CN112349699A - Six-layer wiring LCP packaging substrate, manufacturing method and multi-chip system-in-package structure - Google Patents
Six-layer wiring LCP packaging substrate, manufacturing method and multi-chip system-in-package structure Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims abstract description 182
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 76
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 266
- 239000002184 metal Substances 0.000 claims abstract description 266
- 238000005476 soldering Methods 0.000 claims abstract description 16
- 239000010410 layer Substances 0.000 claims description 385
- 230000008054 signal transmission Effects 0.000 claims description 51
- 238000003466 welding Methods 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 34
- 229910000679 solder Inorganic materials 0.000 claims description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 239000011247 coating layer Substances 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- 230000008569 process Effects 0.000 claims description 16
- 239000007787 solid Substances 0.000 claims description 13
- 230000005540 biological transmission Effects 0.000 claims description 11
- 238000001465 metallisation Methods 0.000 claims description 11
- 125000006850 spacer group Chemical group 0.000 claims description 10
- 230000000149 penetrating effect Effects 0.000 claims description 9
- 238000005553 drilling Methods 0.000 claims description 7
- 238000004026 adhesive bonding Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 126
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 126
- 239000000463 material Substances 0.000 description 17
- 238000010586 diagram Methods 0.000 description 12
- 230000010354 integration Effects 0.000 description 7
- 238000013461 design Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000003475 lamination Methods 0.000 description 5
- 238000011049 filling Methods 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000005202 decontamination Methods 0.000 description 3
- 230000003588 decontaminative effect Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- -1 high heat resistance Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000678 plasma activation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76895—Local interconnects; Local pads, as exemplified by patent document EP0896365
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5386—Geometry or layout of the interconnection structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
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- Toxicology (AREA)
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Abstract
本发明公开了一种六层布线LCP封装基板、制造方法及多芯片系统级封装结构，所述LCP封装基板包括：从表面至底面分布的6层图形化金属线路层，第一层图形化金属线路层的最外围至少一条边上，分布有所述LCP封装基板对外二次级联I/O焊接用焊盘或图形；位于相邻图形化金属线路层之间的5层绝缘介质层；位于第一层图形化金属线路层和第二层图形化金属线路层之间的绝缘介质层中，且开口朝向所述第一层图形化金属线路层的多个盲槽；位于图形化金属线路层与绝缘介质层之间的多个盲孔。本发明实现了一种能够满足多芯片、高气密要求、高电磁屏蔽、高可靠互联的系统级封装要求的气密封装结构的LCP封装基板。
The invention discloses a six-layer wiring LCP packaging substrate, a manufacturing method and a multi-chip system-level packaging structure. The LCP packaging substrate comprises: six layers of patterned metal circuit layers distributed from the surface to the bottom, and a first layer of patterned metal circuit layers. At least one edge of the outermost periphery of the circuit layer is distributed with pads or patterns for external secondary cascade I/O soldering of the LCP package substrate; 5 layers of insulating dielectric layers are located between adjacent patterned metal circuit layers; in the insulating dielectric layer between the first patterned metal circuit layer and the second patterned metal circuit layer, and the openings face the plurality of blind grooves of the first patterned metal circuit layer; located in the patterned metal circuit layer A plurality of blind holes between the insulating dielectric layer. The invention realizes an LCP package substrate with a hermetically sealed packaging structure that can meet the system-level packaging requirements of multi-chips, high air tightness requirements, high electromagnetic shielding, and high reliability interconnection.
Description
Technical Field
The invention relates to the technical field of integrated circuits and chip packaging, in particular to a six-layer wiring LCP packaging substrate, a manufacturing method and a multi-chip system-in-package structure, which are used for high-reliability system-in-package for high-frequency applications such as radio frequency, microwave, millimeter wave and the like.
Background
As semiconductor and integrated circuit technologies advance, system integration requirements further increase, and current electronic circuit designs and manufacturing are developed towards smaller size and higher integration density, and considerable work is being done in the field of multi-chip packaging. In an advanced package form, a plurality of Radio Frequency (RF) chips, digital Integrated Circuit (IC) chips, micro chip devices, etc. are assembled on a package substrate by the SIP technology and then integrated into one package. The multi-chip packaging form shortens the pin distance between the chips, greatly improves the packaging density and can meet the requirements of system-level packaging to a certain extent.
Depending on the material of the package substrate, the package method can be generally divided into two types: one is a multilayer ceramic package using a cavity structure, and the other is a plastic package using a multilayer PCB substrate as a chip substrate material.
The ceramic packaging substrate has the advantages of high integration density, high reliability, high air tightness, high heat conductivity, excellent corrosion resistance and the like. However, due to the thermal mismatch between the ceramic material and the PCB material, the large-sized package cannot be performed, and the ceramic package has a problem of high manufacturing cost.
