Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive work are within the scope of the present application.
Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the specification. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
The inventors of the present application have found, through long-term research: although a curved full-screen mobile phone can provide a user with a larger display field of view and better aesthetic appearance and hand-holding feeling, the structural change of the mobile phone can also cause the change of the size of the internal space of the body and the configuration thereof. Since the interior of the body generally requires a large number of various structural members to be stacked, the above-mentioned changes in the size and configuration of the space make it necessary for product developers to redesign the structure of the body of the mobile phone and adjust the layout of the electronic components therein. To this end, the present application proposes the following examples.
Referring to fig. 1 and fig. 2 together, fig. 1 is a schematic structural diagram of an embodiment of an electronic device provided in the present application, and fig. 2 is a schematic exploded structural diagram of the electronic device in fig. 1.
The electronic device 10 of the embodiment of the present application may be a portable device such as a mobile phone, a tablet computer, a notebook computer, and a wearable device. The embodiment of the present application takes the electronic device 10 as a mobile phone as an example for description. The electronic device 10 includes a display module 11, a rear cover 12 and a middle frame 13. The display module 11 and the rear cover plate 12 are respectively connected with the middle frame 13, so that the display module 11 and the rear cover plate 12 form a basic structure for clamping the middle frame 13 together after being assembled, as shown in fig. 1. For example, the display module 11 and the rear cover plate 12 are respectively covered on two opposite surfaces of the middle frame 13 by one or a combination of assembling manners such as clamping, gluing, welding and the like. Further, the electronic device 10 is also provided with a structural component such as a battery, a main board, a camera module, a fingerprint module, and the like, so that the electronic device 10 can implement corresponding functions. The structural member is generally disposed between the display module 11 and the rear cover 12, and can be mounted and fixed on the middle frame 13, so that the structural member can be stacked inside the electronic device 10 and occupy a certain space.
The display module 11 may be a screen such as an lcd (liquid Crystal display), an OLED (Organic Light-Emitting Diode), a Mini-LED, or a Micro-LED. In the embodiment of the present application, the display module 11 is an OLED screen for example. Generally, the display module 11 includes a transparent cover 111, a display panel 112 and a driving circuit assembly 113, as shown in fig. 2. The display panel 112 may be attached to the transparent cover 111 by using a sealant such as OCA (optical Clear Adhesive) or PSA (Pressure Sensitive Adhesive). The transparent cover 111 may be made of glass or a polyimide film, and is mainly used for protecting the display panel 112, and may be used as an outer surface of the electronic device 10, so that a user can perform touch operations such as clicking and sliding operations. The display panel 112 is mainly used for displaying a screen, and can be used as an interactive interface to instruct a user to perform the touch operation on the transparent cover 111. The driving circuit assembly 113 is generally disposed on a side of the display panel 112 away from the transparent cover 111 and electrically connected to the display panel 112, and a detailed structure will be described later so that the display panel 112 can display a picture. In some other embodiments, the outer surface of the electronic device 10 (i.e., the outer surface of the transparent cover plate 111) may be further provided with any one of other functional film layers, such as a tempered film, a frosted film, a decoration film, a peep-proof film, a water condensation film, and the like, so that the electronic device 10 can provide different use effects for a user.
The rear cover 12 is a battery cover of the electronic device 10, and may be made of glass, metal, hard plastic, or other electrochromic materials. The rear cover 12 has a certain structural strength, and is mainly used to protect the electronic device 10 together with the transparent cover 111. Accordingly, the material of the middle frame 13 may be glass, metal, hard plastic, or the like. The middle frame 13 also has a certain structural strength, and is mainly used for supporting and fixing structural members inside the electronic device 10. Further, since the rear cover plate 12 and the middle frame 13 are generally directly exposed to the external environment, the rear cover plate 12 and the middle frame 13 may preferably have certain wear-resistant, corrosion-resistant, scratch-resistant, and other properties, or the outer surfaces of the rear cover plate 12 and the middle frame 13 (i.e., the outer surfaces of the electronic device 10) may be coated with a layer of functional material for wear-resistant, corrosion-resistant, scratch-resistant. In some embodiments, the rear cover plate 12 and the middle frame 13 may be two separate structural members, as shown in fig. 2, and they may be assembled by one or a combination of clamping, gluing, welding, and the like. In other embodiments, the rear cover plate 12 and the middle frame 13 may also be integrally formed, such as by stamping, injection molding, etc.
