CN111447792B - Heat-dissipating device, preparation method of heat-dissipating device, and electronic equipment - Google Patents

Abstract

The application provides a heat abstractor, including first apron, second apron, capillary structure and working fluid, first apron with the second apron lid closes and forms inclosed accommodation space, capillary structure sets up first apron is close to the surface of accommodation space, the working fluid is filled in the accommodation space, wherein, first apron includes first region and second region, capillary structure is including setting up at least one first capillary structure in first region is in with setting up at least one second capillary structure in the second region, the thickness of first capillary structure is greater than the thickness of second capillary structure. Through setting up the first capillary structure and the second capillary structure that thickness is different to increase the heat radiating area in the heat dissipation process, improve the radiating efficiency, and then be favorable to reducing heat abstractor's thickness, realize heat abstractor's frivolousization. The application also provides a preparation method of the heat dissipation device and electronic equipment.

Description

Heat-dissipating device, preparation method of heat-dissipating device, and electronic equipment

technical field

The application belongs to the technical field of heat conduction, and in particular relates to a heat dissipation device, a preparation method of the heat dissipation device, and electronic equipment.

Background technique

When the electronic device operates, heat is generated, which directly causes the temperature of the electronic device to rise sharply. Therefore, the heat needs to be quickly dissipated by means of a heat sink. However, the traditional heat dissipation device is thick and occupies a certain space, thereby restricting the development of electronic devices towards thinness and lightness.

SUMMARY OF THE INVENTION

In view of this, the present application provides a heat dissipation device and a preparation method of the heat dissipation device, which is beneficial to realize the lightening and thinning of the heat dissipation device; meanwhile, it also provides an electronic device including the heat dissipation device, which improves the heat dissipation performance of the electronic device and is beneficial to the electronic device. thinning.

In a first aspect, the present application provides a heat dissipation device, comprising a first cover plate, a second cover plate, a capillary structure and a working fluid, the first cover plate and the second cover plate cover together to form a sealed container space, the capillary structure is disposed on the surface of the first cover plate close to the accommodating space, and the working fluid is filled in the accommodating space, wherein the first cover plate includes a first area and a second two regions, the capillary structure includes at least one first capillary structure disposed in the first region and at least one second capillary structure disposed in the second region, and the thickness of the first capillary structure is greater than that of the second capillary structure. B. The thickness of the capillary structure.

In a second aspect, the present application provides a method for preparing a heat sink, comprising:

providing a first cover plate and a second cover plate, the first cover plate including a first area and a second area;

At least one first capillary structure is formed in the first area, and at least one second capillary structure is formed in the second area, and the thickness of the first capillary structure is greater than the thickness of the second capillary structure;

Covering the first cover plate and the second cover plate to form a closed accommodating space, and the first capillary structure and the second capillary structure are arranged in the accommodating space;

A working fluid is injected into the accommodating space, and a heat dissipation device is formed after sealing.

In a third aspect, the present application provides an electronic device, including a heating element and a heat dissipation device, the heat dissipation device includes a first cover plate, a second cover plate, a capillary structure and a working fluid, the first cover plate and the The second cover plate is closed to form a closed accommodating space, the capillary structure is disposed on the surface of the first cover plate close to the accommodating space, and the working fluid is filled in the accommodating space, wherein the The first cover plate includes a first area and a second area, and the capillary structure includes at least one first capillary structure disposed in the first area and at least one second capillary structure disposed in the second area, so The thickness of the first capillary structure is greater than the thickness of the second capillary structure, and the heating element is disposed in contact with the first region of the first cover plate.

The present application provides a heat dissipation device and a preparation method of the heat dissipation device. By arranging a first capillary structure and a second capillary structure with different thicknesses, the heat dissipation area is increased during the heat dissipation process, and an excellent heat dissipation effect is achieved, thereby facilitating the reduction of The weight and overall thickness of the heat dissipation device realize the lightness and thinness of the heat dissipation device; the preparation method of the heat dissipation device is simple, which is favorable for realizing industrialized production. The present application also provides an electronic device including the above-mentioned heat dissipation device, which can not only improve the heat dissipation performance of the electronic device, but also be beneficial to realize the lightness and thinness of the electronic device.

Description of drawings

In order to describe the technical solutions in the embodiments of the present application more clearly, the accompanying drawings required to be used in the embodiments of the present application will be described below.

FIG. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application.

FIG. 2 is a schematic structural diagram of a heat dissipation device according to another embodiment of the present application.

FIG. 3 is a top view of a first cover plate according to an embodiment of the application.

