CN111899954B - Thermosetting epoxy resin composition for packaging inductor and preparation method thereof - Google Patents
Thermosetting epoxy resin composition for packaging inductor and preparation method thereof Download PDFInfo
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- CN111899954B CN111899954B CN202010735145.1A CN202010735145A CN111899954B CN 111899954 B CN111899954 B CN 111899954B CN 202010735145 A CN202010735145 A CN 202010735145A CN 111899954 B CN111899954 B CN 111899954B
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- epoxy resin
- resin composition
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- phenol
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 87
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 87
- 239000000203 mixture Substances 0.000 title claims abstract description 56
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 20
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 10
- 238000002360 preparation method Methods 0.000 title description 6
- 239000003063 flame retardant Substances 0.000 claims abstract description 31
- 239000006247 magnetic powder Substances 0.000 claims abstract description 29
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 14
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 8
- 239000003607 modifier Substances 0.000 claims abstract description 8
- 239000000843 powder Substances 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 23
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 19
- -1 iron-silicon-aluminum Chemical compound 0.000 claims description 19
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 13
- 229920002545 silicone oil Polymers 0.000 claims description 13
- 229920002379 silicone rubber Polymers 0.000 claims description 13
- 239000004945 silicone rubber Substances 0.000 claims description 13
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 12
- 229920001568 phenolic resin Polymers 0.000 claims description 12
- 239000005011 phenolic resin Substances 0.000 claims description 12
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 11
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 11
- 229910045601 alloy Inorganic materials 0.000 claims description 10
- 239000000956 alloy Substances 0.000 claims description 10
- 150000002736 metal compounds Chemical class 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 claims description 7
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 7
- 125000002723 alicyclic group Chemical group 0.000 claims description 7
- 125000000217 alkyl group Chemical group 0.000 claims description 7
- RKISUIUJZGSLEV-UHFFFAOYSA-N n-[2-(octadecanoylamino)ethyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCCNC(=O)CCCCCCCCCCCCCCCCC RKISUIUJZGSLEV-UHFFFAOYSA-N 0.000 claims description 7
- 229920003986 novolac Polymers 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 7
- 239000001993 wax Substances 0.000 claims description 7
- 239000011701 zinc Substances 0.000 claims description 7
- 229910052725 zinc Inorganic materials 0.000 claims description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 6
- 125000000623 heterocyclic group Chemical group 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000003960 organic solvent Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 claims description 6
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 4
- LLPKQRMDOFYSGZ-UHFFFAOYSA-N 2,5-dimethyl-1h-imidazole Chemical compound CC1=CN=C(C)N1 LLPKQRMDOFYSGZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 229910000599 Cr alloy Inorganic materials 0.000 claims description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 claims description 4
- 229910000676 Si alloy Inorganic materials 0.000 claims description 4
- XEVZIAVUCQDJFL-UHFFFAOYSA-N [Cr].[Fe].[Si] Chemical compound [Cr].[Fe].[Si] XEVZIAVUCQDJFL-UHFFFAOYSA-N 0.000 claims description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- 239000000788 chromium alloy Substances 0.000 claims description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 4
- XWHPIFXRKKHEKR-UHFFFAOYSA-N iron silicon Chemical compound [Si].[Fe] XWHPIFXRKKHEKR-UHFFFAOYSA-N 0.000 claims description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 claims description 4
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 claims description 4
- 239000012265 solid product Substances 0.000 claims description 4
- YWWDBCBWQNCYNR-UHFFFAOYSA-N trimethylphosphine Chemical compound CP(C)C YWWDBCBWQNCYNR-UHFFFAOYSA-N 0.000 claims description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 2
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 claims description 2
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 2
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 claims description 2
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 claims description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 2
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 claims description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 claims description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 claims description 2