The plastic packaging substrate has the characteristics of low cost, relatively simple process and high interconnection density, and can realize secondary high-density interconnection with a PCB motherboard in the forms of BGA and the like. The biggest defects of the PCB are that the common PCB material has high moisture absorption rate and poor water vapor blocking performance, and cannot realize airtight packaging; meanwhile, the dielectric properties (dielectric constant and dielectric loss) of common resin materials are limited, and the common resin materials cannot be applied to radio frequency/microwave transmission. These deficiencies limit the use of plastic packages for highly reliable, high performance chip packaging, the main area of application of which is consumer electronics today.
The Liquid Crystal Polymer (LCP) material has the outstanding advantages of excellent dielectric transmission property, extremely low moisture absorption rate, water permeability and oxygen transmission rate, plane thermal expansion coefficient matched with copper, high heat resistance, chemical corrosion resistance and the like, conforms to the strict requirements of a radio frequency/microwave chip on a packaging substrate material, and is a new generation substrate material with high reliability, huge potential in the high-performance chip packaging application field and wide application prospect.
Chinese patents CN106486427A and CN206259334U disclose a package housing based on an LCP substrate and a method for manufacturing the same, in which the LCP substrate is used as a substrate layer for chip mounting, and technologies such as chip assembly, metal enclosure frame, cover plate welding and the like are used as auxiliary materials, so as to provide a solution for chip hermetic package. In this package form, a specific structure and a manufacturing method are not given as a package substrate; the packaging form of the packaging structure lacks an external interconnection interface, and the secondary cascade of a packaging body cannot be realized; LCP base plate does not possess the circuit subregion characteristic, can not provide the good electromagnetic shield basis for the multi-chip complex system, and the circuit crosstalk problem is difficult to avoid.
Chinese patent CN102593077A discloses a liquid crystal polymer package structure, which is formed by hot-melting and combining a high-melting-point LCP composite cover plate and a low-melting-point LCP tube shell. The packaging structure is too simple and does not relate to the specific structural characteristics and the implementation method of the substrate.
Chinese patent CN104282632B discloses a package housing based on LCP substrate and a method for manufacturing the same, which uses LCP multi-layer substrate as a carrier to perform hermetic package of chips. The LCP packaging substrate structure is divided according to a surface sealing layer, a chip mounting layer, a welding layer, an interconnection layer and the like, all the structural characteristics of the components are limited, and an implementation method is provided. In the substrate structure, the holes of the circuit interconnection layer are positioned at the periphery of the chip sealing area, and the periphery of the chip is non-airtight due to the existence of the through holes, so that the effective airtight packaging area of the substrate is reduced, and the circuit interconnection design of each layer is limited; the surface layer is defined as a sealing area, is separately designed with the inner bonding layer and is not electrically connected with each other or only connected with the ground, and the structure is only suitable for simple packaging of a single chip and is not suitable for complex system-level application occasions with multi-chip packaging and multi-electromagnetic shielding requirements. The disclosed implementation method is manufactured by multiple lamination and hot pressing. The LCP adhesive film material is thermoplastic in nature and theoretically cannot be laminated multiple times, so the process of making the structure is difficult and impractical.
Chinese patent CN107324273B discloses a method for packaging MEMS device based on LCP multi-layer stacking technology, which adopts a multi-layer LCP stacking and laminating method to prepare a cap for MEMS device, and directly applies LCP material to single-chip plastic package. In the invention, the LCP material only plays a role of a packaging cap, and the application field does not relate to a packaging substrate and can not carry out wiring design.
Chinese patent CN102683220B discloses a method for manufacturing a multilayer organic liquid crystal polymer substrate structure, which can embed active and passive devices into the multilayer organic liquid crystal polymer substrate simultaneously to realize hermetic package of chips. The active device with the salient points is connected to an LCP substrate by using a flip chip bonding technology, then an LCP bonding film is windowed and laminated, and finally, the LCP bonding film is interconnected through metallized through holes to finally form a packaging structure body. The packaging structure adopts the manufacturing route of the chip embedded substrate, mainly faces to single chip packaging, and is not applicable to multi-chip packaging with high electromagnetic shielding requirements; the interconnection holes of the substrate are manufactured through one-time drilling metallization, the interconnection function of the substrate is simple, and the complex interconnection requirement required by multi-chip packaging cannot be met.
Chinese patent CN106252339B discloses a high-density rf multi-chip package structure, which uses a multi-layer substrate and a housing as a carrier, and stacks a plurality of chips and devices in a vertical direction for three-dimensional high-density hybrid integration. The multi-chip package is essentially hybrid integration in the form of a multi-chip package body, has limited electromagnetic shielding performance, relates to selection of multiple temperature gradients and solders, and is difficult to realize the process.
Chinese patent CN103165479B discloses a method for manufacturing a multi-chip system-in-package structure, which integrates a plurality of chips on an interposer by vertically stacking multiple chips to form a system-in-package structure. The structure is suitable for high-density integration of IC chips, but is not suitable for electromagnetic shielding requirements of multiple radio frequency chips.
Chinese patent CN103930989B discloses a radio frequency package on package (rp) circuit, which forms a two-stage package of a radio frequency package on package (PoP) circuit by vertically stacking two rf packages. The structure packaging body does not relate to the electromagnetic shielding problem of the chip in the single packaging body in detail, the function of the substrate is simple, and the aspect of the substrate structure is not described in detail.
