CN111625153A - Touch device and method for improving yield of double-line laser splicing positions - Google Patents

Abstract

The invention relates to the field of capacitive touch screens, in particular to a touch control device and a method for improving the bit yield of dual-line laser splicing, including a capacitive touch screen, the capacitive touch screen has a window area, and at least one touch sensing unit is arranged on the edge area of the window Electrodes, each touch sensing unit electrode is connected with a silver paste layer through a touch connection channel, and the silver paste layer is connected to the corresponding touch sensing unit electrode after being drawn out from the touch connection channel, and the silver paste layer is drawn in a double-ended manner. The silver paste layer is provided with an equal number of first silver paste laser lines and interrupted silver paste laser lines. The first silver paste laser line is a complete section, and there are several splicing and cutting points on the interrupted silver paste laser line. The point is to separate the interrupted silver paste laser line into several sections, and the present invention interrupts the interrupted silver paste laser line along the splicing line, so that the splicing position can be avoided by interrupting the routing of the silver paste laser line. There will be problems caused by the splicing delay.

Description

A touch device and method for improving bit yield of dual-line laser splicing

technical field

The invention relates to the field of capacitive touch screens, in particular to a touch control device and a method for improving the bit yield of double-line laser splicing.

Background technique

Capacitive touch screen technology works by using the human body's current sensing. The capacitive touch screen is a four-layer composite glass screen. The inner surface and the interlayer of the glass screen are each coated with a layer of ITO. The outermost layer is a thin layer of silica glass protective layer. The interlayer ITO coating is used as the working surface. Four electrodes, the inner layer of ITO is a shielding layer to ensure a good working environment. When a finger touches the metal layer, a coupling capacitance is formed between the user and the touch screen surface due to the electric field of the human body. For high-frequency current, the capacitance is a direct conductor, so the finger draws a small current from the contact point. This current flows out from the electrodes on the four corners of the touch screen respectively, and the current flowing through these four electrodes is proportional to the distance from the finger to the four corners. The controller obtains the position of the touch point by accurately calculating the ratio of the four currents. . To realize multi-touch on capacitive screen, it depends on adding electrodes of mutual capacitance. Simply put, it is to divide the screen into blocks and set up a set of mutual capacitance modules in each area to work independently, so the capacitive screen can work independently. The touch situation of each area is detected, and after processing, multi-touch is simply realized. The capacitive technology touch panel CTP (CapacityTouchPanel) works by using the current sensing of the human body. The capacitive screen is a four-layer composite glass screen. The inner surface and the interlayer of the glass screen are each coated with a layer of ITO (nano-indium tin metal oxide). Bit yield method: 15mm thick silica glass protective layer, interlayer ITO coating as working surface, four electrodes drawn from four corners, inner layer of ITO as screen layer to ensure working environment. When the user touches the capacitive screen, due to the electric field of the human body, a coupling capacitor is formed between the user's finger and the work surface. Because the work surface is connected to a high-frequency signal, the finger absorbs a small current, which flows from the four corners of the screen respectively. In theory, the current flowing through the four electrodes is proportional to the distance from the finger to the four corners. The controller obtains the position through precise calculation of the ratio of the four currents. It can reach 99% accuracy and has a response speed of less than 3ms.

With the increasing development and maturity of electronic products, the application scope of touch screen has gradually expanded, and its manufacturing technology has also shown diversity. At present, the common capacitive touch screen structures are G+G (glass-to-glass capacitive touch screen), OGS (single glass capacitive touch screen), GF (glass-to-soft film capacitive touch screen), and GFF (glass-to-double-layer soft touch screen). film capacitive touch screen), etc., represented by external capacitive screens, as well as embedded capacitive screens represented by Oncell (the touch panel function is embedded between the color filter substrate and the polarizer) and Incell (the touch panel function is embedded in the liquid crystal pixel). capacitive screen. While the product performance is steadily improving, the size of the product is also getting bigger and bigger, and the screen ratio of the product is continuously increased, the area of the cover plate BM (black matrix) area is minimized, and the area of the display area is increased.

