CN111710507A - A DIP-to-SMD Integrated Inductor Structure - Google Patents

Abstract

The invention discloses an integrally formed inductance structure of a DIP (double in-line package) rotating SMD (surface mounted device), which comprises a winding body and a base body, wherein the winding body consists of a winding coil and winding lead-out pins, and the joint of the winding coil and the winding lead-out pins is a coil lead-out end; the base body is a metal powder pressing forming block body which completely covers the winding coil; a pin outlet is formed in the bottom surface of the seat body, and a pin bending section is arranged at one end of the winding lead-out pin on one side of the bottom surface through the pin outlet; the bent and whole section of the pin is horizontally attached to the bottom surface; the invention adopts the integrally formed inductor with a plug-in piece and a patch piece, and fills the blank which cannot be reached by the current patch type to a great extent, namely the inductor is applicable to both high and low inductance and high and low product; and all requirements of the integrally formed inductor are met simultaneously: the magnetic shielding structure has a closed circuit and strong anti-interference performance.

Description

A DIP-to-SMD Integrated Inductor Structure

technical field

The invention belongs to the technical field of inductance components, and in particular relates to a DIP-to-SMD integrated inductance structure.

Background technique

Molding Choke is a kind of high-end inductor. It is directly formed on the coil with magnetic core material, and has the characteristics of solid structure and precise characteristics; using magnetic shielding structure, the circuit is closed and has strong resistance to electrical interference (EMI); Ultra-low buzzer, high density; small volume, high current, and excellent temperature rise and inductance characteristics in complex environments. It is very suitable for DC-DC (direct current to direct current) power management module (PMU) used in thin and light smart mobile terminal products, suitable for mobile phones, automobiles, aviation, communications, electric vehicles and charging piles and other fields

The demand for MoldingChock is soaring and oligopolistic competition: MoldingChoke can be used not only in mobile phones, but also in automobiles, aviation, communications and other fields. Looking only at the mobile phone market demand, MoldingChoke is currently dominated by Apple and Samsung applications, and the usage rate of HOV and other brands is low, and the product supply is in short supply. It is estimated that by 2020, the penetration rate of 26 mobile phones will be 70%, the global annual demand will be 36.4 billion, and the market size will be 7.28 billion yuan, with a compound annual growth rate of about 33%.

MoldingChoke is currently in short supply, and the next five years will be a period of rapid growth in the industry; MoldingChoke has become the best choice for leading brand manufacturers. With the release of production capacity, it is expected that there will be more fields such as mobile phones, automobiles, communications, electric vehicles and charging piles. use

The advantages of MoldingChoke over traditional inductors are: small size, low RDC, high rated current, high efficiency, not easy to generate noise, good high load, not easy to be affected by electromagnetic interference, good quality, high temperature resistance grade of the wire used (above H grade), It does not produce skin phenomenon and is relatively stable with frequency changes.

At present, the SMD of MoldingChoke on the market has a relatively narrow inductance range and low product height, and there are many traditional inductors that cannot be replaced; and its processing process requires equipment and parameter customization, high processing costs, and poor adaptability to mainstream production lines. Production is difficult.

SUMMARY OF THE INVENTION

The purpose of the present invention is to solve the above problems, to provide a DIP-to-SMD integrally formed inductor structure, which is an integrally formed inductor that adopts a plug-in to SMD type, which largely fills the gap that cannot be achieved by the current SMD type. That is, the inductance and product height are applicable; and at the same time, it meets all the requirements of the integrated inductor: magnetic shielding structure, strong anti-electrical interference in circuit closure; ultra-low buzzer, high density; high current, still maintains excellent performance in complex environments Temperature rise characteristics and inductance characteristics, etc.