U.S. patent US2019/0080817Al discloses a method for manufacturing an LCP resin multi-layer substrate, which can improve flatness and avoid manufacturing problems such as warping caused by glue shortage by using a special LCP paste as an LCP multi-layer substrate bonding layer and a thickness adjusting layer. This interconnect hole of base plate structure adopts the electrically conductive thick liquids to fill the preparation, because the binder composition of electrically conductive thick liquids, can volatilize under the high temperature and cause the base plate to rise the layer, bubble and explode the board risk even, and the base plate of this kind of mode preparation can't bear high temperature application occasion. And the adhesion force between the LCP paste and the LCP layer and between the LCP paste and the conductive paste is much poorer than that of the conventional LCP adhesive film laminating method theoretically. The multilayer LCP substrate manufactured by the method is not suitable for radio frequency chip packaging application occasions with high interconnection hole reliability.
In the prior art, no technical solution for realizing a package substrate and a system-in-package structure which meet the system-in-package requirements of multi-chip, high-airtightness, high-electromagnetic shielding and high-reliability interconnection by utilizing LCP is available.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: aiming at the existing problems, the six-layer wiring LCP packaging substrate, the manufacturing method and the multi-chip system-in-package structure based on the six-layer wiring LCP packaging substrate are provided, so that the system-in-package requirements of multiple chips, high air tightness, high electromagnetic shielding and high reliability interconnection are met.
The invention provides a six-layer wiring LCP packaging substrate, which comprises:
the metal circuit layer comprises 6 graphical metal circuit layers distributed from the surface to the bottom surface, namely a first graphical metal circuit layer, a second graphical metal circuit layer, a third graphical metal circuit layer, a fourth graphical metal circuit layer, a fifth graphical metal circuit layer and a sixth graphical metal circuit layer in sequence; at least one edge of the outermost periphery of the first patterned metal circuit layer is distributed with bonding pads or patterns for external secondary cascade I/O welding of the LCP packaging substrate;
5 insulating medium layers positioned between the adjacent graphical metal circuit layers; each insulating medium layer is composed of LCP substrates;
the insulating medium layer is positioned between the first patterned metal circuit layer and the second patterned metal circuit layer, and the openings of the insulating medium layer face to the plurality of blind grooves of the first patterned metal circuit layer;
a plurality of blind holes positioned between the graphical metal circuit layer and the insulating medium layer; the blind holes are divided into five types according to the positions in the 6 layers of graphical metal circuit layers:
the first type of blind holes penetrate through and are connected with the first graphical metal circuit layer and the second graphical metal circuit layer;
the second type of blind holes penetrate through and connect the first graphical metal circuit layer to the third graphical metal circuit layer;
the third type of blind holes penetrate through and are connected with the third graphical metal circuit layer and the fourth graphical metal circuit layer;
the fourth type of blind holes penetrate through and connect the fourth graphical metal circuit layer to the sixth graphical metal circuit layer;
the fifth type of blind holes penetrate through and are connected with the fifth graphical metal circuit layer and the sixth graphical metal circuit layer;
wherein, a plurality of first type blind holes or second type blind holes are distributed on the bonding pads or patterns for the outward secondary cascade I/O welding.
Furthermore, the first patterned metal circuit layer comprises a pad or a pattern for external secondary cascade I/O welding at the outermost periphery, a surrounding metal layer at the inner side, and a plurality of groups of chip I/O welding and signal transmission line layers at the inner side of the surrounding metal layer, each group of chip I/O welding and signal transmission line layers is in a rectangular or special-shaped island shape, and each group of chip I/O welding and signal transmission line layers is connected with the surrounding metal layer through an electric insulation area; the surrounding metal layer has an electrical property of a grounding layer and a process property of an airtight welding layer; a coating layer and an upper surface solder mask layer are sequentially arranged on the upper surface of the first patterned metal circuit layer; the coating layer covers the external secondary cascade I/O welding bonding pad or pattern, the surrounding metal layer and each group of chip I/O welding and signal transmission line layer; the upper surface solder mask layer comprises a first surrounding solder mask layer and a plurality of second surrounding solder mask layers, wherein each second surrounding solder mask layer correspondingly surrounds each electric insulation area, and the first surrounding solder mask layer surrounds all the second surrounding solder mask layers;
each group of chip I/O welding and signal transmission line layers comprise chip I/O bonding pads, signal transmission lines and one or more blind slots; the transmission of signals in the circuit layer for I/O welding and signal transmission of each group of chips is completed through chip I/O bonding pads and signal transmission lines in the circuit layer for I/O welding and signal transmission of the group of chips or through corresponding parts in each layer of blind holes and the lower patterned metal circuit layer; the signal transmission between two or more groups of chip I/O welding and signal transmission layers, between a plurality of groups of chip I/O welding and signal transmission layers and the bonding pad or graph for external secondary cascade I/O welding is completed by the corresponding parts in each layer of blind holes and the lower layer of graphical metal circuit layer.
