CN111613632A - Display panel and method of making the same - Google Patents

Abstract

The embodiment of the application provides a display panel and a preparation method thereof, the display panel enables a blocking pattern and a binding terminal to form an opening by arranging the blocking pattern around the binding terminal, and the width of the upper end of the opening is larger than that of the lower end of the opening, so that when the Micro light-emitting diode chip deviates, the Micro light-emitting diode chip can slide to the binding terminal from the blocking pattern and is aligned and attached to the binding terminal, the number of the deviated Micro light-emitting diode chip is reduced, and the problem that the Micro-LED chip and the binding terminal of the existing Micro-LED display panel are easily aligned and deviated to cause the Micro-LED chip to fall off is solved.

Description

Display panel and method of making the same

technical field

The present application relates to the field of display technology, and in particular, to a display panel and a manufacturing method thereof.

Background technique

The existing display technology is developing towards the Micro-LED (miniature light-emitting diode) display technology. During the preparation process of the Micro-LED display panel, it is necessary to use the mass transfer technology to transfer the Micro-LED chip to the corresponding position, so that the Micro-LED chip Normal display, as shown in Figure 1, when the existing Micro-LED chip is bound to the drive circuit, the connection layer will bind the Micro-LED chip to the binding terminal, but in the actual process, due to the Micro-LED chip The alignment accuracy between the chip and the binding terminals is high, which leads to a misalignment between the Micro-LED chip and the binding terminals, causing the Micro-LED chip to slip off, resulting in poor display. In the case of LED chips, the number of Micro-LED chips is large, which further increases the possibility of the Micro-LED chips falling off.

Therefore, the existing Micro-LED display panel has the problem that the Micro-LED chip and the binding terminal are prone to misalignment, causing the Micro-LED chip to fall off.

SUMMARY OF THE INVENTION

Embodiments of the present application provide a display panel and a manufacturing method thereof, so as to alleviate the problem that the Micro-LED chip and the binding terminal are prone to misalignment in the existing Micro-LED display panel, causing the Micro-LED chip to fall off.

An embodiment of the present application provides a display panel, the display panel includes:

substrate;

a driving circuit layer, which is arranged on the substrate and is formed with a driving circuit for driving the miniature light-emitting diode chip;

a binding terminal, disposed on the driving circuit layer and corresponding to the driving circuit;

The barrier layer forms a barrier pattern surrounding the binding terminal, the thickness of the blocking pattern is greater than the thickness of the binding terminal, the blocking pattern and the binding terminal are formed with an opening, and the upper end of the opening is formed with an opening. The width is greater than the width of the lower end of the opening;

a connection layer, disposed on the binding terminal, and located in the opening;

The miniature light-emitting diode chip is disposed on the connection layer and located in the opening formed by the binding terminal and the blocking pattern.

In some embodiments, the micro light-emitting diode chip includes a light-emitting layer, a first electrode and a second electrode, the first electrode is disposed between the light-emitting layer and the binding terminal, and the second electrode is disposed on the side of the light-emitting layer away from the binding terminal.

In some embodiments, the cross-sectional shape of the opening is an inverted trapezoid.

In some embodiments, the included angle formed between the blocking pattern and the extension line of the binding terminal ranges from 30 degrees to 60 degrees.

In some embodiments, a side of the blocking pattern in contact with the binding terminal is a curved surface, and the width of the upper end of the curved surface is greater than the width of the binding terminal.

In some embodiments, the micro light-emitting diode chip includes a light-emitting layer, a first electrode, and a second electrode, and the first electrode and the second electrode are disposed between the light-emitting layer and the binding terminal, The first electrode is connected to the first binding terminal, and the second electrode is connected to the second binding terminal.

In some embodiments, the blocking pattern is disposed around the first binding terminal and the second binding terminal, and the blocking pattern is disposed on the first binding terminal and the second binding terminal between.

In some embodiments, the thickness of the first binding terminal and the second binding terminal is the same, and the thickness of the barrier pattern between the first binding terminal and the second binding terminal is greater than or equal to the thickness of the first binding terminal.

In some embodiments, the material of the barrier layer includes one of soluble polytetrafluoroethylene and black photoresist.

