CN112381979A

CN112381979A - Wireless intelligent audio system module and intelligent access control safety management system

Info

Publication number: CN112381979A
Application number: CN202011379170.7A
Authority: CN
Inventors: 向世海
Original assignee: Azurewave Technology Shanghai Co ltd
Current assignee: Azurewave Technology Shanghai Co ltd
Priority date: 2020-11-30
Filing date: 2020-11-30
Publication date: 2021-02-19

Abstract

The invention provides a wireless intelligent audio system module and an intelligent access control safety management system, wherein the system module comprises a substrate, and the substrate comprises a circuit substrate; a plurality of electronic components arranged on the circuit substrate and electrically connected with the circuit substrate; a package unit including a package body disposed on the circuit substrate and covering the plurality of electronic components; the electronic components comprise a processing unit, a storage unit in communication connection with the processing unit, a communication unit, a driving unit and an interface unit, the communication unit comprises a WIFI communication module or a Bluetooth communication module, and the interface unit comprises MIPI DSI and MIPI CSI. The wireless intelligent audio system module integrates chips with different functions into one electronic package, saves space, reduces energy consumption, provides various interfaces, can be connected with other electronic devices such as audio, video and the like, has higher data transmission rate and meets the requirements of an intelligent access control safety management system.

Description

Wireless intelligent audio system module and intelligent access control safety management system

Technical Field

The invention belongs to the field of integrated circuits, and relates to a wireless intelligent audio system module and an intelligent access control safety management system.

Background

In recent years, the rapid growth of technology has led to the development of various products in combination with the application of technology, and most of the products are designed by modularizing due to the increasing functions of the products. As a novel modern security management system, the intelligent access control security management system is gradually applied to life along with popularization of shooting and recording electronic products such as intelligent sound boxes, intelligent household appliances and computer identification processing technologies. The intelligent entrance guard safety management system integrates microcomputer automatic identification technology and modern safety management measures, relates to a plurality of new technologies such as electronics, machinery, optics, computer technology, communication technology, biotechnology and the like, and is suitable for various important departments such as banks, hotels, machine rooms, military machine depots, key rooms, offices, home theaters, home safety systems, intelligent communities and the like. The system module (SoM) of intelligent entrance guard safety management system has integrated the module of many different functions to cooperate other hardware for example to take a video recording product etc. and realize the quick intelligent recognition of entrance guard together, the system module of intelligent entrance guard safety management system has integrated the module of multiple different functions among the prior art, can make the function of product increase by a wide margin, but under the demand of explaining product miniaturization and exquisite outward appearance now, how to design and have product small and multi-functional product concurrently, be the target of all being studied to the utmost in the industry. Moreover, the system module in the prior art has a large space for improving the space utilization rate and the data transmission rate.

Disclosure of Invention

The invention aims to provide a wireless intelligent audio system module and an intelligent access control safety management system, and aims to solve the problems of low space utilization rate and low data transmission rate of the system module in the prior art.

In order to solve the technical problem, the invention provides a wireless intelligent audio system module, which comprises a substrate, wherein the substrate comprises a circuit substrate; a plurality of electronic components disposed on and electrically connected to the circuit substrate; a packaging unit including a packaging adhesive disposed on the circuit substrate and covering the plurality of electronic components; the electronic components comprise a processing unit, a storage unit in communication connection with the processing unit, a communication unit, a driving unit and an interface unit, the communication unit comprises a WIFI communication module or a Bluetooth communication module, and the interface unit comprises MIPI DSI and MIPI CSI.

Further, the processing unit includes a CPU and/or an MCU.

Further, the memory unit comprises SDRAM and/or eMMC.

Further, the SDRAM includes LPDDR 4.

Further, the interface unit further includes: an ethernet port, udsdhc, GPIO, I2C bus interface, and/or USB interface.

Further, the electronic component further includes a PMIC, and the interface unit further includes a power interface and a RESET interface connected to the PMIC.

Further, the WIFI communication module is based on the 6 th generation wireless technology 802.11 ax.

