CN112743445A - Chemical mechanical polishing detection device and detection method thereof - Google Patents
Chemical mechanical polishing detection device and detection method thereof Download PDFInfo
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- CN112743445A CN112743445A CN202110141359.0A CN202110141359A CN112743445A CN 112743445 A CN112743445 A CN 112743445A CN 202110141359 A CN202110141359 A CN 202110141359A CN 112743445 A CN112743445 A CN 112743445A
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- 238000005498 polishing Methods 0.000 title claims abstract description 138
- 238000001514 detection method Methods 0.000 title claims abstract description 34
- 239000000126 substance Substances 0.000 title claims abstract description 28
- 238000012876 topography Methods 0.000 claims abstract description 12
- 238000012544 monitoring process Methods 0.000 claims abstract description 8
- 230000009471 action Effects 0.000 claims abstract description 4
- 238000006073 displacement reaction Methods 0.000 claims abstract description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 1
- 239000002245 particle Substances 0.000 abstract description 22
- 238000009826 distribution Methods 0.000 abstract description 19
- 230000008859 change Effects 0.000 abstract description 15
- 230000002596 correlated effect Effects 0.000 abstract 1
- 238000007517 polishing process Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 238000005299 abrasion Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
本发明公开一种化学机械抛光检测装置及其检测方法，涉及化学机械抛光技术领域，包括对透明的工件进行夹持的工件夹持部、用于带动抛光垫转动的驱动部及其用于对抛光垫的表面形貌进行图像采集的图像采集部，工件加持部上设置有压力传感器，压力传感器用于测量工件在抛光压力作用下由于法向位移而产生的法向压力；本发明利用图像采集装置实时捕捉抛光界面间抛光垫的表面形貌，结合对抛光界面受力情况的监测，能够分析得到抛光垫表面摩擦系数变化情况，及其摩擦系数变化与研磨颗粒分布变化、磨损变化等参数之间的关系，解决了无法将抛光界面磨粒分布、抛光垫形貌与界面摩擦特性进行关联的技术问题。
The invention discloses a chemical mechanical polishing detection device and a detection method thereof, which relate to the technical field of chemical mechanical polishing, and include a workpiece clamping part for clamping a transparent workpiece, a driving part for driving a polishing pad to rotate, and a The image acquisition part for image acquisition of the surface topography of the polishing pad, the workpiece holding part is provided with a pressure sensor, and the pressure sensor is used to measure the normal pressure generated by the normal displacement of the workpiece under the action of polishing pressure; the present invention utilizes image acquisition The device captures the surface topography of the polishing pad between the polishing interfaces in real time. Combined with the monitoring of the force on the polishing interface, the change of the friction coefficient on the surface of the polishing pad can be analyzed and obtained. It solves the technical problem that the abrasive particle distribution at the polishing interface, the morphology of the polishing pad and the interface friction characteristics cannot be correlated.
Description
Technical Field
The invention relates to the technical field of chemical mechanical polishing, in particular to a chemical mechanical polishing detection device and a detection method thereof.
Background
Ultra-precision machining is an important direction in the field of mechanical manufacturing, and chemical mechanical polishing is one of the most common methods in ultra-precision machining. The distribution of abrasive particles and the frictional characteristics of the polishing interface during chemical mechanical polishing have been the focus of attention in the art.
The existence and distribution form of abrasive particles in a chemical mechanical polishing interface directly influence the surface quality of a polished part and influence scratches, rough appearance, performance consistency and material removal rate of the surface of a workpiece. However, the existing techniques cannot directly detect the existence and distribution of the abrasive particles in the polishing interface, and the chemical mechanical polishing process is usually formulated based on empirical estimation. The method comprises the following steps: the type and the size of the grinding particles are selected according to the types of the polishing workpiece and the polishing solution, and then the number of the required grinding particles is estimated according to the requirements of rough polishing and fine polishing. This empirical process is somewhat blind and lacks specific theoretical guidance.