Furthermore, the bottom of the blind slot is a large-area metal grounding layer of a second layer of graphical metal circuit layer and is provided with a coating layer; the blind slot is a chip I/O pad or pattern around the opening of the first patterned metal line layer.
Further, the number and the size of the blind slots are determined according to the number and the size of the mounted chips.
Furthermore, all the blind holes can be aligned or stacked in a staggered manner in the vertical direction, so that the interconnection requirement of any layer in the 6 layers of graphical metal circuit layers can be met; the diameter of each blind hole is the same, the depth-diameter ratio of the blind hole is less than or equal to 1, and solid electrolytic copper is filled in the blind hole.
Further, the process property and the electrical property of the sixth patterned metal circuit layer are large-area metal layers.
The invention also provides a manufacturing method of the six-layer wiring LCP packaging substrate, which is used for manufacturing the LCP packaging substrate and comprises the following steps:
s1, laser drilling blind holes on the double-sided copper-clad LCP substrate to form a third type of blind holes penetrating and connecting the third patterned metal circuit layer and the fourth patterned metal circuit layer;
s2, performing blind hole metallization to form a third type of blind hole filled with solid electroplated copper;
s3, manufacturing a third patterned metal circuit layer and a fourth patterned metal circuit layer on the upper surface and the lower surface of the double-sided copper-clad LCP substrate;
s4, taking the second single-sided copper-clad LCP substrate and the third single-sided copper-clad LCP substrate to respectively manufacture a second patterned metal circuit layer and a fifth patterned metal circuit layer;
s5, taking a first single-sided copper-clad LCP substrate and a fourth single-sided copper-clad LCP substrate, and then carrying out counterpoint lamination and fusion lamination to form an LCP multilayer substrate from top to bottom according to the sequence of the first single-sided copper-clad LCP substrate, the second single-sided copper-clad LCP substrate processed by S4, the double-sided copper-clad LCP substrate processed by S3, the third single-sided copper-clad LCP substrate processed by S4 and the fourth single-sided copper-clad LCP substrate; the copper-clad surfaces of the first single-sided copper-clad LCP substrate and the second single-sided copper-clad LCP substrate are upward, and the copper-clad surfaces of the third single-sided copper-clad LCP substrate and the fourth single-sided copper-clad LCP substrate are downward;
s6, blind holes are drilled on a first single-side copper-clad LCP substrate and a fourth single-side copper-clad LCP substrate of the LCP multilayer substrate through laser, and first blind holes penetrating and connecting the first patterned metal circuit layer and the second patterned metal circuit layer are formed respectively; a second type of blind holes penetrating and connecting the first patterned metal circuit layer to the third patterned metal circuit layer; a fourth type of blind hole penetrating and connecting the fourth patterned metal circuit layer to the sixth patterned metal circuit layer; a fifth type of blind holes penetrating and connecting the fifth patterned metal circuit layer and the sixth patterned metal circuit layer;
s7, carrying out blind hole metallization to form a first blind hole, a second blind hole, a fourth blind hole and a fifth blind hole filled with solid electroplated copper;
s8, manufacturing a first patterned metal circuit layer on the upper surface of the first single-sided copper-clad LCP substrate, and manufacturing a sixth patterned metal circuit layer on the lower surface of the fourth single-sided copper-clad LCP substrate; removing copper in a blind groove slotting region in the first patterned metal circuit layer;
s9, grooving the grooving region of the blind groove by adopting a laser processing means to form a blind groove for mounting the chip, and performing decontamination treatment on the bottom and the side wall of the blind groove;
s10, coating layer manufacturing is carried out on the first layer of graphical metal circuit layer and the bottom of the blind groove, and after an upper surface solder mask layer is manufactured on the corresponding part of the coating layer, the LCP packaging substrate is obtained;
and S11, if the LCP packaging substrate is manufactured in a splicing mode through the steps S1-S10, milling the LCP packaging substrate manufactured in the splicing mode to form a single LCP packaging substrate.
Furthermore, the depth-diameter ratio of the blind hole is less than or equal to 1.
The invention also provides a multi-chip system-in-package structure, comprising: the LCP packaging substrate, the chip, the metal surrounding frame and the metal cover plate are arranged on the substrate;
the multi-chip system-in-package structure is fixed on a PCB motherboard in a conductive adhesive bonding or welding mode, and a bonding pad or a pattern for external secondary cascade I/O welding on the LCP packaging substrate is used as an external secondary cascade I/O interface of the multi-chip system-in-package structure;
metal spacer bars are distributed in the metal surrounding frame; the metal enclosure frame and the metal spacer ribs are welded on the upper surface of the LCP packaging substrate, the external secondary cascade I/O welding pads or patterns are arranged outside the metal enclosure frame, the metal cover plate is welded on the metal enclosure frame and the metal spacer ribs, and a plurality of cavity structures with airtight packaging performance and electromagnetic shielding performance are formed between the LCP packaging substrate and the metal cover plate through the metal enclosure frame and the metal spacer ribs; each cavity structure comprises one or more blind grooves; each blind slot is used for mounting a chip, when the mounted chip has no electromagnetic shielding requirement, the mounted chip is mounted in the same cavity structure, and when the mounted chip has the electromagnetic shielding requirement, the mounted chip is mounted in different cavity structures; the chip is adhered in the blind groove through the conductive adhesive and is electrically interconnected with the chip I/O welding and signal transmission circuit layer in the first patterned metal circuit layer in a gold wire bonding mode.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. the invention utilizes the excellent high-frequency transmission characteristic, extremely low moisture absorption and water permeability and oxygen transmission rate of the Liquid Crystal Polymer (LCP) material to realize the full LCP material system packaging substrate for multi-chip airtight packaging.
