CN112399654A - Electrothermal film and manufacturing method thereof - Google Patents
Electrothermal film and manufacturing method thereof Download PDFInfo
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- CN112399654A CN112399654A CN202011241560.8A CN202011241560A CN112399654A CN 112399654 A CN112399654 A CN 112399654A CN 202011241560 A CN202011241560 A CN 202011241560A CN 112399654 A CN112399654 A CN 112399654A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims abstract description 67
- 238000005538 encapsulation Methods 0.000 claims abstract description 40
- 238000004806 packaging method and process Methods 0.000 claims abstract description 37
- 238000009413 insulation Methods 0.000 claims abstract description 29
- 239000010410 layer Substances 0.000 claims description 268
- 239000000463 material Substances 0.000 claims description 57
- 239000012790 adhesive layer Substances 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 18
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 239000004642 Polyimide Substances 0.000 claims description 14
- 229910021389 graphene Inorganic materials 0.000 claims description 14
- 229920001721 polyimide Polymers 0.000 claims description 14
- 238000005485 electric heating Methods 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 229920006335 epoxy glue Polymers 0.000 claims description 6
- 238000004080 punching Methods 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 239000000741 silica gel Substances 0.000 claims 2
- 229910002027 silica gel Inorganic materials 0.000 claims 2
- 239000011889 copper foil Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000013464 silicone adhesive Substances 0.000 description 4
- 238000005553 drilling Methods 0.000 description 3
- 238000003698 laser cutting Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000000554 physical therapy Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/34—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
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- Laminated Bodies (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
Abstract
The present disclosure provides an electrothermal film and a method of manufacturing the same. One specific implementation mode of the electrothermal film comprises the following steps: a first encapsulation layer; the conductive heating layer is arranged on the first packaging layer, the conductive heating layer comprises a heating layer, an electrode layer, a heat insulation layer and a first bonding layer, the first bonding layer is provided with a concave part, the heating layer, the electrode layer and the heat insulation layer are arranged in the concave part, the electrode layer is arranged on the heating layer, and the heat insulation layer is arranged between the electrode layer and the first bonding layer; the second packaging layer is arranged on the conductive heating layer. This embodiment avoids first bond line and the regional direct contact that generates heat the layer corresponds, and then avoids the bubble that first bond line was heated and is produced to destroy the integrality of the layer that generates heat.
Description
Technical Field
The disclosure relates to the technical field of electrothermal films, in particular to an electrothermal film and a manufacturing method thereof.
Background
The electrothermal film is used as an electric heating element with outstanding characteristics, and is gradually applied to various fields due to the advantages of energy conservation, environmental protection, health, comfort and the like. Especially, the development in the related fields of medical treatment, physical therapy and the like is rapid, and the development on far infrared and related heating devices is concerned.
At present, the electrothermal film mainly comprises a heating material and an adhesive material for maintaining the adsorption capacity between the heating material and a packaging material. When the heating device including the electric heating film is in a high-temperature environment, the bonding material is easy to be heated at the interface between the heating material and the bonding material to generate bubbles so as to cause the bonding material to swell, the heating material can be torn by the swelled bonding material, the heating material is damaged to influence the heating effect, and finally the heating device fails.
Disclosure of Invention
The present disclosure provides an electrothermal film and a method of manufacturing the same.
In a first aspect, the present disclosure provides an electrothermal film, comprising: a first encapsulation layer; the conductive heating layer is arranged on the first packaging layer, the conductive heating layer comprises a heating layer, an electrode layer, a heat insulation layer and a first bonding layer, the first bonding layer is provided with a concave part, the heating layer, the electrode layer and the heat insulation layer are arranged in the concave part, the electrode layer is arranged on the heating layer, and the heat insulation layer is arranged between the electrode layer and the first bonding layer; the second packaging layer is arranged on the conductive heating layer.
In some alternative embodiments, the second encapsulation layer has at least one vent hole.
In some alternative embodiments, the electrode layer is a copper electrode layer; and the electric heating film further comprises: and the second bonding layer is arranged between the first packaging layer and the conductive heating layer.
