CN112710878B - Detachable high-frequency testing device and vertical probe head thereof - Google Patents

Abstract

The invention discloses a detachable high-frequency testing device and a vertical probe head thereof. The detachable high-frequency testing device comprises a vertical probe head, a signal transmission piece arranged on the vertical probe head and a spacing conversion plate connected with the vertical probe head. The vertical probe head comprises a holder, a high-frequency transmission line and a grounding line, a plurality of conductive probes arranged on the holder in a penetrating way and a high-frequency probe detachably propped against the high-frequency transmission line, wherein the holder comprises a first guide plate unit and a second guide plate unit, and the high-frequency transmission line and the grounding line are formed on the inner surface of the second guide plate unit. The signal transmission member is connected to the high frequency transmission line such that the signal transmission member and the high frequency probe are electrically coupled to each other. The detachable high-frequency testing device and the vertical probe head thereof reduce signal loss generated in the transmission process of high-frequency signals and provide convenience for maintenance, mass production and adjustment through structural improvement.

Description

Detachable high-frequency test device and its vertical probe head

Technical field

The invention relates to a high-frequency testing device and a probe head thereof, and in particular to a detachable high-frequency testing device and a vertical probe head thereof.

Background technique

When using existing high-frequency test equipment, the high-frequency signal transmission process is too long and the high-frequency signal is easily attenuated, so it is easy to cause large signal loss during the transmission process of the high-frequency signal. Furthermore, since the existing test device cannot be disassembled, it is difficult or impossible to maintain the existing test device after its probe is broken, resulting in high maintenance costs. Therefore, how to reduce the signal loss caused by high-frequency signals during the transmission process through structural design improvements and how to quickly disassemble them has become one of the important issues to be solved in this project.

Therefore, the inventor believed that the above-mentioned defects could be improved, so he devoted himself to research and applied scientific principles, and finally proposed an invention that is reasonably designed and effectively improves the above-mentioned defects.

Contents of the invention

Embodiments of the present invention provide a detachable high-frequency testing device and its vertical probe head, which can effectively improve the possible defects of existing high-frequency testing devices and existing probe heads.

An embodiment of the present invention provides a detachable high-frequency testing device, which includes a vertical probe head, a signal transmission component and a pitch conversion plate. The vertical probe head includes a holder, a high-frequency transmission line and a ground line, a plurality of conductive probes and a high-frequency probe. The holder includes a first guide plate unit and a second guide plate unit spaced apart from each other. ; A high-frequency transmission line and a ground line are formed spaced apart from each other on an inner surface of the second guide plate unit facing the first guide plate unit; a plurality of conductive probes are set through the holding base, and Each of the conductive probes includes a probe end and a connection end respectively located on opposite outer sides of the holder; a high-frequency probe is set to penetrate the first guide plate unit but does not penetrate out. In the second guide plate unit, the high-frequency probe includes a penetration section located in the first guide plate unit, a high-frequency detection section extending from one end of the penetration section and passing through the holding base; a contact section extending from the other end of the penetration section, and the contact section detachably abuts the high-frequency transmission line; a signal transmission member installed on the holding base, and the signal The transmission component includes a signal transmission component and a grounding component. The signal transmission component is connected to the high-frequency transmission line, so that the signal transmission component and the high-frequency probe are electrically coupled to each other through the high-frequency transmission line. connected; a ground component surrounds part of the signal transmission component, and the ground component is connected to the ground line; and a spacing conversion plate is connected to the connection end of each of the conductive probes, but does not contact on the high-frequency probe.

Preferably, a part of the signal transmission member is located between the first guide plate unit and the second guide plate unit, and another part of the signal transmission member is located outside the holding base.

Preferably, the second guide plate unit is formed with a placement hole, and the position of the placement hole corresponds to the high-frequency transmission line and the ground line, and a part of the signal transmission member is provided in the placement hole, And another part of the signal transmission component is passed through the pitch conversion plate.

Preferably, the high-frequency transmission line includes two line segments and a tuning element spanning the two line segments, and the two line segments are respectively connected to the resistors of the high-frequency probe. joints and the signal transmission components.

