CN114302629A - Customer premises equipment and control method thereof - Google Patents

Abstract

The application mainly relates to a customer premises equipment and a control method thereof, the customer premises equipment comprises a shell, a radio frequency system arranged in the shell, and a first cooling device and a second cooling device which are connected with the shell, wherein the radio frequency system comprises a millimeter wave radio frequency module, the first cooling device is used for discharging heat generated by the radio frequency system, and the second cooling device is used for cooling the millimeter wave radio frequency module; the first cooling device and the second cooling device are fans or semiconductor refrigerators respectively. The utility model provides a customer premises equipment is provided with first heat sink and the second heat sink that is fan or semiconductor cooler respectively, and first heat sink is used for the heat that discharge radio frequency system produced, and the millimeter wave radio frequency module is dispelled the heat to the second heat sink pertinence to supplementary first heat sink dispels the heat to radio frequency system, and then prolongs first heat sink's life when the heat dissipation demand of taking into account customer premises equipment.

Description

Customer premises equipment and its control method

technical field

The present application relates to the technical field of electronic equipment, in particular to customer pre-installation equipment and a control method thereof.

Background technique

With the continuous development of science and technology, the ^5th generation mobile network (5G for short) is favored by users due to its high communication speed and other characteristics. However, with the continuous popularization of 5G communications, the power density of electronic equipment such as Customer Premise Equipment (CPE) has also increased rapidly, and the operating temperature of related electronic devices is also facing severe over-temperature risks. . According to statistics, more than 50% of the failure of the customer's front-end equipment comes from overheating.

SUMMARY OF THE INVENTION

An embodiment of the present application provides a customer front-end device. The customer front-end device includes a housing, a radio frequency system disposed in the housing, and a first cooling device and a second cooling device connected to the housing. The radio frequency system includes a millimeter wave In the radio frequency module, the first cooling device is used to discharge heat generated by the radio frequency system, and the second cooling device is used to dissipate heat from the millimeter-wave radio frequency module; wherein, the first cooling device and the second cooling device are fans or semiconductor refrigerators respectively.

The embodiment of the present application also provides a control method for customer pre-installed equipment, the control method includes: detecting the rotational speed of the first fan and the temperature of the millimeter-wave radio frequency module; if the rotational speed of the first fan is greater than a preset maximum working rotational speed And the temperature of the millimeter-wave radio frequency module is higher than the preset warning temperature, turn on the second fan; determine whether the temperature of the millimeter-wave radio frequency module is lower than the warning temperature; if the temperature of the millimeter-wave radio frequency module is lower than the warning temperature, turn off the second fan. fan.

The beneficial effects of the present application are as follows: the customer front-end equipment provided by the present application is provided with a first cooling device and a second cooling device, which are fans or semiconductor refrigerators, respectively, and the first cooling device is used to discharge the heat generated by the radio frequency system, and the first cooling device is used to discharge the heat generated by the radio frequency system. The second cooling device dissipates the millimeter-wave radio frequency module in a targeted manner to assist the first cooling device to dissipate heat from the radio frequency system, thereby extending the service life of the first cooling device while taking into account the heat dissipation requirements of the customer's front-end equipment.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the drawings that are used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative effort.

Fig. 1 is the composition structure schematic diagram of a kind of network system architecture provided by this application;

FIG. 2 is a schematic structural diagram of an embodiment of a customer front-end device provided by the present application;

FIG. 3 is a schematic structural diagram of an embodiment of a customer front-end device provided by the present application;

FIG. 4 is a schematic structural diagram of an embodiment of a customer front-end device provided by the present application;

FIG. 5 is a schematic flowchart of an embodiment of a method for controlling a customer premises equipment provided by the present application.

Detailed ways

The present application will be further described in detail below with reference to the accompanying drawings and embodiments. It is particularly pointed out that the following examples are only used to illustrate the present application, but do not limit the scope of the present application. Likewise, the following embodiments are only some of the embodiments of the present application but not all of the embodiments, and all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

Reference in this application to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application may be combined with other embodiments.

Referring to FIG. 1 and FIG. 2 together, FIG. 1 is a schematic structural diagram of a network system architecture provided by the present application, and FIG. 2 is a schematic structural diagram of an embodiment of a customer front-end device provided by the present application. It should be noted that: for the convenience of description, the customer front equipment shown in FIG. 2 hides the casing, but it does not mean that the casing does not exist.

Referring to Fig. 1 , the customer front-end device 10 is often used for indoor/close-range communication network switching. It can be used as a mobile signal access device that receives mobile signals and forwards them with WiFi signals; it can also be used as a high-speed 4G Or a device that converts signals such as 5G into WiFi signals. The customer premises equipment 10 may be connected to the base station 20 and access the core network through the base station 20 . In this way, the customer premises equipment 10 is used to realize the network access function, convert the operator's public network (WAN) to the user's home local area network (LAN), and can support multiple terminals such as mobile phones, tablet computers, notebook computers, wearable devices, etc. Device 30 accesses the network. For example: when the customer front-end equipment 10 is connected to the 5G communication system, the customer front-end equipment 10 can transmit and receive data with the corresponding base station 20 through the beam formed by the millimeter wave antenna module; of course, the beam is preferably aimed at the base station. 20 to increase the stability of the customer premise equipment 10 transmitting uplink data to the base station 20 or receiving the downlink data transmitted by the base station 20 .