Meanwhile, an embodiment of the present application provides a method for manufacturing a display panel. The method for manufacturing a display panel includes:

provide the substrate;

forming a driving circuit layer on the substrate, and etching the driving circuit layer to form a driving circuit for driving the miniature light-emitting diode chip;

A binding terminal is formed on the driving circuit layer; the binding terminal corresponds to the driving circuit;

A barrier layer is formed on the binding terminal, and the blocking layer is etched to form a blocking pattern disposed around the binding terminal; and the thickness of the blocking pattern is greater than that of the binding terminal, and the blocking pattern forming an included angle with the binding terminal, the blocking pattern and the binding terminal are formed with an opening, and the width of the upper end of the opening is greater than the width of the lower end of the opening;

forming a connection layer on the binding terminal; the connection layer is located in the opening;

A miniature light-emitting diode chip is formed on the connection layer to form a display panel; the miniature light-emitting diode chip is located in the opening formed by the binding terminal and the blocking pattern;

Vibration processing is performed on the display panel, so that the offset micro-LED chips are attached to the binding terminals.

Beneficial effects: The embodiment of the present application provides a display panel and a manufacturing method thereof. The display panel includes a substrate, a driving circuit layer, a binding terminal, a barrier layer, a connecting layer and a miniature light-emitting diode chip, and the driving circuit layer is disposed on the On the substrate, a drive circuit for driving the miniature light-emitting diode chip is formed, the binding terminal is arranged on the drive circuit layer and corresponds to the drive circuit, and the barrier layer is formed around the binding terminal. The thickness of the blocking pattern is greater than the thickness of the binding terminal, the blocking pattern and the binding terminal are formed with openings, and the width of the upper end of the opening is greater than the width of the lower end of the opening, so The connection layer is arranged on the binding terminal and is located in the opening, and the micro light-emitting diode chip is arranged on the connection layer and located in the opening formed by the binding terminal and the blocking pattern; by surrounding The binding terminal is provided with a blocking pattern, so that the blocking pattern and the binding terminal form an opening, and the width of the upper end of the opening is greater than the width of the lower end of the opening, so that when the micro light emitting diode chip is offset, the micro light emitting diode chip can be slipped from the blocking pattern. The binding terminals are aligned and attached to the binding terminals, thereby reducing the number of offset micro-LED chips, and alleviating the existing Micro-LED display panels that are prone to misalignment between the Micro-LED chips and the binding terminals. The problem is that the Micro-LED chip falls off.

Description of drawings

The technical solutions and other beneficial effects of the present application will be apparent through the detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings.

FIG. 1 is a schematic diagram of a conventional Micro-LED display panel.

FIG. 2 is a first schematic diagram of a display panel according to an embodiment of the present application.

FIG. 3 is a second schematic diagram of a display panel according to an embodiment of the present application.

FIG. 4 is a third schematic diagram of a display panel according to an embodiment of the present application.

FIG. 5 is a fourth schematic diagram of a display panel according to an embodiment of the present application.

FIG. 6 is a flowchart of a method for fabricating a display panel provided by an embodiment of the present application.

FIG. 7 is a first schematic diagram of a display panel corresponding to each step of the method for manufacturing a display panel according to an embodiment of the present application.

FIG. 8 is a second schematic diagram of a display panel corresponding to each step of the method for manufacturing a display panel provided in an embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc., or The positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as a limitation on this application. In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined as "first", "second" may expressly or implicitly include one or more of said features. In the description of the present application, "plurality" means two or more, unless otherwise expressly and specifically defined.

In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; it can be mechanical connection, electrical connection or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction of two elements relation. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

In this application, unless otherwise expressly specified and defined, a first feature "on" or "under" a second feature may include direct contact between the first and second features, or may include the first and second features Not directly but through additional features between them. Also, the first feature being "above", "over" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature is "below", "below" and "below" the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.

The following disclosure provides many different embodiments or examples for implementing different structures of the present application. To simplify the disclosure of the present application, the components and arrangements of specific examples are described below. Of course, they are only examples and are not intended to limit the application. Furthermore, this application may repeat reference numerals and/or reference letters in different instances for the purpose of simplicity and clarity, and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, this application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

The embodiments of the present application aim at the problem that the Micro-LED chip and the binding terminals are prone to misalignment in the existing Micro-LED display panel, causing the Micro-LED chip to fall off. The embodiments of the present application are used to alleviate the problem.