In some optional embodiments, the at least one vent hole is uniformly disposed on the second encapsulation layer in a region corresponding to the recess.
In some alternative embodiments, the electrode layer is a silver electrode layer.
In some optional embodiments, the heat generating layer is a graphene material.
In some alternative embodiments, the first encapsulation layer and the second encapsulation layer are polyimide PI materials.
In some alternative embodiments, the first adhesive layer is a high temperature resistant silicone adhesive.
In some alternative embodiments, the second adhesive layer is an epoxy glue.
In some alternative embodiments, the thermal insulation layer is a Polyimide (PI) material.
In a second aspect, the present disclosure provides a method of manufacturing an electrothermal film, the method comprising: sequentially forming a heating layer and an electrode layer on the first packaging layer; arranging a high-temperature-resistant adhesive material on the second packaging layer, and arranging a concave part on the high-temperature-resistant adhesive material to form a first adhesive layer; attaching the heat insulation layer into the concave part; and attaching the first packaging layer to the first bonding layer so that the heat generating layer and the electrode layer are arranged in the concave part.
In some optional embodiments, prior to attaching the first encapsulation layer to the first adhesive layer, the method further comprises: and punching the second packaging layer to form at least one vent hole.
In some alternative embodiments, the electrode layer is a copper electrode layer; and before sequentially forming the heat generating layer and the electrode layer on the first encapsulation layer, the method further includes: forming a second adhesive layer on the first encapsulation layer; and forming a heating layer and an electrode layer in sequence on the first packaging layer, including: sequentially attaching the heating layer and the electrode layer to the second bonding layer; and attaching the first encapsulation layer to the first adhesive layer so that the heat generating layer and the electrode layer are disposed in the recess, including: the second adhesive layer is adhered to the first adhesive layer so that the heat generating layer and the electrode layer are disposed in the recess.
In some alternative embodiments, the electrode layer is a silver electrode layer.
In some optional embodiments, the heat generating layer is a graphene material.
In some alternative embodiments, the first encapsulation layer and the second encapsulation layer are polyimide PI materials.
In some alternative embodiments, the high temperature resistant adhesive material is a high temperature resistant silicone adhesive.
In some alternative embodiments, the second adhesive layer is an epoxy glue.
In some alternative embodiments, the thermal insulation layer is a PI material.
The problem of bonding material among the electric heat membrane among the prior art when being heated, the interface exhaust gas between heating material and bonding material produces the bubble, leads to bonding material to swell, and heating material can be torn by the bonding material who swells, and heating material is destroyed, influences the heating effect, finally leads to heating device's inefficacy is solved in order to solve. According to the electric heating film and the manufacturing method thereof, the heat insulation layer is arranged between the first bonding layer and the heating layer, the first bonding layer is prevented from being in direct contact with the heating area corresponding to the heating layer, and accordingly the situation that bubbles generated when the first bonding layer is heated damage the integrity of the heating layer is avoided.
Drawings
Other features, objects and advantages of the disclosure will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
FIG. 1A is a schematic structural view of one embodiment of an electrothermal film according to the present disclosure;
FIG. 1B is a schematic diagram of a structure of one embodiment of a first adhesive layer according to the present disclosure;
fig. 1C is a schematic structural diagram of an alternative implementation of a second encapsulation layer according to the present disclosure;
FIG. 2 is a schematic structural view of yet another embodiment of an electrothermal film according to the present disclosure;
fig. 3A to 3E are schematic structural views in a first manufacturing process of an electric heating film according to the present disclosure;
fig. 4A to 4F are schematic structural views in a second manufacturing process of an electric heating film according to the present disclosure.
Description of the symbols:
1-first packaging layer, 2-second bonding layer, 3-conductive heating layer, 31-heating layer, 32-electrode layer, 33-heat insulation layer, 34-first bonding layer, 341-concave part, 4-second packaging layer and 41-exhaust hole.
Detailed Description
The following description of the embodiments of the present disclosure will be provided in conjunction with the accompanying drawings and examples, and those skilled in the art can easily understand the technical problems and effects of the present disclosure. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. In addition, for convenience of description, only portions related to the related invention are shown in the drawings.