FIG. 4 is a top view of a first cover plate according to another embodiment of the present application.

FIG. 5 is a schematic flowchart of a method for manufacturing a heat sink according to an embodiment of the present application.

FIG. 6 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

FIG. 7 is a schematic cross-sectional view of an electronic device according to another embodiment of the present application.

Description of drawings:

First cover plate-10, first area-11, second area-12, second cover plate-20, capillary structure-30, first capillary structure-31, second capillary structure-32, accommodating space-40 , Support structure-50, cooling device-100, heating element-200, panel-300, shell-400, middle plate-500.

Detailed ways

The following are the preferred embodiments of the present application. It should be pointed out that for those skilled in the art, without departing from the principles of the present application, several improvements and modifications can be made, and these improvements and modifications are also regarded as the present invention. The scope of protection applied for.

The following disclosure provides many different embodiments or examples for implementing different structures of the present application. To simplify the disclosure of the present application, the components and arrangements of specific examples are described below. Of course, they are only examples and are not intended to limit the application. Furthermore, this application may repeat reference numerals and/or reference letters in different instances for the purpose of simplicity and clarity, and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, this application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

Please refer to FIG. 1 . FIG. 1 is a schematic structural diagram of a heat dissipation device 100 according to an embodiment of the application, including a first cover plate 10 , a second cover plate 20 , a capillary structure 30 and a working fluid, a first cover plate 10 and a second cover The plate 20 is covered to form a closed accommodating space 40, the capillary structure 30 is arranged on the surface of the first cover plate 10 close to the accommodating space 40, and the working fluid is filled in the accommodating space 40, which is not shown in FIG. 1; wherein, The first cover plate 10 includes a first area 11 and a second area 12, the capillary structure 30 includes at least one first capillary structure 31 disposed in the first area 11 and at least one second capillary structure 32 disposed in the second area 12, The thickness of the first capillary structure 31 is greater than the thickness of the second capillary structure 32 .

In the present application, when the first cover plate 10 of the heat dissipation device 100 is in contact with the heat source, it absorbs heat and transfers it to the working fluid in the accommodating space 40 . The space 40 , which can also be referred to as a heat dissipation channel, transfers heat from the first cover plate 10 to the second cover plate 20 , and then transfers the heat to the outside through the second cover plate 20 . During the heat transfer process, the vapor condenses into a liquid, and the capillary force generated by the capillary structure 30 drains it to the first cover plate 10, and the above-mentioned heat dissipation process is cyclically performed, thereby completing heat dissipation. The present application adopts the first capillary structure 31 and the second capillary structure 32 with different thicknesses. During the heat dissipation process, the working fluid at the first capillary structure 31 and the second capillary structure 32 absorbs heat and vaporizes, because the first capillary structure 31 Thicker than the second capillary structure 32, therefore, the vapor formed by the vaporization of the working fluid at the first capillary structure 31 has a wider and higher diffusion range in the thickness direction than the vapor formed by the vaporization of the working fluid at the second capillary structure 32. , the heat dissipation area is larger, so that the heat dissipation effect of the first region 11 will be better and more obvious. In practical applications, the first region 11 of the first cover plate 10 corresponds to the heat source, which may be, but not limited to, heating elements, etc., to increase the area of vapor diffusion during the heat dissipation process, improve the heat dissipation effect, and help reduce the thickness of the heat dissipation device 100. The required heat dissipation effect can realize the lightness and thinness of the heat dissipation device 100, and at the same time reduce the use of the material of the second capillary structure 32 in the second area 12, which is economical and conducive to large-scale industrial application, and further reduces the heat dissipation device. 100 weight.

