CN112636843A - Spread spectrum module and on-chip test system - Google Patents
Spread spectrum module and on-chip test system Download PDFInfo
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- H04B17/00—Monitoring; Testing
- H04B17/10—Monitoring; Testing of transmitters
- H04B17/101—Monitoring; Testing of transmitters for measurement of specific parameters of the transmitter or components thereof
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- H—ELECTRICITY
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Abstract
本发明提供一种扩频模块及在片测试系统，包括：微波开关，将激励信号发送至第一或第二倍频器；放大器，对第二倍频信号进行放大；定向耦合器，将信号传输至双定向耦合器；双定向耦合器，将定向耦合器的输出信号的一部分直通输出，另一部分耦合输出作为参考信号，并将测试件的反馈信号通过另一耦合支路耦合输出；衰减器，对第一倍频信号进行衰减得到线性参数，将第二倍频信号直接输出得到非线性参数；第一混频器，产生参考中频信号；第二混频器，产生测试中频信号。本发明采用微波开关切换的方式获得小信号和大信号，同时设置在片高低温探针台，进而在高低温环境下完成毫米波太赫兹放大器芯片的线性和非线性参数幅相误差校准及连续频率扫描测试。
The invention provides a spectrum spread module and an on-chip testing system, comprising: a microwave switch, which sends an excitation signal to a first or second frequency multiplier; an amplifier, which amplifies the second frequency multiplier signal; and a directional coupler, which converts the signal Transmission to the dual directional coupler; dual directional coupler, part of the output signal of the directional coupler is directly output, the other part is coupled out as a reference signal, and the feedback signal of the test piece is coupled out through another coupling branch; attenuator , the first frequency multiplied signal is attenuated to obtain linear parameters, and the second frequency multiplied signal is directly output to obtain nonlinear parameters; the first frequency mixer generates a reference intermediate frequency signal; the second frequency mixer generates a test intermediate frequency signal. The invention adopts the method of microwave switching to obtain small signals and large signals, and sets high and low temperature probe stations on the chip at the same time, and then completes the linear and nonlinear parameter amplitude and phase error calibration and continuous calibration of the millimeter wave terahertz amplifier chip under the high and low temperature environment. Frequency sweep test.
Description
Technical Field
The invention relates to the technical field of microelectronic test and measurement, in particular to a spread spectrum module and an on-chip test system.
Background
Wafer amplifier testing of semiconductors typically involves performing full parametric testing of signals, such as linear and nonlinear parametric testing, at a probe station in a high and low temperature environment. In the traditional test method, when linear parameter test is carried out, an on-chip test system with a vector network analyzer as a core is mainly used; when the nonlinear parameter test is carried out, the on-chip test system mainly takes a signal source and a power meter or the signal source and a spectrometer as the core. Such methods have significant drawbacks: first, the non-linear test method cannot correct errors to the probe tip because vector error calibration cannot be performed. Secondly, the complete test of the full parameters needs to disassemble and connect a plurality of sets of test systems for many times, so that the test uncertainty is increased, and the biggest defect is that the method can not obtain the information of the test amplitude and phase under the nonlinear test condition at the same time.
In another testing method, an on-chip testing scheme of Load Pull is adopted, but the scheme has obvious disadvantages, for example, a core device of a passive Load Pull testing system is an impedance tuner, because of loss of the impedance tuner, influence of insertion loss of the impedance tuner cannot be eliminated after calibration is finished, a testing range is limited, the higher the frequency is, the larger the loss of the tuner is, the larger the influence is, and meanwhile, the Load Pull testing can only be performed on a certain frequency point.
Therefore, designing a set of millimeter wave terahertz on-chip test system capable of completing full parameter test improves the test efficiency on the premise of reducing the test uncertainty, and becomes one of the problems to be solved urgently by the technical staff in the field.
Disclosure of Invention
In view of the above drawbacks of the prior art, an object of the present invention is to provide a spread spectrum module and an on-chip test system, which are used to solve the problems in the prior art that the on-chip test system cannot complete full-parameter testing, the test frequency is limited, the test uncertainty is high, and the operation is complicated.
To achieve the above and other related objects, the present invention provides a spreading module, comprising:
the frequency multiplier comprises a microwave switch, a first frequency multiplier, a second frequency multiplier, an amplifier, a directional coupler, a dual directional coupler, an attenuator, a first frequency mixer and a second frequency mixer;
the microwave switch receives an excitation signal and a trigger signal, and sends the excitation signal to the first frequency multiplier or the second frequency multiplier based on the trigger signal;
the first frequency multiplier is connected with a first output end of the microwave switch and is used for multiplying the frequency of the excitation signal to obtain a first frequency multiplication signal;
the second frequency multiplier is connected with a second output end of the microwave switch and is used for multiplying the frequency of the excitation signal to obtain a second frequency-multiplied signal; the amplifier is connected with the output end of the second frequency multiplier and is used for amplifying the second frequency multiplication signal;
the directional coupler is connected with the first frequency multiplier and the output end of the amplifier, and transmits the output signal of the first frequency multiplier or the amplifier to the double directional coupler;
the dual directional coupler outputs a part of output signals of the directional coupler in a through way, the other part of the output signals are coupled and output to be used as reference signals, and feedback signals of the test piece output by the attenuator are coupled and output;
the attenuator is connected with the double-directional coupler, attenuates the first frequency doubling signal output by the double-directional coupler to obtain a linear parameter for testing, and directly outputs an amplified signal of the second frequency doubling signal output by the double-directional coupler to obtain a nonlinear parameter for testing;
the first mixer is connected with the bi-directional coupler and used for down-converting the reference signal to obtain a reference intermediate frequency signal;
the second mixer is connected with the dual directional coupler and used for down-converting the feedback signal of the tested piece to obtain a test intermediate frequency signal.
Optionally, the feedback signal of the tested piece is a reflected signal of the tested piece or a test signal output by the tested piece.
To achieve the above and other related objects, the present invention further provides an on-chip test system, comprising:
a vector network analyzer, a probe station and the spectrum spreading module;
the vector network analyzer is used for generating an excitation signal required by the test and processing a test intermediate frequency signal;
the spread spectrum module is connected with the vector network analyzer, expands the frequency of an excitation signal output by the vector network analyzer to obtain a linear parameter and a nonlinear parameter for testing, converts a feedback signal of the tested piece into a test intermediate frequency signal and transmits the test intermediate frequency signal to the vector network analyzer;
the probe station is connected with the spread spectrum module and used for bearing and fixing a tested piece and testing the tested piece based on the parameters provided by the spread spectrum module.
Optionally, the vector network analyzer includes a transceiving test module, a reference receiving module, and a signal processing module;
the receiving and transmitting test module is connected with the spread spectrum module, provides an excitation signal and a local oscillator signal for the spread spectrum module, and receives a test intermediate frequency signal output by the spread spectrum module;
the reference receiving module is connected with the spread spectrum module and receives a reference intermediate frequency signal output by the spread spectrum module;
the signal processing module is connected with the transceiving test module and the reference receiving module, and processes the reference intermediate frequency signal and the test intermediate frequency signal to obtain a test result.
Optionally, the vector network analyzer is connected to the spectrum spreading module through a coaxial cable.
Optionally, the probe station is a manual probe station, a semi-automatic probe station, a full-automatic probe station or a high and low temperature probe station.
Optionally, the spread spectrum module is connected with the probe station through a waveguide-to-coplanar waveguide adapter.
Optionally, the on-chip test system further includes a programmable power supply, where the programmable power supply is connected to the vector network analyzer, and provides direct current power for the tested piece and monitors current information of the tested piece in a working state in real time, so as to complete a power added efficiency test on the tested chip.
Optionally, the vector network analyzer is connected to the programmable power supply through a GPIB line.
More optionally, the on-chip test system further includes a power meter, where the power meter is connected to the spectrum spreading module before testing to obtain power information of an output signal of the spectrum spreading module, and sends the power information to the vector network analyzer, so as to calibrate the output power.
More optionally, the on-chip test system is applied to a millimeter wave terahertz waveband, and the spectrum spreading module spreads an excitation signal provided by the vector network analyzer to the millimeter wave terahertz waveband.
As described above, the spread spectrum module and the on-chip test system of the present invention have the following advantageous effects:
according to the on-chip testing system, two signal paths are designed through the spread spectrum module, and the small signal output power required by linear parameter testing and the large signal output power required by nonlinear parameter testing are obtained in a microwave switch switching mode, so that the whole testing system calibrates the testing reference surface to the probe tip, and the amplitude-phase testing of linear and nonlinear parameter continuous frequency scanning of the millimeter wave terahertz amplifier chip under the high-temperature and low-temperature on-chip testing system is completed.
Drawings
Fig. 1 is a schematic structural diagram of a spreading module according to the present invention.
FIG. 2 is a schematic diagram of an on-chip test system according to the present invention.
Description of the element reference numerals
1 spread spectrum module
11 microwave switch
12 first frequency multiplier
13 second frequency multiplier
14 amplifier
15 directional coupler
16 bi-directional coupler
17 attenuator
18 first mixer
19 second mixer
2 vector network analyzer
3 Probe station
4 program control power supply
5 power meter
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 1-2. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated.
Example one
As shown in fig. 1, the present embodiment provides a spreading module 1, where the spreading module 1 includes:
a microwave switch 11, a first frequency multiplier 12, a second frequency multiplier 13, an amplifier 14, a directional coupler 15, a dual directional coupler 16, an attenuator 17, a first mixer 18 and a second mixer 19.
As shown in fig. 1, the microwave switch 11 receives a driving signal and a trigger signal, and sends the driving signal to the first frequency multiplier 12 or the second frequency multiplier 13 based on the trigger signal.
Specifically, in this embodiment, the microwave switch 11 is a single-pole double-throw switch, and includes an input end, a control end, and two output ends, where the input end of the microwave switch 11 receives the excitation signal, and the excitation signal is a fundamental wave radio frequency signal; the control end of the microwave switch 11 is connected with the trigger signal; two output ends of the microwave switch 11 are respectively connected to the first frequency multiplier 12 and the second frequency multiplier 13 to send the excitation signal to a small signal path or a large signal path. As an example, when the trigger signal is at a low level, a small signal path is turned on, and the excitation signal is output to the first frequency multiplier 12; when the trigger signal is at a high level, the large signal path is turned on, and the excitation signal is output to the second frequency multiplier 13; in practical use, the corresponding relationship between the level of the trigger signal and the signal path can be set according to needs, and is not limited to this embodiment.
As shown in fig. 1, the first frequency multiplier 12 is connected to the first output end of the microwave switch 11, and multiplies the frequency of the excitation signal to obtain a first multiplied signal.
Specifically, in the present embodiment, the first frequency multiplier 12 multiplies the frequency of the excitation signal to expand the frequency thereof to the millimeter wave terahertz frequency band. In practical use, the received excitation signal may be multiplied to a predetermined frequency band based on the requirement, which is not limited in this embodiment.
As shown in fig. 1, the second frequency multiplier 13 is connected to the second output end of the microwave switch 11, and multiplies the excitation signal to obtain a second frequency-multiplied signal.
Specifically, in the present embodiment, the second frequency multiplier 13 multiplies the frequency of the excitation signal to expand the frequency of the excitation signal to a millimeter wave terahertz frequency band. In practical use, the received excitation signal may be multiplied to a predetermined frequency band based on the requirement, which is not limited in this embodiment.
As shown in fig. 1, the amplifier 14 is connected to the output end of the second frequency multiplier 13, and amplifies the second frequency multiplied signal.
As shown in fig. 1, the directional coupler 15 is connected to the output ends of the first frequency multiplier 12 and the amplifier 14, and transmits the output signal of the first frequency multiplier 12 or the amplifier 14 to the dual directional coupler 16.
Specifically, in the present embodiment, the through input terminal of the directional coupler 15 is connected to the output terminal of the amplifier 14, and the output signal of the amplifier 14 is through-outputted via the main circuit; the coupling input end of the directional coupler 15 is connected to the output end of the first frequency multiplier 12, and the output signal of the first frequency multiplier 12 is coupled from the branch circuit to the main circuit and then output.
As shown in fig. 1, the dual directional coupler 16 is connected to the output end of the directional coupler 15, and outputs a part of the output signal of the directional coupler 15 through, and the other part of the output signal is coupled out as a reference signal, and the feedback signal of the test piece output by the attenuator 17 is coupled out from the other path as a test signal.
Specifically, in the present embodiment, the dual directional coupler 16 includes two paths; the output signal of the directional coupler 15 is connected to the first input terminal of the dual directional coupler 16, and most of the output signal of the directional coupler 15 is output to the first direct-current output terminal via the first main circuit for testing; a small part of the output signal of the directional coupler 15 is coupled from the first main branch to the first branch and is output through the first coupled output terminal as a reference signal. The feedback signal of the test piece output by the attenuator 17 is connected to the second input terminal of the bi-directional coupler 16, the feedback signal of the test piece is input into the bi-directional coupler 16 through the second main path, and a part of the feedback signal of the test piece is coupled from the second main path to the second branch path and output through the second coupling output terminal.
As shown in fig. 1, the attenuator 17 is connected to the dual directional coupler 16, and attenuates the first frequency multiplication signal output by the dual directional coupler 16 to obtain a small signal power output (linear parameter), and directly outputs (without performing attenuation processing) the second frequency multiplication signal output by the dual directional coupler 16 to obtain a large signal power output (nonlinear parameter).
Specifically, in this embodiment, the attenuator 17 is an attenuator with adjustable attenuation degree, which can be adjusted according to the requirement, so as to further simplify the operation.
It should be noted that "small signal power output" and "small signal" described in the present invention refer to signals in a linear region, and the frequency spectrum and power of the linear region satisfy: the output is equal to k times the input, k being a real number not equal to zero. The large signal power output and the large signal power output refer to signals in a nonlinear region, and the frequency spectrum and the power of the nonlinear region meet the following conditions: the output characteristics are not linearly related to the input, including but not limited to power compression or third order intermodulation. Different tested pieces have different boundaries of linear regions and non-linear regions, and parameters of each device in the spectrum spreading module 1 can be set based on different tested pieces, which is not described in detail herein.
As shown in fig. 1, the first mixer 18 is connected to the bi-directional coupler 16, and down-converts the reference signal to obtain a reference intermediate frequency signal.
Specifically, a radio frequency input end of the first mixer 18 is connected to a first coupling output end of the dual directional coupler 16, a local oscillation input end of the first mixer 18 receives a local oscillation signal, the reference signal is down-converted by frequency mixing, and an output end of the first mixer 18 outputs a reference intermediate frequency signal.
As shown in fig. 1, the second mixer 19 is connected to the dual directional coupler 16, and down-converts the feedback signal of the device under test to obtain a test intermediate frequency signal.
Specifically, a radio frequency input end of the second mixer 19 is connected to a second coupling output end of the dual directional coupler 16, a local oscillation input end of the second mixer 19 receives the local oscillation signal, a down-conversion is performed on the feedback signal of the tested device through frequency mixing, and an output end of the second mixer 19 outputs a test intermediate frequency signal. The feedback signal of the tested piece includes, but is not limited to, the reflection signal of the tested piece and the test signal output by the tested piece, and any signal including the test information is the feedback signal of the tested piece of the present invention, which is not described herein again.
The spread spectrum module can be applied to any system needing linear and nonlinear parameter testing, can avoid repeated establishment of the system when different parameters are tested, effectively simplifies the complexity of operation and improves the testing performance.
Example two
As shown in fig. 2, the present embodiment provides an on-chip test system, which includes:
As shown in fig. 2, the vector network analyzer 2 is used for generating an excitation signal required for a test and processing a test intermediate frequency signal.
Specifically, the vector network analyzer 2 is a test device for electromagnetic wave energy, and can measure various parameter amplitudes and phases of a single-port network or a two-port network. As an example, the vector network analyzer 2 is used for completing tests of linear parameters and nonlinear parameters in the millimeter wave terahertz frequency band, including but not limited to S parameters, gain xdB compression, power P-xdB characteristics, and standing wave tests, which are not described herein in detail.
Specifically, in this embodiment, the vector network analyzer 2 includes a transceiving test module, a reference receiving module and a signal processing module; the receiving and transmitting test module is connected with the spread spectrum module 1, provides an excitation signal and a local oscillation signal for the spread spectrum module 1, and receives a test intermediate frequency signal output by the spread spectrum module 1. The reference receiving module is connected with the spread spectrum module 1 and receives the reference intermediate frequency signal output by the spread spectrum module 1. The signal processing module is connected with the transceiving test module and the reference receiving module, and processes the reference intermediate frequency signal and the test intermediate frequency signal to obtain a test result.
It should be noted that the vector network analyzer 2 is not limited to the modules listed in this embodiment, and any module that can be used for auxiliary testing is applicable to the vector network analyzer 2 of the present invention, and is not limited to this embodiment.
As shown in fig. 2, the spread spectrum module 1 is connected to the vector network analyzer 2, expands the frequency of the excitation signal output by the vector network analyzer 2 to obtain a linear parameter and a nonlinear parameter for testing, and converts the feedback signal of the tested piece into a test intermediate frequency signal to be transmitted to the vector network analyzer 2.
Specifically, the structure and the working principle of the spectrum spreading module 1 are referred to in the first embodiment, which is not described herein again. In this embodiment, the on-chip test system is applied to a millimeter wave terahertz frequency band, and the first frequency multiplier and the second frequency multiplier in the spectrum spreading module 1 spread the excitation signal to the millimeter wave terahertz frequency band, so that the vector network analyzer 2 can process the signal of the millimeter wave terahertz frequency band. The amplifier is a millimeter wave terahertz amplifier, the first mixer and the second mixer are millimeter wave terahertz mixers, and the attenuator is a millimeter wave terahertz adjustable attenuator.
As shown in fig. 2, the probe station 3 is connected to the spectrum spreading module 1, and is configured to carry and fix a tested piece and test the tested piece based on parameters provided by the spectrum spreading module.
Specifically, the probe station 3 includes, but is not limited to, a manual probe station, a semi-automatic probe station, a fully automatic probe station, or a high and low temperature probe station with a temperature control system. In the embodiment, a high-temperature and low-temperature probe station is adopted to provide a temperature environment required by testing for a tested piece, so that multi-parameter high-temperature and low-temperature on-chip testing of millimeter wave terahertz frequency band linear and nonlinear frequency scanning is realized. The tested piece comprises but is not limited to a tested chip, and in the embodiment, the tested piece is a millimeter wave terahertz amplifier chip.
As shown in fig. 2, as an implementation manner of the present invention, the vector network analyzer 2 is connected to the spectrum spreading module 1 through a coaxial cable, and the spectrum spreading module 1 is connected to the probe station 3 through a waveguide-to-coplanar waveguide adapter. In practical use, different modes can be selected to connect the vector network analyzer and the spectrum spreading module, and the spectrum spreading module and the probe station according to needs, which are not described herein in detail.
As shown in fig. 2, as an implementation manner of the present invention, the on-chip test system further includes a programmable Power supply 4, where the programmable Power supply 4 is connected to the vector network analyzer 2, provides direct current Power for the tested device, and monitors current information of the tested device in an operating state in real time through connection with a communication control interface of the vector network analyzer 2, so as to implement Power-added efficiency (PAE) tests on the tested device (including but not limited to the terahertz millimeter wave amplifier chip). As an example, the vector network analyzer 2 and the programmed power supply 4 are connected by a GPIB line. In practical use, different modes can be selected to connect the vector network analyzer and the programmable power supply as required, which is not described herein again.
As shown in fig. 2, as an implementation manner of the present invention, the on-chip test system further includes a power meter 5, where the power meter 5 is connected to the spectrum spreading module 1 before testing to obtain power information of an output signal of the spectrum spreading module 1, and sends the power information to the vector network analyzer 2, so as to calibrate the output power.
According to the on-chip test, two signal paths are designed through the millimeter wave terahertz spread spectrum module, and the small signal output power required by the linear parameter test and the large signal output power required by the nonlinear parameter test are obtained in a microwave switch switching mode, so that the whole test system can finish the amplitude-phase error calibration of the linear and nonlinear parameter on-chip test system of the millimeter wave terahertz amplifier and the continuous frequency scanning on-chip test under the high and low temperature environment; amplitude phase information of linear and nonlinear parameters can be obtained through one-time connection calibration, and a plurality of systems do not need to be frequently disassembled and built; meanwhile, the test reference surface is moved to the probe tip from the waveguide port, so that the test uncertainty is effectively reduced, and the test efficiency is improved.
In summary, the present invention provides a spread spectrum module and an on-chip test system, wherein the spread spectrum module includes: the frequency multiplier comprises a microwave switch, a first frequency multiplier, a second frequency multiplier, an amplifier, a directional coupler, a dual directional coupler, an attenuator, a first frequency mixer and a second frequency mixer; the microwave switch receives an excitation signal and a trigger signal, and sends the excitation signal to the first frequency multiplier or the second frequency multiplier based on the trigger signal; the first frequency multiplier is connected with a first output end of the microwave switch and is used for multiplying the frequency of the excitation signal to obtain a first frequency multiplication signal; the second frequency multiplier is connected with a second output end of the microwave switch and is used for multiplying the frequency of the excitation signal to obtain a second frequency-multiplied signal; the amplifier is connected with the output end of the second frequency multiplier and is used for amplifying the second frequency multiplication signal; the directional coupler is connected with the first frequency multiplier and the output end of the amplifier, and transmits the output signal of the first frequency multiplier or the amplifier to the double directional coupler; the dual directional coupler outputs a part of output signals of the directional coupler in a through way, the other part of the output signals are coupled and output to be used as reference signals, and feedback signals of the test piece output by the attenuator are coupled and output; the attenuator is connected with the double-directional coupler, attenuates the first frequency doubling signal output by the double-directional coupler to obtain a linear parameter for testing, and directly outputs an amplified signal of the second frequency doubling signal output by the double-directional coupler to obtain a nonlinear parameter for testing; the first mixer is connected with the bi-directional coupler and used for down-converting the reference signal to obtain a reference intermediate frequency signal; the second mixer is connected with the dual directional coupler and used for down-converting the feedback signal of the tested piece to obtain a test intermediate frequency signal. According to the on-chip test system, two signal paths are designed through the spread spectrum module, the 'small signal' output power required by linear parameter test and the 'large signal' output power required by nonlinear parameter test are obtained in a microwave switch switching mode, and meanwhile, the high-low temperature probe station is arranged, so that the whole test system can finish amplitude-phase error calibration of linear and nonlinear parameter on-chip test systems of the millimeter wave terahertz amplifier in high-low temperature environments and continuous frequency scanning on-chip test. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (11)
1. A spreading module, the spreading module comprising:
the frequency multiplier comprises a microwave switch, a first frequency multiplier, a second frequency multiplier, an amplifier, a directional coupler, a dual directional coupler, an attenuator, a first frequency mixer and a second frequency mixer;
the microwave switch receives an excitation signal and a trigger signal, and sends the excitation signal to the first frequency multiplier or the second frequency multiplier based on the trigger signal;
the first frequency multiplier is connected with a first output end of the microwave switch and is used for multiplying the frequency of the excitation signal to obtain a first frequency multiplication signal;
the second frequency multiplier is connected with a second output end of the microwave switch and is used for multiplying the frequency of the excitation signal to obtain a second frequency-multiplied signal; the amplifier is connected with the output end of the second frequency multiplier and is used for amplifying the second frequency multiplication signal;
the directional coupler is connected with the first frequency multiplier and the output end of the amplifier, and transmits the output signal of the first frequency multiplier or the amplifier to the double directional coupler;
the dual directional coupler outputs a part of output signals of the directional coupler in a through way, the other part of the output signals are coupled and output to be used as reference signals, and feedback signals of the test piece output by the attenuator are coupled and output;
the attenuator is connected with the double-directional coupler, attenuates the first frequency doubling signal output by the double-directional coupler to obtain a linear parameter for testing, and directly outputs an amplified signal of the second frequency doubling signal output by the double-directional coupler to obtain a nonlinear parameter for testing;
the first mixer is connected with the bi-directional coupler and used for down-converting the reference signal to obtain a reference intermediate frequency signal;
the second mixer is connected with the dual directional coupler and used for down-converting the feedback signal of the tested piece to obtain a test intermediate frequency signal.
2. The spread spectrum module of claim 1, wherein: the feedback signal of the tested piece is the reflection signal of the tested piece or the test signal output by the tested piece.
3. An on-chip test system, comprising at least:
a vector network analyzer, a probe station and a spread spectrum module according to claim 1 or 2;
the vector network analyzer is used for generating an excitation signal required by the test and processing a test intermediate frequency signal;
the spread spectrum module is connected with the vector network analyzer, expands the frequency of an excitation signal output by the vector network analyzer to obtain a linear parameter and a nonlinear parameter for testing, converts a feedback signal of the tested piece into a test intermediate frequency signal and transmits the test intermediate frequency signal to the vector network analyzer;
the probe station is connected with the spread spectrum module and used for bearing and fixing a tested piece and testing the tested piece based on the parameters provided by the spread spectrum module.
4. The on-chip test system of claim 3, wherein: the vector network analyzer comprises a transceiving test module, a reference receiving module and a signal processing module;
the receiving and transmitting test module is connected with the spread spectrum module, provides an excitation signal and a local oscillator signal for the spread spectrum module, and receives a test intermediate frequency signal output by the spread spectrum module;
the reference receiving module is connected with the spread spectrum module and receives a reference intermediate frequency signal output by the spread spectrum module;
the signal processing module is connected with the transceiving test module and the reference receiving module, and processes the reference intermediate frequency signal and the test intermediate frequency signal to obtain a test result.
5. The on-chip test system of claim 3, wherein: the vector network analyzer is connected with the spread spectrum module through a coaxial cable.
6. The on-chip test system of claim 3, wherein: the probe station is a manual probe station, a semi-automatic probe station, a full-automatic probe station or a high-low temperature probe station.
7. The on-chip test system of claim 3, wherein: the spread spectrum module is connected with the probe station through a waveguide-to-coplanar waveguide adapter.
8. The on-chip test system of claim 3, wherein: the on-chip testing system further comprises a programmable power supply, wherein the programmable power supply is connected with the vector network analyzer and provides direct current power supply for the tested piece and monitors the current information of the tested piece in a working state in real time so as to complete the power additional efficiency test of the tested piece.
9. The wafer test system of claim 8, wherein: and the vector network analyzer is connected with the program-controlled power supply through a GPIB (general purpose interface bus) line.
10. The on-chip test system according to any one of claims 3 to 9, wherein: the on-chip test system further comprises a power meter, wherein the power meter is connected with the spread spectrum module before testing to obtain power information of signals output by the spread spectrum module, and the power information is sent to the vector network analyzer to realize calibration of output power.
11. The on-chip test system of claim 10, wherein: the on-chip test system is applied to a millimeter wave terahertz waveband, and the spectrum spreading module spreads an excitation signal provided by the vector network analyzer to the millimeter wave terahertz waveband.
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