sub>A bottom layer welding surface, two CDC-A pole pieces and two CDC-B pole pieces; the bottom layer welding surface is provided with se:Sub>A CDC-A excitation output electrode and se:Sub>A CDC-B excitation output electrode; the CDC-A excitation output electrode and the CDC-B excitation output electrode are connected with an excitation source;
manufacturing a middle-layer circuit board, wherein the center of the middle-layer circuit board is hollowed, and the periphery of the middle-layer circuit board is a middle-layer welding surface;
manufacturing an upper circuit board, wherein the upper circuit board comprises four quadrants A+, A-, B+ and B-and an upper welding surface, and the boundary between the A+ quadrant and the A-quadrant is perpendicular to the boundary between the B+ quadrant and the B-quadrant; wherein the A+ quadrant and the A-quadrant are symmetrically arranged, and the B+ quadrant and the B-quadrant are symmetrically arranged; the A+ quadrant and the A-quadrant form positive and negative plates of the first sensor, and the B+ quadrant and the B-quadrant form positive and negative plates of the second sensor; the sum of the areas of the two CDC-A pole pieces is equal to the sum of the areas of the A+ quadrant and the A-quadrant; the sum of the areas of the two CDC-B pole pieces is equal to the sum of the areas of the B+ quadrant and the B-quadrant; the two CDC-A pole pieces completely correspond to se:Sub>A detection pole A+ and se:Sub>A detection pole A-, which are input by the first sensor, and the two CDC-B pole pieces completely correspond to se:Sub>A detection pole B+ and se:Sub>A detection pole B-, which are input by the second sensor;
and stacking and welding the welding surfaces of the three circuit boards by using a soldering tin method, wherein the welded upper layer circuit board, middle layer circuit board and bottom layer circuit board form a sandwich structure, and the center of the sandwich structure is a cavity.
And (3) forming a small hole in the bottom layer circuit board, injecting flowable capacitive liquid into the cavity through the small hole, wherein the volume of the injected capacitive liquid is one half of that of the cavity, sealing the small hole by using glue or soldering tin, and generating a bubble in the cavity due to the fact that the cavity is not filled.
Further, the method also comprises the following steps:
and processing positioning points at the same positions of the bottom layer circuit board, the middle layer circuit board and the upper layer circuit board, so that the inclination angles of the three circuit boards are completely and simultaneously changed.
Further, the method also comprises the following steps: and wrapping the outer surfaces of the bottom layer circuit board and the middle layer circuit board, the sensor electrode and the capacitive liquid with the whole copper foil.
The working principle of the invention is that the air in the air bubble has smaller capacitance than the liquid, and the capacitance of the position of the air bubble is smaller, so the position of the air bubble can be determined by the capacitance value, and if the air bubble is in the middle, the detected capacitance value is 0.
The invention has the beneficial effects that: the invention provides a brand new high-precision horizontal sensitive structure and a processing method thereof, adopts a three-layer structure form and a symmetrical structure, converts the position of a middle bubble into a capacitor with high sensitivity, and provides a technical scheme of the high-sensitivity horizontal sensitive structure.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic diagram of a bottom circuit board structure according to the present invention;
FIG. 3 is a schematic diagram of an upper circuit board structure according to the present invention;
fig. 4 is a schematic diagram of a middle-layer circuit board structure according to the present invention.
