CN112310689A

CN112310689A - Interface of curved structure, interface assembly and test socket comprising interface and method for manufacturing interface

Info

Publication number: CN112310689A
Application number: CN202010674034.4A
Authority: CN
Inventors: 李承龙
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-07-15
Filing date: 2020-07-14
Publication date: 2021-02-02
Anticipated expiration: 2040-07-14
Also published as: WO2021010583A1; CN112310689B

Abstract

The invention relates to an interface of a bent structure, an interface assembly and a test socket comprising the interface and a method for manufacturing the interface. An interface for reliably and rapidly testing a test object, an interface assembly and a test socket including the interface, and a method of manufacturing the interface are provided. In the interface, the upper terminal pins are directly connected to the lower terminal pins corresponding thereto via the connection lines, so the interface can achieve reliable testing of a test object, and the interface may be completely free from contaminants accumulated due to repeated testing. Therefore, the interface can contribute to high-speed reliable testing of the test object.

Description

Interface of curved structure, interface assembly and test socket comprising interface and method for manufacturing interface

Cross Reference to Related Applications

This application claims priority from korean patent application No. 10-2019-.

Technical Field

One or more embodiments relate to a test socket, and more particularly, to an interface configured to connect terminal pins of a test object to terminal pins of a test Printed Circuit Board (PCB) when the test object is tested, and a test socket including the same.

Background

In the past few years, electronic products have become small with the diversification of functions and the miniaturization of sizes of semiconductor devices and digital home electric appliances. In addition, reliable and fast testing is also required for electronic products. In particular, reliable and rapid testing is required for semiconductor packages having terminal pins of various structures, such as Quad Flat Pack (QFP), Small Outline Package (SOP), Land Grid Array (LGA) package, and Surface Mount Device (SMD) package. In addition, products mounted with high-performance micro connectors configured to directly connect boards to boards, or to directly connect boards to board connectors (e.g., small display modules and camera modules) have increased dramatically. According to the related art, a semiconductor package or an electronic product including a microconnector is mainly tested by using a test probe.

Disclosure of Invention

One or more embodiments include an interface configured to reliably and quickly test a test object, an interface assembly and a test socket including the interface, and a method of manufacturing the interface.

Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the embodiments presented in this disclosure.

According to one or more embodiments, the interface having a curved structure includes two part interfaces and a connecting body connecting the two part interfaces, wherein each of the two part interfaces includes: an upper contact portion in which upper terminal pins are arranged in a first direction; a lower contact portion in which the lower terminal pin is arranged in the first direction, the lower contact portion being arranged below the upper contact portion; a connection part including connection lines respectively connecting the upper terminal pins to the lower terminal pins respectively corresponding thereto, wherein each of the connection lines is bent twice in the same direction by two bending parts and has an upper line, a side line, and a lower line; and a support band fixing and supporting the upper terminal pins, the lower terminal pins, and the connection line, and exposing at least a portion of each of the upper terminal pins and at least a portion of each of the lower terminal pins, wherein the upper terminal pins are integrally connected to the connection line and the lower terminal pins corresponding to the upper terminal pins, respectively.

According to one or more embodiments, an interface having a curved structure includes: a flexible Printed Circuit Board (PCB) body including an upper layer having a central portion formed with a first opening line in a first direction, a lower layer disposed below the upper layer and having a central portion formed with a second opening line in the first direction, two side layers integrally connecting the upper layer to the lower layer and separated from each other in a second direction perpendicular to the first direction, and an interconnection disposed in the flexible PCB body; an upper contact portion including upper terminal pins arranged in a first direction on both sides of a first opening line on a central portion of the upper layer; and a lower contact portion including lower terminal pins arranged in a first direction at both sides of a second opening line on a central portion of the lower layer, wherein the upper terminal pins are respectively connected to the lower terminal pins corresponding thereto via interconnects, and the upper layer, the lower layer, and the side layers are formed on a vertical cross section perpendicular to the first direction

And (4) shaping.

In accordance with one or more embodiments, an interface assembly comprises: an interface having a curved configuration; and an adapter that holds a structure of the interface and is inserted into an inner space of the interface and coupled to the interface, wherein the interface has any one of the two interface structures.

In accordance with one or more embodiments, a test socket includes: an interface having a curved configuration; an adapter that retains a structure of the interface and is inserted into an inner space of the interface and coupled to the interface; and a guide block having a guide groove at an upper portion thereof for guiding the test object, the interface and the adapter being coupled thereunder, wherein the interface has any one of the two interface structures.

According to one or more embodiments, a method of manufacturing an interface having a curved structure includes: forming an interface pre-substrate including a body portion and a dummy (dummy) portion of an interface; attaching a support band to the main body portion of the mouthpiece; half-etching a portion provided on the interface pre-substrate; removing the dummy portion from the interface pre-substrate; and coupling the adapter to the body portion of the interface and forming the interface by performing two bending operations.

Drawings

The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings in which:

FIG. 1 is a perspective view of an interface having a curved configuration according to one embodiment;

fig. 2A to 2H are plan and side views for illustrating a process of manufacturing an interface having the bent structure of fig. 1;

fig. 3A to 3E are perspective views showing in detail the structure of a bent portion of a connection line in an interface having the bent structure of fig. 1;

FIGS. 4A and 4B are side views of an interface having a curved configuration according to one embodiment;

5A-8C are side and conceptual views of an adapter and an interface assembly in which an interface and adapter are coupled according to one embodiment;

FIGS. 9A-10D are perspective views of an adapter according to one embodiment;

11-15B are plan views of a support band coupled to the mouthpiece of FIG. 1;

fig. 16-17D are perspective views of an interface assembly in which an interface and an adapter are coupled according to one embodiment;

18A-18C are perspective and cross-sectional views of an interface having a curved configuration according to one embodiment;

FIGS. 19A and 19B are perspective and cross-sectional views of a test socket including an interface having a curved configuration according to one embodiment;

FIGS. 20A-20D are perspective, cross-sectional, and enlarged views of a test socket including an interface having a curved configuration according to one embodiment; and

fig. 21A-21C are perspective, cross-sectional, and exploded perspective views of a test socket including an interface having a curved configuration according to one embodiment.

Detailed Description

Reference will now be made in detail to the embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. In this regard, the present embodiments may have different forms and should not be construed as being limited to the description set forth herein. Accordingly, the embodiments are described below to explain aspects of the present specification by referring to the figures only. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. When an expression such as "at least one" precedes or succeeds a list of components, the entire list of components is modified, but individual components in the list are not modified.

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the drawings, like reference numerals refer to like constituent elements, and a repetitive description will not be given.

Fig. 1 is a perspective view of an interface 100 having a curved configuration according to one embodiment.

Referring to fig. 1, the mouthpiece 100 having a bent structure (hereinafter, simply referred to as "mouthpiece") according to the present embodiment may include a first partial mouthpiece 100-1, a second partial mouthpiece 100-2, a connecting body 140, and a support band 150. The first and second part interfaces 100-1 and 100-2 may have a symmetrical structure based on an opening region H0 formed at the center thereof. Therefore, for ease of explanation, only the first partial interface 100-1 will be described.

The first part interface 100-1 may include an upper contact portion 110, a lower contact portion 120, and a connection portion 130. The plurality of upper terminal pins 112 may be arranged in the upper side contact portion 110 in the first direction (x-direction). The lower contact portion 120 may be disposed below the upper side contact portion 110, and the plurality of lower terminal pins 122 may be disposed in the lower side contact portion 120 in the first direction (x-direction). The connection portion 130 may include a plurality of connection lines 132, and the plurality of connection lines 132 may respectively connect the plurality of upper terminal pins 112 with the plurality of lower terminal pins 122 respectively corresponding thereto.

Each of the upper terminal pins 112 may be integrally formed with each of the connection lines 132 and each of the lower terminal pins 122 as a metal line, the connection lines 132 and the upper terminal pins 112 corresponding to the lower terminal pins 122. In other words, the first part interface 100-1 may include a plurality of metal lines, and each metal line may be separately formed by each upper terminal pin 112 corresponding to the upper contact part 110, each lower terminal pin 122 corresponding to the lower contact part 120, and each connection line 132 corresponding to the connection part 130. The upper terminal pin 112, the lower terminal pin 122, and the connection line 132 may be formed of a metal such as beryllium copper alloy or stainless steel (SUS). However, the materials of the upper terminal pins 112, the lower terminal pins 122, and the connection lines 132 are not limited to the above materials. In addition, according to an embodiment, in order to prevent scratches and improve conductivity, the upper terminal pin 112, the lower terminal pin 122, and the connection line 132 may be coated with nickel, metal, or the like.

The end of the upper terminal pin 112 may have a shape in which a central portion thereof is convex, unlike the other portion of the upper terminal pin 112 connected to the connection line 132. Further, the end of the lower terminal pin 122 may have a bent shape protruding downward to have a step difference.