It should be noted that the structures, proportions, and dimensions shown in the drawings and described in the specification are for the understanding and reading of the present disclosure, and are not intended to limit the conditions under which the present disclosure can be implemented, so they are not technically significant, and any modifications of the structures, changes in the proportions and adjustments of the dimensions should be made without affecting the efficacy and attainment of the same. In addition, the terms "above", "first", "second" and "a" as used herein are for the sake of clarity only, and are not intended to limit the scope of the present disclosure, and changes or modifications of the relative relationship may be made without substantial changes in the technical content.
Referring to fig. 1A, fig. 1A shows a schematic structural diagram of an embodiment of an electrothermal film according to the present disclosure. The electric heating film 100 may include a first encapsulation layer 1, a conductive heat generation layer 3, and a second encapsulation layer 4. The conductive heating layer 3 is arranged on the first packaging layer 1, wherein the conductive heating layer 3 comprises a heating layer 31, an electrode layer 32, a heat insulation layer 33 and a first bonding layer 34, the first bonding layer 34 is provided with a concave portion 341, the heating layer 31, the electrode layer 32 and the heat insulation layer 33 are arranged in the concave portion 341, the electrode layer 32 is arranged on the heating layer 31, and the heat insulation layer 33 is arranged between the electrode layer 32 and the first bonding layer 34; and the second packaging layer 4 is arranged on the conductive heating layer 3.
Fig. 1B is a schematic structural view of one embodiment of a first adhesive layer 34 having a recess 341 according to the present disclosure.
The first packaging layer 1 plays a role in protection, and the electrode layer 32 and the heat generating layer 31 are prevented from being exposed. For example, high temperature resistant materials such as mica flakes may be used.
The electrode layer 32 functions to conduct current to the heat generating layer 31. Materials with good electrical conductivity properties may be used, such as nickel or other metals with good electrical conductivity or alloys thereof.
The heat generating layer 31 functions to transfer heat and maintain heat generating performance. Materials with good thermal conductivity properties, such as ITO (Indium Tin Oxide), carbon nanotubes, may be used.
The first adhesive layer 34 may be made of a material having an adsorption ability. A high temperature resistant adhesive material, such as an epoxy type adhesive, may be used.
The recess 341 may be a through hole, a blind hole (blind hole), a groove, or a cavity.
The heat insulating layer 33 functions to insulate the heat generating layer 31 from the first adhesive layer 34, preventing the heat generating layer 31 from being in direct contact with the first adhesive layer 34. A high temperature resistant material such as PET may be selected.
The second packaging layer 4 plays a role in protection, and the electrode layer 32 and the heat generating layer 31 are prevented from being exposed. For example, high temperature resistant materials such as mica flakes may be used.
Fig. 1C is a schematic structural diagram of an alternative implementation of the second encapsulation layer according to the present disclosure, and in some alternative implementations, the second encapsulation layer 4 may have at least one vent hole 41.
In some alternative implementations, the at least one vent hole 41 may be uniformly disposed on the second encapsulation layer 4 at a region corresponding to the concave portion 341.
In some alternative implementations, the electrode layer 32 may be a silver electrode layer.
In some alternative implementations, the heat generating layer 31 may be a graphene material. Here, the graphene material may be single-layer or multi-layer graphene.
In some alternative implementations, the first encapsulation layer 1 and the second encapsulation layer 4 may be PI materials.
In some alternative implementations, the first adhesive layer 34 may be a high temperature resistant silicone adhesive.
In some alternative implementations, the thermal insulation layer 33 may be a PI material.
The electric heating film 100 avoids the direct contact of the heating area corresponding to the first bonding layer 34 and the heating layer 31 by arranging the heat insulation layer 33 between the first bonding layer 34 and the heating layer 31, and further avoids the integrity of the heating layer 31 damaged by bubbles generated by heating the interface between the first bonding layer 34 and the heating layer 31 of the first bonding layer 34, and the heating effect is influenced. Meanwhile, the air bubbles generated by the adhesive material corresponding to the heat generating region can be exhausted by further matching with the air vent 41 arranged on the second packaging layer 4.
