CN110966882B - Temperature-uniforming plate, preparation method of temperature-uniforming plate and electronic equipment - Google Patents
Temperature-uniforming plate, preparation method of temperature-uniforming plate and electronic equipment Download PDFInfo
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- CN110966882B CN110966882B CN201911304116.3A CN201911304116A CN110966882B CN 110966882 B CN110966882 B CN 110966882B CN 201911304116 A CN201911304116 A CN 201911304116A CN 110966882 B CN110966882 B CN 110966882B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a temperature-uniforming plate, a preparation method thereof and electronic equipment, wherein the temperature-uniforming plate comprises a first component and a second component which are oppositely arranged, a containing cavity is formed between the first component and the second component, liquid working media are filled in the containing cavity, the first component comprises a first substrate, a first capillary structure layer and a first heat dissipation layer, the second component comprises a second substrate, a second capillary structure layer and a second heat dissipation layer, the first heat dissipation layer is arranged on the outer side of the first substrate, the second heat dissipation layer is arranged on the outer side of the second substrate, heat generated by a heating electronic device can be rapidly conducted to the inside of the temperature-uniforming plate, and condensation heat generated after the liquid working media are condensed can be rapidly dissipated to the outside, so that the surface heat exchange capability and the radiation heat dissipation capability of the temperature-uniforming plate are improved, in addition, the thickness of the first heat dissipation layer and the second heat dissipation layer is very thin, the whole thickness of the temperature-uniforming plate can be effectively controlled, the light and thin electronic equipment is facilitated to be realized.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a temperature-uniforming plate, a preparation method of the temperature-uniforming plate and electronic equipment.
Background
With the rapid development of electronic integration technology, electronic devices are developing toward miniaturization and light weight, and the integration level of systems is higher and higher. On the other hand, in the application of high-power components in electronic equipment, the heat power consumption is increased sharply, and the generated heat is not sufficiently dissipated, so that the working performance and the service life of the product are directly influenced, and statistics shows that more than about 40% of reliability (service life) faults of electronic products are caused by temperature rise. With the advent of the 5G era, the heat dissipation task of electronic products has become more severe.
Because the internal space of the electronic product is limited and the heat flux density is greatly improved, the traditional heat dissipation device is difficult to effectively solve the heat dissipation problem. With the development of the demand, some advanced heat dissipation technologies appear on the market, and the phase-change heat transfer technology is a heat conduction and heat dissipation scheme with strong competitiveness, such as a temperature equalization plate, the working principle of the phase-change heat transfer technology is that heat is transferred by utilizing evaporation and condensation of a liquid working medium, namely gas-liquid phase change, the liquid working medium is evaporated and vaporized when one end of a heat transfer device is heated, steam flows to the other end under a small pressure difference to release heat to be condensed into liquid, the liquid flows back to an evaporation section along a pipe wall under the action of gravity or capillary force, and the process is continuously circulated, so that the heat is transferred from one end of the phase-change heat transfer device to the other end.
The existing temperature equalizing plate is often weak in heat dissipation performance, the shell of the temperature equalizing plate is generally made of metal sheets such as copper, aluminum and stainless steel, the contact area between the surface of the temperature equalizing plate and air is limited, and meanwhile, the radiation coefficient is low, so that the surface heat exchange capacity and the radiation heat dissipation capacity of the temperature equalizing plate are poor.
Disclosure of Invention
The embodiment of the invention provides a temperature-uniforming plate, a preparation method of the temperature-uniforming plate and electronic equipment, which can improve the surface heat exchange capacity and the radiation heat dissipation capacity of the temperature-uniforming plate.
In a first aspect, an embodiment of the present invention provides a temperature-uniforming plate, where the temperature-uniforming plate includes a first component and a second component that are arranged oppositely;
an accommodating cavity is formed between the first part and the second part, and liquid working media are filled in the accommodating cavity;
the first component comprises a first substrate, a first capillary structure layer and a first heat dissipation layer, the first capillary structure layer is positioned on one side, close to the second component, of the first substrate, and the first heat dissipation layer is positioned on one side, far away from the second component, of the first substrate;
the second component comprises a second substrate, a second capillary structure layer and a second heat dissipation layer, the second capillary structure layer is located on one side, close to the first component, of the second substrate, and the second heat dissipation layer is located on one side, far away from the first component, of the second substrate.
Optionally, the temperature equalization plate further comprises a support structure, and the support structure is disposed between the first capillary structure layer and the second capillary structure layer.
Optionally, the support structure comprises a support net or a support column.
Optionally, the temperature equalization plate further comprises a connecting part, which is used for connecting the first part and the second part and enclosing the first part and the second part to form the accommodating cavity.
Optionally, the first capillary structure layer, the second capillary structure layer, the first heat dissipation layer, and the second heat dissipation layer are made of graphene and/or carbon nanotubes.
Optionally, the thickness of the first heat dissipation layer and the second heat dissipation layer ranges from 10 μm to 30 μm.
Optionally, the thickness of the temperature equalizing plate ranges from 0.1mm to 0.3 mm.
