CN111385969A - Press-fit connection structure and press-fit connection method between circuit boards - Google Patents
Press-fit connection structure and press-fit connection method between circuit boards Download PDFInfo
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- CN111385969A CN111385969A CN201811631686.9A CN201811631686A CN111385969A CN 111385969 A CN111385969 A CN 111385969A CN 201811631686 A CN201811631686 A CN 201811631686A CN 111385969 A CN111385969 A CN 111385969A
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- circuit board
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- 238000000034 method Methods 0.000 title claims abstract description 43
- 238000003825 pressing Methods 0.000 claims abstract description 47
- 239000002245 particle Substances 0.000 claims abstract description 23
- 239000003292 glue Substances 0.000 claims abstract description 16
- 238000007731 hot pressing Methods 0.000 claims abstract description 8
- 238000007650 screen-printing Methods 0.000 claims description 12
- 208000010727 head pressing Diseases 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 230000008054 signal transmission Effects 0.000 abstract description 6
- 238000010030 laminating Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000012806 monitoring device Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
A press-fit connection structure and a press-fit connection method between circuit boards belong to the technical field of circuit boards. The pressing connection structure between the circuit boards comprises a first circuit board and a second circuit board; a silk screen frame is arranged in the pad area of the first circuit board or the second circuit board; the pad areas of the first circuit board and the second circuit board are pressed together through hot pressing, and the silk screen frame stretches the two circuit boards to enable a gap to be reserved between the two circuit boards when the two circuit boards are pressed, so that the conductive particle glue is ensured to flow and be uniformly distributed on the pads. The method comprises the steps of S01, dispensing and positioning the first circuit board provided with the silk screen frame in the pad area on the base; step S02, attaching the pad area of the second circuit board to the pad area of the first circuit board through hot pressing, and spreading the two circuit boards by the silk-screen frame when the two circuit boards are pressed so as to leave a gap between the two circuit boards; step S03, the press heats and solidifies the glue. The invention is suitable for pressing between circuit boards with or without cover films, the positioning and the fitting between the circuit boards are accurate, and the smooth transmission of signals is ensured.
Description
Technical Field
The invention belongs to the technical field of printed circuit boards, and particularly relates to a pressing connection structure and a pressing connection method between circuit boards.
Background
The camera module is arranged on a mobile phone, a computer, a television, a monitoring device or other digital devices and is used for collecting image information. With the demand for light and thin design, the camera module is also required to be designed to be light and thin. For example, in a mobile phone module, a circuit board between a component and the component is generally connected by a connector, the connector generally has a male socket and a female socket, and the male socket needs to be inserted into the female socket during connection. The connector, such as the connecting buckle, has a certain thickness, occupies a large space, and is inconvenient for designing an ultra-thin mobile phone. Therefore, in the existing mode, an ACF process is adopted to press and connect two circuit boards, so that a connector can be omitted, the arrangement space is saved, and the size of the module is reduced to a certain extent by overlapping and pressing the circuit boards.
The existing circuit boards are connected through an ACF process, and in order to meet the common needs of the ACF process, the circuit boards need to be customized and cannot be provided with cover films. However, in this way, the customized circuit board is time consuming and expensive, and the connection between the circuit boards without the cover films is completed through the ACF, and the existing jig is insufficient in bonding precision and strength in the pressing process, and is easy to peel off and shift. When the circuit board is provided with the covering film, the height of the covering film is 20-30 microns; the maximum jig of the ACF conductive particle jig is 10 microns. When the existing circuit boards are connected in a pressed mode through an ACF process, the conductive particles cannot be crushed due to the existence of the covering film, and the circuit cannot be conducted.
