CN111525228A - Antenna module and electronic device - Google Patents

Abstract

The present application discloses an antenna module and an electronic device. The antenna module includes a circuit board, an antenna, and a first heat dissipation element. The first heat dissipation element is connected to the circuit board, and the dielectric constant of the first heat dissipation element is less than or equal to 3. The antenna is electrically connected to the circuit board, the emitting surface of the antenna faces the first heat dissipation element, and the projection of the first heat dissipation element on the emitting surface at least partially covers the emitting surface. In this way, the first heat dissipation element can dissipate heat for the circuit board, and the emitting surface of the antenna faces the first heat dissipation element, and the dielectric constant of the first heat dissipation element is less than or equal to 3, which can effectively prevent the first heat dissipation element from affecting the antenna signal.

Description

Antenna modules and electronics

technical field

The present application relates to the field of electronic equipment, and in particular, to an antenna module and electronic equipment.

Background technique

In the related art, the antenna components of electronic equipment usually generate a large amount of heat during operation, and it is necessary to install a heat sink such as a heat sink to dissipate heat from the antenna components. However, the setting of the heat sink may reduce the radiation rate of the antenna signal, especially When using 5G wireless communication, the frequency spectrum used by 5G communication mainly includes sub-6GHz and millimeter wave. However, the millimeter wave has high frequency and short wavelength, weak diffraction ability and weak penetration ability, and cannot exist within a certain distance of the antenna component. There are structural parts that can cause a sharp attenuation of the transmitted signal from the antenna. Therefore, how to improve the heat dissipation capability of the antenna without affecting the antenna signal has become a research problem for technicians.

SUMMARY OF THE INVENTION

Embodiments of the present application provide an antenna module and an electronic device.

The antenna module of the embodiment of the present application includes:

circuit board;

a first heat dissipation element connected to the circuit board, the first heat dissipation element having a dielectric constant less than or equal to 3; and

The antenna is electrically connected to the circuit board, and the radiating surface of the antenna faces the first heat dissipation element.

An electronic device according to an embodiment of the present application includes a housing and the above-mentioned antenna module, the antenna module is at least partially disposed in the housing, and the projection of the first heat dissipation element on the emission surface at least partially covers the emission noodle.

In the antenna module and the electronic device according to the embodiments of the present application, the first heat dissipation element can dissipate heat from the circuit board, and the radiating surface of the antenna faces the first heat dissipation element, and the dielectric constant of the first heat dissipation element is less than or equal to 3, which can effectively prevent the The first heat dissipation element affects the antenna signal. In this way, the dielectric constant of the first heat dissipation element is relatively small, and the attenuation of the signal is weak or even negligible, so that the heat dissipation capability of the antenna can be improved without affecting the antenna signal.

Additional aspects and advantages of the embodiments of the application will be set forth, in part, in the following description, and in part will be apparent from the description below, or learned by practice of the embodiments of the application.

Description of drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily understood from the following description of embodiments taken in conjunction with the accompanying drawings, wherein:

1 is a schematic perspective view of an electronic device according to an embodiment of the present application;

2 is another schematic perspective view of the electronic device according to an embodiment of the present application;

3 is a schematic diagram of an internal structure of an electronic device according to an embodiment of the present application;

FIG. 4 is another three-dimensional schematic diagram of the electronic device according to the embodiment of the present application;

5 is an exploded schematic diagram of the electronic device according to an embodiment of the present application;

6 is a schematic perspective view of an antenna module according to an embodiment of the present application;

7 is a schematic plan view of an antenna module according to an embodiment of the present application;

8 is an exploded schematic diagram of an antenna module according to an embodiment of the present application;

FIG. 9 is another exploded schematic diagram of the antenna module according to the embodiment of the present application;

FIG. 10 is a schematic diagram of the comparison of the lobe width of the antenna signal in the horizontal direction;

FIG. 11 is a schematic diagram showing the comparison of the lobe width of the antenna signal in the vertical direction;

Figure 12 is a schematic diagram of the comparison of the radiation efficiency of the antenna signal in the horizontal direction;

FIG. 13 is a schematic diagram showing the comparison of the radiation efficiency of the antenna signal in the vertical direction.

Description of main component symbols:

Electronic device 1000, base station 1100, antenna module 100, circuit board 10, antenna 20, emission surface 21, mounting surface 22, accommodating space 23, first heat dissipation element 30, first substrate 31, first heat sink 32, second Heat dissipation element 40, second substrate 41, second heat dissipation fin 42, third heat dissipation element 50, housing 200, heat dissipation channel 210, base 220, air intake channel 221, surrounding wall 230, top cover 240, connector 300, frame body 400 , cooling fan 500 , and rotating mechanism 600 .

Detailed ways

The embodiments of the present application will be further described below with reference to the accompanying drawings. The same or similar reference numbers refer to the same or similar elements or elements having the same or similar functions throughout the drawings.

In addition, the embodiments of the present application described below in conjunction with the accompanying drawings are exemplary, only used to explain the embodiments of the present application, and should not be construed as limitations on the present application.