In a second aspect, an embodiment of the present invention further provides a method for manufacturing a vapor chamber, including:
providing a first substrate and a second substrate;
respectively forming a first capillary structure layer and a first heat dissipation layer on two sides of the first substrate;
forming a second capillary structure layer and a second heat dissipation layer on two sides of the second substrate respectively;
the first substrate and the second substrate are oppositely arranged to form a containing cavity, the first capillary structure layer is positioned on one side of the first substrate close to the second substrate, and the second capillary structure layer is positioned on one side of the second substrate close to the first substrate;
sealing the accommodating cavity and reserving a liquid injection port;
and injecting liquid working medium into the accommodating cavity from the liquid injection port, and sealing the liquid injection port after vacuumizing.
Optionally, the first capillary structure layer and the first heat dissipation layer are made of the same material, and the first capillary structure layer and the first heat dissipation layer are formed on two sides of the first substrate simultaneously in an electrophoretic deposition mode.
Optionally, the second capillary structure layer and the second heat dissipation layer are made of the same material, and the second capillary structure layer and the second heat dissipation layer are formed on two sides of the second substrate simultaneously in an electrophoretic deposition mode.
Optionally, the first capillary structure layer, the first heat dissipation layer, the second capillary structure layer, and the second heat dissipation layer are made of graphene and/or carbon nanotubes.
In a third aspect, an embodiment of the present invention further provides an electronic device, including the temperature equalization plate provided in the first aspect of the present invention.
The temperature-uniforming plate provided by the embodiment of the invention comprises a first component and a second component which are oppositely arranged, wherein a containing cavity is formed between the first component and the second component, liquid working media are filled in the containing cavity, the first component comprises a first substrate, a first capillary structure layer and a first heat dissipation layer, the second component comprises a second substrate, a second capillary structure layer and a second heat dissipation layer, the first heat dissipation layer is arranged on the outer side of the first substrate, the second heat dissipation layer is arranged on the outer side of the second substrate, so that heat generated by the heating electronic device can be quickly conducted to the inside of the temperature equalization plate, and in addition, the first heat dissipation layer and the second heat dissipation layer are very thin, so that the overall thickness of the temperature equalization plate can be effectively controlled, and the electronic equipment is light and thin.
Drawings
The invention is explained in more detail below with reference to the figures and examples.
Fig. 1 is a schematic structural diagram of a vapor chamber according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of another temperature-uniforming plate according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of another temperature-uniforming plate according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of another temperature-uniforming plate according to an embodiment of the present invention;
FIG. 5 is a schematic structural view of the support column of FIG. 4;
FIG. 6 is a flowchart of a method for manufacturing a vapor chamber according to an embodiment of the present invention;
fig. 7 is a schematic structural view illustrating a first capillary structure layer and a first heat dissipation layer formed on two sides of a first substrate, respectively;
fig. 8 is a schematic structural view illustrating a second capillary structure layer and a second heat dissipation layer formed on both sides of a second substrate, respectively;
fig. 9 is a graph comparing the heat dissipation performance of the temperature-uniforming plate according to the embodiment of the present invention with that of the temperature-uniforming plate according to the comparative example and a pure aluminum plate having an equal thickness.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature. Furthermore, the terms "first" and "second" are used merely for descriptive purposes and are not intended to have any special meaning.
Fig. 1 is a schematic structural view of an isothermal plate according to an embodiment of the present invention, and as shown in fig. 1, the isothermal plate includes a first member 110 and a second member 120, which are disposed opposite to each other.
The first component 110 includes a first substrate 111, a first capillary structure layer 112 and a first heat dissipation layer 113, the first capillary structure layer 112 is located on one side of the first substrate 111 close to the second component 120, and the first heat dissipation layer 113 is located on one side of the first substrate 111 far from the second component 120. That is, the first capillary structure layer 112 is formed on the inner side of the first substrate 111, and the first heat dissipation layer 113 is formed on the outer side of the first substrate 111.
The second component 120 includes a second substrate 121, a second capillary structure layer 122 and a second heat dissipation layer 123, the second capillary structure layer 122 is located on one side of the second substrate 121 close to the first component 110, and the second heat dissipation layer 123 is located on one side of the second substrate 121 far from the first component 110. That is, the second capillary structure layer 122 is formed on the inner side of the second substrate 121, and the second heat dissipation layer 123 is formed on the outer side of the second substrate 121.
The first part 110 and the second part 120 are oppositely arranged, a certain gap is formed between the first part 110 and the second part 120, the peripheral edges of the first part 110 and the second part 120 are sealed, an accommodating cavity 130 is formed inside the accommodating cavity, and the accommodating cavity 130 is filled with liquid working media.
For example, when in use, the second heat dissipation layer 123 of the temperature equalization plate is attached to the surface of the heat-generating electronic device, and heat generated by the heat-generating electronic device is conducted to the accommodating cavity 130 through the second heat dissipation layer 123 and the second substrate 121 by means of heat transfer. The liquid working medium at the bottom of the accommodating cavity 130 is heated, evaporated and vaporized, the vapor flows to the first part 110 under a slight pressure difference, and when encountering the first capillary structure layer 112 with a lower temperature, the vapor is condensed to release heat and is condensed into liquid. The heat released by the condensation is finally dissipated to the outside through the first substrate 111 and the first heat dissipation layer 113. The condensed liquid working medium flows back to the bottom of the accommodating cavity 130 through the first capillary structure layer 112 and the second capillary structure layer 122. The above process is continuously cycled to achieve heat dissipation of the heat-generating electronic device.
