CN111638002B - MEMS pressure sensor oil filling core and packaging method thereof - Google Patents
MEMS pressure sensor oil filling core and packaging method thereof Download PDFInfo
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- CN111638002B CN111638002B CN202010530588.7A CN202010530588A CN111638002B CN 111638002 B CN111638002 B CN 111638002B CN 202010530588 A CN202010530588 A CN 202010530588A CN 111638002 B CN111638002 B CN 111638002B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000003921 oil Substances 0.000 claims abstract description 48
- 238000007789 sealing Methods 0.000 claims abstract description 43
- 239000012528 membrane Substances 0.000 claims abstract description 34
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 26
- 239000010703 silicon Substances 0.000 claims abstract description 26
- 239000004065 semiconductor Substances 0.000 claims abstract description 14
- 238000001514 detection method Methods 0.000 claims abstract description 9
- 238000003466 welding Methods 0.000 claims description 32
- 239000000853 adhesive Substances 0.000 claims description 22
- 230000001070 adhesive effect Effects 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229910000831 Steel Inorganic materials 0.000 claims description 7
- 230000000903 blocking effect Effects 0.000 claims description 7
- 239000010959 steel Substances 0.000 claims description 7
- 239000000945 filler Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 10
- 230000008859 change Effects 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 7
- 230000035882 stress Effects 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/06—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0264—Pressure sensors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention relates to the technical field of pressure sensors, and discloses an MEMS pressure sensor oil filling core body, which comprises an upper cover, a base and a sensitive component, wherein the lower end of the upper cover is connected with the base in a sealing way, the base and the upper cover form a sealing cavity, a detection medium is filled in the sealing cavity, and the sensitive component is arranged on the base and positioned in the sealing cavity. According to the MEMS pressure sensor oil filling core and the packaging method thereof, the chip formed by the silicon elastic membrane, the semiconductor resistor and the signal calibration module is adopted, a signal processing circuit is not required to be arranged outside, the lead wire is less in interconnection, the structure is simple, the cost is low, the product reliability is high, the production is convenient, the semiconductor resistor and the signal calibration module are located on different planes, the signal calibration module is located on the periphery of the silicon elastic membrane, the risk that the stress change of the silicon elastic membrane affects the signal calibration module, and a circuit in the signal calibration module is damaged is avoided, and the precision is guaranteed.
Description
Technical Field
The invention relates to the technical field of pressure sensors, in particular to an MEMS pressure sensor oil filling core and a packaging method thereof.
Background
The pressure sensor has the main function of converting an external pressure signal into an electric signal and is widely applied to the fields of automobile electronics, aerospace, petrochemical industry, medical appliances, consumer electronics and the like.
The pressure chip is used as a core device of the pressure sensor and can be mainly divided into a diffused silicon piezoresistive pressure sensor, a capacitive pressure sensor, a piezoelectric pressure sensor and a resonant pressure sensor; the pressure sensor chip adopts advanced MEMS technology, forms a pressure sensing diaphragm by etching technology, and produces a pressure sensitive element in a pressure sensing diaphragm area by ion implantation, in addition, the MEMS pressure sensor has small volume, light weight, low cost and high sensitivity, is suitable for batch production, has wide application environment, different application environments have different requirements on MEMS pressure sensor packaging modes, in order to meet the medium compatibility of the sensor, the pressure sensor oil filling cores of different packaging modes are published, the existing oil filling core packaging modes are difficult to get rid of defects of high product cost, complex manufacturing process, low precision, poor reliability and the like, the patent CN106768592A discloses a pressure transmitter oil filling core with signal processing function, a base disclosed by the pressure transmitter oil filling core is a high pressure sintering seat, the base body is manufactured by machining, the processing efficiency is low, the cost is high, the manufacturing process is not compatible with a mature semiconductor packaging technology, such as an automatic high-speed patch and full-automatic high-speed lead bonding, in addition, a temperature measuring module, a signal processing unit and a pressure sensing unit are arranged on the same surface, the pressure sensor is not damaged by the pressure sensor, the pressure sensor is arranged in the sealing cavity of the pressure sensor, the pressure sensor is not damaged by the pressure sensor chip, and the pressure sensor is arranged in the sealing cavity of the air-absorbing module, and the pressure sensor is not damaged by the pressure sensor has a sealing structure of the air-absorbing module, and the pressure sensor is in the sealing cavity, and the pressure sensor is in the air-sensitive cavity is in the air-sensitive area, and the pressure sensor is in the air-sensitive area is in the air-sealing cavity area, meanwhile, the internal silicone oil filling volume is too much, the output temperature drift of the pressure sensor is increased, the accuracy of the sensor is reduced, in addition, a pressure chip and AS I C double-chip mode is adopted in the packaging module, the manufacturing cost and failure risk of the product are increased, a simple oil filling core body is disclosed in the patent CN208721309U, a pipe shell adhered with the pressure chip is directly riveted, the process leads to huge stress of the pipe shell product, the stress is transmitted to the pressure chip, the output drift of the sensor is caused, the consistency and the accuracy are degraded, in addition, a sealing ring with a thermal expansion coefficient far exceeding that of a silicon chip is arranged in the sealing cavity, and the output temperature drift of the sensor is caused to be increased under the high-low temperature condition.
