CN111505906B - Gluing method - Google Patents
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- CN111505906B CN111505906B CN202010525375.5A CN202010525375A CN111505906B CN 111505906 B CN111505906 B CN 111505906B CN 202010525375 A CN202010525375 A CN 202010525375A CN 111505906 B CN111505906 B CN 111505906B
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- 238000000034 method Methods 0.000 title claims abstract description 110
- 238000004026 adhesive bonding Methods 0.000 title abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 126
- 238000005507 spraying Methods 0.000 claims abstract description 68
- 238000012546 transfer Methods 0.000 claims abstract description 12
- 230000008569 process Effects 0.000 claims description 87
- 229920002120 photoresistant polymer Polymers 0.000 claims description 24
- 239000003292 glue Substances 0.000 claims description 16
- 238000000576 coating method Methods 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 12
- 239000007921 spray Substances 0.000 claims description 11
- 238000003892 spreading Methods 0.000 claims description 8
- 230000007480 spreading Effects 0.000 claims description 8
- 238000009826 distribution Methods 0.000 abstract description 11
- 239000010408 film Substances 0.000 description 20
- 238000010586 diagram Methods 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 5
- 230000002349 favourable effect Effects 0.000 description 5
- 230000004075 alteration Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000007619 statistical method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention provides a gluing method which comprises eccentric spraying treatment, centering spraying treatment and film forming treatment. According to the gluing method, firstly, the center of the bottom of a spraying part is enabled to be right at a first position of the surface of a substrate to be treated through a position control part, the linear distance between the first position and the center of the substrate to be treated is larger than 0, and then eccentric spraying treatment is carried out; after the eccentric spraying treatment is finished, the bottom center of the spraying part is opposite to the center of the surface of the substrate to be treated, so that the centering spraying treatment is performed, annular and center point-shaped distribution of pattern transfer mediums on the surface of the substrate to be treated is facilitated, and good uniformity and chromatic aberration-free photoresistance are further formed on the surface of the substrate to be treated through the film forming treatment.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to a gluing method.
Background
Wafer coating photoresist equipment is one of the core equipment of photolithography processes in the field of semiconductor manufacturing, wherein a photoresist coating unit is the most important functional unit. After the wafer passes through the gluing unit, photoresist with target thickness is coated on the surface of the wafer, and the uniformity of the photoresist coating directly influences the stability of line width in subsequent exposure. With the continuous shrinking of the line width of semiconductor devices, the requirements for uniformity of photoresist coating become more and more stringent, so it is important to improve the process effect of the photoresist coating unit.
Patent application publication No. CN110879509A discloses a photoresist coating method in which a showerhead having a plurality of spray holes is disposed above a wafer, and then the wafer surface photoresist is provided with good uniformity by controlling the rotation rate and rotation time of the wafer. However, the method is only suitable for coating photoresist with low dynamic viscosity, and the photoresist with high dynamic viscosity is easy to block the spraying holes, so that the uniformity of coating cannot be ensured, and even the normal operation of coating can be prevented.
Therefore, there is a need to develop a novel glue application method to solve the above-mentioned problems existing in the prior art.
Disclosure of Invention
The invention aims to provide a gluing method for evenly and non-aberration coating a pattern transfer medium with dynamic viscosity not lower than 4000 centipoises on the surface of a substrate to be treated through a gluing device.
In order to achieve the above object, the present invention provides a glue spreading device including a slide part, a spray part, a position control part, and a rotation driving part, the glue spreading method including:
s1: after the substrate to be treated is loaded on the slide part, the center of the bottom of the spraying part is opposite to a first position of the surface of the substrate to be treated through the position control part, and the linear distance between the first position and the center of the substrate to be treated is greater than 0;
s2: the spraying part sprays the substrate to be treated and simultaneously drives the substrate to be treated to rotate through the rotary driving part so as to perform eccentric spraying treatment;
s3: after the eccentric spraying treatment is finished, the center of the bottom of the spraying part is opposite to the center of the surface of the substrate to be treated through the position control part;
s4: the spraying part sprays the substrate to be treated and simultaneously drives the substrate to be treated to rotate through the rotary driving part so as to perform centering spraying treatment;
s5: after the centering spraying treatment is finished, the substrate to be treated is driven to rotate by the rotary driving part so as to perform film forming treatment.
