CN111259613B - Layout method of electronic device and integrated circuit - Google Patents
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Abstract
Description
技术领域technical field
本发明涉及一种电子装置以及所执行的集成电路的布局方法,尤其涉及一种可易于调整布局密度的电子装置及所执行的布局方法。The present invention relates to an electronic device and an implemented integrated circuit layout method, in particular to an electronic device that can easily adjust the layout density and the implemented layout method.
背景技术Background technique
在集成电路的布局中,布局工程师为使芯片具有最大的利用率,会倾向以相对高的密度来进行电路的布局。在完成主要电路的布局动作后,布局工程师并会针对集成电路中的空白区域的部分,进行虚拟区块的填入动作。在所有的空白区域皆完成虚拟区块的填入动作后,集成电路可能因为布局密度过高,而无法满足设计/布局规范的需求。在这样的状况下,布局工程师只能手动针对各个空白区域进行手动调整,以求满足设计/布局规范的需求。In the layout of integrated circuits, layout engineers tend to layout circuits with a relatively high density in order to maximize chip utilization. After completing the layout of the main circuit, the layout engineer will perform a filling operation of the virtual block for the blank area in the integrated circuit. After all blank areas are filled with virtual blocks, the integrated circuit may fail to meet design/layout specification requirements due to too high layout density. In such a situation, layout engineers can only manually adjust each blank area to meet the requirements of the design/layout specification.
上述的布局调整方法需要耗费大量的人力,且布局工程师的手动调整动作未必能一次到位,常需要多次反复的调整动作,方能满足设计/布局规范的需求,浪费时间以及人力。The above-mentioned layout adjustment method requires a lot of manpower, and the manual adjustment action of the layout engineer may not be in place at one time, and often requires repeated adjustment actions to meet the requirements of the design/layout specification, wasting time and manpower.
发明内容Contents of the invention
本发明提供一种电子装置及所执行的集成电路的布局方法,其可易于调整布局密度。The invention provides an electronic device and a layout method of the implemented integrated circuit, which can easily adjust the layout density.
本发明的集成电路的布局方法包括:接收布局信息,解析布局信息并获得集成电路中的多个空白区域;预设多个虚拟区块,虚拟区块具有不同的尺寸;依据各空白区域的尺寸,选择虚拟区块的至少其中之一,以对各空白区域的中心位置进行填入动作,并产生更新后布局信息;针对更新后布局信息执行布局密度检查来获得检查结果;以及,依据检查结果以缩减在集成电路中的多个设定虚拟区块的尺寸,并产生输出布局信息。The integrated circuit layout method of the present invention includes: receiving layout information, analyzing the layout information and obtaining multiple blank areas in the integrated circuit; preset multiple virtual blocks, the virtual blocks have different sizes; according to the size of each blank area , select at least one of the virtual blocks to fill in the center positions of each blank area, and generate updated layout information; perform a layout density check on the updated layout information to obtain a check result; and, according to the check result to reduce the size of a plurality of set virtual blocks in the integrated circuit and generate output layout information.
本发明的电子装置用以执行集成电路的布局动作。电子装置包括存储器以及处理器。存储器用以储存布局信息,以及预先设定的多个虚拟区块的布局信息,其中,虚拟区块具有不同的尺寸。处理器用以:接收布局信息,解析布局信息并获得集成电路中的多个空白区域;依据各空白区域的尺寸,选择虚拟区块的至少其中之一,以对各空白区域的中心位置进行填入动作,并产生更新后布局信息;针对更新后布局信息执行布局密度检查来获得检查结果;依据检查结果以缩减在集成电路中的多个设定虚拟区块的尺寸,并产生输出布局信息。The electronic device of the present invention is used for performing the layout operation of the integrated circuit. The electronic device includes a memory and a processor. The memory is used for storing layout information and preset layout information of a plurality of virtual blocks, wherein the virtual blocks have different sizes. The processor is used to: receive layout information, analyze the layout information and obtain a plurality of blank areas in the integrated circuit; select at least one of the virtual blocks according to the size of each blank area, so as to fill in the center positions of each blank area Action, and generate updated layout information; perform layout density check on the updated layout information to obtain check results; reduce the size of a plurality of set virtual blocks in the integrated circuit according to the check results, and generate output layout information.
基于上述,本发明通过在集成电路中的空白区域填入不同尺寸的虚拟区块,并通过调整其中的设定虚拟区块的尺寸,以自动化的调整集成电路的布局密度。如此一来,集成电路的布局密度的调整动作,可通过自动化的方式来完成,免去人工调整的麻烦,并使集成电路的布局密度可更精确的被设定。Based on the above, the present invention automatically adjusts the layout density of the integrated circuit by filling the blank areas of the integrated circuit with virtual blocks of different sizes and adjusting the size of the set virtual blocks. In this way, the adjustment of the layout density of the integrated circuit can be completed in an automated manner, eliminating the trouble of manual adjustment, and enabling the layout density of the integrated circuit to be set more precisely.