The invention patent CN105472885B discloses a press-fit connection structure of a PCB and a FPC and a manufacturing method thereof, and particularly discloses that the press-fit connection structure comprises the PCB and the FPC, wherein a copper foil layer and a group soldering layer are sequentially arranged on the surface of a base material of the PCB from inside to outside, a pad area is formed at the position of the copper foil layer and the solder mask layer on the base material, a plurality of PCB pads are arranged in the pad area, a plurality of FPC pads are arranged on the FPC, the PCB pads are in press-fit connection with the FPC pads through an ACF process, and the outline dimension of the pad area of the PCB is larger than or equal to the outline dimension of the FPC at the side of the FPC pads. The invention ensures that the ACF is not split between the FPC board and the PCB board due to the height difference of the bonding area after being pressed, ensures the reliability of ACF interconnection between the soft board and the hard board, and improves the ACF process yield and the product quality. However, the invention is limited to the connection between the soft board and the hard board, and the manufacturing method of the connection structure is limited, so that the connection structure is not suitable for the connection between other boards, such as the connection between the hard board and the hard board, and the connection between the soft board and the soft board. In addition, the height difference between the FPC board and the PCB board is still kept, and when the circuit board is provided with the covering film, the problems that the conductive particles cannot be crushed, the circuit cannot be conducted, and signals cannot be transmitted smoothly still exist. In addition, the invention still adopts the existing jig to finish when laminating, and the laminating and positioning accuracy is not enough for one or two or three circuit boards with a double-row or three-row golden finger pad area or a plurality of circuit boards with a row of golden finger pad areas; and the height difference between the two plates makes the alignment, positioning and pressing more difficult. This causes two boards not accurate enough when laminating, and conductive particle distributes on the golden finger pad inhomogeneous, and the signal can't be transmitted smoothly, and the reliability is poor.
Disclosure of Invention
The invention aims to provide a press-fit connection structure and a press-fit connection method between circuit boards, which have the advantages of high bonding precision between the circuit boards, no dislocation offset, high connection strength of the circuit boards, reliable connection between the circuit boards and effective signal transmission, are suitable for connection of various types of circuit boards, are suitable for connection of various pairs of multiple circuit boards, and are also suitable for connection between the circuit boards with or without cover films.
The invention provides a pressing connection structure between circuit boards, which comprises a first circuit board and a second circuit board, wherein the first circuit board is provided with a first connecting hole; a silk screen frame is arranged in the pad area of the first circuit board or the pad area of the second circuit board; the pad region of the first circuit board is connected with the pad region of the second circuit board through hot pressing, and the screen printing frame props the two circuit boards apart when the two circuit boards are pressed so as to leave a gap between the two circuit boards, so that the flow of the conductive particle glue is ensured, and the conductive particles can be uniformly distributed on the pads.
Preferably, one of the first circuit board and the second circuit board is an FPC board, and the other is a PCB board; or, the first circuit board and the second circuit board are both PCB boards; or, the first circuit board and the second circuit board are both FPC boards.
Preferably, the first wiring board and the second wiring board are wiring boards having cover films.
Preferably, the silk screen frame is a closed frame surrounding the bonding pad; or the silk screen frame is an unsealed frame surrounding the outside of the bonding pad.
The invention also provides a press-fit connection method between circuit boards, which comprises the following steps:
step S01, arranging a silk screen frame in the pad area of the first circuit board, and dispensing and positioning the first circuit board on the base;
step S02, attaching the pad area of the second circuit board to the pad area of the first circuit board through hot pressing, and opening the two circuit boards by the silk-screen frame when the two circuit boards are pressed so as to leave a gap between the two circuit boards, thereby ensuring that the conductive particle glue flows and the conductive particles can be uniformly distributed on the pads;
and step S03, heating and curing the glue by the press to obtain a pressing connection structure between the circuit boards.
Preferably, when at least one of the first wiring board and the second wiring board is an FPC board, the method further includes: between steps S03 and S02, a cushion pad is covered on the attached circuit board.
Preferably, one of the first circuit board and the second circuit board is an FPC board, and the other is a PCB board; or, the first circuit board and the second circuit board are both PCB boards; or, the first circuit board and the second circuit board are both FPC boards.
Preferably, the first wiring board and the second wiring board are wiring boards having cover films.
Preferably, before the positioning step of the first circuit board in the step S01 and the positioning step of the second circuit board pressed on the first circuit board in the step S02 are executed, positioning holes are formed in the first circuit board and the second circuit board, and positioning columns are arranged on the base; when the positioning is carried out, the first circuit board is matched and positioned with the base positioning column through the positioning hole of the first circuit board, and the second circuit board is matched and positioned with the base positioning column through the positioning hole of the second circuit board, so that the second circuit board and the first circuit board are positioned and attached.