The gluing method has the beneficial effects that: in the step S1, the bottom center of the spraying part is first opposite to the first position of the surface of the substrate to be processed through the position control part, the linear distance between the first position and the center of the substrate to be processed is greater than 0, so that the eccentric spraying treatment is performed through the step S2, after the eccentric spraying treatment is completed, the bottom center of the spraying part is opposite to the center of the surface of the substrate to be processed through the step S3, so that the centering spraying treatment is further performed through the step S4, and the pattern transfer medium is favorable for forming annular and center point distribution on the surface of the substrate to be processed, so that the photoresist with good uniformity and no color difference is further formed on the surface of the substrate to be processed through the film forming treatment.
Preferably, the surface of the substrate to be treated is circular and has a diameter of 200-400 mm. The beneficial effects are that: is favorable for forming uniform and colorless-difference photoresist.
Further preferably, in the step S1, a linear distance between the first position and a center of a surface of the substrate to be processed is set to 40-60% of a radius of the substrate to be processed by the position control unit. The beneficial effects are that: the pattern transfer medium is favorable for forming reasonable annular and center point distribution on the surface of the substrate to be treated.
Further preferably, the step S1 further includes making a vertical distance between the bottom of the spraying part and the surface of the substrate to be treated be 5-15 mm by the position control part.
Further preferably, in the step S2, the substrate to be processed is driven to continuously rotate at a speed of 30-100 rpm for 10-30 seconds by the rotation driving part, and the flow rate of the pattern transferring medium is controlled to be 0.2-4 ml/S by the spraying part, so as to complete the eccentric spraying treatment. The beneficial effects are that: the pattern transfer medium is favorable for forming annular distribution on the surface of the substrate to be processed.
Further preferably, in the step S4, the substrate to be processed is driven to continuously rotate at a speed of 30-100 rpm for 10-30 seconds by the rotation driving part, and the flow rate of the pattern transferring medium is controlled to be 0.2-4 ml/S by the spraying part, so as to complete the centering spraying treatment. The beneficial effects are that: the pattern transfer medium is favorable for further forming center point-shaped distribution on the surface of the substrate to be processed.
Further preferably, in the step S5, the number of film forming processes is at least 2 to control the thickness and uniformity of the formed photoresist.
Further preferably, the film forming process includes a first film forming process, and in the step S5, after the centering spraying process is completed, the substrate to be processed is subjected to a first driving process by the rotation driving part, so as to drive the substrate to be processed to rotate at a speed of 200-1000 rpm until the pattern transferring medium is spread on the surface of the substrate to be processed, so as to complete the first film forming process.
Further preferably, the film forming process further includes a second film forming process, and in step S5, after the first film forming process is completed, the substrate to be processed is subjected to a second driving process by the rotation driving part, so as to drive the substrate to be processed to rotate at a speed of 1000-3500 rpm, until the pattern transferring medium is uniformly coated on the surface of the substrate to be processed, so as to complete the second film forming process.
Further preferably, the substrate to be processed is rotated at the same speed during any one of the first driving process and the second driving process performed on the substrate to be processed by the rotation driving section.
Further preferably, any one of the first driving process and the second driving process is composed of a plurality of sub-driving processes sequentially performed, and the rotation driving part drives the substrate to be processed to rotate at different rates through different sub-driving processes.
Further preferably, the rotation rate of the substrate to be processed increases as the number of sub-driving processes increases.
Drawings
FIG. 1 is a flow chart of a glue application method according to an embodiment of the invention;
fig. 2 is a schematic structural diagram of a glue spreading device according to an embodiment of the present invention;
FIG. 3 is a schematic view illustrating an operation state of a substrate to be processed according to an embodiment of the present invention;
FIG. 4 is a schematic diagram showing a distribution state of a pattern transferring medium on a surface of a substrate to be processed according to an embodiment of the present invention;
FIG. 5 is a schematic diagram showing another distribution state of a pattern transferring medium on a surface of a substrate to be processed according to an embodiment of the present invention;
fig. 6 is a photograph of a rubberized substrate according to an embodiment of the invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention. Unless otherwise defined, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. As used herein, the word "comprising" and the like means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof without precluding other elements or items.
Aiming at the problems existing in the prior art, the embodiment of the invention provides a gluing method, which is used for evenly coating a pattern transfer medium with no chromatic aberration and a dynamic viscosity of not less than 4000 centipoises on the surface of a substrate to be treated through a gluing device.
