CN111293208A - Carrier device for infrared emitting diodes - Google Patents
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- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
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- H—ELECTRICITY
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- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
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Abstract
本发明涉及一种用于红外线发射二极体的载体装置,主要包括一底部载体、一侧墙以及一反射部,所述侧墙设置并环绕所述底部载体的顶部,且所述反射部设置于所述侧墙的内墙,并产生至少一反射光,其中,所述至少一反射光的半角等于或小于15度,由此,本发明的用于红外线发射二极体的载体装置,可使红外线发射二极体实现多种的光场配置,达到提升红外线发射二极体应用领域以及使用便利性的功效。
The invention relates to a carrier device for infrared emitting diodes, which mainly includes a bottom carrier, a side wall and a reflection part, the side wall is arranged and surrounds the top of the bottom carrier, and the reflection part is arranged On the inner wall of the side wall, at least one reflected light is generated, wherein the half angle of the at least one reflected light is equal to or less than 15 degrees. Therefore, the carrier device for infrared emitting diodes of the present invention can The infrared emitting diode realizes various light field configurations, so as to achieve the effect of improving the application field of the infrared emitting diode and the convenience of use.
Description
技术领域technical field
本发明涉及一种载体装置,尤指一种用于红外线发射二极体的载体装置。The present invention relates to a carrier device, in particular to a carrier device for infrared emitting diodes.
背景技术Background technique
红外线二极体因具有省电、反应速度快、寿命长、体积小等优势,其广泛应用于读取、通信或感测等领域,例如信号传输、夜间监控等应用。Due to the advantages of power saving, fast response, long life and small size, infrared diodes are widely used in reading, communication or sensing fields, such as signal transmission, night monitoring and other applications.
习知的红外线二极体元件(如红外线晶片)会根据其所应用的领域或产品,搭配透镜来形成特定的光场图案,以满足市场的需求。A conventional infrared diode device (such as an infrared chip) is matched with a lens to form a specific light field pattern according to the application field or product, so as to meet the needs of the market.
然而,由于红外线二极体元件所发射的光线通常具有全角为120~140度之间的特性,较大的角度导致红外线二极体元件所发射的光线所能形成的光场图案较少(例如:较雷射二极体少),进而限制了红外线二极体元件所能应用的领域及产业。However, since the light emitted by the infrared diode element usually has the characteristic of having a full angle between 120 and 140 degrees, a larger angle results in less light field patterns formed by the light emitted by the infrared diode element (for example, : less than laser diodes), which limits the fields and industries that infrared diode components can be applied to.
发明内容SUMMARY OF THE INVENTION
鉴于上述现有技术的不足,本发明的主要目的在于提供一种用于红外线发射二极体的载体装置,以产生其半角等于或小于15度的反射光,由此实现更多元的光场图案配置,从而提升红外线发射二极体应用领域以及使用便利性。In view of the above-mentioned deficiencies of the prior art, the main purpose of the present invention is to provide a carrier device for infrared emitting diodes, so as to generate reflected light with a half angle equal to or less than 15 degrees, thereby realizing a more diverse light field Pattern configuration, thereby improving the application field of infrared emitting diodes and the convenience of use.
为达成上述目的,本发明所采取的主要技术手段是:提供一种用于红外线发射二极体的载体装置,其包括:In order to achieve the above-mentioned purpose, the main technical means adopted by the present invention are: to provide a carrier device for infrared emitting diodes, which includes:
一底部载体;a bottom carrier;
一侧墙,设置并环绕该底部载体的顶部;以及a side wall positioned and surrounding the top of the bottom carrier; and
一反射部,设置于所述侧墙的内墙,并产生至少一反射光,其中,所述至少一反射光的半角等于或小于15度。A reflecting portion is disposed on the inner wall of the side wall and generates at least one reflected light, wherein the half angle of the at least one reflected light is equal to or less than 15 degrees.
在一较佳实施例中,所述载体装置还包括一电极部,该电极部与所述底部载体的底部连接,且用于与一外部控制电路电连接。In a preferred embodiment, the carrier device further includes an electrode portion connected to the bottom of the bottom carrier and used for electrical connection with an external control circuit.