Each connecting line 132 mayCan be bent twice in the same direction with two bent portions 134 to thereby obtain

A shape bending structure. In this case, the amount of the solvent to be used,

the shape-bending structures not being limited to being precise

But can include

All the bent structures with similar shapes. For example,

the shape-curved structure may comprise a curved structure that narrows towards the inlet or a curved structure that widens towards the inlet. Furthermore, it is possible to provide a liquid crystal display device,

the shape-curved structure may have a curved portion that is rounded instead of having a specific angle. In addition to this, the present invention is,

the shape-bending structure may have a shape in which the entire side surface portion connecting the upper portion to the lower portion is rounded.

Based on

In the curved structure, each connection line 132 may include an upper line (refer to 132u of fig. 2H) integrally connected with the upper terminal pin 112, a lower line (refer to 132d of fig. 2H) integrally connected with the lower terminal pin 122, and a lateral line (refer to 132s of fig. 2H) between the two curved portions 134. In addition, the thickness or width of the bent portion 134 may be smaller than that of the remaining portion of the connection line 132.

The connecting body 140 may couple the first portion interface 100-1 and the second portion interface 100-2. The connection body 140 may be disposed on an upper layer of the interface 100, i.e., on a region on which the upper contact portion 110 and the upper line 132u of the connection portion 130 are disposed. In addition, the connection body 140 may have a structure protruding from the first and second part interfaces 100-1 and 100-2 on two paths along the first direction (x direction).

Further, an opening region H0 may be formed in the connecting body 140. As described above, the first and second part interfaces 100-1 and 100-2 may have a symmetrical structure based on the opening region H0. In more detail, the upper terminal pins 112 of the first and second partial interfaces 100-1 and 100-2 may extend in the second direction (y direction) to protrude toward the opening region H0. In addition, since the upper terminal pin 112 of the first partial interface 100-1 and the upper terminal pin 112 of the second partial interface 100-2 may be arranged to be symmetrical based on the opening region H0, the opening line Hl may be formed to extend in the first direction (x-direction) between the upper terminal pin 112 of the first partial interface 100-1 and the upper terminal pin 112 of the second partial interface 100-2.

The connecting body 140 may comprise the same material as the first portion interface 100-1. However, the connecting body 140 may be electrically isolated from the first portion interface 100-1 and the second portion interface 100-2. A coupling hole H1 may be formed in the connecting body 140. The interface 100 may be coupled to the adaptor (refer to 200 of fig. 2F) through the coupling hole H1.

The support band 150 may fix and support the first section interface 100-1, the second section interface 100-2, and the connection body 140, and may keep each of the upper terminal pins 112, each of the lower terminal pins 122, and each of the connection lines 132 separated from each other in the first direction (x-direction). The support band 150 may include an upper support band 150u covering the upper surfaces of the first and second partial interfaces 100-1 and 100-2 and the connecting body 140, and a lower support band 150d covering the lower surfaces of the first and second partial interfaces 100-1 and 100-2 and the connecting body 140.

An open region corresponding to the open region H0 of the coupling body 140 may be formed in the central portion of the support band 150. Accordingly, at least a portion of each upper terminal pin 112 may be exposed from the support tape 150 through the open region.

The interface 100 according to the present embodiment may have each of them has

A structure in which the first part interface 100-1 and the second part interface 100-2 of the shape bending structure are coupled to each other via the connection body 140. Also, the interface 100 according to the present embodiment may have a structure in which the upper terminal pin 112 may be directly connected to the lower terminal pin 122 corresponding thereto via the connection line 132. Therefore, the interface 100 according to the present embodiment can reliably perform a test on a test object, and is not affected at all by a contaminated material or the like deposited by repeating the test. Therefore, the interface 100 according to the present embodiment can contribute to high-speed reliable testing of a test object.

In more detail, the interface 100 according to the present embodiment may be included in a test socket (refer to 1000a of fig. 19A). When a test object is tested by the test socket 1000a, the interface 100 may be inserted only between the test object and a test Printed Circuit Board (PCB) (see 3000 of fig. 19A), and terminal pins of the test object may be connected to the upper terminal pins 112 of the interface 100, while terminal pins of the test PCB 3000 may be connected to the lower terminal pins 122. In addition, the upper terminal pins 112 may be directly connected to the lower terminal pins 122 via the connection lines 132. Therefore, the test socket 1000a including the interface 100 according to the present embodiment can minimize errors due to contact defects. In addition, based on the structure of direct connection, in the test socket 1000a including the interface 100 according to the present embodiment, in addition to disconnection, electrical disconnection due to the intervention of impurities can be prevented.

Fig. 2A to 2H are a plan view and a side view for illustrating a process of manufacturing the interface 100 having the bent structure of fig. 1.

Referring to fig. 2A, an interface pre-substrate 100a may be first formed according to a method of manufacturing the interface 100 having a bending structure of the present embodiment. In fig. 2A, only one interface pre-substrate 100a is shown. However, in practice, a plurality of interface pre-substrates 100a may be arranged in a two-dimensional array. The interface pre-substrate 100a may mainly include an interface body portion and a dummy portion D. The interface body portion may include a first portion interface 100-1a, a second portion interface 100-2a, and a connection body 140. The first and second partial interfaces 100-1a and 100-2a may have a symmetrical structure, and thus only the first partial interface 100-1a will be described. The same applies hereinafter.

The first part interface 100-1a may include an upper contact portion 110, a lower contact portion 120, and a connection portion 130. The upper contact portion 110 may include a plurality of upper terminal pins 112, the lower contact portion 120 may include a plurality of lower terminal pins 122, and the connection portion 130 may include a plurality of connection lines 132. As described above, each upper terminal pin 112 may form one metal line together with each connection line 132 and each lower terminal pin 122 corresponding thereto.

Further, in fig. 2A, the bent portion 134' of the connection line 132 is indicated by a dotted line. Here, the bent portion 134 may not be formed in the connection line 132. Further, according to an embodiment, an additional structure may not be formed at the end 112t of the upper terminal pin 112.

The connecting body 140 may connect the first portion interface 100-1a with the second portion interface 100-2 a. The connection body 140 may be disposed in a central portion of the interface preparation substrate 100a, and may have a structure protruding from the first and second part interfaces 100-1a and 100-2a on two paths along the first direction (x-direction). An opening region H0 may be formed in a central portion of the connecting body 140, and a coupling hole H1 may be formed at an edge of the connecting body 140.

The dummy portion D may include a first dummy portion D1 and a second dummy portion D2. The first dummy portion D1 may extend in the first direction (x direction) and may be connected to the lower terminal pin 122 to support the lower terminal pin 122. The second dummy portion D2 may extend from the connection body 140 in the second direction (y-direction) and may be arranged adjacent to the outermost connection line 132 of the connection portion 130 and the outermost lower terminal pin 122 of the lower contact portion 120. Referring to fig. 2A, two first dummy portions D1 and four second dummy portions D2 may be arranged in the interface pre-fabricated substrate 100 a.

In the interface pre-substrate 100a, metal lines may be respectively formed in the first direction (x direction) by molding. Also, the boundary portion connecting the interface main portion and the dummy portion D to each other may be formed to be thin by molding, so that the dummy portion D may be easily cut. According to one embodiment, the boundary portions of the interface body portion and the dummy portion D may be formed to be thin by half etching instead of molding, and may also be formed to be thin by applying both molding and half etching.

Referring to fig. 2B, a support tape 150 may be attached to the interface preparation substrate 100 a. The support band 150 may include an upper support band 150u covering the upper surface of the interface body portion and a lower support band 150d covering the lower surface of the interface body portion. The support bands 150 may include open areas corresponding to the open areas H0. The lower support band 150d may cover the ends of the upper and lower

terminal pins

112 and 122, and the upper support band 150u may expose the ends.

Referring to fig. 2C, those portions corresponding to the bent portions 134' of the connection lines 132 may be removed from the support bands 150. Removing those portions corresponding to the bent portions 134' from the support bands 150 may be performed for both the upper support band 150u and the lower support band 150 d. However, according to one embodiment, the removal may be performed for only one of the upper and

lower support bands

150u and 150 d.

In addition, the end 122t of the lower terminal pin 122 may be bent to have a step difference before or after removing those portions of the support band 150. The shape of the end portion 122t of the lower terminal pin 122 is shown in an enlarged manner on the right side of fig. 2C. The end portion 122t of the lower terminal pin 122 may be bent to protrude upward, and then after the bending process is performed via the bent portion, the end portion 122t of the lower terminal pin 122 may have a bent structure protruding downward. Such a bent structure of the end portion 122t of the lower terminal pin 122 may enable smooth contact with the terminal pin 3100 of the test PCB 3000. According to one embodiment, the end portion 122t of the lower terminal pin 122 may have a different structure from that shown.

As shown in fig. 2C, at the end 122t of the lower terminal pin 122, the lower support band 150d may be attached only to the lower surface of the end 122t of the lower terminal pin 122, and the upper support band 150u may not be attached to the upper surface of the end 122t of the lower terminal pin 122 to expose the upper surface of the end 122t of the lower terminal pin 122. This is because the upper surface of the end portion 122t of the lower terminal pin 122 may be a portion that is in contact with the terminal pin 3100 of the test PCB 3000. In addition, when the lower surface of the end portion 122t of the lower terminal pin 122 is also exposed, there is a risk of bending or damage in a subsequent process. Therefore, by covering the lower surface of the end portion 122t of the lower terminal pin 122 with the lower support tape 150d, the end portion 122t of the lower terminal pin 122 can be protected and supported.

