CN113037894B

CN113037894B - Electronic equipment

Info

Publication number: CN113037894B
Application number: CN201911349105.7A
Authority: CN
Inventors: 李敬
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2019-12-24
Filing date: 2019-12-24
Publication date: 2023-03-03
Anticipated expiration: 2039-12-24
Also published as: CN113037894A

Abstract

The utility model mainly relates to an electronic equipment, this electronic equipment includes display module assembly, back shroud, center and microphone subassembly, and display module assembly, back shroud are connected with the center respectively, and the microphone subassembly sets up between display module assembly and back shroud, and at least one side edge of display module assembly is crooked towards the center, and the back shroud forms the breach with the center cooperation, and the breach is as the pickup hole of microphone subassembly. Compare and directly set up the sound hole that picks up of microphone on the cell-phone casing in correlation technique, this application passes through the cooperation between back shroud and the center and indirectly forms a breach, and this breach is used as the sound pick-up hole of microphone, can increase the disguised nature of picking up the sound hole to can increase the whole uniformity of electronic equipment in the appearance.

Description

Electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to electronic equipment.

Background

With the increasing popularity of electronic devices, electronic devices have become indispensable social and entertainment tools in people's daily life, and people have increasingly high requirements for electronic devices. In the conventional electronic device (e.g., a mobile phone), a hole is generally formed in a housing of the electronic device to serve as a sound collecting hole of a microphone in the mobile phone. The holes are large, the aperture of the holes is generally 1.2mm, and the overall consistency of the appearance of the mobile phone is damaged.

Disclosure of Invention

The embodiment of the application provides an electronic equipment, wherein, electronic equipment includes display module assembly, back shroud, center and microphone subassembly, and display module assembly, back shroud are connected with the center respectively, and the microphone subassembly sets up between display module assembly and back shroud, and at least one side edge of display module assembly is crooked towards the center, and the back shroud forms the breach with the center cooperation, and the breach is as the pickup hole of microphone subassembly.

The beneficial effect of this application is: compare and directly set up the sound hole that picks up of microphone on the cell-phone casing in correlation technique, this application passes through the cooperation between back shroud and the center and indirectly forms a breach, and this breach is used as the sound pick-up hole of microphone, can increase the disguised nature of picking up the sound hole to can increase the whole uniformity of electronic equipment in the appearance.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an embodiment of an electronic device provided in the present application;

FIG. 2 is an exploded view of the electronic device of FIG. 1;

FIG. 3 is a schematic diagram of a partial structure of the electronic device of FIG. 1;

FIG. 4 is a schematic side view of the electronic device of FIG. 1;

FIG. 5 is a schematic side view of another embodiment of the electronic device of FIG. 1;

FIG. 6 is a partially enlarged schematic view of a portion C in FIG. 1;

FIG. 7 is an enlarged partial view of the section D of FIG. 2;

FIG. 8 is a schematic cross-sectional view of the electronic device of FIG. 3 along line VIII-VIII;

FIG. 9 is a schematic cross-sectional view of the middle frame of FIG. 8;

FIG. 10 is a cross-sectional structural view of the first bracket of FIG. 8;

FIG. 11 is an exploded view of the electronic device of FIG. 3;

FIG. 12 is a cross-sectional schematic view of another embodiment of the electronic device of FIG. 8;

FIG. 13 is a schematic diagram of a top view of the electronic device of FIG. 1;

FIG. 14 is a schematic cross-sectional view of the driving circuit assembly of FIG. 8;

FIG. 15 is a cross-sectional structural view of another embodiment of the stent of FIG. 14;

fig. 16 is a partially enlarged structural view of a portion E in fig. 8.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples of the present application, not all examples, and all other examples obtained by a person of ordinary skill in the art without making any creative effort fall within the protection scope of the present application.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to fig. 1 to fig. 3 together, fig. 1 is a schematic structural diagram of an embodiment of an electronic device provided in the present application, fig. 2 is a schematic exploded structural diagram of the electronic device in fig. 1, and fig. 3 is a schematic partial structural diagram of the electronic device in fig. 1.

In the embodiment of the present application, the electronic device 10 may be a portable device such as a mobile phone, a tablet computer, a notebook computer, and a wearable device. The embodiment of the present application takes the electronic device 10 as a mobile phone as an example for description. The electronic device 10 includes a display module 11, a rear cover 12, a middle frame 13, a first bracket 14, and a microphone assembly 15, as shown in fig. 2. The display module 11 and the rear cover plate 12 are respectively connected with the middle frame 13, so that the display module 11 and the rear cover plate 12 form a basic structure for clamping the middle frame 13 together after being assembled, as shown in fig. 1. For example, the display module 11 and the rear cover plate 12 are respectively covered on two opposite surfaces of the middle frame 13 by one or a combination of assembling manners such as clamping, gluing, welding and the like. The first bracket 14 is arranged between the display module 11 and the rear cover plate 12 and is spliced with the middle frame 13; the first bracket 14 may be disposed near the rear cover 12 to support the rear cover 12, thereby preventing the rear cover 12 from being deformed or broken by an external force. Further, a microphone assembly 15 and other structural members such as a battery, a main board, a camera module, a fingerprint module are also disposed between the display module 11 and the rear cover 12, so that the electronic device 10 can implement corresponding functions.

In the embodiment of the present application, the rear cover 12 and the middle frame 13 cooperate to form a gap 16, as shown in fig. 3, the gap 16 serves as a sound pickup hole of the microphone assembly 15. The notch 16 may be a micro-gap, and the specific structure will be described in detail later. Compared with the prior art in which the sound pickup hole of the microphone is directly formed in the mobile phone shell, in the embodiment of the present application, the notch 16 is indirectly formed by the cooperation between the rear cover plate 12 and the middle frame 13, so that the notch 16 is used as the sound pickup hole of the microphone assembly 15, the concealment of the sound pickup hole can be increased, and the overall consistency of the electronic device 10 in appearance can be increased. Furthermore, the middle frame 13 is provided with a first sound transmission channel, and the first sound transmission channel is communicated with the notch 16; the first support 14 is provided with a second sound transmission channel which is communicated with the first sound transmission channel; the microphone assembly 15 is disposed at an end of the second sound transmission channel far from the first sound transmission channel, so that the microphone assembly 15 can communicate with the external environment, and the specific structure will be described in detail later. In other words, the middle frame 13 and the first bracket 14 of the embodiment of the present application can not only support the back cover plate 12, but also cooperate with each other to form a sound transmission channel for communicating the microphone assembly 15 with the external environment.