2 and 1 , the customer premises equipment 10 may include a casing 11 and a radio frequency system 12 disposed in the casing 11 , and the casing 11 supports, locates and protects structures such as the radio frequency system 12 . Wherein, the housing 11 may be substantially cylindrical, prismatic, or the like, so as to constitute the appearance of the customer front-end equipment 10 . Correspondingly, the casing 11 may be provided with function keys such as a power key, a WPS key, a switch key, etc., as well as sockets such as a USB socket, a network cable socket, a power socket, etc., and various types of indicator light.

With reference to FIG. 2 , the radio frequency system 12 may include a 4G radio frequency module 121 , a 5G radio frequency module, and a WiFi radio frequency module 124 . The 5G radio frequency module may include a millimeter wave radio frequency module 122 and a sub-6G radio frequency module 123. The millimeter wave radio frequency module 122 is used for transmitting and receiving antenna signals in the millimeter wave frequency band, and the sub-6G radio frequency module 123 is used for transmitting and receiving antenna signals in the sub-6 GHz frequency band. Signal. It is worth noting that the millimeter wave radio frequency module 122 can provide a continuous bandwidth of more than 100M and a great data throughput, so that the customer premises equipment 10 has relatively high communication performance. Further, the radio frequency system 12 may further include a first circuit board 125 and a second circuit board 126, and electronic components such as radio frequency transceivers and power amplifiers of the 4G radio frequency module 121, the sub-6G radio frequency module 123 and the WiFi radio frequency module 124 can be integrated. On the first circuit board 125, their antennas can be supported by the housing 11; electronic components such as radio frequency transceivers and power amplifiers of the millimeter wave radio frequency module 122 can be integrated on the second circuit board 126, and its antenna can also be printed on fabricated on the second circuit board 126 .

It should be noted that although the millimeter wave has the advantages of providing a continuous bandwidth of more than 100M and great data throughput, at the same time, due to the high frequency of the millimeter wave, that is, the short wavelength, the diffraction ability and the penetration ability are weak. , the transmission distance is short. Not only that, the transmission of millimeter waves is highly susceptible to environmental influences, and rain and tree blocking will cause great interference to signal transmission. Therefore, the transmission of millimeter waves requires the antenna of the customer premises equipment 10 to be aligned with the base station 20 as much as possible, so that the customer premises equipment 10 can transmit uplink data to the base station 20 or receive downlink data transmitted by the base station 20 . Based on this, the millimeter-wave radio frequency module 122 of the customer premises equipment 10 is generally designed to be rotatable. For example, the second circuit board 126 can be connected to the first circuit board 125 through a rotating structure 13 , so that the millimeter wave radio frequency module 122 can rotate relative to the first circuit board 125 , thereby meeting the requirements of the customer front-end equipment 10 to rotate and scan.

As an example, the 4G radio frequency module 121 , the WiFi radio frequency module 124 and the sub-6G radio frequency module 123 can be arranged at intervals along the height direction of the customer premises equipment 10 , and in the aforementioned height direction, the 4G radio frequency module 121 can be compared with The sub-6G radio frequency module 123 is closer to the millimeter wave radio frequency module 122 . Further, the antennas of the 4G radio frequency module 121 , the sub-6G radio frequency module 123 and the WiFi radio frequency module 124 can be set at intervals along the circumferential direction of the customer front-end device 10 , so that the beam scanning range of the above-mentioned radio frequency modules can be Achieve 360° omnidirectional coverage on the horizontal plane. Wherein, the aforementioned antenna may be a directional antenna and/or an omnidirectional antenna. A directional antenna means that the emission and reception of electromagnetic waves in one or several specific directions are particularly strong, while the emission and reception of electromagnetic waves in other directions are zero or zero. A very small antenna; an omnidirectional antenna exhibits 360° uniform radiation on the horizontal pattern, with no directionality, and appears as a beam with a certain width on the vertical pattern, and in general, the smaller the lobe width , the greater the gain. For example: the number of antennas of the 4G radio frequency module 121 is four, and they are evenly spaced along the circumferential direction of the customer front-end equipment 10, and their geometric centers are approximately flush in the height direction of the customer-end equipment 10; The number of antennas of the sub-6G radio frequency module 123 is four, and they are evenly spaced along the circumferential direction of the customer front-end equipment 10, and their geometric centers are approximately flush in the height direction of the customer-end equipment 10; The number of antennas of the WiFi radio module 124 is four, and they are evenly spaced along the circumferential direction of the customer premises equipment 10 , and their geometric centers are approximately flush in the height direction of the customer premises equipment 10 .

