CN101738509A - High-frequency vertical probe device - Google Patents

Abstract

The invention discloses a vertical probe device, which is used for transmitting a high-frequency test signal and the accompanying ground potential thereof to an electronic element of a wafer to be tested, and is provided with an adapter plate for receiving the high-frequency test signal and the ground potential, the output signals are respectively received by a signal needle and at least one compensation needle, after the ground potential is transmitted to the compensation needle, the compensation needle is stably and effectively electrically contacted with two ground layers which are mutually conducted from top to bottom, a ground loop is conducted to the ground potential arranged on the electronic element through the ground layers, and the high-frequency test signal received by the electronic element maintains the characteristic impedance.

Description

High frequency vertical probe device

technical field

The invention relates to a vertical probe card, in particular to a vertical probe card for transmitting high-frequency test signals.

Background technique

With the rapid development of semiconductor technology, electronic components are becoming more and more high-speed and high-frequency operating conditions. The design of the electrical test probe card also needs to focus on high-frequency test conditions to achieve the integrity of test signal transmission; for high-density applications As far as vertical probe cards for component testing are concerned, most of the general probe card circuit designs can be laid out through a variety of high-frequency transmission lines to meet the signal transmission conditions. However, when the high-frequency test signal is transmitted to the probe, the dielectric environment around the probe The parasitic capacitance effect of the test signal or the crosstalk phenomenon between adjacent probes during the round-trip process of the test signal often results in a situation where the transmission impedance of the high-frequency test signal does not match, resulting in a high loss of the signal actually received by the test component, that is, the effective gain frequency width cannot meet the required high-frequency test conditions.

Figure 1 shows a "vertical probe card" proposed by the inventor of this case on August 18, 2006. It was published in China as the No. 200811444 patent on March 1, 2008. The vertical probe card 10 of the transmission condition is set in the assembly design of the probe 11, and the compensation probe 112 that provides the impedance matching function of the signal probe 111 passes through the probe guide plates 121 and 122 and contacts the lower guide plate 122 at the same time. The conductive layer 13 can make all the compensation probes 112, the grounding probes 113 and the conductive layer 13 electrically connected to the ground potential, so as to meet the characteristic impedance requirement of maintaining the signal probe 111 to transmit high-frequency test signals.

However, since the probe 11 has an elastic bending and stretching structure inside the probe base 12, it is beneficial to achieve the best electrical contact effect between the tip of the electronic component to be tested and the electronic component to be tested during the test. Therefore, although the probes 11 can just pass through the probe guide plates 121, 122, they are not completely firmly combined with them, but the perforation of the lower guide plate 122 can undergo longitudinal displacement when touching the electronic component to be tested, so After long-term testing, unnecessary wear and tear between the conductive layer 13 and the grounding probe 113 is unavoidable, reducing the electrical conduction effect between the compensation probe 112 , the grounding probe 113 and the conductive layer 13 .

In view of this, the inventors of the present case have made great efforts to improve the above defects in order to provide high-quality and high-reliability high-frequency electrical measurement probes to meet the actual electrical measurement conditions and operating characteristics.

Contents of the invention

Therefore, the main purpose of the present invention is to provide a vertical probe device, which can make the wafer-level electrical measurement engineering meet the transmission conditions of high-frequency electrical measurement signals with a high-quality signal transmission structure.

In order to achieve the purpose disclosed above, a vertical probe device provided by the present invention includes an adapter plate, a probe base and a plurality of probes, and the high-frequency test signal and its accompanying ground potential are output from the adapter plate After being received by a signal pin and at least one compensation pin respectively, not only the high-frequency test signal is transmitted to the signal pin to have impedance matching characteristics, but also the ground potential is transmitted to the at least one compensation pin, and the upper and lower mutual The two conductive ground layers make the ground loop conduct to a ground pin, so that the ground potential set by the high-frequency electronic component touched by the ground pin, and then the high-frequency electronic component received by the signal pin touch The test signal maintains its characteristic impedance; moreover, through the stable and effective electrical contact between the at least one compensation pin and the two ground planes, it can avoid the interruption of the ground loop of the high-frequency test signal and the occurrence of characteristic impedance mismatch. reflection loss phenomenon.