It should be noted that, in this embodiment, the technical solution of the present invention is described by taking the example that the second heat dissipation layer 123 of the temperature equalization plate is attached to the surface of the heat-generating electronic device, and in fact, in other embodiments of the present invention, the first heat dissipation layer 113 of the temperature equalization plate may also be attached to the surface of the heat-generating electronic device, which can also achieve the effects of the present invention, and the present invention is not described herein again.
First heat dissipation layer 113 and second heat dissipation layer 123 have the characteristics that heat dissipation and heat-transfer capacity are strong, can conduct the heat that the electron device that generates heat to the samming board inside rapidly, and the condensation heat that produces after will liquid working medium condensation simultaneously gives off the external world rapidly, provides the surface heat transfer ability and the radiation heat-sinking ability of samming board. In addition, the first heat dissipation layer 113 and the second heat dissipation layer 123 are thin, so that the overall thickness of the temperature equalization plate can be effectively controlled, and the electronic device is light and thin.
The temperature-uniforming plate provided by the embodiment of the invention comprises a first component and a second component which are oppositely arranged, wherein a containing cavity is formed between the first component and the second component, liquid working media are filled in the containing cavity, the first component comprises a first substrate, a first capillary structure layer and a first heat dissipation layer, the second component comprises a second substrate, a second capillary structure layer and a second heat dissipation layer, the first heat dissipation layer is arranged on the outer side of the first substrate, the second heat dissipation layer is arranged on the outer side of the second substrate, so that heat generated by the heating electronic device can be quickly conducted to the inside of the temperature equalization plate, and in addition, the first heat dissipation layer and the second heat dissipation layer are very thin, so that the overall thickness of the temperature equalization plate can be effectively controlled, and the electronic equipment is light and thin.
On the basis of the above embodiment, the temperature equalization plate provided by the embodiment of the present invention may further include a connecting member, where the connecting member is used to connect the first member and the second member, and encloses with the first member and the second member to form an accommodating cavity.
Illustratively, as shown in fig. 1, the first capillary structure layer 112 and the first heat dissipation layer 113 do not completely cover the surface of the first substrate 111, exposing the peripheral edge portion 1111 of the first substrate 111, the second capillary structure layer 122 and the second heat dissipation layer 123 do not completely cover the surface of the second substrate 121, exposing the peripheral edge portion 1211 of the second substrate 121, and forming a loop of the connection member 140 by pressing the peripheral edge portion 1111 of the first substrate 111 and the peripheral edge portion 1211 of the second substrate 121 and welding them by laser welding, thereby forming the receiving cavity 130.
Fig. 2 is a schematic structural diagram of another temperature equalization plate according to an embodiment of the present invention, and this embodiment provides another implementation form of the connection component.
As shown in fig. 2, the connection member 140 is provided on the peripheral portions of the first member 110 and the second member 120, and connects the peripheral portions of the first substrate 111 and the second substrate 121. The connection member 140 may be made of the same material as the first substrate 111 and the second substrate 121, the connection member 140 may be welded to the first substrate 111 and the second substrate 121 by laser welding, and the connection member 140 surrounds the first substrate 111 and the second substrate 121 to form the receiving cavity 130.
It should be noted that the connecting components provided in the above embodiments are exemplary illustrations of the present invention, and should not be construed as limiting the present invention.
After filling the liquid working medium into the accommodating cavity 130, in order to reduce the phase transition temperature of the liquid working medium, the accommodating cavity needs to be vacuumized, so as to reduce the air pressure inside the accommodating cavity 130, and further reduce the phase transition temperature of the liquid working medium inside the accommodating cavity 130. Since the first substrate 111 and the second substrate 121 are thin, the first substrate 111 and the second substrate 121 cannot provide enough supporting force during the vacuum-pumping process, so that the first substrate 111 and the second substrate 121 collapse inward, and the isothermal plate is scrapped.
In view of the above problem, on the basis of the above embodiment, the temperature equalization plate provided in the embodiment of the present invention may further include a support structure, where the support structure is disposed between the first capillary structure layer and the second capillary structure layer, and is used to support the first component and the second component. Fig. 3 is a schematic structural diagram of another temperature equalization plate according to an embodiment of the present invention, and this embodiment provides an implementation form of a support structure.
As shown in fig. 3, the supporting structure is a supporting mesh 151, and the supporting mesh 151 is sandwiched between the first capillary structure layer 112 and the second capillary structure layer 122, and is used for supporting the first member 110 and the second member 120 and preventing the internal cavity from collapsing during the vacuum-pumping process. The support screen 151 includes, but is not limited to, a wire mesh, a fiber mat, an ultra-thin foamed metal sheet, and the like. Illustratively, the support mesh 151 includes a plurality of support wires in the form of cylindrical spirals. The supporting lines are connected in a criss-cross mode, the supporting lines arranged in the longitudinal direction and the transverse direction are respectively arranged in parallel at intervals, and the supporting lines arranged in the longitudinal direction and the supporting lines arranged in the transverse direction are connected in a perpendicular and crossed mode to form a supporting net.