The following disclosure provides many different embodiments or examples for implementing different structures of the present application. To simplify the disclosure of the present application, the components and arrangements of specific examples are described below. Of course, they are only examples and are not intended to limit the application. Furthermore, this application may repeat reference numerals and/or reference letters in different instances for the purpose of simplicity and clarity, and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed.

Please refer to FIG. 1 , which is a schematic perspective view of an electronic device 1000 according to an embodiment of the present application. The electronic device 1000 in the embodiments of the present application includes, but is not limited to, customer terminal equipment (Customer Premise Equipment, CPE) and wireless devices such as wireless routers. For example, the electronic device 1000 may be a 5G customer terminal device. Taking the electronic device 1000 as a client terminal device as an example, the client terminal device is a wireless broadband access device, and the electronic device 1000 can convert the signal transmitted by the base station 1100 (Base Station), for example, convert the 5G millimeter wave signal into a tablet computer, smart Mobile phones, notebooks and other mobile terminals use a common WiFi (Wireless Fidelity) signal device, which can support multiple mobile terminals to surf the Internet at the same time. The electronic device 1000 may also transmit data to the base station 1100 to transmit the data to the server center through the base station 1100 .

The electronic device 1000 may be installed indoors or outdoors. Specifically, when the electronic device 1000 is installed indoors, the electronic device 1000 may be installed on a wall, or may be placed on a desktop or other position. When the electronic device 1000 is installed outdoors, the electronic device 1000 may be fixed on the wall, for example, the electronic device 1000 may be fixed on the wall through a mounting bracket. The electronic device 1000 located outdoors can be connected to the indoor mains power supply through a wire, so that the mains can continuously supply power to the electronic device 1000 .

The electronic device 1000 may have a regular shape such as a cylindrical shape or a square column shape. Of course, the electronic device 1000 may also have other special shapes. In the electronic device 1000 shown in FIG. 1 , the cross-section of the electronic device 1000 is substantially oval.

Referring to FIGS. 2-5 , in one embodiment of the present application, an electronic device 1000 includes a casing 200 , a frame body 400 , a cooling fan 500 and an antenna module 100 . The frame body 400 is disposed in the casing 200 , and the frame body 400 is used to carry the internal components of the electronic device 1000 , for example, the frame body 400 is used to carry the antenna module 100 and the cooling fan 500 . The cooling fan 500 is disposed in the casing 200 , and the cooling fan 500 is used for generating air flow to dissipate the heat in the casing 200 to the outside of the casing 200 .

The antenna module 100 is disposed at least partially within the housing 200 . The antenna module 100 can be used to transmit and receive signals.

Specifically, the housing 200 is an external part of the electronic device 1000 . The casing 200 may constitute the external shape of the electronic device 1000 , or in other words, the specific shape of the electronic device 1000 is roughly determined by the casing 200 . For example, when the casing 200 is cylindrical, the overall shape of the electronic device 1000 is cylindrical.

It can be understood that the housing 200 can be a hollow structure, and the housing 200 can accommodate the internal components of the terminal electronic device 1000 to protect the internal components of the electronic device 1000 . For example, the housing 200 can reduce the impact on the internal components of the electronic device 1000 , and prevent the internal components from being displaced and other adverse consequences that affect the normal use of the electronic device 1000 . For another example, the housing 200 can reduce the contact of foreign objects such as dust and water vapor with the internal components, and prevent the internal components from being damaged such as short circuits.

The casing 200 may be made of materials such as metal or plastic. In order to improve the ability of the electronic device 1000 to send and receive signals, the housing 200 may be made of non-shielding materials such as plastic. In this way, the signal can penetrate the casing 200 and be received by the antenna module 100 in the casing 200 . In addition, the antenna module 100 in the casing 200 can transmit signals through the casing 200 .

Of course, the casing 200 can be made of various materials according to the specific functions of the casing 200 . For example, the housing 200 can be made of a material with relatively high strength, such as metal, as the bearing part.

Referring to FIGS. 2 and 4 , in some embodiments, the casing 200 may have a heat dissipation channel 210 , and the heat dissipation channel 210 is used to dissipate the heat in the casing 200 to the outside of the casing 200 . In this way, the heat in the casing 200 can be dissipated to the outside of the casing 200 through the heat dissipation channel 210 , thereby reducing the temperature in the casing 200 and ensuring the normal operation of the electronic device 1000 .

Specifically, the heat dissipation channel 210 may be a circular hole, a square hole, or a hole with a specific shape such as a special shape. In addition, the number of the heat dissipation channels 210 may be multiple, and the plurality of heat dissipation channels 210 may be arranged at intervals along the circumferential direction of the housing 200 . The cooling rate of the device 1000.

Further, in some embodiments, the heat dissipation channel 210 may be located at the top of the housing 200 . It can be understood that the air with higher temperature generally flows upwards. Therefore, disposing the heat dissipation channel 210 on the top of the casing 200 is conducive to the dissipation of heat in the casing 200 through the heat dissipation channel 210 .

It should be pointed out that the "top" referred to in the embodiments of the present application refers to the part located above the electronic device 1000 when the electronic device 1000 is in normal use. For example, in the height direction, the height of the top of the electronic device 1000 is 1/4 of the total height of the electronic device 1000 . Therefore, the top of the casing 200 is the upper part of the casing 200 when the electronic device 1000 is in normal use.

