CN111777322A - Glass cover plate and processing method thereof - Google Patents
Glass cover plate and processing method thereof Download PDFInfo
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- CN111777322A CN111777322A CN202010734269.8A CN202010734269A CN111777322A CN 111777322 A CN111777322 A CN 111777322A CN 202010734269 A CN202010734269 A CN 202010734269A CN 111777322 A CN111777322 A CN 111777322A
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
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- Surface Treatment Of Glass (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention discloses a processing method of a glass cover plate, which comprises the steps of attaching a protective layer on the glass cover plate, cutting the glass cover plate attached with the protective layer by using a laser crack cutting method, chamfering by using hydrofluoric acid solution, and finally removing the protective layer. The invention also discloses the glass cover plate processed by the processing method. The method of combining laser cutting and chemical chamfering is used, the dependence on the quantity of CNC equipment in the case of large processing requirements of the cover plate industry is solved, the equipment investment is reduced, the asset allocation is lightened, the process flow is reduced, the size limit can be greatly improved, and the surface strength of glass products is improved; the C-shaped chamfered edge with the angle of 45 +/-5 ℃ can be obtained by adopting a chemical method, the C-shaped chamfered edge is easy to strip after the chamfered edge, the protective layer removing speed is high, and the efficiency is high.
Description
Technical Field
The invention relates to the field of liquid crystal display cover plate glass, in particular to a glass cover plate and a processing method thereof.
Background
Liquid crystal display apron glass is along with intelligent terminal product's popularization, and the demand is very big, reply market demand, and apron manufacturing enterprise needs constantly to increase equipment input volume, and focus on promotes production efficiency, improves product hardness and bending strength simultaneously.
The conventional cover plate production process comprises the following steps: cutting a plain plate → cleaning → processing CNC outline → cleaning → other processes of the posterior segment. Among them, the cutting of the plain plate is classified into scribing cutting using a diamond or hard metal wheel or laser cutting. The method comprises the steps of marking and cutting a glass sheet similar to a final product but with enlarged size by using a diamond or hard metal wheel, and then breaking the glass by a mechanical method, wherein the enlarged size can prolong the CNC grinding and chamfering workload, prolong the processing time, reduce the efficiency and increase the loss of consumables. In the conventional laser cutting method, laser energy is concentrated to a micro-area on the surface of the glass within a short time to evaporate the glass, but the edge of the glass is often melted and cannot be removed from the glass substrate.
At present liquid crystal display cover plate glass beveling, appearance processing all is accomplished by CNC CNC engraving and milling machine promptly, can get rid of through the CNC edging because produce sharp edges and corners during the cutting, and through grinding and polishing glass's geometric configuration size control in tolerance requirement range. However, when the CNC edge grinding and chamfering are carried out, an external force is applied to the surface of the glass by mechanical grinding, the glass is inevitably subjected to edge breakage as a brittle material, so that the reject ratio of the glass product is increased, in order to solve the problem of edge breakage, a cutter with a higher mesh number is generally adopted, the adoption of the cutter with the higher mesh number only reduces the length of cracks, but does not solve the problem of crack generation, and the cutting speed of the cutter with the higher mesh number is far slower than that of the cutter with the lower mesh number, so that the production efficiency is greatly reduced.
With the rise of electronic devices, the application of glass in the display field is becoming wider, which also puts higher demands on the appearance and strength of glass. At present, the appearance and the size of a glass product are complex and changeable, but the CNC engraving and milling machine is limited by the size of a grinding wheel, so that edge grinding and chamfering cannot be performed on acute angles and special edge areas, if a process is available, the edge grinding and chamfering process of glass is not limited by the appearance, microcracks caused by CNC machining of the glass are reduced, the strength of the glass is improved, and great economic benefit and social benefit are achieved.
Disclosure of Invention
Therefore, the invention aims to solve the technical problems of high edge breakage reject ratio and low glass strength in the existing edge chamfering method of the glass cover plate, thereby providing the glass cover plate and the processing method thereof.
