CN111371975A - Camera module packaging structure - Google Patents

Abstract

The present invention provides a camera module package structure, comprising a photosensitive element, a substrate and a camera element, the photosensitive element has a plurality of first solder joints, the substrate has a accommodating portion and a plurality of second solder joints disposed in the accommodating portion The photosensitive element is arranged in the accommodating portion, the plurality of first and second solder joints correspond to each other and are electrically connected through a plurality of wires, and the photosensitive element and the surrounding inner wall of the accommodating portion are spaced by a gap for filling A glue material, the camera element is fixedly combined on the substrate corresponding to the accommodating part; the total height of the camera module can be reduced, and the image effect of the camera module can be increased.

Description

Camera module package structure

technical field

The invention relates to a package structure, in particular to a camera module package structure.

Background technique

At present, there are the following three packaging processes in the field of camera module manufacturing: 1. CSP (Chip ScalePackage) process; 2. Flip Chip process; 3. COB (Chip On Board) process.

1. The CSP process adds a glass protective layer on the bare wafer, but when the light penetrates the glass protective layer, it will cause slight refraction, reflection and energy loss, resulting in poor image quality. 2. Flip Chip process is difficult for most manufacturers to adopt this process due to the complex process and high cost. 3. The COB process is popularized due to the low price of photosensitive elements and the mature technology. There are two bonding processes in the post-process of the COB packaging process, namely: 1. Hot Bar (solder paste hot pressing), 2. ACF (anisotropic conductive paste hot pressing)/ACP (anisotropic conductive paste hot pressing) .

However, 1.Hot Bar has basically been unadopted due to its low reliability; and 2.ACF/ACP needs to purchase additional equipment, which makes the cost soar, so that the existing COB process cannot further reduce the height of the camera module.

In addition, the photosensitive element is embedded in the substrate by a tight fitting method. However, this fixing method relies on friction, the fixing effect is not good, and debris and dust are generated during the installation process. The debris and dust not only It will contaminate the surface of the photosensitive element, resulting in poor image quality, more likely to cause a short circuit on the substrate, and the solder joints of the substrate or the photosensitive element may also be damaged during the installation of the photosensitive element.

Therefore, as the current electronic equipment is getting lighter, thinner and shorter, how to improve the current camera module packaging process to reduce the overall height of the camera module, reduce the risk of contamination of the bare chip, facilitate process control, improve the pass rate and increase the number of cameras The image effect of the module has a good fixed effect, which is the direction that researchers in this field should strive for.

SUMMARY OF THE INVENTION

One object of the present invention is to reduce the overall height of the camera module.

Another object of the present invention is to prevent the sizing material from remaining on the surface of the photosensitive element or the substrate, thereby increasing the image effect of the camera module.

Another object of the present invention is to improve the stability of the combination of the camera modules.

In order to achieve the above object, the present invention provides a camera module packaging structure, which is characterized by comprising:

a photosensitive element with a plurality of first solder joints;

A substrate has an accommodating portion and a plurality of second solder joints, the plurality of second solder joints are arranged around the accommodating portion, the photosensitive element is arranged in the accommodating portion, the plurality of first solder joints, the plurality of second solder joints The dots correspond to each other and are electrically connected by a plurality of wires, the photosensitive element and the inner wall surface around the accommodating portion are spaced by a gap, and the gap is used for filling a glue; and

An imaging element, corresponding to the accommodating portion, is fixedly combined on the base plate.

In the camera module package structure, the glue fills the gap to fix the photosensitive element.

In the packaging structure of the camera module, a plurality of glue inlets are arranged around the accommodating part to communicate with the gap, and the glue material is filled into the gap from the plurality of glue inlets.

The said camera module package structure, wherein the accommodating part has a window area around the periphery, a solder resist layer is provided on the outer surface of the substrate and does not cover the accommodating part and the area set in the window area, the plurality of second soldering The point is set in the windowed area.

In the camera module package structure, the surface of the window area is lower than the surface of the solder resist layer.