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 claims description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 2
- 229910001309 Ferromolybdenum Inorganic materials 0.000 claims description 2
- 229910001145 Ferrotungsten Inorganic materials 0.000 claims description 2
- 229910001289 Manganese-zinc ferrite Inorganic materials 0.000 claims description 2
- 229910001053 Nickel-zinc ferrite Inorganic materials 0.000 claims description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Natural products P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims description 2
- 229910001308 Zinc ferrite Inorganic materials 0.000 claims description 2
- PGTXKIZLOWULDJ-UHFFFAOYSA-N [Mg].[Zn] Chemical compound [Mg].[Zn] PGTXKIZLOWULDJ-UHFFFAOYSA-N 0.000 claims description 2
- JIYIUPFAJUGHNL-UHFFFAOYSA-N [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] Chemical compound [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] JIYIUPFAJUGHNL-UHFFFAOYSA-N 0.000 claims description 2
- 239000004844 aliphatic epoxy resin Substances 0.000 claims description 2
- 239000004305 biphenyl Substances 0.000 claims description 2
- 235000010290 biphenyl Nutrition 0.000 claims description 2
- 239000004203 carnauba wax Substances 0.000 claims description 2
- 235000013869 carnauba wax Nutrition 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- 229930003836 cresol Natural products 0.000 claims description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 2
- BVURNMLGDQYNAF-UHFFFAOYSA-N dimethyl(1-phenylethyl)amine Chemical compound CN(C)C(C)C1=CC=CC=C1 BVURNMLGDQYNAF-UHFFFAOYSA-N 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 2
- 150000002460 imidazoles Chemical class 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000012184 mineral wax Substances 0.000 claims description 2
- FVAZJUHWWXJXGV-UHFFFAOYSA-N n,n-diethylethanamine;n,n-dimethyl-1-phenylmethanamine Chemical compound CCN(CC)CC.CN(C)CC1=CC=CC=C1 FVAZJUHWWXJXGV-UHFFFAOYSA-N 0.000 claims description 2
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 claims description 2
- 239000004843 novolac epoxy resin Substances 0.000 claims description 2
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 claims description 2
- NRNFFDZCBYOZJY-UHFFFAOYSA-N p-quinodimethane Chemical group C=C1C=CC(=C)C=C1 NRNFFDZCBYOZJY-UHFFFAOYSA-N 0.000 claims description 2
- 235000011837 pasties Nutrition 0.000 claims description 2
- 150000003003 phosphines Chemical class 0.000 claims description 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 claims description 2
- RXJKFRMDXUJTEX-UHFFFAOYSA-N triethylphosphine Chemical compound CCP(CC)CC RXJKFRMDXUJTEX-UHFFFAOYSA-N 0.000 claims description 2
- IUURMAINMLIZMX-UHFFFAOYSA-N tris(2-nonylphenyl)phosphane Chemical compound CCCCCCCCCC1=CC=CC=C1P(C=1C(=CC=CC=1)CCCCCCCCC)C1=CC=CC=C1CCCCCCCCC IUURMAINMLIZMX-UHFFFAOYSA-N 0.000 claims description 2
- WXAZIUYTQHYBFW-UHFFFAOYSA-N tris(4-methylphenyl)phosphane Chemical compound C1=CC(C)=CC=C1P(C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 WXAZIUYTQHYBFW-UHFFFAOYSA-N 0.000 claims description 2
- RPJGYLSSECYURW-UHFFFAOYSA-K antimony(3+);tribromide Chemical compound Br[Sb](Br)Br RPJGYLSSECYURW-UHFFFAOYSA-K 0.000 claims 1
- 239000006082 mold release agent Substances 0.000 claims 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 3
- 239000012778 molding material Substances 0.000 description 10
- 239000002245 particle Substances 0.000 description 7
- 239000005022 packaging material Substances 0.000 description 6
- 239000012257 stirred material Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 235000021355 Stearic acid Nutrition 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 4
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 4
- 239000008117 stearic acid Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000005485 electric heating Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 229920000298 Cellophane Polymers 0.000 description 1
- LLQPHQFNMLZJMP-UHFFFAOYSA-N Fentrazamide Chemical compound N1=NN(C=2C(=CC=CC=2)Cl)C(=O)N1C(=O)N(CC)C1CCCCC1 LLQPHQFNMLZJMP-UHFFFAOYSA-N 0.000 description 1
- BIEHXHIWQHAVFZ-UHFFFAOYSA-M bromoantimony Chemical compound [Sb]Br BIEHXHIWQHAVFZ-UHFFFAOYSA-M 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/33—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials mixtures of metallic and non-metallic particles; metallic particles having oxide skin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/022—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/005—Impregnating or encapsulating
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
The invention provides a thermosetting epoxy resin composition for packaging inductors, which is characterized by comprising the following components: 80-95 parts of magnetic powder with different grain size grading, 1-8 parts of epoxy resin, 1-8 parts of curing agent, 0.01-1 part of curing accelerator, 0.1-1 part of release agent, 0.1-2 parts of flame retardant, 0.1-1 part of low-stress modifier and 0.1-1 part of silane coupling agent. The invention has the following technical effects: the epoxy resin composition has high reliability, good fluidity and strength, and is suitable for packaging inductors.