In the present application, the capillary structure 30 includes at least one first capillary structure 31 in the first region 11 and at least one second capillary structure 32 in the second region 12 . In an embodiment of the present application, please refer to FIG. 1 , the first capillary structure 31 and the second capillary structure 32 are disposed on the surface of the first cover plate 10 at intervals. It can be understood that there is a distance between the first capillary structure 31 and the second capillary structure 32 at this time. In another embodiment of the present application, the first capillary structure 31 and the second capillary structure 32 are continuously disposed on the surface of the first cover plate 10 , and there is no space between the first capillary structure 31 and the second capillary structure 32 at this time. When the first capillary structure 31 and the second capillary structure 32 are continuously arranged, during the heat dissipation process, after the working fluid in the first capillary structure 31 and the second capillary structure 32 is heated and vaporized, the first capillary structure 31 and the second capillary structure 32 diffuses out near the surface of the second cover plate 20 , that is, the gas-liquid separation is realized in the thickness direction of the capillary structure 30 , which can be called the realization of gas-liquid separation in the vertical direction. When the first capillary structure 31 and the second capillary structure 32 are spaced apart, during the heat dissipation process, after the working fluid in the first capillary structure 31 and the second capillary structure 32 is heated and vaporized, the working fluid from the first capillary structure 31 and the second capillary structure 32 is heated and vaporized. 32 diffuses out in the lateral dimension direction, which can be called gas-liquid separation in the horizontal direction. Compared with the gas-liquid separation in the vertical direction, the heat dissipation channel after the gas-liquid separation in the horizontal direction has more volume occupied by the first capillary structure 31 and the second capillary structure 32, so that the heat dissipation channel is wider and the heat dissipation area is larger. This is more conducive to improving the heat dissipation efficiency. In an embodiment of the present application, the distance between the first capillary structure 31 and the second capillary structure 32 is greater than 100 μm, which increases the heat dissipation area and increases the heat dissipation effect, thereby appropriately reducing the thickness of the heat dissipation device 100 . At the same time, the lightening and thinning of the heat dissipation device 100 is achieved. Further, the distance between the first capillary structure 31 and the second capillary structure 32 is greater than 150 μm, which further improves the heat dissipation effect.

In the embodiment of the present application, the first region 11 of the first cover plate 10 includes one or more first capillary structures 31 . Referring to FIG. 1 , the first region 11 has a plurality of first capillary structures 31 . In one embodiment, a plurality of first capillary structures 31 may be continuously and not spaced apart on the first region 11 . In another embodiment, the plurality of first capillary structures 31 are arranged at intervals in the first region 11, thereby realizing gas-liquid separation in the horizontal direction. Compared with the continuous arrangement of the plurality of first capillary structures 31, the heat dissipation channels are more efficient. wide, the heat dissipation area is larger, the heat dissipation efficiency of the heat dissipation device 100 is improved, and when the plurality of first capillary structures 31 are continuously arranged, a larger capillary force can be generated, so that the accommodating space 40 cannot be filled during the heat transfer process of the steam. The flow will be re-drained into the first capillary structure 31, and the accommodating space 40 cannot be fully utilized. However, when a plurality of first capillary structures 31 are arranged at intervals, the accommodating space 40 can be more fully utilized and the heat dissipation area can be improved. In one embodiment, the distance between adjacent first capillary structures 31 is greater than 100 μm, which increases the heat dissipation area and the heat dissipation effect, which is beneficial to reduce the thickness of the heat dissipation device 100 and realize the lightness and thinness of the heat dissipation device 100 . Further, the spacing between adjacent first capillary structures 31 is greater than 150 μm, 180 μm, 200 μm or 210 μm, which further improves the heat dissipation area and the heat dissipation effect. In another embodiment, the plurality of first capillary structures 31 are arranged in an array on the first cover plate 10 , so that the heat dissipation process is more uniform and the heat dissipation uniformity is improved.

In the embodiment of the present application, the second region 12 of the first cover plate 10 includes one or more second capillary structures 32 . Referring to FIG. 1 , the second region 12 has a plurality of second capillary structures 32 . In one embodiment, a plurality of second capillary structures 32 may be continuously disposed on the second region 12 without any interval. In another embodiment, the plurality of second capillary structures 32 are arranged at intervals in the second region 12, thereby realizing gas-liquid separation in the horizontal direction. Compared with the continuous arrangement of the plurality of second capillary structures 32, the heat dissipation channels are more efficient. The heat dissipation area is wider and the heat dissipation area is larger, which improves the heat dissipation efficiency of the heat dissipation device 100. Moreover, when the plurality of second capillary structures 32 are continuously arranged, a larger capillary force can be generated, so that the accommodating space 40 cannot be filled during the heat transfer process of the steam. The flow will be re-drained into the second capillary structure 32, and the accommodating space 40 cannot be fully utilized. However, when a plurality of second capillary structures 32 are arranged at intervals, the accommodating space 40 can be more fully utilized and the heat dissipation area can be improved. In one embodiment, the distance between adjacent second capillary structures 32 is greater than 100 μm, which increases the heat dissipation area and increases the heat dissipation effect, which is beneficial to reduce the thickness of the heat dissipation device 100 and realize the lightness and thinness of the heat dissipation device 100 . Further, the spacing between adjacent second capillary structures 32 is greater than 150 μm, 180 μm, 200 μm or 210 μm, which further improves the heat dissipation area and the heat dissipation effect. In another embodiment, the plurality of second capillary structures 32 are arranged in an array on the first cover plate 10 , so that the heat dissipation process is more uniform and the heat dissipation uniformity is improved.

