CN104681267A - Manufacturing method of chip type inductor - Google Patents
Manufacturing method of chip type inductor Download PDFInfo
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- CN104681267A CN104681267A CN201310604400.9A CN201310604400A CN104681267A CN 104681267 A CN104681267 A CN 104681267A CN 201310604400 A CN201310604400 A CN 201310604400A CN 104681267 A CN104681267 A CN 104681267A
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Abstract
The invention discloses a manufacturing method of a chip type inductor. The method comprises the steps of preparing iron core powder; pressing the iron core powder into a powder core in a shape of a Chinese character Ri (sun); sintering the pressed powder core in the shape of the Chinese character Ri (sun) to form an iron core in a shape of the Chinese character Ri (sun); manufacturing an insulation layer on the surface of the iron core after sintering the iron core; manufacturing an electrode layer on the surface of the insulation layer; coiling a coiling part of the iron core with a coil; electrically connecting the coil with the electrode layer; sealing the coil area with glue to form a closed magnetic circuit structure; then exposing the electrode layer to form the chip type inductor after the closed magnetic circuit structure is manufactured.
Description
Technical field
The present invention relates to a kind of inductor, espespecially a kind of manufacture method of chip-type inductor.
Background technology
Inductor is the one of passive device, has the electronic component resisting any curent change, and it by coil winding the iron core material supported and formed, and iron core material can be magnetic material or nonmagnetic substance.Inductor is changed by coil current, and to produce magnetic flux change, according to the circuit element that the phenomenon in magnetic field is made, wherein the source in magnetic field is that electric charge is flowing, and it is exactly that electric current formed.The electric current exchanged can produce magnetic field, and the magnetic field of variation can induce electric current, the ratio of its linear relationship, and we are called inductance.
Traditional knockdown inductor, mainly there is the I-shaped iron core of a manganese-zinc ferrite, by coil winding on this I-shaped iron core, the more I-shaped iron core group being wound with coil is loaded on a section is in the lid of U-shaped, to form knockdown inductor.Because the permeability of this knockdown inductor is high, saturated magnetic force is low, easily saturated in use, cannot resistance to big current, is not therefore used.
Current inductor is all that requirement can resistance to big current, and therefore most inductor is as choke or anti-current device.The making of this inductor utilizes powder compaction to form, leading winding air core coil, air core coil is positioned in mould, iron powder is poured into be pressed into an inductor with this coil in this mould after, the practice of this kind of powder compaction makes permeability low, saturated magnetic force is high, and inductor is not easily saturated in use, can resistance to larger electric current.
Another kind of powder compaction, an air core coil is first made when making, air core coil is placed in mould, the iron powder of macromolecular material colloid is had to pour in mould by adding, every square centimeter is utilized to form with the compacting of the high pressure of 6 ~ 8 ton force amounts, in manufacturing process, easily make the insulating varnish on coil be racked, cause coil short circuit between layers, cause the generation of big current.
Another powder compaction, adopt the pedestal that siderochrome Si powder (FeCrSi) is first hot pressed into a convex shape, the coil be wound around is being placed on the projection of this pedestal, siderochrome silicon (FeCrSi) is compressed on this pedestal to be coated on the projection of this coil and this pedestal by recycling hot forming technology, only make the bottom of pedestal expose, the production method of this kind of inductor easily produces leakage phenomenon.
Another powder compaction, is first make an air core coil and a lead frame, is placed in mould by air core coil and lead frame, after being poured into by iron powder more first carry out mold pressing in mould, then after hot-pressing processing, namely completes the making of inductor.Because the spare part of this kind of inductor is more, therefore also relatively take a lot of work sequence and man-hour in making.
Summary of the invention
In view of this, the technical problem to be solved in the present invention is the manufacture method providing a kind of chip-type inductor, makes inductor have resistance to electric current high, heat-resisting height.
Another technical problem that the present invention will solve is the manufacture method providing a kind of chip-type inductor, avoids producing leakage phenomenon.
For solving the problems of the technologies described above, technical scheme of the present invention is achieved in that a kind of manufacture method of chip-type inductor, comprising:
A) an iron core powder, is had;
B), this iron core powder compaction is become day font powder core;
C), " day " font powder core of having suppressed sinters, and makes this " day " font powder core form the iron core of " day " font;
D), after this iron core burns, a layer insulating is made on the surface in this iron core;
E), on the surface of this insulating barrier, an electrode layer is made;
F), in the wound portion of this iron core, a coil is wound around, this coil and this electrode layer electrically connect; And
G), with this coil region carry out sealing to form a closed-flux structure, this closed-flux structure after manufacturing, makes this electrode layer expose, forms the inductor of a chip-type.