Disclosure of Invention
(One) solving the technical problems
Aiming at the defects of the prior art, the invention provides an MEMS pressure sensor oil filling core body and a packaging method thereof, which have the advantages of high detection precision of the oil filling core body and the like, and solve the problems that in the prior art, a temperature measuring module, a signal processing unit and a pressure sensing unit are arranged on the same working surface, and the pressure sensing unit belongs to the weakest area of a sensor chip and continuously deforms along with pressure change, and the signal processing unit is also arranged on the area, so that a microcircuit in the chip is exposed to fatigue damage, and the precision of the sensor is reduced.
(II) technical scheme
In order to achieve the aim of high detection precision of the oil-filled core, the invention provides the technical scheme that the MEMS pressure sensor oil-filled core comprises an upper cover, a base and a sensitive component;
the lower end of the upper cover is connected with the base in a sealing way, the base and the upper cover form a sealing cavity, and a detection medium is filled in the sealing cavity;
The base is provided with a sensitive component which is positioned in the sealed cavity, and the sensitive component comprises a silicon elastic membrane and a signal calibration module which are positioned on the same plane;
The signal calibration module is positioned around the silicon elastic membrane;
The silicon elastic membrane is provided with a semiconductor resistor.
Preferably, the upper surface of the base is provided with a patch adhesive and a positioning mark, the patch adhesive is used for bonding the sensitive component, and the positioning mark is distributed on the periphery of the patch adhesive.
Preferably, a back pressing sheet is further arranged between the patch adhesive and the sensitive component.
Preferably, a round hole is formed in the center of the surface mount adhesive, and a through hole communicated with the round hole is formed in the lower surface of the base.
Preferably, the base is also provided with a pin, the pin is provided with a lead wire electrically connected with the sensitive component, and the joint of the pin and the base is provided with sintered glass.
Preferably, the base is also provided with a filling hole, and the lower surface of the base is connected with steel balls positioned in the filling hole.
Preferably, a first welding ring with a conical section is arranged on the contact surface of the base and the lower end of the upper cover in a sealing connection mode.
Preferably, the upper cover comprises a circular ring, a pressure diaphragm and a shell, wherein a second welding ring is arranged on the shell, the shell is connected with the circular ring through the second welding ring, the pressure diaphragm is positioned between the shell and the circular ring, the pressure diaphragm and the shell are all made of metal with the same model.
Preferably, the upper surface of the shell is provided with an overpressure blocking groove, the lower surface of the shell is provided with a medium groove, and the medium groove is communicated with the overpressure blocking groove.
A packaging method of an MEMS pressure sensor oil filling core body comprises the following steps:
(a) The circular ring, the pressure membrane and the shell are coaxially combined in sequence, and an upper cover is formed in a sealing welding mode through a second welding ring;
(b) The sensitive component is adhered to the paster adhesive of the base and positioned by the positioning mark, so that the quick paster is realized;
(c) Ultrasonic thermal bonding is carried out on the sensitive component and the pins through the leads, so that the sensitive component and the pins form electrical connection;
(d) Sealing and welding the base and the upper cover in a resistance welding mode through a first welding ring with a conical section;
(e) Filling liquid medium into a medium groove in the shell through a filler hole in a vacuum environment;
(f) Sealing and welding the steel balls with the filling holes on the base to form an oil filling core;
(g) And (5) performing calibration test on the finished oil-filled core.