Therefore, the invention adopts the following technical scheme:
the invention provides a processing method of a glass cover plate, which comprises the following steps:
s1: attaching a protective layer on the glass cover plate;
s2: cutting the glass cover plate attached with the protective layer by using a laser crack cutting method to obtain a glass cover plate attached with the protective layer;
s3: using hydrofluoric acid solution to perform edge chamfering treatment on the glass cover plate attached with the protective layer;
s4: and removing the protective layer of the glass cover plate after the edge chamfering.
Further, when the protective layer is attached at S1, the outer edge of the protective layer is retracted 0-0.5mm compared with the final outer dimension of the glass cover plate.
In the step S3, the edge chamfering treatment is to soak the glass cover plate attached with the protective layer by using 3-10 wt% of hydrofluoric acid solution or to spray the glass cover plate by using a spray head, and the treatment time is 15-60 min.
Preferably, the step of attaching the protective layer in S1 is to coat the UV sensitive ink on both sides of the glass cover plate and then to develop the UV sensitive ink by exposure.
Wherein the thickness of the UV photosensitive ink is 5-30 μm, the coating environment is a yellow dust-free environment, the coating method is roller coating or screen printing on two sides, and then baking is carried out at the temperature of 150-; the exposure and development step is to place the film in an exposure machine for UV ultraviolet double-sided exposure, wherein the wavelength of the exposed UV is 350-450 nm, and the emergent light intensity range is 8mW/cm2-40mW/cm2And putting the exposed glass cover plate into a developer containing 1-5 wt% of sodium hydroxide or potassium hydroxide, and developing at 25-35 ℃ for 5-10 min.
And S4, removing the protective film, namely spraying the chamfered glass cover plate at 40-70 ℃ for 30-150 seconds by using a 3-10 wt% sodium hydroxide solution, removing the photosensitive ink layer, and rinsing to be clean.
Or the protective layer adhered in S1 is an acid-resistant film adhered on the surface of the glass cover plate, the acid-resistant film is made of one of polyethylene, polypropylene, polyvinyl chloride or polyethylene terephthalate, the thickness of the acid-resistant film is 50-150 μm, and the method for adhering the acid-resistant film is to use a double-roller laminator for adhering.
And in S4, the protective film is directly torn off to remove the acid-resistant film.
Further, the laser power in S2 is 20-50kw, and the cutting speed is 30 mm/S-100 mm/S
The invention also provides a glass cover plate which is processed by the processing method.
The technical scheme of the invention has the following advantages:
(1) the invention uses the method of combining laser cutting and chemical chamfering, solves the problem of dependence on the quantity of CNC equipment when the cover plate industry has larger processing requirements, reduces equipment investment, light asset allocation, reduces process flow, and simultaneously can greatly improve size limit.
(2) According to the invention, hydrofluoric acid is used for chemical chamfering after laser cutting, because the section of the glass is a standard vertical plane, when the section is in an acidic solution containing F ions, the F ions have the characteristic of isotropy in erosion of the glass material: the corrosion exists in each direction of each point, but the contact area of the protruded sharp corner part is larger, and the fluid scouring speed and force in the process are larger, so that the protruded part is preferentially removed, a process that the vertical surface contracts inwards in an equal proportion and the angle of the sharp corner is gradually increased is formed, straight edges can be chamfered, C-shaped chamfered edges with the angle of 45 +/-5 degrees are formed, the requirement of tight assembly of the glass cover plate and the plastic shell is met, and the fastening effect of the plastic outer frame on the cover plate can be realized; meanwhile, the chemical edge chamfering is easy to strip, and the speed and the efficiency are high.
(3) When the protective layer is attached, the outer edge of the protective layer is retracted 0-0.5mm compared with the final outer dimension of the glass cover plate, so that the final required chamfered edge dimension is achieved.
(4) The processing method provided by the invention uses exposure development or acid-resistant film sticking to attach the protective layer, not only prevents hydrofluoric acid from corroding the surface in the chamfering process, but also has the function of controlling the chamfering size of the glass product, controls the etching to occur in a fixed area and guides the etching removal amount to be concentrated on the right-angled edge of the glass cutting line to the maximum extent by controlling the dimension of the exposure development or the distance between the protective film and the edge, and meanwhile, the existence of the protective layer can greatly reduce the possibility that the glass surface is damaged in the process of turnover and technology, and improve the yield.