Preferably, the tuning element is not connected to the ground line, and the first guide plate unit is formed with a through hole directly above the tuning element.

Preferably, the high-frequency probe is a spring pin, and the first guide plate unit includes at least one first sub-plate and a cover plate disposed on at least one of the first sub-plates, and the cover plate is located away from One side of the second guide plate unit holds the high-frequency probe so that the high-frequency probe can only move relative to the first guide plate unit in the high-frequency detection section.

Preferably, the first guide plate unit includes two first sub-plates that are offset from each other, and the high-frequency probe is positioned on the two first sub-plates.

Preferably, a portion of any of the conductive probes located between the first guide plate unit and the second guide plate unit has a first length, and a second length of the contact section is between 50% to 80% of the first length.

An embodiment of the present invention provides a vertical probe head of a detachable high-frequency testing device, which includes a holder, a high-frequency transmission line and a grounding line, a plurality of conductive probes and a high-frequency probe. The holding base includes a first guide plate unit and a second guide plate unit spaced apart from each other; a high-frequency transmission line and a ground line are formed spaced apart from each other on the second guide plate unit facing the first guide plate unit. An inner surface; a plurality of conductive probes, which are set through the holder, and each of the conductive probes includes a probe end and a connection end respectively located on opposite outer sides of the holder; and a high-frequency probe, which is set to penetrate the first guide plate unit but does not penetrate the second guide plate unit. The high-frequency probe includes a penetration section located in the first guide plate unit. , a high-frequency detection section extending from one end of the penetration section and passing through the holding base and a contact section extending from the other end of the penetration section, and the contact section can detachably abut against the The high frequency transmission line.

Preferably, the high-frequency transmission line includes two line segments and a tuning element spanning the two line segments, and one of the two line segments is connected to the high-frequency detector. In the contact section of the needle, the tuning element is not connected to the ground line; the first guide plate unit is formed with a through hole directly above the tuning element.

In summary, the detachable high-frequency testing device and its vertical probe head disclosed in the embodiments of the present invention can improve the existing high-frequency testing devices and existing probe heads through special structural design and matching. Needle defects. (For example: a vertical probe head is provided with a high-frequency transmission line and a high-frequency probe that is in contact with the high-frequency transmission line, and is used to perform high-frequency operation together with the signal transmission component connected to the high-frequency transmission line. Signal transmission; Furthermore, the detachable design of the detachable high-frequency test device and its vertical probe head makes its maintenance more convenient)

In order to further understand the characteristics and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, these descriptions and drawings are only used to illustrate the present invention and do not make any reference to the protection scope of the present invention. limit.

Description of drawings

Figure 1 is a partial cross-sectional schematic view of the first embodiment of the present invention.

Figure 2 is a partial top view of Figure 1 with an annular partition plate omitted.

Figure 3 is a partial cross-sectional schematic view of the second embodiment of the present invention.

FIG. 4 is a schematic diagram of using an electrical connector as the signal transmission component according to the third embodiment of the present invention.

Figure 5 is a partial top view of Figure 4 with the annular partition plate omitted.

FIG. 6 is a schematic diagram of a third embodiment of the present invention using a coaxial cable as the signal transmission component.

Figure 7 is a partial top view of Figure 6 with the annular partition plate omitted.

Figure 8 is a partial cross-sectional schematic diagram of the fourth embodiment of the present invention.

Figure 9 is a partial cross-sectional schematic view of the fifth embodiment of the present invention.

Figure 10 is a partial cross-sectional schematic view of the sixth embodiment of the present invention.

Detailed ways

Please refer to Figures 1 to 10, which are embodiments of the present invention. It should be noted that this embodiment corresponds to the relevant quantities and shapes mentioned in the drawings, and is only used to specifically illustrate the implementation of the present invention. , in order to facilitate understanding of the content of the present invention, but not to limit the protection scope of the present invention.