In the figure, 1, a bottom circuit board; 2. a middle layer circuit board; 3. an upper layer circuit board; 4. a cavity; 5. a small hole; 11. CDC-se:Sub>A pole piece; 12. CDC-B pole piece; 13. a bottom layer welding surface; 111. CDC-se:Sub>A excitation output pole; 121. CDC-B excitation output pole; 61. a first location point; 62. a second positioning point; 31. a quadrant A; 32. quadrant A+; 33, b+ quadrant, 34, B-quadrant; 35. an upper layer welding surface; 21. and a middle layer welding surface.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The terms "first," "second," "third," and the like in this disclosure are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", and "a third" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise. All directional indications (such as up, down, left, right, front, back … …) in embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular gesture (as shown in the drawings), and if the particular gesture changes, the directional indication changes accordingly. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the invention. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
As shown in fig. 1, 2, 3 and 4, a high-precision horizontal sensitive structure comprises a bottom layer circuit board (1), a middle layer circuit board (2) and an upper layer circuit board (3);
the bottom surface of the bottom layer circuit board is grounded and used for shielding interference; the bottom layer circuit board comprises se:Sub>A bottom layer welding surface (13), two CDC-A pole pieces (11) and two CDC-B pole pieces (12); the two CDC-A pole pieces and the two CDC-B pole pieces are symmetrically arranged; the bottom layer welding surface is provided with se:Sub>A CDC-A excitation output electrode (111) and se:Sub>A CDC-B excitation output electrode (121); the CDC-A excitation output electrode and the CDC-B excitation output electrode are connected with an excitation source;
the middle layer circuit board (2) is hollowed out, and the periphery of the middle layer circuit board is a middle layer welding surface (21);
the upper circuit board comprises four quadrants A+ (32), A- (31), B+ (33) and B- (34) and an upper welding surface, wherein the boundary between the A+ quadrant and the A-quadrant is perpendicular to the boundary between the B+ quadrant and the B-quadrant; wherein the A+ quadrant and the A-quadrant are symmetrically arranged, and the B+ quadrant and the B-quadrant are symmetrically arranged; the A+ quadrant and the A-quadrant form positive and negative plates of the first sensor, and the B+ quadrant and the B-quadrant form positive and negative plates of the second sensor; the sum of the areas of the two CDC-A pole pieces is equal to the sum of the areas of the A+ quadrant and the A-quadrant; the sum of the areas of the two CDC-B pole pieces is equal to the sum of the areas of the B+ quadrant and the B-quadrant; the two CDC-A pole pieces completely correspond to se:Sub>A detection pole A+ and se:Sub>A detection pole A-, which are input by the first sensor, and the two CDC-B pole pieces completely correspond to se:Sub>A detection pole B+ and se:Sub>A detection pole B-, which are input by the second sensor;
the upper layer circuit board, the middle layer circuit board and the bottom layer circuit board are stacked and welded through the bottom layer welding surface, the middle layer welding surface and the upper layer welding surface to form a sandwich structure, and the center of the sandwich structure is a cavity (4); the cavity includes a volume of the liquid and air bubbles that is slightly less than the volume of the cavity.
Furthermore, locating points (61) and (62) are arranged on the bottom layer circuit board, the middle layer circuit board and the upper layer circuit board, and are used for enabling the inclination angles of the three circuit boards to be changed completely and simultaneously.
Preferably, the outer surfaces of the bottom and middle circuit boards and the sensor poles and the capacitive liquid therein are encased by the whole copper foil.
Further, the bottom circuit board is provided with a small hole (5) for injecting the capacitive liquid with the volume smaller than that of the cavity into the cavity (4).
A processing method of a high-precision horizontal sensitive structure comprises the following steps:
manufacturing a bottom layer circuit board, wherein the bottom surface of the bottom layer circuit board is grounded and used for shielding interference; the bottom layer circuit board comprises se:Sub>A bottom layer welding surface, two CDC-A pole pieces and two CDC-B pole pieces; the bottom layer welding surface is provided with se:Sub>A CDC-A excitation output electrode and se:Sub>A CDC-B excitation output electrode; the CDC-A excitation output electrode and the CDC-B excitation output electrode are connected with an excitation source;
manufacturing a middle-layer circuit board, wherein the center of the middle-layer circuit board is hollowed, and the periphery of the middle-layer circuit board is a middle-layer welding surface;
manufacturing an upper circuit board, wherein the upper circuit board comprises four quadrants A+, A-, B+ and B-and an upper welding surface, and the boundary between the A+ quadrant and the A-quadrant is perpendicular to the boundary between the B+ quadrant and the B-quadrant; wherein the A+ quadrant and the A-quadrant are symmetrically arranged, and the B+ quadrant and the B-quadrant are symmetrically arranged; the A+ quadrant and the A-quadrant form positive and negative plates of the first sensor, and the B+ quadrant and the B-quadrant form positive and negative plates of the second sensor; the sum of the areas of the two CDC-A pole pieces is equal to the sum of the areas of the A+ quadrant and the A-quadrant; the sum of the areas of the two CDC-B pole pieces is equal to the sum of the areas of the B+ quadrant and the B-quadrant; the two CDC-A pole pieces completely correspond to se:Sub>A detection pole A+ and se:Sub>A detection pole A-, which are input by the first sensor, and the two CDC-B pole pieces completely correspond to se:Sub>A detection pole B+ and se:Sub>A detection pole B-, which are input by the second sensor;
and stacking and welding the welding surfaces of the three circuit boards by using a soldering tin method, wherein the welded upper layer circuit board, middle layer circuit board and bottom layer circuit board form a sandwich structure, and the center of the sandwich structure is a cavity.