(5) The invention uses laser crack cutting method, focuses laser beam in the glass, heats the glass middle layer, quenches the surface layer to form temperature difference and tensile stress, the tensile stress makes the glass surface start to break along the direction of the preset marking line, thereby achieving the purpose of cutting. The method has high cutting precision and small reserved amount, can meet the size requirement of a final product in one step, and can only perform chamfering, shorten the process flow and improve the production efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a flow chart of a processing method in examples 1 to 5 of the present invention;
FIG. 2 is a schematic structural diagram of the photosensitive ink-coated glass cover plate obtained in step (1) of example 1 of the present invention;
FIG. 3 is a schematic structural view of the exposed and developed glass cover plate obtained in step (2) of example 1;
FIG. 4 is a schematic structural diagram of the laser-cut cover glass obtained in step (3) of example 1 of the present invention;
FIG. 5 is a schematic structural diagram of the chamfered cover glass obtained in step (4) in example 1 of the present invention;
FIG. 6 is a schematic structural diagram of the cover glass after the protective layer is removed in step (5) in example 1 of the present invention;
FIG. 7 is an enlarged view of a portion of the chamfered edge portion of the glass cover plate of FIG. 6;
FIG. 8 is a photograph of the glass cover sheet obtained in example 1 taken when the edge breakage state is observed with a microscope;
FIG. 9 is a photograph taken when the edge breakage of the cover glass obtained in comparative example 1 is observed with a microscope;
FIG. 10 is a photograph taken when the edge breakage of the cover glass obtained in comparative example 2 was observed with a microscope.
Description of reference numerals:
1-a glass cover plate; 2-a protective layer; 3-glass cover plate.
Detailed Description
The following examples are provided to further understand the present invention, not to limit the scope of the present invention, but to provide the best mode, not to limit the content and the protection scope of the present invention, and any product similar or similar to the present invention, which is obtained by combining the present invention with other prior art features, falls within the protection scope of the present invention.
The examples do not show the specific experimental steps or conditions, and can be performed according to the conventional experimental steps described in the literature in the field.
The reagents and instruments used in the present invention were as follows:
a glass cover plate: high alumina glass-corning 2320; UV sensitive ink: red big electron HD-200; acid-resistant film: a tin-free good pp film with a thickness of 100 μm;
laser cutting instrument: a large group of lasers PLG 1612-FL-50; an exposure machine: taiwan Zhi Sheng UVE-M552.
The rest of the reagents are all standard reagents in the market.
The following specific examples are further illustrative of the present invention, and the examples do not exemplify all the embodiments of the present invention, but only some of the embodiments are exemplified, and the specific examples are as follows:
example 1
This embodiment provides a method for processing a glass cover plate, as shown in fig. 1, which comprises the following steps:
(1) coating UV sensitive ink with the thickness of 5 mu m on two sides of a glass cover plate 1 to serve as a protective layer 2, wherein the coating environment is a yellow dust-free environment, the coating method is roll coating on two sides, and then baking is carried out for 10min at the temperature of 250 ℃, and the final structure is shown in FIG. 2;
(2) placing into an exposure machine for UV ultraviolet double-sided exposure, wherein the exposure UV wavelength is 450nm, and the emergent light intensity range is 40mW/cm2The exposed glass cover plate 1 is put into a developer containing 5 wt% of sodium hydroxide or potassium hydroxide and developed for 5min at 30 ℃, the final structure is shown in figure 3, the outer edge of the protective layer 2 is retracted by 0.5mm compared with the final external dimension of the glass cover plate 3;
(3) cutting the glass cover plate 1 attached with the protective layer 2 by using a laser crack cutting method to obtain a glass cover plate 3 attached with the protective layer 2, wherein the laser power is 50kw, the cutting speed is 100mm/s, and the final structure is shown in figure 4;
(4) soaking the glass cover plate 3 attached with the protective layer 2 by using 10 wt% hydrofluoric acid solution for 60min, wherein the final structure is shown in FIG. 5;
(5) and (3) placing the chamfered glass cover plate 3 into a 10 wt% sodium hydroxide solution, spraying for 150 seconds at 70 ℃ to remove the photosensitive ink layer, then rinsing to obtain the glass cover plate 3 shown in figure 5, and chamfering to obtain a 45-degree C-shaped chamfered edge, wherein the structure is shown in figure 6.