Moreover, the essence of chemical mechanical polishing is the tribology problem of three-body interface, and the frictional force is one of the specific quantitative indexes of the interface friction characteristic and directly reflects the material removal rate characteristic in the chemical mechanical polishing interface. Therefore, the relation among the friction force of the polishing interface, the friction coefficient of the polishing surface, the size, the thickness, the distribution state and the abrasion state of the grinding particles is obtained, and the method has important guiding significance for making a more standard and more reasonable polishing process. Some of the existing polishing test machines can only measure the friction force in the polishing process or the surface rigidity of the polishing pad in a non-working state, such as the invention patent with the application number of 201810737394.7 named as the measuring device and the measuring method of the polishing friction force and the invention patent with the application number of 202010291933.6 named as the measuring device and the using method of the polishing pad in a micro-contact state, but both of the invention can not analyze the relation between the friction coefficient of a polishing interface and the distribution of abrasive particles and the shape of the polishing pad, and can not play a good role in guiding a more reasonable polishing process.
Disclosure of Invention
The invention aims to provide a chemical mechanical polishing detection device and a detection method thereof, which aim to solve the problems in the prior art, correlate the abrasive particle distribution of a polishing interface, the morphology of a polishing pad and the friction characteristic of the interface, and lay a reliable foundation for further clarifying the polishing essence, optimizing the polishing process, improving the polishing efficiency and reducing the polishing cost.
In order to achieve the purpose, the invention provides the following scheme: a chemical mechanical polishing detection device comprises a workpiece clamping part for clamping a transparent workpiece, wherein a pressure sensor is arranged on the workpiece clamping part and used for measuring the normal pressure of the workpiece generated by the normal displacement under the action of polishing pressure; the workpiece clamping part is also provided with a shooting area;
the polishing device also comprises a driving part for driving the polishing pad to rotate;
the polishing device further comprises an image acquisition part for acquiring images of the surface topography of the polishing pad, and the image acquisition part acquires the images of the surface topography of the polishing pad through the shooting area.
Preferably, the area of the photographing region is larger than the area of the polishing pad.
Preferably, the number of the pressure sensors is 2, and the pressure sensors are respectively located at two ends of a diagonal line after the workpiece is installed.
Preferably, a torque sensor for measuring torque is provided on a drive shaft of the drive unit.
Preferably, a clamping groove for clamping the workpiece is arranged on the workpiece clamping part, and the pressure sensor is arranged at the clamping groove; the clamping groove is also provided with a plurality of bolt holes, and the fixing bolts fix the workpiece in the clamping groove through the bolts.
Preferably, the workpiece clamping part is fixed on a sliding block, the sliding block is arranged on a fixed support in a sliding mode, and the fixed support is arranged on a base in a sliding mode.
Preferably, a first lead screw is arranged on the fixed support, a first nut is connected to the first lead screw, and the first nut is fixedly connected with the sliding block; the fixed support is further provided with a first sliding groove, and the sliding block is provided with a first protruding block in sliding fit with the first sliding groove.
Preferably, a second lead screw is arranged on the base, a second nut is connected to the second lead screw, and the second nut is fixedly connected with the fixed support; the base is further provided with a second sliding groove, and the fixed support is further provided with a second protruding block matched with the second sliding groove.
Preferably, the image acquisition part is arranged on the image acquisition support in a sliding mode, the image acquisition part comprises an industrial camera, an objective lens of the industrial camera is right opposite to the shooting area, and a focal length adjusting knob used for adjusting the focal length is further arranged on the industrial camera.