[First Embodiment]

As shown in Figures 1 and 2, this embodiment is a detachable high-frequency testing device 100, which can be used to test an object under test (not shown, such as a semiconductor wafer). The detachable high-frequency testing device 100 includes a vertical probe head 1, a signal transmission component 2 installed on the vertical probe head 1, and a pitch conversion board connected to the vertical probe head 1 3.

It should be noted that although the present invention is illustrated by using the vertical probe head 1 coupled with the signal transmission component 2 and the pitch conversion plate 3, the present invention is not limited thereto. That is to say, the vertical probe head 1 can be used alone (such as sold) or used in conjunction with other components. The structure of each component of the detachable high-frequency testing device 100 will be introduced below, and the connection relationship between the components of the detachable high-frequency testing device 100 will be explained in due course.

Referring to Figures 1 and 2, the vertical probe head 1 includes a holder 11, a high-frequency transmission line 12 and a ground line 13 formed on the holder 11. A plurality of conductive probes 14 on the holder 11 and a high-frequency probe 15 set on the holder 11 . The vertical probe head 1 is detachably assembled to the pitch conversion plate 3; that is to say, the vertical probe head 1 can be directly detached from the pitch conversion plate 3 to perform Maintain or replace other new vertical probe heads 1.

The holding base 11 includes a first guide plate unit 111 and a second guide plate unit 112 that are spaced apart from each other, and the first guide plate unit 111 and the second guide plate unit 112 are respectively located on the The upper part and the lower part of the holding base 11. In other words, the first guide plate unit 111 and the second guide plate unit 112 are spaced apart along a longitudinal direction L. In this embodiment, the first guide plate unit 111 and the second guide plate unit 112 are both substantially parallel to a transverse direction W, and the transverse direction W is perpendicular to the longitudinal direction L. In addition, the holding base 11 in this embodiment may also include an annular partition plate 113, so that the first guide plate unit 111 and the second guide plate unit 112 can clamp the annular partition plate 113 and set apart from each other.

In this embodiment, the first guide plate unit 111 includes two first sub-plates 1111, and the two first sub-plates 1111 are substantially parallel to the transverse direction W. It should be noted that in this embodiment, the two first sub-boards 1111 are not displaced from each other. However, in practical applications, the two first sub-boards 1111 can be positioned by being displaced from each other. Conductive probe 14 and the high-frequency probe 15 .

The first guide plate unit 111 is formed with a through hole 1112; that is, the through hole 1112 penetrates the two first sub-boards 1111. It should be noted that the shape, quantity, material of the first sub-board 1111 and the shape, size, formation position and other related properties of the through holes 1112 can be changed according to needs, and are not limited to this embodiment.

In this embodiment, the second guide plate unit 112 includes two second sub-plates 1121, and the two second sub-plates 1121 are substantially parallel to the transverse direction W. It should be noted that in this embodiment, the two second sub-boards 1121 are not displaced from each other. However, in actual application, the two second sub-boards 1121 can be positioned by being displaced from each other. Conductive probe 14.

Wherein, an inner surface 112a of the second guide plate unit 112 faces the first guide plate unit 111, that is to say, the inner surface 112a of the second guide plate unit 112 faces upward in FIG. 1 . Furthermore, the second guide plate unit 112 is formed with a mounting hole 1122 and a plurality of hole positions 112b, and defines a plurality of needle positions 112c. In this embodiment, the mounting hole 1122 penetrates the second guide plate unit 112, and the shape and size of the mounting hole 1122 can be changed according to requirements.

In this embodiment, the plurality of hole positions 112b are generally rectangular and are formed in the second guide unit 112 at intervals; the outlines of the plurality of needle positions 112c are defined as rectangular, and the plurality of needle positions 112c are formed in a rectangular shape. Bits 112c are spaced apart from each other. It should be noted that the number, shape, and position of the plurality of needle positions 112c and the plurality of hole positions 112b can be changed according to requirements, and are not limited to this embodiment. For example, in other embodiments not shown in the present invention, the plurality of needle positions 112c and the plurality of hole positions 112b may all be substantially circular.