Referring to fig. 2D, after removing those portions of the support tape 150, portions corresponding to the bent portions 134 may be half-etched to thinly form the bent portions 134. The reason why the bent portion 134 is thinly formed by half etching is that it may be difficult to bend due to repulsive force when the bent portion 134 is not thin, and it may be difficult to maintain a bent shape even after bending.

Further, when the bent portions 134 are half-etched, the end portions 112t of the upper terminal pins 112 may be half-etched together, so that the end portions 112t of the upper terminal pins 112 may have a structure in which the end portions 112t of the upper terminal pins 112 have a convex center. As shown in an enlarged view at the center of fig. 2C, the end 112t of the upper terminal pin 112 may have a convex structure when viewed as a cross section perpendicular to the second direction (y direction). However, the structure of the end portion 112t of the upper terminal pin 112 is not limited to the convex structure.

According to one embodiment, the end portion 112t of the upper terminal pin 112 may be half-etched before the bent portion 134 is half-etched. Also, according to an embodiment, the end portion 112t of the upper terminal pin 112 may not be half-etched, and thus may have substantially the same shape as the rest of the upper terminal pin 112.

Referring to fig. 2E, by removing the dummy portion D from the interface pre-substrate 100a, only the interface body 100E may be left. For example, the interface body 100e may include a first partial interface 100-1e, a second partial interface 100-2e, a connecting body 140, and a support band 150.

Referring to fig. 2F, the adapter 200 may be coupled to the interface body 100F, and the connection wire 132 may be primarily bent in a vertically downward direction by the bent portion 134 adjacent to the upper contact portion 110. The adaptor 200 may have a cross section as shown, which has substantially the same shape as a rectangle, and the coupling protrusion 203 may be formed on an upper surface of the adaptor 200. The adapter 200 and the coupling protrusion 203 may be coupled via the coupling protrusion 203 and the coupling hole H1.

Referring to fig. 2G and 2H, after the primary bending, the connection line 132 may be bent secondarily in a horizontal direction by a bent portion 134 adjacent to the lower contact portion 120. The primary bending and the secondary bending may be performed in the same direction. For example, the first partial interface 100-1E of FIG. 2E may be bent a first time in a counter-clockwise direction to create the state of the first partial interface 100-1F of FIG. 2F, and then may be bent a second time again in a counter-clockwise direction to form the structure of the first partial interface 100-1 as shown in FIG. 2G. In addition, the second partial interface 100-2E of fig. 2E may be primarily bent in the clockwise direction to create the state of the second partial interface 100-2F of fig. 2F, and then may be secondarily bent again in the clockwise direction to form the structure of the second partial interface 100-2 as shown in fig. 2G.

Fig. 2G shows a structure in which the interface 100 and the adapter 200 are coupled to each other, and fig. 2H shows the interface 100 with the adapter 200 removed therefrom. Thus, the structure of the interface 100 may be substantially the same in fig. 2G and 2H. In fig. 2H, each connection line 132 may be divided into an upper line 132u of the upper surface, a side line 132s of the side surface, and a lower line 132d of the lower surface. Further, when the interface 100 forms a test socket, the interface 100 may form the test socket in a state where the interface 100 is coupled to the adapter 200. Therefore, hereinafter, a structure in which the interface 100 and the adapter 200 are coupled to each other is referred to as an "interface assembly".

Fig. 3A to 3E are perspective views illustrating in detail the structure of the bent portion of the connection line 132 in the interface 100 having the bent structure of fig. 1.

Referring to fig. 3A, in the interface 100 according to the present embodiment, since the bent portion 134a may be formed by half-etching the connection line 132, the bent portion 134a may have a groove shape thinner than the remaining portion of the connection line 132. In fig. 3A, the groove shape of the bent portion 134a is shown to have a horizontal lower surface and a side surface perpendicular to the lower surface. However, the groove shape of the bent portion 134a is not limited thereto. For example, the groove of the bent portion 134a may have a shape in which a side surface of the groove is inclined at an obtuse angle with respect to a lower surface thereof or be rounded. In addition, the groove of the bent portion 134a may have a shape in which both the side surface and the lower face are rounded.

Referring to fig. 3B, in the interface 100 according to the present embodiment, although the bent portion 134B may have a groove shape thinner than the rest of the connection line 132 by half etching, the bent portion 134B may include a first penetration portion Hb1 formed by removing at least a part of the bottom of the bent portion 134B.

Referring to fig. 3C, in the interface 100 according to the present embodiment, the bending portion 134C may have a structure including the second penetration portion Hb2, the second penetration portion Hb2 being formed by penetrating a portion of the side surface of the connection line 132 entirely. Since the bent portion 134c includes the second penetration portion Hb2, the width of the bent portion 134c may be smaller than that of the remaining portion of the connection line 132.

Referring to fig. 3D, in the interface 100 according to the present embodiment, the bent portion 134D may have a structure in which a minute groove gm is formed in the connection line 132. The minute grooves gm may be arranged in the width direction of the connection line 132. Since the minute groove gm is formed in the bent portion 134d, the portion of the bent portion 134d on which the minute groove gm is formed may be thinner than the remaining portion of the connection line 132.

Referring to fig. 3E, in the interface 100 according to the present embodiment, the bent portion 134E may have a structure in which the third penetration hole Hb3 is formed in the connection line 132. The third penetration hole Hb3 may be formed at both side surfaces of the connection line 132, and may have a "V" shape when viewed downward. Since the bent portion 134e includes the third penetration portion Hb3, the bent portion 134e may have a smaller width than the remaining portion of the connection line 132.

Five structures of the bent portion have been described. However, the structure of the bent portion is not limited thereto. For example, the bent portion may include various structures by which bending becomes easy and the bent shape can be completely maintained after bending.

Fig. 4A and 4B are side views of an interface 100g having a curved configuration according to one embodiment.

Referring to fig. 4A, an interface 100g according to the present embodiment may be similar to the interface 100 of fig. 1. However, the interface 100g may be different from the interface 100 of fig. 1 in terms of the structure of the end portions 122t1 of the lower terminal pins 122. In detail, in the interface 100g according to the present embodiment, the end portion 122t1 of the lower terminal pin 122 may have a shape in which the end portion 122t1 of the lower terminal pin 122 extends horizontally from the connection line 132 instead of having a bent structure in which the end portion 122t1 of the lower terminal pin 122 protrudes downward to have a step. In the interface 100g according to the present embodiment, the end 112t of the upper terminal pin 112 may have a convex center structure as shown in fig. 2D. However, the present application is not limited thereto, and the end 112t of the upper terminal pin 112 may not have the convex structure.

According to one embodiment, although the lower terminal pins 122 may extend from the connection line 132 in a linear form, all of the lower terminal pins 122 may gradually slope downward from the connection line 132. As described above, when the lower terminal pin 122 has a structure in which the lower terminal pin 122 is gradually inclined downward, the lower terminal pin 122 may then smoothly contact the terminal pin 3100 of the test PCB 3000.

Referring to fig. 4B, the interface 100h according to the present embodiment may be similar to the interface 100 of fig. 3. However, the interface 100h may be different from the interface 100 of fig. 1 in terms of the structure of the end portions 122t2 of the lower terminal pins 122. In detail, in the interface 100h according to the present embodiment, the end portion 122t2 of the lower terminal pin 122 may have a "V" shaped bent structure. When the end 122t1 of the lower terminal pin 122 has a "V" shaped bent structure, the end 122t1 may then smoothly contact the terminal pin 3100 of the test PCB 3000.

Three configurations of the end of the lower terminal pin 122 have been described. However, the structure of the end of the lower terminal pin 122 is not limited thereto. For example, the end of the lower terminal pin 122 may be formed to have various structures to enable smooth contact with the terminal pin 3100 of the test PCB 3000.

Fig. 5A-8C are side and conceptual views of an adapter and an interface assembly in which an interface is coupled with the adapter, according to an embodiment.

Referring to fig. 5A and 5B, the adaptor 200 according to the present embodiment may include a main body 201 and a coupling protrusion 203 formed on an upper surface of the main body 201. The coupling protrusion 203 may be disposed on an area corresponding to the coupling hole H1 of the interface 100.

The body 201 of the adapter 200 may extend in the first direction (x-direction) to correspond to the shape of the interface 100. Also, the cross section of the body 201 is perpendicular to the first direction (x direction), and may have a rectangular shape. However, as shown in fig. 5A, the cross-section of the body 201 may not have an exact rectangular shape, and there may be inclined portions at two vertexes of the lower surface of the body 201. However, according to one embodiment, the cross-section of the body 201 may have a generally rectangular shape. Also, the cross-section of the body 201 may have a rounded apex.

