CN112185983B - Display panel and display device - Google Patents

Abstract

The present invention provides a display panel and a display device. The display panel includes: a light-emitting device, an array substrate, and a connecting glue; the array substrate and the light-emitting device are electrically connected through a first conductive block and a second conductive block, and the first conductive block and the second conductive block The second conductive block is not in contact; the connecting glue is arranged between the light-emitting device and the array substrate, the projection of the connecting glue on the array substrate is located in the projection of the bottom wall of the light-emitting device facing the array substrate on the array substrate, and the connecting glue is located on the first conductive Around the block and the second conductive block; the connecting glue is used to bond the light emitting device and the array substrate. When making a display panel, the connection layer between the light emitting device and the substrate decomposes, and then generates gas to push the light emitting device and the substrate to separate. At this time, the connecting glue between the light emitting device and the array substrate will support the light emitting device and prevent the light emitting device Damage due to uneven force.

Description

Display panel and display device

technical field

The present invention relates to the field of display technology, in particular to a display panel and a display device.

Background technique

With the gradual development of display device technology, micro light emitting diodes are gradually applied to various display devices due to their higher brightness and longer service life.

A display panel usually includes an array substrate and a light-emitting device composed of micro-light emitting diodes. During preparation, micro-light-emitting diodes are first prepared on a substrate, then the micro-light-emitting diodes on the substrate are connected to the array substrate, and then the substrate is separated from the micro-light-emitting diodes. During this process, the micro light emitting diodes are prone to uneven force, resulting in damage to the micro light emitting diodes.

Contents of the invention

In view of this, the embodiments of the present invention provide a display panel and a display device to solve the technical problem that the micro-LEDs are susceptible to uneven force during the manufacturing process, resulting in damage to the micro-LEDs.

An embodiment of the present invention provides a display panel, including: a light-emitting device, an array substrate, and a connecting glue; the array substrate and the light-emitting device are electrically connected through a first conductive block and a second conductive block, and the first The conductive block is not in contact with the second conductive block; the connection glue is arranged between the light-emitting device and the array substrate, and the projection of the connection glue on the array substrate is located where the light-emitting device faces the In the projection of the bottom wall of the array substrate on the array substrate, the connecting glue is located around the first conductive block and the second conductive block; the connecting glue is used to bond the light emitting device and the the array substrate.

In the above display panel, preferably, the connecting glue is bonded to the first conductive block and the second conductive block.

For the above display panel, preferably, the connecting glue is thermoplastic glue; preferably, the connecting glue is photoresist; preferably, the connecting glue includes polymethacrylate or polystyrene or polycarbonate ester.

In the above display panel, preferably, the bottom wall of the light emitting device is provided with a first electrode and a second electrode, and the first electrode and the second electrode are not in contact; the first electrode and the second electrode are not in contact with each other; The first conductive block is connected, and the second electrode is connected to the second conductive block.

In the above display panel, preferably, the light emitting device has a side wall adjacent to the bottom wall; the first electrode includes a first contact portion on the bottom wall, and a first contact portion on the side wall The first extension part on the wall, the first conductive block is connected with the first contact part and the first extension part.

In the above display panel, preferably, the second electrode includes a second contact portion located on the bottom wall and a second extension portion located on the side wall, the second conductive block and the The second contact portion is connected to the second extension portion.

In the above display panel, preferably, the area of the bottom wall of the light emitting device is smaller than the area of the top wall of the light emitting device.

In the above display panel, preferably, both the first conductive block and the second conductive block are metal blocks.

In the above display panel, preferably, the first conductive block is welded to the first electrode, and the second conductive block is welded to the second electrode.

An embodiment of the present invention also provides a display device, which includes a casing and the above-mentioned display panel, and the display panel is arranged on the casing.

In the display panel and the display device provided by the embodiments of the present invention, the array substrate and the light emitting device are electrically connected through the first conductive block and the second conductive block, the connecting glue is arranged between the light emitting device and the array substrate, and the connecting glue is placed on the array substrate The projection of the light-emitting device is located in the projection of the bottom wall of the array substrate, and the connecting glue is located around the first conductive block and the second conductive block; when making a display panel, the connecting glue between the light-emitting device and the array substrate will support Light-emitting devices to avoid damage caused by uneven force on the light-emitting devices.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.