Traditional capacitive displays are mainly made by the following two methods:

The first method is to print silver paste on the pure ITO (indium tin oxide) conductive film that has etched the VA (display area) layer, and then complete the peripheral touch sensing circuit by laser process etching. However, because the film thickness of the printed silver paste is not easy to control, and due to the increase of processing times during the production process, the silver paste diluent volatilizes and the viscosity increases, the uniformity of the silver paste particles, and the dust-free environment have a great influence on the circuit. It is difficult to refine the process of the capacitive screen, and the production yield is low.

The second method is to use a metal ITO conductive film as the conductive film of the capacitive screen, complete the VA area pattern and peripheral wiring by one chemical etching, and then remove the metal in the VA area by secondary etching, and retain the ITO in the VA area as a conductive induction. Floor. In this process, since the metal layer is plated on the ITO layer by the vacuum sputtering process, the metal layer has a tiny void area, which cannot be ruled out by normal visual inspection. As a result, the through-hole area is significantly increased, resulting in disconnection of the touch sensing circuit, affecting the production yield, and bringing instability to the process.

Chinese patent CN201610578836.9 discloses a capacitive screen and a preparation method thereof. By arranging an ITO layer whose surface is a metal conductive layer on a transparent substrate, the metal conductive layer and the ITO layer are chemically etched to form the display area of the capacitive screen and its periphery. The routing area is further laser-etched to the peripheral routing area to form a touch sensing circuit. Through the above method, the preparation method can effectively reduce the space occupied by the touch sensing circuit of the capacitive screen, improve the screen ratio of the product, so that the product can achieve the appearance effect of a narrow frame, and also effectively improve the process yield and process of the product. stability.

However, in the process of making capacitive screens, there is a process for laser engraving lines, which uses light to burn off the unnecessary places, thereby leaving the required conductive channels; as for the size of the burnt, it is determined by the size of the laser spot, according to the current industry The spot size of capacitive screen laser machine is generally between 0.03-0.035mm, so the etched line spacing is generally about 0.035mm; in order to reduce the risk of short circuit, products with space will increase the etched line spacing. The line laser method is to design 2 parallel laser lines with a distance of 0.01-0.02mm, which can be adjusted according to actual needs, so that the etching distance can be changed to about 0.05mm. The galvanometer divides the laser into blocks, and there will be a handover splicing position between the blocks, and this splicing position is the place where the whole laser has the most problems, and the double-line case is even more problematic, so this application is a A method for improving the bit yield of dual-line laser splicing.

SUMMARY OF THE INVENTION

The technical problem to be solved by the present invention is to provide a touch control device and a method for improving the bit yield of double-line laser splicing. The method of improving the yield of the double-line laser splicing bit is to interrupt the silver paste laser line along the splicing line, so that the splicing position can be avoided by interrupting the wiring of the silver paste laser line, and the splicing delay band will not appear. question to come.

In order to solve the above-mentioned technical problems, the present invention provides the following technical solutions:

A touch device is provided, including a capacitive touch screen, the capacitive touch screen has a window area, and at least one touch sensing unit electrode is arranged on the edge area of the window, each of the touch sensing unit electrodes is connected through a touch connection channel There is a silver paste layer, and the silver paste layer is connected to the corresponding touch sensing unit electrodes after being drawn out from the touch connection channel. The silver paste laser line and the interrupted silver paste laser line, the first silver paste laser line is a complete segment, and the interrupted silver paste laser line is provided with several splicing and cutting points, and the splicing and cutting points will interrupt the silver paste. The paste laser line is divided into several sections, and the interrupted silver paste laser line of each section is independent of each other and not connected to each other.

As a preferred solution of the touch device, the capacitive touch screen has a GG structure, a GF structure, a GFF structure, a GF structure or an OGS structure.

As a preferred solution of the touch device, the capacitive touch screen includes several laser-etched blocks, two adjacent laser-etched blocks are connected together, and a splicing line is arranged between the two adjacent laser-etched blocks, so The splicing cut point is set at the splicing line.

As a preferred solution of the touch control device, the interrupted silver paste laser line is interrupted to both ends along the splicing line to form a depression, and the first silver paste laser line corresponds to the interrupted silver paste laser line one-to-one, forming a For multiple groups of double-lead lines, the line distance between the first silver paste laser line and the interrupted silver paste laser line in the same group is 0.01-0.02mm.