Description
Technical Field
The invention relates to a thermosetting epoxy resin composition for packaging inductors and a preparation method thereof, belonging to the field of chemical compositions.
Background
With the rapid development of technology, especially the emergence of multifunctional devices, the demand of the whole passive device is becoming larger and larger, and inductors are widely used as one of the important parts of passive components. Meanwhile, the requirements for high current, high frequency, miniaturization and the like of the inductor are continuously upgraded.
In the production process of the inductor, the current mainstream process is to directly press the magnetic packaging material and the coil into an integrated inductor by using overhigh pressure. The existing packaging material for packaging the inductor has the defects of low strength, poor flowability, low production yield, high cost and the like.
Therefore, the novel inductance packaging material has the advantages of moderate cost, simple and convenient operation, good universality and high strength, and is extremely high in demand.
Disclosure of Invention
The invention aims to overcome the defects of low strength, poor flowability, low production yield, high cost and the like of the conventional inductor packaging material, and provides a thermosetting epoxy resin composition for packaging inductors and a preparation method thereof.
The inventor finds that the problems of low strength, poor fluidity and low production yield of the inductance packaging material can be solved by adopting high-content magnetic powder with different grain size grades as a raw material and adopting a specific preparation method, and the effects of simple and convenient operation, good process universality, high magnetic conductivity and the like of the packaged inductance product are realized.
The technical problem to be solved by the invention is realized by the following technical scheme:
a thermosetting epoxy resin composition for encapsulating inductors, comprising the following components: 80-95 parts of magnetic powder with different grain size grading, 1-8 parts of epoxy resin, 1-8 parts of curing agent, 0.01-1 part of curing accelerator, 0.1-1 part of release agent, 0.1-2 parts of flame retardant, 0.1-1 part of low-stress modifier and 0.1-1 part of silane coupling agent;
the thermosetting epoxy resin composition is prepared by the following method:
dissolving substances except the magnetic powder and the flame retardant with different grain size grading in the components in 1 time of organic solvent by mass, and uniformly stirring at normal temperature until the solid part is completely dissolved;
secondly, under the stirring state, slowly adding the magnetic powder with different grain size grading and the flame retardant into the resin solution obtained in the first step, and stirring at a high speed to be pasty;
thirdly, putting the paste obtained in the second step into a vacuum oven at 50-100 ℃, and drying under negative pressure to remove the organic solvent to obtain a solid product;
and fourthly, crushing the solid product obtained in the third step to obtain powder, performing the powder into cake materials through a cake making machine, and finally obtaining the thermosetting epoxy resin composition which comprises graded magnetic powder with different grain sizes, has good forming process performance and is suitable for packaging inductors.
Wherein,
the magnetic powder with different grain size grading is at least one material powder selected from simple metal, alloy and metal compound. The simple metal, alloy and metal compound are selected from one or more material powders of iron, iron-silicon alloy, iron-silicon-aluminum alloy, iron-silicon-chromium alloy, ferromolybdenum alloy, ferrotungsten alloy, ferroboron alloy, ferric oxide, magnesium-zinc ferrite, manganese-zinc ferrite or nickel-zinc ferrite.
The magnetic powder with different grain size grading has the grain size of more than 1 mu m and less than 300 mu m.
The epoxy resin is used for effectively improving the heat resistance of the epoxy resin composition, and is selected from one or more of o-cresol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, open-chain aliphatic epoxy resin, alicyclic epoxy resin, heterocyclic type epoxy resin, glycidyl ether type epoxy resin of p-xylylene and/or m-xylylene modified phenolic resin, glycidyl ester type epoxy resin, glycidyl oil type or methyl glycidyl oil type epoxy resin.
