CN112369129B - Electronic control device - Google Patents

Abstract

The invention provides a technology capable of ensuring the quality of a card-type edge terminal part. The electronic control device (10) has two circuit boards (20, 30), wherein the card-type edge terminal portions (27, 36) face in the same direction, and the board surfaces (21, 31) face each other. Each card-type edge terminal part (27, 36) has a plurality of terminals (42) provided on the substrate surface and an electrically insulating printed layer (70) surrounding each terminal (42). The surface of the printed layer (70) is set higher than the contact surface (42 a) of each terminal (42) in the thickness direction of the circuit board (20).

Description

Electronic Control Devices

Technical Field

The present invention relates to an electronic control device in which two circuit substrates are sealed with resin.

Background technique

Among electronic control devices having a resin sealing structure, there are so-called card edge connector type electronic control devices that are provided with a card edge connector that can be inserted into an edge connector socket. The card edge connector is formed by providing a terminal portion as an external connection terminal at the end of a circuit substrate. Regarding such a card edge connector type electronic control device, there is a technology disclosed in Patent Document 1.

In the electronic control device disclosed in Patent Document 1, a circuit substrate is arranged in a cavity of a transfer mold composed of a lower mold and an upper mold, and the card-type edge terminal portion of the circuit substrate is clamped by the lower mold and the upper mold, and molten resin material is pressed into the cavity, thereby sealing the circuit substrate with resin.

Prior Art Literature

Patent Literature

Patent Document 1: Japanese Patent Application Publication No. 2006-173402

Summary of the invention

Problem that the invention aims to solve

However, for such an electronic control device, it is sometimes desirable to increase the signal transmission system for transmitting signals to the outside. In this case, it is sufficient to increase the number of terminals constituting the card edge terminal portion. However, when the number of terminals is increased, the width of the card edge terminal portion becomes wider. This is disadvantageous from the perspective of miniaturization of the electronic control device. Therefore, there is a limit to increasing the number of card edge terminal portions.

Therefore, it is conceivable to arrange the substrate surfaces of the two circuit substrates apart from each other and face each other, and to seal the entirety of the two circuit substrates with a resin sealing member in a state where each card edge terminal portion is exposed.

In order to expose each card edge terminal, it is necessary to seal between the card edge terminals when the molten resin material flows into the cavity of the mold. As an example of a sealing method, a method of moving and inserting a slide mold between each card edge terminal is considered.

In order to prevent the molten resin from leaking from the cavity, each card edge terminal part needs to be in close contact with the slide mold. Therefore, when the slide mold moves, the slide mold and each card edge terminal part will rub against each other. It is important to ensure the quality of each card edge terminal part in view of this friction phenomenon to improve the quality of the electronic control device.

An object of the present invention is to provide a technology capable of ensuring the quality of a card edge terminal portion.

Means used to solve problems

According to the invention of technical solution 1, an electronic device is provided, which has:

Two circuit substrates, wherein the card edge terminals face the same direction and the substrate surfaces face each other;

a plurality of electronic components mounted on the two circuit substrates, respectively; and

A resin sealing member that exposes only the card edge terminals and seals all of the plurality of electronic components and the two circuit substrates.

Each of the card edge terminal portions has a plurality of terminals disposed on the substrate surface and an electrically insulating printed layer surrounding each of the terminals.

The surface of the printed layer is set higher than the contact surface of each of the terminals in the thickness direction of the circuit substrate.

According to the invention of Technical Solution 2, it is preferred that the two circuit substrates respectively have an electrically insulating plate-shaped base material, a wiring layer arranged on the surface of the base material, and an electrically insulating solder resist layer covering the surface of the base material, and the printed layer is a screen printed layer printed on the surface of the solder resist layer by screen printing.

According to the invention of claim 3, the two circuit substrates are arranged in a tapered shape so that the interval between them increases toward the card edge terminal portions.

Effects of the Invention

In the technical solution 1, each card edge terminal portion has a plurality of terminals provided on the substrate surface and an electrically insulating printed layer surrounding each terminal. The surface of the printed layer is set higher than the contact surface of each terminal in the thickness direction of the circuit substrate. Therefore, when the sliding mold is inserted between each card edge terminal portion, the sliding mold does not contact each terminal but contacts the printed layer. Since the sliding mold and each terminal do not rub against each other, the quality of the card edge terminal portion can be ensured.

In the technical solution 2, the printed layer is printed on the surface of the solder resist layer by screen printing. Therefore, when the number of the component is printed on the surface of the solder resist layer by screen printing, the printed layer can be provided at the same time. The printed layer can be provided around the card edge terminal portion without adding a new process.