FIG. 1 is a first schematic diagram of the connection between a light emitting device and an array substrate in a display panel provided by an embodiment of the present invention;

2 is a top view of the first conductive block, the second conductive block, and the connecting glue on the array substrate in the display panel provided by the embodiment of the present invention;

FIG. 3 is a second schematic diagram of the connection between the light emitting device and the array substrate in the display panel provided by the embodiment of the present invention.

Explanation of reference signs:

10: Light emitting device;

101: the first electrode layer;

102: light-emitting layer;

103: the second electrode layer;

104: first electrode;

105: second electrode;

106: insulating layer;

1041: the first contact portion;

1042: first extension;

1051: the second contact portion;

1052: second extension;

20: array substrate;

201: the first conductive block;

202: the second conductive block;

30: connecting glue.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

The display panel usually includes an array substrate and a light-emitting device composed of micro-light-emitting diodes. The array substrate is provided with a first metal post and a second metal post, and the first metal post and the second metal post are not in contact. The light-emitting device is provided with a first The electrode and the second electrode, the first electrode and the second electrode are not in contact, the first metal column is connected to the first electrode by welding, and the second metal column is also connected to the second electrode by welding, so as to realize the array substrate Based on the electrical connection with the light emitting device, the mechanical connection between the light emitting device and the array substrate is realized. During preparation, the micro-light emitting diodes are first prepared on the substrate, then the micro-light-emitting diodes on the substrate are welded to the array substrate, and finally the substrate is irradiated with a laser of a certain wavelength to decompose the connection layer between the substrate and the micro-light-emitting diodes to generate gas. In this way, the separation between the substrate and the micro light emitting diodes is achieved.

However, when the connection layer decomposes, the generated gas pushes the micro-LED to separate from the substrate, and the cross-sectional area of the first metal post and the second metal post is small, and at this time, the micro-light-emitting diode is prone to uneven force, resulting in damage to the micro-light-emitting diode .

Figure 1 is a first schematic diagram of the connection between the light-emitting device and the array substrate in the display panel provided by the embodiment of the present invention; Figure 2 is the first conductive block, the second conductive block and the connecting glue in the array of the display panel provided by the embodiment of the present invention A top view on the substrate; FIG. 3 is a second schematic diagram of the connection between the light-emitting device and the array substrate in the display panel provided by the embodiment of the present invention.

Please refer to Figure 1-Figure 3. This embodiment provides a display panel, including: a light emitting device 10, an array substrate 20, and a connecting glue 30; the array substrate 20 and the light emitting device 10 are electrically connected through a first conductive block 201 and a second conductive block 202, wherein the first The first conductive block 201 and the second conductive block 202 are not in contact; the connecting glue 30 is arranged between the light emitting device 10 and the array substrate 20, and the projection of the connecting glue 30 on the array substrate 20 is located on the bottom wall of the light emitting device 10 facing the array substrate 20. In the projection on the array substrate 20 , the connecting glue 30 is located around the first conductive block 201 and the second conductive block 202 ; the connecting glue 30 is used for bonding the light emitting device 10 and the array substrate 20 .

The light-emitting device 10 in this embodiment can be an organic light-emitting device 10 or an inorganic light-emitting device 10 . This embodiment does not limit the light-emitting device 10 , as long as the light-emitting device 10 can emit light when power is supplied to the light-emitting device 10 . Continuing to refer to FIG. 1 , exemplary, the light-emitting device 10 may include an insulating layer 106, and a first electrode layer 101, a light-emitting layer 102, and a second electrode layer 103 that are stacked; the insulating layer 106 wraps around the first electrode layer 101, emits light The outside of the layer 102 and the second electrode layer 103 can drive the light emitting layer 102 to emit light when the first electrode layer 101 and the second electrode layer 103 are charged.

In this embodiment, the array substrate 20 is electrically connected to the light-emitting device 10 through the first conductive block 201 and the second conductive block 202. The array substrate 20 is provided with a thin film transistor, and the thin film transistor is connected to the first conductive block 201 and the second conductive block. Block 202 is electrically connected, and the first conductive block 201 and the second conductive block 202 are electrically connected to the light emitting device 10, so as to control the first conductive block 201 and the second conductive block 202 to supply power to the light emitting device 10 through the thin film transistor, so as to realize the display panel. show.