Generally speaking, the radio frequency system 12 generates a large amount of heat during the operation of transmitting and receiving radio frequency signals. If the heat is not dissipated in time, the reliability and service life of the electronic components in the radio frequency system 12 will be greatly affected. To this end, with reference to FIG. 2 , a first heat sink 141 can be provided on at least one of the front and back sides of the first circuit board 125 , and the first heat sink 141 can radiate heat to the circuit board integrated on the first circuit board 125 . The radio frequency transceivers, power amplifiers and other electronic components of the 4G radio frequency module 121 , the sub-6G radio frequency module 123 and the WiFi radio frequency module 124 are dissipated for heat dissipation. Two radiators 142 , the second radiator 142 can dissipate heat to the electronic components such as the radio frequency transceiver and the power amplifier of the millimeter wave radio frequency module 122 and other modules integrated on the second circuit board 126 by means of thermal radiation. The first radiator 141 and the second radiator 142 may have a plurality of heat dissipation fins arranged at intervals to increase the heat dissipation area of the corresponding heat sink, thereby improving the heat dissipation effect of the customer pre-installed device 10 . Further, a fan 151 may be provided at one end of the radio frequency system 12 , for example, the end away from the millimeter-wave radio frequency module 122 , and the fan 151 may form heat convection in the casing 11 so as to remove the heat in the casing 11 in time. Correspondingly, referring to FIG. 1, the housing 11 may be provided with a first ventilation hole 111 and a second ventilation hole 112, and the first ventilation hole 111 and the second ventilation hole 112 may be respectively arranged on the side of the customer front-end device 10; One of them is used as the air inlet, and the other is used as the air outlet. For example: in the height direction of the customer front equipment 10, the first ventilation hole 111 is close to the bottom of the customer front equipment 10, and the second ventilation hole 112 is close to the top of the customer front equipment 10, so as to increase the first ventilation hole 111 and the second ventilation hole 111. The distance between the two ventilation holes 112; the fan 151 can be arranged close to the first ventilation hole 111, that is, at the bottom of the customer pre-installed device 10, so as to lower the center of gravity of the customer-pre-installed device 10, thereby increasing the time when the customer pre-installed device 10 is placed. stability. The cooling fins of the first radiator 141 and the second radiator 142 may extend along the direction of the airflow generated by the fan 151 , so as to improve the cooling effect of the customer pre-installed device 10 .

The inventor of the present application has found in the long-term research and development work that: the related art uses the fan 151 to cooperate with the first radiator 141 and the second radiator 142, although it can meet the heat dissipation requirements of the customer's front-end equipment 10 to a certain extent, but the fan 151 has moving parts such as stator and rotor, in which factors such as loss of lubricating oil, stress concentration and entry/accumulation of dust often lead to the failure of the aforementioned moving parts, which in turn leads to lower reliability and shorter service life of the fan 151, The reliability and service life of the customer premises equipment 10 is also reduced. Not only that, in conjunction with FIG. 1 and FIG. 2 , when the radio frequency system 12 is overloaded, the data traffic is often very large, resulting in a sharp increase in the power consumption of the customer front-end equipment 10; and the millimeter-wave radio frequency module 122 is located in the customer front-end equipment. The top of 10 , that is, farther from the fan 151 . In some embodiments, such as the working mode of the fan 151 is the blowing mode, the air flow in the housing 11 is from the first ventilation hole 111 to the second ventilation hole 112, and the millimeter wave radio frequency module 122 is located downstream of the air flow generated by the fan 151, resulting in The heat in the housing 11 is collected to the millimeter-wave radio frequency module 122 . At this time, due to the thermal cascade effect, the heat dissipation efficiency of the area where the millimeter wave radio frequency module 122 is located will decrease accordingly. In some other embodiments, such as the working mode of the fan 151 is the ventilation mode, the air flow in the housing 11 is from the second ventilation hole 112 to the first ventilation hole 111 , although the millimeter wave radio frequency module 122 is located upstream of the air flow generated by the fan 151 , but the distance from the fan 151 is far away, and there is also a problem that the heat dissipation efficiency of the area where the millimeter wave radio frequency module 122 is located is low. Regardless of the above-mentioned embodiments, in order to reduce the temperature at the millimeter-wave radio frequency module 122 , the rotational speed of the fan 151 needs to be significantly increased, so as to increase the flow rate of the airflow generated by the fan 151 . However, blindly increasing the rotational speed of the fan 151 will not only cause a larger fan noise, which will affect the user experience of the product, but also increase the risk of the fan 151 failing due to a larger workload. To this end, an inventive concept of the present application may be: adding a cooling device to the customer front-end equipment 10 , and the additional cooling device can dissipate heat for the millimeter-wave radio frequency module 122 . Specifically, when the fan 151 is overloaded and the temperature of the millimeter-wave radio frequency module 122 is still high, the additional cooling device is turned on to dissipate heat to the millimeter-wave radio frequency module 122; and when the temperature of the millimeter-wave radio frequency module 122 drops Then close the additional cooling device. In this way, the additional cooling device can assist the fan 151 to dissipate heat from the radio frequency system 12 , so as to allow the fan 151 to work at a lower noise level while taking into account the heat dissipation requirements of the customer's front-end equipment 10 , and prolong the service life of the fan 151 .

3 and 4 together, FIG. 3 is a schematic structural diagram of an embodiment of a customer front-end device provided by the present application, and FIG. 4 is a schematic structural diagram of an embodiment of the customer front-end device provided by the present application. It should be noted that: for the convenience of description, compared with FIG. 2 , the customer front-end equipment shown in FIG. 3 and FIG. 4 is simplified in structure. Similarly, the customer premises equipment shown in Figure 4 conceals the housing, but does not mean that the housing does not exist.