Furthermore, the upper and lower surfaces of the support net 151 are respectively in contact with the first capillary structure layer 112 and the second capillary structure layer 122, and the liquid working medium condensed on the first portion 110 can flow back to the bottom of the accommodating cavity 130 via the support net 151, that is, the support net 151 can play a role in assisting the liquid working medium to flow back, thereby further improving the heat transfer performance of the temperature equalization plate.
Fig. 4 is a schematic structural view of another temperature equalization plate according to an embodiment of the present invention, fig. 5 is a schematic structural view of a support column in fig. 4, and this embodiment provides another implementation form of a support structure.
As shown in fig. 4 and 5, the supporting structure is a supporting column 152, and a plurality of supporting columns 152 are uniformly disposed between the first capillary structure layer 112 and the second capillary structure layer 122, so as to support the first component 110 and the second component 120 and prevent the internal cavity from collapsing during the vacuum-pumping process. The axis of the supporting column 152 is perpendicular to the first capillary structure layer 112 and the second capillary structure layer 122, and both ends of the supporting column 152 are in contact with the first capillary structure layer 112 and the second capillary structure layer 122, respectively. Illustratively, the supporting column 152 is a hollow cylinder with a capillary structure having an inverted trapezoidal groove on the surface, and the extending direction of the capillary structure is parallel to the axis of the supporting column 152. The liquid working medium condensed on the first portion 110 can flow back to the bottom of the accommodating cavity 130 through the capillary structure on the supporting column 152, that is, the supporting column 152 can play a role in assisting the liquid working medium to flow back, so that the heat transfer performance of the temperature equalization plate is further improved.
It should be noted that the support structure provided in the above embodiments is an exemplary illustration of the present invention, and should not be considered as a limitation of the present invention.
In the above embodiment, the first substrate 111 and the second substrate 121 may be metal foils having a good thermal conductivity, for example, copper foil, aluminum foil, titanium foil, or stainless steel foil. Specifically, in the embodiment of the present invention, the first substrate 111 and the second substrate 121 are copper foils, copper has excellent thermal conductivity and extensibility, and the first substrate 111 and the second substrate 121 can have good thermal conductivity, and meanwhile, the problem of deformation and fracture when the first substrate 111 and the second substrate 121 are collided can be avoided.
In the above embodiments, the materials of the first capillary structure layer 112, the second capillary structure layer 122, the first heat dissipation layer 113, and the second heat dissipation layer 123 include graphene, carbon nanotubes, or a mixture of graphene and carbon nanotubes. In an embodiment, the first capillary structure layer 112, the second capillary structure layer 122, the first heat dissipation layer 113, and the second heat dissipation layer 123 are made of graphene.
The capillary structure layer in the existing temperature equalizing plate usually adopts a porous capillary structure sintered by metal powder, the process is complex, the energy consumption is large, the production cost is high, and when the temperature equalizing plate is subjected to the action of external force, the capillary structure is easy to break under the condition of bending deformation, so that the capillary force is weakened, and the heat conduction capability is influenced; in addition, the capillary structure with small aperture generated by adopting the metal powder sintering mode can provide larger capillary force, but can also increase the reflux resistance of the liquid working medium; the metal capillary structure layer can further increase the overall weight of the temperature equalization plate, which is not favorable for the lightening and thinning of electronic equipment.
In this embodiment, the first capillary structure layer 112 and the second capillary structure layer 122 are both made of graphene, which has excellent thermal conductivity, and the graphene can be formed by a deposition method (e.g., electrophoretic deposition), and has a simple process, low energy consumption, and low production cost. Because graphite alkene has better pliability, when the temperature-uniforming plate takes place the deformation of certain degree, inside capillary structure can not suffer destruction, makes the temperature-uniforming plate possess certain pliability to satisfy more application scenarios. In addition, by controlling the deposition parameters, the pores of the first and second capillary structure layers 112 and 122 can be adjusted to obtain capillary structures with different pores. In addition, the graphene has stable chemical properties and can be compatible with various liquid working media, so that the long-term operation stability of the temperature equalization plate can be ensured, and the service life of the temperature equalization plate can be prolonged. Exemplary liquid working fluids include, but are not limited to, water, liquid nitrogen, ammonia, isobutane, acetone, methanol, ethanol, hydrofluorocarbon refrigerants, and the like.
The first heat dissipation layer 113 and the second heat dissipation layer 123 are made of graphene, the graphene has excellent heat conduction performance, and can be formed in a deposition mode (for example, electrophoretic deposition), so that the process is simple, the energy consumption is low, and the production cost is low. The infrared emissivity of the first heat dissipation layer 113 and the infrared emissivity of the second heat dissipation layer 123 are above 0.9, and in addition, the first heat dissipation layer 113 and the second heat dissipation layer 123 have the characteristics of rough porous surfaces, so that the contact area of the uniform temperature plate and air can be greatly increased, the heat exchange coefficient is increased, the problem that the uniform temperature plate is good in heat transfer performance and poor in heat dissipation performance is effectively solved, and the graphene is stable in physical and chemical properties and high in surface adhesion, so that a certain surface protection effect can be achieved.