In addition, the second guide plate unit 112 may be formed with a first groove 112d on the inner surface 112a, and the notch of the first groove 112d is directed upward in FIG. 1 . In this embodiment, the first groove 112d is located approximately below the high-frequency probe 15 in FIG. 1 , and the size of the first groove 112d is slightly larger than that of the high-frequency probe 15 adjacent to it. The size of one end of the inner surface 112a. In this way, part of the high-frequency probe 15 can be located (or fitted) in the first groove 112d, thereby better holding the high-frequency probe 15 and making the high-frequency probe The probe 15 is less likely to move in said transverse direction W.

As shown in FIG. 2 , the high-frequency transmission line 12 and the ground line 13 are formed on the inner surface 112 a of the second guide plate unit 112 at intervals, and the high-frequency transmission line 12 and the ground line 13 are spaced apart from each other. The position of the line 13 corresponds to the position of the mounting hole 1122 of the second guide plate unit 112 . In this embodiment, the high-frequency transmission line 12 is located in an area surrounded by the ground line 13 .

The high-frequency transmission line 12 includes two line segments 121 and a tuning element 122 (such as an inductor and/or capacitor) spanning the two line segments 121 . In this embodiment, the two line segments 121 are substantially parallel to the transverse direction W. As shown in FIG. 1 , among the two line segments 121 , the line segment 121 relatively on the left is connected to the high-frequency probe 15 , and the line segment 121 relatively on the right is connected to the high-frequency probe 15 . A signal transmission component 21 of the signal transmission component 2 (described in detail in subsequent descriptions). In other embodiments not shown in the present invention, the number of the tuning elements 122 may be two. That is to say, the number of the tuning elements 122 is at least one, and the number, shape and other related properties of the tuning elements 122 can be changed according to requirements.

Specifically, the line segment 121 located relatively on the left side is connected to a contact segment 153 of the high-frequency probe 15 (described in detail in subsequent descriptions). The tuning element 122 is not connected to the ground line 13 . In addition, the tuning element 122 is located directly below the through hole 1112 , so that the tuning element 122 can be easily repaired, adjusted, or relatedly set through the through hole 1112 .

A plurality of conductive probes 14 are set through the holder 11 , and each of the conductive probes 14 includes a probe end portion 141 and a connection end respectively located on two opposite outer sides of the holder 11 . Department 142. Specifically, the plurality of conductive probes 14 are set through the holes 112b of the first guide plate unit 111 and the second guide plate unit 112 .

In this embodiment, the conductive probes 14 are elongated, and the number of the conductive probes 14 is only illustrated as two in the drawings, but the number, shape, position and other details of the conductive probes 14 Relevant properties, etc. can be changed according to requirements and are not limited to this embodiment. It should be noted that the function of the conductive probe 14 can be defined according to design requirements. For example, the conductive probe 14 can be used for grounding, transmitting (low frequency) signals, or transmitting power, but this embodiment does not include limit.

The probe end portion 141 is located near the top of FIG. 1 , and the probe end portion 141 of each of the conductive probes 14 can be used to contact the object to be tested, so as to conduct testing on the object to be tested. Related tests. The connection end portion 142 is located adjacent to the lower side of FIG. 1 , and the connection end portion 142 of each conductive probe 14 is detachably connected to the pitch conversion plate 3 .

The high-frequency probe 15 is elongated and is set to penetrate the first guide plate unit 111 but does not penetrate the second guide plate unit 112 . In detail, the length of the high-frequency probe 15 is less than the length of any of the above-mentioned conductive probes 14, and the high-frequency probe 15 is located at the needle position 112c of the second guide plate unit 112 in Figure 2 above. The high-frequency probe 15 includes a penetration section 151 located in the first guide plate unit 111, a high-frequency detection section 152 extending from one end of the penetration section 151 and passing through the holding base 11, and a self-contained probe. A contact section 153 extends from the other end of the penetration section 151 . In this embodiment, the number of the high-frequency probes 15 is one, but the number, shape, position and other related properties of the high-frequency probes 15 can be changed according to needs and are not limited to this embodiment. .