In the adapter 200 according to the present embodiment, the first slot G1 may be formed in the upper surface of the main body 201. The first socket G1 may extend in a first direction (x-direction) in which the upper terminal pins 112 are arranged. The upper buffering member 210 may be filled in the first slot G1. The upper shock-absorbing member 210 may include, for example, a material having elasticity, such as silicon rubber. The first socket G1 may be formed at a region corresponding to a position where the upper terminal pin 112 of the interface 100 is arranged. When the terminal pins of the test object contact the upper terminal pins 112, the first socket G1 and the upper buffer member 210 may provide a buffer action by elasticity, and thus may cause smooth and stable contact.

According to one embodiment, the first slot G1 may be formed only in the upper surface of the body 201, and the upper buffering member 210 may not be filled in the first slot G1. However, due to the first socket G1, the upper terminal pins 112 may move up and down at the first socket G1. Therefore, when the terminal pin of the test object contacts the upper terminal pin 112, the upper terminal pin 112 may directly serve as a buffer by moving up and down at the first socket G1. Therefore, smooth and stable contact can be caused.

Fig. 5B illustrates the structure of the interface assembly 500, wherein the interface 100 is coupled to the adapter 200. The structure of the interface assembly 500 is shown substantially the same as in fig. 2G before the interface 100 is separated from the adapter 200.

Referring to fig. 6A and 6B, the structure of the adapter 200a and the interface assembly 500a according to the present embodiment may be different from the structure of the adapter 200 and the interface assembly 500 in fig. 5A and 5B in that a second slot G2 is further formed in the lower surface of the body 201a of the adapter 200 a. In detail, in the adapter 200a according to the present embodiment, the second slot G2 may be formed in the lower surface of the main body 201 a. The second socket G2 may extend in a first direction (x-direction) in which the terminal pins 122 are arranged. The lower buffer member 220 may be filled in the second slot G2. Lower damping member 220 may also include a material having elasticity, such as silicone rubber. The second socket G2 may be formed at a region corresponding to a position where the lower terminal pin 122 of the interface 100 is arranged. When the terminal pin 3100 of the test PCB 3000 contacts the lower terminal pin 122, the second socket G2 and the lower buffer member 220 may provide a buffer effect by elasticity, and thus, smooth and stable contact may be caused.

According to one embodiment, the second slot G2 may be formed only in the lower surface of the body 201a, and the lower buffer member 220 may not be filled in the second slot G2. In this case, the second slot G2 may also function as a buffer as the first slot G1 described above to enable smooth and stable contact.

Referring to fig. 7A and 7B, the structure of the adapter 200B and the interface assembly 500B according to the present embodiment may be different from the structure of the adapter 200 and the interface assembly 500 of fig. 5A and 5B or the structure of the adapter 200a and the interface assembly 500a of fig. 6A and 6B in that an additional slot may not be formed in the body 201B of the adapter 200B. In detail, in the adaptor 200b according to the present embodiment, the main body 201b may include an elastic material. For example, the body 201b may include silicon rubber. As such, when the body 201b includes an elastic material, a slot or a buffer member for a buffering action may not be required. In other words, when the terminal pin of the test object contacts the upper terminal pin 112, and/or when the terminal pin 3100 of the test PCB 3000 contacts the lower terminal pin 122, the body 201b may directly provide a buffering action to enable smooth and stable contact.

Referring to fig. 8A to 8C, since the first slot G1 may be formed in the upper surface of the main body 201C of the adapter 200C, the structures of the adapter 200C and the interface assembly 500C according to the present embodiment may be similar to those of the adapter 200 and the interface assembly 500 in fig. 5A and 5B. However, the adapter 200c and the interface assembly 500c according to the present embodiment may be different from the adapter 200 and the interface assembly 500 in that a buffer member may not be filled in the first slot G1, and a U-shaped protrusion Pu may be formed at a central portion of the first slot G1. The U-shaped projection Pu may extend in a first direction (x-direction) on which the first slot G1 extends.

As shown in fig. 8B and 8C, the end of the upper terminal pin 112 of the interface 100 may be located on the upper surface of the U-shaped projection Pu. As a result, when the terminal pin of the test object (e.g., the terminal pin of the microconnector 2001) contacts the upper terminal pin 112, the upper terminal pin 112 may be bent by having elasticity as shown by the dotted line, thereby providing a buffer action. Therefore, smooth and stable contact can be caused.

Fig. 9A to 10D are perspective views of

adapters

200D, 200e, 200f, 200g, and 200h according to embodiments. Fig. 9A is a perspective view of an upper portion of the adapter 200D, fig. 9B is a perspective view of a lower portion of the adapter 200D, and fig. 10A to 10D are perspective views of upper portions of the

adapters

200e, 200f, 200g, and 200 h.

Referring to fig. 9A and 9B, the adaptor 200d according to the present embodiment may include a main body 201, a coupling protrusion 203 formed on an upper surface 201t of the main body 201, and a lower buffer member 220 inserted into a lower insertion groove Gd of a lower surface 201B of the main body 201B.

Four coupling protrusions 203 may be formed on the upper surface 201t of the main body 201. However, the number of the coupling protrusions 203 is not limited to four. For example, the coupling protrusions 203 may be arranged on the region corresponding to the coupling holes H1 of the interface 100 corresponding to the number of the coupling holes H1. That is, when the number of the coupling holes H1 of the interface 100 is not four, the coupling protrusions 203 may have different numbers corresponding to the number of the coupling holes H1.

The body 201 of the adaptor 200d may extend in the first direction (x-direction) corresponding to the shape of the interface 100. Also, the cross section of the body 201 is perpendicular to the first direction (x direction), and may have a rectangular shape. Also, as shown in fig. 9B, stoppers 201p extending in the second direction (y direction) and protruding in the third direction (z direction) may be formed at both ends of the lower surface 201B of the main body 201 in the first direction (x direction). As shown in fig. 16B, a part of the connecting portion 130 and the lower contact portion 120 of the mouthpiece 100g may be arranged between the two stoppers 201 p.

The stopper 201p may be formed on the lower surface 201B of the body 201, and thus, when the interface assembly (see 500d of fig. 16B) including the interface 100g is included in the test socket and a test object is tested, it may be prevented that a downward-applied pressure is directly transmitted to the lower terminal pin 122 and a portion of the connection portion 130 connected to the lower terminal pin 122. Therefore, the lower terminal pin 122 and the portion in the connection portion 130 of the interface 100g are not excessively bent and deformed.

A lower insertion groove Gd may be formed in the lower surface 201b of the body 201, and the lower buffer member 220 may be filled in the lower insertion groove Gd. Two lower slots Gd may be formed to correspond to the lower contact portions 120 of the first and second partial interfaces 100-1g and 100-2 g. In addition, two lower cushion members 220 may be arranged to correspond to the two lower insertion grooves Gd. According to one embodiment, lower cushioning member 220 may be omitted.

The lower insertion groove Gd may be formed to extend in the first direction (x-direction), and the lower buffer member 220 may also extend in the first direction (x-direction). For example, the lower damping member 220 may have a cylindrical shape, a pillar shape, or a polygonal prism shape extending in one direction. The lower buffering member 220 may have a length corresponding to a length of the lower insertion groove Gd in the first direction (x-direction), and may have a diameter or width corresponding to a width of the lower insertion groove Gd. Lower damping member 220 may include, for example, a material having elasticity, such as silicone rubber. When the terminal pins of the test PCB 3000 contact the lower terminal pins 122, the lower buffer member 220 may provide a buffer effect based on elasticity, thereby enabling smooth and stable contact.

Referring to fig. 10A, an adapter 200e according to the present embodiment may be different from the adapter 200d of fig. 9A in that an upper slot Guc may be formed in an upper surface 201t of a body 201, and an upper damping member 210 may be disposed in an upper slot Guc. In detail, in the adaptor 200e according to the present embodiment, the upper slot Guc may be formed at a central portion of the upper surface 201t of the main body 201. The two upper slots Guc may be formed to correspond to the upper contact portions 110 of the first and second partial interfaces 100-1g and 100-2 g. In addition, two upper shock-absorbing members 210 may be arranged to correspond to the two upper slots Guc. According to one embodiment, upper cushioning member 210 may be omitted. The structure of upper slot Guc and the shape and material of upper cushioning member 210 may be the same as the structure of lower slot Gd and the shape and material of lower cushioning member 220 described above. The upper buffering member 210 may provide a buffering action based on elasticity when the terminal pin of the test object contacts the upper terminal pin 112, thereby enabling smooth and stable contact.

Referring to fig. 10B, an adapter 200f according to the present embodiment may be different from the adapter 200d of fig. 9A in that two coupling protrusions 203 are formed on an upper surface 201t of a main body 201. In detail, in the adapter 200f according to the present embodiment, the coupling protrusion 203 may be formed only at two vertexes on one path in the second direction (y direction) among the four vertexes on the upper surface 201t of the main body 201. As such, the structure in which the coupling protrusion 203 is formed on one path in the second direction (y direction) may be based on the structure of the interface 100g ', in which, as shown in fig. 17B, the connection portion 130 of the first partial interface 100-1g ' and the connection portion 130 of the second partial interface 100-2g ' have different lengths on the upper surface 201t of the main body 201 such that the position of the upper contact portion 110 is offset in the second direction (y direction). For reference, the structure of the above-described interface 100g 'may be implemented such that, when the test socket is coupled to the microconnector of the test object, the test socket including the interface 100g' may obtain a coupling margin corresponding to the structure of the microconnector of the test object.