The Display module 11 may be a screen such as an LCD (Liquid Crystal Display), an OLED (Organic Light-Emitting Diode), a Mini-LED, or a Micro-LED. In the embodiment of the present application, the display module 11 is an OLED screen for example. Generally, the display module 11 includes a transparent cover 111, a display panel 112 and a driving circuit assembly 113, as shown in fig. 2. The display panel 112 may be attached to the transparent cover plate 111 by using a sealant such as OCA (optical Clear Adhesive) or PSA (Pressure Sensitive Adhesive). The transparent cover 111 may be made of glass, polyimide (PI) or Colorless Polyimide (CPI), and is mainly used to protect the display panel 112, and may be used as the outer surface of the electronic device 10, so that a user can perform touch operations such as clicking and sliding operations. The display panel 112 is mainly used for displaying images, and can be used as an interactive interface for instructing a user to perform the touch operation on the transparent cover 111. The driving circuit assembly 113 is generally disposed on a side of the display panel 112 away from the transparent cover 111 and electrically connected to the display panel 112, and a detailed structure will be described later so that the display panel 112 can display a picture.

The rear cover 12 is a battery cover of the electronic device 10, and may be made of glass, metal, hard plastic, or other electrochromic materials. The rear cover 12 has a certain structural strength, and is mainly used to protect the electronic device 10 together with the transparent cover 111. Accordingly, the material of the middle frame 13 may be glass, metal, hard plastic, or the like. The middle frame 13 also has a certain structural strength, and is mainly used for supporting and fixing the microphone assembly 15 and other structural components such as a battery, a main board, a fingerprint module and a camera module. Further, since the rear cover plate 12 and the middle frame 13 are generally directly exposed to the external environment, the rear cover plate 12 and the middle frame 13 may preferably have certain properties of wear resistance, corrosion resistance, scratch resistance, etc., or the outer surfaces of the rear cover plate 12 and the middle frame 13 (i.e., the outer surfaces of the electronic device 10) may be coated with a layer of functional material for wear resistance, corrosion resistance, scratch resistance, etc. In some embodiments, the rear cover plate 12 and the middle frame 13 may be two separate structural members, as shown in fig. 1, and they may be assembled by one or a combination of clamping, gluing, welding, and the like. In other embodiments, the rear cover plate 12 and the middle frame 13 may also be integrally formed, such as by hot bending, stamping, and injection molding.

Generally, the electronic device 10 may have a box-like appearance as a whole, that is, the display module 11, the rear cover 12 and the middle frame 13 may have a rectangular structure. The display module 11 has four side edges, the rear cover plate 12 also has four side edges, and the middle frame 13 also has four side edges correspondingly; arc transition is generally adopted between every two side edges of the display module 11, between every two side edges of the rear cover plate 12 and between every two side edges of the middle frame 13, so as to increase the aesthetic appearance and the holding hand feeling of the electronic device 10. Further, at least one of the four side edges of the display module 11 may be bent toward the middle frame 13, so that the picture displayed by the display module 11 can extend from the front of the display module 11 to the side thereof in a form similar to a waterfall. Accordingly, at least one of the four side edges of the rear cover 12 may be bent toward the middle frame 13 to enhance the aesthetic appearance and grip feeling of the rear cover 12. Wherein, the curvature radius of the display module 11 bending towards the middle frame 13 may be greater than or equal to the curvature radius of the rear cover 12 bending towards the middle frame 13, so as to increase the size of the image displayed by the side of the display module 11, thereby improving the display effect of the electronic device 10.

It should be noted that the side edges in the embodiment of the present application are a simple expression, and the width of the side edges is not considered, and the dimensions of the display module 11, the rear cover 12, and the middle frame 13 in the thickness direction of the electronic device 10 are not considered.

In some embodiments, the four side edges of the display module 11 and the four side edges of the rear cover 12 may be curved toward the middle frame 13, as shown in fig. 1 and 2, that is, the side edges may be curved. So set up, not only can reduce or even hide the black border width of display module assembly 11 to make electronic equipment 10 can provide bigger demonstration field of vision for the user, can also make display module assembly 11 build a visual effect around the demonstration, thereby make electronic equipment 10 bring one kind and be different from bang screen, water droplet screen, dig the hole screen, the visual experience of flat full-face screens such as over-and-under type camera and sliding closure type camera for the user, and then increase electronic equipment 10's competitiveness. In other embodiments, the display module 11 and the rear cover 12 may also be in a single-curved, double-curved, or triple-curved structure. In the embodiment of the present application, the electronic device 10 is described by taking a structure in which the display module 11 and the back cover 12 are all four-sided curved as an example. In the electronic device 10 shown in fig. 1 and fig. 2, only a portion (for example, a quarter) of the display module 11, the rear cover 12 and the middle frame 13 is described, and the structures of the other portions are the same as or similar to those in the drawings, and are not repeated herein. The specific structure of this quarter of the electronic device 10 is described in detail below.

With continued reference to fig. 1 to 3, the transparent cover 111 includes a first straight portion 1111 and a first curved portion 1112, the first curved portion 1112 is connected to the first straight portion 1111 and has a smooth transition therebetween; the first bending portion 1112 extends toward a direction close to the middle frame 13, so that an edge area of the transparent cover 111 is bent, and a side surface of the display module 11 is curved. The transparent cover 111 may be an integrally formed structure.

In some embodiments, the display panel 112 is attached to the first flat portion 1111, so that the front surface of the display module 11 can display a picture; the first bending portion 1112 may be attached with some LED lamps to blink when the electronic device 10 receives a short message, a WeChat message, a QQ message, or the like, so as to remind the user, or may blink along with a music rhythm when the electronic device 10 plays music, so as to create a music atmosphere. In some other embodiments, the display panel 112 may include a main display portion 1121 and a sub display portion 1122, wherein the sub display portion 1122 is connected to the main display portion 1121, and the two are in smooth transition; the main display portion 1121 is attached to the first flat portion 1111, and the sub-display portion 1122 is attached to the first curved portion 1112, so that the edge region of the display panel 112 is curved, the front and the side of the display module 11 can display the image, and the electronic device 10 can provide a larger display view for the user. In the embodiment of the present application, after the display panel 112 is attached to the transparent cover 111, the minimum bending radius of the sub-display portion 1122 relative to the main display portion 1121 may be 6mm, that is, the minimum curvature radius of the display module 11 may be 6mm. Taking a mobile phone as an example, the thickness of the whole mobile phone is generally less than 10mm, and the curvature radius of the value enables the side surface of the mobile phone to display more pictures, so that the mobile phone can provide a larger display visual field for a user.

The rear cover plate 12 comprises a second straight portion 121 and a second curved portion 122, the second curved portion 122 surrounds the second straight portion 121, and the two are in smooth transition; the second bent portion 122 is bent toward a direction close to the middle frame 13 so that the edge area of the rear cover panel 12 is bent. The rear cover plate 12 may be an integrally formed structure.

Further, the first bending portion 1112 and the second bending portion 122 can be connected to two opposite surfaces of the middle frame 13 by one or a combination of clamping, gluing, welding and the like. In some other embodiments, the first flat portion 1111 and the second flat portion 121 may also be slightly curved, for example, both curved toward the middle frame 13, so that the thickness of the electronic device 10 gradually decreases from the middle area to the peripheral area.