The first capillary structure layer 112 and the first heat dissipation layer 113 may be formed on both sides of the first substrate 111 in one step by a deposition method (e.g., electrophoretic deposition), and the second capillary structure layer 122 and the second heat dissipation layer 123 may be formed on both sides of the second substrate 121 in one step by a deposition method (e.g., electrophoretic deposition), so that the process is simplified, and the production cost is saved. By controlling the deposition parameters, the thicknesses of the first capillary structure layer 112, the second capillary structure layer 122, the first heat dissipation layer 113 and the second heat dissipation layer 123 can be controlled at the micron level, and meanwhile, the graphene is light in weight and easy to realize the lightness and thinness of the electronic device.
Illustratively, the thickness of the first capillary structure layer 112, the second capillary structure layer 122, the first heat dissipation layer 113 and the second heat dissipation layer 123 ranges from 10 μm to 30 μm, and the thickness of the uniform temperature plate ranges from 0.1mm to 0.3 mm.
An embodiment of the present invention further provides a method for manufacturing a vapor chamber, fig. 6 is a flowchart of the method for manufacturing a vapor chamber according to the embodiment of the present invention, and as shown in fig. 6, the method includes the following steps:
s201, providing a first substrate and a second substrate.
Illustratively, the first and second substrates may be metal foils having a good thermal conductivity, such as copper foil, aluminum foil, titanium foil, or stainless steel foil. In particular, in the embodiment of the invention, the first substrate and the second substrate are copper foils, the copper has excellent heat conduction performance and extensibility, and the first substrate and the second substrate are ensured to have better heat conduction performance and can be prevented from deforming and breaking when being collided.
S202, forming a first capillary structure layer and a first heat dissipation layer on two sides of the first substrate respectively.
Fig. 7 is a schematic structural view illustrating that a first capillary structure layer and a first heat dissipation layer are respectively formed on two sides of a first substrate, and as shown in fig. 7, a first capillary structure layer 112 and a first heat dissipation layer 113 are respectively formed on two sides of a first substrate 111. Illustratively, in one embodiment, the first capillary structure layer 112 and the first heat dissipation layer 113 do not completely cover the surface of the first substrate 111, exposing the peripheral edge portion 1111 of the first substrate 111.
The first capillary structure layer 112 and the first heat dissipation layer 113 are made of the same material, and for example, the material of the first capillary structure layer 112 and the first heat dissipation layer 113 includes graphene, carbon nanotubes, or a mixture of graphene and carbon nanotubes.
In an embodiment, the first capillary structure layer 112 and the first heat dissipation layer 113 are made of the same material and are made of graphene. The first capillary structure layer 112 and the first heat dissipation layer 113 are simultaneously formed on both sides of the first substrate 111 by means of electrophoretic deposition.
Specifically, the first capillary structure layer 112 and the first heat dissipation layer 113 are prepared as follows:
a copper foil with a suitable area size is cut out as a first substrate 111, and is dried after being repeatedly washed with acetone, ethanol, and deionized water, and an isolation film is attached to the peripheral edge portion 1111 of the first substrate 111.
Preparing graphene oxide dispersion liquid with the concentration range of 0.1mg/ml-3mg/ml, adding a certain amount of DMSO (dimethyl sulfoxide), and uniformly mixing to obtain electrophoretic deposition liquid. In a specific embodiment, the concentration of the graphene oxide dispersion is 0.15 mg/ml.
In a three-electrode system, a first substrate 111 is used as a working electrode, a platinum sheet is used as a counter electrode, an Ag/AgCl electrode is used as a reference electrode, and a constant voltage deposition method is adopted to prepare a first capillary structure layer 112 and a first heat dissipation layer 113 in one step. Wherein the voltage range of constant voltage deposition is 0.5V-3V, and the deposition time is 0.5h-2 h. In one embodiment, the voltage of the constant voltage deposition is 0.5V and the deposition time is 0.5 h.
The electrophoretically deposited first substrate 111 is removed, and the separator is removed and dried at room temperature to obtain the first portion 110.
And S203, forming a second capillary structure layer and a second heat dissipation layer on two sides of the second substrate respectively.
Fig. 8 is a schematic structural view illustrating that a second capillary structure layer and a second heat dissipation layer are respectively formed on two sides of a second substrate, and as shown in fig. 8, a second capillary structure layer 122 and a second heat dissipation layer 123 are respectively formed on two sides of a second substrate 121. Illustratively, in one embodiment, the second capillary structure layer 122 and the second heat dissipation layer 123 do not completely cover the surface of the second substrate 121, exposing the peripheral edge portion 1211 of the second substrate 121.
The second capillary structure layer 122 and the second heat dissipation layer 123 are made of the same material, and for example, the material of the second capillary structure layer 122 and the second heat dissipation layer 123 includes graphene, carbon nanotubes, or a mixture of graphene and carbon nanotubes.
In an embodiment, the second capillary structure layer 122 and the second heat dissipation layer 123 are made of the same material and are made of graphene. The second capillary structure layer 122 and the second heat dissipation layer 123 are simultaneously formed on both sides of the second substrate 121 by means of electrophoretic deposition.
Specifically, the preparation processes of the second capillary structure layer 122 and the second heat dissipation layer 123 are the same as the preparation processes of the first capillary structure layer 112 and the first heat dissipation layer 113, and are not described herein again.
And S204, oppositely arranging the first substrate and the second substrate to form an accommodating cavity.