Referring to fig. 10C, an adapter 200g according to the present embodiment may be different from the adapter 200d of fig. 9A in that two coupling protrusions 203 may be formed on an upper surface 201t of a main body 201, and an upper buffer member 201 may be disposed in an upper insertion groove Gue. In detail, in the adapter 200g according to the present embodiment, as in the case of the adapter 200f of fig. 10B, two coupling protrusions 203 may be formed on the upper surface 201t of the main body 201. Also, on the upper surface 201t of the main body 201 of the adapter 200g according to the present embodiment, the upper insertion groove Gue may be formed in a region opposite to a region where the two coupling protrusions 203 are formed in the second direction (y direction). In the structure of the interface 100g ', two upper slots Gue may be formed at positions corresponding to the upper contact portions 110 of the first and second partial interfaces 100-1g ' and 100-2g ', wherein the upper contact portions 110 are biased. In addition, the two upper shock-absorbing members 210 may be arranged to correspond to the two upper slots Gue. According to one embodiment, upper cushioning member 210 may be omitted.

Referring to fig. 10D, an adapter 200h according to the present embodiment may be different from the adapter 200e of fig. 10A in that two coupling protrusions 203 are formed on an upper surface 201t of a main body 201, and a partition wall 230 is formed between two upper insertion grooves Guc. In detail, in the adapter 200h according to the present embodiment, two coupling protrusions 203 may be formed on the upper surface 201t of the main body 201. However, unlike the

adapter

200f or 200g of fig. 10B or 10C, the coupling protrusion 203 may not be offset on one path in the second direction (y-direction), but may be arranged in the central portion. According to one embodiment, four coupling protrusions 203 may be formed as in the case of the adapter 200e of fig. 10A.

On the upper surface 201t of the main body 201 of the adapter 200h according to the present embodiment, two upper insertion grooves Guc may be formed in the central portion of the second direction (y-direction), and a plurality of partition walls 230 may be formed between the two upper insertion grooves Guc in the first direction (x-direction). The two upper shock-absorbing members 210 may be arranged to correspond to the two upper slots Guc. According to one embodiment, upper cushioning member 210 may be omitted. As shown in the header assembly 500h of fig. 17D, the partition walls 230 may separate the upper terminal pins 112 of the upper contact portion 110 of the header 100g ″. By using the partition walls 230, the upper terminal pins 112 can be prevented from being bent in the left or right direction to contact each other due to an unintentional force.

In the adapter 200H according to the present embodiment, a receiving groove for receiving the insertion groove Guc and the partition wall 230 may be formed in a central portion of the upper surface 201t of the main body 201. As shown, the depth of the receiving groove Gua may be less than the height of the partition wall 230. However, the depth of the accommodation groove Gua is not limited thereto. Also, according to one embodiment, the receiving groove Gua may be omitted.

Fig. 11 to 15B are plan views of support bands attached to the mouthpiece 100, wherein fig. 11 is a plan view of an upper support band, fig. 12A, 13A, 14A and 15A are plan views of a lower support band, and fig. 12B, 13B, 14B and 15B are plan views illustrating a form in which the support bands are attached to the mouthpiece 100. A description will be given with reference to fig. 1.

Referring to fig. 11, in the interface 100 according to the present embodiment, the support bands 150 may include an upper support band 150u and a lower support band 150 d. As shown in fig. 11, the upper support band 150u may cover the connection part 130 of the first partial interface 100-1, the connection part 130 of the second partial interface 100-2, and the upper surface of the connection body 140. An opening region Huc and a coupling hole H1' may be formed in the upper support band 150u to correspond to the opening region H0 and the coupling hole H1 formed in the connecting body 140. In addition, the opening line Hul may be formed to extend in the first direction (x-direction) in the upper support strap 150u to correspond to the bent portion 134 of the connection portion 130.

Accordingly, the upper support band 150u may expose the bent portions 134 of the connection portions 130 of the first and second partial interfaces 100-1 and 100-2 and may expose the upper and

lower contact portions

110 and 120 of the first and second partial interfaces 100-1 and 100-2.

The upper support band 150u may have a first length L1 in the second direction (y-direction) from a portion corresponding to the connecting body 140. According to one embodiment, the upper support band 150u may extend beyond the first length L1 to cover a portion of the lower contact portion 120.

Referring to fig. 12A and 12B, the lower support band 150d of the mouthpiece 100 according to the present embodiment may have substantially the same structure as the upper support band 150u, but the lower support band 150d has a second length L2 in the second direction (y-direction), the second length L2 being greater than the first length L1. In detail, as shown in fig. 12A and 12B, the lower support band 150d may cover lower surfaces of the first and second partial interfaces 100-1 and 100-2 and the connection body 140. Further, an opening region Hdc and coupling holes H1 ″ may be formed in the lower support band 150d to correspond to the opening region H0 and the coupling holes H1 formed in the connecting body 140. In addition, the opening line Hdl may be formed to extend in the first direction (x-direction) in the lower support strap 150d to correspond to the bent portion 134 of the connection portion 130.

In addition, the lower support band 150d may have a second length L2 in the second direction (y-direction) from a portion corresponding to the connection body 140, the second length L2 being greater than the first length L1 such that lower surfaces of the lower contact portions 120 of the first and second part interfaces 100-1 and 100-2 are covered by the lower support band 150 d. Accordingly, as shown in fig. 12B, although the lower support band 150d may expose the upper contact portion 110 and the bent portion 134 of the connection portion 130 of the first and second partial interfaces 100-1 and 100-2, the lower support band 150d may not expose the contact portion 120 of the first and second partial interfaces 100-1 and 100-2. For reference, fig. 12B is a plan view seen from the lower support belt 150 d.

Referring to fig. 13A and 13B, the lower support band 150d1 of the mouthpiece 100 according to the present embodiment may have substantially the same structure as the lower support band 150d of fig. 12A except that the lower support band 150d1 has a plurality of minute protrusions P1 in the open region Hdc 1. In detail, as shown in fig. 13A, the lower support belt 150d1 may include a plurality of minute protrusions P1, the minute protrusions P1 protruding toward the central portion in the opening region Hdc1 in the second direction (y-direction), and arranged to be spaced apart from each other in the first direction (x-direction). Also, as shown in fig. 13B, the minute protrusions P1 may cover the upper terminal pins 112 corresponding to the upper contact portions 110 of the header 100, respectively. Accordingly, the lower support band 150d1 may expose only the curved portion 134 of the connection portion 130 of the first and second partial interfaces 100-1 and 100-2, and may not expose the upper and

lower contact portions

110 and 120 of the upper and second partial interfaces 100-1 and 100-2. The minute protrusion P1 may support the upper contact portion 110 and may help to reinforce the elastic force of the upper contact portion 110. For reference, fig. 13B is a plan view seen from the upper support band 150 u. In fig. 13B, the lower support tape 150d1 may be exposed between the lower terminal pins 122, and the minute protrusions P1 may be exposed between the upper terminal pins 112.

Referring to fig. 14A and 14B, the lower support band 150d2 of the interface 100 according to the present embodiment may have substantially the same structure as the lower support band 150d of fig. 12A except that the lower support band 150d2 has an integral type protrusion P2 in an opening region Hdc 2. In detail, as shown in fig. 14A, the lower support band 150d2 may include an integral type protrusion P2, which is protruded toward the center in the second direction (y direction) in the opening region Hdc2 and extends in the first direction (x direction) in the opening region P2. Also, as shown in fig. 14B, the one-piece type protrusion P2 may cover all the upper terminal pins 112 corresponding to the upper contact portion 110 of the interface 100. Accordingly, the lower support band 150d2 may expose only the curved portion 134 of the connection portion 130 of the first and second partial interfaces 100-1 and 100-2, and may not expose the upper and

lower contact portions

110 and 120 of the first and second partial interfaces 100-1 and 100-2. The integral type protrusion P2 may support the upper contact portion 110 and may help to reinforce the elastic force of the upper contact portion 110. For reference, fig. 14B is a plan view seen from the upper support band 150 u. In fig. 14B, the lower support tape 150d2 may be exposed between the lower terminal pins 122, and the integrated type protrusion P2 may be exposed between the upper terminal pins 112.

Referring to fig. 15A and 15B, the lower support band 150d3 of the interface 100 according to the present embodiment may have a different structure from the lower support band 150d1 of fig. 13A in that the lower support band 150d3 has first minute protrusions P1 in the opening region Hdc1 and second minute protrusions P2 at both ends in the second direction (y-direction).

