CN112004312A - Printed circuit board and overcurrent upper limit adjustment method of printed circuit board - Google Patents

Abstract

The embodiment of the invention discloses a printed circuit board and an overcurrent upper limit adjustment method of the printed circuit board, and relates to the technical field of electronic components. Wherein, the method for adjusting the upper limit of overcurrent of the printed circuit board includes: acquiring the current overcurrent of the third metal body; adjusting the output of the DC power supply to the semiconductor module according to the current overcurrent of the third metal body to adjust the temperature of the first metal body, thereby adjusting the overcurrent upper limit of the third metal body, and the overcurrent upper limit of the third metal body is negatively correlated with the temperature of the first metal body . The present invention can adjust the overcurrent capability of the printed circuit board in real time according to the current overcurrent of the power supply line, thereby improving the overcurrent capability of the printed circuit board.

Description

Printed circuit board and overcurrent upper limit adjustment method of printed circuit board

technical field

The present invention relates to the technical field of electronic components, and more particularly, to a printed circuit board and an overcurrent upper limit adjustment method of the printed circuit board.

Background technique

With the continuous development of technology, the integration of smart devices has become higher and higher. For example, in new energy vehicles and smart cars, various functions are integrated into one or more printed circuit boards (Printed Circuit Board, PCB).

However, the integration of many functions on the printed circuit board will lead to an increase in the overcurrent on the printed circuit board, and the current overcurrent capability of the printed circuit board is often not sufficient to integrate multiple functions on the printed circuit board. Therefore, the current printed circuit board has the problem of insufficient overcurrent capability.

SUMMARY OF THE INVENTION

In view of the above problems, the present invention proposes a printed circuit board and an overcurrent upper limit adjustment method for the printed circuit board to solve the above problems.

An embodiment of the present invention provides a printed circuit board, the printed circuit board includes: a support layer, a first metal body, a second metal body, and a semiconductor module. Wherein, the support layer includes a first surface and a second surface opposite to the first surface; the first metal body is arranged on the first surface of the support layer; the second metal body is arranged on the second surface of the support layer; the semiconductor module is buried in the support layer and electrically connected to the first metal body and the second metal body respectively, when the semiconductor module forms an electrical circuit with the first metal body and the second metal body, the first metal body is under the action of the semiconductor module. The body cools down, and the second metal body heats up.

An embodiment of the present invention provides a method for adjusting the upper limit of overcurrent of a printed circuit board, which is applied to the printed circuit board provided by the above-mentioned embodiment, and the printed circuit board further includes a third metal body, and the third metal body is disposed on the support the first surface of the layer, and the third metal body is located in the temperature radiation area of the first metal body, the third metal body and the first metal body are insulated from each other, the semiconductor module is connected to the DC power supply through the second metal body, and the method includes : Obtain the current overcurrent of the third metal body; adjust the current value output by the DC power supply to the semiconductor module according to the current overcurrent of the third metal body to adjust the temperature of the first metal body, thereby adjusting the overcurrent of the third metal body The upper limit of the overcurrent of the third metal body is negatively correlated with the temperature of the first metal body.

In the printed circuit board provided by the embodiment of the present invention, a printed link board is formed by a support layer, a first metal body, a second metal body and a semiconductor module, wherein the support layer includes a first surface and a surface opposite to the first surface. the second surface; the first metal body is arranged on the first surface of the support layer; the second metal body is arranged on the second surface of the support layer; the semiconductor module is buried in the support layer, and is respectively connected with the first metal body and the second surface The metal body is electrically connected, and when the semiconductor module forms an electrical circuit with the first metal body and the second metal body, the first metal body cools down and the second metal body heats up under the action of the semiconductor module. If the power supply line is arranged near the first metal body of the printed circuit, the temperature around the power supply line on the printed circuit board can be reduced, thereby improving the overcurrent capability of the power supply line. Therefore, the temperature can be improved by cooling the first metal body. The overcurrent capability of the power supply circuit on the first surface of the printed circuit board solves the problem of insufficient overcurrent capability of the current printed circuit board.

The method for adjusting the overcurrent upper limit of the printed circuit board provided by the embodiment of the present invention obtains the current overcurrent of the third metal body; The temperature of the first metal body is adjusted to adjust the overcurrent upper limit of the third metal body, wherein the overcurrent upper limit of the third metal body is negatively correlated with the temperature of the first metal body. Therefore, the overcurrent upper limit of the third metal body can be adjusted in real time according to the current overcurrent of the third metal body, which can not only reduce the power consumption of the printed circuit board, but also improve the overcurrent capability of the printed circuit board.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings used in the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained from these drawings without creative effort.

FIG. 1 shows a schematic structural diagram of a printed circuit board provided according to an embodiment of the present invention.

FIG. 2 shows a schematic diagram of the distribution of a semiconductor module and a first metal body provided according to an embodiment of the present invention.

FIG. 3 shows a schematic structural diagram of a printed circuit board provided according to another embodiment of the present invention.

FIG. 4 shows a schematic diagram of the distribution of the first metal body and the third metal body provided according to an embodiment of the present invention.

FIG. 5 shows a flowchart of a method for adjusting an overcurrent upper limit of a printed circuit board according to an embodiment of the present invention.

FIG. 6 shows a flowchart of a method for adjusting an overcurrent upper limit of a printed circuit board according to another embodiment of the present invention.

FIG. 7 shows a flowchart of a method according to an embodiment of step S250 in the overcurrent upper limit adjustment method of the printed circuit board shown in FIG. 6 according to the present invention.

FIG. 8 shows a flowchart of a method for adjusting an overcurrent upper limit of a printed circuit board according to yet another embodiment of the present invention.

FIG. 9 shows a flowchart of a method for adjusting an overcurrent upper limit of a printed circuit board according to yet another embodiment of the present invention.