In the camera module package structure, the accommodating portion is any one of a groove and a through hole, the groove is recessed inward from the substrate, and the through hole penetrates through the substrate.

In the camera module package structure, the substrate is any one of a printed circuit board and a flexible circuit board.

The camera module package structure further includes a filter, which is arranged on the side of the camera element opposite to the photosensitive element.

In the packaging structure of the camera module, the filter is any one of an infrared filter and a visible filter.

The camera module package structure further includes an adhesive layer, which is disposed on the side of the substrate opposite to the camera element.

With the design of the present invention, the overall height of the camera module can be reduced, the fixing effect is better, and the glue will not remain on the surface of the photosensitive element or the substrate, thereby increasing the image effect of the camera module.

Description of drawings

1 is an exploded perspective view of an embodiment of a camera module packaging structure of the present invention;

FIG. 2 is a three-dimensional combined view of an embodiment of the camera module packaging structure of the present invention;

FIG. 3 is a top plan view of an accommodating portion of an embodiment of a camera module packaging structure of the present invention;

4 is a cross-sectional view taken along line A-A of FIG. 2 of the camera module packaging structure of the present invention;

5 is a schematic diagram of the glue filling of the camera module packaging structure of the present invention;

6 is a cross-sectional view of an alternative embodiment of the camera module packaging structure of the present invention.

Reference numeral description: photosensitive element 1; wire 4; first solder joint 11; filter 5; substrate 2; adhesive layer 6; accommodating part 21; inner wall surface 211; 214 ; the second solder joint 22 ; the window area 23 ; the solder resist layer 24 ; the camera element 3 .

Detailed ways

The above objects of the present invention and their structural and functional characteristics will be described with reference to the preferred embodiments of the accompanying drawings.

Please refer to FIG. 1 to FIG. 5 , which are an exploded perspective view, a three-dimensional combined view, a top view of an accommodating portion of an embodiment, a cross-sectional view along line A-A of FIG. As shown, the camera module package structure of the present invention includes a photosensitive element 1 , a substrate 2 and a camera element 3 .

The photosensitive element 1 has a plurality of first solder joints 11, and the photosensitive element 1 is selected as a photosensitive coupling element (Charge-Coupled device, CCD) and a complementary metal-oxide-semiconductor active pixel sensor (ComplementaryMetal-Oxide-Semiconductor Active pixel sensor, CMOS) either.

The substrate 2 has an accommodating portion 21 , a plurality of second solder joints 22 , a window area 23 and a solder resist layer 24 . The substrate 2 is a printed circuit board, but is not limited to this. In other embodiments, the substrate 2 can also be a flexible circuit board.

The photosensitive element 1 is disposed in the accommodating portion 21 , and the photosensitive element 1 can be fixed in the accommodating portion 21 by dispensing or pasting with double-sided tape. The accommodating portion 21 is a groove recessed from the substrate 2 inward, but not limited to this. In other embodiments, the accommodating portion 21 may also be a through hole penetrating the substrate 2 (as shown in FIG. 6 ). ).

The plurality of second solder joints 22 are disposed around the accommodating portion 21 , the plurality of first and second solder joints 11 , 22 correspond to each other and are electrically connected through a plurality of wires 4 . The plurality of wires 4 are gold wires, but not limited to Here, in other embodiments, the plurality of wires 4 can also be wires made of other materials.

The photosensitive element 1 is separated from the inner wall surface 211 of the accommodating portion 21 by a gap 212 , and the accommodating portion 21 has a plurality of glue inlets 213 around the accommodating portion 21 to communicate with the gap 212 . The gaps 212 have the same width around them, and the gaps 212 are filled with a glue 214 . The glue 214 is epoxy resin or the like, and the glue 214 is filled from the plurality of glue inlets 213 . into the gap 212, and the glue 214 is evenly filled into the gap 212, and then baked and cured to fix the photosensitive element 1. The plurality of glue inlets 213 are six glue inlets 213 in this embodiment. In other embodiments, there may be any two or more glue inlets 213 . In addition, the sizing material 214 can be more uniformly distributed by filling the sizing material 214 simultaneously through the plurality of glue feeding ports 213 .