The invention also provides a detection method of the chemical mechanical polishing detection device, which comprises the following steps:
1) fixing a polishing pad on a polishing disk;
2) putting a workpiece into the clamping groove, pressing and fixing the workpiece by using a fixing bolt, and adjusting the position of a workpiece clamping part to enable the surface of the workpiece to be tightly attached to the polishing pad;
3) adjusting the position of an industrial camera to enable an objective lens to face a polishing pad, and then adjusting the focal length of the objective lens to enable the industrial camera to acquire a clear pattern of the surface appearance of the polishing pad;
4) electrically connecting the industrial camera, the torque sensor and the pressure sensor with a monitoring system;
5) and starting the driving part to polish the workpiece.
Compared with the prior art, the invention has the following technical effects:
1. the invention utilizes the image acquisition device to capture the surface appearance of the polishing pad between polishing interfaces in real time, can fully understand the distribution change condition and the abrasion change condition of the grinding particles in the polishing process, and can analyze and obtain the surface friction coefficient change condition of the polishing pad and the relationship between the friction coefficient change and the parameters of the distribution change, the abrasion change and the like of the grinding particles by combining the monitoring of the stress condition of the polishing interfaces, thereby solving the technical problem that the abrasive particle distribution of the polishing interfaces, the appearance of the polishing pad and the interface friction characteristic can not be associated, and laying a reliable foundation for further clarifying the polishing essence, optimizing the polishing process, improving the polishing efficiency and reducing the polishing cost;
2. according to the invention, the workpiece is made of transparent material, and the workpiece clamping part is provided with the transparent shooting area, so that a good structural basis is provided for the image acquisition device to acquire the surface appearance of the polishing pad;
3. according to the invention, the ball screw structure is adopted for horizontal and vertical adjustment of the workpiece, the adjustment precision is high, the adjustment range of the positive pressure of the workpiece is large, the abrasion and distribution conditions of grinding particles under the conditions of various pressures and torques can be conveniently researched, and the detection result is more enriched; and the ball screw structure has small friction resistance and is very convenient to adjust.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a front view of FIG. 1;
FIG. 3 is a schematic structural view of a workpiece clamping portion;
FIG. 4 is a top view of FIG. 3;
FIG. 5 is a cross-sectional view A-A;
FIG. 6 is a schematic view of a connection structure of a slider, a fixing bracket and a base according to the present invention;
wherein, 1, a workpiece; 2. a workpiece holding portion; 3. a drive section; 4. an image acquisition unit; 5. a pressure sensor; 6. a shooting window; 7. a polishing pad; 8. a torque sensor; 9. a servo motor; 10. a clamping groove; 11. a fixed cavity; 12. a slider; 13. fixing a bracket; 14. a base; 15. a first lead screw; 16. a slider adjusting knob; 17. a first chute; 18. a first bump; 19. a second lead screw; 20. fixing a bracket adjusting knob; 21. a second chute; 22. a second bump; 23. an image acquisition support; 24. an industrial camera; 25. an objective lens; 26. a focus adjusting knob.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention aims to provide a chemical mechanical polishing detection device and a detection method thereof, which aim to solve the problems in the prior art, correlate the abrasive particle distribution of a polishing interface, the morphology of a polishing pad and the friction characteristic of the interface, and lay a reliable foundation for further clarifying the polishing essence, optimizing the polishing process, improving the polishing efficiency and reducing the polishing cost.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Example 1:
the embodiment provides a chemical mechanical polishing detection device, including the work piece clamping part 2 that carries out the centre gripping to transparent work piece 1, a drive division 3 for driving polishing pad 7 pivoted and its image acquisition portion 4 that is used for carrying out image acquisition to polishing pad 7's surface topography, work piece 1 adds and is provided with pressure sensor 5 in holding the portion, pressure sensor 5 is used for measuring work piece 1 because normal displacement and the normal pressure that produces under the polishing pressure effect, work piece 1 adds and is provided with the shooting region in holding the portion, image acquisition portion 4 sees through the shooting region and carries out image acquisition to polishing pad 7's surface topography.