As shown in FIG. 1 , the existing Micro-LED display panel includes a substrate 11 , a driving circuit 12 arranged on the substrate 11 , a passivation layer 13 arranged on the driving circuit 12 , and a binding terminal 14 connected to the driving circuit 12 . A layer of metal 15 is arranged on the binding terminal, and then the Micro-LED chip 16 is bound on the binding terminal 14, as shown in FIG. 1, since the alignment accuracy between the Micro-LED chip and the binding terminal is relatively high high, resulting in a misalignment between the Micro-LED chip 16 and the binding terminal 14, causing the Micro-LED chip to fall off, and due to the large number of Micro-LED chips that need to be bound, the Micro-LED chip may fall off. The possibility increases, so the existing Micro-LED display panel has the problem that the Micro-LED chip and the bonding terminal are prone to misalignment, which causes the Micro-LED chip to fall off.

As shown in FIG. 2, an embodiment of the present application provides a display panel, and the display panel includes:

substrate 21;

The driving circuit layer is disposed on the substrate 21 and is formed with a driving circuit 22 for driving the miniature light-emitting diode chip 26;

The binding terminal 23 is arranged on the driving circuit layer 22 and corresponds to the driving circuit 22;

A barrier layer, forming a barrier pattern 24 around the binding terminal 23 , the thickness h1 of the blocking pattern 24 is greater than the thickness h2 of the binding terminal 23 , and the blocking pattern 24 and the binding terminal 23 are formed with an opening 28, the width L1 of the upper end of the opening 28 is greater than the width L2 of the lower end of the opening 28;

The connection layer 25 is disposed on the binding terminal 23 and located in the opening 28;

The micro LED chips 26 are disposed on the connection layer 25 and located in the openings 28 formed by the binding terminals 23 and the blocking pattern 24 , and the openings 28 are used for the offset micro LED chips 26 to slide on on the connecting layer.

Embodiments of the present application provide a display panel and a manufacturing method thereof. The display panel includes a substrate, a driving circuit layer, a binding terminal, a barrier layer, a connecting layer and a miniature light-emitting diode chip, and the driving circuit layer is disposed on the substrate. , a drive circuit for driving the miniature light-emitting diode chip is formed, the binding terminal is arranged on the drive circuit layer and corresponds to the drive circuit, and the blocking layer forms a blocking pattern arranged around the binding terminal , the thickness of the blocking pattern is greater than the thickness of the binding terminal, the blocking pattern and the binding terminal are formed with openings, the width of the upper end of the opening is greater than the width of the lower end of the opening, and the connecting layer is arranged on the binding terminal and located in the opening, the micro light emitting diode chip is arranged on the connection layer and located in the opening formed by the binding terminal and the blocking pattern; by surrounding the binding terminal A blocking pattern is set so that the blocking pattern and the binding terminal form an opening, and the width of the upper end of the opening is greater than the width of the lower end of the opening, so that when the micro LED chip is offset, the micro LED chip can slide from the blocking pattern to the binding terminal. On the other hand, it is aligned with the binding terminals, thereby reducing the number of offset micro-LED chips, alleviating the existing Micro-LED display panels that are prone to misalignment between the Micro-LED chips and the binding terminals, resulting in The problem of Micro-LED chip falling off.

It should be noted that the openings are used for sliding the offset micro light emitting diode chips on the connection layer.

In one embodiment, as shown in FIG. 2 , the display panel further includes a passivation layer 27 .

In an embodiment, as shown in FIG. 3 , the micro light-emitting diode chip 26 includes a light-emitting layer 262 , a first electrode 261 and a second electrode 263 , and the first electrode 261 is disposed between the light-emitting layer 262 and the light-emitting layer 262 . Between the binding terminals 23, the second electrode 263 is disposed on the side of the light-emitting layer 262 away from the binding terminals 23; when the micro-LED chips are arranged, the micro-LED chips can be arranged vertically, The first electrode is connected with the binding terminal, and the second electrode is connected with the common electrode, so as to realize the connection of the miniature light-emitting diode chip and make the miniature light-emitting diode chip work.

In an embodiment, as shown in FIG. 2 , the cross-sectional shape of the opening is an inverted trapezoid, that is, the blocking pattern forms an included angle with the binding terminal, so that when the micro LED chip is offset, the blocking pattern will be removed from the blocking The inclined surface formed by the pattern slides down onto the binding terminal, so that the number of micro-LEDs that are displaced is reduced, so that the display of the display panel is normal.