Hereinafter, some preferred embodiments are listed in conjunction with the diagrams, in order to describe the structure and effect of the present invention in detail, wherein the brief description of the diagrams used is as follows:

Description of drawings

FIG. 1 is a schematic structural view of an existing vertical probe card;

Fig. 2 is a schematic structural diagram of the first preferred embodiment provided by the present invention applied to a probe card;

FIG. 3A is a schematic structural diagram of a second preferred embodiment of the present invention applied to a probe card;

Figure 3B is a sectional view of the 3B-3B line in Figure 3A, and Figure 3C is a sectional view of the 3C-3C line in Figure 3A;

Fig. 4A is a schematic structural view of the third preferred embodiment of the present invention applied to a probe card; Fig. 4B is a sectional view of the 4B-4B line in Fig. 4A, and Fig. 4C is a sectional view of the 4C-4C line in Fig. 4A;

Fig. 5 is a schematic structural diagram of a fourth preferred embodiment provided by the present invention applied to a probe card;

Fig. 6 is a schematic structural diagram of a fifth preferred embodiment provided by the present invention applied to a probe card;

Fig. 7 is a schematic structural diagram of a sixth preferred embodiment provided by the present invention applied to a probe card;

Fig. 8 is a schematic structural diagram of a seventh preferred embodiment provided by the present invention;

Fig. 9 is a schematic structural view of an eighth preferred embodiment provided by the present invention;

Fig. 10 is a schematic structural diagram of a ninth preferred embodiment provided by the present invention;

Fig. 11 is a schematic structural diagram of a tenth preferred embodiment provided by the present invention;

Fig. 12 is a schematic structural view of an eleventh preferred embodiment provided by the present invention;

Fig. 13 is a schematic structural diagram of a twelfth preferred embodiment provided by the present invention.

[Description of main component symbols]

1, 2, 2’, 2”, 3, 4, 5, 6, 7, 7’, 8, 9 vertical probe units

100 circuit boards 110 seat body

120 Transmission Lines 121, 71, 81 Signal Lines

122, 72, 82 ground wire

20, 20’, 70, 70’, 80, 85 adapter plate

201, 701, 801 top surface 202, 702, 802 bottom surface

21 through holes 22 conductive contacts

221, 73, 83 signal contacts 222, 74, 84 grounding contacts

30, 50, 60, 90 probe base 31, 51, 61, 91 upper guide plate

311, 331 inside 312, 332 periphery

32, 35, 35’, 35”, 52, 37, 75, 86 upper ground plane

321, 341, 521, 371, 381 openings

33, 53, 62, 92 lower guide plate

34, 36, 36', 54, 38, 93 lower ground plane

531, 541 concave part 55 locking element

611, 621 through hole 612, 622 insulation layer

40 probes 41 signal pins

42 grounding pin 43 first compensation pin

44 second compensation pin

Detailed ways

Please refer to the first preferred embodiment provided by the present invention as shown in FIG. 2, which is a vertical probe device 1 for being arranged on the probe card circuit board 100, and can provide multiple transmission lines required for high-frequency testing. 120 is electrically connected, and the transmission line 120 includes a signal line 121 that transmits a high-frequency test signal and a ground line 122 that provides ground potential or maintains the characteristic impedance of the high-frequency test signal, so that the high-frequency electrical test signal is transmitted from the circuit board 100 It is transmitted to the probe device 1 through each of the signal lines 121; of course, the probe device provided by the present invention does not limit the applied circuit transmission space structure, taking the one used in this embodiment as an example, it is the above-mentioned patent disclosure No. No. 200811444 provides the circuit board and transmission line structure, the transmission line 120 is jump-connected to the space above the circuit board 100, and then connected to the probe device 1 provided by the present invention through the seat body 110 in the center of the circuit board 100. , so as to transmit the electrical measurement signal received by the circuit board 100 to the probe device 1; in addition, the inventor filed a patent application No. 96134978 on September 19, 2007 in the Republic of China A kind of "high-speed test device", the vertical probe set disclosed in the high-speed test device can also be replaced by the probe device 1 provided by the present invention, and the effect that the present invention intends to provide can also be brought into play; therefore, based on the above-mentioned electrical Sex transmission structure, the probe device 1 includes an adapter plate 20, a probe base 30 and a plurality of probes 40, wherein:

The adapter plate 20 is made of insulating material, and has a top surface 201, a bottom surface 202, a plurality of through holes 21 and conductive contacts 22, the top surface 201 is connected to the bottom of the base body 110, and the The through hole 21 penetrates from the top surface 201 to the bottom surface 202 and is respectively provided with the conductive contact 22 on the bottom surface 202, so that each signal line 121 can be electrically connected to the conductive contact 22 on the bottom surface 202 after passing through the through hole 21 And corresponding to a signal contact 221 , each of the ground wires 122 is electrically connected to the conductive contact 22 after passing through the through hole 21 and corresponds to a ground contact 222 .

The probe holder 30 is arranged on the bottom surface 202 of the adapter plate 20, and has an upper guide plate 31 and a lower guide plate 33, which are made of insulating material, for setting the probe 40, each of the guide plates 31, 33 An upper ground layer 32 and a lower ground layer 34 are correspondingly arranged respectively. The two ground layers 32, 34 have specific layout patterns according to the test conditions of the chip electronic components that the probe 40 needs to touch. The example provided is to attach a metal film to the two guide plates 31, 33 by attaching copper foil or by preparing a film, and an opening 321, 341 is formed at a position corresponding to the signal contact 221, so that the The openings 321 , 341 can pass through the corresponding probes 40 without being electrically connected to the ground layers 32 , 34 .

The probe 40 is divided into a signal pin 41, a ground pin 42, a first compensation pin 43 and a second compensation pin 44; each of the signal pin 41 and the ground pin 42 is to pass through the two guide plates 31, 33 to maintain the needle vertical state, so that the needle tip at one end protrudes from the lower guide plate 33 to contact the high-frequency test contact and the ground contact of the electronic component to be tested respectively, and the other end is electrically connected to the signal provided on the adapter board 20 respectively. contact 221 and ground contact 222, and the signal pin 41 passes through the openings 321, 341 of the two ground layers 32, 34 to maintain electrical isolation from the two ground layers 32, 34 when passing through the probe base 30. To effectively transmit the high-frequency test signal from the signal line 121, of course, the ground pin 42 provided by the present invention is mainly a functional structure that is electrically connected to the upper ground layer 32. Therefore, the ground pin 42 and the ground contact are exemplified in this embodiment. 222, the structure connected to each other is only to facilitate its setting and is an unnecessary connection structure; each of the first compensation pins 43 is arranged side by side with the signal pin 41, and the two ends are respectively fixed on the upper guide plate 31 and against the upper guide plate 31. The lower guide plate 33 maintains one end electrically contacting the lower grounding layer 34 laid by the lower guide plate 33, and the other end is electrically connected to the ground contact 222 adjacent to the signal contact 221; each of the second compensation pin 44 and the The first compensation pin 43 is also connected to the lower ground layer 34, and provides a current loop between the two ground layers 32, 34 and the ground pin 42, so that the ground potential required to maintain the characteristic impedance of the high-frequency test signal passes through After the first compensation pin 43 is transmitted to the lower ground layer 34, it can be effectively transmitted to the upper ground layer 32 and the ground pin 42 through the second compensation pin 44; The medium of the grounding layers 32,34, therefore does not limit the need to pass through the upper guide plate 31, if only against the two grounding layers 32,34 can also have the same effect; of course, because the two compensation pins 43,44 and As the transmission medium of the ground current required for high-frequency signals, it is not limited to use needle-shaped structures to achieve its functional characteristics. Any metal conductors and wires with current conduction characteristics can be applied to the present invention to achieve the desired effect. .