2. The packaging substrate can realize the interconnection wiring of any layer of 6 layers of graphic circuits, comprises a plurality of blind grooves for chip installation, is matched with the electromagnetic compatibility and process compatibility design of the circuit on the surface layer of the substrate, and can meet the requirements of multi-chip, high electromagnetic shielding and high-reliability system-level packaging.
3. The six-layer wiring LCP packaging substrate adopts high-melting-point LCP substrate lamination, one-time high-temperature melt lamination and matching with first-order and second-order mixed basic interconnection blind hole structure design to realize 6-layer arbitrary-layer interconnection structure; meanwhile, the use of a bonding film material is eliminated, and a simple, efficient, reliable and low-cost solution is provided for high-density integration.
4. The invention is integrally made of the high-melting-point substrate, has better high-temperature welding resistance and widens the process window used for subsequent welding.
5. The multi-chip system level packaging structure realized by the packaging substrate is fixed on a PCB motherboard in a conductive adhesive bonding or welding mode, and the bonding pad or the graph for external secondary cascade I/O welding positioned at the outermost periphery of the packaging substrate is used as an external secondary cascade I/O interface of the multi-chip system level packaging structure, so that the multi-chip system level packaging structure has good compatibility with the PCB motherboard, is simple to use in packaging, has high assembly efficiency, and can be used for large-size and high-integration-density system level packaging.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of an LCP package substrate according to embodiment 1 of the present invention;
wherein: 1-LCP package substrate; 11-patterning a metal circuit layer; 111-a first patterned metal line layer; 112-a second patterned metal line layer; 113-a third patterned metal wiring layer; 114-a fourth patterned metal line layer; 115-a fifth patterned metal wiring layer; 116-a sixth patterned metal line layer; 12-a blind groove; 13-a coating layer; 14-blind holes; 141-blind holes of the first type; 142-blind holes of the second type; 143-blind holes of the third type; 144-type four blind holes; 145-type five blind holes; 15-insulating dielectric layer; 151-a first single-sided copper-clad LCP substrate; 152-a second single-sided copper-clad LCP substrate; 153-double-sided copper-clad LCP substrates; 154-a third single-sided copper-clad LCP substrate; 155-a fourth single-sided copper-clad LCP substrate; 16-signal transmission paths within the substrate; 17-upper surface solder mask; 1111-external secondary cascade I/O bonding pads or patterns.
FIG. 2 is a schematic structural diagram of a first patterned metal circuit layer according to embodiment 1 of the present invention;
21, 22 and 23-chip I/O welding and signal transmission circuit layers; 211. 221, 231-chip mounting blind slot position; 212. 222, 232-chip I/O bonding pads and signal transmission lines; 213. 223, 233-electrically insulating regions; 171. 172, 173-second circumferential solder mask layer; 24-surrounding metal layer; 174-first surrounding solder mask; 16-signal transmission paths within the substrate; 1111-external secondary cascade I/O bonding pads or patterns.
Fig. 3 is a flow chart of a method for manufacturing an LCP package substrate according to embodiment 2 of the present invention.
Fig. 4a to 4j are schematic structural diagrams of steps in the flow of the LCP package substrate manufacturing method of embodiment 2 of the present invention:
FIG. 4a is a schematic structural diagram of a double-sided copper-clad LCP substrate with laser drilled blind holes to form a third type of blind holes;
FIG. 4b is a schematic structural diagram of blind hole metallization of a third type of blind hole;
FIG. 4c is a schematic structural diagram of the third and fourth patterned metal wiring layers after being fabricated;
FIG. 4d is a schematic structural diagram of an alignment stack for fabricating LCP multi-layer substrates;
FIG. 4e is a schematic representation of the laminated structure for fabricating LCP multilayer substrates;
FIG. 4f is a schematic structural diagram of LCP multi-layer substrate laser drilling blind holes to form a first type blind hole, a second type blind hole, a fourth type blind hole and a fifth type blind hole;
fig. 4g is a schematic structural view of blind hole metallization of the first type, second type, fourth type, and fifth type of blind holes;
FIG. 4h is a schematic structural diagram of the first and sixth patterned metal wiring layers after being fabricated; wherein: 121-blind slot grooved area.