The curing agent is selected from one or more of phenol linear phenolic resin and derivatives thereof, phenol alkyl phenolic resin, cresol linear phenolic resin and derivatives thereof, monohydroxy or dihydroxy naphthalene phenolic resin and derivatives thereof, salicylaldehyde type phenol resin, condensate of p-xylene and phenol or naphthol, and copolymer of dicyclopentadiene and phenol.
The curing accelerator is used for accelerating the curing performance of the epoxy resin composition and is selected from one or more of imidazole compounds, tertiary amine compounds and organic phosphine compounds;
the imidazole compound is at least one of 2-methylimidazole, 2,4-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole and 2- (heptadecyl) imidazole;
the tertiary amine compound is at least one of triethylamine benzyl dimethylamine, alpha-methyl benzyl dimethylamine, 2- (dimethylamino methyl) phenol, 2,4,6-tri (dimethylamino methyl) phenol and 1,8-diazabicyclo (5,4,0) undecene-7;
the organic phosphine compound is at least one of triphenylphosphine, trimethylphosphine, triethylphosphine, tributylphosphine, tri (p-methylphenyl) phosphine, tri (nonylphenyl) phosphine and the like.
The release agent is selected from one or more of carnauba wax, sodium stearate, ethylene bisstearamide, synthetic wax and mineral wax. The release agent is preferably a wax containing a fatty acid, from the viewpoint of easily improving the fluidity of the compound.
The flame retardant is at least one selected from the group consisting of a bromoantimony flame retardant, a spherical flame retardant, a hydrated metal compound flame retardant, an organosilicon flame retardant, a nitrogen-containing compound, an organic phosphorus flame retardant and an organic metal compound. The type and content of the flame retardant are not particularly limited, and the flame retardant is preferably selected from hydrated metal compounds and organic phosphorus flame retardants.
The selection of the low stress modifier is not particularly limited, and preferably, the low stress modifier is liquid silicone oil and/or silicone rubber powder.
The silane coupling agent is not particularly limited, and preferably, the silane coupling agent is at least one of gamma-epoxypropylethertrimethoxysilane, gamma-aminopropyltriethoxysilane, gamma-mercaptopropyltrimethoxysilane and gamma-aminopropyltrimethoxysilane.
Preferably, the first and second electrodes are formed of a metal,
in the thermosetting epoxy resin composition for encapsulating inductors,
the magnetic powder with different grain size grading is one or more material powder selected from iron silicon alloy, iron silicon aluminum alloy and iron silicon chromium alloy, and the content is 95 parts by weight;
the magnetic powder with different grain size grading has the grain size of more than 1 mu m and less than 100 mu m;
the epoxy resin is alicyclic epoxy resin, heterocyclic epoxy resin or bisphenol A epoxy resin, and the content is 2.5 parts by weight;
the curing agent is phenol linear phenolic resin or phenol alkyl phenolic resin, and the content is 1.5 parts by weight;
the curing accelerator is 2-methylimidazole, and the content is 0.05 part by weight;
the release agent is sodium stearate or ethylene bis stearamide, and the content is 0.2 part by weight;
the flame retardant is selected from 1:1 blend of aluminum hydroxide/zinc borate or aluminum hydroxide, and the content is 0.3 part by weight;
the low-stress modifier is a mixture of liquid silicone oil and silicone rubber powder, and the content of the liquid silicone oil and the content of the silicone rubber powder are respectively 0.1 part by weight;
the silane coupling agent is gamma-epoxypropyl ether trimethoxy silane, and the content is 0.2 part by weight;
in the method, acetone is selected as the organic solvent in the first step.
The endpoints of the ranges and any values disclosed herein are not limited to the precise range or value, and such ranges or values should be understood to encompass values close to those ranges or values. For ranges of values, between the endpoints of each of the ranges and the individual points, and between the individual points may be combined with each other to give one or more new ranges of values, and these ranges of values should be considered as specifically disclosed herein.
The invention also provides application of the epoxy resin composition as an inductor packaging material.