Further, at the iron core powder of a step be iron nickel 50 powder of iron silicon powder material or soft magnetic material.
Further, in b step, utilize thermosetting processing procedure iron core powder compaction to be become one for " day " font powder core.
Further, be make this " day " font powder core form the iron core of " day " font with low-temperature sintering in step c.
Further, this iron core has a framework, there is in this framework a wound portion, have two between this wound portion and this framework and wear groove.
Further, this iron core makes magnetic permeability mu=60 with sintering technology.
Further, the insulating barrier in Step d is insulating varnish.
Further, the electrode layer in step e prints one deck layers of copper with printing technology, then to power on silver coating in layers of copper, or after printing silver layer, then the mode of electrotinning makes electrode layer on silver layer.
Further, the coil in f step has two the end of a thread, this two the end of a thread respectively with electrode layer electrically connect.
Further, this coil is flat bare copper wire.
Further, the magnetic closed-flux structure of g step is Magnetic adhesive.
Further, this chip-type inductor copper loss is 0.67W.
Further, the Equivalent DC impedance of this chip-type inductor is 6.74mohm.
The technique effect that the present invention reaches is as follows: the manufacture method of chip-type inductor of the present invention utilizes thermosetting, sintered compound mode makes chip-type inductor, makes inductor have resistance to electric current high, heat-resisting height.After this inductor completes, this coil is coated in this closed-flux structure, can avoid producing leakage phenomenon.
Accompanying drawing explanation
Fig. 1 is the Making programme schematic diagram of chip-type inductor of the present invention.
Fig. 2 is the core structure schematic diagram of chip-type inductor of the present invention.
Fig. 3 be chip-type inductor of the present invention iron core on make insulating barrier schematic diagram.
Fig. 4 be chip-type inductor of the present invention insulating barrier on make electrode layer schematic diagram.
Fig. 5 be chip-type inductor of the present invention iron core on winding around schematic diagram.
Fig. 6 is the section cross-sectional schematic of the 6-6 position at Fig. 5.
Fig. 7 is the encapsulation schematic diagram of chip-type inductor of the present invention.
Fig. 8 is the section cross-sectional schematic of the 8-8 position at Fig. 7.
Step 100 ~ 114
Iron core 1
Framework 11
Wound portion 12
Wear groove 13
Insulating barrier 2
Electrode layer 3
Coil 4
The end of a thread 41
Closed-flux structure 5.
Embodiment
Hereby the technical content and a detailed description for the present invention, coordinate graphic being described as follows now:
Referring to Fig. 1 ~ Fig. 7, is Making programme and the structural representation of chip-type inductor of the present invention.As shown in the figure: the manufacture method of chip-type inductor of the present invention, first, as step 100, have iron core powder, this iron core powder is iron nickel 50 powder (FeNi50) of iron Si powder material (FeSi) or soft magnetic material.
Step 102, thermosetting makes, and is utilized by above-mentioned iron core powder thermosetting processing procedure to be pressed into one and is about " day " font powder core (as shown in Figure 2).
Step 104, sintering makes, " day " the font powder core above-mentioned compacting completed sinters, after low-temperature sintering, this " day " font powder core is made to form the iron core (powder core sintered body) 1 of " day " font, this iron core 1 has a framework 11, there is in this framework 11 wound portion 12, have between this wound portion and this framework 11 and run through two of iron core 1 and wear groove 13 (as shown in Figure 2).In this is graphic, this iron core 1 utilizes sintering technology, makes magnetic permeability mu=60.
Step 106, makes insulating barrier, after the iron core 1 of this day font sinters, is manufactured with an insulating barrier 2 (as shown in Figure 3) on the surface in this iron core 1.In this is graphic, this insulating barrier 2 is insulating varnish.
Step 108, make electrode layer, after the insulating barrier 2 on iron core 1 surface completes, one deck layers of copper is printed to utilize printing technology, to power on silver coating in layers of copper again, or after printing silver layer, then the mode of electrotinning makes an electrode layer 3 (as Fig. 4) on the surperficial precalculated position of insulating barrier 2 on silver layer.
