CN112815921A - High-precision horizontal sensitive structure and processing method thereof - Google Patents
High-precision horizontal sensitive structure and processing method thereof Download PDFInfo
- Publication number
- CN112815921A CN112815921A CN202110016886.9A CN202110016886A CN112815921A CN 112815921 A CN112815921 A CN 112815921A CN 202110016886 A CN202110016886 A CN 202110016886A CN 112815921 A CN112815921 A CN 112815921A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- cdc
- pole pieces
- layer circuit
- welding surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003672 processing method Methods 0.000 title claims abstract description 8
- 238000003466 welding Methods 0.000 claims abstract description 44
- 230000005284 excitation Effects 0.000 claims abstract description 39
- 239000007788 liquid Substances 0.000 claims description 20
- 238000001514 detection method Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 6
- 230000009969 flowable effect Effects 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 description 9
- 238000006073 displacement reaction Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 239000003570 air Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C9/00—Measuring inclination, e.g. by clinometers, by levels
- G01C9/18—Measuring inclination, e.g. by clinometers, by levels by using liquids
- G01C9/24—Measuring inclination, e.g. by clinometers, by levels by using liquids in closed containers partially filled with liquid so as to leave a gas bubble
- G01C9/26—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/003—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring position, not involving coordinate determination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C9/00—Measuring inclination, e.g. by clinometers, by levels
- G01C9/02—Details
- G01C9/06—Electric or photoelectric indication or reading means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/30—Reactive power compensation
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Measurement Of Radiation (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The invention relates to a high-precision horizontal sensitive structure and a processing method thereof, wherein the high-precision horizontal sensitive structure comprises a bottom circuit board, a middle circuit board and an upper circuit board; the bottom surface of the bottom layer circuit board is grounded and used for shielding interference; the bottom circuit board comprises a bottom welding surface, two CDC-A pole pieces and two CDC-B pole pieces; the two CDC-A pole pieces and the two CDC-B pole pieces are symmetrically arranged; a CDC-A excitation output electrode and a CDC-B excitation output electrode are arranged on the bottom welding surface; and the CDC-A excitation output electrode and the CDC-B excitation output electrode are connected with an excitation source.
Description
Technical Field
The invention relates to a high-precision level-sensitive structure and a processing method thereof, belonging to the technical field of measurement.
Background
When measuring a non-electrical quantity by an electrical measurement method, the non-electrical quantity to be measured must first be converted into an electrical quantity and then input. An element that converts a non-electrical quantity into an electrical quantity is generally called a transformer; a sensor is a related conversion device designed according to the characteristics of different non-electrical quantities, and a sensor for converting a measured mechanical quantity (such as displacement, force, speed, and the like) into a capacitance change is a capacitive sensor.
From the perspective of energy conversion, the capacitive transducer is a passive transducer, and needs to convert the measured mechanical quantity into voltage or current, and then amplify and process the voltage or current. Linear displacement, angular displacement, interval, distance, thickness, stretching, compression, expansion, deformation and the like in the mechanical quantity are not closely related to the length; these quantities are measured by length or length ratio, and the correlation between the measurement methods is also very close. In addition, under some conditions, the mechanical quantities change slowly, the change range is extremely small, if the extremely small distance or displacement is required to be measured, the high resolution is required, other sensors are difficult to realize the high resolution requirement, and the resolution of the differential transformer sensor commonly used in the precision measurement only reaches the order of magnitude of 1-5 μm; and a capacitance micrometer has the resolution of 0.01 mu m, is improved by two orders of magnitude compared with the resolution of the capacitance micrometer, and has the maximum measuring range of 100 +/-5 mu m, so that the capacitance micrometer is favored in precise small displacement measurement.
For the measurement of these mechanical quantities, especially slowly changing or minute quantities, it is generally appropriate to use capacitive sensors for detection, mainly such sensors have the following outstanding advantages:
(1) the measurement range is large, and the relative change rate can exceed 100 [% ];
(2) the sensitivity is high, if the ratio transformer bridge is used for measurement, the relative variation can reach 10-7 orders of magnitude;
(3) the dynamic response is fast, and the high-frequency characteristic is suitable for dynamic measurement and static measurement due to small movable mass and high natural frequency.
(4) The stability is good because the polar plates of the capacitor are mostly made of metal materials, and the linings between the polar plates are mostly made of inorganic materials such as air, glass, ceramics, quartz and the like; therefore, the device can work for a long time under high-temperature, low-temperature strong magnetic fields and strong radiation, and particularly solves the detection problem under the high-temperature and high-pressure environment.