Example 2
This embodiment provides a method for processing a glass cover plate, as shown in fig. 1, which comprises the following steps:
(1) sticking an acid-resistant film on the surface of the glass cover plate by using a film sticking machine to form a protective layer, wherein the outer edge of the protective layer is in accordance with the final shape and size of the glass cover plate;
(2) cutting the glass cover plate attached with the protective layer by using a laser crack cutting method to obtain a glass cover plate attached with the protective layer, wherein the laser power is 30kw, and the cutting speed is 60 mm/s;
(3) spraying the glass cover plate attached with the protective layer by using a 6 wt% hydrofluoric acid solution for 45min by using a spray head;
(4) and directly tearing off the protective layer on the glass cover plate after edge chamfering, and then rinsing to obtain a final glass cover plate product, wherein the edge chamfering is carried out to obtain a 45-degree C-shaped edge chamfering.
Example 3
This embodiment provides a method for processing a glass cover plate, as shown in fig. 1, which comprises the following steps:
(1) coating UV sensitive ink with the thickness of 20 mu m on two sides of a glass cover plate to serve as a protective layer, wherein the coating environment is a yellow dust-free environment, the coating method is screen printing, and then baking is carried out for 30min at the temperature of 200 ℃;
(2) placing into an exposure machine for UV ultraviolet double-sided exposure, wherein the exposure UV wavelength is 350nm, and the emergent light intensity range is 20mW/cm2Putting the exposed glass cover plate into a developer containing 1 wt% of potassium hydroxide, and developing at 25 ℃ for 10min, wherein the outer edge of the protective layer conforms to the final shape and size of the glass cover plate;
(3) cutting the glass cover plate attached with the protective layer by using a laser crack cutting method to obtain a glass cover plate attached with the protective layer, wherein the laser power is 20kw, and the cutting speed is 50 mm/s;
(4) spraying the glass cover plate attached with the protective layer by using a spray head by using 5 wt% hydrofluoric acid solution, wherein the treatment time is 15 min;
(5) and (3) placing the chamfered glass cover plate into a 5 wt% sodium hydroxide solution, spraying for 30 seconds at 40 ℃ to remove the photosensitive ink layer, then rinsing to obtain a final glass cover plate product, and chamfering to obtain a 45-degree C-shaped chamfered edge.
Example 4
This embodiment provides a method for processing a glass cover plate, as shown in fig. 1, which comprises the following steps:
(1) sticking an acid-resistant film on the surface of the glass cover plate by using a film sticking machine to form a protective layer, wherein the outer edge of the protective layer is retracted by 0.5mm compared with the final appearance size of the glass cover plate;
(2) cutting the glass cover plate attached with the protective layer by using a laser crack cutting method to obtain a glass cover plate attached with the protective layer, wherein the laser power is 40kw, and the cutting speed is 80 mm/s;
(3) soaking the glass cover plate attached with the protective layer by using 8 wt% hydrofluoric acid solution for 40 min;
(4) and directly tearing off the protective layer on the glass cover plate after edge chamfering, and then rinsing to obtain a final glass cover plate product, wherein the edge chamfering is carried out to obtain a 45-degree C-shaped edge chamfering.
