CN111192869B - Substrate and display device - Google Patents

Abstract

The application provides a substrate and a display device. The substrate is used for receiving the plurality of micro-components in the carrier plate and comprises a plate body, a first conductive bump and a second conductive bump. The plate body is provided with a first surface, a transfer area is defined on the first surface, and the transfer area is defined with a central position and an edge position. The first conductive bump is disposed at the center and has a first volume. The second conductive bump is disposed at the edge position and has a second volume. Wherein the first volume is different from the second volume.

Description

Substrates and Display Devices

technical field

The present application relates to a substrate and a display device, and more particularly, to a substrate for receiving a plurality of micro-components and a display device including a plurality of micro-components.

Background technique

When manufacturing a micro LED display, it is necessary to form a plurality of micro LEDs on one substrate (such as a temporary substrate), and then transfer the micro LEDs to another substrate (such as a temporary substrate) in large quantities. or the corresponding position on the permanent substrate). However, during heating and heat dissipation of the substrate on which the micro light-emitting diodes are arranged, the thermal expansion coefficient of various materials may be different, and the substrate may be bowed or warpaged due to thermal stress. In practice, when the substrate is warped, the micro LEDs on the substrate will be displaced together, making it difficult for the micro LEDs to align with the components on another substrate, thereby affecting the transfer yield.

SUMMARY OF THE INVENTION

In view of this, the main purpose of the present application is to provide a substrate that can more efficiently receive the micro-components on the warped carrier.

The present application provides a substrate for receiving a plurality of micro-components in a carrier board. The substrate includes a board body, a first conductive bump and a second conductive bump. The plate body has a first surface, the first surface defines at least one transfer area, and the transfer area defines a center position and an edge position. The first conductive bump is arranged at the center and has a first volume. The second conductive bump is disposed at the edge and has a second volume. wherein the first volume is different from the second volume.

In some embodiments, the first conductive bumps may have a first thickness, the second conductive bumps may have a second thickness, and when the first volume is smaller than the second volume, the first thickness is smaller than the second thickness. Here, the first conductive bump may have a first contact area on the first surface, the second conductive bump may have a second contact area on the first surface, and the first contact area and the second contact area are substantially the same.

In some embodiments, the first conductive bump may have a first contact area on the first surface, and the second conductive bump may have a second contact area on the first surface. When the first volume is smaller than the second volume, the first The contact area is smaller than the second contact area. Here, the first conductive bumps may have a first thickness, the second conductive bumps may have a second thickness, and the first thickness and the second thickness are substantially the same. In addition, the substrate may further include another first conductive bump, two adjacent first conductive bumps are separated by a first distance, and adjacent first conductive bumps and second conductive bumps are separated by a second distance. When one volume is smaller than the second volume, the first distance is greater than the second distance.

In some embodiments, the first conductive bumps may have a first thickness, the second conductive bumps may have a second thickness, and when the first volume is greater than the second volume, the first thickness is greater than the second thickness. Here, the first conductive bump may have a first contact area on the first surface, the second conductive bump may have a second contact area on the first surface, and the first contact area and the second contact area are substantially the same.

In some embodiments, the first conductive bump may have a first contact area on the first surface, and the second conductive bump may have a second contact area on the first surface. When the first volume is greater than the second volume, the first The contact area is larger than the second contact area. Here, the first conductive bumps may have a first thickness, the second conductive bumps may have a second thickness, and the first thickness and the second thickness are substantially the same. In addition, the substrate may further include another first conductive bump, two adjacent first conductive bumps are separated by a first distance, and adjacent first conductive bumps and second conductive bumps are separated by a second distance. When one volume is larger than the second volume, the first distance is smaller than the second distance.

The present application also provides a substrate for receiving a plurality of micro-components in a carrier, the substrate comprising a board body, a first conductive bump and a second conductive bump. The plate body has a first surface, the first surface defines at least one transfer area, and the transfer area defines a center point. The first conductive bump is disposed in the transfer area and has a first cross-sectional shape. The second conductive bump is disposed in the transfer area and has a second cross-sectional shape, the first cross-sectional shape is different from the second cross-sectional shape, and the distance between the first conductive bump and the center point is smaller than the distance between the second conductive bump and the center point distance.

In some embodiments, the first conductive bump has a first volume and the second conductive bump has a second volume, and the first volume may be substantially the same as the second volume. Here, the first conductive bumps may have a first thickness, the second conductive bumps may have a second thickness, the first thickness is smaller than the second thickness, and the first conductive bumps may have a first contact area on the first surface, The second conductive bump may have a second contact area on the first surface, and the first contact area is larger than the second contact area. In addition, the first conductive bumps may have a first thickness, the second conductive bumps may have a second thickness, the first thickness may also be greater than the second thickness, and the first conductive bumps may have a first contact area on the first surface , the second conductive bump may have a second contact area on the first surface, and the first contact area is smaller than the second contact area. On the other hand, the first conductive bumps may have a first Young's modulus, and the second conductive bumps may have a second Young's modulus, wherein the first Young's modulus is greater than the second Young's modulus.

The present application also provides a display device having a substrate that can more efficiently receive micro-components on a warped carrier.