It should be noted that the integrally formed structure in the embodiment of the present application means that the structure of the product is an organic whole, and the product cannot be easily split or divided. For example: the embodiment of the present application may use a thermal bending or heat absorption technique to bend the flat tempered glass into the curved transparent cover 111 according to predetermined process parameters, as shown in fig. 1 and 2, and the curved portion and the straight portion are naturally in a circular arc transition. The above process parameters can be reasonably designed according to factors such as the type of raw material, the bending angle and the curvature radius, and the like, and are not limited herein. Further, the OLED screen in a flat plate form may be attached to the transparent cover plate 111 to form the curved display panel 112. Therefore, in fig. 1 and 2, a line between the first straight portion 1111 and the first bent portion 1112, a line between the main display portion 1121 and the sub display portion 1122, and a line between the second straight portion 121 and the second bent portion 122 are only intended to illustrate boundaries between the above-described portions. In other words, for the transparent cover 111, the display panel 112 and the rear cover 12 in the actual product, the lines are not true, i.e. the lines smoothly transition between the parts.

Further, the rear cover 12 of the embodiment of the present application is provided with a notch 123, and the notch 123 may be specifically provided at an edge of the second bending portion 122, as shown in fig. 2, so that the rear cover 12 and the middle frame 13 cooperate to form a notch 16 at the notch 123, as shown in fig. 3, the notch 16 serves as a sound pickup hole of the microphone assembly 15. The width of the slit 123 (i.e. the size of the gap between the rear cover plate 12 and the middle frame 13) may be 0.1-0.3mm; preferably, the width may be 0.15-0.2mm, and the length of the notch 123 may be 3-4mm, that is, the notch 123 may have a rectangular structure in appearance on the rear cover plate 12. Further, the depth of the notch 123 is determined to penetrate through the rear cover 12, so that the notch 16 formed by the rear cover 12 and the middle frame 13 at the notch 123 can be used as a sound pickup hole of the microphone assembly 15. So configured, the notch 16 may be a narrow, slight gap in the appearance of the electronic device 10 to the user. Since the small gap is small, the small gap is not easily perceived by a user, and the concealment of the sound pickup hole can be increased, so that the overall consistency of the electronic device 10 in appearance can be increased. In other embodiments, the notch 123 may also be saw-toothed, including a series of micro-notches, which may be in one or more of a regular shape such as a semi-circle, a rectangle, a square, a triangle, etc. Furthermore, the rear cover 12 and the middle frame 13 may further be provided with a functional element (not shown in fig. 2 and 3) having a grid-shaped hole at the notch 123, so that the function of the sound pickup hole of the notch 16 is not affected, and the waterproof and dustproof requirements of the electronic device 10 at the notch 16 can be met.

It should be noted that the notch 123 described in the embodiment of the present application may also be opened in the middle frame 13, or opened in both the back cover plate 12 and the middle frame 13, and the notch 16 may also be formed at the notch 123 by matching the middle frame 13 and the back cover plate 12. A brief explanation will be given by taking the example in which the notch 123 is opened in the center frame 13: the width of the slit 123 (i.e., the size of the gap between the middle frame 13 and the rear cover plate 12) may be 0.1-0.3mm; preferably, the width may be 0.15-0.2mm, and the length of the notch 123 may be 3-4mm, that is, the notch 123 may be rectangular in appearance on the middle frame 13. Further, the depth of the notch 123 is determined by penetrating the middle frame 13, so that the notch 16 formed by the matching of the rear cover plate 12 and the middle frame 13 at the notch 123 can be used as a sound pickup hole of the microphone assembly 15. So configured, the notch 16 may be a narrow, slight gap in the appearance of the electronic device 10 to the user. Since the small gap is small and not easy to be perceived by a user, concealment of the sound pickup hole can be increased, and overall consistency of the electronic device 10 in appearance can be increased.

The middle frame 13 includes a frame 131 and a middle plate 132, and the middle plate 132 is connected to the frame 131. The material of the frame 131 may be metal, the material of the middle plate 132 may be rigid plastic, and the two may be made into the middle frame 13 by injection molding, that is, the middle frame 13 may be an integrally formed structural member, so that the structure of the middle frame 13 may be simplified, and the manufacturing cost of the middle frame 13 may be reduced. At this time, the frame 131 may be exposed to the external environment and has an appearance surface capable of playing a role of decoration; the middle plate 132 is mainly located inside the electronic device 10, and can support and fix the first bracket 14 and the microphone assembly 15. In the embodiment of the present application, the notch 16 may be formed by the frame 131 and the second bending portion 122. Further, the first sound transmission passage is mainly opened in the middle plate 132.

In some embodiments, the display module 11 and the rear cover 12 may have a structure that is curved in four directions in appearance, and may also have a symmetrical structure with respect to the middle frame 13 (especially, the frame 131) in appearance, as shown in fig. 4, so that the electronic device 10 can create a symmetrical aesthetic feeling for users. At this time, the maximum outline of the electronic device 10 is located on the frame 131 of the middle frame 13, as indicated by the dotted line indicated by the arrow a in fig. 4. In other embodiments, the display module 11 may further extend toward the middle frame 13 in a bending manner based on the above symmetrical structure, that is, in the thickness direction of the electronic device 10, the bending depth H1 of the display module 11 is greater than the bending depth H2 of the rear cover 12 (specifically, the bending depth of the first bending portion 1112 may be greater than the bending depth of the second bending portion 122), as shown in fig. 5, so as to increase the side display area of the display module 11, and thus, the electronic device 10 can provide a larger display view for a user. At this time, the maximum outline of the electronic device 10 is located at the first curved portion 1112 of the display module 11, as indicated by the dotted line indicated by the arrow B in fig. 5.

It should be noted that the maximum outline described in the embodiment of the present application may refer to a contour corresponding to a maximum projection area when the electronic device 10 is projected along the thickness direction thereof.

Referring to fig. 6 and 7 together, fig. 6 is a partially enlarged structural view of a portion C in fig. 1, and fig. 7 is a partially enlarged structural view of a portion D in fig. 2.

Based on the above detailed description, since the display module 11 and the rear cover 12 may be both curved structures that are curved toward the middle frame 13, when the display module 11, the rear cover 12 and the middle frame 13 are connected, an arc-shaped space is formed between the display module 11 and the rear cover 12. Therefore, one surface of the middle plate 132 close to the display module 11 may be a curved surface having the same or similar curvature radius as the display module 11 (specifically, the sub-display portion 1122), and one surface of the middle plate 132 close to the rear cover 12 may be a curved surface having the same or similar curvature radius as the rear cover 12 (specifically, the second curved portion 122), as shown in fig. 6 and 7, so that the middle plate 132 can better support the display module 11 and the rear cover 12 through the curved surface structure, thereby increasing the structural strength of the whole electronic device 10 and further increasing the reliability of the electronic device 10. In other embodiments, for example, when the curvature radius of the display module 11 and the rear cover 12 is larger (i.e. the curvature degree is smaller), one surface of the middle plate 132 close to the display module 11 and the rear cover 12 may also be a straight plane, so as to simplify the structure of the middle plate 132, thereby reducing the processing difficulty of the middle frame 13.