FIG. 10 shows a functional block diagram of an overcurrent upper limit adjusting device for a printed circuit board provided by an embodiment of the present invention.

FIG. 11 shows a structural block diagram of an electronic device provided by an embodiment of the present invention.

12 is a storage medium for storing or carrying a program code for implementing the method for adjusting the overcurrent upper limit of a printed circuit board according to an embodiment of the present invention.

Detailed ways

In order for those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

With the continuous development of smart car technology, more and more functions are integrated in the car, and the performance is also more and more powerful, resulting in the increasing power consumption of the car. In the past, if the car needs to increase the electric power, it is to increase the wire diameter of the power supply line for the corresponding electric components of the car, so that the overcurrent capability of the wire is improved. However, today's new energy vehicles and smart vehicles are not like traditional vehicles, because the functional equipment is scattered, so the problem of insufficient overcurrent capability can be solved by increasing the wire diameter of the power supply cable. The existing new energy vehicles and smart vehicles have a relatively high degree of integration, and the multi-functions will be integrated into one or more PCBs, and the PCB does not have enough space to increase the wire diameter of the power supply line, so the traditional power supply line is increased. The wire diameter does not solve the problem of insufficient overcurrent capability of the current PCB.

Generally speaking, to increase the overcurrent capability of the PCB, the line width of the power supply line can be increased or the copper thickness can be increased. The space for the line width of the large power supply line and the space available for increasing the copper thickness is not sufficient. Therefore, limited by hardware conditions, it is difficult for the PCB to improve the overcurrent capability of the power supply line through the above method.

The inventor found in practical research that the overcurrent capability of the PCB is usually represented by the formula I=kΔT ^0.44 A ^0.725 , where I is the overcurrent capability of the power supply line (hereinafter referred to as the power supply trace), and k is the coefficient of the power supply trace, △T is the allowable temperature difference between the temperature of the power supply trace on the PCB (hereinafter referred to as the upper limit of overcurrent) and the temperature of other parts of the PCB, and A is the cross-sectional area of the trace. Therefore, it can be seen that for the same width and copper thickness of the traces in the same PCB, the factor that affects the overcurrent capability of the traces is the allowable temperature difference between the traces on the PCB and other parts of the PCB. If the allowable temperature difference between the trace on the PCB and other parts of the PCB is increased, the overcurrent capability of the PCB can be improved without increasing the line width of the power supply circuit and the copper thickness on the PCB.

Therefore, in view of the above problems, the inventor proposes a printed circuit board and an overcurrent upper limit adjustment method for a printed circuit board in the embodiment of the present invention. By designing the structure of the printed circuit board, the printed circuit board can be dynamically changed. The temperature of the part other than the power supply line can increase the allowable temperature difference between the temperature of the power supply line on the PCB and other parts of the PCB, and improve the overcurrent capability of the power supply line.

Please refer to FIG. 1 , a printed circuit board provided by an embodiment of the present invention. The printed circuit board 100 includes a support layer 110 , a first metal body 120 , a second metal body 130 and a semiconductor module 140 . Wherein: the support layer 110 may have a first surface 111 and a second surface 112 opposite to the first surface 111 ; the first metal body 120 is disposed on the first surface 111 of the support layer 110 ; the second metal body 130 is disposed on the support layer 110 The semiconductor module 140 is buried in the support layer 110 and is electrically connected to the first metal body 120 and the second metal body 130 respectively. When the semiconductor module 140 is connected to the first metal body 120 and the second metal body 130 When the metal body 130 forms an electrical circuit, the temperature of the first metal body 120 and the temperature of the second metal body 130 are lowered under the action of the semiconductor module 140 .

In practical applications, the second metal body 130 can be connected to the DC power supply 150 to power on the semiconductor module 140 . When the semiconductor module 140 is powered on, the semiconductor module 140 , the first metal body 120 , the second metal body 130 and the The DC power source 150 can be energized to generate a Peltier effect, also known as a thermoelectric phenomenon. At this time, the temperature of one of the first metal body 120 and the second metal body 130 connected to the semiconductor module 140 will increase, and the temperature of the other metal body will decrease. Optionally, the first metal body may be The temperature of 120 decreases. When the power supply line is arranged on the first surface 111 of the printed circuit board 100, that is, when the power supply line and the first metal body 120 are on the same surface, it is equivalent to the part of the temperature of the printed circuit board 100 other than the power supply line. It can be seen from the above formula I=kΔT ^0.44 A ^0.725 that the allowable temperature difference ΔT between the temperature of the power supply line on the PCB and other parts of the PCB increases, and accordingly, the overcurrent capability of the power supply line will also improve. Therefore, the overcurrent capability of the PCB is effectively improved without increasing the line width of the power supply line on the PCB and the copper thickness of the PCB.

It can be seen that in this embodiment, the printed link board is formed by the support layer 110 , the first metal body 120 , the second metal body 130 and the semiconductor module 140 , wherein the support layer 110 includes the first surface 111 and the first surface 111 and the first surface 111 . The second surface 112 opposite the surface 111; the first metal body 120 is disposed on the first surface 111 of the support layer 110; the second metal body 130 is disposed on the second surface 112 of the support layer 110; the semiconductor module 140 is buried in the support layer 110, and are electrically connected to the first metal body 120 and the second metal body 130 respectively. When the semiconductor module 140 forms an electrical circuit with the first metal body 120 and the second metal body 130, the function of the semiconductor module 140 is The lower first metal body 120 is cooled down, and the second metal body 130 is heated up. If the power supply line is arranged near the first metal body 120 of the printed circuit, the temperature around the power supply line on the printed circuit board 100 can be lowered, thereby improving the overcurrent capability of the power supply line. The temperature is lowered to improve the overcurrent capability of the power supply circuit of the printed circuit board 100 on the first surface 111 , which solves the problem of insufficient overcurrent capability of the current printed circuit board 100 , and improves the safety of the printed circuit board 100 during operation. sex.