Fig. 1 is a flowchart of a glue application method according to an embodiment of the present invention. Referring to fig. 1, the glue application method includes:
s1: after the substrate to be treated is loaded on the slide part, the center of the bottom of the spraying part is opposite to the first position of the surface of the substrate to be treated through the position control part;
s2: the spraying part sprays the substrate to be treated and simultaneously drives the substrate to be treated to rotate through the rotary driving part so as to perform eccentric spraying treatment;
s3: after the eccentric spraying treatment is finished, the center of the bottom of the spraying part is opposite to the center of the surface of the substrate to be treated through the position control part;
s4: the spraying part sprays the substrate to be treated and simultaneously drives the substrate to be treated to rotate through the rotary driving part so as to perform centering spraying treatment;
s5: after the centering spraying treatment is finished, the substrate to be treated is driven to rotate by the rotary driving part so as to perform film forming treatment.
The "centering spraying treatment" in the embodiment of the invention refers to spraying treatment performed by the rotation driving part driving the substrate to be treated to rotate after the bottom center of the spraying part is opposite to the center of the substrate to be treated.
The eccentric spraying treatment in the embodiment of the invention refers to the spraying treatment performed by the rotation driving part driving the substrate to be treated to rotate after the bottom center of the spraying part is opposite to the first position on the surface of the substrate to be treated.
Fig. 2 is a schematic structural diagram of a glue spreading device according to an embodiment of the present invention. Fig. 3 is a schematic diagram illustrating an operating state of a substrate to be processed according to an embodiment of the present invention.
Referring to fig. 2 and 3, the glue applicator 2 includes a slide part 21, a spray part 22, a position control part 23, and a rotation driving part 24. The substrate 31 to be processed is loaded on the carrier part 21 to coat the pattern transferring medium. The meaning of the graphic transfer medium is: the desired pattern is transferred from the reticle to the medium on the substrate to be processed.
In some embodiments of the present invention, the diameter of the substrate 31 to be processed is 200-400 mm, and the dynamic viscosity of the pattern transferring medium is not less than 4000 centipoise.
In embodiments 1-3, the substrate 31 to be processed is a wafer, the pattern transfer medium is a photoresist, the dynamic viscosity of each photoresist is 4000 centipoise, 5000 centipoise and 6000 centipoise, and the diameter of each wafer is 200 mm, 300 mm and 400 mm, respectively.
In the step S1 of some embodiments of the present invention, the substrate 31 to be processed is loaded on the carrier 21 by vacuum adsorption.
Specifically, referring to fig. 2 and 3, the carrier part 21 is connected to a vacuum pump 25, and includes a vacuum chuck (not shown) disposed on the top, and the vacuum chuck (not shown) is in communication with the vacuum pump 25 to suck air through the vacuum pump 25, so that the substrate 31 to be processed is adsorbed on the vacuum chuck (not shown) on the top of the carrier part 21. The specific structure of the slide 21 is well known to those skilled in the art, and will not be described herein.
In the step S1 of some embodiments of the present invention, the bottom center of the spraying portion 22 is first opposite to the first position of the surface of the substrate 31 to be processed by the position control portion 23, and the linear distance between the first position and the center of the substrate 31 to be processed is greater than 0.
Referring to fig. 2 and 3, the spraying part 22 includes a nozzle 221 at the bottom, and the position control part 23 is connected to the spraying part 22 to drive the spraying part 22 to move, thereby controlling the position of the nozzle 221.
In some embodiments of the present invention, the position control portion 23 includes a boom and a driving cylinder that are connected to each other, and the specific structure and the assembly manner are shown in CN109807003a, which is not described herein.
In some embodiments of the present invention, the step S1 further includes: the vertical distance from the bottom of the spraying part 22 to the surface of the substrate 31 to be treated is controlled to be 5-15 mm by the position control part 23.
In embodiments 1 to 3 of the present invention, the vertical distance between the bottom of the spraying portion 22 and the wafer is controlled to be 10 mm by the position control portion 23.
FIG. 4 is a schematic diagram showing a distribution of a pattern transferring medium on a surface of a substrate to be processed according to some embodiments of the present invention.
In the embodiment of the present invention, the linear distance between the first position and the center of the substrate 31 to be processed is greater than 0, so as to facilitate the annular distribution of the pattern transferring medium on the surface of the substrate 31 to be processed.
Specifically, referring to fig. 2 and 4, the surface of the substrate 31 to be treated is circular, the bottom center of the nozzle 221 is opposite to the first position of the surface of the substrate 31 to be treated, so as to form a projection point 41, and in step S1, the linear distance L between the projection point 41 and the center 311 of the surface of the substrate 31 to be treated is made to be 40-60% of the radius of the substrate 31 to be treated by the position control portion 23, so that the pattern transfer medium is advantageously distributed annularly along the annular surface 42 on the surface of the substrate 31 to be treated in the process of the eccentric spraying treatment performed in the subsequent step S2.