FIG. 4i is a schematic structural diagram after a blind groove is formed;
fig. 4j is a schematic structural diagram of the LCP package substrate obtained after the coating layer and the solder mask layer are manufactured.
Fig. 5 is a schematic diagram of a multi-chip system-in-package structure based on an LCP package substrate according to embodiment 3 of the present invention;
wherein: 1-LCP package substrate; 2-multi-chip system-in-package structure; 3-chip; 4-gold wire; 5-a metal enclosure frame; 51-metal spacer bars; 6-a metal cover plate; 7-a cavity structure; 12-a blind groove; 16-signal transmission path within substrate.
Detailed Description
The features and properties of the present invention are described in further detail below with reference to examples.
Example 1
As shown in fig. 1, the six-layer wiring LCP package substrate of the present embodiment includes:
the metal circuit layer comprises 6 graphical metal circuit layers distributed from the surface to the bottom surface, namely a first graphical metal circuit layer, a second graphical metal circuit layer, a third graphical metal circuit layer, a fourth graphical metal circuit layer, a fifth graphical metal circuit layer and a sixth graphical metal circuit layer in sequence; at least one edge of the outermost periphery of the first patterned metal circuit layer is distributed with bonding pads or patterns for external secondary cascade I/O welding of the LCP packaging substrate;
5 insulating medium layers positioned between the adjacent graphical metal circuit layers; each insulating medium layer is composed of LCP substrates;
the insulating medium layer is positioned between the first patterned metal circuit layer and the second patterned metal circuit layer, and the openings of the insulating medium layer face to the plurality of blind grooves of the first patterned metal circuit layer;
a plurality of blind holes positioned between the graphical metal circuit layer and the insulating medium layer; the blind holes are divided into five types according to the positions in the 6 layers of graphical metal circuit layers:
the first type of blind holes penetrate through and are connected with the first graphical metal circuit layer and the second graphical metal circuit layer;
the second type of blind holes penetrate through and connect the first graphical metal circuit layer to the third graphical metal circuit layer;
the third type of blind holes penetrate through and are connected with the third graphical metal circuit layer and the fourth graphical metal circuit layer;
the fourth type of blind holes penetrate through and connect the fourth graphical metal circuit layer to the sixth graphical metal circuit layer;
the fifth type of blind holes penetrate through and are connected with the fifth graphical metal circuit layer and the sixth graphical metal circuit layer;
wherein, a plurality of first type blind holes or second type blind holes are distributed on the bonding pads or patterns for the outward secondary cascade I/O welding.
1. 6 layers of patterned metal circuit layers:
as shown in fig. 2, the first patterned metal circuit layer 111 includes an outward secondary cascade I/O bonding pad or pattern 1111 at the outermost periphery, an inner surrounding metal layer 24, and a plurality of sets of chip I/O bonding and signal transmission line layers 21, 22, 23 at the inner side of the surrounding metal layer 24, each set of chip I/O bonding and signal transmission line layers 21, 22, 23 is shaped as a rectangular or special island, and each set of chip I/O bonding and signal transmission line layers 21, 22, 23 is connected to the surrounding metal layer 24 through an electrical insulation region 213, 223, 233; the surrounding metal layer 24 is an electrical ground layer and a process layer; the upper surface of the first patterned metal circuit layer 111 is sequentially provided with a coating layer 13 and an upper surface solder mask layer 17; the coating layer 13 covers the external secondary cascade I/O bonding pads or patterns 1111, the surrounding metal layer 24 and each set of chip I/O bonding and signal transmission line layers 21, 22 and 23; the upper surface solder mask layer 17 comprises a first surrounding solder mask layer 174 and a plurality of second surrounding solder mask layers 171, 172, 173, wherein each second surrounding solder mask layer 171, 172, 173 correspondingly surrounds each electrically insulating region 213, 223, 233, and the first surrounding solder mask layer 174 surrounds all the second surrounding solder mask layers 171, 172, 173;
each set of chip I/O bonding and signal transmission line layers 21, 22, 23 includes chip I/O pads and signal transmission lines 212, 222, 223, and one or more blind slots 12; the transmission of signals in each set of circuit layers 21, 22 and 23 for chip I/O soldering and signal transmission is completed through the chip I/O pads and the signal transmission lines 212, 222 and 223 in the set of circuit layers 21, 22 and 23 for chip I/O soldering and signal transmission, or through the corresponding parts of the blind holes 14(141, 142, 143, 144 and 145) and the lower patterned metal circuit layers (the second patterned metal circuit layer 112, the third patterned metal circuit layer 113, the fourth patterned metal circuit layer 114, the fifth patterned metal circuit layer 115 and the sixth patterned metal circuit layer 116); signal transmission between two or more sets of chip I/O bonding and signal transmission layers, and between a plurality of sets of chip I/O bonding and signal transmission layers 21, 22, 23 and the pad or pattern 1111 for external secondary cascade I/O bonding is completed by the blind holes 14(141, 142, 143, 144, 145) of each layer and corresponding portions of the lower patterned metal wiring layer (the second patterned metal wiring layer 112, the third patterned metal wiring layer 113, the fourth patterned metal wiring layer 114, the fifth patterned metal wiring layer 115, and the sixth patterned metal wiring layer 116), as shown by the transmission path 16 in fig. 2.