In the embodiment of the present application, please refer to FIG. 2 , the first capillary structure 31 is in contact with the second cover plate 20 . It can be understood that the first capillary structure 31 has opposite first ends and second ends in the thickness direction, the first capillary structure 31 is disposed on the first cover plate 10 , and the first end of the first capillary structure 31 is connected to the first end of the first capillary structure 31 . When the cover plate 10 abuts, the second end of the first capillary structure 31 abuts against the second cover plate 20 . That is to say, the thickness of the first capillary structure 31 is consistent with the size of the accommodating space 40 in the thickness direction of the first capillary structure 31, so that after the working fluid in the first capillary structure 31 is vaporized to form steam, it can fill the entire first capillary structure 31. In the accommodating space 40 corresponding to the area 11, the accommodating space 40 is used more effectively. In practical applications, the heat dissipation area at the corresponding heat source position is increased, thereby improving the heat dissipation effect, which is beneficial to reduce the thickness of the heat dissipation device 100 and realize the heat dissipation device. 100 thinning.

In the embodiment of the present application, when the first region 11 includes a plurality of first capillary structures 31 , please refer to FIG. 3 , the plurality of first capillary structures 31 can divide the accommodating space 40 to form at least one adjacent first capillary structure 31 . A heat dissipation channel between the capillary structures 31 . When there are multiple heat dissipation channels, the multiple heat dissipation channels are not communicated with each other. In another embodiment of the present application, when the first region 11 includes a plurality of first capillary structures 31, please refer to FIG. 4, the plurality of first capillary structures 31 can divide the accommodating space 40 to form a plurality of interconnected The subspace, that is, forming a plurality of interconnected heat dissipation channels. In one embodiment, the cross section of the first capillary structure 31 may be, but not limited to, a square, a rectangle, a circle, an ellipse, a diamond, an irregular shape, and the like.

In the embodiment of the present application, when the second region 12 includes a plurality of second capillary structures 32, please refer to FIG. 3 , the plurality of second capillary structures 32 can divide the accommodating space 40 to form at least one adjacent second capillary structure 32. A heat dissipation channel between the two capillary structures 32 . When there are multiple heat dissipation channels, the multiple heat dissipation channels are not communicated with each other. In another embodiment of the present application, when the second region 12 includes a plurality of second capillary structures 32, please refer to FIG. 4, the plurality of second capillary structures 32 can divide the accommodating space 40 to form a plurality of interconnected The subspace, that is, forming a plurality of interconnected heat dissipation channels. In one embodiment, the cross section of the first capillary structure 31 may be, but not limited to, a square, a rectangle, a circle, an ellipse, a diamond, an irregular shape, and the like. It can be understood that when there are multiple first capillary structures 31 and multiple second capillary structures 32, the first capillary structures 31 can also be arranged as heat dissipation channels that are not connected to each other, and the second capillary structures 32 are arranged between The first capillary structures 31 may also be configured as mutually connected heat dissipation channels, and the second capillary structures 32 may be configured as mutually disconnected heat dissipation channels.

In the present application, by setting the first capillary structure 31 and the second capillary structure 32 with different thicknesses, in application, the first region 11 corresponding to the heat source can have a larger heat dissipation area and improve the heat dissipation effect. The thicknesses of the first capillary structure 31 and the second capillary structure 32 can be selected according to actual needs. In order to facilitate the lightening and thinning of the heat dissipation device 100 , the first capillary structure 31 and the second capillary structure 32 can be micro-scale capillary structures 30 . In the embodiment of the present application, the thickness of the first capillary structure 31 is greater than 80 μm, and the thickness of the second capillary structure 32 is less than or equal to 80 μm, so that the working fluid in the first capillary structure 31 can be fully dissipated after being vaporized, while the second capillary structure 32 can be fully dissipated. The thickness of the structure 32 is relatively small, and the weight of the heat sink 100 is not increased too much. In one embodiment, the thickness of the first capillary structure 31 is 85 μm-120 μm, and the thickness of the second capillary structure 32 is 20 μm-80 μm, which can not only improve the heat dissipation effect of the heat dissipation device 100 , but also reduce the volume of the heat dissipation device 100 . The thickness of the heat dissipation device 100 is not too large, which is beneficial to realize the lightness and thinness of the heat dissipation device 100 . In another embodiment, the thickness of the first capillary structure 31 is 90 μm-120 μm, and the thickness of the second capillary structure 32 is 40 μm-70 μm. In the embodiment of the present application, the thickness ratio of the first capillary structure 31 to the second capillary structure 32 is (1.1-6): 1, and then the steam corresponding to the first region 11 can have a larger heat dissipation space during the heat dissipation process, Improve heat dissipation efficiency. Further, the thickness ratio of the first capillary structure 31 to the second capillary structure 32 is (1.5-4):1.