Capacitive-to-digital converters (CDC) are currently an application technology suitable for detection. The single channel AD7745 and the dual channel AD7746 are both high-resolution sigma-delta capacitance-to-digital converters, and can measure the capacitance directly connected with the input end. These devices have high resolution (21 bit effective resolution and 24 bit no-missing code), high linearity (+ -0.01%) and high accuracy (factory calibration to + -4 fF), and are well suited for detecting liquid levels, positions, pressures and other physical parameters. These devices have complete functionality, integrating a multiplexer, a stimulus source, a DAC for capacitance, a temperature sensor, a reference voltage source, a clock generator, control and calibration logic, an I2C compatible serial interface, and a high precision converter core that integrates a second order sigma delta type charge balance modulator and a third order digital filter. The converter serves as both a CDC of the capacitive input and an ADC of the voltage input.
The measured capacitance Cx is connected between the excitation source and the sigma-delta modulator input. A square wave excitation signal is applied at Cx during the transition. The modulator will sample the charge flowing through Cx without interruption and convert it to a stream of 0 s and 1 s. The density of the modulator output 1 is processed by a digital filter to determine the capacitance value. The filter output is scaled by the calibration factor. The final value can then be read by the external host through the serial interface.
Disclosure of Invention
The present invention aims to provide a high precision level sensitive structure and a method of processing the same, which makes it possible to use high performance capacitive sensing in angle measurement applications based on capacitive-to-digital converter (CDC) technology.
The technical scheme adopted by the invention is as follows: a high-precision horizontal sensitive structure is characterized by comprising a bottom circuit board, a middle circuit board and an upper circuit board;
the bottom surface of the bottom layer circuit board is grounded and used for shielding interference; the bottom circuit board comprises a bottom welding surface, two CDC-A pole pieces and two CDC-B pole pieces; the two CDC-A pole pieces and the two CDC-B pole pieces are symmetrically arranged; a CDC-A excitation output electrode and a CDC-B excitation output electrode are arranged on the bottom welding surface; the CDC-A excitation output electrode and the CDC-B excitation output electrode are connected with an excitation source;
the center of the middle layer circuit board is hollowed, and the periphery of the middle layer circuit board is a middle layer welding surface;
the upper circuit board comprises four quadrants of A +, A-, B + and B-and an upper welding surface, and the boundary of the A + and the A-is vertical to the boundary of the B + and the B-; the A + quadrant and the A-quadrant are symmetrically arranged, and the B + quadrant and the B-quadrant are symmetrically arranged; the A + and A-quadrants form a positive pole piece and a negative pole piece of the first sensor, and the B + and B-quadrants form a positive pole piece and a negative pole piece of the second sensor; the areas of the two CDC-A pole pieces are equal to the area of the A + plus the area of the A-; the areas of the two CDC-B pole pieces are equal to the area of B plus B minus; the two CDC-A pole pieces completely correspond to the detection poles A + and A-input by the first sensor, and the two CDC-B pole pieces completely correspond to the detection poles B + and B-input by the second sensor;
the upper layer circuit board, the middle layer circuit board and the bottom layer circuit board are stacked and welded through the bottom layer welding surface, the middle layer welding surface and the upper layer welding surface to form a sandwich-type structure, and the center of the sandwich-type structure is a cavity; the cavity comprises a capacitive liquid and a gas bubble which are slightly smaller than the volume of the cavity.
Furthermore, positioning points are arranged on the bottom circuit board, the middle circuit board and the upper circuit board and used for enabling the inclination angles of the three circuit boards to be completely the same.
Preferably, the outer surfaces of the bottom circuit board and the middle circuit board and the sensor electrode and the capacitive liquid in the bottom circuit board and the middle circuit board are wrapped by whole copper foil.
Further, the bottom circuit board is provided with a small hole (5) for injecting capacitive liquid with volume less than that of the cavity into the cavity (4).