3 and 4 , the customer premises equipment 10 may include a housing 11 , a radio frequency system 12 disposed in the housing 11 , and a first cooling device 152 and a second cooling device 153 connected to the housing 11 . The first cooling device 152 is used to dissipate the heat generated by the radio frequency system, and the second cooling device 153 dissipates heat to the millimeter-wave radio frequency module 122 in a targeted manner, so as to assist the first cooling device 152 to dissipate heat from the radio frequency system 12 , thereby taking into account both the The service life of the first cooling device 152 is extended when the heat dissipation of the customer pre-installed equipment 10 is required. Different from the related art: the first cooling device 152 and the second cooling device 153 in the present application are respectively fans or semiconductor coolers (Thermoelectric Cooler, TEC), so as to detect the rotational speed or current of the first cooling device 152, and The temperature at the millimeter wave radio frequency module 122 is used to control whether the second cooling device 153 is turned on or not, as well as its rotational speed or current, so that the cooling system of the customer pre-equipment 10 is more flexible and controllable, thereby improving the performance of the customer pre-equipment 10. The reliability of the cooling system and prolong its life.

It should be noted that: for the embodiment in which the fan is used as the first cooling device 152 or the second cooling device 153, the fan can be arranged in the casing 11 or outside the casing 11, and can also be used as the casing part of 11. Among them, the fan is arranged in the casing 11, which can better take into account the appearance quality of the customer's front-end equipment 10; cooling needs. Similarly, for the embodiment in which the semiconductor refrigerator is used as the first cooling device 152 or the second cooling device 153, the semiconductor refrigerator can be arranged in the casing 11 or outside the casing 11, and can also be used as the first cooling device 152 or the second cooling device 153. part of the housing 11 . Among them, the semiconductor refrigerator is arranged in the housing 11, which is more conducive to reducing the thermal resistance between the semiconductor refrigerator and the heat source such as the millimeter-wave radio frequency module 122, and better takes into account the appearance quality of the customer front-end equipment 10; The refrigerator is arranged outside the casing 11 or as a part of the casing 11 , which is more conducive to maintaining the low temperature state of the cold end (relative to the high temperature state of the hot end) of the semiconductor refrigerator. Further, compared with the non-contact cooling of the fan, the hot end of the semiconductor cooler is generally in contact with the heat source such as the millimeter-wave radio frequency module 122 to reduce the thermal resistance between the two, thereby making the semiconductor cooler more efficient. "carries" heat from a heat source to its cold end. Based on this, for the embodiment in which the semiconductor cooler is used as the second cooling device 153, in order to take into account the working requirements of the millimeter wave radio frequency module 122 rotating relative to the housing 11, the semiconductor refrigerator can be in contact with the millimeter wave radio frequency module 122, and then Then it rotates relative to the housing 11, and at this time, it can simply be regarded as an indirect connection between the semiconductor cooler and the housing 11; the semiconductor cooler can also be directly connected with the housing 11, and its hot end is as close as possible to the millimeter-wave radio frequency module. 122, in order to take into account the heat dissipation requirement of the semiconductor cooler for the millimeter-wave radio frequency module 122 and the working requirement of the millimeter-wave radio frequency module 122 rotating relative to the housing 11 (and the semiconductor refrigerator).

In some embodiments, both the first cooling device 152 and the second cooling device 153 may be fans, and the fans may be axial-flow, centrifugal, mixed-flow or other types of fans, such as piezoelectric fans, electromagnetic fans, and the like. At this time, the housing 11 may be provided with a first ventilation hole 111 and a second ventilation hole 112, one of the first ventilation hole 111 and the second ventilation hole 112 is used as an air inlet, and the other is used as an air outlet. For example, in the height direction of the customer front equipment 10 , the first ventilation hole 111 is close to the bottom of the customer front equipment 10 , and the second ventilation hole 112 is close to the top of the customer front equipment 10 . Further, the millimeter-wave radio frequency module 122 is close to the second ventilation hole 112 , that is, the millimeter-wave radio frequency module 122 is close to the top of the customer front-end device 10 to reduce the probability of the millimeter-wave radio frequency module 122 being blocked.

As an example, the first cooling device 152 is configured to discharge the heat generated by the radio frequency system 12, that is, the first cooling device 152 forms thermal convection in the casing 11, so as to take away the heat in the casing 11 in time; The second cooling device 153 is configured to dissipate heat to the millimeter-wave radio frequency module 122 . Wherein, when the customer front-end equipment 10 is working, at least the first cooling device 152 of the first cooling device 152 and the second cooling device 153 is in an open state. Specifically, the first cooling device 152 can be set to be always on when the customer pre-installed equipment 10 is working, in order to respond to the heat dissipation demand of the customer front-end equipment 10; when the first cooling device 152 is overloaded and the temperature of the millimeter wave radio frequency module 122 remains the same When the temperature is higher, the second cooling device 153 can be turned on immediately to dissipate heat for the millimeter-wave radio frequency module 122 ; when the temperature of the millimeter-wave radio frequency module 122 drops, the second cooling device 153 can be turned off. In this way, the second cooling device 153 can assist the first cooling device 152 to dissipate heat to the RF system 12 , so as to allow the first cooling device 152 to work at a lower noise level while taking into account the cooling requirements of the customer's front-end equipment 10 , and extend the The service life of the first cooling device 152 .