As shown in FIG. 1 , the high-frequency detection section 152 of the high-frequency probe 15 is adjacent to the top of FIG. 1 . In other words, in this embodiment, the high-frequency detection section 152 penetrates the first guide plate unit 111 of the holding base 11 toward the upper side of FIG. 1 . The high-frequency detection section 152 can be used to contact the object to be tested, so as to perform relevant detection on the object to be tested.

The contact section 153 of the high-frequency probe 15 extends downward in FIG. 1 and penetrates the first guide plate unit 111 of the holder 11 . The contact section 153 detachably abuts the high-frequency transmission line 12 , so that the contact section 153 can be electrically coupled to the high-frequency transmission line 12 . Specifically, the contact section 153 detachably abuts the line section 121 of the high-frequency transmission line 12 at the pin position 112c.

In addition, in other embodiments not shown in the present invention, the vertical probe head 1 may also include two ground pins (not shown), which may have a length equal to that of the high-frequency probe 15 . The two ground pins are substantially parallel to the high-frequency probe 15 and are set through the first guide plate unit 111 . Specifically, the two ground pins may be located on opposite sides of the high-frequency probe 15 in FIG. 2 . One end of the ground pin can be connected to the object under test, and the other end of the ground pin can detachably bear against the part of the ground line 13 located on the pin position 112c, so as to detect the high frequency. Transmission line 12 provides ground for testing purposes.

It should be noted that in this embodiment, the shape of the grounding pins is elongated. However, the shape, quantity, size, material and other related properties of the grounding pins can be changed according to needs and are not based on this embodiment. Examples are limited. According to actual needs, the ground pin can be selectively installed or detached from the vertical probe head 1, and the vertical probe head 1 is not limited to including the ground pin.

The signal transmission component 2 is installed on the holding base 11 , and the signal transmission component 2 includes the signal transmission component 21 and a ground component 22 . As shown in FIG. 1 , in this embodiment, a part of the signal transmission member 2 is disposed in the placement hole 1122 , and the other part of the signal transmission member 2 passes through the pitch conversion plate 3 . It is worth mentioning that the signal transmission component 2 can be an electrical connector or a coaxial cable, and the signal transmission component 2 of this embodiment is not limited thereto. For example, in this embodiment, the signal transmission component 2 is an electrical connector, and the signal transmission component 21 of the signal transmission component 2 corresponds to a conductive element of the electrical connector. Terminal; the ground component 22 of the signal transmission component 2 corresponds to a metal shell of the electrical connector and at least one ground pin thereof.

The signal transmission component 21 is connected to the high-frequency transmission line 12 , so that the signal transmission component 21 and the high-frequency probe 15 are electrically coupled to each other through the high-frequency transmission line 12 . In detail, the signal transmission component 21 is connected to the line segment 121 located relatively on the right side of the two line segments 121 of the high-frequency transmission line 12, and is further connected to the two line segments 121 through the tuning element 122. The line section 121 is connected to the high-frequency probe 15 by connecting the line section 121 on the left side of the two line sections 121, so that the signal transmission component 21 can communicate with the high-frequency probe. 15 are electrically coupled to each other.

The ground component 22 surrounds part of the signal transmission component 21, and is connected to the ground line 13 to provide grounding. Specifically, as shown in FIG. 2 , the position where the signal transmission component 21 is connected to the high-frequency transmission line 12 is located inside the multiple positions where the ground component 22 is connected to the ground line 13 . However, this embodiment does not limit the shape and quantity of the ground components 22 .

As shown in FIG. 1 , the pitch conversion plate 3 is located below in FIG. 1 . The pitch conversion plate 3 is (detachably) connected to the connection end 142 of each conductive probe 14 but does not contact the high-frequency probe 15 . It should be noted that the pitch conversion plate 3 can be a printed circuit board structure, and the material, formation position and other related properties of the pitch conversion plate can be changed according to needs, and are not limited to this embodiment.

[Second Embodiment]

Please refer to Figure 3, which is a second embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment, so the similarities between the two embodiments will not be described in detail, and the differences between the two embodiments will not be repeated. A rough description is as follows:

Each of the conductive probes 14 has a first length L1 between the first guide plate unit 111 and the second guide plate unit 112 . The contact section 153 has a second length L2, and the second length L2 of the contact section 153 is between 50% and 80% of the first length L1 of the conductive probe.