During detection, the workpiece 1 is fixed on the workpiece clamping part 2, the workpiece 1 is opposite to the shooting area, then the workpiece 1 is moved to the surface of the polishing pad 7, the driving part 3 drives the polishing pad 7 to polish the surface of the workpiece 1, the image acquisition part 4 is opposite to the polishing pad 7, and the surface appearance of the polishing pad 7 is acquired through the shooting area and the workpiece 1; in the detection process, the workpiece 1 generates a trace amount of transverse deformation under the pressure action of the polishing pad 7, the trace amount of deformation can cause the change of the measured value of the pressure sensor 5, so that the normal pressure applied to the workpiece 1 is obtained, and then the positive pressure value Fn applied to the workpiece 1 is calculated according to the rigidity and the deformation coefficient of the workpiece 1; the torque M output by the driving portion 3 during actual rotation can be determined by conventional means in the prior art, and M ═ f × L, f ═ Fn × μ (f is the polishing interface friction force, L is the equivalent moment of the force applied by the polishing pad 7, and μ is the polishing pad 7 interface friction coefficient), and M, L, Fn are known values obtained by calculation or measurement, so that μ can be calculated; the relationship between the friction coefficient of the friction interface and each parameter of the abrasive particles on the surface of the polishing pad 7 is obtained by combining the acquisition of the surface topography of the polishing pad 7 by the image acquisition part 4 and carrying out a plurality of detection experiments by changing the parameters of the size, the shape, the quantity, the distribution state and the like of the abrasive particles on the surface of the polishing pad 7 one by one.
Therefore, the embodiment captures the surface morphology of the polishing pad 7 between the polishing interfaces in real time by using the image acquisition device, can fully understand the distribution change condition and the abrasion change condition of the abrasive particles in the polishing process, and can analyze and obtain the surface friction coefficient change condition of the polishing pad 7 and the relationship between the friction coefficient change and the parameters such as the distribution change and the abrasion change of the abrasive particles in combination with the monitoring of the stress condition of the polishing interfaces, thereby solving the technical problem that the abrasive particle distribution of the polishing interfaces and the morphology of the polishing pad 7 can not be associated with the interface friction characteristic, and laying a reliable foundation for further clarifying the polishing essence, optimizing the polishing process, improving the polishing efficiency and reducing the polishing cost.
In order to ensure that the image acquisition part 4 can acquire the overall surface topography of the polishing pad 7, the area of the shooting area is larger than the area of the polishing pad 7 in the embodiment; specifically, in the present embodiment, the shooting area is a shooting window 6 formed on the workpiece clamping portion 2, the workpiece 1 is fixed behind the clamping portion and located below the shooting window 6 and close to the shooting window 6, the polishing pad 7 is fixed and located below the workpiece 1, the image acquisition portion 4 is located above the workpiece clamping portion 2 and directly faces the shooting window 6 and the polishing pad 7, and the surface topography of the polishing pad 7 can be acquired in real time.
In order to reduce the error caused by the non-uniform deformation of the workpiece 1, in the embodiment, 2 pressure sensors 5 are provided and respectively located at two ends of a diagonal of the workpiece 1 after installation, and the polishing interface normal pressure is calculated by taking the average value of the two.
In order to facilitate real-time collection of a polishing interface torque value, in this embodiment, a torque sensor 8 for measuring a torque is disposed on a driving shaft of the driving portion 3, the driving portion 3 may specifically be a servo motor 9, and the servo motor 9 drives a polishing disk for fixing the polishing pad 7 to rotate; the transmission mode between the servo motor 9 and the polishing disk may be transmission through coupling connection, or transmission through worm and gear connection, and the specific mode is not limited in this embodiment.
Further, in the embodiment, the workpiece clamping portion 2 is provided with 2 clamping grooves 10 for clamping the workpiece 1, the number of the clamping grooves 10 is 2, and a fixing cavity 11 for placing the pressure sensor 5 is communicated with the side portion of each clamping groove 10; in this embodiment, the workpiece 1 is fixed by a fixing bolt, and a plurality of bolt holes are formed in the clamping groove 10, and the fixing bolt fixes the workpiece 1 in the clamping groove 10 by the bolt.