Referring to fig. 2, fig. 2 shows a schematic structural view of yet another embodiment of an electrothermal film according to the present disclosure. The electric heating film 200 may include: the packaging structure comprises a first packaging layer 1, a conductive heating layer 3, a second packaging layer 4 and a second bonding layer 2. The conductive heating layer 3 is arranged on the first packaging layer 1, wherein the conductive heating layer 3 comprises a heating layer 31, an electrode layer 32, a heat insulation layer 33 and a first bonding layer 34, the first bonding layer 34 is provided with a concave portion 341, the heating layer 31, the electrode layer 32 and the heat insulation layer 33 are arranged in the concave portion 341, the electrode layer 32 is arranged on the heating layer 31, and the heat insulation layer 33 is arranged between the electrode layer 32 and the first bonding layer 34; the second packaging layer 4 is arranged on the conductive heating layer 3, and the electrode layer 32 is a copper electrode layer; and the second bonding layer 2 is arranged between the first packaging layer 1 and the conductive heating layer 3.
In some alternative implementations, the second adhesive layer 2 is an epoxy glue.
The electric heating film 200 shows that when the electrode layer 32 is a copper electrode layer, a second adhesive layer 2 may be disposed between the first packaging layer 1 and the conductive heating layer 3 to improve the adhesion between the first packaging layer 1 and the conductive heating layer 3.
Fig. 3A to 3E are schematic structural views in a first manufacturing process of an electric heating film according to the present disclosure. The figures have been simplified for a better understanding of various aspects of the disclosure.
Referring to fig. 3A, a heat generating layer 31 and an electrode layer 32 are sequentially formed on the first package layer 1.
In some alternative implementations, the heat generating layer 31 may be a graphene film. For example, a graphene film may be deposited on a temporary substrate (e.g., copper foil) by a chemical vapor deposition technique in the prior art, and then the graphene film is transferred to the first encapsulation layer 1.
In some alternative implementations, the electrode layer 32 may be a silver electrode layer. For example, a silver electrode layer may be prepared using a printing process according to the electrode structure design.
Referring to fig. 3B, a high temperature resistant adhesive material is disposed on the second encapsulation layer 4, and a recess 341 is disposed on the high temperature resistant adhesive material to form the first adhesive layer 34.
Here, the concave portion 341 may be provided on the high temperature resistant adhesive material by using other suitable drilling method such as laser cutting to form the first adhesive layer 34.
In some alternative implementations, the high temperature resistant adhesive material may be a high temperature resistant silicone adhesive.
In some alternative implementations, the first encapsulation layer 1 and the second encapsulation layer 4 may be PI materials.
Referring to fig. 3C, the thermal insulation layer 33 is attached to the concave portion 341.
In some alternative implementations, the thermal insulation layer 33 may be a PI material.
Referring to fig. 3D, in some alternative implementations, the second encapsulation layer 4 is perforated to form at least one vent hole 41.
Here, the second encapsulation layer 4 may be perforated by using other suitable drilling methods such as laser cutting to form at least one vent hole 41.
Referring to fig. 3E, the first packaging layer 1 is attached to the first adhesive layer 34, so that the heat generating layer 31 and the electrode layer 32 are disposed in the concave portion 341.
Fig. 4A to 4F are schematic structural views in a second manufacturing process of an electric heating film according to the present disclosure. The figures have been simplified for a better understanding of various aspects of the disclosure. Here, the electrode layer 32 is a copper electrode layer.
Referring to fig. 4A, a second adhesive layer 2 is formed on the first packaging layer 1.
In some alternative implementations, the second adhesive layer 2 may be an epoxy glue.
Referring to fig. 4B, the heat generating layer 31 and the electrode layer 32 are sequentially attached to the second adhesive layer 2.