The present application provides a display device, which includes a substrate and a plurality of micro-components. The substrate includes a board body, a first conductive bump and a second conductive bump. The plate body has a first surface, the first surface defines at least one transfer area, and the transfer area defines a center point. The first conductive bump is disposed in the transfer region and has a first volume and a first cross-sectional shape. The second conductive bump is disposed in the transfer area and has a second volume and a second cross-sectional shape, wherein the first volume is different from the second volume or the first cross-sectional shape is different from the second cross-sectional shape. The distance between the first conductive bump and the center point is smaller than the distance between the second conductive bump and the center point. The plurality of micro components are correspondingly disposed on the first conductive bump and the second conductive bump.

In some embodiments, the bonding areas of the first conductive bumps and the second conductive bumps corresponding to the plurality of micro-components may be approximately the same. In addition, the first conductive bumps and the micro-components disposed on the substrate have a first height, and the second conductive bumps and the micro-components corresponding to the substrate have a second height, and the first height may be different from the second height .

To sum up, the present application provides a substrate and a display device. The conductive bumps at different positions on the substrate are different, so that they can correspond to carriers with different warped shapes. For example, when the carrier board is warped upwardly (smiley face), the conductive bumps at the upper edge of the substrate can have a larger volume or a larger cross-sectional area. On the contrary, when the carrier board is warped in a concave (crying face) type, the conductive bumps on the upper edge of the substrate can correspond to a smaller volume or a smaller cross-sectional area. Therefore, the substrate of the present application can more efficiently receive the micro-miniature components on the warped carrier.

The details of other functions and embodiments of the present application are described below with reference to the accompanying drawings.

Description of drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments described in this application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a substrate corresponding to an upper concave carrier according to an embodiment of the present application;

2A is a top view illustrating a substrate according to another embodiment of the present application;

2B is a schematic cross-sectional view along line AA according to FIG. 2A;

3 is a schematic structural diagram illustrating a substrate corresponding to an upper concave carrier according to another embodiment of the present application;

4 is a schematic structural diagram illustrating a substrate corresponding to an upper concave carrier according to yet another embodiment of the present application;

5 is a schematic structural diagram illustrating a substrate corresponding to an upper concave carrier according to another embodiment of the present application;

6 is a schematic structural diagram illustrating a substrate corresponding to a recessed carrier plate according to an embodiment of the present application;

7 is a schematic structural diagram illustrating a substrate corresponding to a recessed carrier plate according to another embodiment of the present application;

FIG. 8 is a schematic diagram illustrating a structure of a substrate corresponding to a recessed carrier according to yet another embodiment of the present application.

Symbol Description

1, 2, 3, 4, 5, 6: substrate

10, 20, 30, 40, 50, 60: plate body

10a, 20a, 30a, 40a, 50a, 60a: first surface

12, 22, 32, 42, 52, 62: first conductive bumps

12a, 22a, 32a, 42a, 52a, 62a: the surface of the first conductive bump

14, 24, 34, 44, 54, 64: second conductive bumps

14a, 24a, 34a, 44a, 54a, 64a: the surface of the second conductive bump

al, a2, a3: area

hl, h2, h3: thickness

dl, d2: distance

90: carrier board

92, 92a, 92b: Micro components

94, 94a, 94b: Metal connection pads

S1: Transfer area

Detailed ways

The following is a specific description of the embodiments of the present application and the achieved effects, and an example is provided and described with the drawings as follows.

Please also refer to FIG. 1 . FIG. 1 is a schematic diagram illustrating a structure of a substrate corresponding to an upper concave carrier according to an embodiment of the present application. As shown in FIG. 1 , the substrate 1 disclosed in this embodiment can be used to receive a plurality of micro-components 92 on a carrier board 90 . Here, the micro-component 92 can be, for example, a vertical or flip-chip micro-LED, and some embodiments can also be applied to other micro-components, including micro-integrated circuits, micro-laser diodes, and micro-sensing components. The carrier 90 may be, for example, a growth substrate or a temporary substrate of the micro-component 92 , and the substrate 1 of this embodiment may be a permanent substrate (display panel) of the micro-component 92 or another temporary substrate. As can be seen from FIG. 1 , the carrier board 90 may include a plurality of micro-components 92 , and the micro-components 92 are disposed on the side of the carrier board 90 facing the substrate 1 . In one example, the carrier 90 may be a temporary carrier without a working circuit, such as a glass carrier, a sapphire carrier (Sapphire), a silicon carrier (Si), or an alumina carrier (Al ₂ O ₃ ). Unrestricted.

The substrate 1 includes a board body 10 , a plurality of first conductive bumps 12 and a plurality of second conductive bumps 14 , wherein the board body 10 may be a Complementary Metal-Oxide-Semiconductor (CMOS) substrate, A low temperature poly-silicon (LTPS) substrate, a thin film transistor (Thin Film Transistor, TFT) substrate, or other substrates having working circuits are not limited in this embodiment. Here, the board body 10 may have a first surface 10a, the first surface 10a faces the carrier board 90, and the first conductive bumps 12 and the second conductive bumps 14 are disposed on the first surface 10a. In practice, the first conductive bumps 12 and the second conductive bumps 14 are used to connect to the metal connection pads 94 respectively, and the first conductive bumps 12 and the second conductive bumps 14 can be disposed on the first surface 10a within a specific area, eg, a transfer area in the first surface 10a. In practice, after the substrate 1 exemplified in this embodiment receives a plurality of micro-components 92, it can become a display panel or a part of a display device. In other words, the display device may include a plurality of micro-components 92 , and the plurality of micro-components 92 are respectively disposed on the corresponding first conductive bumps 12 and the second conductive bumps 14 .