As a preferred solution of the touch device, the interrupted silver paste laser lines are arranged in the laser etching blocks, and the number of interrupted silver paste laser lines is less than or equal to the number of laser etching blocks.

Also provided is a method for improving bit yield of dual-line laser splicing, comprising the following steps:

forming an ITO line on the ITO thin film layer of the capacitive touch screen, the ITO line including ITO electrode lines and ITO lead lines;

Use shrinkage aging treatment to completely crystallize the ITO electrode lines and ITO lead lines on the ITO line;

Laminate a dry film on the ITO circuit, and perform ultraviolet exposure treatment to harden the dry film along the direction of the conductive circuit pattern;

The unhardened dry film is washed away with a developer to expose the ITO circuit;

The exposed ITO lines are etched away with etching solution;

The hardened dry film is de-filmed, so that only the ITO circuit layer that forms the conductive circuit remains on the ITO thin film layer;

The conductive silver paste is printed on the frame area of the ITO circuit layer forming the conductive circuit, and the conductive silver paste is laser-etched to form the silver paste overlapping circuit.

As a preferred solution of the method for improving the bit yield of double-line laser splicing of a touch device, conductive silver paste is printed on the border area of the ITO circuit layer forming the conductive circuit, and the conductive silver paste is laser etched to form Silver glue lap line, including:

Determine the area of the frame area of the ITO circuit layer, and divide the frame area of the ITO circuit layer into several laser-etched blocks with equal areas;

Determine the splicing line between two adjacent laser-etched blocks;

In the border area of the ITO circuit layer, screen printing block-shaped silver paste blocks and multiple sets of dual-channel first silver paste laser lines and interrupted silver paste laser lines;

Baking the silver paste block, the first silver paste laser line and the interrupted silver paste laser line, heating and drying to form a silver paste layer and wiring silver paste;

Taking the splicing line as the critical line after drying the interrupted silver paste laser line, the interrupted silver paste laser line is divided into several sections;

Laser etching is performed on the laser-etched blocks with silver paste blocks and wiring silver pastes to form silver-glue overlapping lines.

As a preferred solution of the method for improving the bit yield of dual-line laser splicing of a touch device, the area of the frame area of the ITO circuit layer is determined, and before dividing the frame area of the ITO circuit layer into several laser-etched blocks of equal area, Also includes:

Determine the window area and non-window area of the ITO film layer;

printing a decorative layer in the window area;

forming touch sensing unit electrodes on the non-window area;

A laser shielding layer is printed on the surface of the printed decoration layer.

As a preferred solution of the method for improving the bit yield of the dual-line laser splicing of the touch device, the edge metal layer is overlapped with the touch sensing unit electrode.

As a preferred solution of the method for improving the bit yield of dual-line laser splicing of a touch device, a block-shaped silver paste block and multiple sets of dual-channel first silver paste laser lines and interruptions are screen-printed in the border area of the ITO circuit layer. Among the silver paste laser lines, block-shaped silver paste blocks and multiple groups of double-channel first silver paste laser lines and interrupted silver paste laser lines are screen-printed on the laser shielding layer.

Compared with the prior art, the present invention has the following beneficial effects:

First determine the window area and non-window area of the ITO film layer, print the decorative layer on the window area, and form the touch sensing unit electrodes on the non-window area, wherein the edge metal layer overlaps with the touch sensing unit electrodes, and then print the decorative layer. Surface printing laser shielding layer. Divide the frame area of the ITO circuit layer into several laser-etched blocks of equal area, determine the splicing line between two adjacent laser-etched blocks, that is, find the first laser-etched block and the first laser-etched block. The splicing lines between, screen printing block-shaped silver paste blocks and multiple sets of dual-channel first silver paste laser lines and interrupted silver paste laser lines on the laser shielding layer. The broken silver paste laser line is baked, heated and dried to form a silver paste layer and a silver paste for wiring. In several sections, laser etching is performed on the laser etching blocks with silver paste blocks and wiring silver pastes to form silver paste overlapped lines.