Referring to fig. 1 and 2, for example, the first substrate 111 and the second substrate 121 are disposed opposite to each other, such that the first capillary structure layer 112 is located on a side of the first substrate 111 close to the second substrate 121, and the second capillary structure layer 122 is located on a side of the second substrate 121 close to the first substrate 111. That is, the first capillary structure layer 112 is formed on the inner side of the first substrate 111, the first heat dissipation layer 113 is formed on the outer side of the first substrate 111, the second capillary structure layer 122 is formed on the inner side of the second substrate 121, and the second heat dissipation layer 123 is formed on the outer side of the second substrate 121. A certain gap exists between the first capillary structure layer 112 and the second capillary structure layer 122, so that a receiving cavity 130 is formed between the first substrate 111 and the second substrate 121.
In order to avoid the problem that the first substrate 111 and the second substrate 121 collapse inward during the subsequent vacuum-pumping process, so that the temperature equalization plate is discarded, in some embodiments of the present invention, when the first substrate 111 and the second substrate 121 are disposed opposite to each other, a support structure may be disposed between the first capillary structure layer 112 and the second capillary structure layer 122, as shown in fig. 3 and 4, the support structure may be a support net 151 or a support column 152, and the support net 151 and the support column 152 have been described in detail in the foregoing embodiments, and the present invention is not described herein again.
S205, sealing the containing cavity and reserving a liquid injection port.
Illustratively, a thin metal tube (not shown) may be placed between the first substrate 111 and the second substrate 121 as a liquid injection port. As shown in fig. 1, a circle of the connection part 140 is formed by pressing the peripheral edge portion 1111 of the first substrate 111 and the peripheral edge portion 1211 of the second substrate 121 and welded by means of laser welding, thereby forming the hermetic container 130.
It should be noted that, in the above embodiment, the connection component described in fig. 1 is taken as an example to describe step S205. In another embodiment of the present invention, as shown in fig. 2, the connection member 140 is disposed at the periphery of the first member 110 and the second member 120, and connects the periphery of the first substrate 111 and the second substrate 121. Then, the step S205 may be to weld the connection member 140 with the first substrate 111 and the second substrate 121 by laser welding. The connection part 140 encloses the first substrate 111 and the second substrate 121 to form a closed receiving chamber 130. The liquid inlet is provided in the connecting member 140.
And S206, injecting the liquid working medium into the accommodating cavity from the liquid injection port, and sealing the liquid injection port after vacuumizing.
Liquid working medium is injected into the accommodating cavity 130 from the liquid injection port, the filling amount of the liquid working medium is 10% -30%, namely the volume ratio of the liquid working medium to the accommodating cavity 130 is 10% -30%. In one embodiment, the liquid working substance is water and the filling amount is 25%.
After the liquid working medium is filled, the accommodating cavity 130 is vacuumized, and finally the liquid injection port is sealed, so that the temperature-uniforming plate is obtained.
The use and operation of the vapor chamber are described in detail in the foregoing embodiments, and the present invention is not described herein again.
The preparation method of the temperature-uniforming plate provided by the embodiment of the invention comprises the steps of forming the first capillary structure layer and the first heat dissipation layer on two sides of the first substrate respectively, forming the second capillary structure layer and the second heat dissipation layer on two sides of the second substrate respectively, arranging the first substrate and the second substrate oppositely to form the accommodating cavity, sealing the accommodating cavity, reserving the liquid injection port, injecting liquid working medium into the accommodating cavity from the liquid injection port, and sealing the liquid injection port after vacuumizing to form the temperature-uniforming plate. Through setting up first heat dissipation layer in the outside of first basement, the second heat dissipation layer sets up in the outside of second basement, can conduct the heat that the electron device that generates heat to the samming inboard rapidly, simultaneously with the condensation heat that produces behind the liquid working medium condensation rapidly give off the external world, improve the surface heat exchange ability and the radiation heat-sinking capability of samming board, in addition, first heat dissipation layer and second heat dissipation layer thickness are very thin, can effectively control the whole thickness of samming board, be favorable to realizing electronic equipment's frivolousization.
Fig. 9 is a comparison diagram of heat dissipation performance of the temperature-uniforming plate provided in the embodiment of the present invention, the temperature-uniforming plate of the comparative example, and the pure aluminum plate with the same thickness, in order to further illustrate performance advantages of the temperature-uniforming plate provided in the present invention, one end of the temperature-uniforming plate is installed with a heat source with fixed power, and heat conduction and heat dissipation performances of the temperature-uniforming plate provided in the embodiment of the present invention (hereinafter referred to as the present embodiment), the temperature-uniforming plate provided in the comparative example (hereinafter referred to as the comparative example), and the pure aluminum plate with the same thickness are respectively tested in a test tool of a closed space, and a temperature rise curve of the heat source (i.e., a heating electronic device) is recorded. Compared with the temperature equalizing plate provided by the embodiment, the temperature equalizing plate provided by the comparative example has the same structure and parameters except that the first heat dissipation layer and the second heat dissipation layer are not arranged.