(III) beneficial effects
Compared with the prior art, the invention provides the MEMS pressure sensor oil filling core body and the packaging method thereof, which have the following beneficial effects:
1. According to the MEMS pressure sensor oil filling core and the packaging method thereof, the chip formed by the silicon elastic membrane, the semiconductor resistor and the signal calibration module is adopted, a signal processing circuit is not required to be arranged outside, the lead wire is less in interconnection, the structure is simple, the cost is low, the product reliability is high, the production is convenient, the semiconductor resistor and the signal calibration module are located on different planes, the signal calibration module is located on the periphery of the silicon elastic membrane, the risk that the stress change of the silicon elastic membrane affects the signal calibration module, and a circuit in the signal calibration module is damaged is avoided, and the precision is guaranteed.
2. According to the MEMS pressure sensor oil filling core and the packaging method thereof, the ring, the pressure diaphragm and the shell are all made of metal of the same model, and all-metal packaging is adopted, so that materials with strong hygroscopicity and large thermal expansion coefficient such as PCB and plastic parts are not arranged in the sealing cavity, and bubbles, moisture and thermal deformation are prevented from being generated in the sealing cavity, and the reliability and the precision of a product are reduced.
3. According to the MEMS pressure sensor oil filling core and the packaging method thereof, the medium filling quantity in the sealed cavity is controlled to be the minimum volume, and the smaller the medium filling volume is, the smaller the shrinkage and expansion quantity of the product due to the CTE of the medium material is under the high-low temperature change, so that the high-low temperature precision of the MEMS pressure sensor oil filling core is improved.
4. According to the MEMS pressure sensor oil filling core and the packaging method thereof, the upper surface of the base is provided with the patch adhesive and the positioning mark, the patch adhesive is used for bonding the sensitive component, the positioning mark is distributed on the periphery of the patch adhesive for positioning, and high-speed automatic patch is convenient to realize.
Drawings
Fig. 1 is a cross-sectional view of a first embodiment of a MEMS pressure sensor oil filled core structure according to the present invention.
Fig. 2 is a structural diagram of an upper cover in a first embodiment of an oil filling core of a MEMS pressure sensor according to the present invention.
Fig. 3 is a block diagram of a base and a sensitive component in a first embodiment of an oil filling core of a MEMS pressure sensor according to the present invention.
Fig. 4 is a block diagram of a sensitive component in a first embodiment of an oil filling core of a MEMS pressure sensor according to the present invention.
Fig. 5 is a top view of a base in a first embodiment of a MEMS pressure sensor oil-filled core according to the present invention.
Fig. 6 is a cross-sectional view of a second embodiment of a MEMS pressure sensor oil filled core according to the present invention.
Fig. 7 is a block diagram of a sensitive component in a second embodiment of an oil filling core of a MEMS pressure sensor according to the present invention.
In the figure, the upper cover 10, the base 20, the pin 201, the upper surface of the base 202, the first welding ring 203, the filler hole 204, the sintered glass 205, the positioning mark 206, the lead 301, the adhesive tape 302, the sensitive component 40, the elastic membrane 41, the signal calibration module 42, the semiconductor resistor 43, the back-pressed sheet 44, the through hole 510, the circular ring 11, the pressure membrane 12, the housing 13, the overpressure blocking groove 131, the medium groove 132, the second welding ring 14, the steel ball 15, the sealing cavity 16 and the detection medium 17 are arranged.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Embodiment one:
Referring to fig. 1-5, an oil filling core of a MEMS pressure sensor comprises an upper cover 10, a base 20 and a sensitive component 40, wherein the base 20 is provided with the sensitive component 40, the sensitive component 40 comprises a silicon elastic membrane 41 and a signal calibration module 42, the silicon elastic membrane 41 and the signal calibration module 42 are arranged on a bare chip and are positioned on the same horizontal plane, the signal calibration module 42 is positioned around the silicon elastic membrane 41, the silicon elastic membrane 41 is provided with a semiconductor resistor 43, the semiconductor resistor 43 and the signal calibration module 42 are positioned on different planes, the signal calibration module 42 is positioned around the silicon elastic membrane 41, the risk that lines in the signal calibration module 42 are damaged due to the stress change of the silicon elastic membrane 41 influencing the signal calibration module 42 is avoided, and the accuracy is guaranteed;