Optionally, the first metal body 120 and the second metal body 130 may be one or more conductive traces on the printed circuit board 100, or may be conductive metal layers covering the printed circuit board 100, wherein, The number and shape of the conductive metal layers are not limited herein.

It can be understood that when the power supply line is arranged on the first surface 111, the power supply line and the first metal body 120 are insulated from each other. Specifically, the power supply line and the first metal body 120 may be separated by a certain distance, or may be isolated by an insulating material. .

It should be noted that, in a known physical phenomenon, two different connection points will be generated when a direct current is passed through a closed circuit formed by connecting two different metal wires to each other. As long as direct current is applied, one of the junctions will become hot and the other junction will be cold. This is the Peltier effect.

Wherein, the semiconductor module 140 may be used to cause the first metal body 120 and the second metal body 130 to generate a Peltier effect when forming an electrical circuit with the first metal body 120 , the second metal body 130 , and the DC power source 150 . Specifically, the semiconductor module 140 may be a semiconductor pair formed by a P-type semiconductor 141 and an N-type semiconductor 142, or may be a semiconductor material that can be used to generate a temperature difference.

Optionally, the first metal body 120 and the second metal body 130 may be the same metal material, or may be different metal materials, specifically, the first metal body 120 and the second metal body 130 include but are not limited to: copper , aluminum and other metal materials, specifically copper foil can be used. Optionally, the first metal body 120 and the second metal body 130 may be symmetrically disposed with respect to the support layer 110 .

Optionally, the support layer 110 may be made of polypropylene (PP) material, and may be composed of epoxy resin, which mainly functions to provide support for the PCB and determine the thickness of the PCB.

1 again, the second metal body 130 may include: a first sub-metal body 131 and a second sub-metal body 132 , both of which are disposed on the support layer 110 . The second surface 112, and the first sub-metal body 131 and the second sub-metal body 132 are insulated from each other, wherein the first sub-metal body 131 is used for connecting with the negative electrode of the DC power supply 150, and the second sub-metal body 132 is used for connecting with the DC The positive pole of the power supply 150 is connected.

In some embodiments, the first sub-metal body 131 and the second sub-metal body 132 may be spaced apart by a certain distance, and may also be electrically isolated by insulating materials. Optionally, the first metal body 120 and the second metal body 130 may be the same metal material or different metal materials. Specifically, the first metal sub-body 131 and the second metal sub-body 132 include but are not limited to : Copper, aluminum and other metal materials.

Optionally, the first sub-metal body 131 and the second sub-metal body 132 may be metal traces on the printed circuit board 100 . The first sub metal body 131 and the second sub metal body 132 may be symmetrical with a portion of the first metal body 120 with respect to the support layer 110 .

The semiconductor module 140 includes a P-type semiconductor 141 (Bi2Te3-Sb2Te3) and an N-type semiconductor 142 (Bi2Te3-Bi2Se3). Both the P-type semiconductor 141 and the N-type semiconductor 142 are buried in the support layer 110, and the P-type semiconductor 141 respectively The N-type semiconductor 142 is electrically connected to the first sub-metal body 131 and the first metal body 120, and the N-type semiconductor 142 is electrically connected to the second sub-metal body 132 and the first metal body 120, respectively.

The method of burying the P-type semiconductor 141 and the N-type semiconductor 142 in the support layer 110 may refer to the current methods of burying capacitors and resistors in the PCB.

In practical applications, when the first sub-metal body 131 is connected to the negative electrode of the DC power source 150 and the second sub-metal body 132 is connected to the positive electrode of the DC power source 150 , the current generated by the DC power source 150 passes through the second sub-metal body 132 in sequence. , N-type semiconductor 142 , first metal body 120 , P-type semiconductor 141 and first sub-metal body 131 , due to the existence of energy level difference between the two materials in which charge carriers move, that is, thermoelectric potential difference, current passes through N-type semiconductor 142 and P The type semiconductor 141 will create a temperature difference between the first metal body 120 and the second metal body 130. Specifically, the first metal body 120 will absorb heat to produce a cooling effect, and the second metal body 130 will emit heat to produce a heating effect. At this time, the surface on which the first metal body 120 is located on the PCB can be used as the cold end, and the surface where the second metal body 130 is located can be used as the hot end. The temperature of the other parts is reduced, and the temperature that the power supply line is allowed to reach on the PCB is fixed, and the allowable temperature difference ΔT between the temperature of the power supply line on the PCB and other parts of the PCB increases, thereby improving the overcurrent capability I of the power supply line. .

As an example, when the ambient temperature is 20°C, the temperature of the entire PCB should also be approximately 20°C. If the allowable temperature rise of the power supply line is 10°C, the maximum allowable temperature of the power supply line is 30°C. Since the temperature difference of common thermoelectric cooling chips can be over 80°C, the temperature difference between the cold end and the hot end of the PCB board in this embodiment can also be over 80°C. If the temperature of the hot end is controlled at 50°C by means of heat conduction through metal heat sinks, air cooling or water cooling, the temperature of the PCB traces at the cold end (ie, the first metal body 120 ) is 80°C lower than 50°C. , is -30°C. Using the PCB structure of this embodiment, the temperature of the PCB trace is reduced to -30°C. If the allowable temperature of the power supply line is still 10°C higher than the original temperature of the other PCBs, the temperature rise of this section of the trace is 30°C-( -30°C) = 60°C. According to the formula, it can be calculated that when the solution of this embodiment is not used, the overcurrent capability of the PCB is 2.754, and when the solution of this embodiment is used, the overcurrent capability of the PCB is 6.059, so the same PCB, the same line width and copper thickness, the overcurrent capability of the PCB using this embodiment is more than twice that of the conventional PCB not using it.