The heat dissipation channel 210 may be formed on the top surface of the housing 200 , or may be formed on the side surface of the housing 200 , or the heat dissipation channel 210 may be formed on both the top surface and the side surface of the housing 200 .

Of course, when the heat dissipation of the electronic device 1000 is small enough, the heat dissipation channel 210 can be omitted. The heat dissipation of the electronic device 1000 can be directly transferred to the outside of the casing 200 through the casing 200 .

Referring to FIGS. 4-5 , in some embodiments of the present application, the housing 200 includes a base 220 , a surrounding wall 230 and a top cover 240 . The surrounding wall 230 connects the base 220 and the surrounding wall 230 . Specifically, the base 220 and the surrounding wall 230 may be separate structures, or in other words, the surrounding wall 230 may be detachably mounted on the base 220 . Of course, the base 220 and the surrounding wall 230 may also be an integral structure. The surrounding wall 230 and the top cover 240 may be a separate structure, or may be an integral structure.

The base 220 can provide support for the electronic device 1000 when placed on a supporting surface such as a desktop. The base 220 may be in a block shape or a plate shape or the like. In the embodiment of the present application, the base 220 is provided with an air intake channel 221 , and the air intake channel 221 is used for the external air of the electronic device 1000 to enter the housing 200 , so that the air absorbs the heat generated by the electronic device 1000 and then dissipates from the heat dissipation channel 210 to the outside of the housing 200 .

The surrounding wall 230 may form an accommodation space for accommodating the internal components of the electronic device 1000 . The surrounding wall 230 may be a continuous structure, or in other words, the surrounding wall 230 does not form a joint seam. In the embodiment of the present application, the connector 300 of the electronic device 1000 is exposed from the surrounding wall 230 , as shown in FIG. 3 and FIG. 4 . The electronic device 1000 can communicate with other devices or be connected to a power source through the connector 300 . The connector 300 is, for example, a USB (Universal Serial Bus) connector 300 and a connector 300 such as a power socket. The embodiments of the present application do not limit the specific type of the connector 300 .

The top cover 240 may cover the top of the surrounding wall 230 . The top cover 240 may shield the internal components of the electronic device 1000 from the top of the surrounding wall 230 . The top cover 240 may have a sheet-like or block-like structure. In addition, the outer end surface of the top cover 240 may be in the shape of a circle, an ellipse, or the like, and the structure and shape of the top cover 240 are not limited herein.

In the embodiment of the present application, the heat dissipation channel 210 is provided at the connection between the top cover 240 and the surrounding wall 230 . In other words, the heat dissipation channel 210 is located between the top end of the surrounding wall 230 and the top cover 240 . When the heat dissipation channel 210 is annular, the heat dissipation channel 210 may be formed by a gap formed by the spaced arrangement of the top cover 240 and the surrounding wall 230 .

In some embodiments, the frame body 400 serves as a bearing element of the electronic device 1000 . Internal parts of the electronic device 1000 can be mounted on the casing 400 . For example, at least one of the cooling fan 500 and the antenna module 100 may be mounted on the frame body 400 . For another example, the internal parts of the electronic device 1000 may be installed on the frame body 400 by means of screws, snaps, etc., and the specific installation methods of the internal parts are not limited here. Since the structure of the frame body 400 is adapted to the installation position of the internal parts of the electronic device 1000 , the shape of the frame body 400 is generally irregular. In order to make the frame body 400 easy to manufacture and form, the frame body 400 may be formed by an injection molding process.

Of course, in other embodiments, in the case that the casing 200 can support the client's mobile terminal, the frame body 400 can be omitted.

Referring to FIG. 3 , in the embodiment of the present application, the cooling fan 500 is arranged spaced apart from the antenna module 100 , and the cooling fan 500 is used to generate airflow to dissipate the heat generated by components such as the antenna module 100 in the housing 200 through the cooling channel 210 to dissipate the heat from the housing. The heat in the 200 is dissipated to the outside of the casing 200 . In other words, when the cooling fan 500 is working, the airflow with heat flows from the inside of the casing 200 through the cooling passage 210 and then flows out of the casing 200 . In this way, the cooling fan 500 can speed up the flow of gas, thereby reducing the internal temperature rise of the electronic device 1000 and ensuring the normal use of the electronic device 1000 .

For example, during operation, the cooling fan 500 can inhale air with a lower temperature from the air intake channel 221 , so that the lower temperature air absorbs the heat generated by the components such as the antenna module 100 in the housing 200 and then is discharged from the cooling channel 210 .

In the embodiment of the present application, the cooling fan 500 is located above the antenna module 100 . The "above" referred to here means that, when the electronic device 1000 is in normal use, the direction in which the electronic device 1000 is away from the ground is "up". Therefore, in this embodiment, the position of the cooling fan 500 is higher than the position of the antenna module 100 . The heat dissipation fan 500 can dissipate the heat generated by the antenna module 100 to the outside of the casing 200 through the heat dissipation channel 210 .

The cooling fan 500 may be a centrifugal fan or an axial fan, and the specific type of the cooling fan 500 is not limited here, as long as the cooling fan 500 can dissipate the heat in the casing 200 to the outside of the casing 200 through the cooling channel 210 .

