CN112743445B - A chemical mechanical polishing detection device and detection method thereof - Google Patents
A chemical mechanical polishing detection device and detection method thereof Download PDFInfo
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- CN112743445B CN112743445B CN202110141359.0A CN202110141359A CN112743445B CN 112743445 B CN112743445 B CN 112743445B CN 202110141359 A CN202110141359 A CN 202110141359A CN 112743445 B CN112743445 B CN 112743445B
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- 238000005498 polishing Methods 0.000 title claims abstract description 140
- 238000001514 detection method Methods 0.000 title claims abstract description 33
- 239000000126 substance Substances 0.000 title claims abstract description 28
- 238000012544 monitoring process Methods 0.000 claims abstract description 8
- 230000009471 action Effects 0.000 claims abstract description 4
- 238000006073 displacement reaction Methods 0.000 claims abstract description 4
- 238000012876 topography Methods 0.000 claims 1
- 239000002245 particle Substances 0.000 abstract description 23
- 238000009826 distribution Methods 0.000 abstract description 20
- 230000008859 change Effects 0.000 abstract description 17
- 238000007517 polishing process Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 238000005299 abrasion Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000002596 correlated effect Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 201000004569 Blindness Diseases 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
本发明公开一种化学机械抛光检测装置及其检测方法，涉及化学机械抛光技术领域，包括对透明的工件进行夹持的工件夹持部、用于带动抛光垫转动的驱动部及其用于对抛光垫的表面形貌进行图像采集的图像采集部，工件加持部上设置有压力传感器，压力传感器用于测量工件在抛光压力作用下由于法向位移而产生的法向压力；本发明利用图像采集装置实时捕捉抛光界面间抛光垫的表面形貌，结合对抛光界面受力情况的监测，能够分析得到抛光垫表面摩擦系数变化情况，及其摩擦系数变化与研磨颗粒分布变化、磨损变化等参数之间的关系，解决了无法将抛光界面磨粒分布、抛光垫形貌与界面摩擦特性进行关联的技术问题。
The invention discloses a chemical mechanical polishing detection device and a detection method thereof, which relate to the technical field of chemical mechanical polishing, and comprise a workpiece clamping portion for clamping a transparent workpiece, a driving portion for driving a polishing pad to rotate, and an image acquisition portion for acquiring an image of the surface morphology of the polishing pad. A pressure sensor is arranged on the workpiece holding portion, and the pressure sensor is used to measure the normal pressure generated by the normal displacement of the workpiece under the action of the polishing pressure. The invention utilizes an image acquisition device to capture the surface morphology of the polishing pad between polishing interfaces in real time, and in combination with the monitoring of the stress condition of the polishing interface, the change of the friction coefficient of the polishing pad surface can be analyzed, and the relationship between the change of the friction coefficient and parameters such as the change of abrasive particle distribution and the change of wear can be obtained, thereby solving the technical problem that the distribution of abrasive particles at the polishing interface, the morphology of the polishing pad and the interface friction characteristics cannot be associated.
Description
Technical Field
The invention relates to the technical field of chemical mechanical polishing, in particular to a chemical mechanical polishing detection device and a detection method thereof.
Background
Ultraprecise machining is an important direction in the field of machine fabrication, and chemical mechanical polishing is one of the most commonly used methods in ultraprecise machining. The distribution of abrasive particles and polishing interface friction characteristics during chemical mechanical polishing have been the focus of attention in the art.
The existence and distribution form of the abrasive particles in the chemical mechanical polishing interface directly influence the surface quality of the polished workpiece, and have influence on the surface scratches, the rough morphology, the performance consistency and the material removal rate of the workpiece. The existing technology cannot directly detect the existence and distribution of abrasive particles in the polishing interface, and chemical mechanical polishing process formulation is carried out based on empirical estimation. The rough process comprises selecting the type and size of abrasive particles according to the type of polishing workpiece and polishing liquid, and estimating the number of abrasive particles according to coarse and fine polishing requirements. This experience-based process has some blindness and lacks specific theoretical guidance.