Further, two surfaces of the border between the frame 131 and the middle plate 132 may be recessed toward each other to form a first groove 133 and a second groove 134. Wherein, the first groove 133 is close to the display module 11, and the second groove 134 is close to the rear cover 12, as shown in fig. 6; and the distance between the first groove 133 and the second groove 134 is smaller than the width of the outer surface of the frame 131 in the thickness direction of the electronic device 10, as shown in fig. 7, so that the display module 11 can extend to the first groove 133 along the curved surface of the middle plate 132, and the rear cover 12 can extend to the second groove 134 along the curved surface of the middle plate 132, as shown in fig. 6, so that the display module 11 and the rear cover 12 can be partially hidden in the middle frame 13. That is, the middle frame 13 can protect the side edges of the display module 11 and the rear cover 12 to some extent, thereby increasing the reliability of the electronic device 10.

In this embodiment, the width of the appearance surface of the frame 131 in the thickness direction of the electronic device 10 may be less than or equal to 1.8mm; preferably, the width is greater than or equal to 1.4mm and less than or equal to 1.6mm, so that the display module 11 and the rear cover plate 12 can extend more toward each other along the middle plate 132, thereby enabling the electronic device 10 to provide a larger display view for a user. Accordingly, the appearance surface of the frame 131 may be a straight plane or an arc convex surface, so that the electronic device 10 can obtain better appearance and holding feeling. Further, the middle frame 13 is thinned from the inside to the outside of the electronic device 10 in the whole structure, as shown in fig. 6 and 7, so that the middle frame 13 can meet both requirements of ultra-thinning and structural strength, thereby increasing the reliability of the middle frame 13.

The specific structures of the first holder 14 and the microphone assembly 15 and their cooperation with the back cover 12 and the middle frame 13 will be described in detail below.

Referring to fig. 8 to 11 together, fig. 8 is a schematic cross-sectional structure of the electronic device in fig. 3 along a direction VIII-VIII, fig. 9 is a schematic cross-sectional structure of the middle frame in fig. 8, fig. 10 is a schematic cross-sectional structure of the first bracket in fig. 8, and fig. 11 is a schematic exploded structure of the electronic device in fig. 3.

In the embodiment of the present application, the first bracket 14 is disposed between the second straight portion 121 and the middle plate 132; the first bracket 14 can be spliced with the middle plate 132 as shown in fig. 8, so that the first bracket 14 supports the rear cover plate 12 together with the middle frame 13, thereby increasing the structural strength of the electronic device 10. Further, the middle plate 132 is provided with a first sound transmission channel, as shown in fig. 9; the first bracket 14 is provided with a second sound transmission channel, as shown in fig. 10; the second sound transmission channel communicates with the first sound transmission channel to form a sound transmission channel of the microphone assembly 15, as shown in fig. 8. The microphone assembly 15 is disposed between the middle plate 132 and the first bracket 14, the first sound transmission channel is communicated with the notch 16, and the second sound transmission channel extends to the microphone assembly 15, as shown in fig. 8, so that the middle frame 13 and the first bracket 14 cooperate to form a sound transmission channel of the microphone assembly 15.

For example: a sound inlet 1322 is formed in the first surface 1321 of the middle plate 132 close to the second bending portion 122, as shown in fig. 9 and 11; the sound inlet 1322 communicates with the gap 16, as shown in fig. 8. Further, a first hole 1324 is formed in the first end surface 1323 of the middle plate 132 and the first support 14, and the first hole 1324 extends to the sound inlet 1322, as shown in fig. 9; so that the middle plate 132 can form the first sound transmission channel by opening the sound inlet 1322 and the first hole 1324. In other words, the first sound-transmitting channel may be the sound inlet 1322 and the first hole 1324 penetrating through the sound-transmitting channel in fig. 9. A sound outlet 142 is formed on a second surface 141 of the second straight portion 121 of the first bracket 14 away from the rear cover 12, as shown in fig. 10; the sound outlet 142 is communicated with the microphone assembly 15, as shown in fig. 8. Further, a second hole 144 is formed in a second end face 143 where the first bracket 14 and the middle plate 132 are spliced, as shown in fig. 10 and 11, and the second hole 144 extends to the sound outlet 142, as shown in fig. 10; so that the first holder 14 can form the second sound-conveying channel by opening the sound outlet 142 and the second hole 144. In other words, the second sound transmission channel can be the sound outlet 142 and the second hole 144 penetrating in fig. 10.

Based on the above detailed description, the second hole 144 is communicated with the first hole 1324, so that the second sound transmission channel can be communicated with the first sound transmission channel, and thus the middle frame 13 and the first support 14 cooperate to form the sound transmission channel of the microphone assembly 15, as shown in fig. 8. Further, a first sealing ring 145 is disposed between the second end surface 143 and the first end surface 1323, as shown in fig. 8 and 11; so that the first bracket 14 is hermetically connected with the middle plate 132, thereby increasing the sound pickup effect of the microphone assembly 15. The first sealing ring 145 may be a sealing member such as foam, a silicone sleeve, or a sealing structure formed by curing such as glue or glue dispensing. Further, the first end surface 1323 and the second end surface 143 may not be perpendicular to the plane of the second straight portion 1121 to increase the contact area between the first end surface 1323 and the second end surface 143, as shown in fig. 8, so as to increase the sealing area of the first sealing ring 145, that is, increase the sealing performance between the first end surface 1323 and the second end surface 143, and increase the sound pickup effect of the microphone assembly 15. The first end surface 1323 and/or the second end surface 143 may further have a sink groove for placing the first seal ring 145 (the sink groove is formed in the second end surface 143 in fig. 8 and 10, but not labeled), so that structural compactness can be increased, and phenomena such as dislocation of the first seal ring 145 can be avoided under the extreme conditions such as falling of the electronic device 10, thereby increasing the sealing reliability of the first seal ring 145.

Generally, the space inside the electronic device 10 is limited, but requires a large number of structural members to be accommodated; the structure of the electronic device 10 is also often of a slim design, for example, with a thickness of only 7-8mm, resulting in the thickness of the structural components inside the electronic device 10 also often being small. For the embodiment of the present application, the first support 14 is joined to the middle frame 13 to support the rear cover plate 12, and is further communicated with the first hole 1324 through the second hole 144, so that the second sound transmission channel can be communicated with the first sound transmission channel, and the middle frame 13 and the first support 14 are matched to form a sound transmission channel of the microphone assembly 15; also, a microphone assembly 15 is disposed between the middle plate 132 and the first bracket 14. In the case that the middle frame 13 (especially the middle plate 132) and/or the first support 14 is thin, the stacking requirement of multiple structural members may cause a certain misalignment between the second hole 144 and the first hole 1324 in the thickness direction of the electronic device 10, which may affect the communication performance between the second sound transmission channel and the first sound transmission channel, and thus affect the sound pickup effect of the microphone assembly 15. To this end, in the embodiment of the present application, the first hole 1324 has a stepped hole shape near one end of the first bracket 14, as shown in fig. 9; and/or, one end of the second hole 144 close to the middle plate 132 is in a stepped hole shape as shown in fig. 10, so as to increase the communication area between the first hole 1324 and the second hole 144, as shown in fig. 8, thereby increasing the communication performance between the second sound transmission channel and the first sound transmission channel, and further increasing the sound pickup effect of the microphone assembly 15.