Further, the working mode of the first cooling device 152 can be the blowing mode or the exhausting mode, so as to discharge the heat generated by the radio frequency system 12; and the working mode of the second cooling device 153 can be the blowing mode, so as to blow away the millimeter-wave radio frequency. The heat generated by the module 122 itself or the heat accumulated at the millimeter-wave radio frequency module 122 . Wherein, for the first cooling device 152 , the so-called blowing mode refers to sending cold air into the customer front equipment 10 , and the so-called exhaust mode refers to sending hot air to the outside of the customer front equipment 10 . In other words, taking the airflow in the customer pre-installation equipment 10 as a reference, the first cooling device 152 is located upstream of the aforementioned airflow when the working mode is the blowing mode, and is located downstream of the aforementioned airflow when the working mode is the exhausting mode.

In some specific embodiments, referring to FIG. 3 , the first cooling device 152 may be close to the first ventilation hole 111 , that is, in the height direction of the customer front equipment 10 , the first cooling device 152 may be close to the customer front equipment 10 . , the second cooling device 153 may be close to the top of the customer premises equipment 10 . At this time, since the hot air in the customer front equipment 10 tends to spread to the top of the customer front equipment 10, and the first cooling device 152 is close to the bottom of the customer front equipment 10, the working mode of the first cooling device 152 can be Blow mode is preferred. In this way, the airflow generated by the first cooling device 152 is in the same direction as the hot air diffused in the customer front equipment 10 , which is beneficial to improve the heat dissipation effect of the customer front equipment 10 and reduce the power of the first cooling device 152 and the second cooling device 153 . consumption.

In some other specific embodiments, referring to FIG. 4 , the first cooling device 152 may be close to the second ventilation hole 112 , that is, in the height direction of the customer front equipment 10 , the first cooling device 152 and the second cooling device 153 Both can be near the top of the customer premises equipment 10 . At this time, since the hot air in the customer premises equipment 10 tends to diffuse to the top of the customer premises equipment 10, and the first cooling device 152 is close to the top of the customer front equipment 10, the working mode of the first cooling device 152 can be The ventilation mode is preferred. In this way, the airflow generated by the first cooling device 152 is in the same direction as the hot air diffused in the customer front equipment 10 , which is beneficial to improve the heat dissipation effect of the customer front equipment 10 and reduce the power of the first cooling device 152 and the second cooling device 153 . consumption.

Similarly, the customer premises equipment 10 may further include a first heat sink 141 and a second heat sink 142, the first heat sink 141 may be connected to other modules of the radio frequency system 12 except the millimeter wave radio frequency module 122, and the second heat sink 142 142 can be connected to the millimeter wave radio frequency module 122 to assist the first cooling device 152 and the second cooling device 153 to dissipate heat. Specifically, at least one of the front and back sides of the first circuit board 125 can be provided with a first heat sink 141, and the first heat sink 141 can radiate heat to the 4G radio frequency module 121, The radio frequency transceivers, power amplifiers and other electronic components of the sub-6G radio frequency module 123 and the WiFi radio frequency module 124 are dissipated for heat dissipation. The second radiator 142 can be provided on the side of the second circuit board 126 away from the millimeter wave radio frequency module 122 and other modules. The second radiator 142 can dissipate heat to the electronic components such as the radio frequency transceiver and the power amplifier of the module such as the millimeter wave radio frequency module 122 integrated on the second circuit board 126 by means of thermal radiation. Wherein, the thermal conductivity of the first radiator 141 and the second radiator 142 may be greater than or equal to 100W·(m·K) ⁻¹ ; and the thermal conductivity of air is only about 0.0267W·(m·K) ⁻¹ . The material of the first heat sink 141 and the second heat sink 142 may be a metal with high thermal conductivity such as aluminum or its aluminum alloy, copper or its copper alloy, or a high thermal conductivity functional material such as graphite. Of course, each of the heat dissipation fins in the first heat sink 141 and the second heat sink 142 may also be configured as a heat dissipation structure such as a vapor chamber (Vapor Chambers, VC). Further, between the first radiator 141 and the first circuit board 125 and between the second radiator 142 and the second circuit board 126 may also be filled with materials having relatively high thermal conductivity such as silicone grease, thermally conductive gel, thermally conductive pad, metal sheet, etc. High thermal conductivity thermal interface material to reduce interface thermal resistance.

Based on the above related descriptions, the first heat sink 141 and the second heat sink 142 may have a plurality of heat dissipation fins arranged at intervals to increase the heat dissipation area of the corresponding heat sink, thereby improving the heat dissipation effect of the customer pre-installed device 10 . The heat dissipation fins of the second heat sink 142 can extend away from the millimeter-wave radio frequency module 122, and the second cooling device 153 can be located on the side of the second heat sink 142 away from the millimeter-wave radio frequency module 122, so the second cooling device 153 The generated airflow may not be perpendicular to the plane where the cooling fins of the second radiator 142 are located, that is, the airflow generated by the second cooling device 153 flows along the gap between the two cooling fins of the second radiator 142 as much as possible, so that the millimeter-wave Heat is dissipated more efficiently in the area where the RF module 122 is located.