Furthermore, chemical mechanical polishing is essentially a three-body interface tribology problem, friction is one of the specific quantitative indicators of interface friction characteristics, and directly reflects the material removal rate characteristics in the chemical mechanical polishing interface. Therefore, the relation between the friction force of the polishing interface and the friction coefficient of the polishing surface and the size, thickness, distribution state and abrasion state of the abrasive particles is obtained, and the method has important guiding significance for making a more standard and more reasonable polishing process. However, some existing polishing experimental machines can only measure the friction force in the polishing process or the surface rigidity of the polishing pad in a non-working state, such as the invention patent with the application number of 201810737394.7, the name of the device and the method for measuring the polishing friction force, and the invention patent with the application number of 202010291933.6, the name of the device and the method for measuring the microscopic contact state of the polishing pad, but the relationship between the friction coefficient of the polishing interface and the distribution of abrasive particles and the morphology of the polishing pad cannot be analyzed, and a good guiding effect on the more reasonable polishing process cannot be achieved.
Disclosure of Invention
The invention aims to provide a chemical mechanical polishing detection device and a detection method thereof, which are used for solving the problems in the prior art, correlating polishing interface abrasive particle distribution, polishing pad morphology and interface friction characteristics, and laying a reliable foundation for further clearing polishing essence, optimizing polishing process, improving polishing efficiency and reducing polishing cost.
The invention provides a chemical mechanical polishing detection device, which comprises a workpiece clamping part for clamping a transparent workpiece, wherein the workpiece clamping part is provided with a pressure sensor for measuring normal pressure generated by normal displacement of the workpiece under the action of polishing pressure;
the polishing device also comprises a driving part for driving the polishing pad to rotate;
the polishing device further comprises an image acquisition part for acquiring images of the surface morphology of the polishing pad, and the image acquisition part acquires the images of the surface morphology of the polishing pad through the shooting area.
Preferably, the photographing region has an area larger than that of the polishing pad.
Preferably, the number of the pressure sensors is 2, and the pressure sensors are respectively positioned at two ends of a diagonal line after the workpiece is installed.
Preferably, a torque sensor for measuring torque is provided on the drive shaft of the drive section.
Preferably, the workpiece clamping part is provided with a clamping groove for clamping the workpiece, the clamping groove is provided with the pressure sensor, the clamping groove is also provided with a plurality of bolt holes, and the workpiece is fixed in the clamping groove through the bolts by the fixing bolts.
Preferably, the workpiece clamping part is fixed on a sliding block, the sliding block is slidably arranged on a fixed bracket, and the fixed bracket is slidably arranged on a base.
Preferably, the fixing support is provided with a first screw rod, the first screw rod is connected with a first nut, the first nut is fixedly connected with the sliding block, the fixing support is also provided with a first sliding groove, and the sliding block is provided with a first protruding block in sliding fit with the first sliding groove.
Preferably, the base is provided with a second screw rod, the second screw rod is connected with a second nut, the second nut is fixedly connected with the fixed support, the base is also provided with a second chute, and the fixed support is also provided with a second bump matched with the second chute.
Preferably, the image acquisition part is slidably arranged on the image acquisition bracket, the image acquisition part comprises an industrial camera, an objective lens of the industrial camera is opposite to the shooting area, and a focal length adjusting knob for adjusting a focal length is further arranged on the industrial camera.
The invention also provides a detection method of the chemical mechanical polishing detection device, which comprises the following steps:
1) Fixing the polishing pad on the polishing disk;
2) Placing the workpiece into a clamping groove, compacting and fixing the workpiece by using a fixing bolt, and adjusting the position of a workpiece clamping part to enable the surface of the workpiece to be tightly attached to a polishing pad;
3) Adjusting the position of the industrial camera to enable the objective to be opposite to the polishing pad, and then adjusting the focal length of the objective to enable the industrial camera to acquire clear patterns of the surface morphology of the polishing pad;
4) Electrically connecting an industrial camera, a torque sensor and a pressure sensor with a monitoring system;
5) And starting the driving part to polish the workpiece.