For example, please refer to FIG. 2A and FIG. 2B together. FIG. 2A is a top view of a substrate according to another embodiment of the present application, and FIG. 2B is a schematic cross-sectional view taken along line AA according to FIG. 2A . As shown in the figure, a plurality of first conductive bumps 12 and a plurality of second conductive bumps 14 may be disposed on the first surface 10a, and the first conductive bumps 12 and the second conductive bumps 14 may be divided into a plurality of Groups, each of which can be a transfer area. In other words, the first surface 10a may include a plurality of transfer areas, such as the transfer area S1 indicated in FIG. 2A, so that when the micro-components 92 are transferred, the first surface 10a may receive the micro-components 92 in different transfer areas. . Of course, the first surface 10a may also correspond to only one transfer area, that is, the transfer area may be part or all of the first surface 10a, which is not limited in this embodiment.

In one example, the transfer area may define a center position and an edge position, the first conductive bumps 12 may be disposed at the center position, and the second conductive bumps 14 may be disposed at the edge positions. For example, assuming that the transfer area is a rectangle, the edge positions may be relatively close to the perimeter of the rectangle, and the center position may be relatively close to the center point of the rectangle. In other words, the first conductive bump 12 defined in this embodiment is closer to the center of the transfer area, while the second conductive bump 14 is farther from the center of the transfer area. This embodiment does not limit the shape or area of the transfer area, and the transfer area may be a rectangle, a circle, a triangle, or other suitable geometric shapes. In practice, since the micro-components 92 on the carrier board 90 are arranged regularly, in order to receive the micro-components 92 , generally the first conductive bumps 12 and the second conductive bumps 14 also correspond to the arrangement of the micro-components 92 . .

However, conventionally, when transferring the micro-components 92 disposed on the carrier board 90, some practical problems will be encountered, which will affect the transfer yield. One of the problems is that the carrier board 90 may be slightly warped during the heating and heat dissipation process, which may cause the position of the micro-components 92 on the carrier board 90 to change or the arrangement interval to be different. Common warpage of the carrier plate 90 is, for example, concave-up warpage and concave-down warpage. The concave-up warpage means that the center portion of the carrier plate 90 is closer to the board body 10 , and the edge portion is farther away from the board body. 10. Concave warping is the opposite, meaning that the center portion of the carrier plate 90 is further away from the plate body 10 and the edge portion is closer to the plate body 10 . Conventionally, since the micro-components 92 on the carrier board 90 may be warped due to the problem of the carrier board 90, the micro-components 92 near the center of the carrier board 90 are not on the same horizontal plane, for example, in the concave-type warped carrier board 90. will be lower. Since the conductive bumps of the conventional substrate are all the same, when the carrier board 90 is pressed against the conventional substrate, the connection tightness between the metal connection pads 94 and the conductive bumps of the micro-components 92 at different positions on the carrier board 90 will be generated. difference. For example, the micro-component 92 close to the center of the carrier board 90 has a relatively high connection tightness between the metal connection pads 94 and the conductive bumps. On the other hand, for the micro-components 92 near the edge of the carrier board 90, the connection tightness between the metal connection pads 94 and the conductive bumps is relatively low. As a result, the conventional substrate may have the problem of uneven conductivity of each micro-component 92, and even affect the transfer yield.

Different from the conventional substrate, this embodiment proposes a new substrate 1 . As seen from FIG. 1 , the carrier board 90 is concavely warped. At this time, in order to allow the substrate 1 to more effectively receive the plurality of micro-components 92 on the carrier board 90 , the first conductive bumps 12 in this embodiment are connected to The second conductive bumps 14 are designed to have different volumes due to different locations. Those skilled in the art should understand that the volume is related to the area and the height, and this embodiment demonstrates an example of adjusting the height by fixing the area. In the example of FIG. 1 , it is assumed that the area of the first surface 12a (first contact area) where the first conductive bump 12 is intended to be in contact with the micro-device 92 and the contact area where the second conductive bump 142 is intended to be in contact with the micro-device 92 is a The area of the second surface 14a (the second contact area) is the same, for example, the area a1. At this time, the thicknesses of the first conductive bumps 12 and the second conductive bumps 14 will be different. For example, the thickness (first thickness) of the first conductive bumps 12 is h1, then the thickness of the second conductive bumps 14 ( The second thickness) is h2, and the thickness h1 will be less than the thickness h2. That is, when the carrier board 90 is concave-up warped, FIG. 1 demonstrates that the volume (first volume) of the first conductive bumps 12 is slightly smaller than the volume (second volume) of the second conductive bumps 14 example of.