Generally, the electronic device 10 may have a box-like appearance structure as a whole, that is, the display module 11, the rear cover 12 and the middle frame 13 may be rectangular. The display module 11 has four side edges, the rear cover plate 12 also has four side edges, and the middle frame 13 also has four side edges correspondingly; the two side edges of each structure are generally rounded to enhance the aesthetic appearance and grip of the electronic device 10. Further, at least one side edge of at least one of the display module 11 and the rear cover 12 connected to the middle frame 13 is a structure bent toward the middle frame 13. In other words, at least one of the four side edges of the display module 11 is bent toward the middle frame 13; and/or at least one of the four side edges of the rear cover plate 12 is bent toward the middle frame 13.
It should be noted that the side edges in the embodiment of the present application are a simple expression, and the width of the side edges is not considered, and the dimensions of the display module 11, the rear cover 12, and the middle frame 13 in the thickness direction of the electronic device 10 are not considered. Further, the side edges described in the embodiments of the present application should not be simply understood as lines in a general sense.
In some embodiments, the four side edges of the display module 11 and the four side edges of the rear cover 12 may be curved toward the middle frame 13, as shown in fig. 1 and 2, that is, the side edges may be curved, so that the display module 11 is curved in four directions in appearance, and the rear cover 12 is curved in four directions in appearance. The mode that the display module 11 is bent on four sides not only can reduce or even hide the black edge of the display module 11, so that the electronic device 10 can provide a larger display view for a user; the picture that can also make display panel 112 show can extend to its side from the front of display module assembly 11 with the form similar to "waterfall", also be that display module assembly 11 can build a visual effect who surrounds the demonstration promptly to make electronic equipment 10 bring a visual experience that is different from bang screen, water droplet screen, dig the hole screen, flat full-face screen such as over-and-under type camera and sliding closure type camera for the user, and then increase electronic equipment 10's competitiveness. In other embodiments, the display module 11 and the back cover 12 may have a single-sided curved appearance, a double-sided curved appearance, or a three-sided curved appearance, or only one of the display module 11 and the back cover 12 may have the curved surface structure. The electronic device 10 in the embodiment of the present application is described by taking a structure in which the display module 11 and the back cover 12 are all bent on four sides as an example. The electronic device 10 shown in fig. 1 and 2 only describes a portion (e.g., one quarter) of the display module 11, the rear cover 12 and the middle frame 13, and the structures of the other portions are the same as or similar to those in the drawings, and are not repeated herein. The specific structure of this quarter of the electronic device 10 is described in detail below.
With reference to fig. 1 and fig. 2, the transparent cover 111 includes a main body portion 1111 and a curved portion 1112, the curved portion 1112 surrounds the main body portion 1111 and is in smooth transition with the main body portion 1111; the bent portion 1112 extends toward a direction close to the center frame 13 so that the transparent cover plate 111 is provided in a bent shape. The display panel 112 includes a main display portion 1121 and a sub display portion 1122 which are integrally formed, wherein the sub display portion 1122 surrounds the main display portion 1121, and the main display portion 1121 and the sub display portion 1122 are in smooth transition; the main display portion 1121 is attached to the main body portion 1111, and the sub display portion 1122 is attached to the bent portion 1112 so that the display panel 112 is also provided in a bent shape. In the embodiment of the present application, after the display panel 112 is attached to the transparent cover 111, the minimum bending radius of the sub-display portion 1122 relative to the main display portion 1121 may be 6mm, that is, the minimum curvature radius of the display module 11 may be 6 mm. Taking a mobile phone as an example, the thickness of the whole mobile phone is generally less than 10mm, and the curvature radius of the value enables the display module 11 to have a larger bending depth in the thickness direction of the whole mobile phone, that is, the side surface of the mobile phone can display more pictures, so that the mobile phone can provide a larger display view for a user. Further, the rear cover 12 includes a flat plate portion 121 and a bent portion 122 integrally formed, the bent portion 122 surrounds the flat plate portion 121, and the two portions are in smooth transition; the bent portion 122 extends toward the middle frame 13, so that the rear cover 12 is disposed in a curved shape. The bending portion 1112 and the bending portion 122 can be connected to two opposite surfaces of the middle frame 13 by one or a combination of assembling manners such as clamping, gluing, welding, and the like. In other embodiments, the main portion 1111 and the flat plate portion 121 may also be slightly bent, for example, the bending directions of the two are away from each other.