Of course, in other embodiments, when the heat dissipation of the electronic device 1000 is sufficiently small, the cooling fan 500 may be omitted. The heat dissipation of the electronic device 1000 may be transmitted to the outside of the casing 200 through the casing 200 , or dissipated to the outside of the casing 200 through the heat dissipation channel 210 .

Referring to FIGS. 6-8 , in some embodiments of the present application, the antenna module 100 includes a circuit board 10 , an antenna 20 and a first heat dissipation element 30 . The first heat dissipation element 30 is connected to the circuit board 10 , and the dielectric constant of the first heat dissipation element 30 is less than 3. The antenna 20 is electrically connected to the circuit board 10 , and the emission surface 21 of the antenna 20 faces the first heat dissipation element 30 .

It can be understood that in the related art, the antenna component of an electronic device usually generates a large amount of heat during operation, and it is necessary to set a cooling device such as a radiator to dissipate heat from the antenna component. However, the setting of the radiator may reduce the radiation rate of the antenna signal. , especially when using 5G wireless communication, because the frequency spectrum used by 5G communication mainly includes sub-6GHz and millimeter wave, however, the millimeter wave frequency has high frequency and short wavelength, weak diffraction ability, weak penetration ability, and a certain distance from the antenna component. There should be no structural parts within the range that will cause the antenna to transmit signals sharply attenuated. Therefore, how to improve the heat dissipation capability of the antenna without affecting the antenna signal has become a research problem for technicians.

In the antenna module 100 and the electronic device 1000 of the present application, the first heat dissipation element 30 can dissipate heat from the circuit board 10 , and the radiating surface 21 of the antenna 20 faces the first heat dissipation element 30 , and the dielectric constant of the first heat dissipation element 30 Less than or equal to 3 can effectively avoid the influence of the first heat dissipation element 30 on the antenna signal. In this way, the dielectric constant of the first heat dissipation element 30 is relatively small, and the attenuation of the signal is weak or even negligible, so that the heat dissipation capability of the antenna 20 can be improved without affecting the antenna signal.

It should be noted that, in the embodiments of the present application, "the emission surface 21 faces the first heat dissipation element 30" can be understood as the emission surface 21 and the first heat dissipation element 30 being parallel or at a certain inclined angle. The projection on the emission surface 21 at least partially overlaps the emission surface 21 . In the following, if the same or similar description occurs, it can also be understood with reference to this. In the embodiment shown in FIGS. 6-8 , the emission surface 21 faces the first heat dissipation element 30 and is in contact with the first heat dissipation element 30 .

Referring to FIGS. 7-8 , in one embodiment, the antenna 20 is a millimeter wave antenna, and the millimeter wave antenna is used for transmitting and receiving millimeter waves. Millimeter waves are electromagnetic waves with wavelengths ranging from 24GHz to 52GHz. Due to the high frequency and short wavelength of the millimeter wave, the diffracting ability and the penetrating ability are weak, and there cannot be any structural components within a certain distance range of the antenna 20 components that will cause the antenna 20 to transmit signals sharply attenuated. In the antenna module 100 of the present application, the dielectric constant of the first heat dissipation element 30 is less than 3, and its attenuation to the millimeter-wave signal is relatively weak, so that the first heat dissipation element 30 can provide the antenna without affecting the antenna signal. 20 modules for heat dissipation.

Specifically, the circuit board 10 may be a rigid circuit board 10 or a flexible circuit board 10 . In this embodiment, in order to improve the installation stability of the circuit board 10 and the millimeter-wave antenna, the circuit board 10 is, for example, a rigid circuit board such as a printed circuit board (Printed Circuit Board, PCB).

Referring to Figure 8, the mmWave antenna is in the form of a sheet. The millimeter wave antenna can be fixed on the circuit board 10 by soldering. The millimeter wave antenna can achieve the purpose of signal transmission with the circuit board 10 .

Specifically, referring to FIG. 8 , in some embodiments, the antenna 20 further includes a mounting surface 22 opposite to the emission surface 21 , and the antenna 20 transmits and receives signals through the emission surface 21 . The antenna 20 is fixedly mounted on the circuit board 10 through the mounting surface 22 , the first heat dissipation element 30 is disposed on the emission surface 21 , and the first heat dissipation element 30 is used to dissipate heat from the antenna 20 .

In this way, the first heat dissipation element 30 can quickly dissipate the heat generated by the antenna 20 to reduce the temperature of the antenna module 100 and ensure the normal operation of the antenna 20 .

Referring to FIGS. 6-8 , in some embodiments, the first heat dissipation element 30 includes a first substrate 31 and a plurality of first heat dissipation fins 32 disposed on the first substrate 31 , and the first substrate 31 is disposed on the antenna 20 . The emission surface 21 at least partially covers the emission surface 21 , and a plurality of first heat sinks 32 are disposed on the first substrate 31 at intervals.

In this way, the plurality of first heat dissipation fins 32 can increase the heat dissipation area of the first heat dissipation element 30 and improve the heat dissipation performance of the heat dissipation element.