Based on the above detailed description, the sound inlet 1322 of the middle frame 13 and the first hole 1324 are substantially perpendicular in structure, as shown in fig. 9; the sound outlet 142 and the second hole 144 of the first bracket 14 are also substantially at right angles in configuration, as shown in fig. 10. That is, the first sound transmission channel and the second sound transmission channel are both substantially right-angled in structure, so that the sound transmission channel formed by splicing the middle frame 13 and the first support 14 is substantially zigzag in structure. Therefore, in order to satisfy the feasibility in terms of process, the middle frame 13 and the first support 14 may be manufactured separately and then spliced together. For example: the middle plate 132 made of hard plastic and the frame 131 made of metal are processed into the middle frame 13 of an integral structure by injection molding, and the middle plate 132 can form the sound inlet 1322 and the first hole 1324 by core setting. The metal frame 131 can enhance the aesthetic appearance and the wear-resistant, corrosion-resistant, scratch-resistant properties of the middle frame 13, and the hard plastic middle plate 132 can enhance the overall strength of the middle frame 13. Similarly, the first frame 14 is manufactured by injection molding, and the core is disposed so that the sound outlet 142 and the second hole 144 can be formed in the first frame 14. In other embodiments, the sound inlet 1322 of the middle frame 13 and the sound outlet 142 of the middle plate 14 may be formed by Numerical Control (CNC) machining. Further, in order to facilitate the setting of the core and the requirement of demolding thereof, and avoid the hole blocking phenomenon caused by the mold slide, the first hole 1324 may be a through hole penetrating through the middle plate 132, as shown in fig. 8 and 9; and a sealing pad 135 is disposed at a side of the first hole 1324 away from the first end surface 1323, as shown in fig. 8, the sealing pad 135 is attached to the middle plate 132 to seal an end of the first hole 1324 away from the first end surface 1323. The sealing pad 135 may be made of PET (Polyethylene Terephthalate), and may be adhered to the middle plate 132 by glue, foam, or the like. Correspondingly, the surface of the middle plate 132, which is attached to the sealing pad 135, may be an inclined surface to increase the attaching area of the sealing pad 135, and the inclined surface may further be provided with a sink groove (not labeled in fig. 8 and 9) for placing the sealing pad 135, so as to increase the structural compactness. Further, the minimum distance (shown as N in fig. 10) between the maximum depth position of the second hole 144 and the wall of the sound outlet 142 may be less than or equal to 0.1mm, so as to reduce the volume of the second hole 144, i.e. the volume of the sound transmission channel, thereby increasing the sound transmission effect of the sound transmission channel (because an excessively large sound transmission channel affects the high-frequency cut-off frequency of the sound); and the requirement of demoulding the inner core of the first support 14 is taken into consideration, so that the phenomenon of hole blocking caused by the slide of the mould is avoided, and the reliability of the first support 14 is improved.

Further, the material of the first bracket 14 may be the same as or similar to that of the middle plate 132. In the embodiment of the present application, the first bracket 14 and the middle plate 132 are made of rigid plastic. Compared with the soft rubber material, the first bracket 14 and the middle plate 132 of the embodiment of the present application are made of hard plastic, on one hand, the structural strength is better, and the problem of sound transmission channel deformation caused by external force extrusion on the first bracket 14 and the middle plate 132 in the splicing and using processes can be improved; on the other hand, the problem that burrs are easily formed in the sound transmission channel during the injection molding process of the first bracket 14 and the middle plate 132 can be improved, so that the sound transmission effect of the sound transmission channel is increased, and the communication quality of the electronic device 10 is further increased.

With continued reference to fig. 8-11, the microphone assembly 15 includes a first circuit board 151 and a microphone 152. The first circuit board 151 is used to electrically connect the microphone 152 with a main board of the electronic device 10, so that the microphone 152 picks up sound under control of the main board, and converts the picked-up sound into an electrical signal to be transmitted to the main board. The first circuit board 151 may be a flexible circuit board, which may be adapted to a complicated spatial layout inside the electronic device 10, thereby simplifying various wirings inside the electronic device 10. The first circuit board 151 is disposed on one side of the first bracket 14 close to the middle plate 132, and is provided with a sound through hole 1511, as shown in fig. 11. The microphone 152 is disposed on a side of the first circuit board 151 close to the middle plate 132, and is communicated with the sound outlet 142 through the sound transmission through hole 1511, as shown in fig. 8, so that the microphone 152 can be communicated with the external environment through the gap 16 formed by the rear cover plate 12 and the middle frame 13, and the sound transmission channel (mainly the first hole 1324 and the second hole 144) formed by splicing the middle frame 13 and the first bracket 14, so that the microphone 152 can pick up sound. In the embodiment of the present application, the microphone 152 may be first attached to the first circuit board 151 through Surface Mounting Technology (SMT), and then the second sealing ring 153 is used to achieve the sealing connection between the first circuit board 151 and the first bracket 14, as shown in fig. 8, so as to meet the sealing requirement between the first circuit board 151 and the first bracket 14. The second sealing ring 153 may be a sealing member such as a foam, a silicone sleeve, or a sealing structure formed by curing such as glue or glue dispensing. Correspondingly, the second surface 141 may be further provided with a sunken groove (not labeled in fig. 8 and 10) for placing the second sealing ring 153, so as to increase the structural compactness.

In the embodiment of the present application, an avoiding groove 1512 may be disposed at one end of the first circuit board 151 close to the middle frame 13 (specifically, the side frame 131), as shown in fig. 11; during the assembly process of the electronic apparatus 10, the first circuit board 151 can be disposed around the portion of the first bracket 14 (specifically, the second surface 141) protruding toward the middle plate 132 via the avoiding groove 1512, as shown in fig. 8 and 11, so as to increase the compactness of the electronic apparatus 10 in structure.

Generally, a function element such as a microphone mainly plays a role of picking up a voice of a user and converting a voice signal into an electric signal in an interactive process such as a user making a call, sending a voice message, and chatting a video (including voice). Further, as the user demands higher and higher call quality during the above interaction process, two microphones are generally disposed in the electronic device 10, wherein one of the two microphones is mainly used for picking up the user sound (which may be referred to as a main microphone), and the other microphone is mainly used for picking up the environmental sound (which may be referred to as a sub-microphone). The electronic device 10 may perform denoising processing according to the user sound picked up by the primary microphone and the environmental sound picked up by the secondary microphone, so as to increase the resolution (reduction degree) of the electronic device 10 to the user sound, thereby increasing the call quality of the electronic device 10 and improving the user experience. Therefore, the microphone 152 according to the embodiment of the present application may be a main microphone of the electronic device 10, or may be a sub-microphone of the electronic device 10.