The invention has the following technical effects:
the epoxy resin composition has high reliability, good fluidity and strength, and is suitable for packaging inductors.
Detailed Description
The present invention is further illustrated by the following examples, but the scope of the invention is not limited thereto.
The detection method comprises the following steps:
gel time GT: a hot plate method, heating an electric heating plate to 175 +/-1 ℃, placing 0.3-0.5g of powder of a molding material sample on the electric heating plate, taking the time when the powder gradually changes from fluid to colloid as an end point, and reading the required time;
spiral flow length SF: measuring on a transfer molding press by using an EMMI-1-66 spiral flow metal mold, wherein the molding pressure is 70 +/-2 Kgf/cm < 2 >, the mold temperature is 175 +/-2 ℃, and 20 +/-5 g of powder of a molding material sample is taken for testing;
magnetic permeability mu: the powder of the molding material sample was injected into a fixed mold, molded at 175 ℃ by a transfer molding press to form a cured magnet, and the properties thereof were measured.
Example 1
2.5 parts by weight of alicyclic epoxy resin (purchased from Japan cellophane company, trademark: EHPE-3150), 1.5 parts by weight of phenol novolac resin (purchased from Japan Ming and company, trademark: HF-3M), 0.05 part by weight of 2-methylimidazole, 0.2 part by weight of gamma-glycidyl propyl ether trimethoxysilane, 0.1 part by weight of liquid silicone oil, 0.1 part by weight of silicone rubber powder (D50 =1 μ M), 0.2 part by weight of stearic acid wax were dissolved in an equal mass part of acetone solution at normal temperature, 95 parts by weight of magnetic powder of different particle size distribution (D50 =8 μ M, purchased from Jizhuo Innovai materials Co., ltd., model number JCF 2-2), 0.3 part by weight of flame retardant (aluminum hydroxide/zinc borate = 1/1) were slowly added to the above solution, stirred at high speed for 15min, the stirred material was dried in vacuum at 60 ℃ for 2 hours under reduced pressure, and the obtained material powder was pulverized in a box to obtain an epoxy resin composition. And (3) performing the epoxy resin composition powder into a cake material to obtain the epoxy resin composition molding material, which is marked as A1. The properties of A1 were measured and the results are shown in Table 1.
Example 2
2.5 parts by weight of heterocyclic epoxy resin (purchased from Nissan chemical company under the brand name TEPIC-S), 1.5 parts by weight of phenol alkyl phenol formaldehyde resin (purchased from Nippon Ming and company under the brand name MEHC-7800 SS), 0.05 part by weight of 2-methylimidazole, 0.2 part by weight of gamma-epoxypropylether trimethoxysilane, 0.1 part by weight of liquid silicone oil, 0.1 part by weight of silicone rubber powder (D50 =1 μm), 0.2 part by weight of ethylene bis stearamide, dissolved in an equal mass part of acetone solution at normal temperature, 95 parts by weight of magnetic powder of different particle size grading (D50 =8 μm, purchased from Jilin Innovation materials Co., ltd., model number JCF 2-2), 0.3 part by weight of flame retardant (aluminum hydroxide/zinc borate = 1/1), slowly added to the above solution, stirred at high speed for 15min, the stirred material was dried in a vacuum oven at 60 ℃ for 2h, and the obtained material powder was pulverized under reduced pressure to obtain an epoxy resin composition. And (3) performing the epoxy resin composition powder into a cake material to obtain the epoxy resin composition molding material, which is marked as A2. The properties of A2 were measured and the results are shown in table 1.
Example 3
2.5 parts by weight of bisphenol A epoxy resin (product number 127, hongchang chemical company), 1.5 parts by weight of phenol alkyl phenol formaldehyde resin (product number MEHC-7800SS, available from japan Ming and company), 0.05 parts by weight of 2-methylimidazole, 0.2 parts by weight of gamma-epoxypropylpropylether trimethoxysilane, 0.1 parts by weight of liquid silicone oil, 0.1 parts by weight of silicone rubber powder (D50 =1 μm), 0.2 parts by weight of ethylene bis stearamide, dissolved in an equal mass part of acetone solution at normal temperature, 95 parts by weight of magnetic powder of different particle size gradations (D50 =8 μm, available from Jilin & ltp & gtInnovative materials, type JCF 2-2), 0.3 parts by weight of flame retardant (aluminum hydroxide) were slowly added to the above solution, stirred at high speed for 15min, and the stirred material was dried under reduced pressure in a vacuum oven at 60 ℃ for 2 hours to obtain an epoxy resin composition powder. And performing the epoxy resin composition powder into a cake material to obtain an epoxy resin composition molding material, which is marked as A3. The properties of A3 were measured and the results are shown in table 1.