The touch device and the method for improving the yield rate of the double-line laser splicing bit are interrupted along the splicing line by interrupting the silver paste laser line, so that the splicing bit can be avoided by interrupting the alignment of the silver paste laser line. There will be no problems caused by splicing delay. After production verification, the first silver paste laser line is complete, and the interrupted silver paste laser line is intermittent, which leads to the interrupted depression point of the silver paste laser line. There is a sense of boss. The distance of this boss can be adjusted and optimized according to the accuracy of the actual laser equipment, and this slight boss does not affect the performance of the entire channel, but effectively improves the problem of laser burst at a splicing position. It has been verified that the method for improving the yield of the double-line laser splicing bit can effectively improve the problem of the explosion point of the double-line laser splicing bit, and improve the yield of the double-line laser etching splicing bit.

Description of drawings

1 is a schematic diagram of a common method for improving the bit yield of dual-line laser splicing in the prior art;

FIG. 2 is a partial schematic diagram of a common method for improving the bit yield of dual-line laser splicing in the prior art;

3 is a schematic diagram of a method for double-improving double-line laser splicing bit yield in the prior art;

FIG. 4 is a schematic diagram of the method for improving the bit yield of dual-line laser splicing according to the present invention;

5 is a schematic flowchart of a method for double-improving double-line laser splicing bit yield in the prior art;

6 is a schematic flowchart of S700") in the double-improved double-line laser splicing bit yield method in the prior art;

FIG. 7 is a schematic diagram of the method for improving the bit yield of dual-line laser splicing according to the present invention;

FIG. 8 is a schematic flow diagram 1 of S700) in the method for improving the bit yield of dual-line laser splicing according to the present invention;

FIG. 9 is a second schematic flowchart of S700) in the method for improving the bit yield of dual-line laser splicing according to the present invention;

FIG. 10 is a schematic flow chart of S707) in the method for improving the bit yield of double-line laser splicing according to the present invention.

The symbols in the figure are:

1- Touch the connection channel;

2-Silver paste layer;

3- The first silver paste laser line;

4- The second silver paste laser line;

5- the first laser etching block;

6- The first laser etching block;

7- splicing line;

8- Interrupt the silver paste laser line.

Detailed ways

In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", The orientation or positional relationship indicated by "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must have The particular orientation, construction and operation in the particular orientation are therefore not to be construed as limitations of the invention. Furthermore, the terms "first", "second", and "third" are used for descriptive purposes only and should not be construed to indicate or imply relative importance.

With the increasing development and maturity of electronic products, the application scope of touch screen has gradually expanded, and its manufacturing technology has also shown diversity. At present, the common capacitive touch screen structures include G+G (glass-to-glass capacitive touch screen), OGS (single glass capacitive touch screen), GF (glass-to-soft film capacitive touch screen), and GFF (glass-to-double-layer soft touch screen). Membrane capacitive touch screen) and other plug-in capacitive screens, as well as On cell (touch panel function embedded between the color filter substrate and polarizer), Incell (touch panel function embedded in liquid crystal pixels) represented by Embedded capacitive screen. While the product performance is steadily improving, the size of the product is also getting bigger and bigger, and the screen ratio of the product is continuously increased, the area of the cover plate BM (black matrix) area is minimized, and the area of the display area is increased.

Please refer to FIG. 1 and FIG. 2 , the touch device in the prior art includes a capacitive touch screen, and the capacitive touch screen has a GG structure, a GF structure, a GFF structure, a GF2 structure or an OGS structure. The capacitive touch screen has a window area, and the edge area of the window is provided with at least one touch sensing unit electrode, each touch sensing unit electrode is connected with a silver paste layer 2 through a touch connection channel 1, and the silver paste layer 2 is connected from the touch connection channel 1. After being drawn out from the middle, it is connected to the corresponding touch sensing unit electrodes. The silver paste layer 2 is a double-ended lead-out method. The silver paste layer 2 is provided with an equal number of first silver paste laser lines 3 and second silver paste laser lines 4. The first silver paste laser line 3 and the second silver paste laser line 4 are both a complete section, and the first silver paste laser line 3 and the second silver paste laser line 4 correspond one-to-one to form multiple sets of double lead-out lines.