Step 110, has a copper cash, by this copper cash through in this two wound portion 12 being wound in this iron core 1 of wearing groove 13 to form coil 4, two ends after the winding of this coil 4 respectively have a end of a thread 41 (as shown in Figure 5).In this is graphic, this coil is flat bare copper wire.
Step 112, connecting electrode layer, after coil 4 is wound around, by the end of a thread 41 electrically connect (as shown in Figure 6) on electrode layer 3 of coil 4 two end.
Step 114, sealing make, with on Magnetic adhesive this coil 4 region coated to form a closed-flux structure 5, this closed-flux structure 5 after manufacturing, makes this electrode layer 3 expose, and also forms the inductor (as shown in Figure 7, Figure 8) of a chip-type.In this is graphic, this closed-flux structure 5 can be avoided producing leakage field phenomenon.
Above-mentioned iron core 1 is that iron nickel 50 powder (FeNi50) sintering adopting iron Si powder or soft magnetic material makes magnetic permeability mu=60.Because permeability is high, this coil 4 around the number of turns few, copper loss is 0.67w, and Equivalent DC impedance DCR (DC Resistance) is 6.74mohm, and therefore electric current is little, has the high and heat-resisting high characteristic of resistance to electric current.
Referring to Fig. 2 ~ Fig. 8, is each viewing angle constructions schematic diagram of chip-type inductor of the present invention.As shown in the figure: chip-type inductor structure of the present invention, comprising: iron core 1, insulating barrier 2, electrode layer 3, coil 4 and a closed-flux structure 5.
This iron core 1, it has a framework 11, has a wound portion 12 in this framework 11, has two and wear groove 13 between this wound portion 12 and this framework 11.In this is graphic, this iron core 1 is day font, and with iron nickel 50 powder (FeNi50) of iron Si powder material (FeSi) or soft magnetic material for material, utilizes sintering technology to make magnetic permeability mu=60.
This insulating barrier 2, is coated on the outer surface of this iron core 1.In this is graphic, this insulating barrier 2 is insulating varnish.
This electrode layer 3, is located at the insulating barrier 2 of this iron core 1 side on the surface, this electrode layer 3 has a layers of copper, is provided with a silver layer in this layers of copper, or this electrode layer 3 is a silver layer, is provided with a tin layers in this silver layer.
This coil 4, two to wear groove 13 through this, and be wound around and be located at this wound portion 12, it has two the end of a thread 41, this two the end of a thread 41 is electrically connected on this electrode layer 3.This coil 4 is flat bare copper wire.
This closed-flux structure 5, be located on this coil 4, with the flat bare copper wire of this coil 4 coated, after this closed-flux structure 5 this coil 4 coated, form a chip-type inductor structure (as shown in Figure 7), can allow chip-type inductor structure being attached on this circuit board (not shown) with surface mount technology.In this is graphic, this closed-flux structure 5 can avoid generation leakage field phenomenon for Magnetic adhesive.
Above-mentioned iron core 1 is that iron nickel 50 powder (FeNi50) sintering adopting iron Si powder or soft magnetic material makes magnetic permeability mu=60.Because permeability is high, this coil 4 around the number of turns few, copper loss is about 0.67w, and equivalence makes DC impedance DCR (DC Resistance) be about 6.74mohm, and therefore electric current is little, has the high and heat-resisting high characteristic of resistance to electric current.
Above are only preferred embodiment of the present invention, be not used for limiting scope of the invention process.Namely all equalizations done according to the present patent application the scope of the claims change and modify, all by the scope of the claims of the present invention is contained.
Claims (13)
1. a manufacture method for chip-type inductor, is characterized in that, comprising:
A) an iron core powder, is had;
B), this iron core powder compaction is become day font powder core;
C), the day font powder core suppressed sinters, and makes this " day " font powder core form the iron core of " day " font;
D), after this iron core burns, a layer insulating is made on the surface in this iron core;
E), on the surface of this insulating barrier, an electrode layer is made;
F), in the wound portion of this iron core, a coil is wound around, this coil and this electrode layer electrically connect; And
G), with this coil region carry out sealing to form a closed-flux structure, this closed-flux structure after manufacturing, makes this electrode layer expose, forms the inductor of a chip-type.
2., as claims requires the manufacture method as described in 1, it is characterized in that, be iron nickel 50 powder of iron silicon powder material or soft magnetic material at the iron core powder of a step.