In an embodiment, as shown in FIG. 2 , the included angle A formed between the blocking pattern and the extension line of the binding terminal ranges from 30 degrees to 60 degrees. When setting the included angle, In order to avoid that when the value of the included angle is large, the blocking pattern will be blocked on the binding terminal, and the micro LED chip will stay on the blocking pattern when it is offset, the upper limit of the value of the included angle is 60 degrees, while When the included angle is small, the micro LED chips will be tiled on the blocking pattern, and cannot slide down to the connection layer by vibration, so as to be connected with the binding terminal. Therefore, the value range of the included angle is 30 degrees to 60 degrees. , so that the blocking pattern ensures a certain gradient, so that when the micro-LED chip is offset, it can slide off the blocking pattern, but the embodiment of the present application is not limited to this, and the included angle can be selected so that the offset micro-LED chip can slide off Any angle on the connection layer.

In an embodiment, in a display panel, the blocking pattern may be set on the left side of the binding terminal, and when the blocking pattern is set on the left side of the binding terminal, the blocking pattern may be set on the binding terminal The left side, and then when binding the micro LED chip, the micro LED chip can be bound slightly to the left, so that even if the micro LED chip is offset, it will be offset to the left, and set on the left side of the binding terminal. The blocking pattern on the side can make the miniature light-emitting diode chip tilt toward the binding terminal, and subsequently vibrate the display panel, so that the miniature light-emitting diode chip is attached to the binding terminal.

In one embodiment, in a display panel, the blocking pattern may be disposed on the right side of the binding terminal, and when the blocking pattern is disposed on the right side of the binding terminal, the blocking pattern may be disposed on the binding terminal On the right side, then when binding the micro LED chip, the micro LED chip is slightly bound to the right, so that the micro LED chip can be normally bound or shifted to the right, and due to the blocking pattern on the right side, the When the display panel is subsequently vibrated, the micro LED chips shifted to the blocking pattern can be slid onto the binding terminals, so that the micro LED chips are attached to the binding terminals, thereby completing the binding of the micro LED chips.

In an embodiment, in a display panel, the blocking pattern may be disposed on the front side of the binding terminal, and when the blocking pattern is disposed on the front side of the binding terminal, the blocking pattern may be disposed on the binding terminal On the right side, when the micro LED chip is bound, the micro LED chip is bound slightly forward, so that the micro LED chip can be normally bound or bound forward, and because the upper side has a blocking pattern, the subsequent The display panel can be vibrated, so that the micro LED chips offset on the blocking pattern can be slid onto the binding terminals, so that the micro LED chips are attached to the binding terminals, so as to realize the micro LED chips and the binding terminals. alignment fit.

In an embodiment, in a display panel, the blocking pattern can be arranged on the back side of the binding terminal, and by arranging the blocking pattern on the back side of the binding terminal, when the micro light-emitting diode chip is bound, By binding the micro LED chips slightly to the back side, the micro LED chips can be normally bound on the binding terminals, or the micro LED chips can be offset backwards. The display panel can be vibrated subsequently, so that the micro-LED chips on the blocking pattern offset backwards can be slid onto the binding terminals, so that the micro-LED chips are attached to the binding terminals, so as to realize the micro-LED chips and the binding terminals. Alignment of binding terminals.

In one embodiment, as shown in FIG. 4 , the blocking patterns 24 are arranged around the binding terminals 23 , and the blocking patterns 24 are symmetrically arranged with respect to the binding terminals 23 . The blocking pattern is arranged around the binding terminal, so that when the micro light emitting diode chip is offset on the binding terminal, when the micro light emitting diode chip is shifted to any side, the micro light emitting diode chip can be removed from the binding terminal. The blocking pattern slides down onto the binding terminal, so that the micro light-emitting diode chip and the binding terminal are aligned and adhered, and the binding of the micro light-emitting diode chip and the binding terminal is completed.

In an embodiment, the side of the blocking pattern in contact with the binding terminal is a curved surface, and the width of the upper end of the curved surface is greater than the width of the binding terminal, that is, when the blocking pattern is set, the blocking pattern can be blocked. The pattern is set to a curved surface. When the side of the blocking pattern is a curved surface, when the micro LED chip is offset, the micro LED chip can also slide down from the curved surface to the top of the binding terminal, so as to realize the micro LED chip and the binding terminal. fit binding.