Specifically, the first substrate 31 and the first heat sink 32 can dissipate the heat generated by the radiating surface 21 of the antenna 20, and the heat dissipation fan 500 can form an air flow between the plurality of first heat sinks 32, so as to dissipate the heat to the antenna. The emission surface 21 of 20 conducts heat dissipation. In FIGS. 6-8 , the plurality of first heat sinks 32 are arranged substantially in parallel and substantially perpendicular to the first substrate 31 , and the first substrate 31 is attached to the emitting surface 21 of the antenna 20 .

In some embodiments, the dielectric constant of the first heat dissipation element 30 is less than or equal to 2.8, and the loss tangent of the first heat dissipation element 30 is less than or equal to 0.001. In this way, the influence of the first heat dissipation element 30 on the antenna signal is small.

Preferably, in one example, the dielectric constant of the first heat dissipation element 30 ranges from 2.3 to 2.4, and the loss tangent value of the first heat dissipation element 30 ranges from 0.000018 to 0.00002.

In some embodiments, the first heat dissipation element 30 includes ultra-high molecular weight polyethylene fibers. That is, the first heat dissipation member 30 may be made of ultra-high molecular weight polyethylene fibers. The ultra-high molecular weight polyethylene fiber has good electrical properties, and its dielectric constant and loss tangent are small, so that the dielectric constant of the first heat dissipation element 30 can reach a level of less than 3, thereby preventing the first heat dissipation element 30 from affecting the antenna Signal.

In some embodiments, ultra-high molecular weight polyethylene fibers may be formed from a drawn stack of ultra-high molecular weight polyethylene fibers from the ultra-high molecular weight polyethylene fibers.

In this way, the thermal conductivity of ultra-high temperature molecular weight polyethylene fibers formed by oriented drawing stacks in the fiber length direction. In this way, the first heat dissipation element 30 can have better thermal conductivity without affecting the antenna signal, thereby improving the heat dissipation capability.

It can be understood that the microscopic aspect of the thermal conductivity of the material is reflected in the kinetic energy transfer during the phonon oscillation process. The most ideal state is that the lossless phonons collide with each other in the plane direction, that is, a completely elastic collision (also known as the "ballistic transport of phonons"). transport"). There are three main factors that affect the thermal conductivity of materials: lattice defects, impurities inside the material and boundary effects. The ultra-high molecular weight polyethylene formed by ordinary sintering and injection molding resin materials has low thermal conductivity and poor thermal conductivity due to the existence of lattice defects and impurities in the internal pressing and injection molding process. Generally < 8W/mK. However, in the embodiment of the present application, the ultra-high molecular weight polyethylene fiber material formed by directional extrusion and wire drawing stacking can reduce the mean free path of phonons, thereby reducing the inelastic collision probability of phonons in a single bundle of fibers, and then Increases thermal conductivity in the fiber length direction. For example, in an actual measurement process, the thermal conductivity of the drawn polyethylene fiber in the fiber length direction can reach 40W/mK.

Specifically, in the process of preparing ultra-high molecular weight polyethylene fibers, first, the ultra-high molecular weight polyethylene fiber polymer particles are dissolved in a specific solvent or heated to 145°C at a high temperature to prepare ultra-high molecular weight polyethylene fiber suspension or melt , using a metering pump to quantitatively, continuously and uniformly extrude the solution or melt from the fine holes of the spinneret.

Then, through the changes in the geometry and physical shape of the primary fibers extruded from the spinneret, the filaments in the extrusion, curing process of gelation, crystallization, secondary transformation and macromolecular orientation in the extensional flow can be aligned. The physical and mechanical properties and thermal conductivity of the resulting fibers are changed. The prepared primary fibers are pulled twice, and the internal lattice is oriented again under the action of external force, so as to obtain fiber bundles in which the internal polymer fibers are evenly arranged along the drawing direction, and the ultra-high molecular weight formed by the above-mentioned directional extrusion and drawing Polyethylene fibers can reduce the mean free path of phonons, thereby reducing the inelastic collision probability of phonons in a single bundle of fibers, thereby increasing the thermal conductivity in the fiber length direction.

In the embodiment of the present application, the first heat dissipation element 30 is formed to extend in a direction perpendicular to the emission surface 21 , the drawing direction of the ultra-high molecular weight polyethylene fiber is perpendicular to the emission surface 21 , and the thermal conductivity of the first heat dissipation element 30 along the drawing direction is greater than Or equal to 40W/mK.

Specifically, the drawing direction of the ultra-high molecular weight polyethylene is the length direction of the fibers, that is, the extending direction of the first heat dissipation element 30 . For example, the extension direction of the first substrate 31 and the extension direction of the first heat sink 32, in the example shown in FIG. , in this direction, the heat dissipation coefficient of the first heat dissipation element 30 is larger, and the heat dissipation performance is better.

In addition, in the method of the present application, the density of the first heat dissipating element 30 made of ultra-high molecular weight polyethylene fibers is relatively small, and its density is 0.930 g/cm ³ , which can make the electronic device 1000 light in weight.