In the present application, the material of the capillary structure 30 is a metal material. In one embodiment, the material of the capillary structure 30 includes at least one of copper, titanium, nickel and tin or stainless steel; that is, the material of the first capillary structure 31 and the second capillary structure 32 includes copper, titanium, nickel The material of the first capillary structure 31 and the material of the second capillary structure 32 may be the same or different from at least one of tin or stainless steel. For example, the material of the first capillary structure 31 and the second capillary structure 32 is copper. For another example, the material of the first capillary structure 31 is copper-titanium alloy, and the material of the second capillary structure 32 is copper. In the present application, the preparation of the capillary structure 30 can be selected according to actual needs, as long as it can provide capillary force. In one embodiment, the capillary structure 30 may be cut from a metal mesh. In another embodiment, the capillary structure 30 may be made of sintered metal mesh. In yet another embodiment, the capillary structure 30 may be formed by etching. In the embodiment of the present application, by providing the first capillary structure 31 and the second capillary structure 32 with different thicknesses, there is no need for a thinner first capillary structure 31, so a relatively fine preparation process is not required, which is more economical.

In the present application, the heat dissipation device 100 includes a first cover plate 10 and a second cover plate 20 , and the first cover plate 10 and the second cover plate 20 are covered to form a closed accommodating space 40 . It can be understood that the terms "first" and "second" in this application are only used for description purposes, and cannot be understood as indicating or implying relative importance or implying the number of indicated technical features. The capillary structure 30 is disposed on the first cover plate 10. During application, the surface of the first cover plate 10 away from the second cover plate 20 is adhered to the heat source, including direct adherence and indirect adherence through other components. Of course, the capillary structure 30 can also be arranged on the second cover plate 20, and at this time, the surface of the second cover plate 20 away from the first cover plate 10 is attached to the heat source. In the present application, the first cover plate 10 includes a first area 11 and a second area 12, the first area 11 and the second area 12 are adjacent to each other, for example, but not limited to, the first area 11 can surround the second area 12, or The second area 12 surrounds the first area 11 , or the first area 11 and the second area 12 are disposed adjacent to each other. The setting manner and range of the first area 11 and the second area 12 can be selected according to actual needs, and the range of the first area 11 can be designed but not limited to the size of the heat source.

In the present application, in order to achieve lightness and thinness of the heat dissipation device 100 , optionally, the thickness of the first cover plate 10 is less than or equal to 200 μm, and the thickness of the second cover plate 20 is less than or equal to 200 μm. Further, the thickness of the first cover plate 10 is less than or equal to 180 μm, and the thickness of the second cover plate 20 is less than or equal to 180 μm. Further, the thickness of the first cover plate 10 is less than or equal to 150 μm, and the thickness of the second cover plate 20 is less than or equal to 150 μm. In the present application, the first cover plate 10 and the second cover plate 20 are composed of materials with thermal conductivity. In one embodiment, the thermal conductivity of the first cover plate 10 is greater than 10W/(m·K), and the thermal conductivity of the second cover plate 20 is greater than 10W/(m·K), so that the heat dissipation device 100 has an excellent heat dissipation effect . In one embodiment, the material of the first cover plate 10 includes at least one of copper, titanium, nickel and tin or stainless steel, and the material of the second cover plate 20 includes at least one of copper, titanium, nickel and tin or Stainless steel. Further, the material of the first cover plate 10 is titanium, copper-titanium alloy, copper-nickel alloy, copper-tin alloy or stainless steel, and the material of the second cover plate 20 is titanium, copper-titanium alloy, copper-nickel alloy, copper-tin alloy or stainless steel. , so that the first cover plate 10 and the second cover plate 20 have better mechanical properties, which is beneficial to reduce the thickness thereof while ensuring the good performance of the heat dissipation device 100 . It can be understood that the materials of the first cover plate 10 and the second cover plate 20 may be the same or different, and the materials of the first cover plate 10 or the second cover plate 20 and the capillary structure 30 may be the same or different. In one embodiment, the first cover plate 10 and the second cover plate 20 may be a single-layer structure or a multi-layer structure, which may be specifically selected according to actual needs.