It should be noted that the integrally formed structure in the embodiment of the present application means that the structure of the product is an organic whole, and the product cannot be easily split or divided. For example, the present embodiment may bend a flat tempered glass into the transparent cover 111 disposed in a curved shape according to predetermined process parameters by using a hot bending technique, as shown in fig. 1 and 2, and the curved portion and the straight portion naturally perform a circular arc transition. The above process parameters can be reasonably designed according to factors such as the type of raw material, the bending angle and the curvature radius, and are not limited herein. Further, the OLED screen in a flat plate form or a pre-bent form may be attached to a transparent cover plate 111 disposed in a bent form to form a display panel 112 disposed in a bent form, as shown in fig. 1 and 2, thereby forming the display module 11 disposed in a bent form. For another example, if the rear cover 12 is made of glass, the flat tempered glass may be bent into the curved rear cover 12 by the above-mentioned hot bending technique; if the material of the back cover plate 12 is metal, the metal plate can be bent into the back cover plate 12 in the curved arrangement by using a stamping technique, as shown in fig. 1 and 2, and the curved portion and the straight portion are naturally in a circular arc transition. Therefore, in fig. 1 and 2, a line between the main body portion 1111 and the bent portion 1112, a line between the main display portion 1121 and the sub display portion 1122, and a line between the flat plate portion 121 and the bent portion 122 are only intended to illustrate boundaries between the above portions. In other words, for the transparent cover 111, the display panel 112 and the rear cover 12 in the actual product, the lines are not true, i.e. the lines smoothly transition between the parts.
The middle frame 13 includes a frame 131 and a middle plate 132, wherein the middle plate 132 is connected to the frame 131 and extends away from the frame 131. The material of the frame 131 may be metal, the material of the middle plate 132 may be rigid plastic, and the two may be made into the middle frame 13 by injection molding, that is, the middle frame 13 may be an integrally formed structural member, so that the structure of the middle frame 13 may be simplified, and the manufacturing cost of the middle frame 13 may be reduced. At this time, the frame 131 may be exposed to the external environment and has an appearance surface capable of playing a role of decoration; the middle plate 132 is mainly located inside the electronic device 10, and can support and fix the structural members such as the battery, the main board, the camera module, and the fingerprint module. In other embodiments, for example, when the transparent cover 111 is made of glass and the rear cover 12 is also made of glass, the middle frame 13 may include only the middle plate 132 without the frame 131 exposed to the external environment, the transparent cover 111 made of glass and the rear cover 12 may be directly welded by a glass solder, and the middle frame 13 is completely located inside the electronic device 10.
Further, the display module 11 and the rear cover 12 may not only be in a four-sided bent structure in appearance, but also be in a symmetrical structure with respect to the middle frame 13 (especially the frame 131) in appearance, as shown in fig. 3, so that the electronic device 10 creates a symmetrical aesthetic feeling for users. At this time, the maximum outline of the electronic device 10 is located on the frame 131 of the middle frame 13, as indicated by the arrow a in fig. 3. In some other embodiments, the display module 11 may further extend toward the middle frame 13 in a curved manner based on the above symmetrical structure, as shown in fig. 4, to increase the lateral display area of the display module 11, so that the electronic device 10 can provide a larger display field of view for the user. At this time, the maximum outline of the electronic device 10 is located at the curved portion 1112 of the display module 11, as indicated by an arrow B in fig. 4.
