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CN112018088A - TFT module with electromagnetic interference shielding and anti-static functions - Google Patents

TFT module with electromagnetic interference shielding and anti-static functions Download PDF

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Publication number
CN112018088A
CN112018088A CN202010932019.5A CN202010932019A CN112018088A CN 112018088 A CN112018088 A CN 112018088A CN 202010932019 A CN202010932019 A CN 202010932019A CN 112018088 A CN112018088 A CN 112018088A
Authority
CN
China
Prior art keywords
frame
gnd
iron frame
access port
iron
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010932019.5A
Other languages
Chinese (zh)
Inventor
袁博
李春来
朱文辉
贺小艳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heyuan Sibi Electronics Co ltd
Original Assignee
Heyuan Sibi Electronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heyuan Sibi Electronics Co ltd filed Critical Heyuan Sibi Electronics Co ltd
Priority to CN202010932019.5A priority Critical patent/CN112018088A/en
Publication of CN112018088A publication Critical patent/CN112018088A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60Protection against electrostatic charges or discharges, e.g. Faraday shields
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

A design method of a TFT module with electromagnetic interference shielding and anti-static functions comprises the following steps: the TFT module comprises a rubber frame, an iron frame and an FPC (flexible printed circuit), wherein the rubber frame is arranged in the iron frame, and the FPC is arranged on the rubber frame; arranging a plastic frame GND access port for ESD and EMI protection on the plastic frame; arranging an iron frame GND access port for ESD and EMI protection on the iron frame, wherein the iron frame GND access port is arranged on the inner side of the iron frame; the extension part is arranged on the FPC, the GND pin is arranged on the extension part, and the GND pin is connected with the GND of the mainboard into a whole through the rubber frame GND access port and the iron frame GND access port by the grounding conduction piece. The invention effectively improves the ESD and EMI protection capability of the TFT module, enables the whole module to be in the GND protection environment, and effectively improves the application performance of the module.