A processing method of a high-precision horizontal sensitive structure comprises the following steps:
manufacturing a bottom circuit board, wherein the bottom surface of the bottom circuit board is grounded and is used for shielding interference; the bottom circuit board comprises a bottom welding surface, two CDC-A pole pieces and two CDC-B pole pieces; a CDC-A excitation output electrode and a CDC-B excitation output electrode are arranged on the bottom welding surface; the CDC-A excitation output electrode and the CDC-B excitation output electrode are connected with an excitation source;
making a middle layer circuit board, wherein the center of the middle layer circuit board is hollowed, and the periphery of the middle layer circuit board is a middle layer welding surface;
manufacturing an upper circuit board, wherein the upper circuit board comprises four quadrants of A +, A-, B + and B-and an upper welding surface, and a boundary between A + and A-is vertical to a boundary between B + and B-; the A + quadrant and the A-quadrant are symmetrically arranged, and the B + quadrant and the B-quadrant are symmetrically arranged; the A + and A-quadrants form a positive pole piece and a negative pole piece of the first sensor, and the B + and B-quadrants form a positive pole piece and a negative pole piece of the second sensor; the areas of the two CDC-A pole pieces are equal to the area of the A + plus the area of the A-; the areas of the two CDC-B pole pieces are equal to the area of B plus B minus; the two CDC-A pole pieces completely correspond to the detection poles A + and A-input by the first sensor, and the two CDC-B pole pieces completely correspond to the detection poles B + and B-input by the second sensor;
the welding surfaces of the three circuit boards are stacked and welded by using a tin soldering method, the upper layer circuit board, the middle layer circuit board and the bottom layer circuit board after welding form a sandwich structure, and the center of the sandwich structure is a cavity.
And forming a small hole on the bottom layer circuit board, injecting flowable capacitive liquid into the cavity through the small hole, wherein the volume of the injected capacitive liquid is one half of that of the cavity, sealing the small hole by using glue or soldering tin, and generating a bubble in the cavity because the cavity is not filled.
Further, the method also comprises the following steps:
and processing positioning points at the same positions of the bottom circuit board, the middle circuit board and the upper circuit board, so that the inclination angles of the three circuit boards are completely the same.
Further, the method also comprises the following steps: and the outer surfaces of the bottom layer circuit board and the middle layer circuit board, the sensor electrode and the capacitive liquid are wrapped by the whole copper foil.
The working principle of the invention is that the capacitance of the position of the air bubble is smaller than that of the liquid, so that the position of the air bubble can be determined by the capacitance value, and if the air bubble is in the middle, the detected capacitance value is 0.
The invention has the beneficial effects that: the invention provides a brand-new high-precision horizontal sensitive structure and a processing method thereof.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of a bottom-layer circuit board structure according to the present invention;
FIG. 3 is a schematic view of an upper circuit board structure according to the present invention;
FIG. 4 is a schematic view of a middle layer circuit board structure according to the present invention.
In the figure, 1, a bottom layer circuit board; 2. a middle layer circuit board; 3. an upper layer circuit board; 4. a cavity; 5. a small hole; 11. CDC-A pole piece; 12. CDC-B pole piece; 13. a bottom layer welding surface; 111. CDC-A excitation output pole; 121. CDC-B excitation output pole; 61. a first anchor site; 62. a second positioning point; 31. a-quadrant; 32. a + quadrant; 33, B + quadrant, 34, B-quadrant; 35. an upper layer welding surface; 21. and (6) welding the middle layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terms "first", "second" and "third" in the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. All directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
As shown in fig. 1, fig. 2, fig. 3 and fig. 4, a high-precision level-sensitive structure includes a bottom circuit board (1), a middle circuit board (2) and an upper circuit board (3);
the bottom surface of the bottom layer circuit board is grounded and used for shielding interference; the bottom circuit board comprises a bottom welding surface (13), two CDC-A pole pieces (11) and two CDC-B pole pieces (12); the two CDC-A pole pieces and the two CDC-B pole pieces are symmetrically arranged; a CDC-A excitation output electrode (111) and a CDC-B excitation output electrode (121) are arranged on the bottom welding surface; the CDC-A excitation output electrode and the CDC-B excitation output electrode are connected with an excitation source;
the center of the middle layer circuit board (2) is hollowed, and the periphery of the middle layer circuit board is a middle layer welding surface (21);
the upper circuit board comprises four quadrants of A + (32), A- (31), B + (33) and B- (34) and an upper welding surface, and the boundary of A + and A-is vertical to the boundary of B + and B-; the A + quadrant and the A-quadrant are symmetrically arranged, and the B + quadrant and the B-quadrant are symmetrically arranged; the A + and A-quadrants form a positive pole piece and a negative pole piece of the first sensor, and the B + and B-quadrants form a positive pole piece and a negative pole piece of the second sensor; the areas of the two CDC-A pole pieces are equal to the area of the A + plus the area of the A-; the areas of the two CDC-B pole pieces are equal to the area of B plus B minus; the two CDC-A pole pieces completely correspond to the detection poles A + and A-input by the first sensor, and the two CDC-B pole pieces completely correspond to the detection poles B + and B-input by the second sensor;
the upper layer circuit board, the middle layer circuit board and the bottom layer circuit board are stacked and welded through the bottom layer welding surface, the middle layer welding surface and the upper layer welding surface to form a sandwich type structure, and the center of the sandwich type structure is a cavity (4); the cavity comprises a capacitive liquid and a gas bubble which are slightly smaller than the volume of the cavity.
