CN111970849A - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN111970849A CN111970849A CN201910420297.XA CN201910420297A CN111970849A CN 111970849 A CN111970849 A CN 111970849A CN 201910420297 A CN201910420297 A CN 201910420297A CN 111970849 A CN111970849 A CN 111970849A
- Authority
- CN
- China
- Prior art keywords
- layer
- conductive
- solder mask
- circuit board
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 229910000679 solder Inorganic materials 0.000 claims abstract description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000011889 copper foil Substances 0.000 claims abstract description 22
- 239000007788 liquid Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 238000004132 cross linking Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000005286 illumination Methods 0.000 claims 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- -1 Polyethylene terephthalate Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
A circuit board manufacturing method comprises the following steps: providing a copper-clad unit, wherein the copper-clad unit comprises a base layer and at least one copper foil layer positioned on the base layer; manufacturing the copper foil layer to form a conductive circuit layer, wherein the conductive circuit layer comprises at least one connecting pad; forming a solder mask layer on the conductive circuit layer, wherein the solder mask layer comprises at least one window, and the at least one window exposes the at least one connecting pad; and forming a conductive bump on at least one of the connection pads. The invention also provides a circuit board.
Description
Technical Field
The invention relates to a circuit board and a manufacturing method thereof.
Background
When a circuit board is connected to another circuit board or component by a thermocompression bonding process (Hot-bar), it is often necessary to form conductive bumps on the connection pads in order to align the two connection pads to be bonded. The conductive bumps need to be higher than the entire circuit board and are typically more than 30 microns higher than the circuit board. However, the height of the conductive bump may affect other processes, for example, during the circuit manufacturing process, the dry film may not completely cover the conductive bump, so that the conductive bump is partially etched during the etching process, and in addition, the conductive bump may break the printing screen or cause the ink thickness to be uneven during the formation of the solder mask layer.
Disclosure of Invention
Accordingly, it is desirable to provide a circuit board and a method for manufacturing the same to solve the above problems.
A circuit board manufacturing method comprises the following steps:
providing a copper-clad unit, wherein the copper-clad unit comprises a base layer and at least one copper foil layer positioned on the base layer;
manufacturing the copper foil layer to form a conductive circuit layer, wherein the conductive circuit layer comprises at least one connecting pad;
forming a solder mask layer on the conductive circuit layer, wherein the solder mask layer comprises at least one window, and the at least one window exposes the at least one connecting pad; and
and forming a conductive bump on at least one connecting pad.
The utility model provides a circuit board, includes the basic unit, locates conducting wire layer in the basic unit and locating anti-welding layer on the conducting wire layer, the conducting wire layer is including an at least connecting pad, anti-welding layer is equipped with an at least window in order to expose the connecting pad, circuit board still includes an at least conductive lug, at least one conductive lug connect in on the connecting pad and follow it stretches out to window, conductive lug has smooth surface.
Compared with the prior art, the circuit board manufacturing method of the invention forms the solder mask layer firstly and then forms the conductive bump. The manufacture is simple, the conductive bump is not affected by etching, and the printing of the solder mask layer is not affected. The conductive bump of the manufactured circuit board can not be etched so as to keep the surface smooth, and the shape of the conductive bump can be changed and arranged as required.
Drawings
Fig. 1 is a sectional view of a copper-clad unit according to an embodiment of the present invention.
Fig. 2 is a cross-sectional view of the copper-clad unit shown in fig. 1 after a dry film is attached thereto.
Fig. 3 is a cross-sectional view of the dry film of fig. 2 after exposure.
Fig. 4 is a cross-sectional view of the dry film of fig. 3 after development.
Fig. 5 is a cross-sectional view of the copper-clad unit shown in fig. 4 after etching.
Fig. 6 is a sectional view of the copper-clad unit shown in fig. 5 after the dry film is removed.
Fig. 7 is a cross-sectional view of the copper-clad unit shown in fig. 6 after a solder mask layer is formed thereon.
Fig. 8 is a cross-sectional view of the solder mask layer of fig. 7 after forming a window therein.
Fig. 9 is a cross-sectional view of a circuit board made in accordance with an embodiment of the present invention.
Description of the main elements
Copper-clad unit 10
Solder resist 1211
Connecting pad 131
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Some embodiments of the invention are described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
Referring to fig. 1 to 9, a method for manufacturing a circuit board according to a preferred embodiment of the invention includes the following steps:
referring to fig. 1, a copper-clad unit 10 is provided, where the copper-clad unit 10 includes a base layer 11 and at least one copper foil layer 12 on the base layer 11.
In the illustrated embodiment, the copper foil layer 12 is one layer in number, however, in other embodiments, the copper foil layer 12 may be two layers, with two copper foil layers 12 disposed on opposite sides of the substrate 11.
The base layer 11 may be a hard resin layer, such as made of epoxy resin or fiberglass cloth, or a flexible resin layer, such as made of Polyimide (PI), Polyethylene terephthalate (PET), polytetrafluoroethylene (Teflon), Polyamide (Polyamide), polymethyl methacrylate (polymethyl methacrylate), Polycarbonate (Polycarbonate), or Polyimide-Polyethylene-terephthalate copolymer (Polyimide-Polyethylene-terephthalate copolymer).