In the technical solution 3, the circuit substrate is configured in a tapered shape so that the interval between the card edge terminals increases as the distance between the card edge terminals increases. Therefore, when the slide die is inserted into and removed from between the card edge terminals, the slide die only moves slightly and stops contacting the printed layer. Therefore, the distance between the contact surface of the slide die and the terminal can be further increased. The quality of the electronic control device can be easily improved.

BRIEF DESCRIPTION OF THE DRAWINGS

Fig. 1(a) is a cross-sectional view of an electronic control device of the embodiment. Fig. 1(b) is an enlarged view of part 1b of Fig. 1(a).

Fig. 2(a) is a plan view of the periphery of the card edge terminal portion of the electronic control device shown in Fig. 1. Fig. 2(b) is a cross-sectional view taken along line 2b-2b of Fig. 2(a).

Fig. 3 (a) is a diagram for explaining a preparation step of the method for manufacturing the electronic control device shown in Fig. 1 (a). Fig. 3 (b) is a diagram for explaining a substrate placement step to a press-fitting step.

Fig. 4(a) is a diagram for explaining a resin molding process. Fig. 4(b) is a perspective view of an electronic control device.

Detailed ways

Hereinafter, embodiments of the present invention will be described based on the drawings. In the description, top and bottom refer to top and bottom based on the drawings.

<Example>

Refer to (a) of Fig. 1. For example, the electronic control unit 10 is mounted on a two-wheeled vehicle and is inserted into an edge connector socket Co for use.

The electronic control device 10 includes: a power supply substrate 20 (circuit substrate 20); a control substrate 30 (circuit substrate 30) arranged opposite to the power supply substrate 20; a connecting portion 11 for electrically connecting these circuit substrates 20 and 30; and a resin-made sealing resin portion 12 (sealing component 12) for sealing a part of these circuit substrates 20 and 30 and the connecting portion 11.

The surface of the power substrate 20 that faces the control substrate 30 is defined as a first facing surface 21 (substrate surface 21). The surface on the opposite side of the first facing surface 21 is defined as a first outer surface 22. The surface of the control substrate 30 that faces the power substrate 20 is defined as a second facing surface 31 (substrate surface 31). The surface on the opposite side of the second facing surface 31 is defined as a second outer surface 32.

A plurality of electronic components 23 to 26 are mounted on the power substrate 20 , and a first card edge terminal portion 27 (card edge terminal portion 27 ) is formed. The first card edge terminal portion 27 can supply power to the electronic components 23 to 26 and can be inserted into the edge connector socket Co.

The first card edge terminal portion 27 is exposed to the outside from the sealing resin portion 12. In addition, the first card edge terminal portion 25 needs to be formed at least on the first opposing surface 21.

A plurality of electronic components 33 to 35 are mounted on the control substrate 30 , and a second card edge terminal portion 36 (card edge terminal portion 35 ) is formed. The second card edge terminal portion 36 can supply power to the electronic components 33 to 35 and can be inserted into the edge connector socket Co.

The second card edge terminal portion 35 is exposed to the outside from the sealing resin portion 12. In addition, the second card edge terminal portion 35 needs to be formed at least on the second opposing surface 31.

The electronic components 23 to 26 and the electronic components 33 to 35 are, for example, transistors, ICs (integrated circuits), diodes, etc. The first card edge terminal portion 27 and the second card edge terminal portion 36 face the same direction.

Refer to (b) of Figure 1. The power substrate 20 and the control substrate 30 are arranged to be tilted with reference to parallel lines PL and PL extending parallel to each other. The tilt angle of the power substrate 20 relative to the parallel line PL is θ1, and the tilt angle of the control substrate 30 relative to the parallel line PL is θ2. θ1 and θ2 can be the same angle or different angles. θ1 and θ2 are preferably 0.5° to 2.0°.

At the front end portions 28 and 37 of the power substrate 20 and the control substrate 30, respectively, the distance from the power substrate 20 to the control substrate 30 is L1. Near the sealing resin portion 14, the distance from the power substrate 20 to the control substrate 30 is L2. Here, L1>L2. The two circuit substrates 20 and 30 are arranged so that the card edge terminal portions 27 and 36 are opposed to each other while being separated, and the two circuit substrates 20 and 30 are arranged so as to be inclined to each other in such a manner that the interval between the portions exposed from the sealing resin portion 14 becomes wider as it goes from the portion where the connection portion 11 is provided toward the front end portions 28 and 37. That is, the two circuit substrates 20 and 30 are arranged in a tapered shape so that the interval between each other becomes wider as it goes toward each card edge terminal portion 27 and 36.