It is well known that the sealing of the acoustic channel is critical in order to ensure the speech quality of the electronic device 10. Based on the above detailed description, the second sound transmission channel of the first holder 14 and the first sound transmission channel of the middle frame 13 can be sealed by the first sealing ring 145, and the first circuit board 151 of the microphone assembly 15 and the sound outlet 142 of the first holder 14 can be sealed by the second sealing ring 153. The following description will be made mainly of the sealing property between the sound inlet 1322 of the center frame 13 and the notch 16.

A sealing member 17 is disposed between the middle plate 132 and the rear cover plate 12, as shown in fig. 8, to achieve a sealed connection therebetween, so as to reduce moisture and the like in the external environment from entering the electronic device 10 through the gap between the structural members, thereby increasing the reliability of the electronic device 10. The sealing member 17 may be a sealing structure formed by curing such as glue or glue, a silica gel sleeve, or the like. Further, the sealing member 17 is provided with a sound transmission gap 171, for example, the sound transmission gap 171 is U-shaped, as shown in fig. 11, the opening direction of the sound transmission gap 171 faces the gap 16, as shown in fig. 8, so that the sealing member 17 can meet the above sealing requirement, and can also realize that the gap 16 is communicated with the sound inlet 1322, and avoid sound leakage of the sound transmission channel.

Further, in the process of assembling the rear cover plate 12 and the middle frame 13, one or a combination of foam, glue and the like may be further disposed between the second bending portion 122 of the rear cover plate 12 and the second groove 134 of the middle frame 13, so as to increase the waterproof and dustproof performance of the electronic device 10, and thus increase the reliability of the electronic device 10.

Referring to fig. 12, fig. 12 is a schematic cross-sectional structure diagram of another embodiment of the electronic device in fig. 8. It should be noted that the electronic device shown in fig. 12 mainly includes partial structures related to the rear cover plate 12, the middle frame 13, and the microphone assembly 15; the display module 11 and its related structure are not shown.

In the present embodiment, the microphone assembly 15 is disposed on one side of the middle plate 132 close to the rear cover plate 12, and the middle plate 132 is opened with a first sound transmission channel, as shown in fig. 8, the first sound transmission channel extends to the microphone assembly 15.

The middle plate 132 has a sound inlet 1322 formed on a first surface 1321 thereof near the second bending portion 122, and the sound inlet 1322 communicates with the gap 16, as shown in fig. 12. In this embodiment, the sound inlet 1322 may be expanded from the middle plate 132 to the frame 131, for example, the sound inlet 1322 is expanded from the first surface 1321 to the second groove 134 (i.e. the junction between the frame 131 and the middle plate 132, please refer to fig. 6 and fig. 7), so as to increase the communication area between the sound inlet 1322 and the gap 16, thereby increasing the sound-collecting effect of the microphone assembly 15. Further, the middle plate 132 is provided with a sound outlet 142 near the top surface 1325 of the rear cover plate 12, as shown in fig. 12; so that the sound outlet 142 communicates with the microphone assembly 15. Top surface 1325 of middle plate 132 is lower than first surface 1321, so that a space for placing microphone assembly 15 can be formed between back cover plate 12 and middle plate 132, so as to increase the compactness of electronic apparatus 10 in structure, as shown in fig. 12. Further, a sound guide slot 1327 is opened on a bottom surface 1326 of the middle plate 132 away from the rear cover plate 12, as shown in fig. 12. Wherein, one end of the sound guiding slot 1327 extends to the sound inlet 1322; the other end of the sound guiding slot 1327 extends to the sound outlet 142 so that the middle plate 132 can form a first sound transmission channel. Further, the bottom surface 1326 may be further provided with a sealing pad 135, and the sealing pad 135 is disposed on the sound guide slot 1327 to seal the sound transmission channel formed by the middle plate 132, so as to increase the sound pickup effect of the microphone assembly 15. The bottom surface 1326 may further be provided with a sunken groove (not labeled in fig. 12) for placing the sealing pad 135, so as to increase the structural compactness.

Further, other structures of this embodiment are the same as or similar to those of the above embodiments, and are not described herein again.

Based on the above detailed description, although the curved surface structure formed by bending the display module 11 and the rear cover 12 toward the middle frame 13 enables the electronic device 10 to provide a user with a larger display view and better aesthetic appearance and hand-holding feeling; however, when the length, the width, and the thickness of the electronic device 10 are fixed, the curved surface structure not only compresses the thickness of the middle frame 13 (especially the frame 131) to make the frame 131 at least partially thin, but also compresses the size of the internal space of the electronic device 10 to some extent, as shown in fig. 1 to 7, so as to change the structure of the internal space of the electronic device 10, so that the internal space of the electronic device 10 becomes more crowded, thereby affecting the arrangement of the structural components such as the battery, the motherboard, the camera module, and the fingerprint module. For the flat full-face screen, the driving circuit is usually directly attached to the edge portion of the screen. Since the side edge of the display module 11 in the present application is a curved structure (specifically, the first curved portion 1112 and the sub-display portion 1122), if the driving circuit is attached to the flat region (specifically, the first flat portion 1111 and the main display portion 1121) far away from the side edge, the driving circuit may occupy the space of other structural components, which will inevitably affect the arrangement of the structural components, even cause structural interference. For example, in order to ensure or increase the endurance of a mobile phone, the capacity of the battery of the mobile phone is generally as large as possible, which also means that the battery needs to occupy a large amount of space inside the mobile phone. Therefore, if the driving circuit module 113 is attached to the main display portion 1121, the space of the battery may be occupied, thereby affecting the capacity of the battery. Therefore, in the embodiment of the present application, the body structure (especially, the display module 11) of the electronic device 10 is redesigned, and the layout of the driving circuit assembly 113 therein is adjusted, for example, the structure of the driving circuit assembly 113 is redesigned, so that the driving circuit assembly 113 that should be originally attached to the main display portion 1121 is disposed on the sub-display portion 1122, so as to avoid the curved surface structure of the display module 11 from affecting the arrangement of the above structural members, thereby meeting the arrangement requirement of the above structural members. Furthermore, a receiving slot 136 may be formed on a surface of the middle frame 13 (specifically, the middle plate 132) close to the display module 11, and the driving circuit assembly 113 may be received in the receiving slot 136, so that even though the middle frame 13 can support the display module 11, the electronic device 10 can be more compact in structure. Of course, if the internal structure and the spatial layout of the electronic device 10 are modified in other ways so that the driving circuit is attached to the main display portion 1121 without causing adverse effects (for example, the battery capacity is sharply reduced), the driving circuit may not be attached to the sub display portion 1122.

The specific structure of the driving circuit assembly 113 and its relationship with other structures in the display module 11 will be described in detail below.