Therefore, when the probe device 1 transmits a high-frequency test signal to the electronic component touched by the signal pin 41 and the ground pin 42, it can pass through the signal line 121, the signal pin 41, the ground pin 42, the first compensation pin 43 and The ground wire 122 forms a complete high-frequency test signal transmission loop; and each of the first compensation pins 43 is arranged side by side at a specific distance adjacent to each of the signal pins 41, and cooperates with the lower ground layer 34, the second compensation pin 44, The upper ground layer 32 and the ground pin 42 form a complete ground loop, effectively maintaining the characteristic impedance of the high-frequency test signal received by the high-frequency electronic component touched by the signal pin 41 . Furthermore, on the lower guide plate 33, the signal pins 41 and the ground pins 42 used to touch the electronic components have the function of longitudinal elastic displacement, so as to provide the tips of the signal pins 41 and the ground pins 42 to touch to the ground at the same time. Each electronic component on the wafer to be tested has the best electrical contact effect, but under long-term testing, unnecessary wear and tear will inevitably occur between the grounding layer 34 and the grounding probe 42 arranged on the lower guide plate 33, making the grounding pin 42 It is difficult to maintain a good electrical contact with the lower ground layer 34, so the stable and effective electrical contact between the two compensation pins 43, 44 and the two ground layers 32, 34 can avoid the high-frequency measurement signal The reflection loss phenomenon caused by the mismatch of the characteristic impedance is caused by the interruption of the ground loop, so the probe device 2 provided by the present invention can more effectively maintain the integrity of the transmission of the high-frequency test signal to the electronic component under test than the prior art.

It is worth mentioning that the probe device provided by the present invention is mainly to maintain the integrity of the grounding current loop, and does not limit the layout of the grounding layers provided on the two guide plates 31, 33, please refer to Figure 3 and Figure 4 Shown are a vertical probe device 2, 2' of the second and third preferred embodiments provided by the present invention respectively. The upper and lower grounding layers 35, 36, 35', 36' are only for the specific electrical connection structure for the position where the grounding pin 42 and the compensation pins 43, 44 pass through the probe base 30; therefore, it can As shown in FIG. 3B and FIG. 3C, the upper and lower ground layers 35, 36 of the vertical probe device 2 are wire layout structures, wherein the upper ground layer 35 is electrically connected to each of the second compensation pins 44 and ground pins. 42, the lower ground layer 36 is electrically connected to each of the first compensation pins 43 and the second compensation pins 44; or as shown in Figure 4B and Figure 4C, the vertical probe device 2' is a local thin film metal sheet layout structure, wherein the upper ground layer 35' is electrically connected to the adjacent second compensation pin 44 and the ground pin 42, and the lower ground layer 36' is electrically connected to the adjacent first compensation pin 43 and the second compensation pin 44 .

Please refer to a vertical probe device 3 of the fourth preferred embodiment of the present invention as shown in FIG. Needle 40, the probe holder 50 has an upper guide plate 51 and a lower guide plate 53, and each of the guide plates 51, 53 is respectively provided with an upper ground layer 52 and a lower ground layer 54, which is the same as that provided by the first preferred embodiment above. The differences are:

A plurality of recesses 531 are excavated on the lower guide plate 53 corresponding to the positions of the compensation pins 43 , 44 , and when the metal film is attached to the lower guide plate 53 to form the lower ground layer 54 , the recesses 531 make the lower ground layer 54 The layer 54 is correspondingly formed with a plurality of recesses 541 recessed from the surface of the lower guide plate 53; therefore, when the compensation pins 43, 44 are correspondingly abutted against the recesses 541 of the lower ground layer 54, they have a better electrical contact effect , and can avoid the lateral displacement of the compensation pins 43 and 44 when the vertical probe device 3 is moved or operated.

Please refer to a vertical probe device 4 of the fifth preferred embodiment provided by the present invention as shown in FIG. 6. Compared with the above-mentioned first preferred embodiment, the difference is that it has several The locking element 55 runs through the edges of the upper and lower guide plates 31, 33, not only can fix the two guide plates 31, 33, but also can save the second compensating pin as required by the above-mentioned first preferred embodiment. 44 , each of the locking elements 55 is directly used as a medium for electrically connecting the upper and lower ground layers 32 and 34 .