In this embodiment, the semiconductor module 140 is formed by the P-type semiconductor 141 and the N-type semiconductor 142 , which can generate a large temperature difference effect when the semiconductor module 140 is energized, so that the printed circuit board 100 can be improved more effectively. In addition, both the P-type semiconductor 141 and the N-type semiconductor 142 are conventional devices in the electronics industry, which are easy to purchase, have low cost, and are easy to manufacture and popularize.

In some embodiments, the first metal body 120 is disposed on the first surface 111 of the support layer 110 according to the predetermined wiring, the number of the semiconductor modules 140 is multiple, and the plurality of semiconductor modules 140 are evenly distributed along the predetermined wiring .

As an example, as shown in FIG. 2 , the first metal body 120 may be disposed on the support layer 110 according to the wiring method in FIG. The distance between every two adjacent semiconductor modules 140 in the modules 140 is equal, for example, the first semiconductor module 1401 , the second semiconductor module 1402 , the third semiconductor module 1402 , the third semiconductor module 1402 and the third Semiconductor module 1403 . The distance between the first semiconductor module 1401 and the second semiconductor module 1402 is d, and the distance between the second semiconductor module 1402 and the third semiconductor module 1403 is also d. Optionally, a plurality of semiconductor modules 140 may share a single DC power supply 150 , or each semiconductor module 140 may use a single DC power supply 150 , and the current passing through each semiconductor module 140 of the plurality of semiconductor modules 140 is equal. .

In the present embodiment, by arranging the first metal body 120 on the first surface 111 of the support layer 110 according to the predetermined wiring, the number of the semiconductor modules 140 is multiple, and the plurality of semiconductor modules 140 are arranged along the predetermined wiring Evenly distributed, so that when the plurality of semiconductor modules 140 are energized, the cooling effect of each position of the first metal body 120 is consistent, and the temperature of each position of the first metal body 120 is ensured to be equal, and the whole of the printed circuit board 100 is further improved. overcurrent capability.

In some embodiments, the first metal body 120 may include a first cooling area and a second cooling area, wherein the first cooling area is provided with a first number of semiconductor modules 140 correspondingly, and the second cooling area is correspondingly provided with a second cooling area The number of semiconductor modules 140, wherein the first number is greater than the second number.

As an example, an area of the first metal body 120 on the support layer 110 with relatively dense wiring may be used as the first cooling area, and the area of the first metal body 120 other than the first cooling area may be used as the second cooling area. Specifically, a plurality of traces of the first metal body 120 may be arranged on the first metal body 120 , the intersection A of the multiple traces may be used as the first cooling area, and the part other than the first cooling area may be used as the second cooling area . Optionally, the first cooling area and the second cooling area on the first metal body 120 can be customized according to actual conditions. Optionally, a third cooling area, a fourth cooling area..., an Nth cooling area, etc. can also be set according to actual conditions, wherein the The number of semiconductor modules 140 corresponding to the N cooling regions can be gradually reduced.

In this embodiment, the first metal body 120 includes a first cooling area and a second cooling area, wherein the first cooling area is provided with a first number of semiconductor modules 140 correspondingly, and the second cooling area is correspondingly provided with a first cooling area. There are two semiconductor modules 140 , wherein the first number is greater than the second number, so that the position on the first metal body 120 that needs to be reduced in temperature can be effectively cooled, thereby effectively improving the overcurrent capability of the printed circuit board 100 .

In some embodiments, the printed circuit board 100 may further include:

A temperature sensor, the temperature sensor can be arranged on the first metal body 120 and the second metal body 130 respectively, to monitor the temperature of the first metal body 120 and the temperature of the second metal body 130 in real time, so as to facilitate according to the temperature of the first metal body 120 The temperature and the temperature of the second metal body 130 adjust the current output by the DC power supply 150 to the semiconductor module 140 to accurately improve the overcurrent capability of the printed circuit board 100 .

In some embodiments, the printed circuit board 100 may further include:

The heat dissipation device is disposed on the second metal body 130 to dissipate heat from the second metal body 130 .

Optionally, the heat dissipation device may include a heat dissipation fan, a cooling liquid heat dissipation device, a thermally conductive metal, and the like. Optionally, the heat dissipation device may be in contact with the second metal body 130 to achieve heat dissipation, or may not be in contact with the second metal body 130 , as long as the second metal body 130 can be dissipated.

In this embodiment, by disposing a heat sink on the second metal body 130 , the heat generated by the second metal body 130 can be effectively dissipated, so as to reduce the temperature of the second metal body 130 and ensure the operation of the printed circuit board 100 At the same time, the overcurrent capability of the printed circuit board 100 is improved.

The following is an introduction to the application environment of the overcurrent upper limit adjustment method of the printed circuit board provided by the implementation of the present invention:

The method for adjusting the upper limit of overcurrent of a printed circuit board provided by the implementation of the present invention can be applied to the printed circuit board of the above-mentioned embodiment, and the printed circuit board can include a support layer 110 , a first metal body 120 , a second metal body 130 and The semiconductor module 140, wherein the specific description about the support layer 110, the first metal body 120, the second metal body 130 and the semiconductor module 140 can refer to the above-mentioned embodiment, as shown in FIG. 3 and FIG. 4, the printed circuit The board 100 may further include a third metal body 160, a DC power supply 150, a temperature sensor (not shown in FIG. 3), and a controller 170, the third metal body 160 may be equivalent to the power supply line in the above-mentioned embodiment, the third metal The body 160 is disposed on the first surface 111 of the support layer 110, and the third metal body 160 is located in the temperature radiation area of the first metal body 120, the third metal body 160 and the first metal body 120 are insulated from each other, and the semiconductor module 140 passes through The second metal body 130 is connected to the DC power source 150 . The temperature sensors may be respectively disposed on the first metal body 120 , the second metal body 130 , and the third metal body 160 to detect the temperature of the first metal body 120 , the second metal body 130 and the third metal body 160 in real time. temperature. The controller 170 may be electrically connected to the DC power supply 150 and the temperature sensor, respectively, and may be used to process the temperature collected by the temperature sensor, and to adjust the magnitude of the current output by the DC power supply 150, and so on. The overcurrent upper limit adjustment method of the printed circuit board 100 provided by the implementation of the present invention can be specifically applied to the controller 170 in the printed circuit board 100 .