Referring to fig. 8, 13 and 14 together, fig. 13 is a schematic top view of the electronic device in fig. 1, and fig. 14 is a schematic cross-sectional view of the driving circuit assembly in fig. 8. It should be noted that the schematic cross-sectional structure shown in fig. 8 may be applied to the area where the driving circuit components are located in fig. 13. For the mobile phone, the area may correspond to the bottom of the mobile phone, that is, the sound pickup hole and the driving circuit component are disposed at the same end of the mobile phone.

In the embodiment of the present application, the driving circuit component 113 is attached to the side of the sub-display portion 1122 of the display module 11, which is far away from the transparent cover plate 111, as shown in fig. 8, that is, the driving circuit component 113 is still located at the side edge of the display module 11, so as to avoid the curved surface structure of the display module 11 from affecting the setting of other structures such as the battery, the main board, the camera module, the fingerprint module, and the like in the electronic device 10.

The driving circuit assembly 113 includes a second support 1131, a driving chip 1132 and a second circuit board 1133. The second support 1131 is mainly used to optimize the curved surface structure of the sub-display portion 1122 to a planar structure for conveniently disposing the driving chip 1132, so that the driving circuit assembly 113 can be attached to the sub-display portion 1122. The driving chip 1132 is electrically connected to the display panel 112 and mainly used for controlling the display of the display panel 112 and the interaction between the display panel and the user. The second circuit board 1133 is mainly used to electrically connect the driving chip 1132 with a motherboard of the electronic device 10, so that the driving chip 1132 receives a control command from the motherboard or feeds an interactive command back to the motherboard. Among other things, the second circuit board 1133 may be a flexible circuit board that may accommodate the complex spatial pattern inside the electronic device 10, thereby simplifying various wiring inside the electronic device 10. In this embodiment, the driving chip 1132 may be pre-attached to the flexible circuit board by a surface mounting technology, so as to simplify the structure of the driving circuit assembly 113.

The second support 1131 includes a third surface 1134 and a fourth surface 1135 that are oppositely disposed, as shown in fig. 14. The third surface 1134 is curved, for example, the radius of curvature of the first surface is the same as the radius of curvature of the sub-display 1122, as shown in fig. 8 and 14, so that the second bracket 1131 can be attached to the sub-display 1122. The fourth surface 1135 is planar, as shown in fig. 14, so that the driving chip 1132 can be directly attached to the fourth surface 1135 without bending, and thus the driving chip 1132 can be indirectly attached to the sub-display portion 1122, thereby avoiding the influence on the setting of other structural components in the electronic device 10 due to the driving chip 1132 being disposed on the main display portion 1121, and also avoiding the quality problem (because the driving chip 1132 is structurally fragile, and is not easy to be squeezed or bent) caused by the driving chip 1132 being directly disposed on the sub-display portion 1122. In general, the driving chip 1132 is not directly and tightly disposed against the edge of the sub-display portion 1122 away from the main display portion 1121, but a safety distance is set, as shown by L in fig. 14, for example, the safety distance L is 1.5mm, so as to avoid structural interference between the driving chip 1132 and structural members such as the middle frame 13, and thus increase the safety of the driving chip 1132. Further, the third surface 1134 and the fourth surface 1135 may be coated with colloids such as OCA and PSA, so that the second support 1131 is attached to the sub-display module 1122, and the driving chip 1132 and the second circuit board 1133 are attached to the second support 1131.

It should be noted that the material, size, shape, and thickness of the second support 1131 may be designed reasonably according to the mounting requirement between the driver chip 1132 and the sub-display 1122, and the like, which is not limited herein.

Referring to fig. 15, fig. 15 is a schematic cross-sectional view of another embodiment of the stent of fig. 14.

Based on the above detailed description, after the driving chip 1132 and the second circuit board 1133 are attached to the fourth surface 1135, at least one step corresponding to the thickness of the driving chip 1132 exists between the second circuit board 1133 and the fourth surface 1135, as shown in fig. 14. Since the structural strength of the flexible circuit board is generally poor, the step tends to cause the flexible circuit board to crack. To this end, the second bracket 1131 may further include a fifth surface 1136 remote from the sub-display 1122. And the fifth surface 1136 protrudes from the fourth surface 1135 relative to the third surface 1134, as shown in fig. 15, such that a step difference is formed between the fifth surface 1136 and the fourth surface 1135. In other words, the other surface of the second support 1131 facing away from the third surface 1134 thereof is stepped. The step difference between the fifth surface 1136 and the fourth surface 1135 may be equal to the thickness of the driving chip 1132, so that the driving chip 1132 can be accommodated in the second support 1131 due to the step difference, as shown in fig. 15, so that the surface of the driving chip 1132, which is away from the fourth surface 1135, can be flush with the fifth surface 1136, and further the second circuit board 1133 can be at least partially laid on the fifth surface 1136, as shown in fig. 15.

Referring to fig. 8 and 16 together, fig. 16 is a schematic view of a partial enlarged structure of a portion E in fig. 8.

For an OLED screen, the basic structure of the display panel 112 generally includes a substrate 1123, and an organic electroluminescent layer 1124 and an optical film layer 1125 stacked on the substrate 1123, as shown in fig. 16. The base 1123 is far from the transparent cover 111 (i.e., near the second support 1131), and is mainly used to support the entire display panel 112. The substrate 1123 may be a thermoplastic polyurethane film, such as a polyolefin thermoplastic film, an oriented polystyrene thermoplastic film, a polyethylene terephthalate thermoplastic film, etc., to provide the display panel 112 with a certain deformation capability, so as to facilitate the attachment of the display panel 112 to the curved transparent cover 111. The organic electroluminescent layer 1124 generally includes an emission control layer and a pixel unit (not shown in fig. 16) electrically connected to each other, and the emission control layer is electrically connected to the driving chip 1132, as shown in fig. 16, and is mainly used for enabling the display panel 112 to display a picture under the control of the driving circuit assembly 113. The optical film 1125 generally includes a polarizer and a 1/4 wavelength phase film (not shown in fig. 16), i.e., the optical film 1125 may be a circular polarizer, and is used to remove the reflected light of the ambient light after impinging on the display panel 112, so as to increase the contrast ratio of the display panel 112. In the embodiment of the present disclosure, the optical film layer 1125 is close to the transparent cover 111 (i.e., away from the second bracket 1131), that is, one side of the display panel 112 close to the optical film layer 1125 can be attached to the transparent cover 111 by an adhesive such as OCA or PSA, so that the display panel 112 can be attached to the transparent cover 111 and can form the main display portion 1121 and the sub-display portion 1122. Further, the display panel 112 may further include a touch layer 1126, a buffer layer 1127, and a shielding layer 1128. The touch layer 1126 may be one or a combination of a resistive type, a capacitive type, an acoustic wave type, an infrared type, a pressure-sensitive type, a vibration-wave-sensitive type, and the like, and is generally disposed between the organic electroluminescent layer 1124 and the optical film layer 1125, and is mainly used for receiving a touch operation performed by a user on the display module 11. The buffer layer 1127 may be made of foam, and may be disposed on a side of the substrate 1123 away from the organic electroluminescent layer 1124 for supporting and protecting the substrate 1123, and for alleviating the difference between the substrate 1123 and the shielding layer 1128 in terms of hardness, strength, deformability, and other mechanical properties. The shielding layer 1128 may be a copper foil, and may be disposed on a side of the buffer layer 1127 away from the substrate 1123, mainly for dissipating heat and shielding electromagnetic interference. Furthermore, the functional layers of the display panel 112 may be adhered by a glue (not labeled in fig. 16) such as OCA and PSA.