Please refer to a vertical probe device 5 of the sixth preferred embodiment provided by the present invention as shown in FIG. The first upper and lower grounding layers 37, 38 made are comprehensively attached to the inner sides 311, 331 and peripheral edges 312, 332 of the two guide plates 31, 33, and then multiple layers are also formed at the positions corresponding to the signal pins 41. Openings 371, 381 make the two grounding layers 37, 38 directly in electrical contact with the peripheral edges 312, 332 of the two guide plates 31, 33, which can also save the need for the first preferred embodiment. Two compensating pins 44 .

Please refer to a vertical probe device 6 of the seventh preferred embodiment provided by the present invention as shown in FIG. Needle 41, grounding pin 42, first compensation pin 43, the probe base 60 has an upper guide plate 61 and a lower guide plate 62, the difference from the above-mentioned first preferred embodiment is:

The two guide plates 61 and 62 are made of metal material, which can be passed through by the signal pin 41 and electrically insulated from the signal pin 41, thus not affecting the high-frequency signal transmission characteristics of the signal pin 41. The technical means to electrically insulate the probe base 60 from the signal pins 41 are well known to those engaged in this technical field. 41 are respectively provided with a through hole 611, 621, and an insulating layer 612, 622 is provided on the wall of each of the through hole 611, 621, by keeping the signal pin 41 electrically isolated from the two guide plates 61, 62 , and the inner diameter of the through hole 611 of the upper guide plate 61 is greater than the outer diameter of the signal contact 221 that is electrically connected to the signal pin 41, so as to avoid electrical conduction between the upper guide plate 61 and the signal contact 221, so the probe The device 6 can not only omit the fabrication of the ground layers 32 and 34 as provided in the above-mentioned first preferred embodiment, but also omit the arrangement of the second compensation pin 44 .

Of course, if it is more economical and convenient to manufacture, an insulating sleeve can also be placed around the signal pin 41, and then directly pass through the probe holder made of metal material as mentioned above, which also has the same effect.

Please refer to a vertical probe device 7 of the eighth preferred embodiment provided by the present invention as shown in Figure 9, which has an adapter plate 70 and the same probe base 30 and The difference between the probe 40 and the adapter board 70 compared with the above-mentioned first preferred embodiment is that:

The adapter board 70 can be made of a general printed circuit board (PCB), an organic multi-layer board (Multi-Layer Organic, MLO) or a multi-layer ceramic board (Multi-Layer Ceramic, MLC) with a circuit space conversion function. The space converter has an opposite top surface 701 and a bottom surface 702, and a plurality of high-frequency transmission line structures composed of a plurality of signal lines 71 and ground lines 72 are arranged inside, not only the signal lines 71 are adjacent to specific There is at least one ground wire 72 on the pitch, and the closer the probe base 30 is, the smaller the pitch of the transmission line is, that is, after the space conversion function, the pitch of each signal line 71 on the top surface 701 is much larger than that on the bottom surface 702 The spacing of each signal line 71 on the top is large; therefore, the circuit transmission structure can be transformed from the top surface 701 of the adapter plate 70 to the bottom surface 702 of the adapter plate 70 through space to correspond to the electronic components arranged in high density on the wafer to be tested, The bottom surface 702 of the adapter board 70 is respectively provided with a signal contact 73 and a ground contact 74 corresponding to the signal line 71 and the ground line 72. The signal contact 73 is for the electrical connection of each of the signal pins 41. The ground contact 74 The first compensation pin 43 and the ground pin 44 are electrically connected to each other, so that the high-frequency test signal can be transmitted from the top of the adapter board 70 to the electronic component under test through the signal pin 41 and the ground pin 44 .