It can be understood that, in other embodiments, the first heat dissipation element 30 can also be made of other materials with low dielectric constant, such as PP (polypropylene, polypropylene), PE (polyethylene, polyethylene), PTFE (Poly tetrafluoroethylene) , polytetrafluoroethylene) and SPS (Syndiotactic Polystyrene, syndiotactic polystyrene) and so on. The manufacturing process can also be formed by the above-mentioned directional extrusion and wire drawing stacking, which will not be described in detail here.

Further, with the heat source power consumption Q=1W and the ambient temperature Ta=35°C, the first heat dissipation element 30 formed by stacking the UHMWPE wire drawing with the same size and the ordinary ABS plastic heat sink and the Al- The heat dissipation effect of 6061 (surface sprayed black, no black sprayed) radiator, the specific comparison results are shown in Table 1:

Table 1

As can be seen from the above table, the overall performance of the first heat dissipation element 30 of the present application is comparable to the heat dissipation effect of the black sprayed Al-6061 radiator, and is slightly better than the heat dissipation performance of the surface polished Al-6061 radiator. Compared with ordinary plastic ABS radiator (K=0.26W/mK) and no radiator, the heat source temperature can be greatly reduced (>10℃ profit).

At the same time, the surface emissivity E=0.95 of the first heat dissipation element 30 can significantly improve the surface thermal emissivity E=0.2 compared with the polished aluminum surface radiator emissivity E=0.2, and further improve the heat dissipation capability. certain improvement.

In addition, the surface emissivity of the black-sprayed aluminum heat sink is 0.90, and the heat dissipation performance of the first heat dissipation element 30 is slightly poor (<0.5°C), but the density of the first heat dissipation element 30 made of ultra-high molecular weight fibers is much smaller than that of aluminum. The density of the profile, without the need for surface treatment, can be used to make the product lighter and reduce the cost of the product.

Referring to FIGS. 6-9 , in some embodiments, the antenna module 100 further includes a second heat dissipation element 40 . The second heat dissipation element 40 is disposed on the circuit board 10 and is located outside the range toward which the emission surface 21 faces.

It should be noted that “the second heat dissipation element 40 is located outside the range toward which the emission surface 21 faces” can be understood to mean that there is no overlap between the second heat dissipation element 40 and the emission surface 21 along the direction of the emission surface 21 .

In this way, on the one hand, the second heat dissipation element 40 can dissipate heat from the antenna module 100 together with the first heat dissipation element 30 , thereby improving the heat dissipation capability and making the heat dissipation more uniform. Out of range orientation will not affect the antenna signal. The second heat dissipation element 40 can be made of metal material or plastic material, such as light-weight aluminum material, which is not specifically limited herein.

6-8, in some embodiments, the second heat dissipation element 40 and the antenna 20 are located on opposite sides of the circuit board 10, the second heat dissipation element 40 is opposite to the emitting surface 21, and the second heat dissipation element 40 is used for It is used to dissipate heat to the circuit board 10 .

In this way, the first heat dissipation element 30 can dissipate heat to the emission surface 21 , and the second heat dissipation element 40 can dissipate heat to the side of the circuit board 10 opposite to the emission surface 21 . In this way, both sides of the circuit board 10 can dissipate heat at the same time, so that the heat dissipation is more balanced. For example, taking the antenna 20 as a millimeter-wave antenna as an example, the first heat dissipation element 30 dissipates the heat generated by the radiating surface 21 , and the second heat dissipation element 40 transmits the heat from the mounting surface 22 to the circuit board 10 and the circuit board 10 itself.

Referring to FIGS. 6-8 , in some embodiments, the second heat dissipation element 40 includes a second substrate 41 and a plurality of second heat dissipation fins 42 disposed on the second substrate 41 , and the second substrate 41 is disposed on the circuit board 10 , a plurality of second heat sinks 42 are arranged on the second substrate 41 at intervals.

Next, please refer to Table 2 below. The table below shows that the power consumption of the millimeter-wave antenna is 16.95W, and the circuit board 10 is provided with a second heat dissipation element 40 (for example, an Al-6061 heat sink). Adding the first heat dissipation element 30 on the emitting surface 21 or not adding the first heat dissipation element 30 of the present application has a great influence on the junction temperature of the antenna 20 .

Table 2

It can be seen from the comparison of the data in Table 2 that adding the first heat dissipation element 30 on the emitting surface 21 can effectively reduce the temperature of the antenna 20 module by 12.5°C, and the heat dissipation efficiency is good.

In addition, please refer to Figures 10-13 below. Figures 10-13 respectively compare the lobe width of the millimeter-wave antenna with the first heat-dissipating element 30 on the emitting surface 21 and the first heat-dissipating element 30 without the application of the present application. effect on efficiency.

10 is a schematic diagram of the comparison of the lobe width of the millimeter wave antenna in the horizontal direction. In FIG. 10, the line I is the lobe width curve in the horizontal direction when the first heat dissipation element 30 is not added on the emission surface 21. Line I is the lobe width curve in the horizontal direction when the first heat dissipation element 30 is added on the emission surface 21 . FIG. 11 is a schematic diagram of the comparison of the lobe width of the millimeter-wave antenna in the vertical direction. In FIG. 11, line III is the lobe width curve in the vertical direction when the first heat dissipation element 30 is not added on the emission surface 21, and line IV is the lobe width curve in the vertical direction. When the first heat dissipation element 30 is added to the surface 21, the lobe width curve in the vertical direction.