Referring to fig. 5 and 6 together, fig. 5 is a partially enlarged structural view of a portion C in fig. 1, and fig. 6 is a partially enlarged structural view of a portion D in fig. 2.
Based on the above detailed description, since the display module 11 and the rear cover 12 may be both curved structures that are curved toward the middle frame 13, when the display module 11, the rear cover 12 and the middle frame 13 are connected, an arc-shaped space is formed between the display module 11 and the rear cover 12. Therefore, one surface of the middle plate 132 close to the display module 11 may be a curved surface having the same or similar curvature radius as the display module 11 (specifically, the sub-display portion 1122), and one surface of the middle plate 132 close to the rear cover 12 may be a curved surface having the same or similar curvature radius as the rear cover 12 (specifically, the bent portion 122), as shown in fig. 5 and 6, so that the middle plate 132 can better support the display module 11 and the rear cover 12 through the curved surface structure, thereby increasing the structural strength of the whole electronic device 10 and further increasing the reliability of the electronic device 10. In other embodiments, for example, when the curvature radius of the display module 11 and the rear cover 12 is larger (that is, the curvature degree is smaller), one surface of the middle plate 132 close to the display module 11 and the rear cover 12 may also be a straight plane, so as to simplify the structure of the middle plate 132, and reduce the processing difficulty of the middle frame 13.
Further, two surfaces of the border between the frame 131 and the middle plate 132 may be recessed toward each other to form a first groove 133 and a second groove 134. Wherein, the first groove 133 is close to the display module 11, and the second groove 134 is close to the rear cover 12, as shown in fig. 5; and the distance between the first groove 133 and the second groove 134 is smaller than the width of the outer surface of the frame 131 in the thickness direction of the electronic device 10, as shown in fig. 6, so that the display module 11 can extend to the first groove 133 along the curved surface of the middle plate 132, and the rear cover 12 can extend to the second groove 134 along the curved surface of the middle plate 132, as shown in fig. 5, so that the display module 11 and the rear cover 12 can be partially hidden in the middle frame 13. That is, the middle frame 13 can protect the side edges of the display module 11 and the rear cover 12 to some extent, thereby increasing the reliability of the electronic device 10.
In this embodiment, the width of the appearance surface of the frame 131 in the thickness direction of the electronic device 10 may be less than or equal to 1.8 mm; preferably, the width is greater than or equal to 1.4mm and less than or equal to 1.6mm, so that the display module 11 and the rear cover plate 12 can extend more toward each other along the middle plate 132, thereby enabling the electronic device 10 to provide a larger display view for a user. Accordingly, the appearance surface of the frame 131 may be a straight plane or an arc convex surface, so that the electronic device 10 can obtain better appearance and holding feeling. Further, the middle frame 13 is thinned from the inside to the outside of the electronic device 10 in the whole structure, as shown in fig. 5 and 6, so that the middle frame 13 can meet both requirements of ultra-thinning and structural strength, thereby increasing the reliability of the middle frame 13.