In this embodiment, the second guide plate unit 112 can be thickened, so that the second length L2 can be shortened, so that the second length L2 is between the first length L1 of the conductive probe. 50% to 80%. It should be noted that the method of making the second length L2 range from 50% to 80% of the first length L1 may vary according to the design. For example, in other embodiments not shown in the present invention, the high-frequency transmission line 12 may also be elevated or thickened, so that the second length L2 is between 50% of the first length L1 ~80%.

[Third Embodiment]

Please refer to FIG. 4 to FIG. 7 , which is a third embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment, so the similarities between the two embodiments will not be described again. The two embodiments The differences are roughly explained as follows:

A part of the signal transmission member 2 is located between the first guide plate unit 111 and the second guide plate unit 112 , and another part of the signal transmission member 2 is located outside the holding base 11 . Similar to the first embodiment, the signal transmission member 2 may be the electrical connector or a coaxial cable, and in FIGS. 4 and 5 of this embodiment, the signal transmission member 2 is Take the electrical connector as an example. In addition, in FIGS. 6 and 7 of this embodiment, the signal transmission component 2 takes the coaxial cable as an example, and the signal transmission component 21 of the signal transmission component 2 corresponds to the A core wire of the coaxial cable; the ground component 22 of the signal transmission component 2 corresponds to a ground braid of the coaxial cable.

[Fourth Embodiment]

Please refer to Figure 8, which is a fourth embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment, so the similarities between the two embodiments will not be described in detail, and the differences between the two embodiments will not be repeated. A rough description is as follows:

The first guide plate unit 111 and the second guide plate unit 112 may be offset from each other along the transverse direction W, so that the plurality of conductive probes 14 are generally curved. Accordingly, when the vertical probe head 1 is in operation (for example, the probing end 141 of the conductive probe 14 is connected to the object under test or the connection end of the conductive probe 14 When the portion 142 is connected to the pitch conversion plate 3), the curved design of the plurality of conductive probes 14 can provide buffering and avoid damage to the plurality of conductive probes 14. It should be noted that the conductive probe 14 is not limited to a curved shape and can be changed according to needs; in addition, the degree and position of the curved shape of the conductive probe 14 can be changed according to needs. This embodiment is here No restrictions.

The contact section 153 of the high-frequency probe 15 can be shaped into a substantially bent shape when it is formed (that is, the high-frequency probe 15 does not pass through the first guide plate unit 111 and the second guide plate unit that are offset from each other). 112 and in a bent shape), so that the high-frequency probe 15 can operate (for example, the penetration section 151 is connected to the object under test or the contact section 153 is pressed against the high-frequency probe 15 ). When the frequency transmission line 12 is used), the bent design of the contact section 153 can provide buffering. It should be noted that the contact section 153 of the high-frequency probe 15 is not limited to a curved shape, and can be changed according to requirements; in addition, the contact section 153 of the high-frequency probe 15 is curved. The degree and position of the fold shape can be changed according to requirements, and are not limited in this embodiment.

In addition, in this embodiment, the first guide plate unit 111 may include two first sub-panels 1111 that are offset from each other, and the two first sub-panels 1111 are offset along the transverse direction W. Through the engagement of the conductive probes 14 and the two first sub-boards 1111 that are offset from each other, a plurality of the conductive probes 14 can be better positioned on the holding base 11, and a plurality of the The conductive probe 14 is less susceptible to movement in said transverse direction W. Similarly, through the engagement of the high-frequency probes 15 and the two first sub-boards 1111 that are offset from each other, the plurality of high-frequency probes 15 can be better positioned on the holding base 11, And the plurality of high-frequency probes 15 are less likely to move in the transverse direction W. It should be noted that the first guide plate unit 111 is not limited to including two first sub-boards 1111 that are offset from each other, and the direction and degree of mutual offset of the two first sub-boards 1111 can be determined according to the requirements. Changes are not limited to this embodiment.