Example 5
This embodiment provides a method for processing a glass cover plate, as shown in fig. 1, which comprises the following steps:
(1) coating UV sensitive ink with the thickness of 30 mu m on two sides of a glass cover plate to serve as a protective layer, wherein the coating environment is a yellow dust-free environment, the coating method is roll coating of the two sides, and then baking is carried out for 20min at the temperature of 150 ℃;
(2) placing into an exposure machine for UV ultraviolet double-sided exposure, wherein the exposure UV wavelength is 400nm, and the emergent light intensity range is 8mW/cm2Putting the exposed glass cover plate into a developer containing 3 wt% of sodium hydroxide, and developing at 35 ℃ for 8min, wherein the outer edge of the protective layer is retracted by 0.5mm compared with the final external dimension of the glass cover plate;
(3) cutting the glass cover plate attached with the protective layer by using a laser crack cutting method to obtain a glass cover plate attached with the protective layer, wherein the laser power is 40kw, and the cutting speed is 30 mm/s;
(4) soaking the glass cover plate attached with the protective layer by using 3 wt% hydrofluoric acid solution for 30 min;
(5) and (3) placing the chamfered glass cover plate into a 3 wt% sodium hydroxide solution, spraying for 100 seconds at 50 ℃, removing the photosensitive ink layer, then rinsing to obtain a final glass cover plate product, and chamfering to obtain a 45-degree C-shaped chamfered edge.
Comparative example 1
The difference of the comparative example is that the glass cover plate is prepared by using the traditional process, and the specific steps are that the glass cover plate is mechanically cut into glass sheets with the size allowance of more than 0.5mm relative to the finished product, and the glass sheets are cleaned and then placed into a CNC lathe for shape processing until the required size and edge shape are achieved, so that the final glass cover plate product is obtained.
Comparative example 2
The present comparative example differs from example 1 in that CNC chamfering is used.
The comparative example provides a method for processing a glass cover plate, comprising the following steps:
(1) coating UV sensitive ink with the thickness of 5 mu m on two sides of a glass cover plate to serve as a protective layer, wherein the coating environment is a yellow dust-free environment, the coating method is roller coating of the two sides, and then baking is carried out for 10min at the temperature of 250 ℃;
(2) placing into an exposure machine for UV ultraviolet double-sided exposure, wherein the exposure UV wavelength is 450nm, and the emergent light intensity range is 40mW/cm2Putting the exposed glass cover plate into a developer containing 5 wt% of sodium hydroxide or potassium hydroxide, and developing at 30 ℃ for 5min, wherein the outer edge of the protective layer is retracted by 0.2mm compared with the final external dimension of the glass cover plate;
(3) cutting the glass cover plate attached with the protective layer by using a laser crack cutting method to obtain a glass cover plate attached with the protective layer, wherein the laser power is 50kw, and the cutting speed is 100 mm/s;
(4) putting the glass cover plate attached with the protective layer into a CNC (computerized numerical control) lathe for shape processing until the required size and edge shape are achieved;
(5) and (3) placing the chamfered glass cover plate into a 10 wt% sodium hydroxide solution, spraying for 150 seconds at 70 ℃, removing the photosensitive ink layer, and then rinsing to obtain the final glass cover plate product.
Comparative example 3
The present comparative example differs from example 1 in that no protective layer is applied.
The comparative example provides a method for processing a glass cover plate, comprising the following steps:
(1) cutting the glass cover plate by using a laser crack cutting method to obtain a glass cover plate, wherein the laser power is 50kw, and the cutting speed is 100 mm/s;
(2) and soaking the glass cover plate by using 10 wt% of hydrofluoric acid solution for 60min to obtain a final glass cover plate product.