The second patterned metal circuit layer 112 to the fifth patterned metal circuit layer 115 include a plurality of groups of chip I/O bonding and signal transmission line layers, electrically insulating regions, and surrounding metal layers, which are conventional patterned metal circuit layers, and the specific structures thereof are not described herein again. The process and electrical properties of the 6 th patterned metal line layer 116 are large area metal layers.
2. Blind groove
The bottom of the blind slot 12(211, 221, 231) is a large-area metal grounding layer in the second patterned metal circuit layer 112 and is provided with a coating layer; the blind via 12 is a chip I/O pad or pattern (i.e. a chip I/O pad or pattern in the chip I/O pad and signal transmission line 212, 222, 223) around the opening of the first patterned metal wiring layer 111; the number and size of the blind slots 12 are determined according to the number and size of the mounted chips.
3. Blind hole
All the blind holes 14 in the above five types can be aligned or stacked in staggered arrangement in the vertical direction, so as to meet the interconnection requirement of any layer in the 6-layer patterned metal circuit layer 11. In addition, the diameter of each blind hole 14 is the same, the depth-diameter ratio of the blind hole is less than or equal to 1, and the blind hole 14 is filled with solid electroplated copper. The diameters of the five types of blind holes 14 are the same, on one hand, the subsequent filling of solid electroplated copper can be uniformly manufactured; more importantly, the high-temperature packaging substrate can be uniformly deformed in the later high-temperature assembling process, so that the interconnection reliability of the whole packaging substrate is improved. And the depth-diameter ratio of the blind hole is less than or equal to 1, so that the process of filling the blind hole with solid electroplated copper can be better realized, and the occurrence of the void defect of the electroplated copper is avoided.
Example 2
As shown in fig. 3, the present embodiment provides a method for manufacturing a six-layer wiring LCP package substrate 1 as described in embodiment 1, including the following steps:
s1, as shown in FIG. 4a, laser drilling blind holes on the double-sided copper-clad LCP substrate 153 to form a third type of blind holes 143 penetrating and connecting the third patterned metal circuit layer 113 and the fourth patterned metal circuit layer 114, wherein the depth-diameter ratio of the blind holes is less than or equal to 1;
s2, as shown in FIG. 4b, performing blind hole metallization to form a third type of blind hole 143 filled with solid electroplated copper; before the blind hole metallization, pretreatment such as blind hole decontamination and plasma activation is required; the blind hole metallization is realized by a hole-filling electro-coppering process, and after hole-filling electro-coppering, the copper-plated layer on the surface is thinned to form a third type of blind holes 143 filled with solid electro-coppering;
s3, as shown in fig. 4c, the third patterned metal circuit layer 113 and the fourth patterned metal circuit layer 114 can be fabricated on the upper surface and the lower surface of the double-sided copper-clad LCP substrate by the conventional process flow of printed circuit board pasting → exposure → development → etching;
s4, as shown in fig. 4d, the second patterned metal circuit layer 112 and the fifth patterned metal circuit layer 115 are respectively formed on the second single-sided copper-clad LCP substrate 152 and the third single-sided copper-clad LCP substrate 154 by the same method as that in step S3;
s5, taking a first single-sided copper-clad LCP substrate 151 and a fourth single-sided copper-clad LCP substrate 155, aligning and laminating as shown in fig. 4d from top to bottom according to the sequence of the first single-sided copper-clad LCP substrate 151, a second single-sided copper-clad LCP substrate 152 processed by the S4, a double-sided copper-clad LCP substrate 153 processed by the S3, a third single-sided copper-clad LCP substrate 154 processed by the S4 and the fourth single-sided copper-clad LCP substrate 155, and then melting (under the condition of high temperature and high pressure and vacuum) and laminating to form an LCP multilayer substrate as shown in fig. 4 e; wherein the copper-clad surfaces of the first and second single-sided copper-clad LCP substrates 151 and 152 face up, and the copper-clad surfaces of the third and fourth single-sided copper-clad LCP substrates 154 and 155 face down;
s6, as shown in fig. 4f, laser drilling blind holes on the first single-sided copper-clad LCP substrate 151 and the fourth single-sided copper-clad LCP substrate 155 of the LCP multilayer substrate, and respectively forming the first type of blind holes 141 penetrating and connecting the first patterned metal circuit layer 111 and the second patterned metal circuit layer 112; a second type of blind via 142 passing through and connecting the first patterned metal circuit layer 111 to the third patterned metal circuit layer 113; a fourth type of blind via 144 passing through and connecting the fourth patterned metal wiring layer 114 to the sixth patterned metal wiring layer 116; a fifth type of blind holes 145 penetrating and connecting the fifth patterned metal circuit layer 115 and the sixth patterned metal circuit layer 116, wherein the depth-diameter ratio of the blind holes is less than or equal to 1;