In an embodiment, as shown in FIG. 5 , the micro light-emitting diode chip 26 includes a light-emitting layer 362 , a first electrode 361 and a second electrode 363 , and the first electrode 361 and the second electrode 363 are disposed on the Between the light-emitting layer 362 and the binding terminal 23, the first electrode 361 is connected to the first binding terminal 231, and the second electrode 363 is connected to the second binding terminal 232; The micro light-emitting diode chip and the second electrode are arranged on the same side, by connecting the first electrode and the second electrode to the first binding terminal and the second binding terminal respectively, wherein the first binding terminal is the pixel electrode layer etching The second binding terminal is formed by etching the common electrode layer, and the miniature light-emitting diode chip is connected with the binding terminal to realize the normal operation of the miniature light-emitting diode chip.

In one embodiment, as shown in FIG. 5 , the blocking pattern 24 is disposed around the first binding terminal 231 and the second binding terminal 232 , and the blocking pattern 24 is disposed on the first binding terminal 231 and the second binding terminal 232 . Between the binding terminal 231 and the second binding terminal 232, in order to prevent the first electrode and the second electrode of the micro light emitting diode chip from drifting into the space between the first binding terminal and the second binding terminal, a A blocking pattern is set between the first electrode and the second electrode, so that the first electrode and the second electrode are located above the binding terminal. When the offset micro light emitting diode chip is subsequently normally bound, the micro light emitting diode chip can be bound in the bonding terminal. Above the fixed terminal, the first electrode and the second electrode of the miniature light emitting diode chip will not appear in the gap between the binding terminals, so that the miniature light emitting diode chip can work normally.

In one embodiment, the thickness of the first binding terminal and the second binding terminal are the same, and the thickness of the barrier pattern between the first binding terminal and the second binding terminal is the same , greater than or equal to the thickness of the first binding terminal, so that the blocking pattern can be consistent with the thickness of the first binding terminal, or greater than the thickness of the first binding terminal, so that the first electrode and the second electrode will not fall on the between the first binding terminal and the second binding terminal, so that the offset micro light-emitting diode chips can be normally bound and work normally.

In an embodiment, the material of the barrier layer includes one of soluble polytetrafluoroethylene and black photoresist, and the use of a flexible material can prevent the barrier layer from scratching the binding terminals and the miniature light-emitting diode chip, and at the same time, By using photoresist, the blocking pattern can be better bonded to the binding terminal, thereby preventing the blocking pattern and the binding terminal from falling off, so that the blocking pattern can make the offset micro light emitting diode chip slide off the binding terminal.

In an embodiment, the cross-sectional shape of the blocking pattern includes one of a trapezoid and a pentagon. When the blocking pattern is set, a slope is formed between the blocking pattern and the binding terminal, and the cross-sectional shape of the blocking pattern can be set to form an inclined plane. It is one of a trapezoid and a pentagon, but the embodiments of the present application are not limited thereto, and other micro-LED chips that can realize offset slip off from the blocking pattern may be the cross-sectional shape of the blocking pattern.

In an embodiment, the barrier layer includes a plurality of rows of barrier patterns arranged in an array, and a gap is formed between the barrier patterns of two adjacent columns. When the barrier patterns are arranged, each barrier pattern can be divided and arranged, and each barrier pattern Corresponding to each binding terminal, so that the micro light emitting diode chip can slide down from the blocking pattern to the binding terminal, so as to realize the alignment and bonding of the micro light emitting diode chip and the binding terminal.

In one embodiment, the thickness of the blocking pattern is in the range of two-thirds of the thickness of the binding terminal, that is, when the blocking pattern is set, the thickness of the blocking pattern can be set to be equal to the thickness of the binding terminal. 1.5 times to 2 times, so that the blocking pattern is higher than the binding terminal, so that the blocking pattern can form a certain slope, so that the blocking pattern can make the offset micro LED chips slide off the blocking pattern to the binding terminal, so that the binding The fixed terminal is aligned and attached to the miniature light-emitting diode chip.

In one embodiment, the blocking layer includes a plurality of columns of blocking patterns arranged in an array, the binding terminals include a plurality of columns of binding terminals arranged in an array, and a column of blocking patterns is shared between two adjacent columns of binding terminals. When setting the blocking pattern, the adjacent binding terminals can share the blocking pattern, so that when preparing the blocking pattern, the preparation process is relatively simple, and at the same time, the blocking pattern is not easy to move, so that the blocking pattern can be better attached to the binding terminal. so as to make the offset micro light emitting diode chip slide down from the blocking pattern to the binding terminal, so that the micro light emitting diode chip is attached to the binding terminal.