And (3) opening a small hole (5) in the bottom layer circuit board, injecting flowable capacitive liquid into the cavity through the small hole, wherein the volume of the injected capacitive liquid is one half of the volume of the cavity, sealing the small hole by using glue or soldering tin, and generating a bubble in the cavity due to the fact that the cavity is not filled.
Further, the method also comprises the following steps:
and processing positioning points at the same positions of the bottom layer circuit board, the middle layer circuit board and the upper layer circuit board, so that the inclination angles of the three circuit boards are completely and simultaneously changed.
Further, the method also comprises the following steps: and wrapping the outer surfaces of the bottom layer circuit board and the middle layer circuit board, the sensor electrode and the capacitive liquid with the whole copper foil.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (7)
1. The high-precision horizontal sensitive structure is characterized by comprising a bottom layer circuit board (1), a middle layer circuit board (2) and an upper layer circuit board (3);
the bottom surface of the bottom layer circuit board is grounded and used for shielding interference; the bottom layer circuit board comprises se:Sub>A bottom layer welding surface (13), two CDC-A pole pieces (11) and two CDC-B pole pieces (12); the two CDC-A pole pieces and the two CDC-B pole pieces are symmetrically arranged; the bottom layer welding surface is provided with se:Sub>A CDC-A excitation output electrode (111) and se:Sub>A CDC-B excitation output electrode (121); the CDC-A excitation output electrode and the CDC-B excitation output electrode are connected with an excitation source;
the middle layer circuit board is hollowed out at the center, and the periphery of the middle layer circuit board is a middle layer welding surface (21);
the upper circuit board comprises four quadrants A+ (32), A- (31), B+ (33) and B- (34) and an upper welding surface (35), and the boundary between the A+ quadrant and the A-quadrant is perpendicular to the boundary between the B+ quadrant and the B-quadrant; wherein the A+ quadrant and the A-quadrant are symmetrically arranged, and the B+ quadrant and the B-quadrant are symmetrically arranged; the A+ quadrant and the A-quadrant form positive and negative plates of the first sensor, and the B+ quadrant and the B-quadrant form positive and negative plates of the second sensor; the sum of the areas of the two CDC-A pole pieces is equal to the sum of the areas of the A+ quadrant and the A-quadrant; the sum of the areas of the two CDC-B pole pieces is equal to the sum of the areas of the B+ quadrant and the B-quadrant; the two CDC-A pole pieces completely correspond to se:Sub>A detection pole A+ and se:Sub>A detection pole A-, which are input by the first sensor, and the two CDC-B pole pieces completely correspond to se:Sub>A detection pole B+ and se:Sub>A detection pole B-, which are input by the second sensor;
the upper layer circuit board, the middle layer circuit board and the bottom layer circuit board are stacked and welded through the bottom layer welding surface, the middle layer welding surface and the upper layer welding surface to form a sandwich structure, and the center of the sandwich structure is a cavity (4); the cavity includes a volume of the liquid and the gas bubble that is less than the cavity volume.