s7, as shown in FIG. 4g, performing blind hole metallization to form a first blind hole 141, a second blind hole 142, a fourth blind hole 144 and a fifth blind hole 145 filled with solid electroplated copper;
s8, as shown in fig. 4h, the same method as that of step S3 may be adopted to manufacture the first patterned metal wiring layer 111 on the upper surface of the first single-sided copper-clad LCP substrate 151 and the sixth patterned metal wiring layer 116 on the lower surface of the fourth single-sided copper-clad LCP substrate 155; removing copper in the blind slot slotting region 121 in the first patterned metal circuit layer 111; the blind slot slotting region 121 is a position determined according to design, the region is a non-metal region, and can be processed by adopting an etching copper process to remove a copper layer in the blind slot slotting region 121 so as to facilitate subsequent laser slotting treatment;
s9, as shown in FIG. 4i, grooving the blind groove region by laser processing means to form a blind groove 12 for mounting the chip, and performing decontamination treatment on the bottom and the side wall of the blind groove 12; in the laser processing means, a laser light source is solid ultraviolet laser or gas carbon dioxide laser;
s10, as shown in fig. 4j, after performing coating layer manufacturing on the first patterned metal circuit layer 111 and the bottom of the blind via 12 and manufacturing the solder mask layer 17 on the upper surface of the corresponding part of the coating layer 13, the LCP package substrate 1 is obtained. The coating layer 13 material includes, but is not limited to, electroplated gold, electroless nickel gold, and electroless nickel palladium gold.
S11, if the LCP package substrate is manufactured in the form of a mosaic through steps S1 to S10, the LCP package substrate manufactured in the mosaic is milled to form a single LCP package substrate 1.
That is, when a single LCP substrate is directly used to manufacture the LCP package substrate through steps S1 to S10, the resulting LCP package substrate 1 is the desired structure; when the LCP package substrate is manufactured through steps S1 to S10 in a form of a mosaic, the resulting LCP package substrate 1 needs to be milled to have a desired structure.
Example 3
As shown in fig. 5, based on the LCP package substrate of embodiments 1-2, this embodiment provides a multi-chip system-in-package structure 2, which includes: the LCP package substrate 1 of embodiments 1-2, as well as the chip 3, the metal enclosure frame 5, and the metal cover plate 6;
the multi-chip system-in-package structure 2 is fixed on a PCB motherboard in a conductive adhesive bonding or welding mode, and a bonding pad or a pattern 1111 for external secondary cascade I/O welding on the LCP package substrate 1 is used as an external secondary cascade I/O interface of the multi-chip system-in-package structure 2;
the metal surrounding frame 5 is distributed with metal spacing ribs 51; the metal enclosure frame 5 and the metal spacer ribs 51 are welded on the upper surface of the LCP package substrate 1, the external secondary cascade I/O welding pads or patterns 1111 are arranged outside the metal enclosure frame 5, the metal cover plate 6 is welded on the metal enclosure frame 5 and the metal spacer ribs 51, a plurality of cavity structures 7 with airtight package performance and electromagnetic shielding performance are formed between the LCP package substrate 1 and the metal cover plate 6 through the metal enclosure frame 5 and the metal spacer ribs 51; each cavity structure 7 comprises one or more blind grooves 12; each blind slot 12 is used for mounting one chip 3, when the mounted chip 3 has no electromagnetic shielding requirement, the mounted chip 3 can be mounted in the same cavity structure 7, and when the mounted chip 3 has the electromagnetic shielding requirement, the mounted chip 3 is mounted in different cavity structures 7; the chip 3 is adhered in the blind groove 12 through conductive glue and is electrically interconnected with the chip I/O welding and signal transmission circuit layers 21, 22 and 23 in the first patterned metal circuit layer 111 in a gold wire 4 bonding mode;
the transmission of signals in each set of circuit layers 21, 22 and 23 for chip I/O soldering and signal transmission is completed through the chip I/O pads and the signal transmission lines 212, 222 and 223 in the set of circuit layers 21, 22 and 23 for chip I/O soldering and signal transmission, or through the corresponding parts of the blind holes 14(141, 142, 143, 144 and 145) and the lower patterned metal circuit layers (the second patterned metal circuit layer 112, the third patterned metal circuit layer 113, the fourth patterned metal circuit layer 114, the fifth patterned metal circuit layer 115 and the sixth patterned metal circuit layer 116); the signal transmission between two or more sets of chip I/O bonding and signal transmission layers 21, 22, 23, and between multiple sets of chip I/O bonding and signal transmission layers 21, 22, 23 and the pad or pattern 1111 for external secondary cascade I/O bonding is completed by the blind holes 14(141, 142, 143, 144, 145) and the corresponding portions of the lower patterned metal circuit layer (the second patterned metal circuit layer 112, the third patterned metal circuit layer 113, the fourth patterned metal circuit layer 114, the fifth patterned metal circuit layer 115, and the sixth patterned metal circuit layer 116), as shown by the transmission path 16 in fig. 5.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (9)
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