It should be noted that the first ventilation hole 111 and the second ventilation hole 112 may be located at two ends of the radio frequency system 12, respectively, so that the airflow in the housing 11 flows through the first radiator 141 and the second radiator 142, that is, The amount of heat exchange between the aforementioned airflow and the first radiator 141 and the second radiator 142 is increased, thereby more efficiently removing the heat generated by each module of the radio frequency system 12 conducted by the first radiator 141 and the second radiator 142 .

In some other embodiments, the first cooling device 152 may be a fan, and the second cooling device 153 may be a semiconductor refrigerator. Wherein, the working mode of the first cooling device 152 and the relative position thereof in the customer front-end equipment 10 are the same as or similar to those in the above-mentioned embodiment, and are not repeated here. The difference is that the second cooling device 153 is connected to the millimeter-wave radio frequency module 122 , for example, the hot end of the second cooling device 153 is in contact with the millimeter-wave radio frequency module 122 , and can also be filled with silicone grease, thermal conductive gel, Thermal interface materials with high thermal conductivity, such as thermal pads, metal sheets, etc., can reduce the interface thermal resistance. Further, the second cooling device 153 can also be used as a part of the housing 11 to allow the cold end of the second cooling device 153 to be directly exposed to the external environment where the customer front-end equipment 10 is located, so as to make full use of the heat radiation and heat of the external environment. Convection, etc., so that the cold end of the second cooling device 153 can maintain a lower temperature as much as possible.

In other other embodiments, the first cooling device 152 may be a semiconductor refrigerator, and the second cooling device 153 may be a fan; or, the first cooling device 152 may be a semiconductor refrigerator, and their specific structures are the same as those described above. The same or similar embodiments are not repeated here.

Based on the above detailed description, since the radio frequency system 12 is disposed in the casing 11 , the heat generated by the radio frequency system 12 is discharged from the customer pre-installed equipment 10 except for the guidance of the airflow generated by the first cooling device 152 and the second cooling device 153 . In addition to heat convection (that is, heat convection), it will also be partially absorbed by the housing 11, and then spread to all directions outside the customer front-end device 10 through the housing 11 (that is, heat radiation). In this heat radiation process, the heat dissipation characteristics are almost in series relationship, that is, infrared electromagnetic waves are conducted from the radio frequency system 12 through layers of heat to the casing 11, and the casing 11 then dissipates the heat to the front of the customer through natural convection and/or thermal radiation. in the environment in which the device 10 is located. At this time, limited by the heat conduction capability of the casing 11, the efficiency of the aforementioned heat radiation is often low. To this end, an inventive concept of the present application may be: the structure of the casing 11 and the like can be designed so that infrared electromagnetic waves can directly pass through, so as to allow the radio frequency system 12 in the casing 11 or the first radiator 141 and the second radiator connected thereto. The infrared electromagnetic waves excited by 142 (hereinafter referred to as "heat source") are directly emitted into the environment where the customer front-end device 10 is located, opening up a heat radiation channel with lower thermal resistance, thereby improving the heat dissipation efficiency.

As an example, the housing 11 may be made of an infrared transmissive material, and the average transmittance of the infrared transmissive material to infrared electromagnetic waves in the mid-infrared band may be greater than or equal to 0.5. Preferably, the average transmittance of the infrared transmissive material to infrared electromagnetic waves in the mid-infrared band may be greater than or equal to 0.6. In this way, compared with the related art, the heat dissipation capability is extremely limited through the shell 11 radiating heat to the outside. In the present application, the infrared electromagnetic waves excited by the heat source can directly pass through the shell 11 and then be radiated to the customer front-end equipment 10. In the environment where it is located, to improve the heat dissipation effect of the customer front-end equipment 10 .

It should be noted that the infrared transmissive material described in this application refers to a material that can transmit infrared electromagnetic waves in a specific wavelength band. Wherein, the aforementioned specific waveband may refer to a mid-infrared waveband with a wavelength between 2.5 μm and 25 μm or a frequency between 400 cm ⁻¹ and 400 cm ⁻¹ . As an example, the material of the infrared transmission material may be any one of zinc sulfide (ZnS), zinc selenide (ZnSe), germanium (Ge), calcium fluoride (CaF ₂ ), and barium fluoride (BaF ₂ ). or a combination thereof. Further, the average transmittance α described in this application satisfies the following relationship:

In the formula, λ ₁ and λ ₂ respectively represent the lower limit and upper limit of the wavelength in a specific band, for example, in the mid-infrared band, _{λ 1} =2.5μm,λ ₂ =25μm; Transmittance of electromagnetic waves.

Referring to FIG. 5 , FIG. 5 is a schematic flowchart of an embodiment of a control method for a customer premises equipment provided by the present application. It should be noted that: for the convenience of description, the following exemplarily illustrates the control method of the customer premise equipment in a specific sequence of steps; however, the foregoing control method may also include additional or fewer steps, and some of the steps may also be Execute simultaneously or reverse the order of execution.