Further, the electronic component further includes a JTAG interface module.

Furthermore, the electronic element is arranged on the circuit substrate through wire bonding and/or flip chip bonding.

The invention also provides an intelligent access control safety management system which comprises the wireless intelligent audio system module.

Compared with the prior art, the invention provides a wireless intelligent audio system module and an intelligent access control safety management system, wherein the wireless intelligent audio system module integrates a system comprising a logic component, a memory component and other components into a unit and can be re-developed and applied for multiple times, and the components required by the system are integrated on a chip; the chip with different functions is integrated in an electronic package, so that the space is saved, the energy consumption is reduced, the resource application is saved, various interfaces are provided, the chip can be connected with other electronic devices such as audio and video equipment of the intelligent access control safety management system, the effective control is realized, the data transmission rate is effectively guaranteed, and the requirements of the intelligent access control safety management system are met.

Drawings

Fig. 1 is a schematic structural diagram of a system architecture of a wireless intelligent audio system module according to an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of a wireless intelligent audio system module according to an embodiment of the present invention.

Detailed Description

The wireless intelligent audio system module and the intelligent access control security management system provided by the invention are further described in detail with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.

Fig. 1 is a schematic system architecture diagram of a wireless intelligent audio system module according to an embodiment of the present invention. Referring to fig. 1, a wireless intelligent audio system module includes a substrate, which generally adopts a core substrate material with a high glass transition temperature to enhance the welding strength of a small chip inside the system module and solve the yield defect caused by welding influence, wherein the substrate of the present invention includes a circuit substrate, on which an electronic component circuit diagram is generally designed, and during layout, the distance can be properly reduced according to the selected electronic components, and the electronic components can be shared by using the same path; the electronic elements are arranged on the circuit substrate and electrically connected with the circuit substrate, and the electronic elements are electrically connected with each other through a circuit diagram on the circuit substrate; a packaging unit including a packaging adhesive disposed on the circuit substrate and covering the plurality of electronic components; the electronic components comprise a processing unit, a storage unit in communication connection with the processing unit, a communication unit, a driving unit and an interface unit, the communication unit comprises a WIFI communication module or a Bluetooth communication module, and the interface unit comprises MIPI DSI and MIPI CSI. The invention provides a wireless intelligent audio system module, which integrates a system comprising a logic component, a memory component and other components into a unit and can be repeatedly developed and applied, and integrates the components required by the system on a chip; the chip with different functions is integrated in an electronic package, so that the space is saved, the energy consumption is reduced, the resource application is saved, various interfaces are provided, the chip can be connected with other electronic devices such as audio and video equipment of the intelligent access control safety management system, the effective control is realized, the data transmission rate is effectively guaranteed, and the requirements of the intelligent access control safety management system are met.

The processing unit of the invention may include a CPU and/or an MCU, where the CPU may adopt a quad-core ARM Cortex-a53 processor, and the MCU may adopt an ARM Cortex-M4 processor. And, a system module (SoM) may further be provided with a DeBug UART connected to the processing unit for testing the processing unit.

The design of the drive unit part can be carried out by adopting a design method of software engineering, because a drive runs on a System On Module (SOM) client and needs to carry out data interaction with hardware software, a communication message is firstly formulated, and after a protocol is analyzed, the design of the MAC part is divided into software and hardware, so that the hardware is used for completing the design, and the software is used for completing the design.

The storage unit comprises DDR, Memory, Flash, SDRAM and/or eMMC and the like. The SDRAM can comprise the LPDDR4, the bandwidth of 32Gbps can be provided and is 2 times of that of a DDR3RAM, an eMMC module can adopt eMMC 5.1, and the theoretical bandwidth is about 600 MB/s.

Preferably, in the SoM provided by the present invention, the interface unit further includes: ethernet port (Giga Ethernet), uSDHC, GPIO, I2C bus interface and/or USB interface to meet different product requirements and have high expandability.

