CN212229610U - Binding structure, touch screen, display screen and touch display screen - Google Patents

Abstract

The utility model provides a binding structure, touch-sensitive screen, display screen and touch display screen under the condition that does not increase extra process, binding structure's metal lead layer and first conducting layer carry out the fluting hole design for the side on metal lead layer in conductive particle and the slotted hole in the conductive particle in the conduction layer contacts, and simultaneously, conductive particle also with FPC layer electrical contact, realize having good electric conduction effect between touch IC, display IC and touch module, the display module assembly.

Description

Binding structure, touch screen, display screen and touch display screen

Technical Field

The utility model belongs to the technical field of the flat panel display, especially, relate to touch display technical field, specifically be a bind structure, touch-sensitive screen, display screen and touch-sensitive display screen.

Background

As a simple and convenient human-computer interaction mode, the touch display screen has been widely applied in the fields of electronic devices, vehicle-mounted devices, and the like. Currently, touch display screen includes touch module and display module assembly, no matter be touch module assembly or display module assembly all need through binding mode with their with touch IC, the display IC electric connection that corresponds.

As shown in fig. 1, in the current bonding method, an FPC5 (flexible circuit board) connected with a touch IC or a display IC is connected to an ACF film or an ACP adhesive or an ACA adhesive through an ACP adhesive or an ACA adhesive (anisotropic conductive adhesive) or an ACF film 4 (anisotropic conductive film), and then is bonded to a PIN terminal of a metal lead layer 2 of a substrate 1 to be bonded, and after hot pressing and curing, a bonding process is completed to electrically connect the touch IC and the display IC to a touch module or a display module.

At present, the metal lead PIN end binding structure that some touch-sensitive screens or display screens appear is fig. 2 the structure, PIN end binding structure range upon range of does, is equipped with metal lead layer 2 on the base plate 1, is equipped with the first low conducting layer 3 that one deck electric conductivity is less than metal lead layer 2 on the metal lead layer 2, first low conducting layer 3 can carry out the guard action and/or realize the outward appearance matching effect of touch-sensitive screen, display screen to metal lead layer 2.

However, since the resistivity of the material of the first low-conductive layer 3 is much greater than that of the metal lead layer 2, the addition of the first low-conductive layer 3 may cause a drastic deterioration in the electrical conduction between the touch IC, the display IC, and the touch module and the display module, which are electrically connected through the ACP paste or the ACA paste or the ACF film 5.

At present, a process step can be added, specific chemical reagent is adopted to specifically corrode a partial area of the first low conductive layer 3 so as to realize ACP glue or ACA glue or ACF film 5 and the metal lead layer 2, namely, the chemical reagent only corrodes the specific area of the first low conductive layer 3, but not corrode the metal lead 2, the metal lead 2 is made of metal, when the first low conductive layer 3 is removed, the difficulty of retaining the metal lead 2 is very high, the controllable difficulty is high, the chemical reagent is expensive, the process step needs to be added, and the cost is increased.

Therefore, on the premise of not increasing the process steps, how to simultaneously realize the protection of the metal lead of the PIN end, match the appearance colors of the touch screen and the display screen and ensure that good electric conduction effects are achieved among the touch IC, the display IC, the touch module and the display module is a technical problem in the technical field.

It should be noted that the above background description is only for the purpose of illustrating the technical background of the present invention, and does not represent that the above description is the prior art.

SUMMERY OF THE UTILITY MODEL

To the above problem, the utility model provides a bind structure, touch-sensitive screen, display screen and touch display screen.

The utility model provides a binding structure of touch-sensitive screen or touch display screen includes by down in proper order: the circuit board comprises a substrate, a metal lead layer, a first low conducting layer, a conducting layer and an FPC layer, wherein conducting particles are arranged on the conducting layer.

Binding structure's metal lead layer and first low conducting layer carry out the design of fluting hole, through the design of fluting hole for conductive particle in the conducting layer contacts with the side on metal lead layer in the slotted hole, through the side electrical contact on the metal lead layer in conductive particle and the slotted hole, and simultaneously, conductive particle also with FPC layer electrical contact, the touch IC that FPC layer electricity is connected, show IC, make touch IC, show IC and touch module, show and have good electric conduction effect between the module.