Based on the above-mentioned relevant descriptions and in conjunction with FIG. 3 and FIG. 4 , the control method described in this application is, for example, used in the customer front-end equipment 10 in which both the first cooling device 152 and the second cooling device 153 are fans. The first cooling device 152 and the second cooling device 153 are defined as a first fan and a second fan, respectively. At this time, the control method described in this application is mainly used to adjust the rotational speed of the first fan, whether the second fan is turned on or not, and the rotational speed thereof, so as to meet the cooling requirements and low noise requirements of the customer's pre-installed equipment 10 . Wherein, with reference to FIG. 5 , the control method described in this application may include the following steps:

Step S101: Detect the rotational speed of the first fan.

As an example, the first fan may be set to be always on when the customer premises equipment 10 is in operation, so as to respond to the cooling requirements of the customer premises equipment 10 . Among them, the first fan can have speed regulation functions such as gear speed regulation, linear speed regulation and PID speed regulation, so that the speed can be between the preset minimum working speed and the preset maximum working speed; In order to reduce the number of times the first fan is turned on/off (that is, on and off) to prolong the service life of the first fan, and the maximum operating speed is used to limit the noise level of the first fan, so that the customer pre-installed equipment 10 is in a limit state It still has a lower noise level when working under the hood. Obviously, it is necessary to detect the rotational speed of the first fan in order to evaluate whether the heat dissipation efficiency of the first fan meets the heat dissipation requirement of the customer's pre-installed device 10, and then to determine whether the second fan is turned on.

Step S102: Detect the temperature of the millimeter wave radio frequency module.

Based on the above detailed description, the heat dissipation efficiency of the area where the millimeter wave radio frequency module 122 is located in the radio frequency system 12 is often low, and the probability of the millimeter wave radio frequency module 122 failing due to high temperature is also high. Therefore, it is also necessary to detect the temperature of the millimeter-wave radio frequency module 122 in order to evaluate whether the heat dissipation efficiency of the first fan meets the heat dissipation requirement of the customer pre-installed device 10, and then to determine whether the second fan is turned on.

Step S103: Determine whether the rotational speed of the first fan is greater than the preset maximum operating rotational speed.

Step S104: Determine whether the temperature of the millimeter-wave radio frequency module is higher than a preset warning temperature.

When the determination result in step S103 is that the rotational speed of the first fan is greater than the preset maximum operating rotational speed and the determination result in step S104 is that the temperature of the millimeter-wave radio frequency module is higher than the preset warning temperature, that is, if the rotational speed of the first fan is greater than When the preset maximum operating speed and the temperature of the millimeter-wave radio frequency module 122 are higher than the preset warning temperature, step S105 is executed to turn on the second fan. In other words, even if the first fan is overloaded and the temperature of the millimeter-wave radio frequency module 122 is still high, the second fan is turned on to dissipate heat from the millimeter-wave radio frequency module 122 , thereby assisting the first fan to dissipate heat from the radio frequency system 12 . The first fan is allowed to work at a lower noise level and the service life of the first fan is extended while taking into account the heat dissipation requirements of the customer front-end equipment 10 .

When the determination result in step S103 is that the rotational speed of the first fan is less than the preset maximum operating rotational speed, that is, if the first fan is not overloaded, step S101 is executed to detect the rotational speed of the first fan. In addition, since the first fan can have a speed regulation function, in addition to continuing to detect the speed of the first fan, the temperature of the millimeter-wave radio frequency module 122 can also be used to increase or decrease the speed of the first fan, that is, The rotational speed of the first fan is dynamically adjusted, thereby taking into account the heat dissipation requirements and power consumption of the customer front-end device 10 .

When the determination result in step S104 is that the temperature of the millimeter-wave radio frequency module is lower than the preset warning temperature, step S102 is executed to detect the temperature of the millimeter-wave radio frequency module.

Step S105: Turn on the second fan.

As an example, the first fan can be set to be always on when the customer premises equipment 10 is working to respond to the cooling demand of the customer premises equipment 10; when the first fan is overloaded and the temperature of the millimeter wave radio frequency module 122 is still high At this time, the second fan can be turned on immediately to dissipate heat for the millimeter-wave radio frequency module 122 , that is, the second fan can assist the first fan to dissipate heat to the radio frequency system 12 , so as to allow the first fan to dissipate heat while taking into account the heat dissipation requirements of the customer front-end equipment 10 . One fan operates at a lower noise level and prolongs the service life of the first fan. Among them, the second fan may have speed regulation functions such as gear speed regulation, linear speed regulation, and PID speed regulation, so as to dynamically adjust the power consumption of the second fan according to the temperature of the millimeter-wave radio frequency module 122 , thereby taking into account the customer front-end equipment 10 . cooling requirements and power consumption.

Step S106: Determine whether the temperature of the millimeter wave radio frequency module is lower than the warning temperature.

In the judging structure in step S106, the temperature of the millimeter-wave radio frequency module is lower than the warning temperature, then step S107 is executed to turn off the second fan; when the judging structure in step S106 is that the temperature of the millimeter-wave radio frequency module is lower than the warning temperature, the step S107 is executed. S102, the temperature of the millimeter wave radio frequency module is detected.