在一较佳实施例中,所述底部载体的材料为陶瓷、金属或玻璃纤维。In a preferred embodiment, the material of the bottom carrier is ceramic, metal or glass fiber.
在一较佳实施例中,所述侧墙的材料为金属、陶瓷、塑料或具有反射涂层的塑料。In a preferred embodiment, the material of the side wall is metal, ceramic, plastic or plastic with reflective coating.
在一较佳实施例中,所述侧墙在所述底部载体的顶部形成一反射腔。In a preferred embodiment, the sidewalls form a reflective cavity on top of the bottom carrier.
在一较佳实施例中,所述反射部面对所述反射腔的一侧为圆弧状。In a preferred embodiment, a side of the reflecting portion facing the reflecting cavity is arc-shaped.
在一较佳实施例中,所述圆弧状的弧度为0.2至1之间。In a preferred embodiment, the radian of the circular arc is between 0.2 and 1.
在一较佳实施例中,所述反射光的半角为4至15度之间。In a preferred embodiment, the half angle of the reflected light is between 4 and 15 degrees.
在一较佳实施例中,所述反射部的材料为金属。In a preferred embodiment, the material of the reflecting portion is metal.
本发明的载体装置由所述反射部,而可产生半角等于或小于15度的反射光,由此,搭配本发明的载体装置的红外线发射二极体,可实现更多元的光场图案配置,有效达到提升红外线发射二极体应用领域以及使用便利性的功效。The carrier device of the present invention can generate reflected light with a half angle equal to or less than 15 degrees due to the reflection portion. Therefore, with the infrared emitting diodes of the carrier device of the present invention, more diverse light field pattern configurations can be realized. , effectively achieve the effect of improving the application field of infrared emitting diodes and the convenience of use.
附图说明Description of drawings
图1为根据本发明实施例的载体装置的架构架构示意图;FIG. 1 is a schematic structural diagram of a carrier device according to an embodiment of the present invention;
图2为根据本发明实施例的载体装置的另一架构示意图;2 is another schematic structural diagram of a carrier device according to an embodiment of the present invention;
图3为根据本发明实施例的红外线发射二极体装置的架构示意图;3 is a schematic structural diagram of an infrared emitting diode device according to an embodiment of the present invention;
图4为根据本发明实施例的红外线发射二极体装置的光场图案实施例一示意图;4 is a schematic diagram of Embodiment 1 of a light field pattern of an infrared emitting diode device according to an embodiment of the present invention;
图5为根据本发明实施例的红外线发射二极体装置的光场图案实施例二示意图;以及5 is a schematic diagram of a second embodiment of a light field pattern of an infrared emitting diode device according to an embodiment of the present invention; and
图6为根据本发明实施例的红外线发射二极体装置的光场图案实施例三示意图。6 is a schematic diagram of Embodiment 3 of a light field pattern of an infrared emitting diode device according to an embodiment of the present invention.