In the embodiment of the present application, the first cover plate 10 includes a first horizontal layer and a first frame disposed on the edge of the surface of the first horizontal layer. In this case, the first cover plate 10 may be formed in one piece, but not limited to. In another embodiment of the present application, the first cover plate 10 is a horizontal structure. In the embodiment of the present application, the second cover plate 20 includes a second horizontal layer and a second frame disposed on the edge of the surface of the second horizontal layer. In this case, the second cover plate 20 may be formed in one piece, but not limited to. In another embodiment of the present application, the second cover plate 20 is a horizontal structure. In one embodiment, the first frame is in contact with the second frame to form the accommodating space 40 . In another embodiment, the first frame and the second cover plate 20 of the horizontal structure abut to form the accommodating space 40 . In another embodiment, the accommodating space 40 is formed by abutting the second frame and the first cover plate 10 of the horizontal structure. In another embodiment, the first cover plate 10 and the second cover plate 20 of the horizontal structure may, but not limited to, form the accommodating space 40 by welding and gluing, such as laser welding, diffusion welding, solder welding, and adhesive bonding. Wait.

In the present application, the accommodating space 40 is in a vacuum state, so that the working fluid can be easily vaporized to conduct heat conduction. Optionally, the degree of vacuum in the accommodating space 40 is 10 ^-3 -10 ^-1 Pa. Further, the degree of vacuum in the accommodating space 40 is 10 ^-2 -10 ^-1 Pa.

In the present application, the working fluid in the heat dissipation device 100 absorbs heat and vaporizes rapidly, and this process can take away a large amount of heat, thereby completing a heat dissipation cycle. It can be understood that the working fluid is selected from substances that do not chemically react with the first cover plate 10 , the second cover plate 20 and the capillary structure 30 . Optionally, the working fluid is selected from water, propylene glycol, acetone or methanol. Specifically, the working fluid can be, but is not limited to, deionized water. The filling amount of the working fluid in the accommodating space 40 also affects the heat dissipation efficiency of the heat dissipation device 100 . Optionally, the filling amount of the working fluid in the accommodating space 40 is 15%-70%, which can effectively dissipate heat without making the heat dissipating device 100 too heavy. Further, the filling amount of the working fluid in the accommodating space 40 is 30%-65%.

In the present application, in order to meet the requirement of lightening and thinning of the heat dissipation device 100 and at the same time have strong mechanical properties, therefore, the support structure 50 can be arranged in the accommodating space 40 to play a role in the accommodating space 40 of the heat dissipation device 100 . It has a certain supporting effect, and is also beneficial to the diffusion efficiency of the working fluid in the extending direction of the supporting structure 50 . In one embodiment, please refer to FIG. 1 , the heat dissipation device 100 includes at least one support structure 50 . The support structure 50 is disposed in the accommodating space 40 and abuts against the first cover plate 10 and the second cover plate 20 . In one embodiment, when a plurality of capillary structures 30 are disposed on the first cover plate 10 at intervals, the support structure 50 abuts against the capillary structures 30 , thereby not affecting the heat dissipation space, which is beneficial to efficient heat dissipation. Further, the support structure 50 includes at least one first support structure and at least one second support structure, the first support structure abuts against the first capillary structure 31 , and the second support structure abuts against the second capillary structure 32 . In another embodiment, when the first capillary structure 31 abuts against the second cover plate 20 , the first support structure does not need to be provided. In the present application, the support structure 50 is in contact with the capillary structure 30 , so that the accommodating space 40 can form a plurality of interconnected heat dissipation channels, or the accommodating space 40 can form a plurality of interconnected heat dissipation channels. In the present application, the thickness of the support structure 50 is selected according to actual needs, and may be, but not limited to, 20 μm-120 μm. It can be understood that the support structure 50 mainly plays a supporting role for the heat sink 100 , and the material of the support structure 50 can be selected according to requirements, and can be, but not limited to, metal, such as copper, copper alloy, and the like.

In the present application, by setting the first capillary structure 31 and the second capillary structure 32 with different thicknesses, in the application, the steam in the first region 11 corresponding to the heat source can have a larger heat dissipation space, thereby improving the heat dissipation efficiency, and at the same time The second region 12 without the corresponding heat source does not need to be provided with a thicker capillary structure 30 , which reduces the use of materials and reduces the weight of the heat sink 100 . Optionally, the thickness of the heat dissipation device 100 is less than or equal to 280 μm. Further, the thickness of the heat dissipation device 100 is less than or equal to 250 μm.