After the touch device in the prior art is directly etched by laser, the line distance between the first silver paste laser line 3 and the second silver paste laser line 4 in the same group is about 0.035mm (that is, the size of the light spot), which is regarded as a large-size capacitor. When the screen is on (above 15 inches), the wiring space of the product will be relatively large. The most important thing is that because the lines are relatively long and many, the problems such as problems such as short circuits will also increase. The problem caused by small size requires the use of double-line laser etching. The line distance between the first silver paste laser line 3 and the second silver paste laser line 4 in the same group before laser etching is about 0.01-0.02m , the line distance between the first silver paste laser line 3 and the second silver paste laser line 4 in the same group after laser etching can be increased to about 0.05mm.

Double-line laser etching is to divide the capacitive touch screen into pieces, which means that the laser is not a line no matter how long it is from the beginning to the end, and then another line is lasered. All lines within this range are all lasered, and then move to the next block of lasers. As for the size of the block, it will be determined according to the galvanometer of each device. At present, the general block size on the market is between 120mm-180mm. This also shows that at present, small-sized mobile phones do not need to be divided into blocks in a single touch screen, and only when the product is larger than the range of blocks, the block laser is required. Please refer to FIG. 3, the capacitive touch screen includes a number of laser-etched blocks, two adjacent laser-etched blocks are connected together, and a splicing line is arranged between the two adjacent laser-etched blocks, such as the adjacent ones in the figure. The first laser etching block 5 and the first laser etching block 6 , and the splicing line 7 is the splicing line between the first laser etching block 5 and the first laser etching block 6 . When two-line laser etching is performed, all the first silver paste laser lines 3 and all second silver paste laser lines 4 in the area of the first laser etching block 5 will be laser etched first, and then moved to the first laser etching block. 6 area laser etching, in the same way, all the first silver paste laser lines 3 and all second silver paste laser lines 4 need to be laser etched once, then there will be a gap between the laser etching block and the laser etching block. A case of a splice bit laser. The position of the splicing line 7 is just at the end of the laser of the previous first laser etching block 5 and the beginning of the laser of the next first laser etching block 6, which is the time when the light is the most unstable. At this time, in order to solve this problem, the laser etching equipment adopts the method of delay compensation; that is, when the previous block ends, it extends to a small range of the next block, and when the next block starts, it extends into the laser of a small segment of the previous block. At this time, the laser at the splicing position will be repeated twice as much as the normal laser, and there will always be laser burst points that are not selected by the design, which will lead to the problem of open and short circuits in the circuit.

Referring to FIG. 5 , the method for improving the bit yield of dual-line laser splicing in the prior art includes the following steps:

S100") forming an ITO circuit on the ITO thin film layer of the capacitive touch screen, and the ITO circuit includes an ITO electrode line and an ITO lead wire;

S200") using shrinkage aging treatment to completely crystallize the ITO electrode wire and ITO lead wire on the ITO circuit;

S300") Laminate the dry film on the ITO circuit, and carry out ultraviolet exposure treatment to harden the dry film along the direction of the conductive circuit pattern;

S400") to wash off the unhardened dry film with developer to expose the ITO circuit;

S500") will expose the ITO circuit to be etched away by etching solution;

S600") stripping the hardened dry film, so that only the ITO circuit layer forming the conductive circuit remains on the ITO thin film layer;

S700") printing conductive silver paste on the border area of the ITO circuit layer forming the conductive circuit, and performing laser etching on the conductive silver paste to form the silver paste overlapping circuit.

Please refer to FIG. 6, S700") printing conductive silver paste on the border area of the ITO circuit layer forming the conductive circuit, and performing laser etching on the conductive silver paste to form the silver paste overlapping circuit, which specifically includes the following steps:

S701") determine the area of the frame area of the ITO circuit layer, and divide the frame area of the ITO circuit layer into several laser-etched blocks with equal areas;

S702") determine the splicing line between two adjacent laser-etched blocks;

S703") screen printing block-shaped silver paste blocks and multiple sets of dual-channel first silver paste laser lines 3 and second silver paste laser lines 4 in the border area of the ITO circuit layer;

S704") baking the silver paste block, the first silver paste laser line 3 and the second silver paste laser line 4, heating and drying to form the silver paste layer 2 and the wiring silver paste;

S705") Laser etching the laser-etched blocks with silver paste blocks and wiring silver paste to form silver-paste lapped lines.