Please refer to a vertical probe device 8 of the ninth preferred embodiment provided by the present invention as shown in FIG. The same probe base 30 and the probe 40 in the preferred embodiment differ in that:

The adapter board 80 has an opposite top surface 801 and a bottom surface 802, and is provided with a plurality of signal lines 81 and grounding lines 82 for transmitting high-frequency test signals, and is adjacent to each of the signal lines 81 at a specific distance. At least one ground wire 82 is used to maintain the characteristic impedance of high-frequency test signal transmission. The ends of the signal wire 81 and the ground wire 82 are respectively connected to a signal contact 83 and a ground contact 84 on the bottom surface 802 for each signal pin. 41 and the first compensation pin 43 correspond to the electrical connection, the middle part of the signal line 81 and the grounding line 82 are directly electrically connected to the signal contact 83 and the grounding contact 84 after penetrating the bottom surface 802, and the part of the signal line 81 and the grounding The wire 82 further extends laterally on the bottom surface 802 to a predetermined position and then connects the signal contact 83 and the ground contact 84 .

Therefore, the adapter board 80 can transform the signal line 81 and the ground line 82 from the top surface 801 closer to the surroundings to the proper position on the lower surface 702 corresponding to the signal pin 41 and the first compensation pin 43. Compared with the above-mentioned The circuit transmission structure provided by the eighth preferred embodiment not only has the same space conversion function, but also only performs horizontal circuit space conversion on the bottom surface 802 of the adapter board 80, which can simplify the highly complex circuit layout inside the adapter board and Eliminate the high-cost conditions of making organic multilayer boards or multilayer ceramic boards; moreover, because the high-frequency test condition structures that need to be matched with high-frequency signals and ground signals at the same time can be distributed on the top surface of the adapter board 80 801 corresponds to the periphery of the probe base 30, which is first received by the signal line 81 and the ground line 82 and then transferred to the near center to correspond to the signal pin 41 and the first compensation pin 43. The conditions are densely distributed together, which is conducive to the high-density chip electronic layout required by the test of a small number of high-frequency components, which can effectively use the circuit space and reduce the probability of interference of high-frequency test signals.

Please refer to a vertical probe device 9 of the tenth preferred embodiment provided by the present invention as shown in FIG. The seat 90 and the probe 40 differ in that:

The adapter board 85 is also provided with the signal wire 81 and the ground wire 82, and the bottom surface 802 has an upper ground layer 86 electrically connected to the ground wire 82 and the ground contact 84; the probe holder 90 has an upper, The lower guide plates 91, 92, and the lower ground layer 93 arranged on the lower guide plate 92 are used for the abutment of the needle tip parts of the first and second compensation pins 43, 44, as for the first and second compensation pins 43, 44 The pin tail portion of the pin is connected to the ground contact 84 provided on the bottom surface 802 of the adapter board 85 .

Since the ground wire 82 needs to be accompanied by the corresponding signal wire 81 on the bottom surface 802 to maintain the characteristic impedance of the high-frequency test signal transmission, the upper ground layer 86 can be saved by setting the upper ground layer 86 while making the ground wire 82 on the bottom surface 802. In the above-mentioned embodiments, the man-hours and costs of making the upper ground layer are generally set on the upper guide plate 91 of the probe base 90, so the second compensation pin 44 and the ground pin 42 are pressed against the ground on the adapter plate 85. contact 84, the first compensation pin 43 conducts the ground potential required for the high-frequency test signal to the lower ground layer 93 and then to the second compensation pin 44, and then passes through the upper ground layer 86 to the ground pin. 42 to provide a complete ground current return.

Of course, the function provided by this embodiment to provide the upper ground layer 86 on the bottom surface 802 of the adapter board 85 does not limit the structure of high-frequency transmission lines that can be provided in the adapter board. Take Fig. 12 and Fig. 13 as examples, respectively The eleventh and twelfth preferred embodiments provided by the present invention; a vertical probe device 2" shown in Fig. 12 is the variation application of the second preferred embodiment corresponding to Fig. 3, wherein An adapter board 20' is used for passing the signal line 121 and the ground wire 122. The bottom surface of the adapter board 20' is provided with an upper ground layer 35", and the upper ground layer 35" is connected with each of the second compensation pins 44 and The ground pin 42 is in direct electrical contact, so the ground current loop accompanied by the high-frequency test signal can also pass through the upper ground layer 35" to the ground pin 42; a vertical probe device 7' shown in FIG. 13 is For the variation application of the eighth preferred embodiment as shown in Figure 9, one of the adapter plates 70' is a space transformer structure composed of signal lines 71 and ground lines 72, and a bottom surface of the adapter plate 70' is provided with a The upper ground layer 75 is electrically connected to the ground wire 72, and the upper ground layer 75 is in direct electrical contact with each of the second compensation pin 44 and the ground pin 42, so the ground current loop accompanied by the high-frequency test signal can also be It passes through the upper ground layer 75 to the ground pin 42 .