In order to achieve the above purpose, the technical solution adopted in the present invention is: a DIP-to-SMD integrally formed inductor structure, which includes a winding body and a seat body, the winding body is composed of a winding coil and a winding lead-out pin, and the winding coil is connected with the coil. The connection point of the winding lead-out pin is the coil lead-out end; the base body is a metal powder press-molded block that completely covers the winding coil; the bottom surface of the base body is provided with a foot outlet, and one end of the winding lead-out pin passes through The foot outlet is provided with an entire bent lead section on one side of the bottom surface; the entire bent lead segment is horizontally fitted and arranged on the bottom surface.

Further, the upper and lower coil lead-out ends of the winding coil are arranged on the same side of the winding coil, and the foot outlets are arranged side by side on one side of the long side of the rectangular bottom surface.

Further, the upper and lower coil lead-out ends of the winding coil are respectively arranged on both sides of the winding coil, and the foot outlets are located side by side on the short side of the rectangular bottom surface.

Further, the seat body is provided with a seat body cushion above the bottom surface and below the entire bent section of the lead.

Further, its height is 3mm-13mm.

Further, its inductance L value is 0.22uH-68uH.

Further, the seat body is an alloy powder or a hydroxy iron powder press-molded block.

Further, the winding coil is a flat coil.

Beneficial effects of the present invention:

1. In the present invention, the winding body adopts the winding coil and the winding lead-out pin on one side, and cooperates with the integrated molding process to realize the plug-in molding to the patch molding process, so that the molding machine used has no special requirements, the price is not high, and the operation Simple and so on.

2. Compared with the SMD of MoldingChoke on the market, its normal height is 5mmMax, and the L value is 10uH Max; while the height range of the product of the present invention is between 3mm-13mm, and the L value is 0.22uH-68uH; the adjustment range is relatively wide; A set of blanks that cannot be achieved by current SMD inductors, that is, product height and inductance.

3. The structure of the present invention is also different from the current SMD of MoldingChoke. It adopts flat coil non-circular wire flattening and ordinary molding machine non-specialized molding machine.

4. The present invention adopts the method of plug-in molding and then transferring to the patch, which is not a dedicated patch-type molding; it perfectly utilizes the mature plug-in molding processing technology in the current integrated molding field, and transfers the patch for processing and molding to achieve a sticker that better meets the processing requirements. Chip integrated inductor.

5. The present invention also has a magnetic shielding structure, strong anti-electromagnetic interference ability; low loss, high efficiency, wide applicable frequency and wide application range; lightweight design, space saving, suitable for high density SMT and other functions.

Description of drawings

FIG. 1 is a schematic diagram of the three-dimensional structure of the present invention.

FIG. 2 is a schematic diagram of a longitudinal section of the internal three-dimensional structure of the present invention.

FIG. 3 is a schematic diagram of the three-dimensional structure of the present invention before processing and converting to SMD.

FIG. 4 is a schematic three-dimensional structural diagram of the winding body 1 before being processed and converted to SMD according to the present invention.

FIG. 5 is a schematic three-dimensional structure diagram of the winding body 1 according to the preferred embodiment of the present invention.

Figure 6 is a schematic diagram of the longitudinal section of the internal three-dimensional structure of the preferred embodiment of the present invention.

In the figure: 1. Winding body; 2. Base; 3. Winding coil; 4. Winding lead; 5. Base cushion; 6. Bottom surface; 7. Outlet; 8. Side; 9. Coil lead-out ; 10. The pin is bent over the entire section.

Detailed ways

In order to make those skilled in the art better understand the technical solutions of the present invention, the present invention will be described in detail below with reference to the accompanying drawings. The description in this part is only exemplary and explanatory, and should not have any limiting effect on the protection scope of the present invention. .

As shown in FIG. 1-FIG. 6, the specific structure of the present invention is: a DIP-to-SMD integrated inductor structure, which includes a winding body 1 and a base body 2, and is characterized in that the winding body 1 is composed of a winding coil 3. and the winding lead-out pin 4, the connection between the winding coil 3 and the winding lead-out pin 4 is the coil lead-out end 9; the seat body 2 is a metal powder press-molded block that completely covers the winding coil 3; the A foot outlet 7 is provided on the bottom surface of the seat body 2, and one end of the winding lead-out foot 7 is provided with a lead bending whole section 10 on the bottom side through the foot outlet 7; 6 on the bottom.