Preferably, the base is provided with a plurality of air holes near the positioning columns for adsorbing the circuit board on the base.
Preferably, the base is provided with a pressing block for pressing the positioned circuit board.
Preferably, the base is provided with magnets in the length direction of the positioning circuit board respectively, and the magnets are used for assisting the pressing block to be stably attached to the positioned circuit board in a pressing mode.
Preferably, the method is suitable for connection of a single circuit board or a double circuit board or three circuit boards.
Preferably, in the step S02, the two circuit boards are pressed together by using a pressing head, and when the single circuit board is pressed together, the pressing head is a single pressing head; when the double circuit boards are pressed, the pressing head is a double-head pressing head; when the three circuit boards are pressed, the pressure head is a three-head pressure head.
The invention has the following beneficial effects:
according to the press-fit connection structure and the press-fit connection method between the circuit boards, on one hand, the gap between the press-fit circuit boards is increased by utilizing the screen printing frame, so that the conductive adhesive can smoothly flow, and signals can be smoothly transmitted; on the other hand, the height difference problem between the circuit boards is solved by utilizing the screen printing frame and the gap allowing the conductive adhesive to flow, and the high-precision bonding without dislocation and offset can be facilitated; in addition, the cooperation of the positioning holes and the positioning seats which are accurately positioned can ensure that the pressing connection structure between the circuit boards is stable in pressing and free of offset in the pressing process, and the multi-head pressing head is adopted in the mode, so that a pair of circuit boards can be pressed and conducted simultaneously. The invention is suitable for the connection between the hard boards or the soft boards, or the connection between the hard boards and the soft boards, is also suitable for the connection between single-row or multi-row golden finger circuit boards, or the connection between a pair of multiple circuit boards, and has wide application and good universality.
Drawings
Fig. 1 is a schematic structural view of a press-fit connection structure between circuit boards according to the present invention;
fig. 2 is a schematic structural view of the circuit board provided with the screen printing frame in fig. 1;
FIG. 3 is an exploded view of a press-fit connection structure between circuit boards according to the present invention;
FIG. 4 is a schematic structural diagram of a circuit board different from that of FIG. 2;
fig. 5 is a flow chart of an embodiment of a method for press-fit connection between circuit boards according to the present invention;
FIG. 6 is a block diagram of another real-time method for bonding connection between circuit boards according to the present invention;
FIG. 7 is a schematic structural view of the base employed in FIGS. 5 and 6;
FIG. 8 is a schematic diagram of the dual ram utilized in FIGS. 5 and 6;
FIG. 9 is an exemplary illustration of the bonding connection for a pair of two circuit boards of FIG. 8;
FIG. 10 is another illustration of the attachment of FIG. 8 to a pair of two circuit boards;
FIG. 11 is a schematic view of the construction of the triple-headed ram used in FIGS. 5 and 6;
FIG. 12 is an exemplary illustration of the bonding connection of FIG. 11 for a pair of three circuit boards;
fig. 13 is another example of the attachment connection of fig. 11 for a pair of three circuit boards.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
Referring to fig. 1, a press-fit connection structure between circuit boards of the present invention includes a first circuit board 1 and a second circuit board 2. The pad region of the first wiring board 1 has pads 4, and the pad 4 region of the second wiring board 2 has pads. The pads are arranged in a row to form a single-row golden finger pad, and when the pads are arranged in multiple rows, the golden finger pads are arranged in multiple rows. In order to ensure that the conductive particle glue flows between the two pressed circuit boards, the conductive particles 8 can be uniformly distributed on the gold finger bonding pad, and smooth signal transmission is ensured. A screen printing frame 3 is arranged in the pad area of the first circuit board 1 or the pad area of the second circuit board 2, and the screen printing frame can be arranged around the pad as a closed frame or arranged around the pad as an unsealed frame (refer to fig. 2 and 3). The silk screen printing frame has certain height, struts two circuit boards, ensures that a gap is left between the circuit boards, facilitates glue flowing, and solves the problems that the connection between the gapless existing circuit boards cannot enable the glue to flow, and the glue cannot be uniformly distributed on the golden finger pad, so that the reliability of signal transmission is reduced.