Exemplarily, the first conductive block 201 is electrically connected to the first electrode layer 101 on the light emitting device 10, and the second conductive block 202 is electrically connected to the second electrode layer 103 on the light emitting device 10, so that the first conductive block 201 and the The second conductive block 202 supplies power to the light emitting device 10 .

It is worth noting that, in this embodiment, the first conductive block 201 and the second conductive block 202 can be arranged on the array substrate 20, of course, the first conductive block 201 and the second conductive block 202 can also be arranged on the light emitting device 10, It only needs to ensure that the array substrate 20 can supply power to the light emitting device 10 through the first conductive block 201 and the second conductive block 202 .

In this embodiment, the connecting glue 30 is arranged between the light emitting device 10 and the array substrate 20, and the projection of the connecting glue 30 on the array substrate 20 is located within the projection of the bottom wall of the light emitting device 10 on the array substrate 20, and the connecting glue 30 Located around the first conductive block 201 and the second conductive block 202 . Referring to the orientation shown in FIG. 1, specifically, the top of the first conductive block 201 is in contact with the bottom wall of the light emitting device 10 facing the array substrate 20, and the bottom end of the first conductive block 201 is in contact with the top surface of the array substrate 20; The top of the second conductive block 202 is in contact with the bottom wall of the light emitting device 10 facing the array substrate 20 , and the bottom end of the second conductive block 202 is in contact with the top surface of the array substrate 20 .

In this embodiment, the connecting glue 30 is located around the first conductive block 201 and the second conductive block 202. Specifically, the connecting glue 30 can surround the first conductive block 201 and the second conductive block 202 and connect with the first conductive block 201 and the second conductive block 202. The second conductive block 202 is in contact with, or can surround the first conductive block 201 and the second conductive block 202 but not in contact with the first conductive block 201 and the second conductive block 202. It is worth noting that it is necessary to ensure that one surface of the connecting glue 30 To be bonded to the light emitting device 10 , the other side of the connecting glue 30 is bonded to the array substrate 20 to ensure that the connecting glue 30 can support the light emitting device 10 . In addition, the connecting glue 30 bonds the light emitting device 10 to the array substrate 20 , and also improves the connection force between the light emitting device 10 and the array substrate 20 , and prevents the light emitting device 10 from being detached from the array substrate 20 .

In this implementation, preferably, the connecting glue 30 surrounds the first conductive block 201 and the second conductive block 202 and is in contact with the first conductive block 201 and the second conductive block 202, that is, the connecting glue 30 fills the entire glue-containing area, and is in contact with the connecting glue 30 and the second conductive block 202. Compared with the gap between the first conductive block 201 and the second conductive block 202, the contact area between the connecting glue 30 and the light emitting device 10 is increased, the light emitting device 10 is further supported, and the connection between the light emitting device 10 and the array substrate is further improved. 20 to further prevent the light emitting device 10 from being detached from the array substrate 20 .

In this embodiment, there may be many kinds of connecting glue 30 , as long as it can bond the light emitting device 10 and the array substrate 20 . Preferably, the connecting glue 30 can be thermoplastic glue. Such as: acrylic or polystyrene, etc. The viscosity of the thermoplastic glue gradually decreases as the temperature increases, and gradually solidifies as the temperature decreases, and the above-mentioned process can be repeated; the connecting glue 30 is a thermoplastic glue, and the viscosity of the connecting glue 30 can be adjusted by changing the temperature, which is convenient. Bonding between the array substrate 20 and the light emitting device 10 . Of course, the connecting glue 30 in this embodiment can also be a thermosetting glue, which gradually solidifies as the temperature rises, and the viscosity after curing will not change with the change of temperature.