Similarly, in this embodiment, the second guide plate unit 112 may also include two second sub-panels 1121 that are offset from each other, and the second sub-panels 1121 are offset along the transverse direction W. Through the engagement of the conductive probes 14 and the two second sub-boards 1121 that are offset from each other, a plurality of the conductive probes 14 can be better positioned on the holding base 11, and a plurality of the conductive probes 14 can be better positioned on the holding base 11. The conductive probe 14 is less susceptible to movement in said transverse direction W. It should be noted that the second guide plate unit 112 is not limited to including two second sub-boards 1121 that are offset from each other, and the direction and degree of mutual offset of the two second sub-boards 1121 can be determined according to requirements. Changes are not limited to this embodiment.

[Fifth Embodiment]

Please refer to FIG. 9 , which is a fifth embodiment of the present invention. This embodiment is similar to the above-mentioned fourth embodiment, so the similarities between the two embodiments will not be described in detail. The differences between the two embodiments will not be repeated. A rough description is as follows:

The penetration section 151 of the high-frequency probe 15 may be formed with a second groove 15a, and the second groove 15a corresponds to the position of one of the first sub-boards 1111. Accordingly, through the structural design and matching of the second groove 15a and the two first sub-boards 1111 that are offset from each other (for example, the corresponding first sub-board 1111 is partially fitted into the second sub-board). Groove 15a), the high-frequency probe 15 can be better positioned on the holding base 11 and is less likely to move in the transverse direction W. It should be noted that the position and size of the second groove 15a can be changed according to requirements, and the high-frequency probe 15 is not limited to having the second groove 15a.

[Sixth Embodiment]

Please refer to Figure 10, which is a sixth embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment, so the similarities between the two embodiments will not be described in detail, and the differences between the two embodiments will not be repeated. A rough description is as follows:

In this embodiment, the high-frequency probe 15 is a pogo pin, the number of the first sub-boards 1111 included in the first guide plate unit 111 is one, and the first guide plate unit 111 also includes a cover plate 1113 provided on the first sub-board 1111. That is to say, the number of the first sub-boards 1111 included in the first guide plate unit 111 is at least one. The cover plate 1113 is located on the side away from the second guide plate unit 112 and holds the high-frequency probe 15 so that the high-frequency probe 15 can only use the high-frequency detection section 152 relative to the The first guide plate unit 111 moves.

In detail, the cover plate 1113 is located above the first sub-board 1111 in FIG. 10 , and the cover plate 1113 holds the high-frequency probe 15 along the transverse direction W, so that the The high-frequency probe 15 is preferably held on the first guide plate unit 111 . It should be noted that the shape, installation position and other related properties of the cover 1113 can be changed according to requirements, and this embodiment is not limited thereto.

[Technical effects of the embodiments of the present invention]

To sum up, the detachable high-frequency testing device and its vertical probe head disclosed in the present invention can improve the existing high-frequency testing device and the existing probe head through special structural design and matching. Defects. (For example: a vertical probe head is provided with a high-frequency transmission line and a high-frequency probe that is in contact with the high-frequency transmission line, and is used to perform high-frequency operation together with the signal transmission component connected to the high-frequency transmission line. signal transmission; furthermore, the detachable design of the detachable high-frequency test device and its vertical probe head makes its maintenance more convenient).

Furthermore, the detachable high-frequency testing device and its vertical probe head are improved through structural improvements (for example: the vertical probe head is detachable from the detachable high-frequency testing device, The second length is between 50% and 80% of the first length, the first guide plate unit is formed with a through hole directly above the tuning element, and the second guide plate unit is formed with a placement hole, And the position of the placement hole corresponds to the high-frequency transmission line and the ground line), thereby reducing signal loss generated during the transmission process of high-frequency signals and providing convenience in maintenance, mass production, and adjustment.

The contents disclosed above are only preferred and feasible embodiments of the present invention and do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the patent scope of the present invention. Inside.

