CN112255888A - Feeding and discharging method of electron beam exposure machine - Google Patents
Feeding and discharging method of electron beam exposure machine Download PDFInfo
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- CN112255888A CN112255888A CN202011137388.1A CN202011137388A CN112255888A CN 112255888 A CN112255888 A CN 112255888A CN 202011137388 A CN202011137388 A CN 202011137388A CN 112255888 A CN112255888 A CN 112255888A
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- cavity
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- discharging
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- small cavity
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electron Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention provides a feeding and discharging method of an electron beam exposure machine, which can furthest excavate the capacity of the exposure machine, and use the atmospheric/vacuum conversion time of the electron beam exposure machine due to feeding and discharging on effective exposure output, thereby improving the production efficiency of the exposure machine and reducing the cost of products. The mask plate exposure device comprises a feeding and discharging atmosphere/vacuum conversion cavity and a process cavity, wherein the process cavity is an exposure processing area of an electron beam exposure machine on a mask plate, an isolation valve structure is arranged between the feeding and discharging atmosphere/vacuum conversion cavity and the process cavity, a first small cavity and a second small cavity are arranged in the feeding and discharging/vacuum conversion cavity, the first small cavity and the second small cavity are independent cavities which are arranged from top to bottom, the first small cavity and the second small cavity are combined to form an integral shell structure, and a servo driving device is connected in the height direction of the integral shell structure.
Description
Technical Field
The invention relates to the technical field of mask plate making, in particular to a feeding and discharging method of an electron beam exposure machine.
Background
Semiconductor integrated circuit fabrication processes have entered the 14-16 nanometer volume production stage, thus requiring more advanced photolithography techniques to etch finer line widths and more complex patterns. In the photolithography process, a template is required to transfer and copy a pattern, and the template is called a photomask (also called a photomask, and hereinafter referred to as a mask). The mask plate is manufactured by a tie connection design company and a wafer garden, and maskless photoetching cannot be realized in the photoetching process of the wafer factory at present, so the mask plate is a key ring in the manufacturing of integrated circuits.
The mask substrate is mainly manufactured by exposure, PEB, development, baking, etching, photoresist removal, detection, film pasting and the like, the most important process for manufacturing the mask is the exposure process, and the precision of one exposure machine directly influences the grade of a product. The exposure machine is very expensive, so that the production cost of the product can be reduced by effectively and fully utilizing the capacity of the exposure machine.
Disclosure of Invention
In view of the above problems, the present invention provides a method for loading and unloading an electron beam exposure machine, which maximally excavates the productivity of the exposure machine, and uses the atmospheric/vacuum conversion time of the electron beam exposure machine due to loading and unloading on effective exposure output, thereby improving the production efficiency of the exposure machine and reducing the product cost.
A feeding and discharging method of an electron beam exposure machine is characterized in that: the mask plate exposure device comprises a feeding and discharging atmosphere/vacuum conversion cavity and a process cavity, wherein the process cavity is an exposure processing area of an electron beam exposure machine for a mask plate, an isolation valve structure is arranged between the feeding and discharging atmosphere/vacuum conversion cavity and the process cavity, a first small cavity and a second small cavity are arranged in the feeding and discharging/vacuum conversion cavity, the first small cavity and the second small cavity are independent cavities which are arranged up and down, the first small cavity and the second small cavity are combined to form an integral shell structure, the height direction of the integral shell structure is connected with a servo driving device, the servo driving device drives the integral shell structure to ascend or descend, so that the height of at least one of the first small cavity and the second small cavity is arranged opposite to the height of the process cavity, independent vacuum pumping air pipes are arranged on the peripheral inner walls of the feeding and discharging atmosphere/vacuum conversion cavity, A nitrogen gas charging pipe, when the mask corresponding to the first small cavity is exposed, the corresponding mask is pulled back to the first small cavity from the process cavity by an external push-pull rod, then the small cavity 2 is quickly lifted to the height of the process cavity through a servo driving device, the external push-pull rod pushes the other unexposed mask plate into the process cavity, then closing an isolating valve between the process cavity and the feeding and discharging atmosphere/vacuum conversion cavity, inflating the feeding and discharging atmosphere/vacuum conversion cavity by a nitrogen inflation pipe on the feeding and discharging atmosphere/vacuum conversion cavity to return the feeding and discharging atmosphere/vacuum conversion cavity to the atmosphere state from the vacuum state, taking out the exposed mask in the first small cavity, placing another unexposed mask in the first small cavity, and vacuumizing an air pipe on the wall of the feeding and discharging air/vacuum conversion cavity to start vacuumizing; in the process of performing atmosphere/vacuum conversion on the mask plate by the feeding and discharging atmosphere/vacuum conversion cavity, the mask plate which is already in a vacuum state is exposed by the process cavity, so that the waiting time of the exposure machine for vacuumizing is saved.