Furthermore, positioning points (61) and (62) are arranged on the bottom circuit board, the middle circuit board and the upper circuit board and used for enabling the inclination angles of the three circuit boards to be completely the same.
Preferably, the outer surfaces of the bottom circuit board and the middle circuit board and the sensor electrode and the capacitive liquid in the bottom circuit board and the middle circuit board are wrapped by whole copper foil.
Further, the bottom circuit board is provided with a small hole (5) for injecting capacitive liquid with volume less than that of the cavity into the cavity (4).
A processing method of a high-precision horizontal sensitive structure comprises the following steps:
manufacturing a bottom circuit board, wherein the bottom surface of the bottom circuit board is grounded and is used for shielding interference; the bottom circuit board comprises a bottom welding surface, two CDC-A pole pieces and two CDC-B pole pieces; a CDC-A excitation output electrode and a CDC-B excitation output electrode are arranged on the bottom welding surface; the CDC-A excitation output electrode and the CDC-B excitation output electrode are connected with an excitation source;
making a middle layer circuit board, wherein the center of the middle layer circuit board is hollowed, and the periphery of the middle layer circuit board is a middle layer welding surface;
manufacturing an upper circuit board, wherein the upper circuit board comprises four quadrants of A +, A-, B + and B-and an upper welding surface, and a boundary between A + and A-is vertical to a boundary between B + and B-; the A + quadrant and the A-quadrant are symmetrically arranged, and the B + quadrant and the B-quadrant are symmetrically arranged; the A + and A-quadrants form a positive pole piece and a negative pole piece of the first sensor, and the B + and B-quadrants form a positive pole piece and a negative pole piece of the second sensor; the areas of the two CDC-A pole pieces are equal to the area of the A + plus the area of the A-; the areas of the two CDC-B pole pieces are equal to the area of B plus B minus; the two CDC-A pole pieces completely correspond to the detection poles A + and A-input by the first sensor, and the two CDC-B pole pieces completely correspond to the detection poles B + and B-input by the second sensor;
the welding surfaces of the three circuit boards are stacked and welded by using a tin soldering method, the upper layer circuit board, the middle layer circuit board and the bottom layer circuit board after welding form a sandwich structure, and the center of the sandwich structure is a cavity.
And forming a small hole (5) in the bottom layer circuit board, injecting flowable capacitive liquid into the cavity through the small hole, wherein the volume of the injected capacitive liquid is one half of that of the cavity, sealing the small hole by using glue or soldering tin, and generating a bubble in the cavity because the cavity is not filled.
Further, the method also comprises the following steps:
and processing positioning points at the same positions of the bottom circuit board, the middle circuit board and the upper circuit board, so that the inclination angles of the three circuit boards are completely the same.
Further, the method also comprises the following steps: and the outer surfaces of the bottom layer circuit board and the middle layer circuit board, the sensor electrode and the capacitive liquid are wrapped by the whole copper foil.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. A high-precision horizontal sensitive structure is characterized by comprising a bottom circuit board (1), a middle circuit board (2) and an upper circuit board (3);
the bottom surface of the bottom layer circuit board is grounded and used for shielding interference; the bottom circuit board comprises a bottom welding surface (13), two CDC-A pole pieces (11) and two CDC-B pole pieces (12); the two CDC-A pole pieces and the two CDC-B pole pieces are symmetrically arranged; a CDC-A excitation output electrode (111) and a CDC-B excitation output electrode (121) are arranged on the bottom welding surface; the CDC-A excitation output electrode and the CDC-B excitation output electrode are connected with an excitation source;
the center of the middle layer circuit board is hollowed, and the periphery of the middle layer circuit board is a middle layer welding surface (21);
the upper circuit board comprises four quadrants of A + (32), A- (31), B + (33) and B- (34) and an upper welding surface (35), and the boundary of A + and A-is vertical to the boundary of B + and B-; the A + quadrant and the A-quadrant are symmetrically arranged, and the B + quadrant and the B-quadrant are symmetrically arranged; the A + and A-quadrants form a positive pole piece and a negative pole piece of the first sensor, and the B + and B-quadrants form a positive pole piece and a negative pole piece of the second sensor; the areas of the two CDC-A pole pieces are equal to the area of the A + plus the area of the A-; the areas of the two CDC-B pole pieces are equal to the area of B plus B minus; the two CDC-A pole pieces completely correspond to the detection poles A + and A-input by the first sensor, and the two CDC-B pole pieces completely correspond to the detection poles B + and B-input by the second sensor;
the upper layer circuit board, the middle layer circuit board and the bottom layer circuit board are stacked and welded through the bottom layer welding surface, the middle layer welding surface and the upper layer welding surface to form a sandwich type structure, and the center of the sandwich type structure is a cavity (4); the cavity comprises a capacitive liquid and a gas bubble which are slightly smaller than the volume of the cavity.