Under the structure, for the connection between circuit boards without cover films, the problems of easy cracking, inaccurate and unstable bonding and poor signal reliability (such as the problem shown in CN 105472885B) caused by the height difference existing in the connection between different types of circuit boards are solved; for the connection between circuit boards with covering films, the problem of connection between the circuit boards without the covering films is solved, and the problem that conductive particles cannot crush a conducting circuit due to the fact that the thickness of the covering films is larger than the maximum diameter of an ACF conductive particle jig is also solved. Fig. 1 shows that the circuit board has cover films 7, and the screen printing frame 3 is located between the cover films 7 on the outermost sides of the circuit boards which are attached to each other.
The invention is suitable for the press connection of circuit boards of different types, for example, one of the first circuit board and the second circuit board is an FPC board, and the other is a PCB board; or, the first circuit board and the second circuit board are both PCB boards; or, the first circuit board and the second circuit board are both FPC boards. The invention is also suitable for the press connection of a single circuit board and a pair of multiple circuit boards, and the joint connection between the single circuit boards comprises the joint connection between the single circuit boards with single rows of golden fingers and double rows of golden fingers. The press-fit connection of the two circuit boards comprises the bonding between the two circuit boards with a single row of golden fingers (refer to fig. 9) and the bonding between the two circuit boards with a double row of golden fingers (refer to fig. 10). The press-fit connection of the pair of three circuit boards includes the fitting of three circuit boards with a single row of golden fingers (refer to fig. 12) and the fitting of three circuit boards with double rows of golden fingers (refer to fig. 13).
The press-fit connection structure between the circuit boards can be realized by adopting the press-fit connection method between the circuit boards. Fig. 5 illustrates a method for press-fit connection between circuit boards, according to an embodiment, the method includes:
step S01, arranging a silk screen frame in the pad area of the first circuit board, and dispensing and positioning the first circuit board on the base;
step S02, attaching the pad area of the second circuit board to the pad area of the first circuit board through hot pressing, and opening the two circuit boards by the silk-screen frame when the two circuit boards are pressed so as to leave a gap between the two circuit boards, thereby ensuring that the conductive particle glue flows and the conductive particles can be uniformly distributed on the pads;
and step S03, heating and curing the glue by the press to obtain a pressing connection structure between the circuit boards.
In step S01, the first circuit board is provided with a screen frame of a different form according to fig. 2 or fig. 4. After the first circuit board is dispensed, for example, by thermosetting, it is positioned on the base 5 (see fig. 7). In order to ensure the precise and non-offset bonding connection between the two circuit boards, before the pressing, a positioning hole 11 is formed on the first circuit board 1, and a positioning column 51 is arranged on the base (see fig. 7). The first circuit board 1 is positioned by the positioning holes 11, and is matched and positioned with the base positioning columns 51.
In step S02, due to the existence of the screen printing frame, a gap is left between the first and second circuit boards to provide a flowing space for the flowing of the conductive particles, so as to ensure that the conductive particles can be uniformly distributed on the gold finger pads and ensure the smooth transmission of signals. The thickness of silk screen printing frame and clearance thickness have solved the difference in height problem of connecting between different circuit boards for difficult emergence skew between the circuit board during the pressfitting, even if have, also can reprocess through adjusting clearance distance. In order to further improve the positioning accuracy, prevent the laminating skew. Before pressing, the second circuit board 2 is provided with a positioning hole 21, and the positioning hole 21 of the second circuit board is matched and positioned with the base positioning column 51, so that the second circuit board 2 and the first circuit board 1 are positioned and attached.