Referring to FIG. 5, a method for adjusting the upper limit of overcurrent of a printed circuit board provided by the implementation of the present invention includes:

S110, acquiring the current overcurrent of the third metal body.

In some embodiments, the third metal body is used as a power supply trace on the printed circuit board, and can be connected to the load device on the printed circuit board. When the load device is working, the working current of the load device can be detected, and the working current of the load device can be detected. The current is used as the current overcurrent of the third metal body, thereby obtaining the current overcurrent of the third metal body.

In other embodiments, a current detection device may be provided on the third metal body, the current detection device may be electrically connected to the controller, and the controller may obtain the current overcurrent of the third metal body in real time through the current detection device.

S120 , adjust the current value output by the DC power supply to the semiconductor module according to the current overcurrent of the third metal body, so as to adjust the temperature of the first metal body, thereby adjusting the overcurrent upper limit of the third metal body and the overcurrent of the third metal body The upper limit is inversely related to the temperature of the first metal body.

In some embodiments, the controller may detect whether the current overcurrent exceeds a specification, eg, whether the current overcurrent exceeds 50% of the rated current of the load device. If it does not exceed the standard, it means that the overcurrent of the third metal body is within the normal range and will not affect the normal operation. At this time, the controller does not need to control the output current of the DC power supply to the semiconductor module. If it exceeds the standard, it means that the overcurrent of the third metal body exceeds the normal range, which may cause damage to the device or printed circuit board. At this time, the controller can control the DC power supply to output current to the semiconductor module, and the semiconductor module is powered on. The Peltier effect is generated under the lower temperature, so as to reduce the temperature of the first metal body, thereby increasing the overcurrent upper limit of the third metal body, thereby improving the overcurrent capability of the printed circuit board.

It can be seen that in this embodiment, the current value of the DC power supply output to the semiconductor module is adjusted according to the current overcurrent of the third metal body by acquiring the current overcurrent of the third metal body, so as to adjust the temperature of the first metal body, thereby Adjust the upper limit of the overcurrent of the third metal body, so that the upper limit of the overcurrent of the third metal body can be adjusted in real time according to the current overcurrent of the third metal body, which avoids unnecessary waste of electricity caused by turning on the DC power supply all the time, not only can reduce the printing The power consumption of the printed circuit board is reduced, and the overcurrent capability of the printed circuit board is improved.

In some embodiments, the printed circuit board and the overcurrent upper limit adjustment method of the printed circuit board of the above-mentioned embodiments can be applied to a vehicle.

Referring to FIG. 6, another method for adjusting the upper limit of overcurrent of a printed circuit board provided by the implementation of the present invention can be applied to the printed circuit board in the above-mentioned embodiment, and the method can include:

S210, acquiring the current overcurrent of the third metal body.

The specific implementation of S210 can refer to S110, so it is not repeated here.

S220, judging whether the current overcurrent of the third metal body exceeds a current threshold.

In some embodiments, the controller is also connected to a memory, the current threshold and other data can be stored in the memory in advance, the controller can call the current threshold from the memory, and then compare the collected current overcurrent with the current threshold to determine the current overcurrent. Whether the current exceeds the current threshold.

Optionally, the current threshold may be determined according to the material of the third metal body. Different materials have different overcurrent capabilities when energized. For example, a material with better overcurrent capability may have a higher current threshold. Optionally, the current threshold can be adjusted according to the current temperature value of the third metal body. Generally, the lower the temperature of the third metal body, the larger the current that can pass through. Therefore, when the temperature of the third metal body is lower, it can be Adjust the current threshold higher. Optionally, the current threshold may be determined in combination with the material of the third metal body and the current temperature of the third metal body.

S230 , if the current overcurrent of the third metal body does not exceed the current threshold, adjust the current value output from the DC power source to the semiconductor module to 0.

As an example, for example, the current threshold is 1.6A, and the current overcurrent of the third metal body is 1.4A. At this time, the third metal body does not need to improve the overcurrent capability to ensure the normal operation of the PCB, so the controller can use the DC power supply to The current value output to the semiconductor module is adjusted to 0. Among them, if the DC power supply has no output current, the controller can do nothing. If the DC power supply is outputting current, the controller can control the DC power supply to adjust the current output to the semiconductor module to 0, that is, to turn off the DC power supply.

S240 , if the current overcurrent of the third metal body exceeds the current threshold, obtain the target overcurrent upper limit of the third metal body and the current temperature of the first metal body.

As an example, for example, the current threshold is 1.6A, and the current overcurrent of the third metal body is 2A. At this time, the third metal body needs to improve the overcurrent capability to ensure the normal operation of the PCB. Otherwise, the PCB may be damaged. , the controller can acquire the target overcurrent upper limit of the third metal body and the current temperature of the first metal body.

Wherein, the controller may collect the current temperature of the first metal body through a temperature sensor disposed on the first metal body. The target overcurrent upper limit can be pre-stored in the memory, and the controller can call it from the memory, wherein the target overcurrent upper limit can be customized, but the target overcurrent upper limit cannot exceed the maximum overcurrent corresponding to the material of the third metal body.

S250: Determine the allowable temperature difference of the third metal body according to the target overcurrent upper limit of the third metal body, where the allowable temperature difference of the third metal body is the difference between the temperature upper limit of the third metal body and the temperature of the first metal body.