When the connecting glue 30 is a thermoplastic glue, in the manufacturing process, a whole layer of connecting glue 30 can be formed on the bottom surface of the array substrate 20 first, and then a photosensitive layer is formed on the connecting glue 30; then a mask plate is placed on the photosensitive layer, There is a light-shielding part on the mask, and the projection of the light-shielding part on the array substrate 20 is the same as the projection shape of the bottom wall of the light-emitting device 10 on the array substrate; afterward, the mask is exposed, so that the photosensitive layer outside the light-shielding part is exposed , and then remove the exposed photosensitive layer and the connecting glue 30 corresponding to the exposed photosensitive layer, the photosensitive layer corresponding to the light-shielding part is not exposed and remains, and the corresponding connecting glue 30 corresponding to the light-shielding part is also stored on the array substrate 20, and then The photosensitive layer is removed; at this time, a glue block composed of connecting glue 30 is formed on the array substrate 20 , and the projection of the glue block on the array substrate 20 completely coincides with the projection of the bottom wall of the light emitting device 10 on the array substrate 20 . The first conductive block 201 and the second conductive block 202 can be installed on the light-emitting device 10 in advance, at this time, the light-emitting device 10 is pasted on the glue block, and the glue block is heated to reduce the viscosity of the glue block, and at the same time Press the light-emitting device 10, so that the first conductive block 201 and the second conductive block 202 pass through the glue block and contact the array substrate 20, and at the same time, the connecting glue 30 is located around the first conductive block 201 and the second conductive block 202, To realize the electrical connection between the first conductive block 201 and the second conductive block 202 and the array substrate 20; after that, the temperature of the glue block is lowered so that the glue block is cured, and the connection between the light emitting device 10 and the array substrate 20 can be realized. bonding between. In the above process, the first conductive block 201 and the second conductive block 202 can also be prefabricated on the top surface of the array substrate 20, and then form a whole layer of connecting glue 30 on the top surface of the array substrate 20. At this time, the connecting glue 30 Surround the first conductive block 201 and the second conductive block 202, and then form a glue block by the same method, attach the light-emitting device 10 to the glue block, and heat the glue block to reduce the viscosity of the glue block; press the light-emitting device at the same time 10, so that the light emitting device 10 is in contact with the first conductive block 201 and the second conductive block 202, so as to realize the electrical connection between the first conductive block 201 and the second conductive block 202 and the light emitting device 10.

When the connecting glue 30 is a thermoplastic glue, the connecting glue 30 can also be directly formed on the bottom wall of the light-emitting device 10 during the manufacturing process. At this time, the first conductive block 201 and the second conductive block can be formed on the array substrate 20 in advance. 202, then attach the light-emitting device 10 on the array substrate 20, heat the connecting glue 30 and press the light-emitting device 10, so that the first conductive block 201 and the second conductive block 202 pass through the connecting glue 30 and contact the light-emitting device 10, and then Cool to solidify. Of course, the first conductive block 201 and the second conductive block 202 can also be prefabricated on the bottom wall of the light emitting device 10 .

The connecting glue 30 in this embodiment can also be photoresist. The connection glue 30 of a certain shape can be formed by a photolithography process, so that the connection glue 30 on the array substrate 20 is located in the projection of the bottom wall of the light emitting device 10 on the array substrate 20, and the connection glue 30 is located on the first conductive block 201 and The surrounding of the second conductive block 202 simplifies the manufacturing difficulty.

Exemplarily, a whole layer of connecting glue 30 can be formed on the top surface of the array substrate 20; afterward, photolithography is performed on the connecting glue 30 to form a glue block, and the projection of the glue block on the array substrate 20 is located on the bottom wall of the light emitting device 10 In the projection on the array substrate 20, the glue block has a first through hole and a second through hole, the projection of the first conductive block 201 on the array substrate 20 is located within the projection of the first through hole on the array substrate 20, and the first through hole on the array substrate 20. The projection of the second conductive block 202 on the array substrate 20 is located within the projection of the second through hole on the array substrate 20; then attach the light emitting device 10 with the first conductive block 201 and the second conductive block 202 on the adhesive block, And the first conductive block 201 is penetrated in the first through hole, and the second conductive block 202 is penetrated in the second through hole, so that the first conductive block 201 and the second conductive block 202 are electrically connected to the array substrate 20; The connection between the light emitting device 10 and the array substrate 20 can be realized. The photolithography process includes: covering the mask plate on the connecting glue 30, the mask plate has a light-shielding part, the projection of the light-shielding part on the array substrate 20 coincides with the projection of the bottom wall of the light-emitting device 10 on the array substrate 20, and the light-shielding There is a first light transmission hole and a second light transmission hole on the part, the first light transmission hole corresponds to the first conductive block 201, the second light transmission hole corresponds to the second conductive block 202, and the mask plate is exposed, and then The exposed connecting glue 30 is removed to form the glue block and the first through hole and the second through hole on the glue block.