Compared with the prior art, the invention has the following technical effects:
1. The invention captures the surface morphology of the polishing pad between the polishing interfaces in real time by utilizing the image acquisition device, can fully understand the distribution change condition and the abrasion change condition of the polishing particles in the polishing process, can analyze and obtain the surface friction coefficient change condition of the polishing pad and the relation between the friction coefficient change and the parameters such as the distribution change, the abrasion change and the like of the polishing particles in combination with the monitoring of the stress condition of the polishing interfaces, solves the technical problem that the distribution of the abrasive particles of the polishing interfaces, the morphology of the polishing pad and the friction characteristics of the interfaces cannot be correlated, and lays a reliable foundation for further clearly polishing essence, optimizing the polishing process, improving the polishing efficiency and reducing the polishing cost;
2. In the invention, the workpiece is made of transparent materials, and a transparent shooting area is arranged on the workpiece clamping part, so that a good structural foundation is provided for the image acquisition device to acquire the surface morphology of the polishing pad;
3. the invention adopts the ball screw structure for horizontal and vertical adjustment of the workpiece, has high adjustment precision and large adjustment range of positive pressure of the workpiece, is convenient for researching abrasion and distribution conditions of grinding particles under the condition of various pressures and torques, ensures that the detection result is more abundant, and has small friction resistance of the ball screw structure and very convenient adjustment.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the drawings that are needed in the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a front view of FIG. 1;
FIG. 3 is a schematic view of a work holding portion;
FIG. 4 is a top view of FIG. 3;
FIG. 5 is a cross-sectional view of A-A;
FIG. 6 is a schematic view of the connection structure of the slider, the fixing bracket and the base in the present invention;
The device comprises a workpiece, a workpiece clamping part, a driving part, an image acquisition part, a 5-pressure sensor, a 6-shooting window, a 7-polishing pad, an 8-torque sensor, a 9-servo motor, a 10-clamping groove, a 11-fixing cavity, a 12-slider, a 13-fixing support, a 14-base, a 15-first lead screw, a 16-slider adjusting knob, a 17-first chute, a 18-first bump, a 19-second lead screw, a 20-fixing support adjusting knob, a 21-second chute, a 22-second bump, a 23-image acquisition support, a 24-industrial camera, a 25-objective lens, a 26-focal length adjusting knob.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention aims to provide a chemical mechanical polishing detection device and a detection method thereof, which are used for solving the problems in the prior art, correlating polishing interface abrasive particle distribution, polishing pad morphology and interface friction characteristics, and laying a reliable foundation for further clearing polishing essence, optimizing polishing process, improving polishing efficiency and reducing polishing cost.
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description.
Example 1:
the embodiment provides a chemical mechanical polishing detection device, including carrying out the work piece clamping part 2 of centre gripping to transparent work piece 1, be used for driving the drive division 3 of polishing pad 7 pivoted and its image acquisition portion 4 that is used for carrying out image acquisition to the surface appearance of polishing pad 7, be provided with pressure sensor 5 on work piece 1 and add the clamping part, pressure sensor 5 is used for measuring work piece 1 and is provided with the shooting region on the work piece 1 adds the clamping part owing to normal pressure that normal displacement produced under the polishing pressure effect, image acquisition portion 4 sees through the shooting region and carries out image acquisition to the surface appearance of polishing pad 7.
During detection, the workpiece 1 is fixed on the workpiece clamping part 2, the workpiece 1 is opposite to the shooting area, then the workpiece 1 is moved to the surface of the polishing pad 7, the driving part 3 drives the polishing pad 7 to polish the surface of the workpiece 1, the image acquisition part 4 aligns the polishing pad 7, and the image acquisition is carried out on the surface morphology of the polishing pad 7 through the shooting area and the workpiece 1; in the detection process, the workpiece 1 generates trace transverse deformation under the pressure action of the polishing pad 7, the trace deformation can cause the change of the measured value of the pressure sensor 5, so as to obtain the normal pressure borne by the workpiece 1, then the positive pressure value Fn borne by the workpiece 1 is obtained through calculation according to the rigidity and deformation coefficient of the workpiece 1, the torque M output by the driving part 3 in the actual rotation process can be determined through the conventional means in the prior art, M=f×L, f=Fn×mu (f is the friction force of the polishing interface, L is the equivalent moment applied by the polishing pad 7, mu is the friction coefficient of the polishing pad 7), mu is the known value obtained through calculation or measurement, mu can be obtained through calculation, and the relation between the friction coefficient of the friction interface and each parameter of the abrasive particles on the surface of the polishing pad 7 is obtained through multiple detection experiments by combining the image acquisition part 4 to acquire the surface morphology of the polishing pad 7 and changing the parameters such as the size, the shape, the number, the distribution state of the abrasive particles one by one.
Therefore, the surface morphology of the polishing pad 7 between polishing interfaces is captured in real time by the image acquisition device, the distribution change condition and the abrasion change condition of the polishing particles in the polishing process can be fully known, the surface friction coefficient change condition of the polishing pad 7 and the relation between the friction coefficient change condition and the parameters such as the distribution change and the abrasion change of the polishing particles can be obtained by analyzing through the monitoring of the stress condition of the polishing interfaces, the technical problem that the distribution of abrasive particles of the polishing interfaces, the morphology of the polishing pad 7 and the interface friction characteristics cannot be correlated is solved, and a reliable foundation is laid for further clearly polishing essence, optimizing a polishing process, improving polishing efficiency and reducing polishing cost.