Preferably, the upper and lower coil lead-out ends 9 of the winding coil 3 are arranged on the same side of the winding coil 3 , and the foot outlets 7 are arranged side by side on the long side of the rectangular bottom surface 6 .

Preferably, the upper and lower coil lead-out ends 9 of the winding coil 3 are respectively disposed on both sides of the winding coil 3 , and the foot outlets 7 are located side by side on the short side of the rectangular bottom surface 6 .

In order to further realize the SMD bending and finishing processing and positioning, the seat body 2 is provided with a seat body cushion 5 above the bottom surface 6 and below the lead bending entire section 10 .

Preferably, the height of the structure of the present invention is 3mm.

Preferably, the height of the structure of the present invention is 13 mm.

Preferably, the inductance L value of the present invention is 0.22uH.

Preferably, the inductance L value of the present invention is 68uH.

Preferably, the seat body 2 is an alloy powder press-formed block.

Preferably, the seat body 2 is a hydroxy iron powder press-molded block.

Preferably, the winding coil 3 is a flat coil.

It should be noted that, herein, the terms "comprising", "comprising" or any other variation thereof are intended to encompass non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements, It also includes other elements not expressly listed or inherent to such a process, method, article or apparatus.

Specific examples are used herein to illustrate the principles and implementations of the present invention, and the descriptions of the above examples are only used to help understand the method and the core idea of the present invention. The above are only the preferred embodiments of the present invention. It should be pointed out that due to the limited expression of words, there are objectively unlimited specific structures. For those of ordinary skill in the art, without departing from the principles of the present invention However, some improvements, modifications or changes can also be made, and the above-mentioned technical features can also be combined in an appropriate manner; these improvements, modifications, or combinations, or the concept and technical solutions of the invention are directly applied to other occasions without improvement. should be regarded as the protection scope of the present invention.

Claims (8)

1. An integrally formed inductance structure of a DIP (double in-line package) to SMD (surface mounted device) comprises a winding body (1) and a base body (2), and is characterized in that the winding body (1) consists of a winding coil (3) and a winding lead-out pin (4), and a coil lead-out end (9) is arranged at the joint of the winding coil (3) and the winding lead-out pin (4); the seat body (2) is a metal powder pressing block body which completely covers the winding coil (3); a pin outlet (7) is formed in the bottom surface of the seat body (2), and a pin bending section (10) is arranged at one end of the winding lead-out pin (7) on one side of the bottom surface through the pin outlet (7); the pin bending section (10) is horizontally attached to the bottom surface (6).

2. The integrated inductor structure of DIP to SMD as claimed in claim 1, wherein said coil terminals (9) on the upper and lower sides of said winding coil (3) are disposed on the same side of said winding coil (3), and said pin outlets (7) are disposed side by side on the long side of the rectangular bottom surface (6).

3. The integrated inductor structure of the DIP rotating SMD as claimed in claim 1, wherein the coil terminals (9) of the upper and lower sides of the winding coil (3) are respectively disposed at both sides of the winding coil (3), and the pin outlets (7) are disposed side by side at one side of the short side of the rectangular bottom surface (6).

4. The integrated inductor structure of the DIP corner SMD as claimed in claim 1, wherein the base body (2) is provided with a base body cushion layer (5) above the bottom surface (6) and below the pin bending sections (10).

5. The integrated inductor structure of DIP rotary SMD as claimed in claim 1, wherein its height is 3mm-13 mm.

6. The integrated inductor structure of DIP to SMD as claimed in claim 1, wherein its inductance L is 0.22uH-68 uH.

7. The integrally formed inductor structure of DIP rotary SMD according to claim 1, wherein said base body (2) is an alloy powder or a hydroxyl iron powder press-formed block.

8. The integrated inductor structure of DIP turns SMD according to claim 1, characterized in that said winding coil (3) is a pancake coil.

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