The lower end of the upper cover 10 is in sealing connection with the base 20, the base 20 and the upper cover 10 form a sealing cavity 16, a detection medium 17 is filled in the sealing cavity 16 in a vacuum way, the detection medium can be silicone oil, the sensitive component 40 is positioned in the sealing cavity 16 and is in contact with the detection medium 17, a filler hole 204 is further formed in the base 20 and is used for filling the sealing cavity 16 with the medium, a steel ball 15 is connected in the lower surface of the base 20 and is used for sealing, a first welding ring 203 with a conical section is arranged on a contact surface of the base 20 and the lower end of the upper cover 10 in sealing connection, and a uniform and compact welding surface can be formed during welding, so that the sealing property and the structural stability of the welding surface are ensured;
The base 20 is provided with a pin 201, a sintered glass 205 is arranged at the joint of the pin 201 and the base 20, the sintered glass 205 is used for insulating and sealing the base 20, the pin 201 and the base 20 are made of metal, preferably made of kovar with lower CTE, and the surface layer material is gold-plated, the pin 201 is provided with a lead 301 electrically connected with the sensitive component 40, the connection is completed in a full-automatic thermosonic bonding mode, the lead 301 can be a gold wire, an aluminum wire or a copper wire, and the lead is gold wire, the upper surface 202 of the base 20 is provided with a patch adhesive 302 and a positioning mark 206, the patch adhesive 302 is used for bonding the sensitive component 40, the positioning mark 206 is distributed on the periphery of the patch adhesive 302 for positioning, so that high-speed automatic patch is convenient to realize, and a back pressing piece 44 is further arranged between the patch adhesive 302 and the sensitive component 40, and the back pressure of the sensitive component 40 is ensured;
The upper cover 10 comprises a circular ring 11, a pressure membrane 12 and a shell 13, wherein a second welding ring 14 is arranged on the shell 13, the shell 13 is connected with the circular ring 11 through the second welding ring 14, the pressure membrane 12 is positioned between the shell 13 and the circular ring 11, and the pressure membrane 12 is a flat membrane or a corrugated pressure membrane;
The upper surface 202 of the shell 13 is provided with an overpressure blocking groove 131 for preventing the pressure diaphragm 12 from being damaged due to overlarge deformation caused by overload of external pressure, the lower surface of the shell 13 is provided with a medium groove 132, the medium groove 132 is communicated with the overpressure blocking groove 131, the groove depth of the medium groove 132 can influence the volume of the sealing cavity 16, and further the filling amount of the medium 17 is reduced, so that the medium is kept at the minimum amount, and the product output drift caused by thermal expansion and cold contraction of the medium 17 is avoided.
A packaging method of an MEMS pressure sensor oil filling core body comprises the following steps:
(a) The ring 11, the pressure membrane 12 and the shell 13 are coaxially combined in sequence, and the upper cover 10 is formed in a sealing welding mode through a second welding ring 14;
(b) The sensitive component 40 is adhered to the patch adhesive 302 of the base 20 and positioned by the positioning mark 206, so that quick patch is realized;
(c) Ultrasonic thermal bonding of the sensitive component 40 to the pin 201 via the leads 301 to form an electrical connection;
(d) Sealing and welding the base 20 and the upper cover 10 in a resistance welding mode through a first welding ring 203 with a conical section;
(e) Filling liquid medium into the medium groove 132 in the shell 13 through the filler holes 204 under vacuum environment;
(f) Sealing and welding the steel balls 15 and the filling holes 204 on the base 20 to form an oil filling core;
(g) And (5) performing calibration test on the finished oil-filled core.
Embodiment two:
Referring to fig. 6-7, the difference between the embodiment one and the embodiment one is that there is no back pressing sheet between the adhesive sheet 302 and the sensitive component 40, and the center of the adhesive sheet 302 is provided with a circular hole, and the lower surface of the base 20 is provided with a through hole 510 communicated with the circular hole, so that the oil-filled core is conducted with the atmospheric environment, and the measurement value relative to the atmospheric pressure can be detected.