Because current coating process is basically, sputter the metal level of plating whole layer on the base plate earlier, if the utility model provides a metal lead layer and/or first low conducting layer cover one deck photoresist again, form specific photoresist pattern through photoetching, etch again, get rid of the metal that does not need by the photoresist cover to leave the metal level of required specific pattern. In the photolithography process, the metal wiring layer and the corresponding region of the first low conductive layer are removed by photolithography at the same time, and one of the metal wiring layer and the corresponding region cannot be separately remained.

Because traditional production technology itself just need carve out a metal lead wire pattern through lithography process, the utility model discloses when photoetching and carving metal lead wire layer and first low conducting layer, set up the slotted hole in every metal lead wire layer and first low conducting layer, the adoption is that same photoetching and etching process need not additionally increase the process step.

In an alternative, the ratio of the width or the radial length of the slot to the diameter of the conductive particle is 0.5: 1-2: 1, the probability of the conductive particles being embedded in the slot holes and contacting with the exposed metal on the side surface can be increased.

In an optional scheme, the ratio of the width or the radial length of the slot hole to the diameter of the conductive particles is 1: 1-1.5: 1, and the probability of the conductive particles being embedded in the slot hole and contacting with the exposed metal on the side surface is highest.

Optionally, the diameter of the conductive particle is larger than the depth of the slot.

In a preferred embodiment, the conductive particles are spherical particles, and the spherical particles can increase the probability of contact with the side surface of the metal lead.

In a preferred embodiment, the conductive particles are metal ball particles, such as one or more of gold balls, silver balls, platinum balls, and gold-containing alloy particles.

In an optional scheme, the slotted hole is a circular hole slot or a strip-shaped groove structure.

In a preferred scheme, the slotted hole is of a long strip-shaped structure.

In a preferred embodiment, the diameter of the conductive particles is 100nm to 10 um.

In other schemes, the utility model provides a binding structure includes by down in proper order: the circuit board comprises a substrate, a second low conductive layer, a metal lead layer, a first low conductive layer, a conducting layer and an FPC. Namely, a low conductive layer is arranged on the upper layer and the lower layer adjacent to the metal lead layer. This has a better protective effect and/or optical matching effect on the metal lead layer.

In a preferred embodiment, the first and second low conductive layers comprise metal oxide or metal nitride or metal oxynitride.

And simultaneously, the utility model also provides a touch-sensitive screen, display screen and touch display screen, touch-sensitive screen or display screen or touch display screen all contain above-mentioned binding structure.

The utility model discloses a main beneficial effect lies in: the utility model provides a binding structure, touch-sensitive screen, display screen and touch display screen. Under the condition that no additional process is added, the metal lead layer and the first conducting layer of the binding structure are subjected to grooving hole design, so that conducting particles in the conducting layer are in contact with the side face of the metal lead layer in the groove hole, and meanwhile, the conducting particles are also in electric contact with the FPC layer, and good electric conduction effect among the touch IC, the display IC, the touch module and the display module is achieved. Furthermore, the utility model discloses do not need additionally to increase the technology step, practice thrift manufacturing cost.

Drawings

Fig. 1 is a cross-sectional structural view of a conventional binding structure;

fig. 2 is a cross-sectional structural view of a conventional binding structure;

fig. 3 is a first sectional structure diagram of the binding structure of the present invention;

fig. 4 is a first plane structure diagram of the binding structure of the present invention;

fig. 5 is a second plane structure diagram of the binding structure of the present invention;

fig. 6 is a schematic diagram of a second cross-sectional structure of the binding structure of the present invention.

Reference numerals:

1-first substrate, 2-metal lead, 3-first low conductive layer, 4-ACF film, 5-FPC, 6-conductive layer, 7-conductive particle, 8-slotted hole, 9-second low conductive layer.