In detail, as shown in fig. 15A, the lower support belt 150d3 may include first minute protrusions P1 in the opening region Hdc1 and second minute protrusions P2 at both ends. The first minute projection P1 is the same as the minute projection P1 of the lower support belt 150d1 of fig. 13A.

The second minute protrusions P2 may be arranged at both ends in the second direction (y-direction). The second minute protrusions P2 may be arranged spaced apart from each other in the first direction (x-direction). In addition, since the lower support band 150d3 includes the second minute protrusions P2, the lower support band 150d3 may have a second length L2 in the second direction (y-direction) from a portion corresponding to the connecting body 140, the second length L2 being greater than the first length L1. Accordingly, as shown in fig. 15B, the second minute protrusions P2 may cover the lower surfaces of the lower terminal pins 122 corresponding to the lower contact portions 120 of the header 100, respectively. The second minute protrusion P2 may support the lower contact part 120 and may help to reinforce the elastic force of the lower contact part 120.

Accordingly, the lower support band 150d3 may expose only the curved portion 134 of the connection portion 130 of the first and second partial interfaces 100-1 and 100-2, and may not expose the upper and

lower contact portions

110 and 120 of the first and second partial interfaces 100-1 and 100-2. For reference, fig. 15B is a plan view seen from the upper support band 150 u. In fig. 15B, the first minute protrusions P1 of the lower support tape 150d3 may be exposed between the upper terminal pins 112, and the second minute protrusions P2 may be exposed between the lower terminal pins 122.

Fig. 16A to 17D are perspective views of the

interface assemblies

500D, 500e, 500f, 500g, and 500h, in which the

interfaces

100g, 100g', and 100g ″ and the

adapters

200D, 200e, 200f, 200g, and 200h are coupled to each other according to an embodiment, wherein the adapters correspond to the

adapters

200D, 200e, 200f, 200g, and 200h of fig. 9A to 10D. The aspects described with reference to fig. 9A to 10D will be described briefly or will not be described.

Referring to fig. 16A and 16B, an interface assembly 500d according to the present embodiment may include an interface 100g and the adapter 200d of fig. 9A. Interface 100g may correspond to interface 100g of fig. 4A. However, the interface 100g is not limited to the interface 100g of fig. 4A. The interface 100g may be coupled to the adapter 200d, and the connection body 140 is coupled to the coupling protrusion 203 of the adapter 200d via the coupling hole H1. In fig. 16A and 16B, the support band 150 is omitted and not shown in the mouthpiece 100g for convenience, and the support band 150 is also omitted and not shown in fig. 17A to 17D.

As shown in fig. 16B, the lower contact portion 120 of the interface 100g and a portion of the connection portion 130 (the portion connected to the lower contact portion 120) may be disposed between the stoppers 201P at both ends of the main body 201. In addition, the lower contact portion 120 of the interface 100g may be disposed on the lower buffer member 220, the lower buffer member 220 being disposed on the lower surface of the main body 201. As described above, when the terminal pin of the test PCB 3000 contacts the lower terminal pin 122, the lower buffer member 220 may provide a buffer effect based on elasticity, thereby enabling smooth and stable contact.

Referring to fig. 17A, an interface assembly 500e according to the present embodiment may be different from the interface assembly 500d of fig. 16A in that the interface assembly 500e includes the adapter 200e of fig. 10A. In detail, in the interface assembly 500e according to the present embodiment, the upper contact portion 110 of the interface 100g may be disposed on the upper shock-absorbing member 210 inserted into the upper slot Guc. As described above, when the terminal pin of the test object contacts the upper terminal pin 112, the upper buffer member 210 may provide a buffer effect based on elasticity, thereby enabling smooth and stable contact.

Referring to fig. 17B, an interface assembly 500f according to the present embodiment may be different from the interface assembly 500d of fig. 16A in that the interface assembly 500f includes an interface 100g 'having a structure offset on one path, and the adapter 200f of fig. 10B corresponding to the interface 100 g'. In detail, in the interface 100g ' of the interface module 500f according to the present embodiment, the lengths of the connection portions 130 of the first and second partial interfaces 100-1g ' and 100-2g ' in the second direction (y direction) on the upper surface of the adapter 200f may be different from each other. For example, on the upper surface of the adapter 200f, the connection portion 130 of the first partial interface 100-1g 'may have a length longer than the connection portion 130 of the second partial interface 100-2 g'. Thus, the upper contact portion 110 may be arranged to be biased in the second direction (y-direction) towards the second part interface 100-2 g'.

In the interface assembly 500f according to the present embodiment, the interface 100g' may be coupled to the adapter 200f by providing a structure in which the two coupling protrusions 203 of the adapter 200f are inserted into the two coupling holes H1 of the connecting body 140. The two coupling protrusions 203 may be formed only at the first part interface 100-1 g'.

Referring to fig. 17C, an interface assembly 500g according to the present embodiment may be different from the interface assembly 500f of fig. 17B in that the interface assembly 500g includes the adapter 200g of fig. 10C. In detail, in the interface assembly 500g according to the present embodiment, the upper slot Gue may be formed in the upper surface of the main body 201 of the adaptor 200g, and the upper damping member 210 may be inserted into the upper slot Gue. The upper slot Gue may be biased in a second direction (y-direction) toward the second portion interface 100-2 g'. Accordingly, the upper contact portion 110 of the interface 100g' having the biasing structure may be disposed on the upper buffering member 210.

Referring to fig. 17D, an interface assembly 500h according to the present embodiment may be different from the interface assembly 500e of fig. 17A in that the interface assembly 500h includes the adapter 200h of fig. 10D. In detail, in the interface module 500h according to the present embodiment, two upper insertion grooves Gue may be formed in the central portion of the adapter 200h in the second direction (y-direction), and a partition wall 230 may be formed between the two upper insertion grooves Gue in the first direction (x-direction). Also, the upper terminal pins 112 of the upper contact portion 110 of the header 100g ″ may be disposed between the partition walls 230. The interface 100g ″ may be coupled to the adapter 200H by providing a structure in which the two coupling protrusions 203 of the adapter 200H are inserted into the two coupling holes H1 formed in the central portion of the connecting body 140.

Fig. 18A to 18C are a perspective view and a cross-sectional view of an interface 100-F having a bent structure according to an embodiment, in which fig. 18A is a perspective view of an upper surface, fig. 18B is a perspective view of a lower surface, and fig. 18C is a cross-sectional view of a region taken along a line I-I' of fig. 18A.

Referring to fig. 18A to 18C, the interface 100-F according to the present embodiment may include a flexible pcb (fpcb) body 101, an upper contact portion 110, and a lower contact portion 120.

The FPCB body 101 may include a flexible insulating material. For example, the FPCB body 101 may include an insulating plastic such as Polyimide (PI), Polyester (PET), Glass Epoxy (GE), and the like. The plurality of interconnects 135 may be disposed in the FPCB body 101. According to one embodiment, the interconnection 135 may be disposed on an upper surface or a lower surface of the FPCB body 101, instead of being disposed in the FPCB body 101.

The FPCB body 101 may include an upper layer 101u, a lower layer 101d, and a side layer 101 s. As shown in fig. 18C, the FPCB body 101 may have a rectangular ring shape when viewed from a side surface. The opening region Huc may be formed on a central portion of the upper layer 101u, and two upper protrusions Pu3 protruding toward the central portion in the second direction (y-direction) may be formed in the opening region Huc. In addition, the two upper protrusions Pu3 may be spaced apart from each other with a line of openings extending in the first direction (x-direction). The lower layer 101d may not include an opening region, and may include only two lower protrusions Pl3 protruding toward the central portion in the second direction (y-direction). The two lower protrusions Pl3 may be spaced apart from each other with an opening line Hdl extending in the first direction (x-direction). The lower layer 101d may be shorter than the upper layer 101u in the first direction (x direction). However, according to one embodiment, the lower layer 101d may have substantially the same length along the first direction (x-direction) as the upper layer 101 u. For reference, it can be understood in fig. 18A: the upper layer 101u may be longer than the lower layer 101d in the first direction (x direction) so that the connection hole H1 may be formed in the upper layer 101 u. Via coupling hole H1, an adapter may be coupled to the interface 100-F. The side layer 101s may correspond to a layer connecting the upper layer 101u and the lower layer 101 d.

The plurality of upper terminal pins 112 included in the upper contact portion 110 may be arranged on the upper protrusion Pu3 in the first direction (x-direction). Also, a plurality of lower terminal pins 122 included in the lower contact portion 120 may be arranged on the lower protrusion Pl3 in the first direction (x-direction). As shown in fig. 18C, the upper terminal pins 112 may be respectively coupled to the interconnections 135 corresponding thereto via the contact through holes 115, and the lower terminal pins 122 may be respectively coupled to the interconnections 135 corresponding thereto via the contact through holes 125. Accordingly, the upper terminal pins 112 may be connected to the lower terminal pins corresponding thereto via the

contact vias

115, 125 and the interconnector 135, respectively.