12 is a schematic diagram of the comparison of the radiation efficiency of the millimeter-wave antenna in the horizontal direction. In the figure, line I is the radiation efficiency curve of signals in different frequency bands in the horizontal direction when the first heat dissipation element 30 is not added on the emission surface 21, and the line VI is the radiation efficiency curve of signals in different frequency bands in the horizontal direction when the first heat dissipation element 30 is added on the emission surface 21 . FIG. 13 is a schematic diagram showing the comparison of the radiation efficiency of the millimeter-wave antenna in the vertical direction. In the figure, line VII is the radiation efficiency curve of signals in different frequency bands in the vertical direction when the first heat dissipation element 30 is not added on the emission surface 21. The line VIII is the radiation efficiency curve of signals of different frequency bands in the vertical direction when the first heat dissipation element 30 is added on the emission surface 21 .

It can be seen from FIGS. 10-13 that adding the first heat sink in the present application on the emitting surface 21 has little effect on the radiation field shape of the antenna 20, and the horizontal and vertical lobe widths are basically unchanged (see FIGS. 10 and 11 ) . It has a slight influence on the radiation efficiency of the antenna 20, which shows that some frequency points are improved, some frequency points are decreased, and the fluctuation range is small (see Figure 12 and Figure 13), but the first heat dissipation element is loaded on the whole. 30 has minimal impact on mmWave antennas.

To sum up, in the antenna module 100 of the present application, disposing the first heat dissipation element 30 can improve the heat dissipation capability while affecting the antenna signal (lobe width and radiation efficiency).

Referring to FIG. 9 , in some embodiments, the first heat dissipation element 30 and the second heat dissipation element 40 are integrally formed.

In this way, the first heat dissipation element 30 and the second heat dissipation element 40 can be made into a composite heat sink. The first heat dissipation element 30 can be made of materials with a low dielectric constant such as the UHMWPE fiber mentioned above, and the second heat dissipation element 40 may be made of metal or other materials.

Referring to FIG. 9 , in some embodiments, the first heat dissipation element 30 is disposed on the circuit board 10 , the number of the antennas 20 is multiple, the plurality of antennas 20 enclose an accommodating space 23 , and the first heat dissipation element 30 is at least partially The ground is located in the accommodating space 23 .

In this way, the first heat dissipation element 30 can extend into the accommodating space 23 enclosed by the antenna 20 without affecting the antenna signal, thereby reducing the space occupied by the first heat dissipation element 30 and enabling the electronic device 1000 to be more miniaturized.

Specifically, in such an embodiment, the antennas 20 are respectively electrically connected to the circuit board 10 , the first heat dissipation elements 30 of the plurality of antennas 20 are arranged at intervals, and the projections of the first heat dissipation elements 30 on the emission surfaces 21 of the plurality of antennas 20 are the same as The emission surfaces 21 overlap at least partially. The antenna 20 may be a WIFI antenna 20 or other radio frequency antennas 20 . In such an embodiment, the first heat dissipation element 30 and the second heat dissipation element 40 can be integrally formed on one surface of the circuit board 10, the first heat dissipation element 30 at least partially extends into the accommodating space 23, and the second heat dissipation element The element 40 is located outside the accommodating space 23 .

In addition, please refer to FIG. 9 , in such an embodiment, the antenna module 100 may further include a third heat dissipation element 50 , and the third heat dissipation element 50 is disposed on the circuit board 10 in phase with the first heat dissipation element 30 and the second heat dissipation element 40 . side of the back. In this way, both sides of the circuit board 10 can be dissipated at the same time, thereby improving the heat dissipation performance and making the heat dissipation more uniform.

Referring to FIG. 4 , in some embodiments, the electronic device 100 further includes a rotation mechanism 600 . The antenna module 100 is connected to the rotation mechanism 600 , and the rotation mechanism 600 is used for the rotation of the antenna module 100 relative to the casing 200 .

In this way, in the electronic device 1000 according to the embodiment of the present application, the antenna module 100 can be driven by the rotating mechanism 600 to achieve any orientation, avoiding the need to install multiple antenna modules 100 in multiple directions, which can reduce the need for electronic equipment. Cost of device 1000. In addition, the antenna module 100 can be driven by the rotating mechanism 600 to rotate, so that the antenna module 100 can be rotated to a predetermined position with strong signals to send and receive signals, thereby improving the signal sending and receiving capability of the electronic device 1000 .

Specifically, in such an embodiment, the circuit board 10 of the antenna module 100 may be directly connected to the rotating mechanism 600 , and the driving mechanism 600 drives the circuit board 10 to rotate, thereby driving other components of the antenna module 100 to rotate. In other embodiments, the antenna module 100 can also be connected to the rotating mechanism 600 through other components. For example, the antenna module 100 can be arranged on a bracket, and the rotating mechanism 600 is connected therebetween. The rotating mechanism 600 drives the bracket to rotate, thereby driving The antenna module 100 rotates.