2. The high-precision level sensitive structure according to claim 1, wherein positioning points are arranged on the bottom layer circuit board, the middle layer circuit board and the upper layer circuit board, and are used for enabling the inclination angles of the three circuit boards to be changed completely and simultaneously.
3. The high precision level sensitive structure of claim 1, wherein the outer surfaces of the bottom and middle circuit boards and the sensor poles and capacitive liquid therein are encased by a full-face copper foil.
4. The high precision level sensitive structure according to claim 1, wherein the underlying circuit board is provided with an aperture (5) for injecting a volume of a capacitive liquid into the cavity (4) that is smaller than the cavity volume.
5. A processing method of a high-precision horizontal sensitive structure comprises the following steps:
manufacturing a bottom layer circuit board, wherein the bottom surface of the bottom layer circuit board is grounded and used for shielding interference; the bottom layer circuit board comprises se:Sub>A bottom layer welding surface, two CDC-A pole pieces and two CDC-B pole pieces; the bottom layer welding surface is provided with se:Sub>A CDC-A excitation output electrode and se:Sub>A CDC-B excitation output electrode; the CDC-A excitation output electrode and the CDC-B excitation output electrode are connected with an excitation source;
manufacturing a middle-layer circuit board, wherein the center of the middle-layer circuit board is hollowed, and the periphery of the middle-layer circuit board is a middle-layer welding surface;
manufacturing an upper circuit board, wherein the upper circuit board comprises four quadrants A+, A-, B+ and B-and an upper welding surface, and the boundary between the A+ quadrant and the A-quadrant is perpendicular to the boundary between the B+ quadrant and the B-quadrant; wherein the A+ quadrant and the A-quadrant are symmetrically arranged, and the B+ quadrant and the B-quadrant are symmetrically arranged; the A+ quadrant and the A-quadrant form positive and negative plates of the first sensor, and the B+ quadrant and the B-quadrant form positive and negative plates of the second sensor; the sum of the areas of the two CDC-A pole pieces is equal to the sum of the areas of the A+ quadrant and the A-quadrant; the sum of the areas of the two CDC-B pole pieces is equal to the sum of the areas of the B+ quadrant and the B-quadrant; the two CDC-A pole pieces completely correspond to se:Sub>A detection pole A+ and se:Sub>A detection pole A-, which are input by the first sensor, and the two CDC-B pole pieces completely correspond to se:Sub>A detection pole B+ and se:Sub>A detection pole B-, which are input by the second sensor;
stacking and welding the welding surfaces of the three circuit boards by using a soldering tin method, wherein the welded upper layer circuit board, middle layer circuit board and bottom layer circuit board form a sandwich structure, and the center of the sandwich structure is a cavity;
and (3) opening a small hole (5) in the bottom layer circuit board, injecting flowable capacitive liquid into the cavity through the small hole, wherein the volume of the injected capacitive liquid is one half of the volume of the cavity, sealing the small hole by using glue or soldering tin, and generating a bubble in the cavity due to the fact that the cavity is not filled.
6. The method of processing a high-precision level sensitive structure according to claim 5, further comprising the steps of:
and processing positioning points at the same positions of the bottom layer circuit board, the middle layer circuit board and the upper layer circuit board, so that the inclination angles of the three circuit boards are completely and simultaneously changed.
7. The method of processing a high-precision level sensitive structure according to claim 5, further comprising the steps of: and wrapping the outer surfaces of the bottom layer circuit board and the middle layer circuit board, the sensor electrode and the capacitive liquid with the whole copper foil.
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| CN203848903U (en) * | 2014-03-21 | 2014-09-24 | 中石化第五建设有限公司 | Inductance and capacitance type sensor used for simultaneous detection of inclination angle and liquid level of container |
| CN104034311B (en) * | 2014-04-28 | 2016-08-24 | 哈尔滨工业大学 | In pairs trisection ring-circle nesting pole plate is staggeredly placed formula inclination angle measurement method and device in opposite directions |
| CN104019798B (en) * | 2014-04-28 | 2016-04-27 | 哈尔滨工业大学 | The nested pole plate inclination angle measurement method of concentric coplanar trisection ring-circle and device |
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