3. manufacture method as claimed in claim 2, is characterized in that, utilizes thermosetting processing procedure iron core powder compaction to be become one for " day " font powder core in b step.
4. manufacture method as claimed in claim 3, is characterized in that, is the iron core making this day font powder core formation " day " font with low-temperature sintering in step c.
5. manufacture method as claimed in claim 4, is characterized in that this iron core having a framework, has a wound portion in this framework, have two and wear groove between this wound portion and this framework.
6. manufacture method as claimed in claim 5, it is characterized in that, this iron core makes magnetic permeability mu=60 with sintering technology.
7. manufacture method as claimed in claim 6, it is characterized in that, the insulating barrier in Step d is insulating varnish.
8. manufacture method as claimed in claim 7, wherein, the electrode layer in step e prints one deck layers of copper with printing technology, then to power on silver coating in layers of copper, or after printing silver layer, then the mode of electrotinning makes electrode layer on silver layer.
9. manufacture method as claimed in claim 8, is characterized in that the coil in f step having two the end of a thread, this two the end of a thread respectively with electrode layer electrically connect.
10. manufacture method as claimed in claim 9, it is characterized in that, this coil is flat bare copper wire.
11. manufacture methods as claimed in claim 10, is characterized in that, the magnetic closed-flux structure of g step is Magnetic adhesive.
12. manufacture methods stated as claim 11, is characterized in that, this chip-type inductor copper loss is 0.67W.
13. manufacture methods as claimed in claim 12, is characterized in that, the Equivalent DC impedance of this chip-type inductor is 6.74mohm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310604400.9A CN104681267A (en) | 2013-11-26 | 2013-11-26 | Manufacturing method of chip type inductor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310604400.9A CN104681267A (en) | 2013-11-26 | 2013-11-26 | Manufacturing method of chip type inductor |
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| CN104681267A true CN104681267A (en) | 2015-06-03 |
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| CN201310604400.9A Pending CN104681267A (en) | 2013-11-26 | 2013-11-26 | Manufacturing method of chip type inductor |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109148101A (en) * | 2018-09-04 | 2019-01-04 | 珠海群创新材料技术有限公司 | A kind of soft magnetic core and preparation method thereof of high pressure resistant inductor |
| CN112655060A (en) * | 2020-11-17 | 2021-04-13 | 深圳顺络电子股份有限公司 | Integrally formed inductor and manufacturing method thereof |
| CN114360837A (en) * | 2020-10-12 | 2022-04-15 | 昆山磁通新材料科技有限公司 | Method for manufacturing magnetic element |
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| WO2001078092A1 (en) * | 2000-04-12 | 2001-10-18 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing chip inductor |
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| CN203103053U (en) * | 2013-01-15 | 2013-07-31 | 三积瑞科技（苏州）有限公司 | Polymer composite plastic inductance |
| CN103339695A (en) * | 2011-01-31 | 2013-10-02 | 东光株式会社 | Surface mount inductor and method for manufacturing surface mount inductor |
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Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1267066A (en) * | 1999-03-12 | 2000-09-20 | 株式会社村田制作所 | Coil and surface mounted type coil element |
| WO2001078092A1 (en) * | 2000-04-12 | 2001-10-18 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing chip inductor |
| CN2731657Y (en) * | 2004-07-02 | 2005-10-05 | 潘正友 | Improved Structure of Inductor Core and Wire Frame |
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| CN102294475A (en) * | 2011-08-17 | 2011-12-28 | 天通控股股份有限公司 | Ferrosilicon material and mu60 ferrosilicon magnetic powder core manufacturing method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109148101A (en) * | 2018-09-04 | 2019-01-04 | 珠海群创新材料技术有限公司 | A kind of soft magnetic core and preparation method thereof of high pressure resistant inductor |
| CN114360837A (en) * | 2020-10-12 | 2022-04-15 | 昆山磁通新材料科技有限公司 | Method for manufacturing magnetic element |
| CN112655060A (en) * | 2020-11-17 | 2021-04-13 | 深圳顺络电子股份有限公司 | Integrally formed inductor and manufacturing method thereof |
| CN112655060B (en) * | 2020-11-17 | 2024-04-12 | 深圳顺络电子股份有限公司 | One-piece molded inductor and manufacturing method thereof |
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Application publication date: 20150603 |