As shown in fig. 7, the base 5 is designed to further improve the positioning accuracy. For example, the base is provided with a plurality of air holes 52 near the positioning posts 51 for attaching the circuit board to the base. The air holes 52 are provided in a plurality and may be arranged in an array. And a pressing block 53 is arranged on the base 5 and used for pressing the positioned circuit board to ensure that the circuit board cannot warp. Because the pressing block 53 may have the problem that the circuit board is dislocated due to the displacement of the pressing block when pressed, the base 5 is respectively provided with magnets 54 in the length direction of the positioning circuit board thereof for assisting the pressing block 53 to be stably pressed on the positioned circuit board. Namely, the two magnets shown in the figure are respectively arranged at the two ends of the base 5, and the two ends are positioned and adsorbed to lock the pressing block without deviation.
In step S02, the two circuit boards are pressed together by the pressing head 6. When the single circuit board is pressed, the pressing head is a single pressing head which is of a conventional pressing head structure and is mainly used for bonding connection between the single circuit boards with single-row golden fingers or double-row golden fingers. When the double circuit boards are pressed, as shown in figures 8-10, the press head is a double-head press head. As shown in fig. 11-13, when the three circuit boards are pressed together, the pressing head is a three-head pressing head. When the method is used for pressing by using the pressing head, simultaneous connection and conduction of a pair of multiple circuit boards can be realized at one time, connection and conduction of single-row golden finger circuit boards and double-row golden finger circuit boards are realized at one time, on one hand, the pressing force is uniform, the laminating precision is high, the circuit board impedance is stable, the signal transmission reliability is high, and on the other hand, the process efficiency is improved.
The method is suitable for the press connection between hard boards, soft boards and between the hard boards and the soft boards, and when the soft boards exist in the circuit board, the press connection method between the circuit boards in another embodiment is shown in figure 6. The method comprises the following steps:
step S01', arranging a silk screen frame in the pad area of the first circuit board, and dispensing and positioning the first circuit board on the base;
step S02', the pad area of the second circuit board is attached to the pad area of the first circuit board through hot pressing, and the screen printing frame props the two circuit boards apart when the two circuit boards are pressed so as to leave a gap between the two circuit boards, thereby ensuring that the conductive particle glue flows and the conductive particles can be uniformly distributed on the pads;
step S03', a cushion pad is covered on the bonded circuit board.
And step S04', heating and curing the glue by the press to obtain a pressing connection structure between the circuit boards.
Before utilizing this press pressfitting solidification, adopt the blotter to slow down pressure head pressure, more importantly can avoid the circuit inter-plate to connect the problem emergence of pressfitting thickness inequality, skew appearing with pressure evenly distributed.
The pressfitting connection structure between the circuit boards manufactured by the pressfitting connection method between the circuit boards is accurate in fitting, free of dislocation and deviation, stable in circuit board impedance, compact in structure after connection and high in bearing capacity during stripping, for example, when 90 degrees, the force required for stripping is larger than 48N, and when 180 degrees, the force required for stripping is larger than 16N. In addition, the method can be flexibly arranged according to the module space under the application, for example, a long-size module can be divided into two sections, the circuit board is attached to the module through the method, the size of the module is artificially lengthened, and the design requirement is met.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the present invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.
Claims (14)
1. A press-fit connection structure between circuit boards is characterized by comprising a first circuit board and a second circuit board; a silk screen frame is arranged in the pad area of the first circuit board or the pad area of the second circuit board; the pad region of the first circuit board is connected with the pad region of the second circuit board through hot pressing, and the screen printing frame props the two circuit boards apart when the two circuit boards are pressed so as to leave a gap between the two circuit boards, so that the flow of the conductive particle glue is ensured, and the conductive particles can be uniformly distributed on the pads.
2. The structure of claim 1, wherein one of the first circuit board and the second circuit board is an FPC board, and the other is a PCB board; or, the first circuit board and the second circuit board are both PCB boards; or, the first circuit board and the second circuit board are both FPC boards.
3. The structure of claim 2, wherein the first circuit board and the second circuit board are circuit boards having cover films.
4. A press-fit connection structure between circuit boards according to claim 1, wherein the screen frame is a closed frame surrounding the outside of the bonding pad; or the silk screen frame is an unsealed frame surrounding the outside of the bonding pad.