Claims (10)

1. A detachable high frequency testing device, comprising:

a vertical probe head comprising:

a holder including a first guide unit and a second guide unit disposed at intervals;

a high frequency transmission line and a ground line formed at an inner surface of the second guide plate unit facing the first guide plate unit with a spacing therebetween;

the conductive probes are arranged on the fixing seat in a penetrating mode, and each conductive probe comprises a needle testing end part and a connecting end part which are respectively arranged on two opposite outer sides of the fixing seat; and

The high-frequency probe is arranged in the first guide plate unit in a penetrating way, but does not penetrate through the second guide plate unit, and comprises a penetrating section positioned in the first guide plate unit, a high-frequency detection section extending from one end of the penetrating section and penetrating through the holder, and an abutting section extending from the other end of the penetrating section, wherein the abutting section can be detachably abutted against the high-frequency transmission line; a signal transmission member mounted to the holder, and comprising:

a signal transmission part connected to the high frequency transmission line such that the signal transmission part and the high frequency probe are electrically coupled to each other through the high frequency transmission line; and

A ground member surrounding a portion of the signal transmission member, and the ground member being connected to the ground line; and

a pitch conversion plate connected to the connection end of each of the conductive probes but not in contact with the high frequency probe.

2. The detachable high frequency testing device of claim 1, wherein a portion of the signal transmission member is located between the first guide plate unit and the second guide plate unit, and another portion of the signal transmission member is located outside the holder.

3. The detachable high frequency test apparatus of claim 1, wherein the second guide plate unit is formed with a mounting hole, and the position of the mounting hole corresponds to the high frequency transmission line and the ground line, a portion of the signal transmission member is disposed in the mounting hole, and another portion of the signal transmission member is disposed through the space transformer.

4. The detachable high-frequency testing device according to claim 1, wherein the high-frequency transmission line comprises two line sections and a tuning element connected across the two line sections, and the two line sections are respectively connected to the abutting section of the high-frequency probe and the signal transmission component.

5. The detachable high frequency test apparatus of claim 4, wherein the tuning element is not connected to the ground line, and the first guide unit is formed with a through hole directly above the tuning element.

6. The detachable high-frequency testing apparatus according to claim 1, wherein the high-frequency probe is a pogo pin, the first guiding plate unit includes at least one first sub-board and a cover board disposed on at least one of the first sub-boards, the cover board is located at a side far from the second guiding plate unit and holds the high-frequency probe so that the high-frequency probe can only move relative to the first guiding plate unit with the high-frequency detecting section.

7. The detachable high-frequency testing apparatus according to claim 1, wherein the first guide unit includes two first sub-boards disposed offset from each other, and the high-frequency probe is positioned at the two first sub-boards.

8. The detachable high frequency test apparatus of claim 1, wherein a portion of any one of the conductive probes between the first guide unit and the second guide unit has a first length, and a second length of the abutting section is 50% -80% of the first length.

9. A vertical probe head of a detachable high frequency testing device, the vertical probe head comprising:

a holder including a first guide unit and a second guide unit disposed at intervals;

a high frequency transmission line and a ground line formed at an inner surface of the second guide plate unit facing the first guide plate unit with a spacing therebetween;

the conductive probes are arranged on the fixing seat in a penetrating mode, and each conductive probe comprises a needle testing end part and a connecting end part which are respectively arranged on two opposite outer sides of the fixing seat; and

the high-frequency probe is arranged in the first guide plate unit in a penetrating mode, but does not penetrate through the second guide plate unit, and comprises a penetrating section, a high-frequency detection section and an abutting section, wherein the penetrating section is arranged in the first guide plate unit, the high-frequency detection section extends out of the fixing seat from one end of the penetrating section, the abutting section extends from the other end of the penetrating section, and the abutting section can be detachably abutted against the high-frequency transmission line.

10. The vertical probe head of the detachable high frequency testing apparatus according to claim 9, wherein the high frequency transmission line comprises two line sections and a tuning element connected across the two line sections, and one of the two line sections is connected to the abutting section of the high frequency probe, and the tuning element is not connected to the grounding line; the first guide plate unit is provided with a through hole formed right above the tuning element.