CN112536735B - Diamond grinding wheel and preparation method thereof - Google Patents
Diamond grinding wheel and preparation method thereof Download PDFInfo
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- CN112536735B CN112536735B CN202011187898.XA CN202011187898A CN112536735B CN 112536735 B CN112536735 B CN 112536735B CN 202011187898 A CN202011187898 A CN 202011187898A CN 112536735 B CN112536735 B CN 112536735B
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 168
- 239000010432 diamond Substances 0.000 title claims abstract description 168
- 238000000227 grinding Methods 0.000 title claims abstract description 70
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 239000002245 particle Substances 0.000 claims abstract description 95
- 239000002131 composite material Substances 0.000 claims abstract description 85
- 238000005245 sintering Methods 0.000 claims abstract description 53
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 30
- 239000010439 graphite Substances 0.000 claims abstract description 30
- 239000000843 powder Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 24
- 150000002736 metal compounds Chemical class 0.000 claims abstract description 22
- 238000002156 mixing Methods 0.000 claims abstract description 10
- 239000000956 alloy Substances 0.000 claims abstract description 5
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 5
- 238000000151 deposition Methods 0.000 claims description 45
- 230000008021 deposition Effects 0.000 claims description 32
- CAVCGVPGBKGDTG-UHFFFAOYSA-N alumanylidynemethyl(alumanylidynemethylalumanylidenemethylidene)alumane Chemical compound [Al]#C[Al]=C=[Al]C#[Al] CAVCGVPGBKGDTG-UHFFFAOYSA-N 0.000 claims description 23
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 23
- 238000007731 hot pressing Methods 0.000 claims description 21
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 17
- 239000010936 titanium Substances 0.000 claims description 17
- 229910052719 titanium Inorganic materials 0.000 claims description 17
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 16
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 16
- 239000002905 metal composite material Substances 0.000 claims description 12
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 11
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- UFGZSIPAQKLCGR-UHFFFAOYSA-N chromium carbide Chemical compound [Cr]#C[Cr]C#[Cr] UFGZSIPAQKLCGR-UHFFFAOYSA-N 0.000 claims description 7
- 229910003470 tongbaite Inorganic materials 0.000 claims description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- UGACIEPFGXRWCH-UHFFFAOYSA-N [Si].[Ti] Chemical compound [Si].[Ti] UGACIEPFGXRWCH-UHFFFAOYSA-N 0.000 claims description 6
- UMUXBDSQTCDPJZ-UHFFFAOYSA-N chromium titanium Chemical compound [Ti].[Cr] UMUXBDSQTCDPJZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 3
- 239000012153 distilled water Substances 0.000 claims description 3
- 229910017604 nitric acid Inorganic materials 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 2
- 238000010411 cooking Methods 0.000 claims description 2
- 238000005406 washing Methods 0.000 claims description 2
- 229910052594 sapphire Inorganic materials 0.000 abstract description 23
- 239000010980 sapphire Substances 0.000 abstract description 23
- 238000012545 processing Methods 0.000 abstract description 8
- 238000009966 trimming Methods 0.000 abstract description 4
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 10
- 239000000523 sample Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000002585 base Substances 0.000 description 6
- 239000002994 raw material Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000007767 bonding agent Substances 0.000 description 4
- 239000013068 control sample Substances 0.000 description 4
- 239000013077 target material Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009210 therapy by ultrasound Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
- B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
- B24D7/066—Grinding blocks; their mountings or supports
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0635—Carbides
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention provides a diamond grinding wheel, which comprises a grinding wheel base body and a diamond composite sintered block bonded on the grinding wheel base body, wherein the diamond composite sintered block is mainly formed by uniformly mixing and sintering composite diamond particles, pre-alloy powder and flaky graphite at high temperature, and the composite diamond particles mainly comprise diamond particles and wear-resistant metal compounds formed on the surfaces of the diamond particles. The invention also provides a preparation method of the diamond grinding wheel, which comprises the following steps: diamond particle pretreatment, formation of wear-resistant metal compounds, preparation of diamond composite sintered blocks and preparation of grinding wheels. Therefore, the diamond grinding wheel provided by the invention has the characteristics of good wear resistance, long service life and the like; the sapphire thinning process can be applied, the times of trimming of the sapphire in the thinning process can be reduced, and therefore the sapphire thinning processing efficiency is improved.
Description
Technical Field
The invention belongs to the technical field of application and processing of superhard materials, and particularly relates to a diamond grinding wheel and a preparation method thereof.
Background
Sapphire is a single crystal of alumina, has a unique lattice structure, is wear-resistant, has hardness second to that of diamond, has good light transmittance and electrical insulation, and is an ideal substrate material for LEDs, SOSs and the like. Since the 90 s when LED lighting has gradually penetrated into human life, sapphire has begun to be widely used as an LED substrate material, and the market size of sapphire is expected to be about 105 billion in 2021 s. The thinning of the sapphire substrate is an essential process in the production process of the LED. At present, grinding wheel thinning is mainly adopted for sapphire thinning, due to the brittleness of sapphire and the fact that the deep scratch after the sapphire is thinned affects the subsequent cutting process, the sapphire needs to be trimmed in the thinning process, and the grinding wheel trimming time is one of the important links affecting the processing efficiency.
Diamond is widely used in various fields because of its high hardness, high chemical stability, high wear resistance and low friction coefficient. The abrasive material adopted by the prior sapphire thinning grinding wheel is diamond. The diamond grinding wheel is a finished product which takes diamond particles as cutting materials and is made into a certain shape and a certain purpose by pressing, sintering and processing with the help of a bonding agent or other auxiliary materials, and the diamond has poor chemical affinity to some bonding metals or alloys and is not easy to be wetted by the bonding metals or alloys in the using process, so that the application performance of the diamond grinding wheel is poor. The diamond abrasive is easy to fall off during the use of the grinding tool due to the low bonding strength between the bonding agent and the abrasive, and the service life of the abrasive is shortened.
The existing chemical plating is facing to the updating challenge because the waste acid and waste alkali which are often generated in the diamond preparation process seriously affect the environment. Vacuum micro-evaporation plating can be used for plating the diamond surface, but at present, metal plating is mainly used. Usually nickel plating, titanium plating, tungsten plating, chromium plating, and the like. The existing plated diamond is mostly used for resin bonding agent, and the plated diamond suitable for metal bonding agent is less. Therefore, the diamond grinding wheel for sapphire thinning still has the problems of easy falling of diamond grinding materials, poor wear resistance, short service life and the like, so that the sapphire thinning processing efficiency is influenced.
Disclosure of Invention
In view of this, the present invention provides a diamond grinding wheel and a method for manufacturing the same, so as to solve the problem of low sapphire thinning efficiency.
The diamond composite sintered block is mainly formed by uniformly mixing composite diamond particles, prealloy powder and flake graphite and sintering at high temperature, wherein the composite diamond particles mainly comprise diamond particles and wear-resistant metal compounds formed on the surfaces of the diamond particles.
Based on the above, the wear-resistant metal compound is titanium carbide, chromium carbide, aluminum carbide, silicon carbide, or any combination thereof.
Wherein the pre-alloyed powder is copper-based, iron-based, cobalt-based or nickel-based metal mixed powder. Preferably, the pre-alloyed powder is a copper-based metal mixed powder, and the copper-based metal compound is a mixed metal powder of copper powder and tin powder. More preferably, the prealloyed powder is Cu65Sn35, Cu57Sn43, Cu60Sn40, Cu68Sn32, or Cu70Sn 30.
Based on the above, the concentration of the composite diamond particles is 125-150%, the mass fraction of the pre-alloyed powder is 50-60%, and the mass fraction of the graphite is 5-10%.
Based on the above, the granularity of the composite diamond particles is 400# to 8000#, the granularity of the prealloyed powder is 400# to 1000#, and the granularity of the graphite is 20# to 50 #. Preferably, the composite diamond particles have a particle size of 400#, 800#, 3000# or 8000#, the prealloyed powder has a particle size of 400#, 500#, 600#, 800# or 1000#, and the graphite has a particle size of 20#, 30#, 40# or 50 #.
The invention also provides a preparation method of the diamond grinding wheel, which comprises the following steps:
diamond particle pretreatment, namely performing acid-base treatment on diamond particles, and then performing ultrasonic water washing and drying to obtain clean diamond particles;
forming wear-resistant metal compounds to deposit the wear-resistant metal compounds on the surfaces of the clean diamond particles to obtain composite diamond particles;
preparing a diamond composite sintered block, uniformly mixing the composite diamond particles, the pre-alloyed powder and flaky graphite, and performing hot-pressing sintering treatment in a vacuum environment to obtain a metal composite sintered block;
preparing a grinding wheel to carry out thinning, coarse grinding and fine grinding treatment on the metal composite sintered block to obtain a sintered block with a preset size requirement; and bonding the sintered block with the preset size requirement on a grinding wheel base body to obtain the diamond grinding wheel.
Based on the above, the diamond particle pretreatment step comprises: respectively cooking diamond particles with the particle size of 7-40 mu m in 20-25% of nitric acid and 20-25% of sodium hydroxide solution by mass percent for 20-35 min, ultrasonically cleaning the cooked diamond particles in distilled water for 15-40 min, and then drying to obtain the clean diamond particles.
Based on the above, the step of forming the wear-resistant metal compound comprises: depositing the wear-resistant metal compound on the surface of the clean diamond particles by a vacuum coating method at 530-610 ℃ in a mixed atmosphere of hydrogen and acetone to obtain the composite diamond particles; wherein the wear-resistant metal compound is made of titanium carbide, chromium carbide, aluminum carbide, silicon carbide or any combination thereof.
Based on the above, the step of forming the wear-resistant metal compound comprises:
placing the clean diamond particles on a substrate table of a coating machine chamber, and vacuumizing until the vacuum degree is 1 multiplied by 10-3～3×10-3Pa; heating the substrate table to 550-600 ℃, wherein the rotating speed of the substrate table is 10-15 rad/min, the deposition current is 100A, and hydrogen is introduced into the film plating machine at the flow rate of 50-65 sccm with acetone;
simultaneously depositing for 1-2 h by using a titanium-aluminum target with the deposition power of 3000-4000W and a titanium target with the deposition power of 2000-2500W to form a composite layer of titanium carbide and aluminum carbide on the surface of the clean diamond particles;
simultaneously depositing for 1-2 h by using a titanium-aluminum target with the deposition power of 3000-4000W, a titanium-silicon target with the deposition power of 1000-1500W and a titanium target with the deposition power of 1000-1500W to form a composite layer of titanium carbide, aluminum carbide and silicon carbide on the titanium carbide and aluminum carbide alloy layer;
simultaneously depositing for 1-2 h by using a titanium-aluminum target with the deposition power of 3000-4000W, a titanium-chromium target with the deposition power of 1000-1500W and a titanium target with the deposition power of 1000-1500W to form a composite layer of chromium carbide, titanium carbide and an aluminum carbide layer on the composite layer of the titanium carbide, the aluminum carbide and the silicon carbide;
and finally cooling to room temperature, decompressing and taking out the composite diamond particles.
Based on the above, the step of preparing the diamond composite sintered compact includes: uniformly mixing the composite diamond particles, the pre-alloyed powder and the flake graphite in a three-dimensional mixer for 12-30 hours to obtain a premix, wherein in the premix, the concentration of the composite diamond particles is 125-150%, the mass fraction of the pre-alloyed powder is 50-60%, and the mass fraction of the graphite is 5-10%; and placing the premix in a vacuum hot-pressing sintering machine for sintering treatment to obtain the composite diamond particles, wherein the height of the composite diamond particles is 11-16 cm.
Based on the above, the step of obtaining the composite diamond particles includes: and putting the premix into a graphite mold, then putting the graphite mold into a vacuum hot-pressing sintering machine, sintering for 10-20 min under the conditions of sintering pressure of 80-250 KN, sintering temperature of 520-650 ℃ and vacuum, then decompressing, and cooling to room temperature within 8-15 min to obtain the composite diamond particles.
Compared with the prior art, the diamond grinding wheel provided by the invention comprises a diamond composite sintered block, wherein the diamond composite sintered block is mainly formed by uniformly mixing and sintering composite diamond particles, pre-alloyed powder and flaky graphite at high temperature, wherein the composite diamond particles mainly comprise diamond particles and wear-resistant metal compounds formed on the surfaces of the diamond particles, and the wear resistance of diamond can be enhanced; the prealloyed powder and the wear-resistant metal compound on the surface of the composite diamond particle have good cohesiveness, and the flaky graphite is mainly used as a lubricant, so that diamond particles with the wear-resistant diamond compound formed on the surface are uniformly dispersed in a diamond composite sintered block obtained by sintering the prealloyed powder and the composite diamond particle at a high temperature, and the diamond particles as a grinding wheel grinding material have the characteristics of strong holding force, difficulty in falling, good wear resistance and the like, so that the diamond grinding wheel provided by the invention has the characteristics of good wear resistance, long service life and the like; the diamond grinding wheel can apply a sapphire thinning process, and can reduce the times of trimming the sapphire in the thinning process, thereby improving the sapphire thinning processing efficiency.
Further, in the preparation method provided by the invention, a vacuum coating method is adopted, acetone in a mixed atmosphere of hydrogen and acetone and under the action of high temperature of 530-610 ℃, the acetone in the mixed atmosphere is decomposed and chemically reacts with the metal target material to form the wear-resistant metal compound, and then the wear-resistant metal compound is uniformly deposited on the surfaces of the diamond particles, so that the wear-resistant metal compound is formed on the surfaces of the diamond particles.
Drawings
FIG. 1 is a photograph of a diamond wheel provided by an embodiment of the present invention.
Fig. 2 is a photograph of a composite diamond particle used in an embodiment of the present invention.
FIG. 3 is a photograph of a metal composite sintered compact obtained in the practice of one embodiment of the present invention.
Fig. 4 is a test result diagram of the application of the diamond grinding wheel and the sapphire thinning process according to the embodiment of the invention.
Wherein reference numerals in the figures denote: 1. grinding wheel base body, 2, diamond composite sintering block.
Detailed Description
The technical solution of the present invention is further described in detail by the following embodiments.
Example one
Referring to fig. 1, the present embodiment provides a diamond grinding wheel, which includes a grinding wheel base 1 and a diamond composite sintered compact 2 bonded to the grinding wheel base 1, wherein the diamond composite sintered compact 2 is mainly formed by uniformly mixing and sintering composite diamond particles having a grain size of 400#, prealloy powder Cu65Sn35 having a grain size of 500#, and scaly graphite having a grain size of 40#, at a high temperature. Wherein the composite diamond particles are mainly composed of diamond particles and a wear-resistant metal compound formed on the surfaces of the diamond particles, and the wear-resistant metal compound is a composite of titanium carbide, chromium carbide, aluminum carbide and silicon carbide. The concentration of the composite diamond particles is 150%, the mass fraction of the prealloyed powder Cu65Sn35 is 50%, and the mass fraction of the graphite is 10%.
The embodiment of the invention provides a preparation method of the diamond grinding wheel, which comprises the following steps:
firstly, diamond particle pretreatment
And (3) steaming and boiling the diamond particles with the particle size of 28-40 mu m in nitric acid with the mass percent of 25% and sodium hydroxide solution with the mass percent of 25% for 30 minutes in sequence. The boiled diamond was cleaned in distilled water using ultrasonic waves for minutes. And drying the diamond subjected to ultrasonic treatment to obtain clean diamond particles.
Secondly, forming the wear-resistant metal compound
Putting the clean diamond particles on a substrate table of a coating machine chamber, and vacuumizing until the vacuum degree is 1 multiplied by 10-3～3×10-3Pa; heating the substrate table to about 580 ℃, rotating the substrate table at 10-15 rad/min by taking titanium, titanium aluminum with the area ratio of 5:3, titanium silicon with the area ratio of 5:1 and titanium chromium with the area ratio of 5:2 as targets, enabling diamond placed on the substrate table to roll freely, enabling the deposition current to be 100A, and introducing hydrogen into the film plating machine with acetone at the flow rate of about 60 sccm;
depositing for 2 hours under the deposition power of about 3500W of the titanium-aluminum target and about 2400W of the titanium target by taking the titanium-aluminum target and the titanium target as target materials, and uniformly forming a titanium carbide and aluminum carbide composite layer on the surface of the clean diamond particles;
taking a titanium aluminum target, a titanium silicon target and a titanium target as target materials, simultaneously depositing for 1.5 h under the deposition power of about 3600W of the titanium aluminum target, about 1300W of the titanium silicon target and about 1200W of the titanium target, and uniformly forming a titanium carbide, aluminum carbide and silicon carbide composite layer on the titanium carbide and aluminum carbide composite layer;
then, taking a titanium-aluminum target, a titanium-chromium target and a titanium target as target materials, simultaneously depositing for 1 h under the deposition power of about 3500W of the titanium-aluminum target, about 1400W of the titanium-chromium target and about 1300W of the titanium target, and uniformly forming a titanium carbide, aluminum carbide and chromium carbide composite layer on the titanium carbide, aluminum carbide and silicon carbide composite layer;
and finally, cooling to room temperature after deposition is finished, and decompressing and taking out the composite diamond particles, as shown in figure 2. And (3) screening the composite diamond particles obtained by pressure relief to obtain the composite diamond particles with the granularity of 400 #.
Thirdly, preparing the diamond composite sintered block
Weighing the composite diamond particles with the granularity of 400#, the Cu65Sn35 prealloyed powder with the granularity of 500#, and the flaky graphite with the granularity of 40# according to the quantitative relation provided by the embodiment, and mixing the three materials in a three-dimensional mixer for 24 hours to obtain a premix;
and (3) weighing the premix according to the calculated mass, putting the premix into a graphite mold, paving the premix, and putting the premix into an SMVB100 vacuum hot-pressing sintering machine for sintering treatment. The specific sintering process comprises the following steps: after the graphite mold filled with the premix is placed in the vacuum hot-pressing sintering machine, vacuumizing the vacuum hot-pressing sintering machine until the vacuum degree is 10 Pa; then, maintaining the sintering pressure of 100 KN for 150 s, and then maintaining the sintering pressure of 180 KN for 500 s; meanwhile, the temperature of the inner cavity of the vacuum hot-pressing sintering machine is firstly increased to 100 ℃ within 30 s and is kept for 10 s, and then is increased to 560 ℃ within 120 s and is kept for 500 s; and then the vacuum hot-pressing sintering machine is decompressed, the temperature in the sintering machine is reduced to 25 ℃ within 600 s, and the metal composite sintered block shown in the figure 3 is taken out from the vacuum hot-pressing sintering machine, wherein the height of the metal composite sintered block is 15 mm.
Fourthly, preparing the grinding wheel
Thinning the metal composite sintered block on a single-end-face device, and performing coarse grinding and fine grinding to reach the relevant size requirement to obtain a sintered block with a preset size requirement; and (3) adopting a binder to firmly adhere the sintered blocks with the preset size requirement on the grinding wheel base body 1, and trimming the height of the sintered blocks on a laser processing center to ensure that the sintered blocks have consistent height, thereby preparing the diamond grinding wheel.
Example two
The present embodiment provides a diamond grinding wheel, which has substantially the same structure as the diamond grinding wheel provided in the first embodiment, and the main difference is that: the raw material composite diamond particles adopted in the embodiment have the concentration of 125% and the granularity of 800#, the pre-alloyed powder Cu65Sn35 has the mass fraction of 60% and the granularity of 500#, and the graphite has the mass fraction of 7% and the granularity of 50 #.
The method for manufacturing the diamond grinding wheel provided in the embodiment is basically the same as the method for manufacturing the diamond grinding wheel provided in the first embodiment, and mainly differs in that: the quantitative relation of all the raw materials and sintering process parameters in the step III of preparing the diamond composite sintering block. The preparation method provided by the embodiment relates to a specific sintering process which is as follows: after the graphite mold filled with the premix is placed in the vacuum hot-pressing sintering machine, vacuumizing the vacuum hot-pressing sintering machine until the vacuum degree is 12 Pa; then maintaining the sintering pressure of 95 KN for 185 s, and then maintaining the sintering pressure of 200 KN for 485 s; meanwhile, the temperature of the inner cavity of the vacuum hot-pressing sintering machine is firstly increased to 120 ℃ within 40 s and is kept for 10 s, and then is increased to 580 ℃ within 120 s and is kept for 500 s; and then the vacuum hot-pressing sintering machine is decompressed, the temperature in the sintering machine is reduced to 25 ℃ within 600 s, and the metal composite sintered block shown in the figure 3 is taken out from the vacuum hot-pressing sintering machine, wherein the height of the metal composite sintered block is 15 mm.
EXAMPLE III
The present embodiment provides a diamond grinding wheel, which has substantially the same structure as the diamond grinding wheel provided in the first embodiment, and the main difference is that: the raw material composite diamond particles adopted in the embodiment have the concentration of 140% and the granularity of 3000#, the pre-alloyed powder Cu65Sn35 has the mass fraction of 55% and the granularity of 700#, and the graphite has the mass fraction of 5% and the granularity of 30 #.
The method for manufacturing the diamond grinding wheel provided in the embodiment is basically the same as the method for manufacturing the diamond grinding wheel provided in the first embodiment, and mainly differs in that: the quantitative relation of all the raw materials and sintering process parameters in the step III of preparing the diamond composite sintering block. The preparation method provided by the embodiment relates to a specific sintering process which is as follows: after the graphite mold filled with the premix is placed in the vacuum hot-pressing sintering machine, vacuumizing the vacuum hot-pressing sintering machine until the vacuum degree is 5 Pa; then, maintaining the sintering pressure of 100 KN for 150 s, and then maintaining the sintering pressure of 200 KN for 500 s; meanwhile, the temperature of the inner cavity of the vacuum hot-pressing sintering machine is firstly increased to 150 ℃ within 40 s and is kept for 10 s, and then is increased to 600 ℃ within 120 s and is kept for 480 s; and then the vacuum hot-pressing sintering machine is decompressed, the temperature in the sintering machine is reduced to 25 ℃ within 600 s, and the metal composite sintered block shown in the figure 3 is taken out from the vacuum hot-pressing sintering machine, wherein the height of the metal composite sintered block is 15 mm.
Performance verification
Sample preparation: dividing the diamond grinding wheel into an example sample and a control sample, wherein the example sample is the diamond grinding wheel sample provided in the first embodiment to the third embodiment and is respectively marked as an example sample 1, an example sample 2 and an example sample 3;
the main differences between the control sample and the example sample 1 are: the diamond composite sintered compact used in the control sample was mainly composed of 400# diamond particles, 500# prealloyed powder Cu65Sn35, and 40# flake graphite, i.e., the raw material of the diamond composite sintered compact in the control sample was diamond particles instead of the composite diamond particles of the one of the examples of the present invention.
The test conditions are as follows: on the sapphire thinning equipment, 5 sapphire wafers are stuck on the surface of an objective table by adopting molten paraffin, thinning processing is carried out under the parameters that the rotating speed of a grinding wheel is 600-800 rad/min, the rotating speed of the objective table is 40-60 rad/min and the feeding of the grinding wheel is 1-1.5 mu m/s, and the thickness of the wafer is measured after the processing is finished. The relevant test data are shown in fig. 4 and table 1.
TABLE 1 Diamond grinding wheel Performance test results
As can be seen from table 1: compared with a comparison sample, the diamond grinding wheel provided by each embodiment of the invention is used for the sapphire thinning process, the qualification rates of the diamond grinding wheel and the sapphire thinning process are close, and the difference is not large; the thinning precision of the diamond grinding wheel provided by each embodiment of the invention can completely reach the standard of the prior art, even exceeds the prior art, and meanwhile, the service life of the diamond grinding wheel provided by each embodiment of the invention is obviously prolonged.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention and not to limit it; although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art will understand that: modifications to the specific embodiments of the invention or equivalent substitutions for parts of the technical features may be made; without departing from the spirit of the present invention, it is intended to cover all aspects of the invention as defined by the appended claims.
Claims (6)
1. A diamond grinding wheel comprises a grinding wheel base body and a diamond composite sintered block bonded on the grinding wheel base body, wherein the diamond composite sintered block is mainly formed by uniformly mixing and sintering composite diamond particles, pre-alloy powder and flaky graphite at high temperature, and the composite diamond particles mainly comprise diamond particles and wear-resistant metal compounds formed on the surfaces of the diamond particles;
the step of forming the wear-resistant metal compound on the surface of the diamond particles includes:
clean diamond particles are placed on a substrate table of a coating machine chamber and vacuumized to the vacuum degree of 1 multiplied by 10-3～3×10-3Pa; heating the substrate table to 550-600 ℃, wherein the rotating speed of the substrate table is 10-15 rad/min, the deposition current is 100A, and hydrogen is introduced into a coating machine with acetone at the flow of 50-65 sccm;
simultaneously depositing for 1-2 h by using a titanium-aluminum target with the deposition power of 3000-4000W and a titanium target with the deposition power of 2000-2500W to form a composite layer of titanium carbide and aluminum carbide on the surface of the clean diamond particles;
simultaneously depositing for 1-2 h by using a titanium-aluminum target with the deposition power of 3000-4000W, a titanium-silicon target with the deposition power of 1000-1500W and a titanium target with the deposition power of 1000-1500W to form a composite layer of titanium carbide, aluminum carbide and silicon carbide on the composite layer of the titanium carbide and the aluminum carbide;
simultaneously depositing a titanium-aluminum target with the deposition power of 3000-4000W, a titanium-chromium target with the deposition power of 1000-1500W and a titanium target with the deposition power of 1000-1500W for 1-2 h to form a composite layer of chromium carbide, titanium carbide and an aluminum carbide layer on the composite layer of titanium carbide, aluminum carbide and silicon carbide to obtain composite diamond particles;
and finally cooling to room temperature, decompressing and taking out the composite diamond particles.
2. The diamond grinding wheel according to claim 1, wherein: the concentration of the composite diamond particles is 125-150%, the mass fraction of the pre-alloyed powder is 50-60%, and the mass fraction of the graphite is 5-10%.
3. The diamond grinding wheel according to claim 1, wherein: the granularity of the composite diamond particles is 400-8000 #, the granularity of the prealloyed powder is 400-1000 #, and the granularity of the graphite is 20-50 #.
4. A preparation method of a diamond grinding wheel comprises the following steps:
diamond particle pretreatment, namely performing acid-base treatment on diamond particles, and then performing ultrasonic water washing and drying to obtain clean diamond particles;
forming wear-resistant metal compound, placing the clean diamond particles on a substrate table of a coating machine chamber, and vacuumizing to the vacuum degree of 1 × 10-3～3×10-3Pa; heating the substrate table to 550-600 ℃, wherein the rotating speed of the substrate table is 10-15 rad/min, the deposition current is 100A, and hydrogen is introduced into a coating machine with acetone at the flow of 50-65 sccm; simultaneously depositing for 1-2 h by using a titanium-aluminum target with the deposition power of 3000-4000W and a titanium target with the deposition power of 2000-2500W to form a composite layer of titanium carbide and aluminum carbide on the surface of the clean diamond particles; simultaneously depositing for 1-2 h by using a titanium-aluminum target with the deposition power of 3000-4000W, a titanium-silicon target with the deposition power of 1000-1500W and a titanium target with the deposition power of 1000-1500W to form a composite layer of titanium carbide, aluminum carbide and silicon carbide on the composite layer of the titanium carbide and the aluminum carbide; simultaneously depositing a titanium-aluminum target with the deposition power of 3000-4000W, a titanium-chromium target with the deposition power of 1000-1500W and a titanium target with the deposition power of 1000-1500W for 1-2 h to form a composite layer of chromium carbide, titanium carbide and an aluminum carbide layer on the composite layer of titanium carbide, aluminum carbide and silicon carbide to obtain composite diamond particles; finally, cooling to room temperature, decompressing and taking out the composite diamond particles;
preparing a diamond composite sintered block, uniformly mixing the composite diamond particles, the pre-alloyed powder and flaky graphite, and performing hot-pressing sintering treatment in a vacuum environment to obtain a metal composite sintered block;
preparing a grinding wheel to carry out thinning, coarse grinding and fine grinding treatment on the metal composite sintered block to obtain a sintered block with a preset size requirement; and bonding the sintered block with the preset size requirement on a grinding wheel base body to obtain the diamond grinding wheel.
5. The method for manufacturing a diamond grinding wheel according to claim 4, wherein: the diamond particle pretreatment step comprises: respectively cooking diamond particles with the particle size of 7-40 mu m in 20-25% of nitric acid and 20-25% of sodium hydroxide solution by mass percent for 20-35 min, ultrasonically cleaning the cooked diamond particles in distilled water for 15-40 min, and then drying to obtain the clean diamond particles.
6. The method for manufacturing a diamond grinding wheel according to claim 4 or 5, characterized in that: the preparation method comprises the steps of uniformly mixing the composite diamond particles, pre-alloyed powder and flaky graphite in a three-dimensional mixer for 12-30 hours to obtain a premix, wherein in the premix, the concentration of the composite diamond particles is 125-150%, the mass fraction of the pre-alloyed powder is 50-60%, and the mass fraction of the graphite is 5-10%; and putting the premix into a graphite mold, then putting the graphite mold into a vacuum hot-pressing sintering machine, sintering for 10-20 min under the conditions of sintering pressure of 80-250 KN, sintering temperature of 520-650 ℃ and vacuum, then decompressing, and cooling to room temperature within 8-15 min to obtain the diamond composite sintered block, wherein the height of the diamond composite sintered block is 11-16 cm.
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| US3650714A (en) * | 1969-03-04 | 1972-03-21 | Permattach Diamond Tool Corp | A method of coating diamond particles with metal |
| US5024680A (en) * | 1988-11-07 | 1991-06-18 | Norton Company | Multiple metal coated superabrasive grit and methods for their manufacture |
| US5143523A (en) * | 1991-09-20 | 1992-09-01 | General Electric Company | Dual-coated diamond pellets and saw blade semgents made therewith |
| PL1622745T3 (en) * | 2003-05-09 | 2012-10-31 | Diamond Innovations Inc | A composite material |
| TW201111106A (en) * | 2009-03-02 | 2011-04-01 | Sumitomo Electric Industries | Diamond wire saw, process for manufacturing diamond wire saw |
| CN102240992A (en) * | 2011-06-14 | 2011-11-16 | 北京华特科园超硬材料有限公司 | Diamond grinding wheel for grinding glass, and preparation method of diamond grinding wheel |
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