As shown in fig. 9, comparing the heat source temperature rise test data of the pure aluminum plate and the vapor chamber (including the vapor chamber provided in the example of the present invention and the vapor chamber of the comparative example), it can be found that the vapor chamber has excellent heat transfer and heat dissipation performance. The difference between the data of the comparative example and the data of the present example also indicates that the temperature equalization plate with the heat dissipation layer on the surface not only has high thermal conductivity, but also can further reduce the surface temperature of the heat source by dissipating the heat of the heat source into the air through heat transfer and radiation.
Table 1 shows the temperature equalization performance of the pure aluminum plate and the temperature equalization plate provided in the embodiment of the present invention after being bent at different angles in the same test environment.
TABLE 1
In the temperature equalization plate provided by the embodiment of the invention, the first capillary structure layer and the second capillary structure layer are made of graphene. The temperature of the heat source is the temperature of the surface of the heating electronic device, and the temperature of the end face is the temperature of the end face of the temperature-equalizing plate or the pure aluminum plate far away from the heating electronic device.
As can be seen from Table 1, the temperature equalization performance of the temperature equalization plate provided by the embodiment of the invention is hardly affected after the temperature equalization plate is bent at a certain angle. The graphene has good flexibility, so that when the temperature-uniforming plate deforms to a certain degree, the internal capillary structures of the first capillary structure layer and the second capillary structure layer are not damaged, and the temperature-uniforming plate has certain flexibility. The characteristic is beneficial to the application of the aluminum alloy in special scenes, and the excellent temperature equalizing performance of the aluminum alloy is further proved by comparing the aluminum alloy with temperature difference data of a pure aluminum plate.
The embodiment of the invention also provides electronic equipment which comprises the temperature equalizing plate and the heating electronic device.
The temperature equalizing plate comprises a first part and a second part which are oppositely arranged;
an accommodating cavity is formed between the first component and the second component, and liquid working media are filled in the accommodating cavity;
the first component comprises a first substrate, a first capillary structure layer and a first heat dissipation layer, the first capillary structure layer is positioned on one side of the first substrate close to the second component, and the first heat dissipation layer is positioned on one side of the first substrate far away from the second component;
the second component comprises a second substrate, a second capillary structure layer and a second heat dissipation layer, the second capillary structure layer is located on one side, close to the first component, of the second substrate, and the second heat dissipation layer is located on one side, far away from the first component, of the second substrate.
The temperature equalizing plate is attached to the surface of the heating electronic device, wherein the first heat dissipation layer or the second heat dissipation layer is attached to the surface of the heating electronic device.
In some embodiments, the vapor chamber further comprises a support structure disposed between the first capillary structure layer and the second capillary structure layer. Illustratively, the support structure includes a support mesh or support columns.
In some embodiments, the vapor chamber further comprises a connecting member for connecting the first member and the second member and enclosing the first member and the second member to form a receiving cavity.
In some embodiments, the first capillary structure layer, the second capillary structure layer, the first heat dissipation layer and the second heat dissipation layer are made of graphene and/or carbon nanotubes.
In some embodiments, the first and second heat spreading layers have a thickness in the range of 10 μm to 30 μm.
In some embodiments, the thickness of the temperature equalization plate is in the range of 0.1mm to 0.3 mm.
The use and working principle of the temperature equalization plate are described in detail in the foregoing embodiments, and the present invention is not described herein again.
In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be appropriately combined to form other embodiments as will be appreciated by those skilled in the art.
The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.
Claims (8)
1. The temperature-equalizing plate is characterized by comprising a first part and a second part which are oppositely arranged;
an accommodating cavity is formed between the first component and the second component, liquid working media are filled in the accommodating cavity, and after the liquid working media are filled in the accommodating cavity, the accommodating cavity is vacuumized to be in a vacuum state;
the first component comprises a first substrate, a first capillary structure layer and a first heat dissipation layer, the first capillary structure layer is positioned on one side, close to the second component, of the first substrate, and the first heat dissipation layer is positioned on one side, far away from the second component, of the first substrate;
the second component comprises a second substrate, a second capillary structure layer and a second heat dissipation layer, the second capillary structure layer is positioned on one side, close to the first component, of the second substrate, and the second heat dissipation layer is positioned on one side, far away from the first component, of the second substrate;
the first capillary structure layer and the first heat dissipation layer are formed on two sides of the first substrate in an electrophoretic deposition mode, and the second capillary structure layer and the second heat dissipation layer are formed on two sides of the second substrate in an electrophoretic deposition mode;
the first capillary structure layer, the second capillary structure layer, the first heat dissipation layer and the second heat dissipation layer are made of graphene and/or carbon nano tubes.
2. The vapor chamber of claim 1, further comprising a support structure disposed between the first and second capillary structure layers, wherein the support structure is a support mesh for preventing collapse of the receiving cavity during evacuation.
3. The vapor chamber of claim 1, further comprising a connecting member for connecting the first member and the second member and enclosing the first member and the second member to form the receiving cavity.
4. The vapor chamber of claim 1, wherein the first and second heat spreading layers have a thickness in the range of 10 μ ι η to 30 μ ι η.