附图标记:Reference number:
100——载体装置 110——底部载体100 - Carrier device 110 - Bottom carrier
111——顶部 112——底部111 - Top 112 - Bottom
120——侧墙 121——顶部120 - Side Wall 121 - Top
122——底部 123——反射腔122 - Bottom 123 - Reflector
130——反射部 140——电极部130——
200——红外线二极体元件 300——透镜200 - Infrared diode element 300 - Lens
1000——红外线发射二极体装置1000 - Infrared emitting diode device
具体实施方式Detailed ways
为充分了解本发明的目的、特征及功效,在此借由下述具体实施例,并结合附图,对本发明做详细说明,说明如下:In order to fully understand the purpose, features and effects of the present invention, the present invention is described in detail by the following specific embodiments and in conjunction with the accompanying drawings, and is described as follows:
关于本发明用于红外线发射二极体的载体装置的较佳实施例,如图1所示,载体装置100包括一底部载体110、一侧墙120、一反射部130以及一电极部140,其中,载体装置100用于承载一红外线发射二极体元件以及一光学元件。Regarding the preferred embodiment of the carrier device for infrared emitting diodes of the present invention, as shown in FIG. 1 , the
底部载体110具有一顶部111以及一底部112,顶部111用于承载侧墙120、反射部130以及红外线发射二极体元件(图未示),底部112与电极部140连接,由此,所述红外线发射二极体元件可透过底部载体110与电极部140电性连接,以接收一外部控制电路(例如:驱动电路)所提供的控制信号。The
侧墙120具有一顶部121以及一底部122,底部122环绕并连接底部载体110的顶部111,并与底部载体110的顶部111形成一反射腔123。The
反射部130设置于侧墙120的内墙,并与侧墙120的内墙连接。反射部130用于反射该红外线发射二极体元件所发射的光线,以产生对应的反射光,其中,所述反射光的半角等于或小于15度。The
由此,所述红外线发射二极体元件可透过载体装置100接收所述控制信号并据以发光,且载体装置100可将所述红外线发射二极体元件所发射的光线调整为半角等于或小于15度的反射光,进而使反射光的可调整范围增大,因此可实现更多元的光场图案配置,使载体装置100可应用于不同市场需求,有效达到提升应用领域以及使用便利性的功效。Thus, the infrared emitting diode element can receive the control signal through the
在本较佳实施例中,所述反射光的半角较佳为4~15度之间。In this preferred embodiment, the half angle of the reflected light is preferably between 4 and 15 degrees.
在本较佳实施例中,底部载体110的材料为陶瓷(氧化铝、氮化铝等)、金属(铜、镍、钯、金等)或玻璃纤维(FR-4、G10等),且本发明不以此为限制。In this preferred embodiment, the material of the
在本较佳实施例中,底部载体110可涂布有金属材料。In this preferred embodiment, the
在本较佳实施例中,所述红外线发射二极体元件可透过底部载体110涂布的金属材料与电极部140电性连接;在其他实施例中,所述红外线发射二极体元件可透过底部载体110的导电通孔(图未示)与电极部140电性连接,且本发明不以此为限制。In this preferred embodiment, the infrared emitting diode element can be electrically connected to the
在本较佳实施例中,侧墙120的材料为金属、陶瓷、塑料(例如:PPA树脂、LEP等)或具有反射涂层的塑料,所述反射涂层的材料可为金属,且本发明不以此为限制。In this preferred embodiment, the material of the
在本较佳实施例中,随着反射部130越接近底部载体110的顶部111,反射部130的厚度越厚,且反射部130面对反射腔123的一侧为圆弧状,使得反射腔123大约为碗状。In this preferred embodiment, as the
在本较佳实施例中,所述圆弧状的弧度为0.2至1之间,即角度为11.5度至57.3度之间。In this preferred embodiment, the radian of the arc shape is between 0.2 and 1, that is, the angle is between 11.5 degrees and 57.3 degrees.
在一较佳实施例中,所述圆弧状的弧度为0.24,即角度为14度;在另一较佳实施例中,所述圆弧状的弧度为0.97,即角度为56度。In a preferred embodiment, the radian of the circular arc is 0.24, that is, the angle is 14 degrees; in another preferred embodiment, the radian of the circular arc is 0.97, that is, the angle is 56 degrees.
在本较佳实施例中,反射部130的材料为金属(金、银等),且本发明不以此为限制。In this preferred embodiment, the material of the reflecting
在本较佳实施例中,底部载体110、侧墙120以及反射部130可由黏着剂彼此黏着固定,且本发明不以此为限制。In this preferred embodiment, the
在一实施例中,底部载体110、侧墙120以及反射部130可一体成型((如图2所示),因此,在此实施例中,底部载体110、侧墙120以及反射部130具有相同的材质。In one embodiment, the
在本较佳实施例中,底部载体110可以为圆形、椭圆形、四边形或多边形的其中之一,侧墙120对应于底部载体110而形成圆形、椭圆形、四边形或多边形的开口,且本发明不以此为限制。In this preferred embodiment, the
所述开口的尺径可根据该开口的实施态样(圆形、椭圆形、四边形或多边形)而为长度、宽度、面积、直径或长轴,且本发明不以此为限制。The dimension of the opening can be length, width, area, diameter or major axis according to the implementation form of the opening (circle, ellipse, quadrangle or polygon), and the present invention is not limited thereto.