Based on the above detailed description, although the curved surface structure formed by bending the display module 11 and the rear cover 12 toward the middle frame 13 enables the electronic device 10 to provide a user with a larger display view and better aesthetic appearance and hand-holding feeling; however, when the length, width and thickness of the electronic device 10 are constant, the curved structure not only compresses the thickness of the middle frame 13 (especially the frame 131) to make the frame 131 at least partially thin, as shown in fig. 1 to 6, but also compresses the size of the internal space of the electronic device 10 to a certain extent to change the configuration of the internal space of the electronic device 10, so that the internal space of the electronic device 10 becomes more crowded, thereby affecting the arrangement of the structural components such as the battery, the main board, the camera module, and the fingerprint module. For the flat full-face screen, the driving circuit is usually directly attached to the edge portion of the screen. Since the side edge of the display module 11 in the present application is a curved structure (specifically, the curved portion 1112 and the sub-display portion 1122), if the driving circuit is attached to a flat region (specifically, the main body portion 1111 and the main display portion 1121) far from the side edge, the driving circuit may occupy a space of other structural members, which will inevitably affect the arrangement of the structural members, even cause structural interference. For example, in the case of a mobile phone, in order to ensure or increase its cruising ability, the capacity of the battery is generally as large as possible, which also means that the battery needs to occupy a large amount of space inside the mobile phone. Therefore, if the driving circuit module 113 is attached to the main display portion 1121, the battery space may be occupied, thereby affecting the capacity of the battery. Therefore, in the embodiment of the present application, the body structure (especially, the display module 11) of the electronic device 10 is redesigned, and the layout of the driving circuit assembly 113 therein is adjusted, for example, the structure of the driving circuit assembly 113 is redesigned, so that the driving circuit assembly 113 that should be originally attached to the main display portion 1121 is disposed on the sub-display portion 1122, so as to avoid the curved surface structure of the display module 11 from affecting the arrangement of the above structural members, thereby meeting the arrangement requirement of the above structural members. Furthermore, a receiving slot 135 may be further formed on a surface of the middle frame 13 (specifically, the middle plate 132) close to the display module 11, and the driving circuit assembly 113 may be received in the receiving slot 135, so that even though the middle frame 13 can support the display module 11, the structural compactness of the electronic device 10 can be increased.
The specific structure of the driving circuit assembly 113 and its relationship with other structures in the display module 11 will be described in detail below.
Referring to fig. 7 to 9 together, fig. 7 is a schematic top view of the electronic device in fig. 1, fig. 8 is a schematic partial cross-sectional view of the electronic device in fig. 7 along a direction VIII-VIII, and fig. 9 is a schematic cross-sectional view of the driving circuit assembly in fig. 8. It should be noted that the electronic device shown in fig. 8 mainly includes a partial structure related to the display module 11, and the structures of the rear cover 12 and the middle frame 13 are not shown.
In the embodiment of the present application, the driving circuit component 113 is attached to the sub-display portion 1122 of the display module 11, as shown in fig. 7 and fig. 8, that is, the driving circuit component 113 is still located at the side edge of the display module 11, so as to avoid the curved surface structure of the display module 11 from affecting the arrangement of other structural components such as the battery, the main board, the camera module, and the fingerprint module in the electronic device 10.
The driving circuit assembly 113 includes a support 1131, a driving chip 1132 and a circuit board 1133. The support 1131 is mainly used to optimize the curved surface structure of the sub-display 1122 into a planar structure for conveniently disposing the driving chip 1132, so that the driving circuit assembly 113 can be attached to the sub-display 1122. The driving chip 1132 is electrically connected to the display panel 112 and is mainly used for controlling the display of the display panel 112 and the interaction between the display panel and the user. The circuit board 1133 is mainly used to electrically connect the driving chip 1132 with a motherboard of the electronic device 10, so that the driving chip 1132 receives a control instruction from the motherboard or feeds back an interactive instruction to the motherboard. Further, the circuit board 1133 may be a main board of the electronic device 10, or may be a flexible circuit board electrically connecting the driving chip 1132 and the main board, which is not limited herein. In the embodiment of the present application, the circuit board 1133 is taken as a flexible circuit board for example. The flexible circuit board can accommodate a complex spatial layout inside the electronic device 10, thereby simplifying various wiring inside the electronic device 10. Further, the driving chip 1132 may also be attached to the flexible circuit board in advance through Surface Mount Technology (SMT), so as to simplify the structure of the driving circuit assembly 113.