In order to facilitate moving the fixed workpiece 1 to a proper position, in the embodiment, the workpiece clamping part 2 is fixed on a slide block 12, the slide block 12 is vertically and slidably arranged on a fixed bracket 13, and the fixed bracket 13 is horizontally and slidably arranged on a base 14; a first lead screw 15 is arranged on the fixed support 13, a first nut is connected to the first lead screw 15, which is not shown in the figure, the first nut is fixedly connected with the slide block 12, a slide block adjusting knob 16 is further arranged at the end part of the first lead screw 15, the first lead screw 15 is rotated by rotating the slide block adjusting knob 16, so that the slide block 12 is driven to move on the first lead screw 15, the position of the workpiece 1 in the vertical direction is adjusted, in order to ensure the moving stability of the slide block 12, a first sliding groove 17 is further arranged on the fixed support 13, and a first convex block 18 in sliding fit with the first sliding groove 17 is arranged on the slide block 12; similarly, the base 14 of this embodiment is provided with a second lead screw 19, the second lead screw 19 is connected with a second nut, which is not shown in the drawing, the second nut is fixedly connected with the bottom of the fixed bracket 13, and the end of the second lead screw 19 is further provided with a fixed bracket adjusting knob 20, the second lead screw 19 is rotated by rotating the fixed bracket adjusting knob 20, so as to drive the fixed bracket 13 to move on the second lead screw 19, and thus the position of the workpiece 1 in the horizontal direction is adjusted; in order to ensure the stability of the movement of the fixing bracket 13, a second sliding slot 21 is further provided on the base 14, and a second protrusion 22 matched with the second sliding slot 21 is further provided on the fixing bracket 13.
In the embodiment, the horizontal and vertical adjustment of the workpiece 1 adopts a ball screw structure, the adjustment precision is high, the adjustment range of the positive pressure of the workpiece 1 is large, the abrasion and distribution conditions of grinding particles under the conditions of various pressures and torques can be conveniently researched, and the detection result is more full; and the ball screw structure has small friction resistance and is very convenient to adjust.
In order to adjust the position of the image acquisition part 4 conveniently, so that the image acquisition part 4 can acquire clear images, the image acquisition part 4 is arranged on the image acquisition support in a sliding manner in the embodiment, the image acquisition part 4 and the image acquisition support 23 can be matched through a ball screw structure, and can also be matched through a gear and rack meshing manner, and the specific sliding structure can be realized by the technical personnel in the field according to the prior art, and is not repeated herein.
The image acquisition part 4 comprises an industrial camera 24, an objective lens 25 of the industrial camera 24 faces the shooting area, and a focal length adjusting knob 26 for adjusting the focal length is arranged on the industrial camera 24.
In this embodiment, the driving part 3, the image capturing frame and its base 14 can be fixed on the working platform, and in order to reduce the movement of each component, the objective lens 25 of the industrial camera 24 is aligned with the polishing disc in the vertical direction, and the driving part 3 is positioned in the horizontal moving direction of the fixing frame.
In order to accurately adjust the position of the workpiece 1, the base 14, the fixing support 13 and the image acquisition support 23 are provided with graduated scales.
It should be understood by those skilled in the art that a monitoring system is also included in the present embodiment, and the industrial camera 24, the torque sensor 8, and the pressure sensor 5 are all electrically connected to the monitoring system, so as to analyze the values of torque, pressure, etc. in real time and store the acquired images.