The upper temperature limit of the third metal body can be pre-stored in the memory, and the controller can call it from the memory. Since different metal materials have different upper temperature limits, the temperature can be pre-determined according to the material of the third metal body upper limit.

It can be understood that the target overcurrent upper limit of the third metal body must not exceed the temperature upper limit of the third metal body.

In some embodiments, as shown in FIG. 7 , S250 may include the following steps:

S251 , acquiring the cross-sectional area of the third metal body and the material coefficient of the third metal body.

In some embodiments, both the cross-sectional area of the third metal body and the material coefficient of the third metal body can be queried in advance and stored in the memory, and the controller can call from the memory when needed.

S252, determine the allowable temperature difference of the third metal body based on the cross-sectional area of the third metal body, the material coefficient of the third metal body, the target overcurrent upper limit of the third metal body, and the formula I=kΔT ^0.44 A ^0.725 , where A is the cross-sectional area of the third metal body, k is the material coefficient of the third metal body, I is the target overcurrent upper limit of the third metal body, and ΔT is the allowable temperature difference of the third metal body.

Specifically, the cross-sectional area A of the third metal body obtained in S251, the material coefficient k of the third metal body, and the target overcurrent upper limit I of the third metal body obtained in S240 can be brought into the formula I=kΔT ^0.44 A ^0.725 , thereby obtaining the allowable temperature difference ΔT of the third metal body.

S260, determining a target temperature of the first metal body based on the allowable temperature difference of the third metal body and the current temperature of the first metal body.

Following the above example, by subtracting the allowable temperature difference ΔT from the upper temperature limit of the third metal body, the target temperature to which the first metal body needs to be adjusted can be obtained. As an example, for example, the allowable temperature difference ΔT is 50°C, and the upper limit of the temperature of the third metal body is 60°C, then the target temperature to which the first metal body needs to be adjusted is 10°C.

S270 , acquiring a target current value corresponding to the target temperature, and adjusting the current value output by the DC power source to the semiconductor module to the target current value.

In some embodiments, a mapping relationship table between temperature values and current values may be established in advance, wherein the mapping relationship table may be obtained through a one-to-one mapping relationship between multiple temperature values and multiple current values, and then based on the target temperature and The mapping relationship table finds out the target current value corresponding to the target temperature. As an example, as shown in Table 1:

Table 1

Temperature value (℃) Current value (A) A1 B1 A2 B2 A3 B3

It can be known from Table 1 that when the target temperature is A2, it can be found from Table 1 that the corresponding target current value is B2. By analogy, by looking up Table 1, the corresponding target current value can be quickly and effectively found according to the target temperature. Wherein, the PCB can perform a corresponding test of the temperature of the first metal body and the current value output by the DC power supply to the semiconductor module in advance, and then generate a mapping table according to the test data.

Wherein, optionally, the mapping relationship table may be stored in a memory connected to the controller, so that the controller can call directly. It can also be stored in the cloud server connected to the controller. When the controller needs to use it, it can be obtained from the cloud server through the wireless communication module connected to the controller.

In this embodiment, whether to turn on the DC power supply is determined by judging whether the current overcurrent of the third metal body exceeds the current threshold, and the current flowing into the semiconductor module is adjusted in real time according to the current overcurrent of the third metal body. Therefore, if the third metal body does not need to pass current (such as when the load is turned off), the current flowing through the semiconductor module can be turned off, and the effect of energy saving can be achieved; when the current flowing through the third metal body is small (such as The current overcurrent capability can be met without cooling), and the current flowing through the semiconductor module can be turned off, which can achieve the effect of energy saving; when the current flowing through the third metal body is too large, it can be dynamically adjusted according to the temperature value of the temperature sensor. Adjusting the current flowing through the semiconductor pair can achieve the effect of ensuring the overcurrent capability of the third metal body with minimum energy consumption.

Referring to FIG. 8 , another method for adjusting the overcurrent upper limit of a printed circuit board provided by the implementation of the present invention can be applied to the printed circuit board in the above-mentioned embodiment, and the printed circuit board further includes an alarm device, wherein, The alarm device may be connected to the controller, and the method may include:

S310, acquiring the current overcurrent of the third metal body.

The specific implementation of S310 can refer to S110, so it is not repeated here.

S320, if the current overcurrent of the third metal body exceeds the preset current value, an alarm is performed by an alarm device.

The controller may determine whether the current overcurrent exceeds a preset current value, wherein the preset current value may be greater than the current threshold in the above embodiment, but not exceeding the current upper limit of the third metal body. If the current overcurrent of the third metal body exceeds the preset current value, the controller may send an alarm instruction to the alarm device to instruct the alarm device to alarm. Wherein, the alarm device may be an acousto-optic alarm device, or a wireless communication device, so as to send alarm information to the user's mobile terminal when an alarm command is received.

In this embodiment, by acquiring the current overcurrent of the third metal body, if the current overcurrent of the third metal body exceeds a preset current value, an alarm is issued by an alarm device. It can effectively remind the user that the work of the printed circuit board is abnormal and needs to be dealt with in time, which ensures the safety of the printed circuit board during operation and reduces the damage probability of the printed circuit board.

Please refer to FIG. 9 , another method for adjusting the overcurrent upper limit of a printed circuit board provided by the implementation of the present invention can be applied to the printed circuit board in the above-mentioned embodiment. The printed circuit board further includes a third metal body a connected load, the load may be connected to the controller, the method may include:

S410, acquiring the current overcurrent of the third metal body.

The specific implementation of S410 can refer to S110, so it is not repeated here.

S420, if the current overcurrent of the third metal body exceeds the preset current value, turn off the load, or reduce the working current value of the load.