In addition, please refer to FIG. 6 , in the embodiment of the present application, the length of the first heat dissipation fin 32 in the middle part of the first heat dissipation element 30 is longer than that of the first heat dissipation fins 32 on both sides, and the length of the second heat dissipation element 40 The length of the second cooling fins 42 in the middle portion is also longer than the lengths of the second cooling fins 32 on both sides. In this way, the space occupied when the antenna module 100 is rotated can be reduced, thereby preventing the first heat sink 32 and the second heat sink 42 from interfering with the housing 200 during the rotation.

To sum up, in some embodiments of the present application, the antenna module 100 includes the circuit board 10 , the antenna 20 and the first heat dissipation element 30 . The first heat dissipation element 30 is connected to the circuit board 10 , and the dielectric constant of the first heat dissipation element 30 is less than 3. The antenna 20 is electrically connected to the circuit board 10 , the radiation surface 21 of the antenna 20 faces the first heat dissipation element 30 , and the projection of the first heat dissipation element 30 on the radiation surface 21 at least partially covers the radiation surface 21 .

In the antenna module 100 and the electronic device 1000 of the embodiments of the present application, the first heat dissipation element 30 can dissipate heat from the circuit board 10 , and the radiating surface 21 of the antenna 20 faces the first heat dissipation element 30 , and the dielectric of the first heat dissipation element 30 The constant less than or equal to 3 can effectively avoid the influence of the first heat dissipation element 30 on the antenna signal. In this way, the dielectric constant of the first heat dissipation element 30 is relatively small, and the attenuation of the signal is weak or even negligible, so that the heat dissipation capability of the antenna 20 can be improved without affecting the antenna signal.

In the description of this specification, reference is made to the terms "some embodiments," "one embodiment," "some embodiments," "exemplary embodiments," "examples," "specific examples," or "some examples." Described means that a particular feature, structure, material, or characteristic described in connection with the described embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present application have been shown and described above, it should be understood that the above embodiments are exemplary and should not be construed as limitations to the present application. Variations, modifications, substitutions, and alterations are made to the embodiments, and the scope of the present application is defined by the claims and their equivalents.

Claims (16)

1. An antenna module, comprising:

a circuit board;

a first heat dissipation element connected to the circuit board, the first heat dissipation element having a dielectric constant less than or equal to 3; and

the antenna is electrically connected with the circuit board, the emitting surface of the antenna faces the first heat dissipation element, and the projection of the first heat dissipation element on the emitting surface at least partially covers the emitting surface.

2. The antenna module of claim 1, wherein the first heat dissipating element comprises ultra-high molecular weight polyethylene fibers.

3. The antenna module of claim 2, wherein the ultra high molecular weight polyethylene fibers are formed from a drawn stack of ultra high molecular weight polyethylene.

4. The antenna module of claim 3, wherein the first heat dissipation element is formed to extend in the direction perpendicular to the radiation surface, a drawing direction of the ultra-high molecular weight polyethylene fiber is perpendicular to the radiation surface, and a thermal conductivity of the first heat dissipation element in the drawing direction is greater than or equal to 40W/mK.

5. The antenna module of claim 1, wherein the antenna comprises a millimeter wave antenna.

6. The antenna module of claim 5, wherein the first heat spreading element has a dielectric constant less than or equal to 2.8 and a loss tangent of less than or equal to 0.001.

7. The antenna module of claim 6, wherein the first heat dissipation element has a dielectric constant in a range of 2.3 to 2.4, and a loss tangent in a range of 0.000018 to 0.00002.

8. The antenna module of claim 5, wherein the antenna further comprises a mounting surface opposite to the radiating surface, the antenna is fixedly mounted on the circuit board through the mounting surface, the first heat dissipation element is disposed on the radiating surface, and the first heat dissipation element is configured to dissipate heat of the antenna.

9. The antenna module of claim 8, wherein the first heat spreading element comprises a first substrate and a plurality of first heat spreading fins disposed on the first substrate, the first substrate being disposed on and at least partially covering the radiating surface, the plurality of first heat spreading fins being disposed on the first substrate at intervals.

10. The antenna module of claim 1, further comprising a second heat dissipation element disposed on the circuit board and located outside a range toward which the radiating surface faces.

11. The antenna module of claim 10, wherein the second heat dissipation element and the first heat dissipation element are located on opposite sides of the circuit board, the second heat dissipation element being opposite the radiating surface, the second heat dissipation element being configured to dissipate heat from the circuit board.

12. The antenna module of claim 10, wherein the second heat dissipating element comprises a second substrate and a plurality of second heat dissipating fins disposed on the second substrate, the second substrate being disposed on the circuit board, the plurality of second heat dissipating fins being disposed on the second substrate at intervals.

13. The antenna module of claim 10, wherein the first heat spreading element is integrally formed with the second heat spreading element.

14. The antenna module of claim 1, wherein the first heat dissipation element is disposed on the circuit board, the number of the antennas is plural, an accommodation space is defined by the plural antennas, and the first heat dissipation element is at least partially located in the accommodation space.

15. An electronic device, comprising:

a housing; and

the antenna module of any one of claims 1-11, disposed at least partially within the housing.

16. The electronic device of claim 15, further comprising a rotation mechanism, wherein the antenna module is connected to the rotation mechanism, and the rotation mechanism is configured to drive the antenna module to rotate.

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