When in use:
(1) The external pressure acts on the pressure diaphragm 12, the medium 17 filled in the sealing cavity 16 is extruded through the pressure diaphragm 12, and then the pressure is conducted to the sensitive component 40 through the medium 17, so that the change of the silicon elastic diaphragm 41 on the sensitive component 40 is caused, the silicon elastic diaphragm 41 is stressed to generate strain, the resistance value of the semiconductor resistor 43 on the silicon elastic diaphragm is changed differently under the action of the piezoresistive effect and the anisotropy of the material, and a voltage signal corresponding to the pressure value is output through the Stokes bridge principle.
(2) The circular ring 11, the pressure diaphragm 12 and the shell 13 are all made of metal with the same model, so that thermal stress caused by CTE mismatch among materials is eliminated, and the reduction of sensor output accuracy is avoided.
The beneficial effects of the invention are as follows:
compared with the prior art, the MEMS pressure sensor oil filling core and the packaging method thereof adopt the chip formed by the silicon elastic membrane 41, the semiconductor resistor 43 and the signal calibration module 42, a signal processing circuit is not required to be arranged outside, the leads 301 are less in interconnection, the structure is simple, the cost is low, the product reliability is high, the semiconductor resistor 43 and the signal calibration module 42 are positioned on different planes, the signal calibration module 42 is positioned on the periphery of the silicon elastic membrane 41, the risk that the stress change of the silicon elastic membrane 41 influences the signal calibration module 42 to cause damage to circuits in the signal calibration module 42 is avoided, and the precision is guaranteed;
the circular ring 11, the pressure membrane 12 and the shell 13 are all made of the same type of metal, and all-metal packaging is adopted, so that materials with strong hygroscopicity and thermal expansion coefficients such as PCB, plastic parts and the like are not arranged in the sealed cavity 16, and bubbles, moisture and thermal deformation are prevented from being generated in the sealed cavity, and the reliability and the precision of a product are reduced;
The filling quantity of the medium 17 in the sealing cavity 16 is controlled to be the minimum volume, the smaller the filling volume of the medium 17 is, the smaller the shrinkage and expansion quantity of a product caused by the CTE of a medium material are correspondingly smaller under the high-low temperature change, the high-low temperature precision of the MEMS pressure sensor oil filling core is improved, the upper surface 202 of the base 20 is provided with the adhesive tape 302 and the positioning mark 206, the adhesive tape 302 is used for bonding the sensitive component 40, the positioning mark 206 is distributed on the periphery of the adhesive tape 302 for positioning, so that high-speed automatic adhesive bonding is realized, and the problems that in the prior art, a temperature measuring module, a model processing unit and a pressure sensing unit are arranged on the same working surface, and the pressure sensing unit is the weakest part of a sensor chip and continuously deforms along with the pressure change are solved, and the signal processing unit is also arranged on the surface, so that the microcircuit in the chip is subjected to fatigue damage risk, and the sensor precision is reduced.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The MEMS pressure sensor oil filling core is characterized by comprising an upper cover (10), a base (20) and a sensitive component (40);
the lower end of the upper cover (10) is connected with the base (20) in a sealing way, the base (20) and the upper cover (10) form a sealing cavity (16), and a detection medium (17) is filled in the sealing cavity (16);
a sensitive component (40) is arranged on the base (20) and positioned in the sealed cavity (16), and the sensitive component (40) comprises a silicon elastic membrane (41) and a signal calibration module (42) which are positioned on the same plane;
the signal calibration module (42) is positioned around the silicon elastic membrane (41);
the silicon elastic membrane (41) is provided with a semiconductor resistor (43), and the semiconductor resistor (43) and the signal calibration module (42) are positioned on different planes;
the packaging method of the oil filling core body comprises the following steps:
(a) The circular ring (11), the pressure diaphragm (12) and the shell (13) are coaxially combined in sequence, and an upper cover (10) is formed in a sealing welding mode through a second welding ring (14);
(b) The sensitive component (40) is adhered to the surface mount adhesive (302) of the base (20) and positioned by the positioning mark (206) to realize quick surface mount;
(c) Ultrasonic thermal bonding is carried out on the sensitive component (40) and the pins (201) through the leads (301) so as to form electrical connection;
(d) Sealing and welding the base (20) and the upper cover (10) in a resistance welding mode through a first welding ring (203) with a conical section;
(e) Filling liquid medium into a medium groove (132) in the shell (13) through a filler hole (204) in a vacuum environment;
(f) Sealing and welding the steel balls (15) and the filling holes (204) on the base (20) to form an oil filling core;
(g) And (5) performing calibration test on the finished oil-filled core.