Support 1131 includes first surface 1134 and second surface 1135 disposed opposite one another, as shown in fig. 9. The first surface 1134 is provided in a curved surface shape, for example, the radius of curvature of the first surface is the same as the radius of curvature of the sub-display portion 1122, as shown in fig. 8 and 9, so that the bracket 1131 can be attached to the sub-display portion 1122. The second surface 1135 is disposed in a planar shape, as shown in fig. 9, so that the driving chip 1132 can be directly attached to the second surface 1135 without bending, and thus the driving chip 1132 can be indirectly attached to the sub-display portion 1122, thereby avoiding the influence on the configuration of other structural components in the electronic device 10 due to the fact that the driving chip 1132 is disposed on the main display portion 1121, and also avoiding the quality problem that the driving chip 1132 is directly disposed on the sub-display portion 1122 (because the driving chip 1132 is structurally fragile, and is not easy to be squeezed or bent). In general, the driving chip 1132 is not directly and tightly disposed against the edge of the sub-display portion 1122 away from the main display portion 1121, but a safety distance is set, as shown by L in fig. 8, for example, the safety distance L is 1.5mm, so as to avoid structural interference between the driving chip 1132 and structural members such as the middle frame 13, and thus increase the safety of the driving chip 1132. Further, the first surface 1134 and the second surface 1135 may be coated with an adhesive such as OCA, PSA, etc. so that the bracket 1131 is attached to the sub-display module 1122, and the driving chip 1132 and the circuit board 1133 are attached to the bracket 1131.
It should be noted that the material, size, shape, thickness, and other parameters of the support 1131 may be designed reasonably according to the requirements of the attachment between the driving chip 1132 and the sub-display 1122, and the like, which is not limited herein.
Referring to fig. 10, fig. 10 is a schematic cross-sectional view of another embodiment of the stand of fig. 9.
Based on the above detailed description, after the driving chip 1132 and the circuit board 1133 are attached to the second surface 1135, at least one step corresponding to the thickness of the driving chip 1132 exists between the circuit board 1133 and the second surface 1135, as shown in fig. 8 and 9. Since the structural strength of the flexible circuit board is generally poor, the step tends to cause the flexible circuit board to crack. To this end, the support 1131 may further include a third surface 1136 remote from the secondary display 1122. And the third surface 1136 protrudes from the second surface 1135 relative to the first surface 1134, as shown in fig. 10, such that a step difference is formed between the third surface 1136 and the second surface 1135. In other words, the other surface of the support 1311 facing away from its first surface 1134 is stepped. The step difference between the third surface 1136 and the second surface 1135 may be equal to the thickness of the driving chip 1132, so that the driving chip 1132 can be accommodated in the bracket 1131 due to the step difference, as shown in fig. 10, so that the surface of the driving chip 1132, which is away from the second surface 1135, can be flush with the third surface 1136, and further the circuit board 1133 can be at least partially laid on the third surface 1136, as shown in fig. 10.
Further, other structures of the present embodiment are the same as or similar to those described above, and are not described herein again.
Referring to fig. 8 and 11 together, fig. 11 is a schematic view of a partial enlarged structure of a portion E in fig. 8.