In order to ensure that the image acquisition part 4 can acquire the overall surface morphology of the polishing pad 7, the area of the shooting area in the embodiment is larger than the area of the polishing pad 7, specifically, the shooting area in the embodiment is a shooting window 6 formed on the workpiece clamping part 2, the workpiece 1 is fixed below the shooting window 6 and is close to the shooting window 6 after being clamped, the polishing pad 7 is fixed below the workpiece 1, and the image acquisition part 4 is positioned above the workpiece clamping part 2 and is opposite to the shooting window 6 and the polishing pad 7, so that the surface morphology of the polishing pad 7 can be acquired in real time.
In order to reduce errors caused by uneven deformation of the workpiece 1, in this embodiment, 2 pressure sensors 5 are provided and are respectively located at two ends of a diagonal line of the workpiece 1 after being installed, and an average value of the two pressure sensors is taken to calculate the normal pressure of the polishing interface.
In order to collect the torque value of the polishing interface in real time, in this embodiment, the driving shaft of the driving portion 3 is provided with a torque sensor 8 for measuring torque, the driving portion 3 may specifically be a servo motor 9, the servo motor 9 drives a polishing disc for fixing the polishing pad 7 to rotate, and the transmission mode between the servo motor 9 and the polishing disc may be through coupling connection transmission, or may also be through worm and gear connection transmission, and the embodiment is not limited specifically.
Further, in this embodiment, the workpiece clamping portion 2 is provided with clamping grooves 10 for clamping the workpiece 1,2 clamping grooves 10 are relatively arranged, a fixing cavity 11 for placing the pressure sensor 5 is communicated with the side portion of each clamping groove 10, in this embodiment, the workpiece 1 is fixed by fixing bolts, and a plurality of bolt holes are formed in the clamping grooves 10, and the fixing bolts fix the workpiece 1 in the clamping grooves 10 by bolts.
In order to facilitate the movement of the fixed workpiece 1 and enable the workpiece to be in a proper position, in this embodiment, the workpiece clamping part 2 is fixed on a sliding block 12, the sliding block 12 is vertically and slidably arranged on a fixed bracket 13, the fixed bracket 13 is horizontally and slidably arranged on a base 14, a first lead screw 15 is arranged on the fixed bracket 13, a first nut is connected to the first lead screw 15, which is not shown in the figure, and is fixedly connected with the sliding block 12, a sliding block adjusting knob 16 is further arranged at the end part of the first lead screw 15, the first lead screw 15 is rotated by rotating the sliding block adjusting knob 16, so that the sliding block 12 is driven to move on the first lead screw 15, the position of the workpiece 1 in the vertical direction is adjusted, in order to ensure the moving stability of the sliding block 12, a first sliding groove 17 is further arranged on the fixed bracket 13, a first lug 18 which is in sliding fit with the first sliding groove 17 is arranged on the sliding block 12, a second lead screw 19 is arranged on the base 14, a second nut is not shown in the figure, the second lead screw 19 is connected to the second lead screw, the second nut is fixedly connected to the sliding block 12, a sliding block adjusting knob 16 is further arranged at the end part of the first lead screw 15, and the second lead screw 19 is further driven to move on the fixed bracket 19, and the second lead screw 19 is further fixedly arranged on the base 13, so that the second lead screw is in the horizontal direction is in order to ensure the moving stability of the sliding direction of the sliding block 12, and the sliding position of the workpiece is adjusted by rotating the second lead screw 19.
In the embodiment, the horizontal and vertical adjustment of the workpiece 1 adopts a ball screw structure, the adjustment precision is high, the adjustment range of the positive pressure of the workpiece 1 is large, the abrasion and distribution conditions of the grinding particles are convenient for researching the conditions of various pressures and torques, the detection result is more enriched, and the ball screw structure has small friction resistance and is very convenient to adjust.
In order to facilitate the adjustment of the position of the image acquisition portion 4, so that the image acquisition portion 4 can acquire a clear image, in this embodiment, the image acquisition portion 4 is slidably disposed on the image acquisition support, and the image acquisition portion 4 and the image acquisition support 23 can be matched through a ball screw structure as well as a gear-rack engagement manner, and the specific sliding structure can be realized by a person skilled in the art according to the prior art, and will not be described here.