Comparative example 1 using a low content of magnetic powder
10 parts by weight of alicyclic epoxy resin (available from JACmax, inc., under the trademark EHPE-3150), 5 parts by weight of phenol novolac resin (available from JACmin, inc., under the trademark HF-3M), 0.05 part by weight of 2-methylimidazole, 0.5 part by weight of gamma-glycidyl propyl ether trimethoxysilane, 0.5 part by weight of liquid silicone oil, 0.5 part by weight of silicone rubber powder (D50 =1 μ M), 0.5 part by weight of stearic acid wax, dissolved in an equal mass part of acetone solution at normal temperature, 82 parts by weight of magnetic powder of different particle size grading (D50 =8 μ M, available from JILINZHOU InnovEI, inc., under the model number JCF 2-2), 1 part by weight of flame retardant (aluminum hydroxide/zinc borate = 1/1) were slowly added to the above solution, stirred at high speed for 15min, the stirred material was vacuum-dried at 60 ℃ for 2 hours under reduced pressure, and the resulting material was pulverized to obtain a powder of an epoxy resin composition box. And (3) performing the epoxy resin composition powder into a cake material to obtain an epoxy resin composition molding material, which is marked as B1. The properties of B1 were measured, and the results are shown in table 1.
Comparative example 2 use of a low content of magnetic powder
10 parts by weight of heterocyclic epoxy resin (purchased from Nissan chemical company under the brand name TEPIC-S), 5 parts by weight of phenol alkyl phenolic resin (purchased from Nippon Ming and company under the brand name MEHC-7800 SS), 0.05 part by weight of 2-methylimidazole, 0.5 part by weight of gamma-epoxypropylether trimethoxy silane, 0.5 part by weight of liquid silicone oil, 0.5 part by weight of silicone rubber powder (D50 =1 μm), 0.5 part by weight of ethylene bis stearamide, dissolved in an equal mass part of acetone solution at normal temperature, 82 parts by weight of magnetic powder of different particle size grading (D50 =8 μm, purchased from Jilin & Onconk Innovation materials Co., ltd., model number JCF 2-2), 1 part by weight of flame retardant (aluminum hydroxide/zinc borate = 1/1) were slowly added to the above solution, stirred at high speed for 15min, and the stirred material was dried in a vacuum oven at 60 ℃ for 2 hours under reduced pressure to obtain an epoxy resin composition. And (3) performing the epoxy resin composition powder into a cake material to obtain an epoxy resin composition molding material, which is marked as B2. The properties of B2 were measured and the results are shown in Table 1.
Comparative example 3 use of a Low content magnetic powder
10 parts by weight of bisphenol A type epoxy resin (Macro Chang chemical company, trade name 127), 5 parts by weight of phenol alkyl phenol formaldehyde resin (available from Nippon Ming and company, trade name MEHC-7800 SS), 0.05 part by weight of 2-methylimidazole, 0.5 part by weight of gamma-epoxypropylether trimethoxysilane, 0.5 part by weight of liquid silicone oil, 0.5 part by weight of silicone rubber powder (D50 =1 μm), 0.5 part by weight of stearic acid wax were dissolved in an equal mass part of acetone solution at normal temperature, 82 parts by weight of magnetic powder of different particle size distribution (D50 =8 μm, available from Jilin Innova materials company, model number JCF 2-2), 1 part by weight of flame retardant (aluminum hydroxide) were slowly added to the above solution, stirred at high speed for 15min, the stirred material was dried under reduced pressure in a vacuum oven at 60 ℃ for 2 hours, and the obtained material was pulverized to obtain epoxy resin composition powder. And (3) performing the epoxy resin composition powder into a cake material to obtain an epoxy resin composition molding material, which is marked as B3. The properties of B3 were measured and the results are shown in table 1.