2. A high precision level sensitive structure according to claim 1, wherein the bottom layer circuit board, the middle layer circuit board and the upper layer circuit board are all provided with positioning points for making the inclination angles of the three circuit boards be completely the same.
3. A high precision level sensitive structure according to claim 1, wherein the outer surfaces of said bottom and middle circuit boards and the sensor electrodes and capacitive liquid therein are encased by a full-face copper foil.
4. A high accuracy level sensitive structure according to claim 1, characterized in that the bottom circuit board is provided with an aperture (5) for injecting a capacitive liquid into the cavity (4) in a volume smaller than the cavity volume.
5. A processing method of a high-precision horizontal sensitive structure comprises the following steps:
manufacturing a bottom circuit board, wherein the bottom surface of the bottom circuit board is grounded and is used for shielding interference; the bottom circuit board comprises a bottom welding surface, two CDC-A pole pieces and two CDC-B pole pieces; a CDC-A excitation output electrode and a CDC-B excitation output electrode are arranged on the bottom welding surface; the CDC-A excitation output electrode and the CDC-B excitation output electrode are connected with an excitation source;
making a middle layer circuit board, wherein the center of the middle layer circuit board is hollowed, and the periphery of the middle layer circuit board is a middle layer welding surface;
manufacturing an upper circuit board, wherein the upper circuit board comprises four quadrants of A +, A-, B + and B-and an upper welding surface, and a boundary between A + and A-is vertical to a boundary between B + and B-; the A + quadrant and the A-quadrant are symmetrically arranged, and the B + quadrant and the B-quadrant are symmetrically arranged; the A + and A-quadrants form a positive pole piece and a negative pole piece of the first sensor, and the B + and B-quadrants form a positive pole piece and a negative pole piece of the second sensor; the areas of the two CDC-A pole pieces are equal to the area of the A + plus the area of the A-; the areas of the two CDC-B pole pieces are equal to the area of B plus B minus; the two CDC-A pole pieces completely correspond to the detection poles A + and A-input by the first sensor, and the two CDC-B pole pieces completely correspond to the detection poles B + and B-input by the second sensor;
the welding surfaces of the three circuit boards are stacked and welded by using a tin soldering method, the upper layer circuit board, the middle layer circuit board and the bottom layer circuit board after welding form a sandwich structure, and the center of the sandwich structure is a cavity.
And forming a small hole (5) in the bottom layer circuit board, injecting flowable capacitive liquid into the cavity through the small hole, wherein the volume of the injected capacitive liquid is one half of that of the cavity, sealing the small hole by using glue or soldering tin, and generating a bubble in the cavity because the cavity is not filled.
6. A method of processing a high precision level sensitive structure according to claim 5, further comprising the steps of:
and processing positioning points at the same positions of the bottom circuit board, the middle circuit board and the upper circuit board, so that the inclination angles of the three circuit boards are completely the same.