The interface 100-F according to the present embodiment may have substantially the same function or function as the interface 100 of fig. 1. That is, the interface 100-F according to the present embodiment can minimize an error due to a contact defect because in the interface 100-F, the upper terminal pins 112 can be directly connected to the lower terminal pins 122 corresponding thereto via the

contact vias

115 and 125 and the interconnection 135, respectively. Further, based on such a direct connection structure, there is no risk of power failure due to the intervention of impurities except in the case of disconnection.

Fig. 19A and 19B are a perspective view and a cross-sectional view of a test socket 1000a including an interface 100 having a bent structure according to an embodiment, where 19B is a cross-sectional view of a region taken along line II-II' of fig. 19A.

Referring to fig. 19A and 19B, the test socket 1000a according to the present embodiment may include an interface 100, an adapter 200a, and a boot block 300 a. The test socket 1000a according to the present embodiment may be, for example, a test socket configured to test an electronic product including a microconnector. However, the test object of the test socket 1000a according to the present embodiment is not limited to the electronic product including the microconnector.

The interface 100 may include any one of the

interfaces

100, 100g, and 100h of fig. 1, 4A, and 4B. However, the interface 100 of the test socket 1000a according to the present embodiment is not limited to the above-described

interfaces

100, 100g, and 100 h. For example, the interface 100g included in the

interface assembly

500f or 500h of fig. 17B or 17D may also be used.

The adapter 200a may comprise the adapter 200a of fig. 6A. However, the adapter 200a is not limited to the adapter 200a of fig. 6A. For example, adapter 200A may comprise

adapters

200, 200B, 200C, 200D, 200e, 200f, 200g, or 200h of fig. 5A, 7A, 8A, 9A, 10B, 10C, or 10D.

The guide block 300a may include a lower guide block 320 and an upper guide block 340. The guide block 300a is not limited to the illustrated structure, but may include various structures. In addition, according to an embodiment, the guide block 300a may have a structure of one guide block in a single body, instead of a structure of two guide blocks coupled.

The lower guide block 320 may support and protect the interface 100 disposed in the lower guide block 320. For example, an interface assembly in which the interface 100 and the adapter 200a are coupled may be disposed in a central portion of the lower guide block 320. The lower guide block 320 may be coupled to the upper guide block 340 such that the interface assembly may be coupled to the guide block 300 a.

The upper guide block 340 may be disposed above the lower guide block 320, may include a test hole Ht at the center thereof, and may include a guide groove Gg1 for guiding the test object around the test hole Ht. The test hole Ht may be formed in the central portion of the upper guide block 340 in the form of a line in the first direction (x-direction). The position of the test hole Ht may correspond to the position of the upper contact portion 110 of the interface 100. Therefore, as shown in fig. 19A, the upper terminal pins 112 of the upper contact portion 110 may be exposed through the test holes Ht.

The guide block 300a may be coupled to the test PCB 3000. When the lead block 300a is coupled to the test PCB 3000, the lower terminal pins 122 of the interface 100 may be coupled to the terminal pins of the test PCB 3000.

Fig. 20A to 20D are a perspective view, a cross-sectional view, and an enlarged view of a test socket 1000B including an interface 100 having a bent structure according to an embodiment, wherein fig. 20B is a cross-sectional view of a region taken along a line III-III' of fig. 20A, fig. 20C is an enlarged view of a region a of fig. 20A, and fig. 20D is an enlarged view of a region B of fig. 20B.

Referring to fig. 20A to 20D, a test socket 1000b according to the present embodiment may be different from the test socket 1000A of fig. 19A in that the test socket 1000b may further include a first microconnector 400. In detail, the test socket 1000b according to the present embodiment may include an interface 100, an adaptor 200a, a guide block 300b, and a first microconnector 400. The interface 100 and adapter 200a may be the same as those described above with reference to fig. 19A and 19B.

The lead block 300b may be similar to the lead block 300a of the test socket 1000a of fig. 19A. That is, the guide block 300b may include a lower guide block 320 and an upper guide block 340a, wherein the interface assembly may be coupled in the lower guide block 320. However, the lower test hole Ht' may be defined by a side protrusion Ps formed in the test hole Ht of the upper guide block 340 a. The side protrusions Ps may prevent the first microconnector 400 from being removed from the test socket 1000 b.

The first microconnector 400 may be disposed on the interface 100. For example, the first microconnector 400 may be disposed on the interface 100 by providing a structure in which the terminal pins 403 are connected to the upper terminal pins 112 of the interface 100. The first microconnector 400 may be movable on the interface 100. In other words, the first microconnector 400 may not be fixed to the interface 100 by means of soldering or the like. Instead, the first microconnector 400 may simply be placed on the interface 100. Therefore, when the first microconnector 400 is coupled to a second microconnector of an electronic product that is a test object, the first microconnector 400 may freely move. Accordingly, the first microconnector 400 and the second microconnector may be stably and accurately coupled to each other, and the terminal pins 403 of the first microconnector 400 and the terminal pins of the second microconnector may be prevented from being damaged.

With respect to the movement of the first microconnector 400, the horizontal cross-sectional area of the lower test hole Ht' of the upper guide block 340a may be greater than that of the first microconnector 400. Here, the horizontal cross-sectional area may be defined on a plane based on the first direction (x-direction) and the second direction (y-direction). In addition, for convenience of comparison, the horizontal cross-sectional areas of the lower test well Ht' and the first microconnector 400 may be defined based on a rectangle. For example, as shown in fig. 20C, in the case of the lower test well Ht', the horizontal cross-sectional area may include a dotted line portion instead of the bent portion. Further, in the case of the first microconnector 400, the horizontal cross-sectional area may exclude lead portions of the terminal pins 403, which protrude from both sides of the lower surface of the first microconnector 400 in the second direction (y-direction). That is, the horizontal cross-sectional area may be defined based on a side surface of the body 401 of the first microconnector 400.

As shown in fig. 20C and 20D, the lower test well Ht' may be larger than the first microconnector 400 in both the first direction (x-direction) and the second direction (y-direction). For example, when it is assumed that the first microconnector 400 is located at the center of the lower test well Ht ', the lower test well Ht' may be larger than the first microconnector 400 by two times the first distance Wx in the first direction (x-direction) and larger than the first microconnector 400 by two times the second distance Wy in the second direction (y-direction).

As described above, the first microconnector 400 may not be fixed on the interface 100 and may move on the interface 100. However, the moving range of the first microconnector 400 may be defined within the range of the horizontal cross-sectional area of the lower test well Ht'. Accordingly, the first microconnector 400 may move within a range of twice the first distance Wx in the first direction (x-direction) for the lower test well Ht', as indicated by an arrow M2. Also, the first microconnector 400 may be moved within a range of twice the second distance Wy in the second direction (y direction) for the lower test well Ht', as indicated by an arrow M1.

For reference, an electronic product as a test object may include, for example, a small display module and a camera module mounted with a micro connector. However, the electronic product as the test object is not limited thereto. For example, the electronic product as a test object may include all types of electronic devices in which the microconnector is mounted. In the test socket 1000b according to the present embodiment, the first microconnector 400 having a male connector structure is disposed on the interface 100. However, the embodiments are not limited thereto. A first microconnector 400 having a female connector structure may also be disposed on the interface 100. In addition, when the first microconnector 400 has a male connector structure, an electronic product as a test object may include a microconnector having a female connector structure. In contrast, when the first microconnector 400 has a female connector structure, the electronic product may include a microconnector having a male connector structure.

Fig. 21A to 21C are a perspective view, a cross-sectional view, and an exploded perspective view of a test socket 1000C including an interface 100-F having a bent structure according to an embodiment, wherein fig. 21B is a cross-sectional view of a region taken along a line IV-IV' of fig. 21A.

Referring to fig. 21A to 21C, the test socket 1000C according to the present embodiment may include an interface 100-F, an adapter 200i, and a boot block 300C.

Interface 100-F may correspond to interface 100-F of FIG. 18A. Accordingly, the interface 100-F may have a structure in which the upper terminal pin 112 and the lower terminal pin 122 are disposed on the FPCB body 101.

The adapter 200i may be coupled to the interface 100-F, and the

buffer members

210 and 220 may be filled in the insertion grooves formed on the upper and lower surfaces thereof, similar to the adapter 200a of fig. 6A. The

buffer members

210 and 220 may be disposed on regions corresponding to the positions of the upper and

lower contact portions

110 and 120 of the interface 100-F. According to one embodiment, only slots may be formed in the adapter 200i, and additional cushioning members may not be filled in the slots. The adapter 200i can be coupled into the coupling hole H1 of the interface 100-F via the coupling protrusion 203. The interface 100-F and the adapter 200i may be included in an interface assembly.

A coupling groove Gj may be formed below the guide block 300c, and a guide groove Gg2 may be formed above the guide block 300 c. The interface assembly may be inserted into and coupled to the coupling groove Gj. The guide groove Gg2 may guide the test object when the test object is subjected to a test. A support layer Ls1 may be included on the bottom of the guide groove Gg 2. The support layer Ls1 may support the test object when the test object is tested. The coupling hole Ht2 may be formed in a central portion of the support layer Ls 1. A test object (e.g., a microconnector of an electronic product that includes the microconnector) may be coupled to the interface 100-F via a coupling hole Ht 2. That is, the terminal pins of the microconnector may contact the upper terminal pins 112 of the interface 100 via the coupling holes Ht 2.