Comparative example 4 using high content of magnetic powder and conventional preparation method
2.5 parts by weight of an alicyclic epoxy resin (available from Nippon Daiiol corporation under the trademark EHPE-3150), 1.5 parts by weight of a phenol novolac resin (available from Nippon Ming and Co under the trademark HF-3M), 0.05 part by weight of 2-methylimidazole, 0.2 part by weight of gamma-glycidyl propyl ether trimethoxysilane, 0.1 part by weight of liquid silicone oil, 0.1 part by weight of silicone rubber powder (D50 =1 μ M), 0.2 part by weight of stearic acid wax, 95 parts by weight of magnetic powder of different particle size distribution (D50 =8 μ M available from Gillen Innovelties Co., ltd., model JCF 2-2), 0.3 part by weight of a flame retardant (aluminum hydroxide/zinc borate = 1/1) were mixed together, pulverized and mixed uniformly by a high-speed pulverizer, and then the mixture was placed in a two-roll mixer and melt-kneaded at a temperature of 80 ℃ for 8min. And taking the melted and mixed materials from the double-roller mixing mill, naturally cooling and crushing to obtain the epoxy resin composition. And (3) performing the epoxy resin composition powder into a cake material to obtain an epoxy resin composition molding material, which is marked as B4. The properties of B4 were measured and the results are shown in table 1.
TABLE 1
As can be seen from the results of examples 1-3, the epoxy resin composition of the present invention has a high magnetic permeability and also has good fluidity and flow time.
As can be seen from the comparison of the results of examples 1-3 and comparative examples 1-4, the epoxy resin composition of the present invention has higher magnetic permeability and better fluidity, and can meet the requirements of inductance on the use electrical property and the operability of the encapsulation material.
The preferred embodiments of the present invention have been described above in detail, but the present invention is not limited thereto. Within the scope of the technical idea of the invention, many simple modifications can be made to the technical solution of the invention, including combinations of various technical features in any other suitable way, and these simple modifications and combinations should also be regarded as the disclosure of the invention, and all fall within the scope of the invention.
Claims (9)
1. A thermosetting epoxy resin composition for encapsulating inductors, characterized by comprising the following components: 80-95 parts of magnetic powder with different grain size grading, 1-8 parts of epoxy resin, 1-8 parts of curing agent, 0.01-1 part of curing accelerator, 0.1-1 part of release agent, 0.1-2 parts of flame retardant, 0.1-1 part of low-stress modifier and 0.1-1 part of silane coupling agent;
the thermosetting epoxy resin composition is prepared by the following method:
firstly, dissolving substances except the magnetic powder and the flame retardant with different grain size gradations in the components in 1-time mass part of organic solvent, and stirring uniformly at normal temperature until the solid part is completely dissolved;
secondly, under the stirring state, slowly adding the magnetic powder with different grain size grading and the flame retardant into the resin solution obtained in the first step, and stirring at a high speed to be pasty;
thirdly, putting the paste obtained in the second step into a vacuum oven at 50-100 ℃, and drying under negative pressure to remove the organic solvent to obtain a solid product;
fourthly, crushing the solid product obtained in the third step to obtain powder, preforming the powder into cake materials through a cake making machine, and finally obtaining the thermosetting epoxy resin composition which comprises graded magnetic powder with different grain sizes and is good in forming process performance and suitable for packaging inductors;
the magnetic powder with different grain size grading is at least one material powder selected from simple metal, alloy and metal compound; the simple metal, alloy and metal compound is one or more material powders selected from iron, iron-silicon alloy, iron-silicon-aluminum alloy, iron-silicon-chromium alloy, ferromolybdenum alloy, ferrotungsten alloy, ferroboron alloy, ferric oxide, magnesium-zinc ferrite, manganese-zinc ferrite or nickel-zinc ferrite;
the magnetic powder with different grain size grading has the grain size of more than 1 mu m and less than 300 mu m.