7. A method of processing a high precision level sensitive structure according to claim 5, further comprising the steps of: and the outer surfaces of the bottom layer circuit board and the middle layer circuit board, the sensor electrode and the capacitive liquid are wrapped by the whole copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110016886.9A CN112815921B (en) | 2021-01-07 | 2021-01-07 | High-precision horizontal sensitive structure and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110016886.9A CN112815921B (en) | 2021-01-07 | 2021-01-07 | High-precision horizontal sensitive structure and processing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112815921A true CN112815921A (en) | 2021-05-18 |
| CN112815921B CN112815921B (en) | 2023-05-30 |
Family
ID=75868391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110016886.9A Active CN112815921B (en) | 2021-01-07 | 2021-01-07 | High-precision horizontal sensitive structure and processing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112815921B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104019798A (en) * | 2014-04-28 | 2014-09-03 | 哈尔滨工业大学 | Method and device for measuring dip angle of concentric coplanar trisected ring-circle nested polar plate |
| CN104034311A (en) * | 2014-04-28 | 2014-09-10 | 哈尔滨工业大学 | Paired trisectional annular-circular nested pole plate staggered arrangement type inclination angle measuring method and apparatus thereof |
| CN203848903U (en) * | 2014-03-21 | 2014-09-24 | 中石化第五建设有限公司 | Inductance and capacitance type sensor used for simultaneous detection of inclination angle and liquid level of container |
| CN105180901A (en) * | 2015-10-07 | 2015-12-23 | 湖南科技学院 | Spherical capacitive plane level detection sensor |
-
2021
- 2021-01-07 CN CN202110016886.9A patent/CN112815921B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203848903U (en) * | 2014-03-21 | 2014-09-24 | 中石化第五建设有限公司 | Inductance and capacitance type sensor used for simultaneous detection of inclination angle and liquid level of container |
| CN104019798A (en) * | 2014-04-28 | 2014-09-03 | 哈尔滨工业大学 | Method and device for measuring dip angle of concentric coplanar trisected ring-circle nested polar plate |
| CN104034311A (en) * | 2014-04-28 | 2014-09-10 | 哈尔滨工业大学 | Paired trisectional annular-circular nested pole plate staggered arrangement type inclination angle measuring method and apparatus thereof |
| CN105180901A (en) * | 2015-10-07 | 2015-12-23 | 湖南科技学院 | Spherical capacitive plane level detection sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112815921B (en) | 2023-05-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3422324A (en) | Pressure variable capacitor | |
| Patranabi | Sensors and Tranducers | |
| CN206891622U (en) | A kind of ceramic capacitive pressure sensors | |
| CN111059995B (en) | Self-driven displacement sensor based on friction nano generator | |
| CN101266167A (en) | Capacitive digital level sensor and its measuring method | |
| CN107389229A (en) | A kind of ceramic capacitive pressure sensors | |
| CN212807437U (en) | Core body of differential pressure sensor | |
| CN103941041A (en) | Single-mass-block three-axis MEMS accelerometer with three frame structures | |
| CN101493367A (en) | Miniature dynamical stress sensor based on MEMS technology and method of producing same | |
| Li et al. | Capacitive pressure sensor with integrated signal-conversion circuit for high-temperature applications | |
| CN112815921B (en) | High-precision horizontal sensitive structure and processing method thereof | |
| CN112815922B (en) | High-precision angle sensor sensitive structure and processing method thereof | |
| CN108828265B (en) | Capacitive micromechanical acceleration sensor | |
| CN114659681A (en) | High-temperature force sensor and production method thereof | |
| CN201876332U (en) | Surface friction shearing stress sensor | |
| CN211668429U (en) | Rock class material super dynamic strain test device | |
| CN112504498A (en) | Annular structure temperature sensor | |
| CN103175465A (en) | Minisize resistance-type displacement meter based on full-bridge electrometric method | |
| CN105157551A (en) | Triangle displacement sensor | |
| CN108957150A (en) | A kind of electric-field sensor based on electrostriction effect | |
| CN115575661A (en) | Two-dimensional capacitive differential MEMS wind speed and direction sensor | |
| CN201266126Y (en) | Double bridge type thick film pressure transducer | |
| CN203672371U (en) | Quartz flexure accelerometer based dipmeter | |
| CN109231157B (en) | Pressure and displacement integrated MEMS sensor combining four-beam circular membrane and coaxial cylinder | |
| CN102109402B (en) | Surface friction shearing stress sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20221104 Address after: 518000 4th floor, building e, Tangtou first industrial zone, Tangtou community, Shiyan street, Bao'an District, Shenzhen City, Guangdong Province Applicant after: Shenzhen Dolby Laser Co.,Ltd. Address before: 518000 Shenzhen, Guangdong Guangming New District Gongming office, Tian Liao community guangguangxin Park West seven, Qiao de science and Technology Park building, six B building. Applicant before: SHENZHEN DOBIY ELECTRONIC Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |