CN112423472A - Rigid-flexible circuit board and manufacturing method thereof - Google Patents
Rigid-flexible circuit board and manufacturing method thereof Download PDFInfo
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- CN112423472A CN112423472A CN201910780132.3A CN201910780132A CN112423472A CN 112423472 A CN112423472 A CN 112423472A CN 201910780132 A CN201910780132 A CN 201910780132A CN 112423472 A CN112423472 A CN 112423472A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 239000010410 layer Substances 0.000 claims abstract description 195
- 239000000758 substrate Substances 0.000 claims abstract description 73
- 239000012790 adhesive layer Substances 0.000 claims abstract description 37
- 238000000034 method Methods 0.000 claims abstract description 20
- 238000003825 pressing Methods 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 59
- 239000010408 film Substances 0.000 claims description 43
- 239000011889 copper foil Substances 0.000 claims description 40
- 229910000679 solder Inorganic materials 0.000 claims description 29
- 239000013039 cover film Substances 0.000 claims description 23
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- 238000007747 plating Methods 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 7
- 239000003814 drug Substances 0.000 abstract description 7
- 239000007788 liquid Substances 0.000 abstract description 7
- 239000004642 Polyimide Substances 0.000 description 8
- -1 polyethylene terephthalate Polymers 0.000 description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 description 8
- 239000005020 polyethylene terephthalate Substances 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 8
- 239000004743 Polypropylene Substances 0.000 description 6
- 229920001155 polypropylene Polymers 0.000 description 6
- 239000011241 protective layer Substances 0.000 description 5
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229920006380 polyphenylene oxide Polymers 0.000 description 4
- 238000005452 bending Methods 0.000 description 2
- 239000012787 coverlay film Substances 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 235000001892 vitamin D2 Nutrition 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a manufacturing method of a rigid-flexible circuit board, which comprises the steps of providing a flexible circuit substrate and a supporting film, wherein the supporting film comprises a release adhesive layer, pressing a first insulating layer on the surface of the flexible circuit substrate provided with the supporting film, the first insulating layer is provided with a first opening, and forming a first rigid circuit substrate on the first insulating layer except for the first opening, so that the rigid-flexible circuit board is obtained. The manufacturing method of the rigid-flexible printed circuit board can solve the problems of collapse and liquid medicine feeding in the rigid-flexible printed circuit board manufacturing process. The invention also provides a rigid-flexible circuit board manufactured by the method.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a rigid-flexible circuit board and a manufacturing method thereof.
Background
The rigid-flex board is a printed circuit board including one or more rigid regions and one or more flexible regions, and has the durability of a rigid board and the flexibility of a flexible board, so that the rigid-flex board has the characteristics of being light, thin, compact, resistant to severe application environments and the like, and is particularly suitable for being applied to precise electronics such as portable electronic products, medical electronic products, military equipment and the like. In design, in order to facilitate bending of the rigid-flex board, reduce spatial interference, and prevent failure and fracture of the rigid-flex interface region, a local gap is usually designed in the rigid-flex interface region. However, the gap may cause the collapse risk of the portion above the gap in the manufacturing process of the rigid-flex printed circuit board, which affects the subsequent manufacturing process, and the liquid medicine is likely to flow into the gap in the uncovering process of the circuit board, which affects the performance of the product.
Disclosure of Invention
In view of the above, the present invention provides a method for manufacturing a rigid-flex circuit board, which can solve the problems of collapse and liquid medicine injection in the rigid-flex circuit board manufacturing process.
In addition, it is also necessary to provide a rigid-flex circuit board manufactured by the above method.
The invention provides a manufacturing method of a rigid-flexible circuit board, which comprises the following steps:
providing a flexible circuit substrate, wherein the flexible circuit substrate comprises a flexible folding area, a non-flexible folding area and a connecting area positioned between the flexible folding area and the non-flexible folding area;
providing a support film, and arranging the support film on a connection area on one surface of the flexible circuit substrate, wherein the support film comprises a release adhesive layer arranged towards the connection area;
pressing a first insulating layer on the surface of the flexible circuit substrate with the support film, wherein the first insulating layer covers the non-flexible folding area and the support film on the connecting area, and is provided with a first opening corresponding to the flexible folding area;
and forming a first hard circuit substrate on the first insulating layer except the first opening, thereby obtaining the rigid-flex board.
The invention also provides a rigid-flexible circuit board, which comprises a flexible circuit substrate, a supporting film, a first insulating layer and a first rigid circuit substrate, the flexible circuit substrate comprises a flexible folding area, a non-flexible folding area and a connecting area positioned between the flexible folding area and the non-flexible folding area, the support film is arranged on the connection area on one surface of the flexible circuit substrate, the support film comprises a release adhesive layer arranged towards the connection area, the first insulating layer is arranged on the surface of the flexible circuit substrate with the support film, the first insulating layer covers the non-flexible folding area and the support film on the connecting area, the first insulating layer is provided with a first opening, the first opening corresponds to the flexible folding area, the first hard circuit substrate is arranged on the first insulating layer except the first opening.
The manufacturing method of the rigid-flexible printed circuit board and the rigid-flexible printed circuit board manufactured by the method can solve the problems of collapse and liquid medicine feeding in the rigid-flexible printed circuit board manufacturing process.
Drawings
FIG. 1 is a schematic structural diagram of a flexible circuit substrate according to a preferred embodiment of the invention.
Fig. 2 is a schematic structural diagram of the flexible circuit substrate shown in fig. 1 after a support film is formed thereon.
Fig. 3 is a schematic structural diagram of a first insulating layer according to a preferred embodiment of the invention.
Fig. 4 is a schematic structural view of the first copper foil layer and the first adhesive layer according to the preferred embodiment of the invention.
Fig. 5 is a schematic structural view illustrating the first copper foil layer, the first adhesive layer and the first insulating layer shown in fig. 3 and 4 laminated on the flexible circuit substrate shown in fig. 2.
Fig. 6 is a schematic structural diagram after a first copper plating layer is formed on the first copper foil layer shown in fig. 5, a second conductive trace is formed, and a peelable adhesive layer is formed on the other side.
Fig. 7 is a schematic view of a structure after a second insulating layer and a second copper foil layer are formed on the second conductive line shown in fig. 6, and a third insulating layer and a third copper foil layer are formed on the other side.
Fig. 8 is a schematic structural view of a rigid-flex circuit board obtained after forming copper plating layers on the second copper foil layer and the third copper foil layer shown in fig. 7, respectively, etching, solder mask, and opening the cover.
Description of the main elements
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
To further explain the technical means and effects of the present invention adopted to achieve the intended purpose, the present invention will be described in detail with reference to the accompanying drawings and preferred embodiments.
The preferred embodiment of the invention provides a manufacturing method of a rigid-flexible circuit board, which comprises the following steps:
s11, please refer to fig. 1, a flexible circuit substrate 10 is provided, in which the flexible circuit substrate 10 includes a flexible folding region 101, a non-flexible folding region 102, and a connection region 103 located between the flexible folding region 101 and the non-flexible folding region 102.
In this embodiment, the number of the non-flexible folding regions 102 is two, and the two non-flexible folding regions are respectively located at two opposite sides of the flexible folding region 101. The connecting region 103 is located between the flexible folding region 101 and one of the non-flexible folding regions 102.
Further, the flexible circuit substrate 10 further includes a first base layer 11, a first conductive trace 12 formed on one surface of the first base layer 11, and a first cover film 13 formed on the first conductive trace 12. The first cover film 13 includes a fourth insulating layer 131 formed on the first conductive traces 12 and a first protective layer 132 formed on the fourth insulating layer 131.
The flexible circuit substrate 10 further includes a fourth conductive trace 14 formed on the first base layer 11 away from the first conductive trace 12, and a second cover film 15 formed on the fourth conductive trace 14. The second cover film 15 includes a fifth insulating layer 151 formed on the fourth conductive traces 14 and a second protective layer 152 formed on the fifth insulating layer 151.
The flexible circuit substrate 10 is provided with at least one first through hole 16, the first through hole 16 is filled with a conductive paste, and the conductive paste is used for connecting the first conductive circuit 12 and the fourth conductive circuit 14 so as to realize circuit conduction between the first conductive circuit 12 and the fourth conductive circuit 14.
S12, please refer to fig. 2, a supporting film 20 is provided, the supporting film 20 is disposed on the connection region 103 on one surface of the flexible circuit substrate 10, and the supporting film 20 further includes a release layer 21 disposed toward the connection region 103.
In the present embodiment, the support film 20 is disposed on the connection region 103 on the surface of the first cover film 13. The release adhesive layer 21 can be bonded to and separated from the surface of the first cover film 13. For example, when the flexible circuit substrate 10 is bent at the connection region 103, the release adhesive layer 21 can be separated from the first protection layer 132; when the flexible circuit substrate 10 is not bent, the release adhesive layer 21 can be bonded to the surface of the first protection layer 132. The material of the support film 20 includes at least one of polyethylene terephthalate (PET) and Polyimide (PI).
S13 please refer to fig. 3, a first insulating layer 31 is provided.
The first insulating layer 31 has a first opening 32. The material of the first insulating layer 31 may be one selected from epoxy resin (epoxy resin), polypropylene (PP), BT resin, Polyphenylene Oxide (PPO), Polyimide (PI), Polyethylene Terephthalate (PET), Polyethylene Naphthalate (PEN), and the like. In this embodiment, the first insulating layer 31 is made of polypropylene.
S14, please refer to fig. 4, a first adhesive layer 33 and a first copper foil layer 301 are provided.
The first copper foil layer 301 is disposed on one surface of the first adhesive layer 33.
S15, referring to fig. 5, the first insulating layer 31 is laminated on the surface of the flexible circuit substrate 10 having the supporting film 20.
The first insulating layer 31 may be in a semi-cured state. After the lamination, the support film 20 is embedded in the first insulating layer 31, so that the first insulating layer 31 covers the non-bending region 102 and covers the support film 20 on the connection region 103. Moreover, the first opening 32 corresponds to the flexible folding area 101.
S16, pressing the first adhesive layer 33 and the first copper foil layer 301 on the first insulating layer 31.
The first adhesive layer 33 covers the flexible folding area 101, the non-flexible folding area 102, and the connection area 103. The first adhesive layer 33 is connected to the first insulating layer 31.
S17, referring to fig. 6, a first copper plated layer 302 is formed on the first copper foil layer 301, and the first copper plated layer 302 and the first copper foil layer 301 are etched to obtain a second conductive trace 30.
The second conductive traces 30 are formed by etching through an exposure and development method. Before the first copper plating layer 302 is formed, at least one second through hole (not shown) is opened in the first copper foil layer 301, and the second through hole further penetrates through the first adhesive layer 33, the first insulating layer 31, the first cover film 13 and connects the first conductive trace 12. The first copper plating layer 302 is further filled in the second via hole, thereby forming a second conductive pillar 35. The second conductive trace 30 is electrically connected to the first conductive trace 12 through the second conductive pillar 35.
S18, forming a peelable adhesive layer 34 on the second cover film 15, where the peelable adhesive layer 34 corresponds to the flexible folding area 101 and the connection area 103.
The peelable adhesive layer 34 can be peeled off from the surface of the flexible circuit substrate 10. The peelable adhesive layer 34 is used to protect the flexible circuit substrate 10 from damage during a subsequent decap process.
S19, referring to fig. 7, a second insulating layer 41 and a second copper foil layer 401 are sequentially formed on the second conductive traces 30.
The second insulating layer 41 and the second copper foil layer 401 both cover the flexible folding area 101, the non-flexible folding area 102 and the connection area 103.
S20, sequentially forming a third insulation layer 51 and a third copper foil layer 501 on the second coverlay film 15 with the peelable glue layer 34.
The third insulating layer 51 and the third copper foil layer 501 both cover the flexible folding area 101, the non-flexible folding area 102 and the connection area 103.
S21, referring to fig. 8, a second copper plated layer 402 is formed on the second copper foil layer 401, and the second copper plated layer 402 and the second copper foil layer 401 are etched to obtain a third conductive trace 40.
The third conductive traces 40 are formed by etching through an exposure and development method. Before the second copper-plated layer 402 is formed, at least one third through hole (not shown) is opened in the second copper foil layer 401, and the third through hole further penetrates through the second copper foil layer 401 and the second insulating layer 41 and connects to the second conductive trace 30. The second copper plating layer 402 further fills in the third via hole, thereby forming a third conductive pillar 42. The third conductive traces 40 are electrically connected to the second conductive traces 30 through the third conductive pillars 42.
S22, forming a third copper plated layer 502 on the third copper foil layer 501, and etching the third copper plated layer 502 and the third copper foil layer 501 to obtain a fifth conductive trace 50.
The fifth conductive traces 50 are formed by etching through an exposure and development method. Before the third copper plating layer 502 is formed, at least one fourth via (not shown) is opened in the third copper foil layer 501, and the fourth via further penetrates through the third copper foil layer 501, the third insulating layer 51, the second coverlay film 15 and is connected to the fourth conductive trace 14. The third copper plating layer 502 is further filled in the fourth via hole, so as to form a fourth conductive pillar 43. The fifth conductive trace 50 is electrically connected to the fourth conductive trace 14 through the fourth conductive pillar 43.
S23, forming a first solder mask 70 and a second solder mask 71 on the surfaces of the third conductive traces 40 and the fifth conductive traces 50, respectively.
The first solder mask 70 is used to protect the third conductive trace 40, and the second solder mask 71 is used to protect the fifth conductive trace 50. The first solder mask layer 70 and the second solder mask layer 71 can be made of solder mask ink, such as green oil.
S24, forming a second opening 80 on the first solder mask layer 70 corresponding to the flexible folding area 101 (i.e., a decapping step), where the second opening 80 penetrates through the first solder mask layer 70, the third conductive trace 40, the second insulating layer 41, the second conductive trace 30, and the first adhesive layer 33, so as to obtain the first rigid circuit board 60.
S25, opening a third opening 81 on the second solder mask layer 71 at a position corresponding to the position of the peelable glue layer 34 (i.e., a decapping step), thereby obtaining the second rigid circuit board 61.
The second rigid circuit substrate 61 is disposed on the non-flexible folding area 102 of the second cover film 15.
It is understood that, after the step S18, the steps S19 to S22 may be repeated, that is, the build-up method is used to further form the conductive traces, so that the rigid trace substrate has a greater number of conductive trace layers. In addition, the steps S19 to S22 can be omitted, that is, the rigid wiring substrate is a single-layer board. It is also understood that the order of the above steps S11 to S25 is not fixed, and the order of S11 to S25 may be adjusted in actual operation.
The manufacturing method of the rigid-flexible circuit board provided by the invention has the following advantages:
when the flexible circuit substrate 10 is bent at the connection region 103, the release adhesive layer 21 can be separated from the first protection layer 132; when the flexible circuit substrate 10 is not bent, the release adhesive layer 21 can be bonded to the surface of the first protection layer 132. The support film 20 can prevent the first insulating layer 31 from collapsing to avoid affecting the subsequent process. In addition, the support film 20 can prevent liquid medicine from flowing into the gap of the circuit board in the uncovering process, and therefore the performance of the circuit board is improved.
The invention further provides a rigid-flexible printed circuit board 100, wherein the rigid-flexible printed circuit board 100 includes a flexible circuit substrate 10, a first insulating layer 31, a supporting film 20, a first rigid circuit substrate 60 and a second rigid circuit substrate 61. The second rigid circuit substrate 61, the flexible circuit substrate 10, the first insulating layer 31, and the first rigid circuit substrate 60 are sequentially stacked.
The flexible circuit substrate 10 includes a flexible folding region 101, a non-flexible folding region 102, and a connection region 103 located between the flexible folding region 101 and the non-flexible folding region 102. In this embodiment, the number of the non-flexible folding regions 102 is two, and the two non-flexible folding regions are respectively located at two opposite sides of the flexible folding region 101. The connecting region 103 is located between the flexible folding region 101 and one of the non-flexible folding regions 102.
Further, the flexible circuit substrate 10 further includes a first base layer 11, a first conductive trace 12 formed on one surface of the first base layer 11, and a first cover film 13 formed on the first conductive trace 12. The first cover film 13 includes a fourth insulating layer 131 formed on the first conductive traces 12 and a first protective layer 132 formed on the fourth insulating layer 131.
The flexible circuit substrate 10 further includes a fourth conductive trace 14 formed on the first base layer 11 away from the first conductive trace 12, and a second cover film 15 formed on the fourth conductive trace 14. The second cover film 15 includes a fifth insulating layer 151 formed on the fourth conductive traces 14 and a second protective layer 152 formed on the fifth insulating layer 151.
The flexible circuit substrate 10 is provided with at least one first through hole 16, the first through hole 16 is filled with a conductive paste, and the conductive paste is used for connecting the first conductive circuit 12 and the fourth conductive circuit 14 so as to realize circuit conduction between the first conductive circuit 12 and the fourth conductive circuit 14.
The first insulating layer 31 has a first opening 32, and the first opening 32 corresponds to the flexible folding region 101. The material of the first insulating layer 31 may be one selected from epoxy resin (epoxy resin), polypropylene (PP), BT resin, Polyphenylene Oxide (PPO), Polyimide (PI), Polyethylene Terephthalate (PET), Polyethylene Naphthalate (PEN), and the like. In this embodiment, the first insulating layer 31 is made of polypropylene. The first insulating layer 31 is in a semi-cured state.
The supporting film 20 is disposed on the connection region 103 on one surface of the flexible circuit substrate 10. In the present embodiment, the support film 20 is disposed on the connection region 103 on the surface of the first cover film 13. The support film 20 is embedded in the first insulating layer 31, and the first insulating layer 31 covers the non-flexible region 102 and covers the support film 20 on the connection region 103. The support film 20 further includes a release layer 21 disposed toward the connection region 103. The release liner 21 can be bonded and separated from the surface of the first protective layer 132. For example, when the flexible circuit substrate 10 is bent at the connection region 103, the release adhesive layer 21 can be separated from the first protection layer 132; when the flexible circuit substrate 10 is not bent, the release adhesive layer 21 can be bonded to the surface of the first protection layer 132. The material of the support film 20 includes at least one of polyethylene terephthalate (PET) and Polyimide (PI).
The first rigid circuit board 60 includes a second conductive trace 30 and a first adhesive layer 33, and the second conductive trace 30 is disposed on the first insulating layer 31 through the first adhesive layer 33. The second conductive trace 30 includes a first copper-plated layer 302 and a first copper foil layer 301, and the first copper foil layer 301 is disposed between the first copper-plated layer 302 and the first adhesive layer 33.
The first rigid circuit board 60 further includes a third conductive trace 40 and a second insulating layer 41, wherein the third conductive trace 40 is disposed on the second conductive trace 30 through the second insulating layer 41. The third conductive trace 40 includes a second copper plated layer 402 and a second copper foil layer 401, wherein the second copper foil layer 401 is disposed between the second copper plated layer 402 and the second insulating layer 41.
The second hard circuit substrate 61 includes a third insulating layer 51 and a fifth conductive trace 50, and the third insulating layer 51 is disposed between the fifth conductive trace 50 and the flexible circuit substrate 10. The fifth conductive trace 50 includes a third copper foil layer 501 and a third copper-plated layer 502, wherein the third copper foil layer 501 is disposed between the third copper-plated layer 502 and the third insulating layer 51.
The rigid-flex circuit board 100 further includes a second conductive pillar 35, a third conductive pillar 42, and a fourth conductive pillar 43. The second conductive pillar 35 is used to electrically connect the second conductive trace 30 and the first conductive trace 12. The third conductive pillars 42 are used to electrically connect the third conductive traces 40 and the second conductive traces 30. The fourth conductive pillar 43 is used for electrically connecting the fifth conductive trace 50 and the fourth conductive trace 14.
The rigid-flex circuit board 100 further includes a first solder mask layer 70 and a second solder mask layer 71. The first solder mask layer 70 is disposed on the first rigid circuit substrate 60, and the second solder mask layer 71 is disposed on the second rigid circuit substrate 61. The first solder mask layer 70 and the second solder mask layer 71 can be made of solder mask ink, such as green oil. The first solder mask layer 70 is provided with a second opening 80 corresponding to the flexible folding area 101, and the second opening 80 penetrates through the first solder mask layer 70, the third conductive trace 40, the second insulating layer 41, the second conductive trace 30 and the first adhesive layer 33.
It is understood that the rigid-flex circuit board 100 may further form conductive traces by a layer-adding method, that is, a plurality of third conductive traces 40 and fifth conductive traces 50 are added, so that the rigid-flex circuit board has a greater number of conductive trace layers. In addition, the third conductive traces 40 and the fifth conductive traces 50 may be omitted, that is, the rigid wiring substrate is a single-layer board.
The rigid-flexible circuit board 100 provided by the invention has the following advantages:
when the flexible circuit substrate 10 is bent at the connection region 103, the release adhesive layer 21 can be separated from the first protection layer 132; when the flexible circuit substrate 10 is not bent, the release adhesive layer 21 can be bonded to the surface of the first protection layer 132. The support film 20 can prevent the first insulating layer 31 from collapsing to avoid affecting the subsequent process. In addition, the support film 20 can prevent liquid medicine from flowing into the gap during the uncovering process of the circuit board, thereby improving the performance of the rigid-flexible circuit board 100.
The manufacturing method of the rigid-flex circuit board and the rigid-flex circuit board 100 provided by the invention can solve the problems of collapse and liquid medicine feeding in the rigid-flex circuit board manufacturing process.
The above description is only an optimized embodiment of the present invention, but the present invention is not limited to this embodiment in practical application. Other modifications and changes to the technical idea of the present invention should be made by those skilled in the art within the scope of the claims of the present invention.
Claims (10)
1. A manufacturing method of a rigid-flexible circuit board is characterized by comprising the following steps:
providing a flexible circuit substrate, wherein the flexible circuit substrate comprises a flexible folding area, a non-flexible folding area and a connecting area positioned between the flexible folding area and the non-flexible folding area;
providing a support film, and arranging the support film on a connection area on one surface of the flexible circuit substrate, wherein the support film comprises a release adhesive layer arranged towards the connection area;
pressing a first insulating layer on the surface of the flexible circuit substrate with the support film, wherein the first insulating layer covers the non-flexible folding area and the support film on the connecting area, and is provided with a first opening corresponding to the flexible folding area;
and forming a first hard circuit substrate on the first insulating layer except the first opening, thereby obtaining the rigid-flex board.
2. The method for manufacturing a rigid-flex circuit board according to claim 1, wherein the flexible circuit substrate includes a first base layer, a first conductive trace formed on one surface of the first base layer, and a first cover film formed on the first conductive trace, and the support film is disposed on the connection region on the surface of the first cover film.
3. The method of claim 2, wherein forming the first rigid circuit substrate comprises:
forming a first adhesive layer and a first copper foil layer on the first insulating layer, wherein the first adhesive layer covers the flexible folding area, the non-flexible folding area and the connecting area;
forming a first copper plating layer on the first copper foil layer, and etching the first copper plating layer and the first copper foil layer to obtain a second conductive circuit;
forming a second insulating layer and a second copper foil layer on the second conductive circuit;
forming a second copper plating layer on the second copper foil layer, and etching the second copper plating layer and the second copper foil layer to obtain a third conductive circuit, wherein the third conductive circuit is electrically connected with the second conductive circuit and the first conductive circuit;
forming a first solder mask layer on the third conductive circuit;
and forming a second opening corresponding to the flexible area on the first solder mask layer, wherein the second opening penetrates through the first solder mask layer, the third conductive circuit, the second insulating layer, the second conductive circuit and the first adhesive layer, so as to obtain the first rigid circuit substrate.
4. The method for manufacturing a rigid-flex circuit board according to claim 2, wherein the flexible circuit substrate further comprises a fourth conductive trace formed on the first base layer away from the first conductive trace, and a second cover film formed on the fourth conductive trace.
5. The method for manufacturing a rigid-flex circuit board as claimed in claim 4, further comprising forming a second rigid circuit substrate on the non-flexible folding area of the second cover film.