In embodiments 1-3 of the present invention, the linear distance between the first location and the center of the wafer is 40%, 50% and 60% of the wafer diameter, respectively.
In step S2 of some embodiments of the present invention, the rotation driving portion 24 drives the substrate 31 to be processed to continuously rotate at a speed of 30-100 rpm for 10-30 seconds, and the spraying portion 22 controls the flow of the pattern transferring medium to be 0.2-4 ml/S, so as to complete the eccentric spraying treatment, thereby facilitating the pattern transferring medium to form annular distribution on the surface of the substrate 31 to be processed.
Specifically, referring to fig. 2 and 3, the rotation driving portion 24 is connected to a vacuum chuck (not shown) at the top of the slide portion 21, so as to drive the substrate 31 to be processed to rotate around its central axis. The specific structure and assembly of the rotary driving portion 24 are well known to those skilled in the art, and will not be described herein.
Further, the spraying part 22 further includes a liquid guide line 222 to supply the pattern transferring medium from an external container to the nozzle 221.
In step S2 of embodiments 1 to 3 of the present invention, the continuous rotation rates are 30 rpm, 50 rpm and 100 rpm, and the continuous rotation times are 20 seconds, 10 seconds and 30 seconds, respectively. The nozzles 221 provide a flow rate of the photoresist of 0.5 ml/s.
FIG. 5 is a schematic diagram showing another distribution of a pattern transferring medium on a surface of a substrate to be processed according to some embodiments of the present invention.
In the step S3 of some embodiments of the present invention, referring to fig. 2 and 5, the bottom center of the nozzle 221 is opposite to the surface center 311 of the substrate 31 to be processed, and then the centering spray process of the step S4 is performed, so that the pattern transferring medium is distributed in a center point shape along the circular surface 51 on the surface of the substrate 31 to be processed.
In the step S4 of some embodiments of the present invention, the substrate 31 to be processed is driven to rotate continuously at a speed of 30-100 rpm for 10-30 seconds by the rotation driving part 24, and the flow rate of the pattern transferring medium is controlled to be 0.2-4 ml/S by the spraying part 22, so as to complete the centering spraying process.
In step S4 of embodiments 1 to 3 of the present invention, the continuous rotation rates are 30 rpm, 50 rpm and 100 rpm, and the continuous rotation times are 20 seconds, 10 seconds and 30 seconds, respectively. The nozzles 221 provide a flow rate of the photoresist of 0.5 ml/s.
In the step S5 of some embodiments of the present invention, the number of film forming processes is at least 2 to control the thickness and uniformity of the formed photoresist.
In some embodiments of the invention, the film forming process includes a first film forming process and a second film forming process.
In some embodiments of the present invention, after the centering spraying process is completed, the rotation driving portion 24 performs a first driving process on the to-be-processed substrate 31 to drive the to-be-processed substrate 31 to rotate at a speed of 200-1000 rpm until the pattern transferring medium is spread on the surface of the to-be-processed substrate 31, so as to complete the first film forming process.
In the first film formation process according to some embodiments of the present invention, the substrate 31 to be processed is rotated at the same speed by the rotation driving section 24 during the first driving process of the substrate 31 to be processed.
In some of the first film forming processes of the present invention, the first driving process includes a plurality of sub-driving processes, and the substrate 31 to be processed is driven by the rotation driving portion 24 to perform the plurality of sub-driving processes.
In some embodiments of the present invention, the first driving process is composed of a plurality of sub-driving processes sequentially performed, and the rotation driving part 24 rotates the substrate 31 to be processed at different speeds through different sub-driving processes.
During the first driving process of some embodiments of the present invention, the rotation rate of the substrate 31 to be processed increases as the number of sub-driving processes increases. Specifically, the plurality of sub-driving processes are sequentially and continuously performed. By "sequentially and continuously performed" is meant that the rotation of the substrate 31 to be processed is not stopped during the switching of the different sub-driving processes.
Specifically, the first driving process in embodiments 1 to 3 of the present invention is composed of a first sub-driving process and a second sub-driving process, which are sequentially and continuously performed.
In embodiment 1 of the present invention, the wafer is continuously rotated at a speed of 200 rpm for 5 seconds by the rotation driving unit 24 to complete the first sub-driving process, and then the rotation speed is increased to 550 rpm and continuously rotated for 5 seconds to complete the second sub-driving process.