It is further characterized in that:
the small cavity is at the same height with the push-pull rod and the process cavity in the feeding and blanking process, and the height position of the small cavity is accurately and quickly controlled by a servo driving device and a corresponding positioning sensor;
the first small cavity and the second small cavity which are vertically arranged in the integral shell structure respectively and independently bear the corresponding mask clamp, and the mask clamp freely slides relative to the front and back positions of the small cavities, so that the mask plate is smoothly taken and placed;
the nitrogen gas inflation pipe returns the vibration amplitude of the feeding and discharging atmosphere/vacuum conversion cavity from vacuum to atmospheric state within the exposure allowable range;
two mask plate clamps are placed simultaneously to enter a first small cavity and a second small cavity respectively during first feeding;
in the exposure process of the electron beam exposure machine, the feeding and discharging atmosphere/vacuum conversion cavity carries out the operations of reducing the atmosphere environment, taking and placing the mask and vacuumizing.
After the invention is adopted, in the exposure process of the electron beam exposure machine, the feeding and discharging atmosphere/vacuum conversion cavity carries out the operations of reducing the atmosphere, taking and placing the mask plate and vacuumizing, the production capacity of the exposure machine is excavated to the maximum extent, the feeding and discharging atmosphere/vacuum conversion time of the electron beam exposure machine is used for effective exposure output, the production efficiency of the exposure machine is improved, and the product cost is reduced.
Drawings
FIG. 1 is a schematic diagram of the structure of a charging and discharging atmosphere/vacuum conversion chamber according to the present invention;
the names corresponding to the sequence numbers in the figure are as follows:
the device comprises a feeding and discharging atmosphere/vacuum conversion cavity 10, a first small cavity 1, a second small cavity 2, an integral shell structure 3 and a servo driving device 4.
Detailed Description
A loading and unloading method for an electron beam exposure machine is shown in figure 1: the mask plate exposure device comprises a feeding and discharging atmosphere/vacuum conversion cavity 10 and a process cavity, wherein the process cavity is an exposure processing area of an electron beam exposure machine for a mask plate, an isolation valve structure is arranged between the feeding and discharging atmosphere/vacuum conversion cavity 10 and the process cavity, a first small cavity 1 and a second small cavity 2 are arranged in the feeding and discharging/vacuum conversion cavity 10, the first small cavity 1 and the second small cavity 2 are independent cavities which are arranged up and down, the first small cavity 1 and the second small cavity 2 are combined to form an integral shell structure 3, a servo driving device 4 is connected in the height direction of the integral shell structure 3, the servo driving device 4 drives the integral shell structure to ascend or descend so that the height of at least one of the first small cavity 1 and the second small cavity 2 is arranged corresponding to the height of the process cavity, and independent vacuumizing air pipes are arranged on the peripheral inner walls of the feeding and discharging atmosphere/vacuum conversion cavity 10, A nitrogen gas charging pipe, when the mask corresponding to the first small cavity 1 is exposed, the corresponding mask is pulled back to the first small cavity 1 from the process cavity by an external push-pull rod, then the small cavity 2 is quickly lifted to the height of the process cavity through the servo driving device 4, the external push-pull rod pushes the other unexposed mask plate into the process cavity, then the isolating valve between the process chamber and the feeding and discharging atmosphere/vacuum conversion chamber 10 is closed, the nitrogen gas charging pipe on the feeding and discharging atmosphere/vacuum conversion chamber 10 charges the feeding and discharging atmosphere/vacuum conversion chamber, so that after the feeding and discharging atmosphere/vacuum conversion chamber returns to the atmosphere state from the vacuum state, taking out the exposed mask in the first small cavity 1, placing another unexposed mask in the first small cavity 1, and vacuumizing the vacuum pipe on the wall of the feeding and discharging atmosphere/vacuum conversion cavity 10 to start vacuumizing; in the process of performing atmosphere/vacuum conversion on the mask plate by the feeding and discharging atmosphere/vacuum conversion cavity 10, the mask plate which is already in a vacuum state is exposed by the process cavity, so that the waiting time of the exposure machine for vacuumizing is saved.