2. The thermosetting epoxy resin composition for encapsulating inductors according to claim 1, wherein the epoxy resin is used for effectively improving the heat resistance of the epoxy resin composition, and is selected from one or more of o-cresol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, open chain aliphatic epoxy resin, alicyclic epoxy resin, heterocyclic type epoxy resin, glycidyl ether type epoxy resin of p-xylylene and/or m-xylylene modified phenol resin, glycidyl ester type epoxy resin, glycidyl type or methylglycidyl type epoxy resin.
3. The thermosetting epoxy resin composition for encapsulating inductors as claimed in claim 1, wherein the curing agent is selected from one or more of phenol novolac resin and its derivatives, phenol alkyl novolac resin, cresol novolac resin and its derivatives, monohydroxy or dihydroxy naphthalene novolac resin and its derivatives, salicylaldehyde type phenol resin, condensate of p-xylene and phenol or naphthol, and copolymer of dicyclopentadiene and phenol.
4. The thermosetting epoxy resin composition for encapsulating inductors as claimed in claim 1, wherein said curing accelerator is used for accelerating the curing performance of said epoxy resin composition and is selected from one or more of imidazole compounds, tertiary amine compounds and organic phosphine compounds;
the imidazole compound is at least one of 2-methylimidazole, 2, 4-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole and 2- (heptadecyl) imidazole;
the tertiary amine compound is at least one of triethylamine benzyl dimethylamine, alpha-methyl benzyl dimethylamine, 2- (dimethylamino methyl) phenol, 2,4, 6-tri (dimethylamino methyl) phenol and 1, 8-diazabicyclo (5, 4, 0) undecene-7;
the organic phosphine compound is at least one of triphenylphosphine, trimethylphosphine, triethylphosphine, tributylphosphine, tri (p-methylphenyl) phosphine, tri (nonylphenyl) phosphine and the like.
5. The thermosetting epoxy resin composition for encapsulating inductors as claimed in claim 1, wherein the mold release agent is selected from one or more of carnauba wax, sodium stearate, ethylene bis stearamide, synthetic wax and mineral wax.
6. The thermosetting epoxy resin composition for encapsulating inductors as claimed in claim 1, wherein said flame retardant is at least one selected from the group consisting of antimony bromide flame retardants, spherical flame retardants, hydrated metal compound flame retardants, silicone flame retardants, nitrogen-containing compounds, organic phosphorus flame retardants and organic metal compounds.
7. The thermosetting epoxy resin composition for encapsulating inductors as claimed in claim 1, characterized in that the low stress modifier is liquid silicone oil and/or silicone rubber powder.
8. The thermosetting epoxy resin composition for encapsulating inductors as claimed in claim 1, wherein the silane coupling agent is at least one of gamma-epoxypropylpropylethertrimethoxysilane, gamma-aminopropyltriethoxysilane, gamma-mercaptopropyltrimethoxysilane and gamma-aminopropyltrimethoxysilane.
9. The thermosetting epoxy resin composition for encapsulating inductors according to any one of claims 1 to 8,
the magnetic powder with different grain size grading is one or more material powder selected from iron silicon alloy, iron silicon aluminum alloy and iron silicon chromium alloy, and the content is 95 parts by weight;
the magnetic powder with different grain size grading has the grain size of more than 1 mu m and less than 100 mu m;
the epoxy resin is alicyclic epoxy resin, heterocyclic epoxy resin or bisphenol A epoxy resin, and the content is 2.5 parts by weight;
the curing agent is phenol linear phenolic resin or phenol alkyl phenolic resin, and the content is 1.5 parts by weight;
the curing accelerator is 2-methylimidazole, and the content is 0.05 part by weight;
the release agent is sodium stearate or ethylene bis stearamide, and the content is 0.2 part by weight;
the flame retardant is selected from 1:1 blend of aluminum hydroxide/zinc borate or aluminum hydroxide, and the content is 0.3 part by weight;
the low-stress modifier is a mixture of liquid silicone oil and silicone rubber powder, and the content of the liquid silicone oil and the content of the silicone rubber powder are respectively 0.1 part by weight;
the silane coupling agent is gamma-epoxypropyl ether trimethoxy silane, and the content is 0.2 part by weight;
in the method, the organic solvent in the first step is acetone.
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