For an OLED screen, the basic structure of the display panel 112 generally includes a substrate 1123, and an organic electroluminescent layer 1124 and an optical film layer 1125 stacked on the substrate 1123, as shown in fig. 11. The base 1123 is far from the transparent cover 111 (i.e. close to the support 1131), and is mainly used to support the whole display panel 112. The material of the substrate 1123 may be a thermoplastic polyurethane film, such as a polyolefin thermoplastic film, an oriented polystyrene thermoplastic film, a polyethylene terephthalate thermoplastic film, etc., so that the display panel 112 has a certain deformation capability, and the display panel 112 is attached to the curved transparent cover 111. The organic electroluminescent layer 1124 typically includes an emission control layer and a pixel unit (not shown in fig. 11) electrically connected to each other, and the emission control layer is electrically connected to the driving chip 1132, as shown in fig. 11, and is mainly used for enabling the display panel 112 to display a picture under the control of the driving circuit assembly 113. The optical film 1125 typically includes a polarizer and 1/4 wavelength phase films (not shown in fig. 11), that is, the optical film 1125 may be a circular polarizer, and is mainly used to eliminate the reflected light after the ambient light irradiates the display panel 112, so as to increase the contrast ratio of the display panel 112. In the embodiment of the present application, the optical film layer 1125 is close to the transparent cover 111 (i.e., away from the bracket 1131), that is, one side of the display panel 112 close to the optical film layer 1125 can be attached to the transparent cover 111 by an adhesive such as OCA or PSA, so that the display panel 112 can be attached to the transparent cover 111 and can form the main display portion 1121 and the sub display portion 1122. Further, the display panel 112 may further include a touch layer 1126, a buffer layer 1127, and a shielding layer 1128. The touch layer 1126 may be one or a combination of a resistive type, a capacitive type, an acoustic wave type, an infrared type, a pressure-sensitive type, a vibration-wave-sensitive type, and the like, and is generally disposed between the organic electroluminescent layer 1124 and the optical film layer 1125, and is mainly used for receiving a touch operation performed by a user on the display module 11. The buffer layer 1127 may be made of foam, and may be disposed on a side of the substrate 1123 away from the organic electroluminescent layer 1124, and is mainly used to support and protect the substrate 1123 and to reduce the difference between the substrate 1123 and the shielding layer 1128 in terms of hardness, strength, deformability, and other mechanical properties. The shielding layer 1128, which may be copper foil, may be disposed on the side of the buffer layer 1127 away from the substrate 1123, and is mainly used for dissipating heat and shielding electromagnetic interference. Furthermore, the functional layers of the display panel 112 may be bonded by a glue (not shown in fig. 11) such as OCA and PSA.
In order to facilitate electrical connection between the organic electroluminescent layer 1124 and the driving chip 1132, the organic electroluminescent layer 1124 is disposed at the edge of the sub-display portion 1122 away from the main display portion 1121 in a curved shape, as shown in fig. 11, so that the organic electroluminescent layer 1124 can further extend along the second surface 1135 to the driving chip 1132. Preferably, the organic electroluminescent layer 1124 extends along the second surface 1135 at least to between the driving chip 1132 and the support 1131, so that the driving chip 1132 can be directly attached to the organic electroluminescent layer 1124. Further, in a direction in which the sub-display portion 1122 is away from the main display portion 1121, an included angle β between an extension surface of the second surface 1135 and an extension surface of the sub-display portion 1122 may be an acute angle, so that an angle θ formed when the organic electroluminescent layer 1124 is bent and then extended along the support 1131 is bent again is an obtuse angle, as shown in fig. 11, thereby ensuring flatness of the organic electroluminescent layer 1124 and preventing the organic electroluminescent layer 1124 from being broken due to excessive bending.
Generally, the organic electroluminescent layer 1124 can be made by depositing organic and inorganic materials on the substrate 1123 by evaporation, and can have a thickness of only 0.03mm, which is fragile. For this reason, the base 1123 is not only disposed between the shielding layer 1128 and the organic electroluminescent layer 1124 to support the entire display panel 112, but may be further attached to the aforementioned bent portion of the organic electroluminescent layer 1124 to individually support a portion of the organic electroluminescent layer 1124, as shown in fig. 11, thereby increasing the reliability of the display panel 112. Further, the matrix 1131 may also extend along the organic electroluminescent layer 1124 to the area where the support 1131 is located, so that the projection of the matrix 1131 on the second surface 1135 at least partially falls on the support 1131 (colloquially referred to as "ledge"), as shown by M in fig. 11. The lap width M of the substrate 1131 may be greater than or equal to 0.5mm and less than or equal to 1.5mm, so that the substrate 1131 can support a part of the organic electroluminescent layer 1124 and does not structurally interfere with the driving chip 1132.
The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes performed by the content of the present application and the attached drawings, or directly or indirectly applied to other related technical fields, are also included in the scope of the present application.