Example 2:
the embodiment provides a detection method of a chemical mechanical polishing detection device, which comprises the following steps:
1) fixing the polishing pad 7 on the polishing disk;
2) putting the workpiece 1 into the clamping groove 10, pressing and fixing the workpiece by using a fixing bolt, and adjusting the position of the workpiece clamping part 2 to enable the surface of the workpiece 1 to be tightly attached to the polishing pad 7;
3) adjusting the position of the industrial camera 24 to enable the objective lens 25 to be opposite to the polishing pad 7, and then adjusting the focal length of the objective lens 25 to enable the industrial camera 24 to acquire a clear pattern of the surface topography of the polishing pad 7;
4) electrically connecting the industrial camera 24, the torque sensor 8 and the pressure sensor 5 with a monitoring system;
5) the drive section 3 is turned on to polish the workpiece 1.
After the primary polishing is finished, calculating and summarizing to obtain the friction coefficient of a polishing interface and the change of the torque and the pressure of the polishing interface; and then replacing the workpiece 1, distributing and changing parameters such as the number, the size, the material quality, the distribution condition and the like of the grinding particles on the polishing pad 7, repeating the steps, and finally summarizing and analyzing to obtain the relation between the friction coefficient of the polishing interface and the number, the size, the material quality and the distribution condition of the grinding particles.
The adaptation according to the actual needs is within the scope of the invention.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (10)
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113858034A (en) * | 2021-09-18 | 2021-12-31 | 长江存储科技有限责任公司 | Polishing device, detection method of polishing device and polishing system |
| CN114648494A (en) * | 2022-02-28 | 2022-06-21 | 扬州市苏灵农药化工有限公司 | Pesticide suspending agent production control system based on factory digitization |
| CN115625571A (en) * | 2022-12-19 | 2023-01-20 | 江苏卓远半导体有限公司 | Monitoring method and system for diamond disk |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020037681A1 (en) * | 2000-09-25 | 2002-03-28 | Norm Gitis | Method and apparatus for controlled polishing |
| US20020137434A1 (en) * | 2001-03-22 | 2002-09-26 | Bong Choi | Method and apparatus for measuring properties of a polishing pad |
| CN210997937U (en) * | 2019-06-19 | 2020-07-14 | 南京星合精密智能制造研究院有限公司 | Ultra-precise polishing system with machine vision |
| CN111469047A (en) * | 2020-04-14 | 2020-07-31 | 大连理工大学 | Test device for online detection of contact characteristics of polishing pad and use method thereof |
| CN211332748U (en) * | 2019-10-22 | 2020-08-25 | 宁波日晟新材料有限公司 | Fixture device for monocrystalline silicon wafer polishing machine |
| CN112139910A (en) * | 2020-10-28 | 2020-12-29 | 重庆川仪调节阀有限公司 | Valve seat grinding and clamping device |
| CN214322985U (en) * | 2021-02-02 | 2021-10-01 | 河南科技学院 | Chemical mechanical polishing detection device |
-
2021
- 2021-02-02 CN CN202110141359.0A patent/CN112743445B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020037681A1 (en) * | 2000-09-25 | 2002-03-28 | Norm Gitis | Method and apparatus for controlled polishing |
| US20020137434A1 (en) * | 2001-03-22 | 2002-09-26 | Bong Choi | Method and apparatus for measuring properties of a polishing pad |
| CN210997937U (en) * | 2019-06-19 | 2020-07-14 | 南京星合精密智能制造研究院有限公司 | Ultra-precise polishing system with machine vision |
| CN211332748U (en) * | 2019-10-22 | 2020-08-25 | 宁波日晟新材料有限公司 | Fixture device for monocrystalline silicon wafer polishing machine |
| CN111469047A (en) * | 2020-04-14 | 2020-07-31 | 大连理工大学 | Test device for online detection of contact characteristics of polishing pad and use method thereof |
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| CN214322985U (en) * | 2021-02-02 | 2021-10-01 | 河南科技学院 | Chemical mechanical polishing detection device |
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| CN113858034A (en) * | 2021-09-18 | 2021-12-31 | 长江存储科技有限责任公司 | Polishing device, detection method of polishing device and polishing system |
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