In some alternative implementations, the heat generating layer 31 may be a graphene film. The graphene film can be obtained by depositing on the copper foil through a chemical vapor deposition technology in the prior art, then the second bonding layer 2, the graphene film and the copper foil are sequentially laid on the first packaging layer 11 and pressed together, a copper electrode mask is designed according to an electrode design structure, and then a patterned copper electrode layer is prepared by utilizing an etching technology. The part of the copper foil remained after etching is a copper electrode, and the graphene film appears in the etched area of the copper foil.
Referring to fig. 4C, a high temperature resistant adhesive material is disposed on the second encapsulation layer 4, and a recess 341 is disposed on the high temperature resistant adhesive material to form the first adhesive layer 34.
Referring to fig. 4D, the thermal insulation layer 33 is attached to the concave portion 341.
In some alternative implementations, the thermal insulation layer 33 may be a PI material.
Referring to fig. 4E, in some alternative implementations, the second encapsulation layer 4 is perforated to form at least one vent hole 41.
Here, the second encapsulation layer 4 may be perforated by using other suitable drilling methods such as laser cutting to form at least one vent hole 41.
Referring to fig. 4F, the first packaging layer 1 is attached to the first adhesive layer 34, so that the heat generating layer 31 and the electrode layer 32 are disposed in the concave portion 341.
While the present disclosure has been described and illustrated with reference to particular embodiments thereof, such description and illustration are not intended to limit the present disclosure. It will be clearly understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the true spirit and scope of the present disclosure as defined by the appended claims. The illustrations may not be drawn to scale. There may be a difference between the art reproduction in the present disclosure and the actual device due to variables in the manufacturing process, and the like. There may be other embodiments of the disclosure that are not specifically illustrated. The specification and drawings are to be regarded in an illustrative rather than a restrictive sense. Modifications may be made to adapt a particular situation, material, composition of matter, method, or process to the objective, spirit and scope of the present disclosure. All such modifications are intended to be within the scope of the claims appended hereto. Although the methods disclosed herein have been described with reference to particular operations performed in a particular order, it should be understood that these operations may be combined, sub-divided, or reordered to form equivalent methods without departing from the teachings of the present disclosure. Accordingly, unless specifically indicated herein, the order and grouping of the operations is not a limitation of the present disclosure.
Claims (10)
1. An electrothermal film comprising:
a first encapsulation layer;
the conductive heating layer is arranged on the first packaging layer and comprises a heating layer, an electrode layer, a heat insulation layer and a first bonding layer, the first bonding layer is provided with a concave part, the heating layer, the electrode layer and the heat insulation layer are arranged in the concave part, the electrode layer is arranged on the heating layer, and the heat insulation layer is arranged between the electrode layer and the first bonding layer;
and the second packaging layer is arranged on the conductive heating layer.
2. The electrothermal film according to claim 1, wherein the second encapsulation layer has at least one vent; preferably, the at least one vent hole is uniformly disposed on the second encapsulation layer in a region corresponding to the recess.
3. The electrothermal film according to claim 1 or 2, wherein the electrode layer is a copper electrode layer; and
the electric heating film further includes:
the second bonding layer is arranged between the first packaging layer and the conductive heating layer;
preferably, the second adhesive layer is an epoxy glue.
4. The electrothermal film according to claim 1 or 2, wherein the electrode layer is a silver electrode layer.
5. The electrothermal film according to claim 1 or 2, wherein the heat generating layer is a graphene material; preferably, the first encapsulation layer and the second encapsulation layer are polyimide PI materials; preferably, the first adhesive layer is high temperature resistant silica gel; preferably, the heat insulation layer is made of PI material.
6. A method of manufacturing an electrothermal film comprising:
sequentially forming a heating layer and an electrode layer on the first packaging layer;
arranging a high-temperature-resistant adhesive material on the second packaging layer, and arranging a concave part on the high-temperature-resistant adhesive material to form the first adhesive layer;
attaching a thermal insulation layer into the recess;
and attaching the first packaging layer to the first bonding layer so that the heat generating layer and the electrode layer are arranged in the concave part.