However, what is described above is only a preferred feasible embodiment of the present invention, so all equivalent structural changes made by applying the description of the present invention and the scope of the patent application should be included in the scope of the patent of the present invention.

Claims (28)

1. vertical probe device is characterized in that including:

One card extender has a bottom surface, and this bottom surface is provided with at least one signal contact and at least one ground contact, and this ground contact electrically conducts to earthing potential;

One probe base has upper and lower relative a upper guide plate and a bottom guide, and this upper guide plate is arranged in the bottom surface of this card extender;

One signal pin wears this probe base, has a needle point and a backshank, and the needle point of this signal pin is suspended at this bottom guide below, and the backshank of this signal pin electrically connects this at least one signal contact;

One compensation pin, adjacent specific spacing with this signal pin has a needle point and a backshank, and the needle point of this compensation pin is resisted against this bottom guide, and the backshank of this compensation pin electrically connects this at least one ground contact; And,

One grounding pin wears this probe base, has a needle point and a backshank, and the needle point of this grounding pin is suspended at this bottom guide below, and the backshank of this grounding pin electrically connects the needle point of this compensation pin.

2. according to the described vertical probe device of claim 1, it is characterized in that, this probe base be provided with electrically conduct mutually one on ground plane and ground plane once, be laid in this upper guide plate and this bottom guide respectively.

3. according to the described vertical probe device of claim 2, it is characterized in that ground plane is to be attached to metallic film that to wear a plurality of openings behind this upper guide plate made on this, described opening corresponding for described signal pin passes with this on ground plane be electrically insulated.

4. according to the described vertical probe device of claim 2, it is characterized in that this time ground plane is to be attached to metallic film that to wear a plurality of openings behind this bottom guide made, described opening is corresponding to be passed and is electrically insulated with this time ground plane for described signal pin.

5. according to the described vertical probe device of claim 2, it is characterized in that ground plane was to electrically connect in the edge of this probe base under ground plane reached on this.

6. according to the described vertical probe device of claim 5, it is characterized in that also having a plurality of locks made from metal material and establish element, wear this upper guide plate and bottom guide and electrically connect upward ground plane and ground plane down.

7. according to the described vertical probe device of claim 5, it is characterized in that ground plane extension laying to side edge of this probe base was touched under ground plane reached on this.

8. according to the described vertical probe device of claim 1, it is characterized in that the bottom surface of this card extender is laid with ground plane on, this bottom guide is laid with ground plane, and ground plane was to electrically conduct mutually under ground plane reached on this.

9. according to claim 2 or the 8th described vertical probe device, it is characterized in that, this compensation pin is the first compensation pin, and this probe unit also is provided with one second compensation pin, and this second compensation needle set has a needle point and a backshank to electrically connect this time ground plane respectively and goes up ground plane.

10. according to the described vertical probe device of claim 9, it is characterized in that, have a plurality of these signal pins, a plurality of this first compensation pin, a plurality of this second compensation pin and a plurality of this grounding pin, this time ground plane is that many leads are made, electrically connect respectively this first compensation pin and respectively this second compensation pin respectively, should go up ground plane is that many leads are made, electrically connects respectively this second compensation pin and respectively this grounding pin respectively.

11. according to the described vertical probe device of claim 9, it is characterized in that, have a plurality of these signal pins, a plurality of this first compensation pin, a plurality of this second compensation pin and at least one this grounding pin, this time ground plane is that at least one sheet metal is made, electrically connect described first compensation pin and the described second compensation pin, should go up ground plane is that at least one sheet metal is made, electrically connects the described second compensation pin and this at least one grounding pin.