Detailed Description

For clarity of description, the binding structure, the touch screen and the touch display screen provided by the present invention are described in detail below with reference to the drawings of the specification and the text description of the embodiments.

In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention.

In the description of the present invention, it is still to be understood that the touch screen refers to the electronic device with only touch function that does not include the display module, the display screen refers to the electronic device with only display function that does not include the touch module, the touch display screen is the existing touch function that includes both the touch module and the display module, and also has the electronic device with display function.

As shown in fig. 3, the utility model provides a binding structure of touch-sensitive screen or touch display screen includes by lower to upper in proper order: the circuit board comprises a substrate 1, a metal lead layer 2, a first low conductive layer 3, a conducting layer 6 and an FPC layer 5, wherein conductive particles 7 are arranged on the conducting layer 6. Binding structure's metal lead layer 2 and first low conducting layer 3 carry out the design of fluting hole, through the design of fluting hole for conducting particle 7 in the conducting layer 6 contacts with the side of metal lead layer 2 in the slotted hole 8, through the side electrical contact of metal lead layer 2 in conducting particle 7 and the slotted hole 8, simultaneously, conducting particle 7 also with FPC layer 5 electrical contact, realize touching IC, show that it has good electric conduction effect to show between IC and the touch module, the display module.

As shown in fig. 4 to 5, in an alternative scheme, the slot hole is a circular hole slot or a strip-shaped groove structure.

In a preferred scheme, the slotted hole is in a strip-shaped groove structure.

As shown in fig. 6, in other schemes, the utility model provides a binding structure includes from bottom to top in proper order: the circuit board comprises a substrate 1, a second low conductive layer 9, a metal lead layer 2, a first low conductive layer 3, a conducting layer 6 and an FPC layer 5. Namely, a low conductive layer is arranged on the upper layer and the lower layer adjacent to the metal lead layer 2. This has a better protective effect and/or optical matching effect on the metal lead layer 2.

The utility model also provides a touch-sensitive screen, display screen and touch display screen, touch-sensitive screen or display screen or touch display screen all contain above-mentioned binding structure.

The above is the present invention provides a preferred embodiment of binding structure, touch screen, display screen and touch display screen, which can not be understood as the limitation of the protection scope of the present invention, and those skilled in the art should know that, under the non-conflicting condition, the features in the above embodiments and embodiments herein can also be combined with each other, without departing from the concept of the present invention, various improvements or replacements can be made, all of which should be within the protection scope of the present invention, that is, the protection scope of the present invention should be subject to the claims.

Claims (10)

1. A binding structure sequentially comprises from bottom to top: the circuit board comprises a substrate (1), a metal lead layer (2), a first low conductive layer (3), a conducting layer (6) and an FPC layer (5), wherein conductive particles (7) are arranged on the conducting layer (6);

the metal lead layer (2) and the first low conductive layer (3) are designed to be provided with slotted holes, and through the slotted hole design, conductive particles (7) in the conductive layer (6) are in contact with the side faces of the metal lead layer (2) in the slotted holes (8), and meanwhile, the conductive particles (7) are also in electrical contact with the FPC layer (5).

2. The binding structure according to claim 1, wherein the ratio of the width or the radial length of the slot (8) to the diameter of the conductive particles is 0.5: 1-2: 1.

3. binding structure according to claim 1, characterised in that the slotted hole (8) is a circular hole slot or an elongated groove structure.

4. The binding structure according to claim 1, wherein the conductive particles (7) are spherical particles.

5. The binding structure according to claim 4, wherein the conductive particles (7) have a diameter of 100nm to 10 um.

6. The bonding structure according to claim 1, wherein a second low conductive layer (9) is further provided between the metal lead layer (2) and the substrate (1).

7. The bonding structure according to claim 6, wherein the first and second low conductive layers (3, 9) comprise a metal oxide or a metal nitride or a metal oxynitride.

8. A touch screen comprising a binding according to any one of claims 1-7.

9. A display screen comprising a binding according to any one of claims 1 to 7.

10. A touch screen display comprising a binding according to any one of claims 1 to 7.

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