The present application also provides a preparation method of a heat dissipation device, and the preparation method prepares the heat dissipation device 100 of any of the above-mentioned embodiments. Please refer to FIG. 5 . FIG. 5 is a schematic flowchart of a method for manufacturing a heat sink 100 according to an embodiment of the present application, including the following steps:

Operation 101: Providing a first cover plate and a second cover plate, the first cover plate including a first area and a second area.

In operation 101 , the first cover plate 10 and the second cover plate 20 can be made by, but not limited to, directly cutting a metal plate, and the metal plate can meet the requirements of the first cover plate 10 and the second cover plate 20 in the heat sink 100 thermal conductivity and mechanical properties. In order to achieve lightness and thinness of the heat dissipation device 100 , optionally, the thickness of the first cover plate 10 is less than or equal to 200 μm, and the thickness of the second cover plate 20 is less than or equal to 200 μm. In the present application, the first cover plate 10 includes a first area 11 and a second area 12, and the first area 11 and the second area 12 are adjacent to each other.

Operation 102 : forming at least one first capillary structure in the first region and forming at least one second capillary structure in the second region, wherein the thickness of the first capillary structure is greater than the thickness of the second capillary structure.

In operation 102, the first metal mesh may be provided, but not limited to, the first metal mesh is cut and disposed in the first region 11 to form at least one first capillary structure 31; a second metal mesh is provided, and the second metal mesh is After the mesh is cut, it is arranged in the second area 12 to form at least one second capillary structure 32. The preparation method is simple and convenient, does not require the use of large-scale equipment and precision equipment, and can realize industrial production. In another embodiment, the first capillary structure 31 and the second capillary structure 32 may be formed by sintering, or may be formed by etching. The arrangement of the first capillary structure 31 and the second capillary structure 32 is as described above, and details are not described herein again.

Operation 103 : cover the first cover plate and the second cover plate to form a closed accommodating space, and the first capillary structure and the second capillary structure are arranged in the accommodating space.

In operation 103 , the sealed accommodating space 40 may be formed by, but not limited to, welding and gluing. Optionally, the welding includes at least one of laser welding, diffusion welding, and solder welding. Solder welding includes low temperature solder or high temperature solder, and diffusion welding includes vacuum diffusion welding or gas shielded diffusion welding. In one embodiment, the soldering can be performed in a nitrogen atmosphere at a soldering temperature of 600°C-900°C. When the heat dissipation device 100 further includes the support structure 50 , the support structure 50 is disposed in the accommodating space 40 and abuts against the first cover plate 10 and the second cover plate 20 .

Operation 104 : inject the working fluid into the accommodating space, and form the heat dissipation device 100 after sealing.

In operation 104, the accommodating space 40 is in a vacuum state, so that the working fluid can be easily vaporized to conduct heat conduction. Optionally, the degree of vacuum in the accommodating space 40 is 10 ^-3 -10 ^-1 Pa. In one embodiment, a liquid-filling tube is welded into the accommodating space 40 , the working fluid is injected into the accommodating space 40 through the liquid-filling tube, and the heat sink 100 is formed after vacuuming and sealing.

The preparation method of the heat dissipation device 100 provided by the present application is simple, can be completed without the use of sophisticated equipment, and the preparation cost is low, and the prepared heat dissipation device 100 has excellent heat dissipation performance, is lighter and thinner, and is favorable for application.

The present application also provides an electronic device, including the heat dissipation device 100 of any of the foregoing embodiments. It can be understood that the electronic device can be, but not limited to, a mobile phone, tablet computer, notebook computer, watch, MP3, MP4, GPS navigator, digital camera, etc., and the heat dissipation device 100 can be, but not limited to, a temperature chamber.