The guide block 300c may be coupled to the test PCB 3000. When the lead block 300c is coupled to the test PCB 3000, the lower terminal pins 122 of the interface 100 may be coupled to the terminal pins 3100 of the test PCB 3000.

According to the present disclosure, in the interface having the bending structure and the test socket including the interface, the upper terminal pin is directly connected to the lower terminal pin corresponding thereto via the connection line, so the interface having the bending structure and the test socket including the interface can achieve reliable testing of a test object, and the interface having the bending structure and the test socket including the interface can be completely free from contaminated materials accumulated by repeated testing. Accordingly, the interface having the bent structure and the test socket including the interface according to the present disclosure may contribute to a high-speed reliable test of a test object.

It is to be understood that the embodiments described herein are to be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects in each embodiment should generally be considered as available for other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure as defined by the following claims.

Claims

1. An interface having a curved configuration, the interface comprising:

two part interfaces and a connecting body connecting the two part interfaces, wherein each of the two part interfaces comprises:

an upper contact portion in which upper terminal pins are arranged in a first direction;

a lower contact portion in which a lower terminal pin is arranged in the first direction, the lower contact portion being arranged below the upper contact portion;

a connection part including connection lines respectively connecting the upper terminal pins to the lower terminal pins respectively corresponding thereto, wherein each of the connection lines is bent twice in the same direction by two bending parts, and has an upper line, a lateral line, and a lower line; and

a support strap fixing and supporting the upper terminal pins, the lower terminal pins, and the connection wire and exposing at least a portion of each upper terminal pin and at least a portion of each lower terminal pin,

wherein the upper terminal pins are integrally connected to the connection line and the lower terminal pins corresponding to the upper terminal pins, respectively.

2. The interface with a bent structure according to claim 1, wherein each lower terminal pin has a protrusion protruding in a downward direction from an end of the lower terminal pin.

3. The interface with a flexure structure of claim 1, wherein the flexure portion includes any one of:

a first structure in which the bent portion is thinner than the rest of the connection line;

a second structure in which a width of the bent portion in the first direction is smaller than a width of the remaining portion of the connection line;

a third structure in which the bent portion is thinner than the remaining portion of the connection line and has a width in the first direction smaller than the width of the remaining portion of the connection line;

a fourth structure in which minute grooves are formed in the connection line in the first direction, an

A fifth structure in which V-shaped penetration holes are formed on both sides of the connection line in the first direction.

4. The interface with a curved structure of claim 1, wherein the support band includes an upper support band covering the two part interfaces and an upper surface of the connecting body and a lower support band covering the two part interfaces and a lower surface of the connecting body,

each of the upper support band or the upper support band and the lower support band having an opening line extending in a first direction to correspond to the curved portion,

the upper support tape exposes upper surfaces of the upper terminal pins and the lower terminal pins, and

the lower support tape covers lower surfaces of the upper terminal pins and the lower terminal pins.

5. The interface with a curved structure of claim 4, wherein the upper support band and the lower support band each comprise: a central portion corresponding to the upper contact portion and the connecting body; and two extending portions extending in two directions from the central portion,

the upper support tape includes a first open region having a rectangular shape in the central portion to expose an upper surface of the upper terminal pin, and

the lower support band includes a second open region corresponding to the first open region at the central portion, wherein the lower support band further includes: an integral type protrusion portion protruding toward a center in the second opening area and covering an entire lower surface of the upper terminal pin; or minute protrusions protruding toward the center in the second open area and covering the lower surfaces of the upper terminal pins, respectively, and being spaced apart from each other.

6. The interface with a bent structure according to claim 5, wherein an end of the extension of the lower support band completely covers a lower surface of the lower terminal pin or separately covers the lower surface of the lower terminal pin.

7. An interface having a curved configuration, the interface comprising:

a flexible Printed Circuit Board (PCB) body including an upper layer having a central portion formed with a first opening line in a first direction, a lower layer disposed below the upper layer and having a central portion formed with a second opening line in the first direction, two side layers integrally connecting the upper layer to the lower layer and separated from each other in a second direction perpendicular to the first direction, and an interconnection disposed in the flexible PCB body;

an upper contact portion including upper terminal pins arranged in a first direction on both sides of a first opening line on a central portion of the upper layer; and

a lower contact portion including lower terminal pins arranged in a first direction on both sides of a second opening line on a central portion of the lower layer,

wherein the upper terminal pins are respectively connected to the lower terminal pins corresponding thereto via the interconnections, and

the upper layer, the lower layer and the side layers are formed on a vertical cross section perpendicular to the first direction

And (4) shaping.

8. The interface with the bent structure according to claim 7, wherein each of the upper terminal pin and the lower terminal pin is connected to its corresponding interconnection via a through via, respectively.

9. An interface assembly, comprising:

the interface with a curved structure of claim 1 or 7; and

an adapter that maintains the bent structure of the interface, is inserted into the inner space of the interface, and is coupled to the interface.

10. The interface assembly of claim 9, wherein the adapter has any one of:

a first structure in which a first slot is formed in a region corresponding to the upper terminal pin;

a second structure in which a first slot is formed in a region corresponding to the upper terminal pin and a second slot is formed in a region corresponding to the lower terminal pin;

a third structure in which a first slot is formed in a region corresponding to the upper terminal pin, and a U-shaped protrusion supporting an end of the upper terminal pin is formed in a central portion of the first slot; and

a fourth structure in which stoppers extending in the second direction and protruding downward are formed on both end portions of the lower surface of the adapter in the first direction, and first slots extending in the first direction are formed in pairs in regions of the lower surface of the adapter corresponding to the lower terminal pins.

11. The interface assembly of claim 10, wherein the adapter has a fourth configuration and further comprises two second slots extending in the first direction on an upper surface of the adapter, or further comprises the two second slots and a partition wall between the two second slots,

the lower terminal pin is disposed between the stoppers, and

the first slot and the second slot are filled with elastic buffer members.

12. The interface assembly of claim 9, wherein the adapter comprises an elastomeric material.

13. A test socket, comprising:

the interface with a curved structure of claim 1 or 7;

an adapter that holds the bent structure of the header, is inserted into the inner space of the header, and is coupled to the header; and

a guide block having a guide groove at an upper portion thereof for guiding a test object, and the interface and the adapter are coupled thereunder.

14. The test socket of claim 13, wherein the adapter has any one of:

a fourth structure in which stoppers extending in the second direction and protruding downward are formed on both ends of the lower surface of the adapter in the first direction, and a first slot extending in the first direction is formed in a region of the lower surface of the adapter corresponding to the lower terminal pin.

15. The test socket of claim 13, wherein the adapter includes a buffer member formed on at least one of a region corresponding to the upper terminal pin and a region corresponding to the lower terminal pin.

16. The test socket of claim 13, wherein the support strip comprises: an upper support band covering the two partial interfaces and an upper surface of the connecting body; and a lower support band covering the two partial interfaces and the lower surface of the coupling body,

17. The test socket of claim 13, further comprising a first microconnector disposed on the interface through a first through-hole formed in a central portion of the guide block, the first microconnector being electrically connected to and movable on the interface,

wherein the first micro-connector has a male connector structure or a female connector structure to correspond to a female connector structure or a male connector structure of a second micro-connector of a test object, and

the first microconnector is movable on the interface when the first and second microconnectors are coupled.

18. A method of manufacturing a header having a curved structure, the method comprising:

forming an interface pre-substrate including a body portion and a dummy portion of the interface;

attaching a support strap to the main body portion of the mouthpiece;

half-etching a portion provided on the interface pre-substrate;

removing a dummy portion from the interface pre-substrate; and

an adapter is coupled to a body portion of the interface and the interface is formed by performing two bending operations.

19. The method of claim 18, wherein the body portion of the interface comprises:

a first partial interface including an upper contact portion, a lower contact portion, and a connection portion, wherein the upper contact portion includes upper terminal pins arranged in a first direction, the lower contact portion includes lower terminal pins arranged in the first direction, and the connection portion includes connection lines respectively connecting the upper terminal pins to the lower terminal pins respectively corresponding thereto in a second direction perpendicular to the first direction, wherein each connection line includes two bent portions;

a second part interface having the same structure as the first part interface and arranged symmetrically to the first part interface; and

a connection body having a structure protruding from the first part interface and the second part interface on two paths in the first direction and connecting the first part interface and the second part interface, and

the dummy portion includes:

two first dummy portions connected to the lower terminal pins to support the lower terminal pins and extending in a first direction; and

four second dummy portions arranged adjacent to the outermost connection line of the connection portion and the outermost lower terminal pin of the lower contact portion and extending from the connection body in a second direction.

20. The method of claim 19, wherein half etching comprises

Half-etching the bent portion, and

removing a portion of the support tape corresponding to the bent portion before half-etching the bent portion.