The window area 23 is disposed around the accommodating portion 21 , and the plurality of second solder joints 22 are disposed in the window area 23 .

The solder resist layer 24 is disposed on the outer surface of the substrate 2 and does not cover the area where the accommodating portion 21 and the opening area 23 are disposed, the plurality of second solder joints 22 are exposed from the opening area 23 , and the opening area 23 The surface is lower than the surface of the solder resist layer 24, and the solder resist layer 24 is an insulating and solder resist ink.

The camera element 3 is fixedly coupled to the substrate 1 corresponding to the accommodating portion 21 . In fact, the camera element 3 can be suspended and aligned with the accommodating portion 21 and the accommodating portion 21 through an Active Alignment process. The photosensitive element 1 is glued and fixed between the substrate 2 and the imaging element 3 after alignment, and the imaging element 3 is an integrated lens.

In one implementation, the camera module package structure further includes a filter 5 disposed on the side of the camera element 3 opposite to the photosensitive element 1, and the filter 5 is selected as an infrared filter and a visible filter. Any one of the optical filters, and in an alternative implementation, the optical filter 5 may be omitted.

In another implementation, the camera module package structure further includes an adhesive layer 6 disposed on the side of the substrate 2 opposite to the camera element 3 , and in an alternative implementation, the adhesive layer 6 may be omitted.

With this design of the present invention, since the photosensitive element 1 is disposed in the accommodating portion 21 , the overall height of the camera module can be reduced. In addition, since the gap 212 between the photosensitive element 1 and the accommodating portion 21 can be filled with the glue material 214 evenly to fix the photosensitive element 1, the fixing effect is better, so that the glue material 214 will not remain on the photosensitive element 1 or the substrate. 2 surface, which can increase the image effect of the camera module.

The above description is only illustrative rather than restrictive for the present invention. Those skilled in the art understand that many modifications, changes or equivalents can be made without departing from the spirit and scope defined by the claims. All will fall within the protection scope of the present invention.

Claims (10)

1. A camera module package structure, comprising:

a photosensitive element having a plurality of first solder points;

a substrate having a containing portion and a plurality of second solder points, wherein the plurality of second solder points are disposed around the containing portion, the photosensitive element is disposed in the containing portion, the plurality of first solder points and the plurality of second solder points are corresponding to each other and electrically connected through a plurality of wires, a gap is formed between the photosensitive element and the inner wall surface of the containing portion, and the gap is used for filling a glue material; and

and the image pickup element is fixedly combined on the substrate corresponding to the accommodating part.

2. The camera module package of claim 1, wherein the adhesive fills the gap to fix the photosensitive element.

3. The camera module package according to claim 2, wherein the receiving portion has a plurality of glue inlets formed at a periphery thereof to communicate with the gap, and the glue is filled into the gap from the plurality of glue inlets.

4. The camera module package structure of claim 1, wherein the receiving portion has a window area at a periphery thereof, a solder mask layer is disposed on an outer surface of the substrate and does not cover the receiving portion and an area where the window area is disposed, and the plurality of second solder bumps are disposed in the window area.

5. The camera module package of claim 4, wherein the surface of the windowed area is lower than the surface of the solder mask layer.

6. The camera module package of claim 1, wherein the accommodating portion is one of a groove and a through hole, the groove is recessed from the substrate, and the through hole penetrates through the substrate.

7. The camera module package of claim 1, wherein the substrate is any one of a printed circuit board and a flexible circuit board.

8. The camera module package of claim 1, further comprising a filter disposed on a side of the camera element opposite to the light-sensing element.

9. The camera module package of claim 8, wherein the filter is any one of an infrared filter and a visible light filter.

10. The camera module package of claim 1, further comprising a backside adhesive layer disposed on a side of the substrate opposite the camera element.

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