The electron beam exposure machine does not influence the exposure quality of the electron beam exposure machine due to vacuumizing in the exposure process, and objects for vacuumizing the charging and discharging atmosphere/vacuum conversion cavity are unexposed masks; the unexposed mask is placed in the corresponding small cavity, and after exposure is finished, the unexposed mask needs to return to the corresponding small cavity and cannot be mixed.
The small cavity is at the same height with the push-pull rod and the process cavity in the feeding and blanking process, and the height position of the small cavity is accurately and quickly controlled by a servo driving device and a corresponding positioning sensor;
the first small cavity 1 and the second small cavity 2 which are arranged up and down in the integral shell structure 3 respectively and independently bear corresponding mask clamps, and the mask clamps freely slide relative to the front and back positions of the small cavities, so that the mask plates are smoothly taken and placed;
the nitrogen gas inflation tube returns the vibration amplitude of the feeding and discharging atmosphere/vacuum conversion cavity from vacuum to atmospheric state within the exposure allowable range;
two mask plate clamps are placed simultaneously to enter a first small cavity 1 and a second small cavity 2 respectively during first feeding;
in the exposure process of the electron beam exposure machine, the feeding and discharging atmosphere/vacuum conversion cavity 10 performs operations of reducing the atmosphere, taking and placing the mask and vacuumizing.
During specific implementation, independent vacuumizing air pipes and nitrogen gas inflation pipes are arranged in the first small cavity 1 and the second small cavity 2, so that vacuumizing and atmosphere recovery are quicker and more efficient.
The servo drive 4 may be arranged in a top or bottom position, the servo drive 4 comprising a servo motor 5, a screw 6, a screw nut 7.
When the servo driving device 4 is arranged at the top position (see fig. 1), the servo motor 5 is fixedly arranged on the top plate of the feeding and discharging atmosphere/vacuum conversion cavity 10, the lower output rod of the servo motor 5 is fixedly connected with a downward convex screw rod 6, the lower section of the screw rod 6 is in threaded connection with a screw nut 7, and the screw nut 7 is fixedly connected at the top plate position of the integral shell structure 3.
When the servo driving device 4 is arranged at the bottom position, the servo motor 5 is fixedly arranged on the bottom plate of the feeding and discharging atmosphere/vacuum conversion cavity 10, an upper output rod of the servo motor 5 is fixedly connected with a convex screw rod 6, the upper section of the screw rod 6 is in threaded connection with a screw nut 7, and the screw nut 7 is fixedly connected at the bottom plate position of the integral shell structure 3.