Examples of the experiments
The examples 1 to 5 and comparative examples 1 to 3 were subjected to edge chipping observation and glass strength test, the test methods of which are: the edge breakage is observed by a microscope, the image is grabbed, then the edge breakage size is measured by microscope software, the strength test adopts a double-ring pressure test method, and the edge breakage result and the strength test result are shown in the following table:
TABLE 1 edge chipping and Strength testing of examples and comparative examples
| Edge chipping amount (μm) | Bending strength (MPa) | |
| Example 1 | 3 | 53 |
| Example 2 | 5 | 53 |
| Example 3 | 7 | 52 |
| Example 4 | 6 | 54 |
| Example 5 | 7 | 51 |
| Comparative example 1 | 85 | 24 |
| Comparative example 2 | 83 | 22 |
| Comparative example 3 | 7 | 58 |
As can be seen from the above table, the edge chipping amount of comparative examples 1 and 2 is significantly larger than that of each example, as shown in the figure, fig. 8 is the edge chipping amount of example 1, fig. 9 is the edge chipping amount of comparative example 1, fig. 10 is the edge chipping amount of comparative example 2, and as can also be clearly seen from comparison of fig. 3, the edge chipping amount of example 1 of the present application is significantly smaller than that of comparative examples 1 and 2; meanwhile, the bending strength of the comparative examples 1 and 2 is influenced by CNC and is lower than that of the examples; the amount of edge chipping and the bending strength of comparative example 3 were similar to those of examples, but since the protective film was not used in advance, the edge portions thereof were substantially free from edge chipping, and the product thickness was also reduced due to corrosion.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (10)
1. A method for processing a glass cover plate is characterized by comprising the following steps:
s1: attaching a protective layer on the glass cover plate;
s2: cutting the glass cover plate attached with the protective layer by using a laser crack cutting method to obtain a glass cover plate attached with the protective layer;
s3: using hydrofluoric acid solution to perform edge chamfering treatment on the glass cover plate attached with the protective layer;
s4: and removing the protective layer of the glass cover plate after the edge chamfering.
2. The process of claim 1, wherein when S1 is adhered to the protective layer, the outer edge of the protective layer is retracted 0-0.5mm compared with the final outer dimension of the cover glass.
3. The process according to claim 2, wherein the chamfering at S3 is carried out by immersing the protective-layer-attached cover glass with 3-10 wt% hydrofluoric acid solution or spraying with a spray head for 15-60 min.
4. The process of any one of claims 1 to 3, wherein the step of attaching the protective layer in S1 comprises coating UV sensitive ink on both sides of the glass cover plate and then exposing and developing.
5. The processing method as claimed in claim 4, wherein the UV sensitive ink has a thickness of 5-30 μm, the coating environment is yellow dust-free, the coating method is roller coating or screen printing, and then baking is performed at 250 ℃ for 10-30min at 150-; the exposure and development step is to place the film in an exposure machine for UV ultraviolet double-sided exposure, wherein the wavelength of the exposed UV is 350-450 nm, and the emergent light intensity range is 8mW/cm2-40mW/cm2And putting the exposed glass cover plate into a developer containing 1-5 wt% of sodium hydroxide or potassium hydroxide, and developing at 25-35 ℃ for 5-10 min.
6. The processing method according to claim 5, wherein in S4, the protective film is removed by spraying the chamfered cover glass with 3-10 wt% sodium hydroxide solution at 40-70 deg.C for 30-150S to remove the photosensitive ink layer, and rinsing.
7. The process according to any one of claims 1 to 3, wherein the step S1 of attaching the protective layer is to attach an acid-resistant film on the surface of the glass cover plate, the acid-resistant film is made of one of polyethylene, polypropylene, polyvinyl chloride or poly terephthalic acid and has a thickness of 50-150 μm, and the acid-resistant film is attached by a double-roll laminator.
8. The process of claim 7, wherein the step of removing the protective film in S4 is direct peeling of the acid-resistant film.
9. The process according to any one of claims 1 to 8, wherein the laser power in S2 is 20 to 50kw and the cutting speed is 30 to 100 mm/S.
10. A cover glass processed by the method of any one of claims 1 to 9.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113371989A (en) * | 2021-05-26 | 2021-09-10 | 苏州镭明激光科技有限公司 | Splitting method and splitting device for semiconductor chip |
| CN114014556A (en) * | 2021-11-19 | 2022-02-08 | 赛德半导体有限公司 | Ultra-thin glass strengthening method, ultra-thin glass, display screen and touch display device |
| CN118380329A (en) * | 2024-04-10 | 2024-07-23 | 通芯微半导体(南通)有限公司 | Processing method of improved glass-based carrier plate |
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