Following the above, since the carrier board 90 in FIG. 1 is concavely warped, the micro-components 92 close to the center of the carrier board 90 are relatively close to the board body 10 , while the micro-components 92 near the edge of the carrier board 90 are closer to the board body 10 . The distance between them is larger. When external pressure is applied to the carrier board 90 to press the substrate 1 , the carrier board 90 will get closer and closer to the board body 10 . At this time, since the second conductive bumps 14 in this embodiment are more protruding than the first conductive bumps 12 , the first conductive bumps 12 and the second conductive bumps 14 at different positions can be contacted at about the same time to the respective metal connection pads 94 . Those skilled in the art know that the volumes of the first conductive bumps 12 and the second conductive bumps 14 may be determined according to the warpage degree of the carrier board 90 . For example, a user can measure the warpage of the carrier board 90 in advance. degree, and then determine how thick the first conductive bump 12 and the second conductive bump 14 should be. In one example, the thickness difference between the conductive bumps in the middle (the first conductive bumps 12 ) and the conductive bumps at the edges (such as the second conductive bumps 14 ) is not more than 50%, so as to avoid the reduction in the process due to the large height difference. Yield. It can be seen that in the substrate 1 of the present embodiment, the first conductive bumps 12 and the second conductive bumps 14 can have approximately the same connection tightness with the metal connection pads 94 at the corresponding positions, so that each micro-component 92 can have a uniform connection density. conductivity, thereby improving transfer yield. In the not-shown embodiment, another conductive bump may also be included, wherein the conductive bumps gradually increase in thickness and volume from the inside to the outside due to the upward concave warpage.

On the other hand, when the carrier board 90 is pressed against the conventional substrate, the conventional substrate may be subjected to uneven stress, which may easily cause damage to the micro-components 92 or the substrate, and result in poor transfer yield. Taking the above-mentioned conventional substrate as an example, because of the micro-components 92 located at the edge of the carrier board 90, the metal connection pads 94 thereof are less easily connected to the conductive bumps below. When external pressure is applied to the carrier board 90 to press the conventional substrate, in order to ensure that the micro-components 92 at the edge of the carrier board 90 can also be transferred, it is possible to apply excessive pressure and cause the micro-components 92 at the center of the carrier board 90 to be excessively high push toward the base plate. For example, the metal connection pads 94 of the micro-components 92 in the center of the carrier board 90 may have over-pressed the conductive bumps below, causing damage to the micro-components 92 or the substrate.

The embodiment of FIG. 3 proposes another new substrate 2 . Please refer to FIG. 1 and FIG. 3 together. FIG. 3 is a schematic diagram illustrating a structure of a substrate corresponding to an upper concave carrier according to another embodiment of the present application. Similar to the embodiment of FIG. 1 , the carrier board 90 exemplified in FIG. 3 is also concavely warped, and the substrate 2 also includes a board body 20 , a plurality of first conductive bumps 22 and a plurality of second conductive bumps. Block 24. In order to allow the substrate 2 to more effectively receive the plurality of micro-components 92 on the carrier board 90 , the first conductive bumps 22 and the second conductive bumps 24 in this embodiment are also designed to have different volumes due to different positions. , and is also an example in which the volume (first volume) of the first conductive bump 12 is slightly smaller than the volume (second volume) of the second conductive bump 14 . Different from the embodiment of FIG. 1 , FIG. 3 assumes that the thickness (first thickness) of the first conductive bump 22 is the same as the thickness (second thickness) of the second conductive bump 24 , for example, the thickness h1 . At this time, the area (first contact area) of the first conductive bump 22 and a first surface 22a intended to be in contact with the micro-component 92 may be a1, and a second conductive bump 24 intended to be in contact with the micro-component 92 The area of the surface 24a (the second contact area) may be a2, and the contact area a1 may be smaller than the contact area a2.

Following the above, since the carrier board 90 in FIG. 1 is concavely warped, the micro-components 92 close to the center of the carrier board 90 are relatively close to the board body 10 , while the micro-components 92 near the edge of the carrier board 90 are closer to the board body 10 . The distance between them is larger. When external pressure is applied to the carrier board 90 to press the substrate 1 , the carrier board 90 will get closer and closer to the board body 10 . At this point, those skilled in the art should understand that when each metal connection pad 94 contacts the first conductive bump 22 and the second conductive bump 24, the stress on the first conductive bump 22 should be slightly greater than that of the first conductive bump 22. The stress to which the second conductive bumps 24 are subjected. However, due to the smaller volume of the first conductive bumps 22 in this embodiment, even if the external pressure on the carrier board 90 is large enough to ensure that the micro-components 92 at the edge of the carrier board 90 can be transferred, the first conductive bumps 22 are more easily Deformation (eg, overflowing between the metal connection pads 94 and the board body 10 ) is used to cope with the extrusion of the external pressure, which can avoid the damage of the micro-components 92 or the substrate 2 caused by the stress, thereby improving the transfer yield.

In addition, taking the above-mentioned conventional substrate as an example, whether the concave-up warpage or the concave-down warpage will cause the micro-components 92 on the carrier board 90 to deviate from their original positions, so that the conductive The bumps may not be accurately aligned with the micro-components 92, resulting in errors in the subsequent transfer and alignment steps. Different from the conventional substrate, FIG. 3 also demonstrates that the first conductive bumps 22 and the second conductive bumps 24 can be arranged in a non-equidistant manner. Those skilled in the art should understand that since the carrier 90 shown in FIG. 3 is concave, the micro-components 92 at the center of the carrier 90 are displaced to both sides to a greater extent, and the carrier 90 The micro-components 92 at the edge locations are less displaced. In order for the first conductive bumps 22 and the second conductive bumps 24 to be accurately aligned with the metal connection pads 94 on the micro-components 92 after the displacement, the first conductive bumps 22 and the second conductive bumps 24 should also be provided separately. on the corresponding position of the plate body 20 (or the transfer area). For example, a first distance d1 may be spaced between two adjacent first conductive bumps 22 , and a second distance may be spaced between adjacent first conductive bumps 22 and second conductive bumps 24 d2. In this embodiment, the first distance d1 is slightly larger than the second distance d2. In other words, the conductive bumps (such as the first conductive bumps 22 ) that are closer to the center of the board body 20 are arranged to be spread apart, while the conductive bumps (such as the second conductive bumps 24 ) that are farther from the center of the board body 20 are arranged. The arrangement will be a little tighter.