Of course, the first conductive block 201 and the second conductive block 202 can also be pre-set on the array substrate 20, and the connecting glue 30 is formed on the top surface of the array substrate 20, and the connecting glue 30 covers the first conductive block 201 and the second conductive block 202. The array substrate 20 of the connecting glue 30 is then photolithographically processed to form a glue block; the light-emitting device 10 is attached to the connecting glue 30, and the first conductive block 201 and the second conductive block 202 are electrically connected to the light-emitting device 10 connection to complete the connection between the light emitting device 10 and the array substrate 20 .

Further, the connecting glue 30 in this embodiment may also be a thermoplastic photoresist. Thermoplastic photoresists can be mainly composed of polymethacrylate or polystyrene or polycarbonate. That is, the photoresist can not only be processed by photolithography, but the viscosity of the photoresist decreases after heating, and gradually solidifies when it is cooled, and the viscosity of the photoresist still decreases when it is heated again after curing. At this time, when the light-emitting device 10 is attached to the array substrate 20, the photoresist is properly heated to reduce the viscosity of the photoresist, so that the photoresist is completely attached to the array substrate 20 and the light-emitting device 10, and then cooled. The photoresist is used to cure the photoresist to realize the connection between the light emitting device 10 and the array substrate 20 . It is worth noting that when the connecting glue 30 is a thermoplastic photoresist, it is not necessary to form the first through hole and the second through hole during the photolithography process. When the array substrate 20 and the light emitting device 10 are bonded, the The viscosity of the photoresist is reduced, and then the light emitting device 10 is pressed, so that the first conductive block 201 and the second conductive block 202 on the light emitting device 10 can pass through the optical glue and contact the array substrate 20 .

The processing process of the display panel provided in this embodiment is as follows: the light emitting device 10 is connected to the substrate through the connection layer, and the top wall of the light emitting device 10 away from the array substrate 20 is connected to the connection layer; the first conductive block 201 is formed on the array substrate 20 and the second conductive block 202, and form the connection glue 30; then attach the light-emitting device 10 to the connection glue 30 through the substrate, and make the first conductive block 201 and the second conductive block 202 electrically connect with the light-emitting device 10, the connection glue 30 bonding the light-emitting device 10 and the array substrate 20; after that, decompose the connection layer by means of light to generate gas, and the gas pushes the substrate to separate from the light-emitting device 10, thereby realizing the production of the display panel.

In the display panel provided in this embodiment, the array substrate 20 and the light emitting device 10 are electrically connected through the first conductive block 201 and the second conductive block 202, and the connecting glue 30 is arranged between the light emitting device 10 and the array substrate 20, and the connecting glue 30 The projection on the array substrate 20 is located in the projection of the bottom wall of the light emitting device 10 on the array substrate 20, and the connecting glue 30 is located around the first conductive block 201 and the second conductive block 202; The connection layer between 10 and the substrate decomposes, and then generates gas to push the light-emitting device 10 away from the substrate. At this time, the connection glue 30 between the light-emitting device 10 and the array substrate 20 will support the light-emitting device 10 and prevent the light-emitting device 10 from being stressed. uneven and damaged.

In addition, the bonding adhesive 30 bonds the light emitting device 10 and the array substrate 20 , which also improves the connection force between the light emitting device 10 and the array substrate 20 , and prevents the light emitting device 10 from being detached from the array substrate 20 .

In this embodiment, the projection of the connecting glue 30 on the array substrate 20 is located within the projection of the bottom wall of the light emitting device 10 on the array substrate 20 . Such an arrangement can also avoid that when multiple light emitting devices 10 are mounted on the array substrate 20 at the same time, the connecting glue 30 enters the gap between two adjacent light emitting devices 10, resulting in the connecting glue 10 being in contact with the base; The light emitting device 10 is difficult to separate.