In embodiment 2 of the present invention, the wafer is continuously rotated at a speed of 300 rpm for 5 seconds by the rotation driving unit 24 to complete the first sub-driving process, and then the rotation speed is increased to 700 rpm and continuously rotated for 5 seconds to complete the second sub-driving process.
In embodiment 3 of the present invention, the rotation driving portion 24 drives the wafer to rotate continuously at a speed of 400 rpm for 5 seconds to complete the first sub-driving process, and the rotation speed is increased to 800 rpm and rotated continuously for 5 seconds to complete the second sub-driving process.
In some embodiments of the present invention, after the first film forming process is completed, the rotation driving portion 24 performs a second driving process on the to-be-processed substrate 31, so as to drive the to-be-processed substrate 31 to rotate at a speed of 1000-3500 rpm until the pattern transferring medium is uniformly coated on the surface of the to-be-processed substrate 31, so as to complete the second film forming process.
In some embodiments of the present invention, the second driving process is composed of a plurality of sub-driving processes sequentially performed, and the rotation driving part 24 rotates the substrate 31 to be processed at different speeds through different sub-driving processes.
During the second driving process of some embodiments of the present invention, the rotation rate of the substrate 31 to be processed increases as the number of sub-driving processes increases. Specifically, the plurality of sub-driving processes are sequentially and continuously performed. By "sequentially and continuously performed" is meant that the rotation of the substrate 31 to be processed is not stopped during the switching of the different sub-driving processes.
Specifically, the second driving process in embodiments 1 to 3 of the present invention is composed of a first sub-driving process and a second sub-driving process, which are sequentially and continuously performed.
In embodiment 1, the wafer is continuously rotated at a speed of 1000 rpm for 5 seconds by the rotation driving unit 24 to complete the first sub-driving process, and then the rotation speed is increased to 1570 rpm and continuously rotated for 50 seconds to complete the second sub-driving process.
In embodiment 2 of the present invention, the wafer is continuously rotated at a speed of 1500 rpm for 5 seconds by the rotation driving unit 24 to complete the first sub-driving process, and then the rotation speed is increased to 2050 rpm and continuously rotated for 50 seconds to complete the second sub-driving process.
In embodiment 3, the wafer is continuously rotated at 1800 rpm for 5 seconds by the rotation driving unit 24 to complete the first sub-driving process, and then the rotation rate is raised to 3150 rpm and continuously rotated for 50 seconds to complete the second sub-driving process.
In the embodiment of the invention, an optical microscope is used for observing the rubberized substrate obtained by the rubberizing method. The specific observation method is a conventional technical means used by those skilled in the art, and is not described herein.
Fig. 6 is a photograph of a rubberized substrate of embodiment 1 of the invention.
Taking the glue coated substrate obtained in example 1 as an example, referring to fig. 6, the photoresist on the surface of the glue coated substrate 61 has uniform color, no chromatic aberration, and no abnormal phenomena such as moire.
In the embodiment of the invention, the annular 49-point measurement is carried out on the photoresist on the surface of the rubberized substrate by adopting an optical film thickness meter with the model number F50 manufactured by Filmetrics corporation in the United states, so as to count the average thickness and uniformity of the photoresist. Specific measurement and statistical methods are conventional techniques used by those skilled in the art and are not described in detail herein.
In the embodiment of the invention, the average thickness of the photoresist on the surface of the rubberized substrate is 10 micrometers-30 micrometers, the uniformity is less than 3 percent, and the mass production requirements can be met.
Specifically, in examples 1-3 of the present invention, the average thicknesses of the photoresists were 14.9 microns, 20.8 microns and 26.3 microns, respectively, with uniformity of less than 3%.
While embodiments of the present invention have been described in detail hereinabove, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. It is to be understood that such modifications and variations are within the scope and spirit of the present invention as set forth in the following claims. Moreover, the invention described herein is capable of other embodiments and of being practiced or of being carried out in various ways.