The copper foil layer 12 may be a rolled copper foil or an electrolytic copper foil.
Referring to fig. 2 to 6, a conductive trace layer 13 is formed on the copper foil layer 12, wherein the conductive trace layer includes at least one connection pad 131.
In one embodiment, the copper foil layer 12 is processed to form the conductive circuit layer 13 by applying a dry film, exposing, developing, etching, and stripping process. The method comprises the following specific steps:
firstly, referring to fig. 2, a dry film 121 is attached to the copper foil layer 12;
secondly, referring to fig. 3, in the exposure, a circuit area of the dry film 121 corresponding to the preset conductive circuit layer 13 is a light-transmitting area, and other areas are light-shielding areas, and the light-transmitting area of the dry film 121 is illuminated to form a solder resist 1211;
thirdly, referring to fig. 4, the dry film 121 in the light shielding region is removed by developing under the action of the developer;
fourthly, referring to fig. 5, etching is performed to remove the copper foil layer 12 without the shielding of the solder resist 1211 to form a conductive circuit layer 13; and
fifth, referring to fig. 6, the film is peeled, and the dry film 121 attached to the copper foil layer 12 is removed together with the solder resist 1211.
Third, referring to fig. 7 and 8, a solder mask layer 14 is formed on the conductive trace layer 13, wherein the solder mask layer includes at least one window 141, and the at least one window 141 exposes the at least one connection pad 131.
In this embodiment, the solder mask layer 14 is made of liquid photosensitive solder mask ink, which includes the following specific steps:
firstly, referring to fig. 7, liquid photosensitive solder mask ink is printed on the surface of the conductive circuit layer 13 and the gaps therebetween;
secondly, pre-baking to pre-cure the surface of the liquid photosensitive solder mask ink;
thirdly, enabling partial areas of the liquid photosensitive solder mask ink to generate a cross-linking reaction through selective Ultraviolet (UV) exposure;
fourthly, referring to fig. 8, the areas of the liquid photosensitive solder mask ink that are not cross-linked are removed by a developing process to form windows 141; and
fifthly, the liquid photosensitive solder mask ink is heated and cured, so that a solder mask layer 14 is formed on the surface of the conductive circuit layer 13 and the gaps thereof.
In a fourth step, referring to fig. 9, a conductive bump 132 is formed on at least one of the connecting pads 131.
In one embodiment, the conductive bumps 132 are formed by printing a conductive material. In one embodiment, the conductive material is a copper paste, but is not limited thereto, and in other embodiments, the conductive material may be a silver paste, a solder paste, or the like.
In one embodiment, the conductive bump 132 has a substantially convex cross-section. The conductive bump 132 includes a first post 1321 and a second post 1323 that are coaxial. The first column 1321 is connected to the connecting pad 131 and is substantially even with the solder mask layer 14. The second post 1323 protrudes from the window 141.
In one embodiment, the first column 1321 has a diameter substantially the same as that of the connecting pad 131. The second column 1323 has a diameter smaller than the diameter of the first column 1321. In other embodiments, the conductive bump 132 may also be a cylinder, a rectangular parallelepiped, or the like.
It is understood that in other embodiments, when the volume of the conductive bump 132 is larger, the conductive bump can be fabricated by etching or cutting the metal substrate.
Referring to fig. 9, a circuit board 100 according to a preferred embodiment of the invention includes a base layer 11, a conductive trace layer 13 disposed on the base layer 11, and a solder mask layer 14 disposed on the conductive trace layer 13. The conductive trace layer 13 includes at least one connection pad 131. The solder mask layer 14 has at least one opening 141 to expose the bonding pad 131.
The circuit board further includes at least one conductive bump 132. At least one of the conductive bumps 132 is connected to the connecting pad 131 and extends out of the window 141. The conductive bump 132 has a flat surface.
In one embodiment, the conductive bump 132 has a substantially convex cross-section. The conductive bump 132 includes a first post 1321 and a second post 1323 that are coaxial. The first column 1321 is connected to the connecting pad 131 and is substantially even with the solder mask layer 14. The second post 1323 protrudes from the window 141.
In one embodiment, the first column 1321 has a diameter substantially the same as that of the connecting pad 131. The second column 1323 has a diameter smaller than the diameter of the first column 1321. In other embodiments, the conductive bump 132 may also be a cylinder, a rectangular parallelepiped, or the like.
The method for manufacturing the circuit board of the present invention forms the solder mask layer 14 and then forms the conductive bump 132. The manufacture is simple, and the conductive bump 132 is not affected by etching or printing of the solder mask layer 14. The conductive bumps 132 of the circuit board 100 are not etched to keep the surface flat, and the shapes of the conductive bumps 132 can be changed according to the needs.