In some embodiments, the controller may determine whether the current overcurrent exceeds the preset current value, and if the current overcurrent does not exceed the preset current value, the controller may not perform any processing. If the current overcurrent exceeds the preset current value, the controller can control the load to turn off the load or reduce the working current value of the load to avoid damage to the printed circuit board due to excessive current.

In this embodiment, by acquiring the current overcurrent of the third metal body, if the current overcurrent of the third metal body exceeds the preset current value, the load is turned off, or the working current value of the load is reduced, so as to ensure the printed circuit Safety while the board is working.

Please refer to FIG. 10, which shows an overcurrent upper limit adjustment device for a printed circuit board provided by an embodiment of the present invention, which can be applied to the printed circuit board of the above-mentioned embodiment, and the printed circuit board further includes a third metal body , the third metal body is arranged on the first surface of the support layer, and the third metal body is located in the temperature radiation area of the first metal body, the third metal body and the first metal body are insulated from each other, and the semiconductor module passes through the second metal body Connected with the DC power supply, the overcurrent upper limit adjustment device 500 of the printed circuit board includes:

The current overcurrent acquisition module 510 is configured to acquire the current overcurrent of the third metal body.

The adjustment module 520 is used to adjust the current value output by the DC power supply to the semiconductor module according to the current overcurrent of the third metal body, so as to adjust the temperature of the first metal body, thereby adjusting the overcurrent upper limit of the third metal body, and the third metal body The upper limit of the overcurrent of the body is inversely related to the temperature of the first metal body.

Optionally, the adjustment module 520 includes:

The first adjusting unit is configured to adjust the current value output by the DC power source to the semiconductor module to 0 if the current overcurrent of the third metal body does not exceed the current threshold value.

Optionally, the adjustment module 520 includes:

The data acquisition unit is configured to acquire the target overcurrent upper limit of the third metal body and the current temperature of the first metal body if the current overcurrent of the third metal body exceeds the current threshold.

The allowable temperature difference determination unit is configured to determine the allowable temperature difference of the third metal body according to the target overcurrent upper limit of the third metal body, wherein the allowable temperature difference of the third metal body is the temperature upper limit of the third metal body and the temperature of the first metal body difference between.

The target temperature determination unit is configured to determine the target temperature of the first metal body based on the allowable temperature difference of the third metal body and the current temperature of the first metal body.

The second adjusting unit is configured to obtain a target current value corresponding to the target temperature, and adjust the current value output by the DC power supply to the semiconductor module to the target current value.

Optionally, the allowable temperature difference determination unit is specifically configured to obtain the cross-sectional area of the third metal body and the material coefficient of the third metal body; based on the cross-sectional area of the third metal body, the material coefficient of the third metal body, the third The target overcurrent upper limit of the metal body and the formula I=kΔT ^0.44 A ^0.725 determine the allowable temperature difference of the third metal body, where A is the cross-sectional area of the third metal body, k is the material coefficient of the third metal body, and I is The target overcurrent upper limit of the third metal body, ΔT is the allowable temperature difference of the third metal body.

Optionally, the printed circuit board further includes an alarm device, and the overcurrent upper limit adjustment device of the printed circuit board further includes:

The alarm module is used for alarming through the alarm device if the current overcurrent of the third metal body exceeds the preset current value.

Optionally, the printed circuit board further includes a load connected to the third metal body, and the overcurrent upper limit adjustment device of the printed circuit board further includes:

The load adjustment module is used for turning off the load or reducing the working current value of the load if the current overcurrent of the third metal body exceeds the preset current value.

Those skilled in the art can clearly understand that, for the convenience and brevity of description, for the specific working process of the above-described devices and modules, reference may be made to the corresponding processes in the foregoing method embodiments, which will not be repeated here.

In several embodiments provided by the present invention, the coupling or direct coupling or communication connection between the modules shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or modules may be electrical, mechanical or otherwise.

In addition, each functional module in each embodiment of the present invention may be integrated into one processing module, or each module may exist physically alone, or two or more modules may be integrated into one module. The above-mentioned integrated modules can be implemented in the form of hardware, and can also be implemented in the form of software function modules.

Please refer to FIG. 11 , which shows a structural block diagram of an electronic device provided by an embodiment of the present invention. The electronic device 600 may be the electronic device 600 capable of running the program in the foregoing embodiments. The electronic device 600 in the present invention may include one or more of the following components: a processor 610, a memory 620, and one or more programs, wherein the one or more programs may be stored in the memory 620 and configured to be executed by one or more A plurality of processors 610 execute, and one or more programs are configured to execute the methods described in the foregoing method embodiments.

Processor 610 may include one or more processing cores. The processor 610 uses various interfaces and lines to connect various parts of the entire electronic device 600, and executes by running or executing the instructions, programs, code sets or instruction sets stored in the memory 620, and calling the data stored in the memory 620. Various functions of the electronic device 600 and processing data. Optionally, the processor 610 may employ at least one of digital signal processing (Digital Signal Processing, DSP), field-programmable gate array (Field-Programmable Gate Array, FPGA), and programmable logic array (Programmable Logic Array, PLA). implemented in hardware. The processor 610 may integrate one or a combination of a central processing unit (Central Processing Unit, CPU), a graphics processing unit (Graphics Processing Unit, GPU), a modem, and the like. Among them, the CPU mainly handles the operating system, user interface and application programs, etc.; the GPU is used for rendering and drawing of the display content; the modem is used to handle wireless communication. It can be understood that, the above-mentioned modem may not be integrated into the processor 610, and is implemented by a communication chip alone.

The processor 610 may be the controller 170 in the printed circuit board as shown in FIG. 3 .

The memory 620 may include random access memory (Random Access Memory, RAM), or may include read-only memory (Read-Only Memory). Memory 620 may be used to store instructions, programs, codes, sets of codes, or sets of instructions. The memory 620 may include a stored program area and a stored data area, wherein the stored program area may store instructions for implementing the operating system, instructions for implementing at least one function (such as a touch function, a sound playback function, an image playback function, etc., shooting function), instructions for implementing the following method embodiments, and the like. The storage data area can also store data created by the terminal during use (such as phone book, audio and video data, map data, driving record data) and the like.