6. The method for manufacturing a rigid-flex circuit board according to claim 5, wherein the step of forming the second rigid circuit substrate includes:
forming a peelable glue layer on the second cover film, wherein the peelable glue layer corresponds to the flexible folding area and the connecting area;
forming a third insulating layer and a third copper foil layer on the second covering film with the peelable glue layer, wherein the third insulating layer covers the peelable glue layer;
forming a third copper-plated layer on the third copper foil layer, and etching the third copper-plated layer and the third copper foil layer to obtain a fifth conductive circuit;
forming a second solder mask layer on the fifth conductive circuit;
and forming a third opening on the second solder mask layer, wherein the third opening corresponds to the strippable glue layer in position and penetrates through the second solder mask layer, the fifth conductive circuit and the third insulating layer, so that the second hard circuit substrate is obtained.
7. A rigid-flexible printed circuit board comprises a flexible printed circuit substrate, a supporting film, a first insulating layer, and a first rigid printed circuit substrate, the flexible circuit substrate comprises a flexible folding area, a non-flexible folding area and a connecting area positioned between the flexible folding area and the non-flexible folding area, the support film is arranged on the connection area on one surface of the flexible circuit substrate, the support film comprises a release adhesive layer arranged towards the connection area, the first insulating layer is arranged on the surface of the flexible circuit substrate with the support film, the first insulating layer covers the non-flexible folding area and the support film on the connecting area, the first insulating layer is provided with a first opening, the first opening corresponds to the flexible folding area, the first hard circuit substrate is arranged on the first insulating layer except the first opening.
8. The FPC as claimed in claim 7, wherein the FPC board comprises a first base layer, a first conductive trace formed on a surface of the first base layer, and a first cover film formed on the first conductive trace, wherein the supporting film is disposed on the connection region on the surface of the first cover film.
9. The rigid-flex circuit board of claim 8, wherein the first rigid circuit board includes a first adhesive layer, a second conductive trace, a second insulating layer, a third conductive trace, and a first solder mask layer sequentially formed on the first insulating layer, the second conductive trace and the third conductive trace are both electrically connected to the first conductive trace, the first solder mask layer has a second opening corresponding to the flexible region, and the second opening penetrates through the first solder mask layer, the third conductive trace, the second insulating layer, the second conductive trace, and the first adhesive layer.
10. The rigid-flex circuit board of claim 8, wherein the flexible circuit substrate further comprises a fourth conductive trace formed on the first base layer away from the first conductive trace, and a second cover film formed on the fourth conductive trace, the rigid-flex circuit board further comprising a second rigid circuit substrate formed on the non-flexible area of the second cover film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113573467A (en) * | 2021-07-27 | 2021-10-29 | 生益电子股份有限公司 | Anti-collision soft-hard combined board and manufacturing method thereof |
| CN113573475A (en) * | 2021-07-27 | 2021-10-29 | 生益电子股份有限公司 | Rigid-flex board and manufacturing method thereof |
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| CN104582311A (en) * | 2015-01-09 | 2015-04-29 | 乐健科技（珠海）有限公司 | Method for preparing flexible-inflexible printed circuit board |
| CN105472906A (en) * | 2014-09-11 | 2016-04-06 | 富葵精密组件(深圳)有限公司 | Flexible and hard combined circuit board and manufacturing method thereof |
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| US20010010303A1 (en) * | 1997-02-14 | 2001-08-02 | A. Roland Caron | Multilayer combined rigid/flex printed circuit board containing flexible soldermask |
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| CN105472906A (en) * | 2014-09-11 | 2016-04-06 | 富葵精密组件(深圳)有限公司 | Flexible and hard combined circuit board and manufacturing method thereof |
| CN104582311A (en) * | 2015-01-09 | 2015-04-29 | 乐健科技（珠海）有限公司 | Method for preparing flexible-inflexible printed circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113573467A (en) * | 2021-07-27 | 2021-10-29 | 生益电子股份有限公司 | Anti-collision soft-hard combined board and manufacturing method thereof |
| CN113573475A (en) * | 2021-07-27 | 2021-10-29 | 生益电子股份有限公司 | Rigid-flex board and manufacturing method thereof |
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|---|---|
| CN112423472B (en) | 2022-03-08 |
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