图3为本发明的载体装置100用于实现红外线发射二极体装置的较佳实施例,红外线发射二极体装置1000包括一载体装置100、一红外线二极体元件200(例如红外线晶片)以及一透镜300。3 is a preferred embodiment of the
载体装置100用于容置并承载红外线二极体元件200,例如,红外线二极体元件200位于反射腔123中,并配置于底部载体110的顶部111,其中红外线二极体元件200用于根据接收的控制信号进行发光。同时,载体装置100还用于承载透镜300,例如,透镜300作为前述的光学元件,还配置于侧墙120的顶部121,其中透镜300用以改变接收的光线的光场。The
由此,红外线二极体元件200所发射的光线,透过反射部130的反射,可产生半角等于或小于15度(较佳为半角4~15之间)且往透镜300方向反射的反射光,该反射光通过透镜300后,可产生半角为4度~70度之间的光线,换言之,红外线发射二极体装置1000所产生的光线半角可为4度~70度之间。由于该反射光具有较广泛的调整范围,例如:本发明的红外线发射二极体装置1000的调整范围可为4度~70度,而熟知的红外线发射二极体装置的调整范围为120度~140度,因此本发明的红外线发射二极体装置1000可实现无法由熟知的红外线发射二极体装置实现的光场图案,如图4~图6所示,其中,图4为光场图案实施例一示意图;图5为光场图案实施例二示意图;图6为光栅光的光场图案实施例三示意图,因此本发明的红外线发射二极体装置1000可实现多样的光场图案配置,有效达到提升应用领域以及使用便利性的功效。Therefore, the light emitted by the
举例来说,由于应用本发明的载体装置100的红外线发射二极体装置1000可产生半角为4度~70度之间的光线,因此可实现以雷射二极体装置(例如:垂直共振腔面射雷射)所实现的光场图案,即,应用本发明的载体装置100的红外线发射二极体装置1000可用以替代现有的雷射二极体装置。此外,由于红外线发射二极体的成本低于雷射二极体,此外本发明的透镜300可以现有透镜产品来实现,又红外线光不会如雷射光般对人眼产生伤害,红外线光在透镜意外脱落的情况不会伤害人眼,因此应用本发明的载体装置100的红外线发射二极体装置1000不仅可应用于人脸辨识等深度感测(或立体影像感测)领域,其相较于雷射二极体装置还具有降低成本以及提升使用安全性的功效。For example, since the infrared emitting
在本较佳实施例中,透镜300为一绕射光学透镜(Diffractive opticalelement,DOE)或一微透镜(Microlens),且本发明不以此为限制。In this preferred embodiment, the
在本较佳实施例中,由于反射光的半角等于或小于15度,透镜300可对该反射光进行光场的调整,并产生几何图形光(例如:光栅光、复数点状光等)的光场图案(如图4至图6所示)。In this preferred embodiment, since the half angle of the reflected light is equal to or less than 15 degrees, the
在本较佳实施例中,透镜400与侧墙120的顶部121可由黏着剂(热塑性黏胶、热固性黏胶)彼此黏着固定,且本发明不以此为限制。In this preferred embodiment, the lens 400 and the top 121 of the
综上所述,由于本发明的载体装置100可产生半角等于或小于15度的反射光,因此可实现更多元的光场图案配置,有效达到提升红外线发射二极体应用领域以及使用便利性的功效。To sum up, since the
本发明在上文中已以较佳实施例揭露,然而本领域技术人员应理解的是,该实施例仅用于描绘本发明,而不应解读为限制本发明的范围。应注意的是,凡是与该实施例等效的变化与置换,均应设为涵盖于本发明的范畴内。因此,本发明的保护范围当以所界定的申请专利范围为准。The present invention has been disclosed above with preferred embodiments, however, those skilled in the art should understand that the embodiments are only used to describe the present invention, and should not be construed as limiting the scope of the present invention. It should be noted that all changes and substitutions equivalent to this embodiment should be set to be included within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the defined scope of the patent application.
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