7. The method of claim 6, wherein prior to said attaching the first encapsulation layer to the first adhesive layer, the method further comprises:
and punching the second packaging layer to form at least one vent hole.
8. The method of claim 6 or 7, wherein the electrode layer is a copper electrode layer; and
before the sequentially forming the heat generating layer and the electrode layer on the first encapsulation layer, the method further includes:
forming a second adhesive layer on the first encapsulation layer; and
form layer and the electrode layer that generates heat in proper order on first packaging layer, include:
sequentially attaching the heating layer and the electrode layer to the second bonding layer; and
the attaching the first encapsulation layer to the first adhesive layer so that the heat generating layer and the electrode layer are placed in the recess includes:
bonding the second adhesive layer to the first adhesive layer so that the heat generating layer and the electrode layer are placed in the recess;
preferably, the second adhesive layer is an epoxy glue.
9. The method of claim 6 or 7, wherein the electrode layer is a silver electrode layer.
10. The method according to claim 6 or 7, wherein the heat generating layer is a graphene material; preferably, the first encapsulation layer and the second encapsulation layer are polyimide PI materials; preferably, the high-temperature-resistant bonding material is high-temperature-resistant silica gel; preferably, the heat insulation layer is made of PI material.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011103450 | 2020-10-15 | ||
| CN2020111034505 | 2020-10-15 |
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| CN112399654A true CN112399654A (en) | 2021-02-23 |
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| CN202022568574.2U Active CN213906973U (en) | 2020-10-15 | 2020-11-09 | Electrothermal film |
| CN202011241525.6A Pending CN112367724A (en) | 2020-10-15 | 2020-11-09 | Electrothermal film and manufacturing method thereof |
| CN202011241560.8A Pending CN112399654A (en) | 2020-10-15 | 2020-11-09 | Electrothermal film and manufacturing method thereof |
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| CN202011241525.6A Pending CN112367724A (en) | 2020-10-15 | 2020-11-09 | Electrothermal film and manufacturing method thereof |
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| CN214070182U (en) * | 2020-10-15 | 2021-08-27 | 烯旺新材料科技股份有限公司 | Electrothermal film |
| CN113630915B (en) * | 2021-07-29 | 2024-11-22 | 上海师范大学 | Composite processing method and microheater for flexible customization of highly adjustable flexible microheater |
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| JP2018504749A (en) * | 2014-12-31 | 2018-02-15 | コーロン インダストリーズ インク | Transparent sheet heating element |
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| CN111526613B (en) * | 2020-05-18 | 2022-07-12 | 无锡格菲电子薄膜科技有限公司 | Copper electrode graphene electrothermal film and preparation method thereof |
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2020
- 2020-11-09 CN CN202022568604.XU patent/CN214070182U/en active Active
- 2020-11-09 CN CN202022568574.2U patent/CN213906973U/en active Active
- 2020-11-09 CN CN202011241525.6A patent/CN112367724A/en active Pending
- 2020-11-09 CN CN202011241560.8A patent/CN112399654A/en active Pending
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| US4719335A (en) * | 1984-01-23 | 1988-01-12 | Raychem Corporation | Devices comprising conductive polymer compositions |
| CN2896773Y (en) * | 2006-04-19 | 2007-05-02 | 杨引萍 | Metalfoil mica heating board |
| KR20170007684A (en) * | 2015-12-15 | 2017-01-19 | (주)티티에스 | Heating element having a fine pattern and method thereof |
| CN109729605A (en) * | 2018-12-27 | 2019-05-07 | 桂林清扬科技有限公司 | A kind of electric heating film and preparation method thereof |
| CN109714837A (en) * | 2019-03-12 | 2019-05-03 | 珠海聚碳复合材料有限公司 | A kind of graphene Electric radiant Heating Film |
| CN214070182U (en) * | 2020-10-15 | 2021-08-27 | 烯旺新材料科技股份有限公司 | Electrothermal film |
Also Published As
| Publication number | Publication date |
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| CN213906973U (en) | 2021-08-06 |
| CN214070182U (en) | 2021-08-27 |
| CN112367724A (en) | 2021-02-12 |
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