Continue to refer to Figure 1. In this embodiment, a first electrode 104 and a second electrode 105 are provided on the bottom wall of the light emitting device 10, and the first electrode 104 and the second electrode 105 are not in contact; the first electrode 104 is connected to the first conductive block 201, and the second The electrode 105 is connected to the second conductive block 202 . The first conductive block 201 is connected to the light emitting device 10 through the first electrode 104 , and the second conductive block 202 is electrically connected to the light emitting device 10 through the second electrode 105 .

In this embodiment, the first electrode 104 and the second electrode 105 can both be made of metal materials such as silver and copper. Of course, in this embodiment, the first electrode 104 and the second electrode 105 can also be made of non-metallic materials such as graphite. It only needs to ensure that the first electrode 104 and the second electrode 105 are electrically conductive.

Similarly, in this implementation, the first conductive block 201 and the second conductive block 202 can be metal blocks mainly composed of metal materials such as silver and copper. Of course, in this embodiment, the first conductive block 201 and the second conductive block 202 can also be A non-metallic block mainly composed of non-metallic materials such as graphite. It only needs to ensure that the first conductive block 201 and the second conductive block 202 are electrically conductive.

In this embodiment, when the first conductive block 201 and the second conductive block 202 are metal blocks, the first electrode 104 and the second electrode 105 are also made of metal material, and at this time the first conductive block 201 is welded to the first electrode 104 , the second conductive block 202 is welded to the second electrode 105 . The first conductive block 201 and the second conductive block 202 are connected to the light emitting device 10 by soldering, which improves the connection strength between the light emitting device 10 and the array substrate 20 on the basis of ensuring the electrical connection.

Preferably, when the first conductive block 201 is connected to the first electrode 104 by welding, and the second conductive block 202 is connected to the second electrode 105 by welding, the first conductive block 201 and the second conductive block 202 can be both It is made of metal indium, and due to the low melting point of indium, it can avoid damage to the light emitting device 10 or the array substrate 20 caused by excessive temperature during soldering.

In this embodiment, when the connecting glue 30 is a thermoplastic photoresist, when the first conductive block 201 and the second conductive block 202 are welded, the connecting glue 30 is also heated, and the connection is also realized when the welding is completed. The adhesive 30 is bonded to the array substrate 20 and the light emitting device 10 .

Continuing to refer to FIG. 3 , in this embodiment, the light-emitting device 10 has a side wall adjacent to the bottom wall; the first electrode 104 includes a first contact portion 1041 on the bottom wall, and a first extension portion on the side wall 1042 , the first conductive block 201 is connected to the first contact portion 1041 and the first extension portion 1042 . The first conductive block 201 is connected to the first contact portion 1041 and the first extension portion 1042, compared with the first electrode 104 only disposed on the bottom wall of the light emitting device 10, the distance between the first conductive block 201 and the first electrode 104 is increased. contact area to avoid poor contact between the first conductive block 201 and the first electrode 104 . In addition, when the first conductive block 201 and the first electrode 104 are connected by welding, the connection force between the first conductive block 201 and the first electrode 104 can also be improved, thereby improving the connection between the light emitting device 10 and the array substrate 20. connection between.

Continue to refer to FIG. 3 . Further, the second electrode 105 includes a second contact portion 1051 on the bottom wall and a second extension portion 1052 on the side wall, and the second conductive block 202 is connected to the second contact portion 1051 and the second extension portion 1052 . The second conductive block 202 is connected to the second contact portion 1051 and the second extension portion 1052, compared with the second electrode 105 where only the bottom wall of the light emitting device 10 is provided, the distance between the second conductive block 202 and the second electrode 105 is improved. contact area to avoid poor contact between the second conductive block 202 and the second electrode 105 . In addition, when the second conductive block 202 and the second electrode 105 are connected by welding, the connection force between the second conductive block 202 and the second electrode 105 can also be improved, thereby improving the connection between the light emitting device 10 and the array substrate 20. connection between.

Continuing to refer to FIG. 3 , in this embodiment, preferably, the area of the bottom wall of the light emitting device 10 is smaller than the area of the top wall of the light emitting device 10 . In this way, the sidewall of the light emitting device 10 is arranged obliquely, which can increase the area of the sidewall of the light emitting device 10 compared with the vertical arrangement of the sidewall of the light emitting device 10; the distance between the first extension 1042 and the bottom wall of the light emitting device 10 On the same premise, the inclined sidewall can increase the area of the first extension 1042 to further increase the contact area between the first conductive block 201 and the first electrode 104; On the premise that the distances between the bottom walls are equal, the inclined side walls can increase the area of the second extension portion 1052 to further increase the contact area between the second conductive block 202 and the second electrode 105 .