12. according to the described vertical probe device of claim 1, it is characterized in that this probe base is made with metal material, this upper guide plate and bottom guide are equipped with a plurality of through holes, correspondence is provided with described signal pin respectively, and described signal pin and this upper guide plate and bottom guide are electrically isolated.

13., it is characterized in that according to the described vertical probe device of claim 12, respectively be equipped with an insulation course on the hole wall of this through hole, and the internal diameter of the set through hole of this upper guide plate greater than this signal pin the external diameter of corresponding this signal contact that electrically connects.

14. according to the described vertical probe device of claim 1, it is characterized in that, this card extender is laid with a plurality of signal wires and ground wire, and respectively corresponding described signal contact and the ground contact of electrically connecting is provided with at least one this ground wire with the adjacent specific distance of this signal wire respectively.

15., it is characterized in that this card extender has an end face according to the described vertical probe device of claim 14, the spacing of adjacent respectively this signal wire is to phase down from end face to the bottom surface of this card extender.

16. according to the described vertical probe device of claim 15, it is characterized in that, this card extender be select with printed circuit board (PCB), organic multilayer plate or multi-layer ceramics plate structure one made.

17., it is characterized in that this bottom guide is at least one recess that is concaved with predetermined depth according to the described vertical probe device of claim 1, the needle point of this compensation pin places this at least one recess.

18. a probe unit is characterized in that including:

One card extender is equipped with a signal wire and at least one ground wire, and this ground wire electrically conducts to earthing potential;

One probe base is located at this card extender, and is laid with a ground plane;

One signal pin wears this probe base, has a needle point and a backshank, and the needle point of this signal pin is in order to an electric shock sub-element, and the backshank of this signal pin electrically connects this signal wire;

One compensation pin with this signal pin adjacent specific spacing arranged side by side, has a needle point and a backshank, and the needle point of this compensation pin contacts this ground plane, and the backshank of this compensation pin protrudes this probe base and electrically connects this at least one ground wire; And,

One grounding pin has a needle point and a backshank, and the needle point that the needle point of this grounding pin protrudes this probe base and this signal pin is positioned at same plane, and the backshank of this grounding pin electrically connects this ground plane.

19., it is characterized in that this ground plane is following ground plane according to the described probe unit of claim 18, this probe base also is provided with ground plane on, backshank of contiguous this compensation pin is set, this on ground plane and under two ground planes such as ground plane be to electrically conduct mutually.

20., it is characterized in that this two ground plane is to be attached to metallic film that to wear a plurality of openings behind this probe base made according to the described probe unit of claim 19, described opening is corresponding to be passed and is electrically insulated with this ground plane for described signal pin.

21., it is characterized in that this two ground plane is to electrically connect in the edge of this probe base according to the described probe unit of claim 19.

22., it is characterized in that according to the described probe unit of claim 21, also have more a plurality of locks made from metal material and establish element, wear this probe base and electrically connect this two ground plane.

23., it is characterized in that this two ground planes extension is established to the side edge of this probe base and touched according to the described probe unit of claim 21.

24., it is characterized in that this compensation pin is the first compensation pin according to the described probe unit of claim 19, this probe unit also is provided with one second compensation pin, this second compensation needle set has a needle point and a backshank to electrically connect this two ground plane respectively.

25., it is characterized in that this ground plane is following ground plane according to the described probe unit of claim 18, this card extender is laid with ground plane on, ground plane and following ground plane are to electrically conduct mutually on this.

26., it is characterized in that this compensation pin is the first compensation pin according to the described probe unit of claim 25, this probe unit also is provided with one second compensation pin, this second compensation needle set has a needle point and a backshank to connect respectively to establish this time ground plane and last ground plane.

27., it is characterized in that this card extender has an end face and a bottom surface according to the described probe unit of claim 18, the spacing of adjacent respectively this signal wire is to phase down from end face to the bottom surface of this card extender.

28., it is characterized in that the needle point of this compensation pin is to go deep into the predetermined degree of depth of this probe base according to the described probe unit of claim 18, this probe base forms a recess to the needle point that should compensate pin, has this ground plane on this recess.

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