The image acquisition part 4 comprises an industrial camera 24, an objective lens 25 of the industrial camera 24 faces the shooting area, and a focal length adjusting knob 26 for adjusting focal length is further arranged on the industrial camera 24.
In this embodiment, the driving part 3, the pattern capturing support and the base 14 thereof may be fixed on a working platform, and in order to reduce the movement of each component, the objective lens 25 of the industrial camera 24 is aligned with the polishing disk in the vertical direction, and the position of the driving part 3 is in the horizontal movement direction of the fixing frame.
In order to accurately adjust the position of the workpiece 1, the base 14, the fixed bracket 13 and the image acquisition bracket 23 are provided with graduated scales.
It should be understood by those skilled in the art that the present embodiment further includes a monitoring system, and the industrial camera 24, the torque sensor 8, and the pressure sensor 5 are electrically connected to the monitoring system, and analyze values of torque, pressure, etc. in real time, and store the acquired images.
Example 2:
the embodiment provides a detection method of a chemical mechanical polishing detection device, which comprises the following steps:
1) Fixing the polishing pad 7 to the polishing disk;
2) Placing the workpiece 1 into the clamping groove 10, pressing and fixing by using a fixing bolt, and adjusting the position of the workpiece clamping part 2 to enable the surface of the workpiece 1 to be tightly attached to the polishing pad 7;
3) Adjusting the position of the industrial camera 24 to enable the objective lens 25 to face the polishing pad 7, and then adjusting the focal length of the objective lens 25 to enable the industrial camera 24 to collect clear patterns of the surface morphology of the polishing pad 7;
4) Electrically connecting the industrial camera 24, the torque sensor 8, the pressure sensor 5 with the monitoring system;
5) The workpiece 1 is polished by the opening drive section 3.
And then, replacing the workpiece 1, distributing and changing the number, the size, the material, the distribution condition and other parameters of the grinding particles on the polishing pad 7, repeating the steps, and finally, summarizing and analyzing to obtain the relationship between the friction coefficient of the polishing interface and the number, the size, the material and the distribution condition of the grinding particles.
The adaptation to the actual need is within the scope of the invention.
It should be noted that it will be apparent to those skilled in the art that the present invention is not limited to the details of the above-described exemplary embodiments, but may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (9)
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| CN202110141359.0A CN112743445B (en) | 2021-02-02 | 2021-02-02 | A chemical mechanical polishing detection device and detection method thereof |
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| CN113858034B (en) * | 2021-09-18 | 2023-06-30 | 长江存储科技有限责任公司 | Polishing device, detection method of polishing device and polishing system |
| CN114648494B (en) * | 2022-02-28 | 2022-12-06 | 扬州市苏灵农药化工有限公司 | Pesticide suspending agent production control system based on factory digitization |
| CN115625571B (en) * | 2022-12-19 | 2023-06-23 | 江苏卓远半导体有限公司 | Method and system for monitoring diamond disk |
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| CN111469047A (en) * | 2020-04-14 | 2020-07-31 | 大连理工大学 | Test device for online detection of contact characteristics of polishing pad and use method thereof |
| CN211332748U (en) * | 2019-10-22 | 2020-08-25 | 宁波日晟新材料有限公司 | Fixture device for monocrystalline silicon wafer polishing machine |
| CN214322985U (en) * | 2021-02-02 | 2021-10-01 | 河南科技学院 | Chemical mechanical polishing detection device |
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| US6494765B2 (en) * | 2000-09-25 | 2002-12-17 | Center For Tribology, Inc. | Method and apparatus for controlled polishing |
| KR100432781B1 (en) * | 2001-03-22 | 2004-05-24 | 삼성전자주식회사 | Apparatus and method for measuring polishing pad |
| CN210997937U (en) * | 2019-06-19 | 2020-07-14 | 南京星合精密智能制造研究院有限公司 | Ultra-precise polishing system with machine vision |
| CN112139910A (en) * | 2020-10-28 | 2020-12-29 | 重庆川仪调节阀有限公司 | Valve seat grinding and clamping device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN211332748U (en) * | 2019-10-22 | 2020-08-25 | 宁波日晟新材料有限公司 | Fixture device for monocrystalline silicon wafer polishing machine |
| CN111469047A (en) * | 2020-04-14 | 2020-07-31 | 大连理工大学 | Test device for online detection of contact characteristics of polishing pad and use method thereof |
| CN214322985U (en) * | 2021-02-02 | 2021-10-01 | 河南科技学院 | Chemical mechanical polishing detection device |
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