Exemplarily, the light emitting device 10 may be in the shape of a cone or a prism, so as to ensure that the area of the bottom wall of the light emitting device 10 is smaller than the area of the top wall of the light emitting device 10 .

Continue to refer to Figures 1-3. In other embodiments, a display device is also provided, including a casing and the above-mentioned display panel, and the display panel is arranged on the casing.

The display device may be a product or component with a display function such as a mobile phone, a tablet computer, a television, a monitor, an electronic book, an electronic paper, a smart watch, a notebook computer, a digital photo frame, or a navigator.

In the display device provided in this embodiment, the array substrate 20 and the light emitting device 10 are electrically connected through the first conductive block 201 and the second conductive block 202, the connecting glue 30 is arranged between the light emitting device 10 and the array substrate 20, and the connecting glue 30 The projection on the array substrate 20 is located in the projection of the bottom wall of the light emitting device 10 on the array substrate 20, and the connecting glue 30 is located around the first conductive block 201 and the second conductive block 202; The connection layer between 10 and the substrate decomposes, and then generates gas to push the light-emitting device 10 away from the substrate. At this time, the connection glue 30 between the light-emitting device 10 and the array substrate 20 will support the light-emitting device 10 and prevent the light-emitting device 10 from being stressed. uneven and damaged.

In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial" , "radial", "circumferential" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the referred device or Elements must have certain orientations, be constructed and operate in certain orientations, and therefore should not be construed as limitations on the invention.

It should be noted that, in the description of the present invention, the terms "first" and "second" are only used to describe different components conveniently, and should not be understood as indicating or implying a sequence relationship, relative importance, or implicit indication. The number of technical characteristics. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features.

In the present invention, unless otherwise specified, the terms "installation", "connection", "connection", "fixation" and other terms should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection, Or integrally formed, it can be mechanically connected, it can be electrically connected or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction relationship between two components, unless There are other clear restrictions. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: It is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the various embodiments of the present invention. scope.

Claims (10)

1. A display panel, characterized in that it comprises: a light emitting device, an array substrate, and a bonding glue; The array substrate and the light-emitting device are electrically connected through a first conductive block and a second conductive block, and the first conductive block and the second conductive block are not in contact; The connection glue is arranged between the light-emitting device and the array substrate, and the projection of the connection glue on the array substrate is located at the bottom wall of the light-emitting device facing the array substrate on the array substrate. In the projection, the connecting glue is located around the first conductive block and the second conductive block; The connecting glue is used to bond the light-emitting device and the array substrate; the connecting glue is a thermoplastic photoresist. 2 . The display panel according to claim 1 , wherein the connecting glue is attached to the first conductive block and the second conductive block. 3 . 3. The display panel according to claim 1, wherein the connecting glue comprises polymethacrylate or polystyrene or polycarbonate. 4. The display panel according to any one of claims 1-3, wherein a first electrode and a second electrode are arranged on the bottom wall of the light emitting device, and the first electrode and the second electrode The two electrodes are not in contact; the first electrode is connected to the first conductive block, and the second electrode is connected to the second conductive block. 5. The display panel according to claim 4, wherein the light emitting device has a side wall adjacent to the bottom wall; the first electrode comprises a first contact portion on the bottom wall , and a first extension portion located on the side wall, the first conductive block is connected to the first contact portion and the first extension portion. 6. The display panel according to claim 5, wherein the second electrode comprises a second contact portion located on the bottom wall and a second extension portion located on the side wall, the first Two conductive blocks are connected to the second contact portion and the second extension portion. 7. The display panel according to claim 6, wherein the area of the bottom wall of the light emitting device is smaller than the area of the top wall of the light emitting device. 8. The display panel according to claim 4, wherein the first conductive block and the second conductive block are metal blocks. 9. The display panel according to claim 8, wherein the first conductive block is welded to the first electrode, and the second conductive block is welded to the second electrode. 10. A display device, characterized by comprising a casing and the display panel according to any one of claims 1-9, the display panel being arranged on the casing.

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