For the convenience of description, FIG. 1 shows that each micro-component 92 has a metal connection pad 94, but this embodiment does not limit the number of metal connection pads 94, for example, each flip-chip micro-component also has a metal connection pad 94 on it. There can be more than two metal connection pads. Please refer to FIG. 4 . FIG. 4 is a schematic structural diagram of a substrate corresponding to an upper concave carrier according to yet another embodiment of the present application. As shown in FIG. 4 , it is assumed that there are a plurality of flip-chip micro-components 92 a and micro-components 92 b on the carrier board 90 . The carrier board 90 is located at the edge and has two corresponding metal connection pads 94b. In practice, in order to connect the two metal connection pads 94a of the micro-component 92a, two first conductive bumps 22 are also provided at corresponding positions of the board body 20 . Similarly, in order to connect the two metal connection pads 94b of the micro-component 92b, two second conductive bumps 24 are also provided on the corresponding positions of the board body 20 .

For the same reason as in the previous embodiment, since the carrier board 90 is concave upward, the micro-components 92a at the center of the carrier board 90 are more displaced to both sides, while the micro-components 92b at the edge positions of the carrier board 90 are displaced to a greater extent. less. Therefore, the distance between the two metal connection pads 94a in the micro-component 92a is relatively apart, and the distance between the two metal connection pads 94b in the micro-component 92b is relatively close. In order to align the two metal connection pads 94 a , the distance d3 between the two first conductive bumps 22 is slightly larger than the distance d4 between the two second conductive bumps 24 . In other words, the previous embodiment demonstrates that each conductive bump corresponds to a micro-component at a different position, and the distance between the conductive bumps closer to the center point of the board body 20 is greater, and the distance from the center point of the board body 20 is larger. The smaller the separation distance between the conductive bumps. This embodiment exemplifies that if the micro-component has multiple metal connection pads, there will be multiple conductive bumps corresponding to the same micro-component. In this case, the conductive The larger the separation distance, the smaller the separation distance between the group of conductive bumps that are farther away from the center point of the board body 20 .

On the other hand, it is also possible for the conductive bumps to have the same volume but have different shapes depending on where they are located. Please refer to FIG. 1 and FIG. 5 together. FIG. 5 is a schematic diagram illustrating a structure of a substrate corresponding to an upper concave carrier according to yet another embodiment of the present application. Similar to the embodiment of FIG. 1 , the carrier board 90 shown in FIG. 5 is also concavely warped, and the substrate 3 also includes a board body 30 , a plurality of first conductive bumps 32 and a plurality of second conductive bumps. Block 34. In addition, the area (first contact area) of a first surface 32a of the first conductive bump 32 intended to be in contact with the micro-component 92 may also be a1, and the thickness (first thickness) of the first conductive bump 32 may also be h1. Different from the embodiment of FIG. 1 , the volumes of the first conductive bumps 32 and the second conductive bumps 34 may be the same, but have different cross-sectional shapes. For example, the area of a second surface 34a of the second conductive bump 34 in FIG. 5 that is intended to be in contact with the micro-device 92 (the second contact area) is the area a3, and the thickness of the second conductive bump 34 (the second thickness ) is h3. At this time, the area a3 will be smaller than the area a1, and the thickness h3 will be larger than the thickness h1. The shape of the second conductive bumps 34 is not limited in this embodiment, but as can be seen from FIG. 5 , the second conductive bumps 34 are higher than the first conductive bumps 32 , and the second conductive bumps 34 are narrower than the first conductive bumps 34 . Conductive bumps 32 .

In the above embodiments of FIGS. 1 to 5 , the Young's modulus of the first conductive bump and the second conductive bump can be designed to be different values, and the first conductive bump and the second conductive bump The Young's modulus of the conductive bumps may correspond to different warpage types of the carrier 90 . For example, when the carrier board 90 is concavely warped, the Young's modulus of the conductive bumps (eg, the first conductive bumps) that are closer to the center point of the board body can be designed to be smaller. On the contrary, the Young's modulus of the conductive bumps (eg, the second conductive bumps) far from the center point of the board body can be designed to be larger. Those with ordinary knowledge in the art can understand that the Young's modulus is a parameter of an elastic material, which is related to the amount of deformation generated when the first conductive bump and the second conductive bump are subjected to normal stress. This embodiment It will not be repeated here. In one example, since the Young's modulus of the first conductive bump is smaller than the Young's modulus of the second conductive bump, it means that the second conductive bump is not easily deformed. The second conductive bumps that are not easily deformed can be used to disperse the stress concentrated on the center point of the board body, so that the first conductive bumps and the second conductive bumps bear approximately the same stress, thereby improving the transfer yield.