Description

TFT module with electromagnetic interference shielding and anti-static functions
Technical Field
The invention relates to a TFT module, in particular to a TFT module with electromagnetic interference shielding and anti-static functions.
Background
The TFT module in the market at present has grade limitation in the aspect of EMI and ESD grade protection, and a simple TFT module can not be applied and popularized in a high-complexity environment, and an application client can only make up the defects in the two aspects through the structures of a mainboard and a host, so that the design complexity of a client shell is increased, and the circuit complexity and the cost of the client mainboard are also increased.
Disclosure of Invention
In order to solve the above technical problems, the present invention provides a design method of a TFT module with electromagnetic interference shielding and anti-static functions.
In order to solve the technical problems, the invention adopts the following technical scheme:
a design method of a TFT module with electromagnetic interference shielding and anti-static functions comprises the following steps:
the TFT module comprises a rubber frame, an iron frame and an FPC (flexible printed circuit), wherein the rubber frame is arranged in the iron frame, and the FPC is arranged on the rubber frame;
arranging a plastic frame GND access port for ESD and EMI protection on the plastic frame;
arranging an iron frame GND access port for ESD and EMI protection on the iron frame, wherein the iron frame GND access port is arranged on the inner side of the iron frame;
the extension part is arranged on the FPC, the GND pin is arranged on the extension part, and the GND pin is connected with the GND of the mainboard into a whole through the rubber frame GND access port and the iron frame GND access port by the grounding conduction piece.
The GND access port of the rubber frame is a slot position arranged on the side wall of the rubber frame.
The glue frame GND access port is arranged along the height direction of the side wall of the glue frame.
The iron frame GND access port is formed in the side wall of the iron frame, and after the rubber frame is installed in the iron frame, the iron frame GND access port is formed in the iron frame through a laying hole corresponding to the rubber frame GND access port.
Glue and be equipped with a plurality of on the frame and glue frame GND and insert the mouth, be equipped with a plurality of chase and insert the mouth on the chase, glue the back of framed dress in the chase, insert the mouth setting at GDN and set up ground connection and turn on and form with chase GND and switch on, the chase GND inserts the GND pin on mouth and the FPC and switches on, makes the chase form holistic GND guard shield.
A reverse diode is additionally arranged between the GND pin on the FPC and a power supply VDD.
And a piezoresistor is arranged in a positive circuit on the FPC.
The invention effectively improves the ESD and EMI protection capability of the TFT module, enables the whole module to be in the GND protection environment, and effectively improves the application performance of the module.
Drawings
FIG. 1 is a partial schematic view of a rubber frame according to the present invention;
FIG. 2 is a partial schematic view of an iron frame according to the present invention;
FIG. 3 is a partial schematic view of an FPC according to the present invention.
Detailed Description
For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.
As shown in fig. 1-3, the present invention provides a method for designing a TFT module with electromagnetic interference shielding and anti-static functions, comprising the following steps:
the TFT module is including gluing frame 1, chase 3, FPC 6, glues frame 1 and adorns in chase 3, and FPC adorns on gluing the frame.
And a plastic frame GND access port 2 for ESD and EMI protection is arranged on the plastic frame 1.
The iron frame 3 is provided with an ESD and EMI protected iron frame GND access 4 which is arranged on the inner side of the iron frame.
The FPC 6 is provided with an extending part, the extending part is provided with a GND pin 7, and the GND pin is connected with the GND of the main board through a rubber frame GND access port and an iron frame GND access port through a grounding conducting piece 5 to form a whole, so that the whole GND shield is formed.
Glue frame GND and insert the mouth for establishing the trench at gluey frame lateral wall, all be equipped with the recess at the lateral wall and the upper surface of gluing the frame for glue the frame and not a sealed annular structure, insert the mouth through this GND, realization that can be convenient is whole ground connection and is handled.
The iron frame GND access port is formed in the side wall of the iron frame, after the rubber frame is arranged in the iron frame, the iron frame is correspondingly provided with the laying hole of the rubber frame GND access port to form the iron frame GND access port, the original structure of the iron frame is not influenced, and connection is facilitated.
Glue and be equipped with a plurality of on the frame and glue frame GND and insert the mouth, be equipped with a plurality of chase and insert the mouth on the chase, glue the back of framed dress in the chase, insert the mouth setting at GDN and set up ground connection and turn on and form with chase GND and switch on, the chase GND inserts the GND pin on mouth and the FPC and switches on, makes the chase form holistic GND guard shield. Thereby making the FPC a conductor with improved ESM and EMI shielding
A reverse diode is additionally arranged between a GND pin on the FPC and a power supply VDD to prevent BEZEL from contacting a power supply element of a mainboard or a test board to cause short circuit in the normal operation process of the TFT module, and the reverse diode is additionally arranged between the GND and the VDD of the TFT to ensure that a chip of the TFT has one more layer.
The FPC is provided with a positive pole loop and a negative pole loop, and in order to prevent ESD voltage from flowing back to the A pole of the LED, the piezoresistor is added in the positive pole loop to play a role in protection, and the selection type of the piezoresistor is matched according to different TFT designs.
Although the present invention has been described in detail with reference to the embodiments, it will be apparent to those skilled in the art that modifications, equivalents, improvements, and the like can be made in the technical solutions of the foregoing embodiments or in some of the technical features of the foregoing embodiments, but those modifications, equivalents, improvements, and the like are all within the spirit and principle of the present invention.

Claims (7)