Optionally, the electronic device 600 may be an in-vehicle terminal, an in-vehicle computer, or the like.

Please refer to FIG. 12 , which shows a structural block diagram of a computer-readable storage medium provided by an embodiment of the present invention. The computer-readable medium 700 stores program code 710, and the program code 710 can be invoked by the processor to execute the method described in the above method embodiments.

The computer readable storage medium 700 may be an electronic memory such as flash memory, EEPROM (Electrically Erasable Programmable Read Only Memory), EPROM, hard disk, or ROM. Optionally, the computer-readable storage medium includes a non-transitory computer-readable storage medium. A computer-readable storage medium has storage space for program code to perform any of the method steps in the above-described methods. These program codes can be read from or written to one or more computer program products. The program code may, for example, be compressed in a suitable form.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand: it can still be The technical solutions described in the foregoing embodiments are modified, or some technical features thereof are equivalently replaced; and these modifications or replacements do not drive the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. A printed circuit board, characterized in that, comprising: a support layer, including a first surface and a second surface opposite to the first surface; a first metal body, the first metal body is disposed on the first surface of the support layer; a second metal body disposed on the second surface of the support layer; and A semiconductor module, the semiconductor module is buried in the support layer, and is electrically connected to the first metal body and the second metal body, respectively, when the semiconductor module is connected to the first metal body and the second metal body. When the second metal body forms an electrical circuit, the first metal body is cooled down and the second metal body is heated up under the action of the semiconductor module. 2. The printed circuit board according to claim 1, wherein the second metal body comprises a first sub-metal body and a second sub-metal body, the first sub-metal body and the second sub-metal body The metal bodies are all arranged on the second surface of the support layer, and the first sub-metal body and the second sub-metal body are insulated from each other, wherein the first sub-metal body is used for connecting with the negative electrode of the DC power supply , the second sub-metal body is used for connecting with the positive pole of the DC power supply; The semiconductor module includes a P-type semiconductor and an N-type semiconductor, the P-type semiconductor and the N-type semiconductor are both buried in the support layer, and the P-type semiconductor is connected to the first sub-metal body and the first sub-metal body, respectively. The first metal body is electrically connected, and the N-type semiconductor is electrically connected to the second sub-metal body and the first metal body, respectively. 3 . The printed circuit board according to claim 1 , wherein the first metal body is arranged on the first surface of the support layer according to a preset wiring, and the number of the semiconductor modules is multiple. 4 . , a plurality of the semiconductor modules are evenly distributed along the preset wiring. 4. The printed circuit board according to any one of claims 1 to 3, further comprising: A heat dissipation device, the heat dissipation device is arranged on the second metal body, and is used for heat dissipation of the second metal body. 5. A method for adjusting the upper limit of overcurrent of a printed circuit board, wherein, when applied to the printed circuit board according to any one of claims 1 to 4, the printed circuit board further comprises a third metal body , the third metal body is arranged on the first surface of the support layer, and the third metal body is located in the temperature radiation area of the first metal body, the third metal body and the first metal body The bodies are insulated from each other, the semiconductor module is connected to a DC power source through the second metal body, and the method includes: obtaining the current overcurrent of the third metal body; According to the current overcurrent of the third metal body, the current value output by the DC power supply to the semiconductor module is adjusted to adjust the temperature of the first metal body, thereby adjusting the upper limit of the overcurrent of the third metal body , the overcurrent upper limit of the third metal body is negatively correlated with the temperature of the first metal body. 6 . The method according to claim 5 , wherein the adjusting the current value output by the DC power supply to the semiconductor module according to the current overcurrent of the third metal body comprises: 6 . If the current overcurrent of the third metal body does not exceed the current threshold, the current value output from the DC power source to the semiconductor module is adjusted to 0. 7 . The method according to claim 6 , wherein the adjusting the current value output by the DC power supply to the semiconductor module according to the current overcurrent of the third metal body comprises: 8 . If the current overcurrent of the third metal body exceeds the current threshold, acquiring the target overcurrent upper limit of the third metal body and the current temperature of the first metal body; The allowable temperature difference of the third metal body is determined according to the target overcurrent upper limit of the third metal body, wherein the allowable temperature difference of the third metal body is the temperature upper limit of the third metal body and the first metal body The difference between the temperature of the body; determining a target temperature of the first metal body based on the allowable temperature difference of the third metal body and the current temperature of the first metal body; A target current value corresponding to the target temperature is acquired, and the current value output by the DC power supply to the semiconductor module is adjusted to the target current value. The method according to claim 7, wherein the determining the allowable temperature difference of the third metal body according to the target overcurrent upper limit of the third metal body comprises: obtaining the cross-sectional area of the third metal body and the material coefficient of the third metal body; The third metal body is determined based on the cross-sectional area of the third metal body, the material coefficient of the third metal body, the target overcurrent upper limit of the third metal body, and the formula I=kΔT ^0.44 A ^0.725 Allowable temperature difference, where A is the cross-sectional area of the third metal body, k is the material coefficient of the third metal body, I is the target overcurrent upper limit of the third metal body, ΔT is the first The allowable temperature difference of the three metal bodies. 9. The method according to any one of claims 5 to 8, wherein the printed circuit board further comprises an alarm device, and the method further comprises: If the current overcurrent of the third metal body exceeds the preset current value, the alarming device will give an alarm. 10. The method of claim 9, wherein the printed circuit board further comprises a load connected to the third metal body, the method further comprising: If the current overcurrent of the third metal body exceeds the preset current value, the load is turned off, or the working current value of the load is reduced.

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