The aforementioned examples in FIGS. 1 to 5 are embodiments corresponding to the case where the carrier board 90 is concave-up warped, but the present application is not limited to this. Please refer to FIG. 1 and FIG. 6 together. FIG. 6 is a schematic diagram illustrating a structure of a substrate corresponding to a recessed carrier according to an embodiment of the present application. Similar to the embodiment of FIG. 1 , the substrate 4 exemplified in FIG. 6 also includes a board body 40 , a plurality of first conductive bumps 42 and a plurality of second conductive bumps 44 , and the carrier board 90 also includes a plurality of micro-components 92 . , and each micro-component 92 has metal connection pads 94 . Different from the embodiment of FIG. 1 , the carrier plate 90 shown in FIG. 6 is concavely warped, that is, the center portion of the carrier plate 90 is farther away from the plate body 40 , and the edge portion is closer to the plate body 40 . As seen from FIG. 6 , the carrier board 90 is concavely warped. At this time, in order to allow the substrate 4 to more effectively receive the plurality of micro-components 92 on the carrier board 90 , the first conductive bumps 42 in this embodiment are connected to The second conductive bump 44 is opposite to FIG. 1 , that is, the volume (first volume) of the first conductive bump 42 is slightly larger than the volume (second volume) of the second conductive bump 44 .

This embodiment also exemplifies an example of adjusting the height with a fixed area. In the example of FIG. 6, the area of a first surface 42a (first contact area) where the first conductive bump 42 is intended to be in contact with the micro-component 92 and the contact area where the second conductive bump 44 is intended to be in contact with the micro-component 92 is a first contact area. The area (second contact area) of the two surfaces 44a is the same, for example, the area a1. At this time, the thicknesses of the first conductive bumps 42 and the second conductive bumps 44 will be different. For example, the thickness (first thickness) of the first conductive bumps 42 is h2, then the thickness of the second conductive bumps 44 ( The second thickness) is h1, and the thickness h2 will be greater than the thickness h1. Since the first conductive bumps 42 in this embodiment are more protruding than the second conductive bumps 44 , when the carrier board 90 is pressed against the substrate 4 by external pressure, the first conductive bumps 42 and the second conductive bumps 42 in different positions The conductive bumps 44 may contact the respective metal connection pads 94 at about the same time. In one example, the first conductive bumps 42 and the second conductive bumps 44 can also have approximately the same connection tightness with the metal connection pads 94 at corresponding positions, so that each micro-component 92 can have uniform conductivity. Thereby increasing the transfer yield. Those skilled in the art know that the volumes of the first conductive bumps 42 and the second conductive bumps 44 can also be determined according to the degree of warpage of the carrier board 90 , which is not limited in this embodiment. In the not-shown embodiment, another conductive bump may also be included, wherein the conductive bumps gradually increase in thickness and volume from the outside to the inside due to the upward concave warpage.

In addition, please refer to FIG. 3 and FIG. 7 together. FIG. 7 is a schematic structural diagram of a substrate corresponding to a recessed carrier according to another embodiment of the present application. Similar to the embodiment of FIG. 3 , the substrate 5 exemplified in FIG. 7 also includes a board body 50 , a plurality of first conductive bumps 52 and a plurality of second conductive bumps 54 , and the carrier board 90 also includes a plurality of micro-components 92 . , and each micro-component 92 has metal connection pads 94 . Different from the embodiment of FIG. 3 , the carrier plate 90 shown in FIG. 7 is concavely warped, that is, the center portion of the carrier plate 90 is farther away from the plate body 50 , and the edge portion is closer to the plate body 50 . Referring to FIG. 7 , in order to allow the substrate 5 to more effectively receive the plurality of micro-components 92 on the carrier board 90 , the first conductive bumps 52 and the second conductive bumps 54 in this embodiment also have different positions due to different positions. Different volumes are designed, and the volume (first volume) of the first conductive bump 52 is slightly larger than the volume (second volume) of the second conductive bump 54 . Different from the embodiment of FIG. 6 , FIG. 7 assumes that the thickness (first thickness) of the first conductive bump 52 is the same as the thickness (second thickness) of the second conductive bump 54 , for example, the thickness h1 . At this time, the area of a first surface 52a (first contact area) of the first conductive bump 52 intended to be in contact with the micro-component 92 may be a2, and the second conductive bump 54 intended to be in contact with the micro-component 92 is a second contact area The area of the surface 54a (the second contact area) may be a1, and the contact area a2 may be larger than the contact area a1.

Following the above, since the carrier board 90 in FIG. 7 is concavely warped, the micro-components 92 close to the edge of the carrier board 90 are relatively close to the board body 50 , while the micro-components 92 near the center of the carrier board 90 are closer to the board body 50 . The distance between them is larger. When external pressure is applied to the carrier board 90 to press the substrate 5 , the carrier board 90 will get closer and closer to the board body 50 . At this time, due to the smaller volume of the second conductive bumps 54 in this embodiment, even if the external pressure on the carrier board 90 is large enough to ensure that the micro-components 92 at the center of the carrier board 90 can be transferred, the second conductive bumps 54 are more compact. Deformation (eg, overflowing between the metal connection pads 94 and the board body 50 ) can be easily used to cope with the extrusion of the external pressure, which can avoid the damage of the micro-component 92 or the substrate 5 caused by the stress, thereby improving the transfer yield.