Preferably, the electronic component further includes a PMIC, and the interface unit further includes a power interface and a RESET interface connected to the PMIC.

Further, the WIFI communication module is based on the 6 th generation wireless technology 802.11ax, the average throughput in the aspect of theoretical wireless speed can reach 4 times of that of the 802.11ac standard, the data transmission efficiency is improved, and the response speed of the whole intelligent access control safety management system is further improved.

Further, the electronic component further includes a JTAG interface module for performing internal testing on each chip.

Preferably, the electronic component is mounted on the circuit substrate by wire bonding and/or flip chip bonding. In designing a package specifically, a cavity may be formed on the top side of the integrated module, the back side metallized after stacking of chips and other components (e.g., resistors, capacitors, etc. in addition to the various electronic components mentioned above) and package protecting the front side, the chips arranged in the cavity such that the set of front contacts are electrically connected to one or more of the module's circuit interconnects, and the product interfaced, the package including a package module having a cavity formed therein, which may be formed as a stacked build-up soldering technique from successively established layers defining circuit interconnects between designs.

In summary, the present invention provides a wireless intelligent audio system module and an intelligent access control security management system, wherein the system module SOM is a highly flexible and reinforced module, and designers can flexibly implement the transplantation between devices in a pin-compatible package. The module includes memory, configuration, ethernet, USB, and clock to support the common functions required by most SoC design cores, which allows for easy access to N multiple user I/O pins through I/O connectors on the back of the module, and further supports access to functions for wireless networks, BT, etc.

The system on module (SoM) of the present invention can help designers develop a specific form factor embedded system with custom interfaces without developing a kernel processing system from the beginning, and designers can insert a pre-designed and tested SoM into a pre-designed or custom carrier card to create an embedded design that functions the same as a fully custom design but requires much less time for hardware development, and there are several advantages to using a SoM over developing hardware from the beginning, including: the method has the advantages of cost saving (high non-recurring engineering cost can be generated in the process of developing and debugging a circuit board based on SoC (system on a chip)), design risk reduction, various SoC choices (benefiting from the pluggable property of SoM), and the like.

Claims

1. a wireless intelligent audio system module, is characterized in that, comprises

a substrate, the substrate includes a circuit substrate;

a plurality of electronic components, the plurality of electronic components are arranged on the circuit substrate and are electrically connected with the circuit substrate;

an encapsulation unit, comprising an encapsulant disposed on the circuit substrate and covering the plurality of electronic components;

Wherein, a plurality of the electronic components include a processing unit, a storage unit communicatively connected to the processing unit, a communication unit, a drive unit, and an interface unit, the communication unit includes a WIFI communication module or a Bluetooth communication module, and the interface unit includes MIPI DSI, MIPI CSI.

2 . The wireless intelligent audio system module according to claim 1 , wherein the processing unit comprises a CPU and/or an MCU. 3 .

3. A wireless intelligent audio system module according to claim 1, wherein the storage unit comprises SDRAM and/or eMMC.

4. The wireless intelligent audio system module according to claim 3, wherein the SDRAM comprises LPDDR4.

5 . The wireless intelligent audio system module according to claim 1 , wherein the interface unit further comprises: an Ethernet port, a uSDHC, a GPIO, an I2C bus interface and/or a USB interface. 6 .

6 . The wireless intelligent audio system module according to claim 1 , wherein the electronic component further comprises a PMIC, and the interface unit further comprises a power interface and a RESET interface connected to the PMIC. 7 .

7 . The wireless intelligent audio system module according to claim 1 , wherein the WIFI communication module is based on the 6th generation wireless technology 802.11ax. 8 .

8 . The wireless intelligent audio system module according to claim 1 , wherein the electronic component further comprises a JTAG interface module. 9 .

9 . The wireless smart audio system module according to claim 1 , wherein the electronic components are mounted on the circuit substrate by wire bonding and/or flip chip bonding. 10 .

10. An intelligent access control security management system, characterized by comprising the wireless intelligent audio system module according to any one of claims 1-9.