2. The MEMS pressure sensor oil-filled core of claim 1, wherein the upper surface (202) of the base (20) is provided with a patch adhesive (302) and a positioning mark (206), the patch adhesive (302) is used for bonding the sensitive component (40), and the positioning mark (206) is distributed on the periphery of the patch adhesive (302).
3. The MEMS pressure sensor oil-filled core of claim 2, wherein a back-pressure sheet (44) is further disposed between the adhesive patch (302) and the sensitive component (40).
4. The MEMS pressure sensor oil filling core as set forth in claim 2, wherein a circular hole is formed in the center of the patch adhesive (302), and a through hole (510) communicated with the circular hole is formed in the lower surface of the base (20).
5. The MEMS pressure sensor oil filling core as set forth in claim 1, wherein a pin (201) is further disposed on the base (20), a lead (301) electrically connected with the sensitive component (40) is disposed on the pin (201), and a sintered glass (205) is disposed at a connection position of the pin (201) and the base (20).
6. The MEMS pressure sensor oil filling core body according to claim 1, wherein the base (20) is further provided with a filling hole (204), and steel balls (15) are connected to the lower surface of the base (20) and located in the filling hole (204).
7. The MEMS pressure sensor oil filling core according to claim 1, wherein a first welding ring (203) with a conical section is arranged on a contact surface of the base (20) and the lower end of the upper cover (10) in a sealing connection manner.
8. The MEMS pressure sensor oil filling core body according to claim 1, wherein the upper cover (10) comprises a circular ring (11), a pressure membrane (12) and a shell (13), a second welding ring (14) is arranged on the shell (13), the shell (13) is connected with the circular ring (11) through the second welding ring (14), the pressure membrane (12) is located between the shell (13) and the circular ring (11), the pressure membrane (12) and the shell (13) are all made of metal with the same model.
9. The MEMS pressure sensor oil filling core according to claim 8, wherein an overpressure blocking groove (131) is formed in the upper surface (202) of the housing (13), a medium groove (132) is formed in the lower surface of the housing (13), and the medium groove (132) is communicated with the overpressure blocking groove (131).
Priority Applications (1)
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| CN112729621A (en) * | 2020-12-21 | 2021-04-30 | 苏州长风航空电子有限公司 | Dual-redundancy pressure sensor and manufacturing method thereof |
| CN113447101A (en) * | 2021-07-14 | 2021-09-28 | 深圳市信为科技发展有限公司 | Hydraulic conduction type mass sensor based on MEMS core and manufacturing process thereof |
| CN113579085B (en) * | 2021-07-16 | 2023-03-31 | 杭州科岛微电子有限公司 | Manufacturing method of oil-filled core packaging structure of diffused silicon pressure sensor |
| CN114061796A (en) * | 2021-11-10 | 2022-02-18 | 中国电子科技集团公司第四十九研究所 | Silicon piezoresistive pressure sensor core and preparation method thereof |
| CN114061831B (en) * | 2022-01-12 | 2022-05-20 | 武汉飞恩微电子有限公司 | Performance testing device for pressure sensor production |
| CN114646420B (en) * | 2022-05-19 | 2022-07-29 | 成都倍芯传感技术有限公司 | Pressure transmitter with high reliability |
| CN115235682B (en) * | 2022-09-21 | 2022-12-20 | 无锡芯感智半导体有限公司 | Packaging structure and method of MEMS pressure sensor |
| CN115711699A (en) * | 2022-11-24 | 2023-02-24 | 中汇瑞德传感科技(苏州)有限公司 | Oil-filled core body of pressure transmitter |
| CN115808263B (en) * | 2023-02-06 | 2023-10-27 | 苏州森斯缔夫传感科技有限公司 | Pressure sensing device, packaging method and pressure monitoring equipment |
| CN119595050A (en) * | 2024-12-11 | 2025-03-11 | 西安亚能电气有限责任公司 | Hydrogen and pressure on-line monitoring device for oil-less equipment top space |
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