In addition, FIG. 7 also exemplifies that the first conductive bumps 52 and the second conductive bumps 54 may be arranged in an unequally spaced manner. Those skilled in the art should understand that since the carrier 90 shown in FIG. 7 is concave, the micro-components 92 at the edge of the The micro-components 92 are less displaced. In order for the first conductive bumps 52 and the second conductive bumps 54 to be accurately aligned with the metal connection pads 94 on the micro-components 92 after the displacement, the first conductive bumps 52 and the second conductive bumps 54 should also be provided separately. on the corresponding position of the plate body 50 (or the transfer area). For example, a first distance d1 may be spaced between two adjacent first conductive bumps 52 , and a second distance may be spaced between adjacent first conductive bumps 52 and second conductive bumps 54 d2. In this embodiment, the first distance d1 is slightly smaller than the second distance d2. In other words, the conductive bumps (such as the second conductive bumps 54 ) that are farther away from the center point of the board body 50 will be spread apart, while the conductive bumps (such as the first conductive bumps 52 ) that are farther away from the center point of the board body 50 are arranged. The arrangement will be a little tighter.

On the other hand, it is also possible that the conductive bumps have the same volume but have different cross-sectional shapes depending on their location. Please refer to FIG. 5 and FIG. 8 together. FIG. 8 is a schematic diagram illustrating a structure of a substrate corresponding to a recessed carrier according to yet another embodiment of the present application. Similar to the embodiment of FIG. 5 , the carrier board 90 shown in FIG. 8 is also concavely warped, and the substrate 6 also includes a board body 60 , a plurality of first conductive bumps 62 and a plurality of second conductive bumps. Block 64. In addition, the contact area (second contact area) of the second conductive bump 64 and the first surface 60a may also be a1, and the thickness (second thickness) of the second conductive bump 64 may also be h1. Unlike the embodiment of FIG. 5 , the volumes of the first conductive bumps 62 and the second conductive bumps 64 may be the same. For example, the contact area (first contact area) of the first conductive bump 62 with the first surface 60a of FIG. 8 is area a3, and the thickness (first thickness) of the first conductive bump 62 is h3. At this time, the area a3 will be smaller than the area a1, and the thickness h3 will be larger than the thickness h1. This embodiment does not limit the shape of the first conductive bumps 62 here, but as can be seen from FIG. 8 , the first conductive bumps 62 are higher than the second conductive bumps 64 , and the first conductive bumps 62 are narrower than the second conductive bumps 62 . Conductive bumps 64 .

In the above embodiments of FIGS. 6 to 8 , the Young's modulus of the first conductive bump and the second conductive bump can be designed to be different values, and the first conductive bump and the second conductive bump The Young's modulus of the conductive bumps may correspond to different warpage types of the carrier 90 . For example, when the carrier board 90 is concavely warped, the Young's modulus of the conductive bumps (eg, the second conductive bumps) farther away from the center point of the board body can be designed to be smaller. On the contrary, the Young's modulus of the conductive bumps (eg, the first conductive bumps) close to the center point of the board body can be designed to be larger. In one example, since the Young's modulus of the second conductive bump is smaller than the Young's modulus of the first conductive bump, it means that the first conductive bump is not easily deformed. The first conductive bumps that are not easily deformed can be used to disperse the stress concentrated on the edge of the board body, so that the first conductive bumps and the second conductive bumps bear approximately the same stress.

To sum up, the substrate provided by the present application can be used in a display device, and the conductive bumps at different positions of the substrate can have different designs to correspond to carriers with different warped shapes. When the carrier is concavely warped, the conductive bumps at the upper edge of the substrate can have a larger volume or a larger Young's modulus. On the contrary, when the carrier board is concavely warped, the conductive bumps on the edge of the substrate can correspond to a smaller volume or a smaller Young's modulus. Therefore, the stress on the substrate can be relatively uniform, and the contact area of the metal connection pads on each micro-component and the corresponding conductive bumps can be approximately the same, so that the micro-components on the warped carrier can be received more efficiently , and improve the transfer yield.

The above-mentioned embodiments and/or implementations are only used to illustrate the preferred embodiments and/or implementations of the technology of the present application, and are not intended to limit the implementation of the technology of the present application in any form. Personnel, without departing from the scope of the technical means disclosed in the content of this application, may make some changes or modifications to other equivalent embodiments, but they should still be regarded as substantially the same technology or embodiment as this application.

Claims (21)