5. A method for press-fit connection between circuit boards is characterized by comprising the following steps:
step S01, arranging a silk screen frame in the pad area of the first circuit board, and dispensing and positioning the first circuit board on the base;
step S02, attaching the pad area of the second circuit board to the pad area of the first circuit board through hot pressing, and opening the two circuit boards by the silk-screen frame when the two circuit boards are pressed so as to leave a gap between the two circuit boards, thereby ensuring that the conductive particle glue flows and the conductive particles can be uniformly distributed on the pads;
and step S03, heating and curing the glue by the press to obtain a pressing connection structure between the circuit boards.
6. The method of claim 5, wherein when at least one of the first circuit board and the second circuit board is an FPC board, the method further comprises: between steps S03 and S02, a cushion pad is covered on the attached circuit board.
7. The method as claimed in claim 5, wherein one of the first and second circuit boards is an FPC board, and the other is a PCB board; or, the first circuit board and the second circuit board are both PCB boards; or, the first circuit board and the second circuit board are both FPC boards.
8. The method as claimed in claim 7, wherein the first and second circuit boards are circuit boards having cover films.
9. The method as claimed in claim 5, wherein before the positioning step of the first circuit board in step S01 and the positioning step of the second circuit board in step S02 before the pressing step of the first circuit board, positioning holes are formed on the first circuit board and the second circuit board, and positioning posts are disposed on the base; when the positioning is carried out, the first circuit board is matched and positioned with the base positioning column through the positioning hole of the first circuit board, and the second circuit board is matched and positioned with the base positioning column through the positioning hole of the second circuit board, so that the second circuit board and the first circuit board are positioned and attached.
10. The method as claimed in claim 9, wherein the base has a plurality of air holes near the positioning posts for attaching the circuit board to the base.
11. A method as claimed in claim 9, wherein the base has a pressing block for pressing the circuit board after positioning.
12. A press-fit connecting method between circuit boards according to claim 11, wherein the base is provided with magnets in the longitudinal direction of the circuit board to assist the pressing block to be stably pressed against the positioned circuit board.
13. A method as claimed in claim 5, wherein the method is adapted for connection between a single circuit board or a double circuit board or three circuit boards.
14. A method as claimed in claim 13, wherein the bonding between the two circuit boards in step S02 is performed by using a pressing head, and when the single circuit board is bonded, the pressing head is a single pressing head; when the double circuit boards are pressed, the pressing head is a double-head pressing head; when the three circuit boards are pressed, the pressure head is a three-head pressure head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811631686.9A CN111385969A (en) | 2018-12-29 | 2018-12-29 | Press-fit connection structure and press-fit connection method between circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811631686.9A CN111385969A (en) | 2018-12-29 | 2018-12-29 | Press-fit connection structure and press-fit connection method between circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111385969A true CN111385969A (en) | 2020-07-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811631686.9A Pending CN111385969A (en) | 2018-12-29 | 2018-12-29 | Press-fit connection structure and press-fit connection method between circuit boards |
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| CN (1) | CN111385969A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090039495A1 (en) * | 2005-10-05 | 2009-02-12 | Sharp Kabushiki Kaisha | Wiring substrate and display device including the same |
| US20090085227A1 (en) * | 2005-05-17 | 2009-04-02 | Matsushita Electric Industrial Co., Ltd. | Flip-chip mounting body and flip-chip mounting method |
| CN101621011A (en) * | 2008-07-02 | 2010-01-06 | 松下电器产业株式会社 | Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates |
| CN107785690A (en) * | 2016-08-26 | 2018-03-09 | 三星显示有限公司 | Coupling unit |
-
2018
- 2018-12-29 CN CN201811631686.9A patent/CN111385969A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090085227A1 (en) * | 2005-05-17 | 2009-04-02 | Matsushita Electric Industrial Co., Ltd. | Flip-chip mounting body and flip-chip mounting method |
| US20090039495A1 (en) * | 2005-10-05 | 2009-02-12 | Sharp Kabushiki Kaisha | Wiring substrate and display device including the same |
| CN101621011A (en) * | 2008-07-02 | 2010-01-06 | 松下电器产业株式会社 | Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates |
| CN107785690A (en) * | 2016-08-26 | 2018-03-09 | 三星显示有限公司 | Coupling unit |
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Application publication date: 20200707 |