Refer to Fig. 1(a). The connection portion 11 may be any member such as a lead wire, a bus bar, or a flexible wiring.

The sealing resin part 12 is formed by transfer molding and can be made of any resin material such as epoxy resin, phenolic resin, melamine resin, unsaturated polyester, silicone resin, polyurethane, polypropylene, etc.

2( a ), on the first outer surface 22 , the first card edge terminal portion 27 has a plurality of, for example, seven, terminals 41 .

Refer to (b) of FIG2 . The power substrate 20 includes: an electrically insulating substrate 51 such as a glass plate; copper wiring layers 52 and 53 provided on both surfaces of the substrate 51; electrically insulating solder resist layers 54 and 55 covering both surfaces of the substrate 51; and printed layers 60 and 70 printed on both surfaces of the solder resist layers 54 and 55. The terminal 41 is a part of the wiring layer 52 and is exposed from the solder resist layer 52.

Refer to FIG2 (a). The printed layer 60 is formed by screen printing, including the product number of the power substrate 20, characters, graphics, and marks that assist in the installation of the electronic components 23 to 26. In this embodiment, the printed layer 60 includes a mark 61 indicating the electronic component 21 and a first surrounding portion 62 surrounding each terminal 41.

When viewed from above, the first surrounding portion 62 can be divided into a first region 63 extending from the edge of the sealing resin portion 12 to the edge in the short-side direction of the terminal 41, a second region 64 adjacent to the first region 63 and extending to the edge in the short-side direction on the opposite side of the terminal 41, and a third region 65 adjacent to the second region 64 and extending to the front end portion 28. The first region 63 and the third region 65 are in a strip shape. The second region 64 is rectangular and is intermittently located between the seven terminals 41 and to the sides thereof.

2( b ) . Similarly, on the first facing surface 21 , a second surrounding portion 72 surrounding the terminal 42 is formed on the surface of the solder resist layer 55 . The second card edge terminal portion 36 of the control board 30 also has the same structure. The description thereof is omitted.

The thickness of the wiring layer 52 on the first outer surface 22 side is the same as the thickness of the wiring layer 53 on the first opposing surface 21 side. Similarly, the thicknesses of the solder resist layers 54 and 55 are the same, and the thicknesses of the printed layers 60 and 70 are also the same.

The surface 72a of the second surrounding portion 72 (printed layer 70) is set higher than each terminal 42 in the thickness direction of the power substrate 20. That is, with the center C in the thickness direction of the power substrate 20 as a reference, the height H1 to the surface 72a of the second surrounding portion 72 is higher than the height H2 to the contact surface 42a of the terminal 42 (H1>H2).

The second card edge terminal portion 36 ( FIG. 1( b )) is also configured similarly to the first card edge terminal portion 27. That is, a third surrounding portion 67 is provided around the terminal 43 on the second facing surface 31. A fourth surrounding portion 77 is provided around the terminal 44 on the second outer surface 32.

Next, a method for manufacturing the electronic control device will be described.

3( a ), first, the main body 13 is prepared. The main body 13 includes a power board 20 having a first card edge terminal 27 , a control board 30 having a second card edge terminal 36 , and a connection portion 11 for connecting the power board 20 and the control board 30 .

Refer to (b) of Figure 3. The molding die 80 for molding the sealing resin portion 12 (refer to (a) of Figure 1) is described. The molding die 80 has: a fixed lower die 81; an upper die 82 that overlaps with the upper portion of the lower die 81 and can move up and down; a sliding die 84 that can slide between these lower die 81 and upper die 82 in the left-right direction and whose front end can enter the cavity 83; a first supporting member 85 that extends upward from the lower die 81 and supports the power substrate 20; a second supporting member 86 that extends upward from the lower die 81 and supports the control substrate 30; a first force applying portion 87 that applies force to the power substrate 20 toward the sliding die 53; a second force applying portion 88 that applies force to the control substrate 30 toward the sliding die 53; and a plunger 89 that heats the resin material 12M and fills it into the cavity 83.

The length of the end 84a of the slide mold 84 on the cavity 83 side is L3, and the length of the end 84b on the opposite side is L4. The length L4 of the end 84b is longer than the length L3 of the end 84a. That is, L3<L4. The slide mold 84 is formed in a tapered shape from the end 84b to the end 84a.

Next, the power board 20 and the control board 30 are placed on the supporting members 85 and 86 , respectively (board placement step).