1. A design method of a TFT module with electromagnetic interference shielding and anti-static functions is characterized by comprising the following steps:
the TFT module comprises a rubber frame, an iron frame and an FPC (flexible printed circuit), wherein the rubber frame is arranged in the iron frame, and the FPC is arranged on the rubber frame;
arranging a plastic frame GND access port for ESD and EMI protection on the plastic frame;
arranging an iron frame GND access port for ESD and EMI protection on the iron frame, wherein the iron frame GND access port is arranged on the inner side of the iron frame;
the extension part is arranged on the FPC, the GND pin is arranged on the extension part, and the GND pin is connected with the GND of the mainboard into a whole through the rubber frame GND access port and the iron frame GND access port by the grounding conduction piece.
2. The method for designing the TFT module with the functions of shielding electromagnetic interference and preventing static electricity according to claim 1, wherein the rubber frame GND inlet is a slot formed in a side wall of the rubber frame.
3. The method for designing the TFT module with the functions of shielding electromagnetic interference and preventing static electricity according to claim 2, wherein the plastic frame GND inlet is arranged along the height direction of the side wall of the plastic frame.
4. The method for designing the TFT module with the functions of shielding electromagnetic interference and preventing static electricity according to claim 3, wherein the iron frame GND access port is formed in the side wall of the iron frame, and after the rubber frame is installed in the iron frame, a placing opening corresponding to the rubber frame GND access port in the iron frame forms the iron frame GND access port.
5. The method for designing a TFT module having the functions of shielding electromagnetic interference and preventing static electricity according to claim 4, wherein the rubber frame is provided with a plurality of rubber frame GND inlets, the iron frame is provided with a plurality of iron frame inlets, after the rubber frame is arranged in the iron frame, the GDN inlets are provided with grounding conduction pieces to be conducted with the iron frame GND, and the iron frame GND inlets are conducted with GND pins on the FPC, so that the iron frame forms an integral GND shield.
6. The method as claimed in claim 5, wherein a reverse diode is additionally disposed between the GND pin of the FPC and the power VDD.
7. The method for designing a TFT module with EMI shielding and ESD protection functions as claimed in claim 6, wherein a voltage dependent resistor is disposed in the positive loop on the FPC.
CN202010932019.5A 2020-09-08 2020-09-08 TFT module with electromagnetic interference shielding and anti-static functions Pending CN112018088A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010932019.5A CN112018088A (en) 2020-09-08 2020-09-08 TFT module with electromagnetic interference shielding and anti-static functions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010932019.5A CN112018088A (en) 2020-09-08 2020-09-08 TFT module with electromagnetic interference shielding and anti-static functions

Publications (1)

Publication Number Publication Date
CN112018088A true CN112018088A (en) 2020-12-01

Family

ID=73517159

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010932019.5A Pending CN112018088A (en) 2020-09-08 2020-09-08 TFT module with electromagnetic interference shielding and anti-static functions

Country Status (1)

Country Link
CN (1) CN112018088A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100014016A1 (en) * 2008-07-17 2010-01-21 Wintek Corporation Flexible printed circuit and liquid crystal module using the same
CN204422905U (en) * 2015-01-05 2015-06-24 深圳同兴达科技股份有限公司 A kind of FPC structure of liquid crystal display EMI suppression
CN205881357U (en) * 2016-07-25 2017-01-11 Tcl显示科技(惠州)有限公司 Display module and display device
CN206224057U (en) * 2016-11-29 2017-06-06 深圳市福瑞达显示技术有限公司 A kind of VR virtual projections device-specific TFT display screens
CN207164422U (en) * 2017-07-06 2018-03-30 星源电子科技(深圳)有限公司 A kind of liquid crystal module with ESD protection structure
CN208506428U (en) * 2018-06-15 2019-02-15 盐城易快来科技有限公司 A kind of FPC anti-interference structure based on LCD MODULE

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100014016A1 (en) * 2008-07-17 2010-01-21 Wintek Corporation Flexible printed circuit and liquid crystal module using the same
CN204422905U (en) * 2015-01-05 2015-06-24 深圳同兴达科技股份有限公司 A kind of FPC structure of liquid crystal display EMI suppression
CN205881357U (en) * 2016-07-25 2017-01-11 Tcl显示科技(惠州)有限公司 Display module and display device
CN206224057U (en) * 2016-11-29 2017-06-06 深圳市福瑞达显示技术有限公司 A kind of VR virtual projections device-specific TFT display screens
CN207164422U (en) * 2017-07-06 2018-03-30 星源电子科技(深圳)有限公司 A kind of liquid crystal module with ESD protection structure
CN208506428U (en) * 2018-06-15 2019-02-15 盐城易快来科技有限公司 A kind of FPC anti-interference structure based on LCD MODULE

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Application publication date: 20201201