In order to facilitate electrical connection between the organic electroluminescent layer 1124 and the driving chip 1132, the organic electroluminescent layer 1124 is curved at the edge of the sub-display portion 1122 away from the main display portion 1121, as shown in fig. 8 and 16, so that the organic electroluminescent layer 1124 can further extend to the driving chip 1132 along the fourth surface 1135. Preferably, the organic electroluminescent layer 1124 extends along the fourth surface 1135 at least to a position between the driving chip 1132 and the second support 1131, so that the driving chip 1132 can be directly attached to the organic electroluminescent layer 1124.

Generally, the organic electroluminescent layer 1124 can be made by depositing organic and inorganic materials on the substrate 1123 by evaporation, and can have a thickness of only 0.03mm and a weak structure. For this reason, the base 1123 is not only disposed between the shielding layer 1128 and the organic electroluminescent layer 1124 to support the entire display panel 112, but may be further attached to the aforementioned bent portion of the organic electroluminescent layer 1124 to individually support a portion of the organic electroluminescent layer 1124, as shown in fig. 16, thereby increasing the reliability of the display panel 112. Further, the substrate 1131 may also extend along the organic electroluminescent layer 1124 to the area where the second support 1131 is located, so that the projection of the substrate 1131 on the fourth surface 1135 at least partially falls on the second support 1131 (colloquially referred to as "ledge"), as shown by M in fig. 16. The width M of the substrate 1131 may be greater than or equal to 0.5mm and less than or equal to 1.5mm, so that the substrate 1131 can support a local portion of the organic electroluminescent layer 1124 and does not structurally interfere with the driving chip 1132.

The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes, which are directly or indirectly applied to other related technical fields, and which are made by using the contents of the specification and the drawings of the present application, are also included in the scope of the present application.

Claims

1. An electronic device is characterized in that the electronic device comprises a display module, a rear cover plate, a middle frame, a first support and a microphone assembly, wherein the display module and the rear cover plate are respectively connected with the middle frame, the rear cover plate comprises a second straight portion and a second bending portion connected with the second straight portion, the second bending portion bends towards the middle frame, the middle frame comprises a frame and a middle plate connected with the frame, the frame and the second bending portion are matched to form a notch, the notch is used as a sound pickup hole of the microphone assembly, the first support is arranged between the second straight portion and the middle plate and is spliced with the middle plate, and the microphone assembly is arranged between the middle plate and the first support;

wherein, the medium plate is close to the first surface of second flexion has seted up into the sound mouth, go into the sound mouth UNICOM in the breach, the medium plate with first terminal surface of first support concatenation has seted up first hole, first hole is for running through the through-hole of medium plate, just one side that first hole kept away from first terminal surface is provided with sealed backing plate, sealed backing plate subsides are located the medium plate, first hole further extends to go into the sound mouth, so that the medium plate forms first sound transmission channel, first support division be equipped with UNICOM in the second sound transmission channel of first sound transmission channel, the second sound transmission channel extends to the microphone subassembly.

2. The electronic device according to claim 1, wherein the second bending portion and/or the bezel has a notch, so that the rear cover plate and the middle bezel are matched to form the notch at the notch.

3. The electronic device according to claim 1, wherein the display module comprises a transparent cover plate and a display panel, the display panel is attached to the transparent cover plate, the transparent cover plate comprises a first straight portion and a first curved portion, and the first curved portion is connected to the first straight portion.

4. The electronic device of claim 3, wherein the electronic device is a rectangular structure, four side edges of the display module are all bent towards the middle frame, and four side edges of the rear cover plate are all bent towards the middle frame.

5. The electronic device of claim 3, wherein a radius of curvature of the display module curved toward the middle frame is greater than or equal to a radius of curvature of the back cover curved toward the middle frame.

6. The electronic device according to claim 3, wherein the display panel is attached to the first flat portion.

7. The electronic device according to claim 3, wherein the display panel includes a main display portion and a sub display portion, the sub display portion is connected to the main display portion, the main display portion is attached to the first flat portion, and the sub display portion is attached to the first curved portion.

8. The electronic device of claim 1, wherein a sound outlet is formed in a second surface of the first bracket away from the second straight portion, the sound outlet is communicated with the microphone assembly, a second hole is formed in a second end surface of the first bracket, which is spliced with the middle plate, the second hole extends to the sound outlet, so that the second sound transmission channel can be formed by the bracket, and the second hole is communicated with the first hole, so that the second sound transmission channel can be communicated with the first sound transmission channel.

9. The electronic device of claim 8, wherein an end of the first hole near the first bracket is stepped; and/or one end of the second hole close to the middle plate is in a stepped hole shape.

10. The electronic device of claim 8, wherein the first end surface and the second end surface are not perpendicular to a plane of the second straight portion.

11. The electronic device of claim 8, wherein the microphone assembly comprises a first circuit board and a microphone, the first circuit board is configured to electrically connect the microphone and a motherboard of the electronic device, the first circuit board is disposed on a side of the first bracket close to the middle plate and has a sound transmission through hole, and the microphone is disposed on a side of the first circuit board close to the middle plate and is connected to the sound outlet through the sound transmission through hole.

12. The electronic device of claim 7, wherein the display module further comprises a driving circuit assembly electrically connected to the display panel and attached to a surface of the sub-display portion away from the transparent cover.

13. The electronic device of claim 12, wherein the driving circuit assembly comprises a second bracket, a driving chip, and a second circuit board, the second bracket comprises a third surface and a fourth surface that are opposite to each other, the third surface is curved so that the second bracket can be attached to the sub-display portion, the fourth surface is planar, the driving chip is attached to the fourth surface and electrically connected to the display panel, and the second circuit board is configured to electrically connect the driving chip to a main board of the electronic device.

14. The electronic device according to claim 13, wherein a radius of curvature of the third surface is the same as a radius of curvature of the sub display portion.

15. The electronic device of claim 13, wherein the second bracket further comprises a fifth surface far from the secondary display portion, and the fifth surface protrudes from the fourth surface relative to the third surface so that a step is formed between the fifth surface and the fourth surface, and the second circuit board is at least partially laid on the fifth surface.

16. The electronic device according to claim 13, wherein the display panel includes a substrate and an organic electroluminescent layer disposed on the substrate, the substrate is close to the second bracket, and the organic electroluminescent layer is curved at an edge of the sub-display portion away from the main display portion, so that the organic electroluminescent layer can further extend along the fourth surface to the driving chip, and the organic electroluminescent layer is electrically connected to the driving chip.