Referring to FIG. 4 , the touch control device includes a capacitive touch screen, and the capacitive touch screen has a GG structure, a GF structure, a GFF structure, a GF2 structure or an OGS structure. The capacitive touch screen has a window area, and the edge area of the window is provided with at least one touch sensing unit electrode, each touch sensing unit electrode is connected with a silver paste layer 2 through a touch connection channel 1, and the silver paste layer 2 is connected from the touch connection channel 1. After being drawn out from the middle, it is connected to the corresponding touch sensing unit electrodes. The silver paste layer 2 is in a double-ended lead-out mode. The silver paste layer 2 is provided with an equal number of first silver paste laser lines 3 and interrupted silver paste laser lines 8. A silver paste laser line 3 is a complete section, and there are several splicing and cutting points on the interrupting silver paste laser line 8. The splicing and cutting points separate the interrupting silver paste laser line 8 into several sections, and each section interrupts the silver paste laser line 8. Lines 8 are independent of each other and not connected to each other.

The capacitive touch screen includes a number of laser-etched blocks, two adjacent laser-etched blocks are connected together, and a splicing line is arranged between the two adjacent laser-etched blocks, and the splicing and cutting point is set at the splicing line. In the adjacent first laser etching block 5 and the first laser etching block 6 in the figure, the splicing line 7 is the splicing line between the first laser etching block 5 and the first laser etching block 6 .

The interrupted silver paste laser line 8 is interrupted along the splicing line to both ends to form a depression. The first silver paste laser line 3 corresponds to the interrupted silver paste laser line 8 one-to-one, forming multiple sets of double lead-out lines, and the first one between the same groups The line distance between the silver paste laser line 3 and the interrupted silver paste laser line 8 is 0.01-0.02mm, the interrupted silver paste laser line 8 is arranged in the laser etching block, and the number of interrupted silver paste laser lines 8 is less than or equal to the laser The number of etched blocks.

Referring to FIG. 7 , the method for improving the bit yield of the dual-line laser splicing of the touch device includes the following steps:

S100) forming an ITO line on the ITO thin film layer of the capacitive touch screen, and the ITO line includes an ITO electrode line and an ITO lead wire;

S200) utilize shrinkage aging treatment to completely crystallize the ITO electrode wire and the ITO lead wire on the ITO circuit;

S300) attaching a dry film on the ITO circuit, and carrying out ultraviolet exposure treatment, so that the dry film is hardened along the direction of the conductive circuit pattern;

S400) the unhardened dry film is washed away with the developer to expose the ITO circuit;

S500) will expose the ITO circuit to utilize etching solution to etch away;

S600) stripping the hardened dry film, so that only the ITO circuit layer forming the conductive circuit is left on the ITO thin film layer;

S700 ) printing conductive silver glue on the border area of the ITO circuit layer forming the conductive line, and performing laser etching on the conductive silver glue to form the silver glue overlapping circuit.

Please refer to FIG. 8, S700) printing conductive silver glue on the border area of the ITO circuit layer forming the conductive line, and performing laser etching on the conductive silver glue to form the silver glue overlapping circuit, which specifically includes the following steps:

S705) determine the area of the frame area of the ITO circuit layer, and divide the frame area of the ITO circuit layer into several laser etching blocks with equal areas;

S706) determine the splicing line between two adjacent laser-etched blocks;

S707) screen printing block-shaped silver paste blocks and multiple sets of dual-channel first silver paste laser lines 3 and interrupted silver paste laser lines 8 in the border area of the ITO circuit layer;

S708) baking the silver paste block, the first silver paste laser line 3 and the interrupted silver paste laser line 8, and heating and drying to form the silver paste layer 2 and the wiring silver paste;

S709) the interrupted silver paste laser line 8 after the drying is a critical line with the splicing line, and the interrupted silver paste laser line 8 is separated into several sections;

S710) Laser etching is performed on the laser etched blocks with silver paste blocks and wiring silver paste to form silver paste lapped lines.