1. A substrate, characterized in that, comprising: A board body has a first surface, the first surface defines a plurality of transfer areas, each of the transfer areas is used to receive a plurality of micro-components in different positions on a carrier board at different levels, each of the transfer areas The area is provided with a first conductive bump and a second conductive bump at the same time, and each of the transfer areas defines a center position and an edge position, wherein each of the micro components is a miniature light-emitting diode, and the carrier board has no working circuit. temporary carrier board; The first conductive bump, disposed at the center of one of the transfer regions, has a first volume; and The second conductive bump is disposed at the edge position in the same transfer area as the first conductive bump and away from the center position, and has a second volume; wherein the first volume is different from the second volume. 2 . The substrate of claim 1 , wherein the first conductive bump has a first thickness, and the second conductive bump has a second thickness when the first volume is smaller than the second volume. 3 . , the first thickness is smaller than the second thickness. 3. The substrate of claim 2, wherein the first conductive bump has a first contact area on the first surface, and the second conductive bump has a second contact area on the first surface , the first contact area is substantially the same as the second contact area. 4. The substrate of claim 1, wherein the first conductive bump has a first contact area on the first surface, and the second conductive bump has a second contact area on the first surface , when the first volume is smaller than the second volume, the first contact area is smaller than the second contact area. 5 . The substrate of claim 4 , wherein the first conductive bump has a first thickness, the second conductive bump has a second thickness, and the first thickness is substantially the same as the second thickness. 6 . . 6 . The substrate of claim 1 , further comprising another first conductive bump, two adjacent first conductive bumps are separated by a first distance, and adjacent first conductive bumps are separated by a first distance. 7 . The bump is spaced from the second conductive bump by a second distance, and when the first volume is smaller than the second volume, the first distance is greater than the second distance. 7. The substrate of claim 6, further comprising another second conductive bump, and when the first volume is smaller than the second volume, two adjacent first conductive bumps The interval is greater than the interval between two adjacent second conductive bumps. 8 . The substrate of claim 1 , wherein the first conductive bump has a first thickness, and the second conductive bump has a second thickness when the first volume is greater than the second volume. 9 . , the first thickness is greater than the second thickness. 9. The substrate of claim 8, wherein the first conductive bump has a first contact area on the first surface, and the second conductive bump has a second contact area on the first surface , the first contact area is substantially the same as the second contact area. 10. The substrate of claim 1, wherein the first conductive bump has a first contact area on the first surface, and the second conductive bump has a second contact area on the first surface , when the first volume is greater than the second volume, the first contact area is greater than the second contact area. 11. The substrate of claim 10, wherein the first conductive bump has a first thickness, the second conductive bump has a second thickness, and the first thickness is substantially the same as the second thickness . 12 . The substrate of claim 1 , further comprising another first conductive bump, two adjacent first conductive bumps are separated by a first distance, and adjacent first conductive bumps are separated by a first distance. 13 . The bump is spaced from the second conductive bump by a second distance, and when the first volume is larger than the second volume, the first distance is smaller than the second distance. 13. The substrate of claim 12, further comprising another second conductive bump, and when the first volume is greater than the second volume, two adjacent first conductive bumps are spaced apart The interval of the second conductive bumps is smaller than that of two adjacent ones. 14. A substrate, characterized in that it comprises: A board body has a first surface with a plurality of first conductive bumps and a plurality of second conductive bumps disposed at the same time, the first surface defines a plurality of a transfer area, and each of the transfer areas defines a center point, each of the transfer areas is used for receiving a plurality of micro-components in a carrier board at different positions at different levels, wherein each of the micro-components is a micro light-emitting diode, and the carrier board is a temporary carrier board without a working circuit; The first conductive bump, disposed in the transfer region of one of the transfer regions, has a first cross-sectional shape; and The second conductive bump is disposed in the same transfer area as the first conductive bump at a position away from the center point in the transfer area, and has a second cross-sectional shape, wherein the first cross-sectional shape is different from the first cross-sectional shape Two cross-sectional shapes, and the distance between the first conductive bump and the center point is smaller than the distance between the second conductive bump and the center point. 15. The substrate of claim 14, wherein the first conductive bump has a first volume and the second conductive bump has a second volume, the first volume being substantially the same as the second volume . 16. The substrate of claim 15, wherein the first conductive bump has a first thickness, the second conductive bump has a second thickness, the first thickness is smaller than the second thickness, and The first conductive bump has a first contact area on the first surface, the second conductive bump has a second contact area on the first surface, and the first contact area is larger than the second contact area. 17. The substrate of claim 15, wherein the first conductive bump has a first thickness, the second conductive bump has a second thickness, the first thickness is greater than the second thickness, and The first conductive bump has a first contact area on the first surface, the second conductive bump has a second contact area on the first surface, and the first contact area is smaller than the second contact area. 18. The substrate of claim 1 or 14, wherein the first conductive bump has a first Young's modulus, the second conductive bump has a second Young's modulus, wherein the The first Young's modulus is greater than the second Young's modulus. 19. A display device, characterized in that, comprising: a base plate, comprising: a plate body having a first surface, the first surface defines a plurality of a transfer area, and each of the transfer areas defines a center point; a first conductive bump, disposed in the transfer region of one of the transfer regions, having a first volume and a first cross-sectional shape; and A second conductive bump, disposed in the same transfer area as the first conductive bump, in the transfer area and away from the center point, has a second volume and a second cross-sectional shape, wherein the first volume is the same as the first volume is different from the second volume or the first cross-sectional shape is different from the second cross-sectional shape; wherein the distance between the first conductive bump and the center point is smaller than the distance between the second conductive bump and the center point; and A plurality of micro-components are correspondingly disposed on the first conductive bump and the second conductive bump, wherein each of the transfer regions carries the plurality of micro-components located at different positions on different levels, wherein each of the micro-components is Miniature light-emitting diodes. 20 . The display device of claim 19 , wherein the first conductive bumps and the second conductive bumps corresponding to the micro components have substantially the same bonding area. 21 . 21 . The display device of claim 19 , wherein the first conductive bumps and the micro-components disposed on the substrate have a first height corresponding to the second conductive bumps disposed on the substrate. 22 . The bump and the micro-component have a second height, and the first height is different from the second height.

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