The working principle is as follows: in the exposure process of the electron beam exposure machine, the feeding and discharging atmosphere/vacuum conversion cavity carries out the operations of reducing the atmosphere, taking and placing the mask plate and vacuumizing, the production capacity of the exposure machine is excavated to the maximum extent, and the feeding and discharging atmosphere/vacuum conversion time of the electron beam exposure machine is used for effective exposure output, so that the production efficiency of the exposure machine is improved, and the product cost is reduced.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. A feeding and discharging method of an electron beam exposure machine is characterized in that: the mask plate exposure device comprises a feeding and discharging atmosphere/vacuum conversion cavity and a process cavity, wherein the process cavity is an exposure processing area of an electron beam exposure machine for a mask plate, an isolation valve structure is arranged between the feeding and discharging atmosphere/vacuum conversion cavity and the process cavity, a first small cavity and a second small cavity are arranged in the feeding and discharging/vacuum conversion cavity, the first small cavity and the second small cavity are independent cavities which are arranged up and down, the first small cavity and the second small cavity are combined to form an integral shell structure, the height direction of the integral shell structure is connected with a servo driving device, the servo driving device drives the integral shell structure to ascend or descend, so that the height of at least one of the first small cavity and the second small cavity is arranged opposite to the height of the process cavity, independent vacuum pumping air pipes are arranged on the peripheral inner walls of the feeding and discharging atmosphere/vacuum conversion cavity, A nitrogen gas charging pipe, when the mask corresponding to the first small cavity is exposed, the corresponding mask is pulled back to the first small cavity from the process cavity by an external push-pull rod, then the small cavity 2 is quickly lifted to the height of the process cavity through a servo driving device, the external push-pull rod pushes the other unexposed mask plate into the process cavity, then closing an isolating valve between the process cavity and the feeding and discharging atmosphere/vacuum conversion cavity, inflating the feeding and discharging atmosphere/vacuum conversion cavity by a nitrogen inflation pipe on the feeding and discharging atmosphere/vacuum conversion cavity to return the feeding and discharging atmosphere/vacuum conversion cavity to the atmosphere state from the vacuum state, taking out the exposed mask in the first small cavity, placing another unexposed mask in the first small cavity, and vacuumizing an air pipe on the wall of the feeding and discharging air/vacuum conversion cavity to start vacuumizing; in the process of performing atmosphere/vacuum conversion on the mask plate by the feeding and discharging atmosphere/vacuum conversion cavity, the mask plate which is already in a vacuum state is exposed by the process cavity, so that the waiting time of the exposure machine for vacuumizing is saved.
2. The loading and unloading method of electron beam exposure machine as claimed in claim 1, wherein: the small cavity is at the same height with the push-pull rod and the process cavity in the feeding and discharging process, and the height position of the small cavity is accurately and quickly controlled by the servo driving device and the corresponding positioning sensor.
3. The loading and unloading method of electron beam exposure machine as claimed in claim 1, wherein: the first small cavity and the second small cavity which are vertically arranged in the integral shell structure respectively and independently bear the corresponding mask clamp, and the mask clamp freely slides relative to the front and back positions of the small cavities, so that the mask plate is smoothly taken and placed.
4. The loading and unloading method of electron beam exposure machine as claimed in claim 1, wherein: the vibration amplitude of the feeding and discharging atmosphere/vacuum conversion cavity returned to the atmospheric state from vacuum by the nitrogen gas inflation pipe is within the exposure allowable range.
5. The loading and unloading method of electron beam exposure machine as claimed in claim 1, wherein: two mask plate clamps are placed simultaneously to enter the first small cavity and the second small cavity respectively during first feeding.
6. The loading and unloading method of electron beam exposure machine as claimed in claim 1, wherein: in the exposure process of the electron beam exposure machine, the feeding and discharging atmosphere/vacuum conversion cavity carries out the operations of reducing the atmosphere environment, taking and placing the mask and vacuumizing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011137388.1A CN112255888A (en) | 2020-10-22 | 2020-10-22 | Feeding and discharging method of electron beam exposure machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011137388.1A CN112255888A (en) | 2020-10-22 | 2020-10-22 | Feeding and discharging method of electron beam exposure machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112255888A true CN112255888A (en) | 2021-01-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011137388.1A Pending CN112255888A (en) | 2020-10-22 | 2020-10-22 | Feeding and discharging method of electron beam exposure machine |
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| Country | Link |
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| CN (1) | CN112255888A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5559584A (en) * | 1993-03-08 | 1996-09-24 | Nikon Corporation | Exposure apparatus |
| CN1424627A (en) * | 2001-12-06 | 2003-06-18 | 株式会社尼康 | Exposure method and device |
| CN103713475A (en) * | 2008-04-18 | 2014-04-09 | Asml荷兰有限公司 | Rapid exchange device for lithography reticles |
-
2020
- 2020-10-22 CN CN202011137388.1A patent/CN112255888A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5559584A (en) * | 1993-03-08 | 1996-09-24 | Nikon Corporation | Exposure apparatus |
| CN1424627A (en) * | 2001-12-06 | 2003-06-18 | 株式会社尼康 | Exposure method and device |
| CN103713475A (en) * | 2008-04-18 | 2014-04-09 | Asml荷兰有限公司 | Rapid exchange device for lithography reticles |
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Application publication date: 20210122 |