Please refer to FIG. 9, S705) determine the area of the frame area of the ITO circuit layer, before dividing the frame area of the ITO circuit layer into several laser-etched blocks of equal area, the following steps are also included:

S701) determine the window area and the non-window area of the ITO thin film layer;

S702) printing a decorative layer in the window area;

S703) forming a touch sensing unit electrode on the non-window area, and the edge metal layer is overlapped with the touch sensing unit electrode;

S704) Printing a laser shielding layer on the surface of the printing decorative layer.

Please refer to FIG. 10 , S707 ) specifically screen-printing block-shaped silver paste blocks and multiple sets of dual-channel first silver paste laser lines 3 and interrupted silver paste laser lines 8 on the laser shielding layer.

In this way, the splicing position can be avoided by interrupting the wiring of the silver paste laser line 8, and the problem caused by the splicing delay will not occur. After production verification, the first silver paste laser line 3 is complete, and the silver paste is interrupted. The laser line 8 is discontinuous, which leads to a sense of convexity at the recessed point where the discontinuity of the silver paste laser line 8 is interrupted. The distance of this convexity can be adjusted and optimized according to the accuracy of the actual laser equipment, and this slight convexity is not. Affects the performance of the entire channel, but effectively improves the problem of laser burst at a splicing position. For an 86-inch product with a length and width of about 2000*1100mm, based on the maximum galvanometer of 180mm, it needs to be separated into about 7*12=84 blocks, and the block in the middle will appear in 4 directions and need to be spliced. There are too many explosion points in the splicing positions in all directions. As long as a certain explosion point is too large, and the silver paste layer 2 is exploded, there is a disconnection, or the laser is blasted to the silver paste of the wiring to cause a short circuit, which will cause the product. become bad. It has been verified that the method for improving the yield of the double-line laser splicing bit can effectively improve the problem of the explosion point of the double-line laser splicing bit, and improve the yield of the double-line laser etching splicing bit.

During the manufacture of the present invention, the window area and the non-window area of the ITO film layer are first determined, a decorative layer is printed on the window area, and a touch sensing unit electrode is formed on the non-window area, wherein the edge metal layer overlaps with the touch sensing unit electrode. , and then print the laser shielding layer on the surface of the printed decorative layer. Divide the frame area of the ITO circuit layer into several laser-etched blocks of equal area, determine the splicing line between two adjacent laser-etched blocks, namely find the first laser-etched block 5 and the first laser-etched block The splicing line 7 between 6, screen printing block-shaped silver paste blocks and multiple sets of dual-channel first silver paste laser lines 3 and interrupted silver paste laser lines 8 on the laser shielding layer The paste laser line 3 and the interrupted silver paste laser line 8 are baked, heated and dried to form the silver paste layer 2 and the wiring silver paste, and the interrupted silver paste laser line 8 after drying takes the splicing line as the critical line, The interrupted silver paste laser line 8 is divided into several sections, and laser etching is performed on the laser etching block with silver paste block and wiring silver paste to form a silver paste overlap line.

The touch device and the method for improving the bit yield of double-line laser splicing are interrupted along the splicing line 7 by interrupting the silver paste laser line 8, so that splicing can be avoided by interrupting the routing of the silver paste laser line 8 position, there will be no problems caused by the splicing delay. After production verification, the first silver paste laser line 3 is complete, but the interrupted silver paste laser line 8 is intermittent, resulting in interruption of the silver paste laser line. 8 There is a sense of boss at the discontinuous depression point. The distance of this boss can be adjusted and optimized according to the accuracy of the actual laser equipment, and this slight boss does not affect the performance of the entire channel, but effectively improves the laser burst of a splicing position. point question. It has been verified that the method for improving the yield of the double-line laser splicing bit can effectively improve the problem of the explosion point of the double-line laser splicing bit, and improve the yield of the double-line laser etched splicing bit.

Claims (10)

1. A touch device is characterized by comprising a capacitive touch screen, wherein the capacitive touch screen is provided with a window area, the edge area of the window is provided with at least one touch sensing unit electrode, each touch sensing unit electrode is connected with a silver paste layer (2) through a touch connecting channel (1), the silver paste layer (2) is connected with the corresponding touch sensing unit electrode after being led out from the touch connecting channel (1), the silver paste layer (2) is in a double-end leading-out mode, first silver paste laser lines (3) with the same number and silver paste laser lines (8) which are broken are arranged in the silver paste layer (2), the first silver paste laser line (3) is a complete segment, a plurality of splicing cut-off points are arranged on the broken silver paste laser line (8), the splicing cut-off point separates into a plurality of sections with breaking silver thick liquid laser line (8), and the each section breaks silver thick liquid laser line (8) mutually independent and not connected.