Please refer to FIG. 6 , which is a schematic structural diagram of an electronic device according to an embodiment of the application. The electronic device includes a panel 300 and a housing 400 . The panel 300 and the housing 400 form an accommodation space, and the accommodation space includes a heating element 200 and a heat sink 100 , wherein the heating element 200 and the first area 11 in the heat dissipation device 100 are arranged in close contact, and the heat dissipation space after the vaporization of the working fluid corresponding to the first area 11 is larger, which can achieve faster heat dissipation and improve heat dissipation efficiency; at the same time, the heat dissipation The thickness of the device 100 can be appropriately reduced and excellent heat dissipation performance can be taken into account. Meanwhile, the thickness of the second capillary structure 32 in the second region 12 is relatively thin, which is beneficial to the reduction of the weight of the heat dissipation device 100 , and is further beneficial to realize the lightweight and thinning of electronic equipment. In practical applications, the heat dissipation device 100 may directly contact the heating element 200 or contact the heating element 200 through the middle plate. At this time, the middle plate needs to be processed so that the heat dissipation device 100 is embedded therein, that is, the heat dissipation device 100 can be connected to the heat dissipation device 100. The heating element 200 is directly attached or indirectly attached, and the heating element 200 is arranged corresponding to the first area in the heat dissipation device 100 . Please refer to FIG. 7 , which is a schematic cross-sectional view of an electronic device according to another embodiment of the present application. The electronic device includes a heating element 200 , a heat dissipation device 100 and a middle plate 500 . Taking a mobile phone as an example, if the heat dissipation device is thick, the mechanical properties of the middle plate of the mobile phone will be affected, thereby affecting the overall strength of the mobile phone. The overall performance of the mobile phone is affected, and at the same time, the heat dissipation device 100 provided by the present application is small in weight, does not increase the weight of the mobile phone too much, and has a good application prospect.

The content provided by the embodiments of the present application has been introduced in detail above, and the principles and embodiments of the present application have been described and explained herein. Persons of ordinary skill, according to the idea of the present application, will have changes in the specific implementation manner and application scope. In conclusion, the contents of this specification should not be construed as a limitation on the present application.

Claims (13)

1. The heat dissipation device is characterized by comprising a first cover plate, a second cover plate, capillary structures and working fluid, wherein the first cover plate and the second cover plate are covered to form a closed accommodating space, the capillary structures are arranged on the surface, close to the accommodating space, of the first cover plate, the working fluid is filled in the accommodating space, the first cover plate comprises a first area and a second area, the capillary structures comprise at least one first capillary structure arranged in the first area and at least one second capillary structure arranged in the second area, the thickness of the first capillary structure is larger than that of the second capillary structure, and the first capillary structure and the second capillary structure are arranged on the surface of the first cover plate at intervals to achieve gas-liquid separation in the horizontal direction.

2. The heat dissipation device of claim 1, wherein a spacing between the first capillary structure and the second capillary structure is greater than 100 μ ι η.

3. The heat dissipation device of claim 1, wherein a plurality of the first capillary structures are arranged in an array on the first cover plate, and a plurality of the second capillary structures are arranged in an array on the first cover plate.

4. The heat dissipating device of claim 1, wherein the first capillary structure has a thickness greater than 80 μ ι η and the second capillary structure has a thickness less than or equal to 80 μ ι η.

5. The heat dissipating device of claim 4, wherein the first capillary structure has a thickness of 85 μ ι η to 120 μ ι η and the second capillary structure has a thickness of 20 μ ι η to 80 μ ι η.

6. The heat dissipating device of claim 1, wherein said first wicking structure abuts said second cover plate.

7. The heat dissipating device of claim 1, wherein the capillary structure comprises stainless steel or at least one of copper, titanium, nickel, and tin.

8. The heat dissipating device of claim 1, further comprising a support structure disposed within the receiving space and abutting the first cover plate and the second cover plate.

9. The heat dissipating device of claim 8, wherein said support structure abuts said capillary structure.

10. The heat dissipating device of claim 1, wherein the heat dissipating device has a thickness of less than or equal to 280 μ ι η.

11. A method for preparing a heat sink, comprising:

providing a first cover plate and a second cover plate, wherein the first cover plate comprises a first area and a second area;

forming at least one first capillary structure in the first area, and forming at least one second capillary structure in the second area, wherein the thickness of the first capillary structure is larger than that of the second capillary structure;

covering the first cover plate and the second cover plate to form a closed accommodating space, wherein the first capillary structure and the second capillary structure are arranged in the accommodating space;

and injecting working fluid into the accommodating space, sealing to form a heat dissipation device, and arranging the first capillary structure and the second capillary structure on the surface of the first cover plate at intervals to realize gas-liquid separation in the horizontal direction.

12. The method of claim 11, wherein forming at least one first capillary structure in the first region and at least one second capillary structure in the second region comprises:

providing a first metal net, cutting the first metal net and arranging the first metal net in the first area to form at least one first capillary structure;

and providing a second metal net, and cutting the second metal net to be arranged in the second area to form at least one second capillary structure.

13. An electronic device comprising a heat generating element and the heat dissipating device of any of claims 1-10, wherein the heat generating element is disposed in close proximity to the first region of the first cover plate in the heat dissipating device.

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