Step S107: Turn off the second fan.

As an example, since the second fan is turned on and dissipates heat for the millimeter-wave radio frequency module 122, the heat dissipation capability of the first fan is enhanced in disguised form, and the temperature of the radio frequency system 12 (especially the millimeter-wave radio frequency module 122) also gradually decreases. Therefore, after a period of time, the temperature of the millimeter-wave radio frequency module 122 will be lower than the warning temperature, and the second fan will be turned off immediately, and the first fan will be kept on, so as to take into account the heat dissipation requirements and power consumption of the customer front-end device 10 .

Step S108: Determine whether the rotational speed of the first fan is less than the preset minimum operating rotational speed.

When the judging structure in step S108 is that the rotational speed of the first fan is less than the preset minimum operating rotational speed, steps S105 and S109 are executed to turn on the second fan and an alarm is issued; the judging structure in step S108 is that the rotational speed of the first fan is greater than When the preset minimum operating speed is reached, step S103 is executed to determine whether the speed of the first fan is greater than the preset maximum operating speed.

Step S109: issue an alarm.

As an example, the first fan can be normally turned on when the customer's front-end equipment 10 is working, so as to respond to the heat dissipation requirements of the customer's front-end equipment 10, the first fan also has the loss of lubricating oil, stress concentration and the entry/exit of dust. The risk of failure due to factors such as agglomeration. Therefore, it is necessary to judge whether the rotational speed of the first fan is lower than the preset minimum working rotational speed, so as to evaluate whether the working state of the first fan is normal. Specifically, when the rotational speed of the first fan is lower than the preset minimum operating speed (for example, the rotational speed of the first fan is zero), that is, if the first fan fails, the second fan is turned on and an alarm is issued to protect customers The work of the front-end device 10 is reminded of the user for maintenance or replacement.

It should be noted that: in an embodiment such as the first cooling device 152 is a fan and the second cooling device 153 is a semiconductor refrigerator, the customer front-end device 10 can also adopt a similar control method, the main difference is that it is necessary to detect and control the current into the semiconductor cooler.

The above descriptions are only part of the embodiments of the present application, and are not intended to limit the protection scope of the present application. Any equivalent device or equivalent process transformation made by using the contents of the description and drawings of the present application, or directly or indirectly applied to other related The technical field is similarly included in the scope of patent protection of this application.

Claims (10)

1. A client premises apparatus, comprising:

a housing;

the radio frequency system is arranged in the shell and comprises a millimeter wave radio frequency module; and

the first cooling device and the second cooling device are connected with the shell, the first cooling device is used for discharging heat generated by the radio frequency system, and the second cooling device is used for dissipating heat of the millimeter wave radio frequency module;

the first cooling device and the second cooling device are fans or semiconductor refrigerators respectively.

2. The customer premises apparatus of claim 1, wherein the first cooling device and the second cooling device are both fans; the working mode of the first cooling device is a blowing mode or an air draft mode, and the working mode of the second cooling device is a blowing mode.

3. The customer premises apparatus of claim 2, wherein said housing defines a first vent and a second vent, said first vent being proximate said first temperature reduction device and said second vent being proximate said second temperature reduction device.

4. The customer premises apparatus of claim 2, further comprising a first heat sink and a second heat sink, the first heat sink being connected to other modules of the radio frequency system than the millimeter wave radio frequency module, the second heat sink being connected to the millimeter wave radio frequency module; the second radiator is provided with a plurality of radiating fins arranged at intervals, the radiating fins deviate from the millimeter wave radio frequency module to extend, the second cooling device is located on one side, deviating from the millimeter wave radio frequency module, of the second radiator, and airflow generated by the second cooling device is not perpendicular to the plane where the radiating fins are located.

5. The customer premises apparatus of claim 4, wherein the first heat sink and the second heat sink have a thermal conductivity greater than or equal to 100W (m-K)^-1。

6. The customer premises apparatus of claim 1, wherein the first cooling device is a fan, and the second cooling device is a semiconductor refrigerator and is connected to the millimeter wave rf module; wherein the second heat sink is a portion of the housing.

7. The customer premises apparatus of claim 1, wherein the housing is made of an infrared transmissive material having an average transmission of infrared light in the mid-infrared band of greater than or equal to 0.5.

8. The client premises apparatus of claim 7, wherein the infrared transmission material is selected from any one of zinc sulfide, zinc selenide, germanium, calcium fluoride, barium fluoride, or a combination thereof.

9. A control method for a customer premises equipment, the control method comprising:

detecting the rotating speed of the first fan and the temperature of the millimeter wave radio frequency module;

if the rotating speed of the first fan is greater than the preset highest working rotating speed and the temperature of the millimeter wave radio frequency module is higher than the preset warning temperature, starting a second fan;

judging whether the temperature of the millimeter wave radio frequency module is lower than the warning temperature or not;

and if the temperature of the millimeter wave radio frequency module is lower than the warning temperature, the second fan is turned off.

10. The control method according to claim 9, characterized by further comprising:

judging whether the rotating speed of the first fan is less than a preset lowest working rotating speed or not;

and if the rotating speed of the first fan is less than the lowest working rotating speed, the second fan is started, and an alarm is given out.

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