Claims (6)
1. A method of coating a pattern transfer medium on a surface of a substrate to be processed by a coating apparatus comprising a slide part, a spray part, a position control part, and a rotation driving part, wherein the dynamic viscosity of the pattern transfer medium is not less than 4000 centipoise, the method comprising:
s1: after the substrate to be treated is loaded on the slide part, the center of the bottom of the spraying part is opposite to a first position of the surface of the substrate to be treated through the position control part, and the linear distance between the first position and the center of the substrate to be treated is greater than 0;
s2: the spraying part sprays the substrate to be treated and simultaneously drives the substrate to be treated to rotate through the rotary driving part so as to perform eccentric spraying treatment;
s3: after the eccentric spraying treatment is finished, the center of the bottom of the spraying part is opposite to the center of the surface of the substrate to be treated through the position control part;
s4: the spraying part sprays the substrate to be treated and simultaneously drives the substrate to be treated to rotate through the rotary driving part so as to perform centering spraying treatment;
s5: after the centering spraying treatment is finished, the substrate to be treated is driven to rotate by the rotary driving part so as to carry out film forming treatment, wherein the number of times of the film forming treatment is at least 2 so as to control the thickness and uniformity of the formed photoresist;
the film forming process includes a first film forming process, in the step S5, after the centering spraying process is completed, a first driving process is performed on the to-be-processed substrate through the rotation driving part, so as to drive the to-be-processed substrate to rotate at a speed of 200-1000 rpm until the pattern transferring medium is spread on the surface of the to-be-processed substrate, so as to complete the first film forming process;
the film forming process further includes a second film forming process, in the step S5, after the first film forming process is completed, performing a second driving process on the to-be-processed substrate by using the rotation driving part, so as to drive the to-be-processed substrate to rotate at a speed of 1000-3500 rpm until the pattern transferring medium is uniformly coated on the surface of the to-be-processed substrate, so as to complete the second film forming process;
any one of the first driving process and the second driving process is composed of a plurality of sub-driving processes which are sequentially performed, the rotation driving part drives the substrate to be processed to rotate at different speeds through different sub-driving processes, and the rotation speed of the substrate to be processed is increased along with the increase of the sub-driving process times.
2. The glue spreading method according to claim 1, wherein the surface of the substrate to be treated is circular and has a diameter of 200-400 mm.
3. The glue spreading method according to claim 2, wherein in the step S1, the linear distance between the first position and the center of the surface of the substrate to be processed is 40-60% of the radius of the substrate to be processed by the position control unit.
4. A glue application method according to claim 3, wherein said step S1 further comprises making the vertical distance of the bottom of said spraying portion from the surface of said substrate to be treated 5-15 mm by said position control portion.
5. A glue spreading method according to claim 3, wherein in the step S2, the substrate to be treated is continuously rotated at a speed of 30-100 rpm for 10-30 seconds by the rotation driving part, and the flow rate of the pattern transferring medium is controlled to be 0.2-4 ml/S by the spraying part, so as to complete the eccentric spraying treatment.
6. The glue spreading method according to claim 5, wherein in the step S4, the substrate to be processed is continuously rotated at a speed of 30-100 rpm for 10-30 seconds by the rotation driving part, and the flow rate of the pattern transferring medium is controlled to be 0.2-4 ml/S by the spraying part, so as to complete the centering spraying process.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010525375.5A CN111505906B (en) | 2020-06-10 | 2020-06-10 | Gluing method |
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|---|---|---|---|
| CN202010525375.5A CN111505906B (en) | 2020-06-10 | 2020-06-10 | Gluing method |
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| CN111505906A CN111505906A (en) | 2020-08-07 |
| CN111505906B true CN111505906B (en) | 2023-09-05 |
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| CN117492328B (en) * | 2023-12-29 | 2024-03-29 | 粤芯半导体技术股份有限公司 | Photoresist coating method, device, equipment and medium based on multiple spraying |
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| CN102360164A (en) * | 2011-09-28 | 2012-02-22 | 上海宏力半导体制造有限公司 | Method for spraying photoresist |
| CN103094093A (en) * | 2011-11-08 | 2013-05-08 | 北大方正集团有限公司 | Method and device for photoresist coating |
| CN104826781A (en) * | 2014-02-11 | 2015-08-12 | 无锡华润上华半导体有限公司 | Wafer gluing method |
| CN107885035A (en) * | 2016-09-30 | 2018-04-06 | 苏州能讯高能半导体有限公司 | A kind of coating technique of photoresist |
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| JP2002361156A (en) * | 2001-06-06 | 2002-12-17 | Tokyo Electron Ltd | Coating film forming device and its method |
| TW200710561A (en) * | 2005-07-28 | 2007-03-16 | Hoya Corp | Mask blank fabrication method and exposure mask fabrication method |
| CN102043340A (en) * | 2010-10-29 | 2011-05-04 | 沈阳芯源微电子设备有限公司 | Method for uniformly spraying photoresist |
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