Although the present invention has been described with reference to the above preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. A circuit board manufacturing method comprises the following steps:
providing a copper-clad unit, wherein the copper-clad unit comprises a base layer and at least one copper foil layer positioned on the base layer;
manufacturing the copper foil layer to form a conductive circuit layer, wherein the conductive circuit layer comprises at least one connecting pad;
forming a solder mask layer on the conductive circuit layer, wherein the solder mask layer comprises at least one window, and the at least one window exposes the at least one connecting pad; and
and forming a conductive bump on at least one connecting pad.
2. The method of manufacturing a circuit board according to claim 1, wherein: the conductive bump is formed by printing a conductive material.
3. The method for manufacturing a circuit board according to claim 2, wherein: the conductive material is copper paste.
4. The method of manufacturing a circuit board according to claim 1, wherein: the manufacturing and forming of the conductive circuit layer comprises the following steps:
a film is pasted, and a dry film is pasted on the copper foil layer;
exposing, wherein a circuit area of the dry film corresponding to the conductive circuit layer is a light-transmitting area, other areas are light-shielding areas, and the light-transmitting area forms a solder mask layer through illumination;
developing, namely removing the dry film in the shading area under the action of a developer;
etching, namely etching and removing the copper foil layer which is not shielded by the solder mask layer to form a conductive circuit layer; and
and stripping the film, and removing the dry film attached to the copper foil layer.
5. The method of manufacturing a circuit board according to claim 1, wherein: the forming of the solder mask layer comprises the following steps:
printing liquid photosensitive solder resist ink on the surface of the conductive circuit layer and in the gap between the conductive circuit layer and the conductive circuit layer;
pre-baking to pre-cure the surface of the liquid photosensitive solder mask ink;
carrying out cross-linking reaction on partial area of the liquid photosensitive solder mask ink by selective ultraviolet exposure;
removing the area of the liquid photosensitive solder mask ink which is not subjected to the cross-linking reaction through a developing process to form a window;
and heating and curing the liquid photosensitive solder mask ink, so that a solder mask layer is formed on the surface of the conductive circuit layer and in the gaps of the conductive circuit layer.
6. The utility model provides a circuit board, includes the basic unit, locates conducting wire layer on the basic unit and locating weld-proof layer on the conducting wire layer, its characterized in that: the circuit board further comprises at least one conductive bump, the at least one conductive bump is connected to the connecting pad and extends out of the window, and the conductive bump has a smooth surface.
7. The circuit board of claim 6, wherein: the conductive bump comprises a first cylinder and a second cylinder, the first cylinder is connected with the connecting pad, and the second cylinder extends out of the window.
8. The circuit board of claim 7, wherein: the first column body and the connecting pad are the same in diameter, and the diameter of the second column body is smaller than that of the first column body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910420297.XA CN111970849A (en) | 2019-05-20 | 2019-05-20 | Circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910420297.XA CN111970849A (en) | 2019-05-20 | 2019-05-20 | Circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111970849A true CN111970849A (en) | 2020-11-20 |
Family
ID=73357715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910420297.XA Pending CN111970849A (en) | 2019-05-20 | 2019-05-20 | Circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111970849A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1326432C (en) * | 2002-12-23 | 2007-07-11 | 矽统科技股份有限公司 | High-density circuit board without pad design and manufacturing method thereof |
| KR100905922B1 (en) * | 2008-02-15 | 2009-07-02 | 삼성전기주식회사 | Packaged printed circuit board and its manufacturing method |
| CN102724815A (en) * | 2011-03-30 | 2012-10-10 | 富葵精密组件(深圳)有限公司 | Manufacturing method for circuit board |
| CN103632979A (en) * | 2012-08-27 | 2014-03-12 | 宏启胜精密电子(秦皇岛)有限公司 | Chip packaging substrate and structure, and manufacturing methods thereof |
| CN103635035A (en) * | 2012-08-29 | 2014-03-12 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and making method thereof |
| CN103635017A (en) * | 2012-08-24 | 2014-03-12 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and manufacturing method thereof |
-
2019
- 2019-05-20 CN CN201910420297.XA patent/CN111970849A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1326432C (en) * | 2002-12-23 | 2007-07-11 | 矽统科技股份有限公司 | High-density circuit board without pad design and manufacturing method thereof |
| KR100905922B1 (en) * | 2008-02-15 | 2009-07-02 | 삼성전기주식회사 | Packaged printed circuit board and its manufacturing method |
| CN102724815A (en) * | 2011-03-30 | 2012-10-10 | 富葵精密组件(深圳)有限公司 | Manufacturing method for circuit board |
| CN103635017A (en) * | 2012-08-24 | 2014-03-12 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and manufacturing method thereof |
| CN103632979A (en) * | 2012-08-27 | 2014-03-12 | 宏启胜精密电子(秦皇岛)有限公司 | Chip packaging substrate and structure, and manufacturing methods thereof |
| CN103635035A (en) * | 2012-08-29 | 2014-03-12 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and making method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201120 |
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| RJ01 | Rejection of invention patent application after publication |