Next, in a state where the two circuit boards 20 and 30 are arranged, the upper mold 82 and the lower mold 81 are overlapped to form the cavity 83 inside (mold closing step).

Next, the slide mold 84 is moved and fitted between the card edge terminals 27 and 36 to seal the space between the card edge terminals 27 and 36 (sealing step).

Next, the biasing parts 87 and 88 are relatively moved in the mold clamping direction to press the circuit boards 20 and 30 against the slide mold 84 (pressing step).

Refer to Fig. 4(a). Next, while the card edge terminals 25 and 35 are sealed, the cavity 83 is filled with the molten resin material 12M, and the circuit boards 20 and 30 are sealed with the molten resin material 12M (resin molding step).

Finally, after the resin material 12M is cooled, the upper mold 82 is separated from the lower mold 81, and the main body 13 sealed with the resin material 12M is removed from the lower mold (mold release step). In this way, the electronic control device 10 is obtained.

Next, the effects of the embodiment will be described.

2( a ), on the first outer surface 22 , each terminal 41 of the first card edge terminal portion 27 is surrounded by an electrically insulating first surrounding portion 62 (printed layer 60 ). The first opposing surface 21 also has a similar structure, and is provided with a second surrounding portion 72 .

Refer to (b) of Fig. 2. The surface of the (printed layer 70) of the second surrounding portion 72 is set higher than the contact surface 42a of each terminal 42 based on the thickness direction of the power substrate 20. Therefore, when the slide mold 84 is inserted between the card edge terminal portions 27 and 36, the slide mold 84 contacts the second surrounding portion 72 without contacting the terminals 42. The slide mold 84 and the terminals 42 do not rub against each other, so the quality of the second card edge terminal portion 27 can be ensured.

In addition, the second enclosing portion 72 is provided by screen printing on the surface of the solder resist layer 55. Therefore, the second enclosing portion 72 can be provided when the component number or the like is printed on the surface of the solder resist layer 55 by screen printing. The second enclosing portion 72 can be provided without adding a new process just for providing the second enclosing portion 72.

Refer to Fig. 1(b). The power board 20 and the control board 30 are arranged in a tapered shape so that the intervals between the card edge terminal portions 27 and 36 become wider as they go toward the card edge terminal portions 27 and 36.

Refer to (b) of FIG3 . Therefore, when the slide die 84 is inserted into or pulled out from the card edge terminal portions 27 and 36, the slide die 84 can be moved slightly to avoid contact with the second surrounding portion 72. Therefore, the distance between the slide die 84 and the contact surface 42a of the terminal portion 42 can be further increased, so that the quality of the electronic control device can be easily improved.

In addition, the present invention is not limited to the embodiments as long as the functions and effects of the present invention are achieved.

Industrial Applicability

The electronic control device of the present invention is suitable for a two-wheeled vehicle.

Reference numerals

10: Electronic control device;

12: Sealing resin part;

20: power substrate (circuit substrate);

21: first opposing surface (substrate surface);

22: first outer surface;

27: first card edge terminal portion;

30: control substrate (circuit substrate);

31: second opposing surface (substrate surface);

32: second outer surface;

36: second card edge terminal portion;

41: Terminal;

42: Terminal;

42a: contact surface;

51: substrate;

52: wiring layer;

53: wiring layer;

54: solder resist layer;

55: solder resist layer;

60: printing layer;

61: mark;

62: first surrounding part;

63: First area;

64: Second area;

65: Third area;

70: printing layer;

72: Second surrounding part.

Claims (2)

1. An electronic control device, comprising:

two circuit boards, wherein the card-type edge terminal parts face the same direction, and the substrate surfaces are opposite to each other;

a plurality of electronic components mounted on the two circuit substrates, respectively; and

A resin sealing member that exposes only the card-type edge terminal portions and seals all of the plurality of electronic components and the two circuit boards,

Each card-type edge terminal part has a plurality of terminals arranged on the substrate surface and an electric insulation printing layer surrounding each terminal,

The surface of the printed layer is set higher than the contact surface of each terminal in the thickness direction of the circuit substrate,

The two circuit boards are arranged in a tapered shape so as to increase the distance between the card-shaped edge terminal portions.

2. The electronic control device according to claim 1, wherein,

The two circuit boards each have an electrically insulating plate-like base material, a wiring layer provided on a surface of the base material, and an electrically insulating solder resist layer covering a surface of the base material,

The printing layer is a screen printing layer printed on the surface of the solder resist layer by screen printing.