In one embodiment, the miniature light-emitting diode chip includes one of a Micro-LED chip and a miniature light-emitting diode chip. To avoid offset of the miniature light-emitting diode chip, when a blocking pattern is arranged on the side of the binding terminal, the A display panel with Micro-LED chips and mini light-emitting diode chips is provided to prevent the Micro-LED chips and mini light-emitting diode chips from falling off.

In one embodiment, the material of the connection layer includes tin.

As shown in FIG. 6 , an embodiment of the present application provides a method for fabricating a display panel, and the method for fabricating a display panel includes:

S1, providing a substrate; its preparation result is shown in (a) in Figure 7;

S2, forming a driving circuit layer on the substrate, and etching the driving circuit layer to form a driving circuit for driving the miniature light-emitting diode chip; the preparation result is shown in (a) of FIG. 7 ;

S3, forming a binding terminal on the driving circuit layer; the binding terminal corresponds to the driving circuit; the preparation result is shown in (a) of FIG. 7 ;

S4, forming a barrier layer on the binding terminal, the preparation result of which is shown in (b) in FIG. 7 ; and etching the barrier layer to form a barrier pattern surrounding the binding terminal; the preparation result is as follows As shown in (c) of FIG. 7 ; and the thickness of the blocking pattern is greater than the thickness of the binding terminal, the blocking pattern and the binding terminal form an included angle, and the blocking pattern and the binding terminal an opening is formed, and the width of the upper end of the opening is greater than the width of the lower end of the opening;

S5, forming a connection layer on the binding terminal; the connection layer is located in the opening; the preparation result is shown in (a) of FIG. 8 ;

S6, forming a miniature light-emitting diode chip on the connection layer to form a display panel; the miniature light-emitting diode chip is located in the opening formed by the binding terminal and the blocking pattern; the preparation result is shown in Fig. 8 (b ) shown;

S7 , vibrating the display panel to make the offset micro light-emitting diode chips adhere to the binding terminals; the preparation result is shown in (c) of FIG. 8 .

An embodiment of the present application provides a method for manufacturing a display panel. The display panel prepared by the method for manufacturing a display panel includes a substrate, a driving circuit layer, a binding terminal, a barrier layer, a connecting layer, and a miniature light-emitting diode chip. The driving circuit layer is disposed on the On the substrate, a driving circuit for driving the miniature light-emitting diode chip is formed, the binding terminal is arranged on the driving circuit layer and corresponds to the driving circuit, and the barrier layer is formed to surround the binding terminal The set blocking pattern, the thickness of the blocking pattern is greater than the thickness of the binding terminal, the blocking pattern and the binding terminal are formed with openings, the width of the upper end of the opening is greater than the width of the lower end of the opening, The connection layer is arranged on the binding terminal and is located in the opening, and the micro light-emitting diode chip is arranged on the connection layer and located in the opening formed by the binding terminal and the blocking pattern; A blocking pattern is arranged around the binding terminal, so that the blocking pattern and the binding terminal form an opening, and the width of the upper end of the opening is greater than the width of the lower end of the opening, so that when the micro LED chip is offset, the micro LED chip can slide off the blocking pattern To the binding terminal, it is aligned with the binding terminal, thereby reducing the number of offset micro light-emitting diode chips, and alleviating the existing Micro-LED display panel existing Micro-LED chips and binding terminals are prone to alignment Offset, causing the Micro-LED chip to fall off.

In one embodiment, the step of vibrating the display panel includes: subjecting the display panel to ultrasonic or microwave vibrating treatment.

In an embodiment, an embodiment of the present application provides a display device, and the display device includes the display panel described in any one of the foregoing embodiments.