5. The vapor chamber of claim 1, wherein the thickness of the vapor chamber is in the range of 0.1mm to 0.3 mm.
6. A preparation method of a vapor chamber is characterized by comprising the following steps:
providing a first substrate and a second substrate;
respectively forming a first capillary structure layer and a first heat dissipation layer on two sides of the first substrate;
forming a second capillary structure layer and a second heat dissipation layer on two sides of the second substrate respectively;
the first substrate and the second substrate are oppositely arranged to form a containing cavity, the first capillary structure layer is positioned on one side of the first substrate close to the second substrate, and the second capillary structure layer is positioned on one side of the second substrate close to the first substrate;
sealing the accommodating cavity and reserving a liquid injection port;
injecting liquid working medium into the accommodating cavity from the liquid injection port, and sealing the liquid injection port after vacuumizing;
the first capillary structure layer and the first heat dissipation layer are formed on two sides of the first substrate in an electrophoretic deposition mode, and the second capillary structure layer and the second heat dissipation layer are formed on two sides of the second substrate in an electrophoretic deposition mode;
the first capillary structure layer, the second capillary structure layer, the first heat dissipation layer and the second heat dissipation layer are made of graphene and/or carbon nano tubes.
7. The method as claimed in claim 6, wherein the first capillary structure layer and the first heat dissipation layer are made of the same material, and the first capillary structure layer and the first heat dissipation layer are formed on both sides of the first substrate by electrophoretic deposition.
8. An electronic device comprising the vapor chamber according to any one of claims 1 to 5.
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| CN111447792B (en) * | 2020-04-08 | 2022-05-13 | Oppo广东移动通信有限公司 | Heat-dissipating device, preparation method of heat-dissipating device, and electronic equipment |
| CN111473671A (en) * | 2020-04-21 | 2020-07-31 | 福建永安市永清石墨烯研究院有限公司 | Graphene VC soaking plate and preparation method thereof |
| CN113840502A (en) * | 2020-06-08 | 2021-12-24 | 太仓市华盈电子材料有限公司 | One-way thermal device |
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| CN112672604B (en) * | 2020-12-22 | 2023-04-21 | Oppo（重庆）智能科技有限公司 | Vapor chamber, shell and electronic device |
| CN113163670A (en) * | 2021-02-24 | 2021-07-23 | 厦门天马微电子有限公司 | Heat-dissipating device, manufacturing method of heat-dissipating device, and electronic equipment |
| CN113218221A (en) * | 2021-03-29 | 2021-08-06 | 江苏精研科技股份有限公司 | Take temperature-uniforming plate of graphene membrane |
| KR102620257B1 (en) * | 2021-07-20 | 2024-01-03 | 주식회사 씨지아이 | Vapor chamber and working fluid used therefor |
| JPWO2024034632A1 (en) * | 2022-08-10 | 2024-02-15 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1707783A (en) * | 2004-06-07 | 2005-12-14 | 鸿富锦精密工业（深圳）有限公司 | A kind of heat pipe and its manufacturing method |
| CN202750388U (en) * | 2012-06-19 | 2013-02-20 | 迈萪科技股份有限公司 | Efficient vapor chamber |
| TW201309997A (en) * | 2011-08-26 | 2013-03-01 | Himanshu Pokharna | Composite material heat pipe and manufacturing method thereof |
| CN203165938U (en) * | 2013-03-15 | 2013-08-28 | 杭州龙尚光电有限公司 | LED (Light-Emitting Diode) superconductive plate |
| CN204217304U (en) * | 2014-11-07 | 2015-03-18 | 游本俊 | A kind of temperature-uniforming plate improving conduction of velocity |
| TW201525399A (en) * | 2013-12-27 | 2015-07-01 | Asia Vital Components Co Ltd | Heat dissipation device |
| CN105101755A (en) * | 2015-08-31 | 2015-11-25 | 新纳科技有限公司 | Heat-conducting structure and heat-dissipation device |
| CN110260697A (en) * | 2019-07-19 | 2019-09-20 | 常州恒创热管理有限公司 | A kind of aluminium base soaking plate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190204020A1 (en) * | 2018-01-03 | 2019-07-04 | Asia Vital Components (China) Co., Ltd. | Manufacturing method of heat dissipation device |
-
2019
- 2019-12-17 CN CN201911304116.3A patent/CN110966882B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1707783A (en) * | 2004-06-07 | 2005-12-14 | 鸿富锦精密工业（深圳）有限公司 | A kind of heat pipe and its manufacturing method |
| TW201309997A (en) * | 2011-08-26 | 2013-03-01 | Himanshu Pokharna | Composite material heat pipe and manufacturing method thereof |
| CN202750388U (en) * | 2012-06-19 | 2013-02-20 | 迈萪科技股份有限公司 | Efficient vapor chamber |
| CN203165938U (en) * | 2013-03-15 | 2013-08-28 | 杭州龙尚光电有限公司 | LED (Light-Emitting Diode) superconductive plate |
| TW201525399A (en) * | 2013-12-27 | 2015-07-01 | Asia Vital Components Co Ltd | Heat dissipation device |
| CN204217304U (en) * | 2014-11-07 | 2015-03-18 | 游本俊 | A kind of temperature-uniforming plate improving conduction of velocity |
| CN105101755A (en) * | 2015-08-31 | 2015-11-25 | 新纳科技有限公司 | Heat-conducting structure and heat-dissipation device |
| CN110260697A (en) * | 2019-07-19 | 2019-09-20 | 常州恒创热管理有限公司 | A kind of aluminium base soaking plate |
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|---|---|
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