2. The touch device as recited in claim 1, wherein the capacitive touch screen is of a GG structure, a GF structure, a GFF structure, a GF2 structure or an OGS structure.

3. The touch device according to claim 2, wherein the capacitive touch screen comprises a plurality of laser etching blocks, two adjacent laser etching blocks are connected together, a splicing line is arranged between the two adjacent laser etching blocks, and the splicing cutting point is arranged at the splicing line.

4. The touch device according to claim 3, wherein the breaking silver paste laser lines (8) break at both ends along the splicing line to form a recess, the first silver paste laser lines (3) correspond to the breaking silver paste laser lines (8) one by one to form a plurality of groups of double outgoing lines, and the distance between the first silver paste laser lines (3) and the breaking silver paste laser lines (8) in the same group is 0.01-0.02 mm.

5. The touch device according to claim 4, wherein the silver paste laser lines (8) are arranged in the laser etching blocks, and the number of the silver paste laser lines (8) is less than or equal to the number of the laser etching blocks.

6. The method of claim 5, wherein the method comprises:

forming an ITO circuit on an ITO thin film layer of the capacitive touch screen, wherein the ITO circuit comprises an ITO electrode wire and an ITO outgoing wire;

completely crystallizing the ITO electrode wires and the ITO outgoing lines on the ITO circuit by using shrinkage aging treatment;

attaching a dry film on the ITO circuit, and performing ultraviolet exposure treatment to harden the dry film along the direction of the conductive circuit pattern;

washing the unhardened dry film by using a developing solution to expose the ITO circuit;

etching the exposed ITO circuit by using an etching solution;

removing the film from the hardened dry film to leave only an ITO circuit layer on the ITO film layer to form a conductive circuit;

and printing conductive silver paste on a frame area of the ITO circuit layer forming the conductive circuit, and performing laser etching on the conductive silver paste to form a silver paste lapping circuit.

7. The method for improving the yield of the double-line laser splicing position of the touch device according to claim 6, wherein conductive silver paste is printed on a frame area of an ITO circuit layer on which the conductive circuit is formed, and the conductive silver paste is subjected to laser etching to form a silver paste splicing circuit, and the method specifically comprises the following steps:

determining the area of a frame area of the ITO circuit layer, and dividing the frame area of the ITO circuit layer into a plurality of laser etching blocks with equal areas;

determining a splicing line between two adjacent laser etching blocks;

silk-screen printing of a blocky silver paste block and a plurality of groups of double-channel first silver paste laser lines (3) and breaking of the silver paste laser lines (8) on a frame area of the ITO circuit layer;

baking the silver paste block, the first silver paste laser line (3) and the broken silver paste laser line (8), and heating and drying to form a silver paste layer (2) and routing silver paste;

dividing the dried broken silver paste laser line (8) into a plurality of sections by taking the splicing line as a critical line;

and carrying out laser etching on the laser etching block with the silver paste block and the routing silver paste to form a silver paste lapping circuit.

8. The method of claim 7, wherein the determining the area of the border region of the ITO trace layer and the dividing the border region of the ITO trace layer into a plurality of laser-etched blocks having equal areas further comprises:

determining a window area and a non-window area of the ITO film layer;

printing a decorative layer on the window area;

forming a touch sensing unit electrode on the non-window area;

and printing a laser shielding layer on the surface of the printing decoration layer.

9. The method of claim 7, wherein the edge metal layer overlaps the touch sensing unit electrode.

10. The method for improving yield of the dual-line laser splicing site of the touch device as claimed in claim 9, wherein the step of screen printing the block-shaped silver paste blocks and the multiple sets of dual-channel first silver paste laser lines (3) and the step of breaking the silver paste laser lines (8) on the frame area of the ITO circuit layer is the step of screen printing the block-shaped silver paste blocks and the multiple sets of dual-channel first silver paste laser lines (3) and the step of breaking the silver paste laser lines (8) on the laser shielding layer.

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