According to the above embodiment, it can be known that:

Embodiments of the present application provide a display panel and a manufacturing method thereof. The display panel includes a substrate, a driving circuit layer, a binding terminal, a barrier layer, a connecting layer and a miniature light-emitting diode chip, and the driving circuit layer is disposed on the substrate. , a drive circuit for driving the miniature light-emitting diode chip is formed, the binding terminal is arranged on the drive circuit layer and corresponds to the drive circuit, and the blocking layer forms a blocking pattern arranged around the binding terminal , the thickness of the blocking pattern is greater than the thickness of the binding terminal, the blocking pattern and the binding terminal are formed with openings, the width of the upper end of the opening is greater than the width of the lower end of the opening, and the connecting layer is arranged on the binding terminal and located in the opening, the micro light emitting diode chip is arranged on the connection layer and located in the opening formed by the binding terminal and the blocking pattern; by surrounding the binding terminal A blocking pattern is set so that the blocking pattern and the binding terminal form an opening, and the width of the upper end of the opening is greater than the width of the lower end of the opening, so that when the micro LED chip is offset, the micro LED chip can slide from the blocking pattern to the binding terminal. On the other hand, it is aligned with the binding terminals, thereby reducing the number of offset micro-LED chips, alleviating the existing Micro-LED display panels that are prone to misalignment between the Micro-LED chips and the binding terminals, resulting in The problem of Micro-LED chip falling off.

In the above-mentioned embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

A display panel and a manufacturing method thereof provided by the embodiments of the present application have been described in detail above, and the principles and implementations of the present application are described with specific examples. The technical solution of the application and its core idea; those of ordinary skill in the art should understand that: it can still make modifications to the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements to some of the technical features; and these modifications or replacements, The essence of the corresponding technical solutions does not deviate from the scope of the technical solutions of the embodiments of the present application.

Claims (10)

1. A display panel, comprising:

a substrate;

the driving circuit layer is arranged on the substrate and is provided with a driving circuit for driving the micro light-emitting diode chip;

the binding terminal is arranged on the drive circuit layer and corresponds to the drive circuit;

a blocking layer forming a blocking pattern disposed around the binding terminals, the blocking pattern having a thickness greater than that of the binding terminals, the blocking pattern and the binding terminals forming an opening, an upper end of the opening having a width greater than that of a lower end of the opening;

the connecting layer is arranged on the binding terminal and is positioned in the opening;

and the micro light-emitting diode chip is arranged on the connecting layer and is positioned in the opening formed by the binding terminal and the blocking pattern.

2. The display panel of claim 1, wherein the micro light emitting diode chip comprises a light emitting layer, a first electrode disposed between the light emitting layer and the binding terminal, and a second electrode disposed on a side of the light emitting layer away from the binding terminal.

3. The display panel according to claim 2, wherein a cross-sectional shape of the opening is an inverted trapezoid.

4. The display panel of claim 3, wherein an angle formed between the barrier pattern and the extension line of the binding terminal ranges from 30 degrees to 60 degrees.

5. The display panel of claim 2, wherein a side of the barrier pattern contacting the binding terminals is a curved surface having an upper end with a width greater than a width of the binding terminals.

6. The display panel of claim 1, wherein the micro light emitting diode chip comprises a light emitting layer, a first electrode, and a second electrode, the first electrode and the second electrode are disposed between the light emitting layer and the binding terminal, the first electrode is connected to a first binding terminal, and the second electrode is connected to a second binding terminal.

7. The display panel of claim 6, wherein the blocking pattern is disposed around the first binding terminal and the second binding terminal, and the blocking pattern is disposed between the first binding terminal and the second binding terminal.

8. The display panel of claim 7, wherein the first binding terminals and the second binding terminals have the same thickness, and a thickness of a blocking pattern between the first binding terminals and the second binding terminals is greater than or equal to the thickness of the first binding terminals.

9. The display panel of claim 1, wherein the material of the barrier layer comprises one of soluble polytetrafluoroethylene, black photoresist.

10. A method for manufacturing a display panel includes:

providing a substrate;

forming a driving circuit layer on the substrate, and etching the driving circuit layer to form a driving circuit for driving the micro light-emitting diode chip;

forming a binding terminal on the driving circuit layer; the binding terminal corresponds to the driving circuit;

forming a barrier layer on the binding terminal, and etching the barrier layer to form a barrier pattern arranged around the binding terminal; the thickness of the blocking pattern is larger than that of the binding terminal, an included angle is formed between the blocking pattern and the binding terminal, an opening is formed between the blocking pattern and the binding terminal, and the width of the upper end of the opening is larger than that of the lower end of the opening;

forming a connection layer on the binding terminal; the connecting layer is positioned in the opening;

forming a micro light-emitting diode chip on the connecting layer to form a display panel; the micro light emitting diode chip is positioned in the opening formed by the binding terminal and the blocking pattern;

and vibrating the display panel to enable the deviated micro light-emitting diode chip to be attached to the binding terminal.

Images