为让本发明的上述特征和优点能更明显易懂,下文特举实施例,并配合附图作详细说明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail with reference to the accompanying drawings.
附图说明Description of drawings
图1示出本发明一实施例的集成电路的布局方法的流程图;Fig. 1 shows the flowchart of the layout method of the integrated circuit of an embodiment of the present invention;
图2A至图2C示出本发明实施例的多个虚拟区块的示意图;2A to 2C show schematic diagrams of multiple virtual blocks according to an embodiment of the present invention;
图3A、图3B示出本发明实施例的布局方法的一步骤的示意图;3A and 3B are schematic diagrams showing a step of a layout method according to an embodiment of the present invention;
图4示出本发明实施例的布局方法的另一步骤的示意图;Fig. 4 shows a schematic diagram of another step of the layout method of the embodiment of the present invention;
图5以及图6本发明实施例布局方法的另一步骤的示意图;5 and 6 are schematic diagrams of another step of the layout method of the embodiment of the present invention;
图7示出本发明另一实施例的布局方法的流程图;FIG. 7 shows a flowchart of a layout method according to another embodiment of the present invention;
图8示出本发明实施例的电子装置的示意图。FIG. 8 shows a schematic diagram of an electronic device according to an embodiment of the present invention.
附图标记说明Explanation of reference signs
S110~S150、S810~S850:集成电路的布局步骤S110~S150, S810~S850: Layout steps of integrated circuits
100:集成电路100: integrated circuit
110~190、1100、1110、1120:空白区域110~190, 1100, 1110, 1120: blank area
DA1:第一密度区块DA1: Block of First Density
DA2:第二密度区块DA2: Second Density Block
210、220、230:虚拟区块210, 220, 230: virtual blocks
BA1:空白区BA1: blank area
DA31~DA33:第三密度区块DA31~DA33: Third Density Block
DB1、DB2、DB12、DB13、DB1A、DB1B、DB1C:虚拟区块DB1, DB2, DB12, DB13, DB1A, DB1B, DB1C: virtual block
DB1A’、DB1D’:取代虚拟区块DB1A’, DB1D’: replace virtual blocks
900:电子装置900: Electronics
910:处理器910: Processor
920:存储器920: memory
IGDS:布局信息IGDS: layout information
DBN:虚拟区块DBN: virtual block
具体实施方式Detailed ways
请参照图1,步骤S110接收布局信息,并通过解析布局信息并获得集成电路中的多个空白区域。在此,布局信息可以为图形数据系统(Graphic Database System,GDSII)格式的相关信息,用以记录集成电路布局的平面的几何形状、文字标签,以及关于结构组成的相关信息。关于空白区域的解析细节,可先依据布局信息,来取得集成电路中的第一杂乱空白区域(如图3A所示),并找出第一杂乱空白区域中具有最大面积的第一矩形。接着,将第一矩形自第一杂乱空白区域移除,以更新而取得第二杂乱空白区域,再自第二杂乱空白区域中找出具有最大面积的第二矩形。通过重复执行上述步骤,直到具有最大面积的第N+1矩形的面积小于预定目标,可完成空白区域的解析动作。其中前述第一矩形至第N矩形即为空白区域。Referring to FIG. 1 , step S110 receives layout information, and obtains a plurality of blank areas in the integrated circuit by analyzing the layout information. Here, the layout information may be related information in a Graphic Database System (GDSII) format, which is used to record the plane geometry of the integrated circuit layout, text labels, and related information about structural composition. Regarding the analysis details of the blank area, the first random blank area in the integrated circuit (as shown in FIG. 3A ) can be obtained according to the layout information, and the first rectangle with the largest area in the first random blank area can be found. Next, the first rectangle is removed from the first cluttered blank area to be updated to obtain a second cluttered blank area, and then a second rectangle with the largest area is found from the second cluttered blank area. By repeatedly executing the above steps until the area of the N+1th rectangle with the largest area is smaller than the predetermined target, the analysis of the blank area can be completed. Wherein the aforementioned first to Nth rectangles are blank areas.
以下请同时参照图1以及图3B,图3B是布局信息解析完的结果。在图3B中,集成电路100中的多个空白区域110~190、1100、1110以及1120被识别出。被识别出的空白区域110~190、1100、1110以及1120可以通过矩形的形式进行框架。空白区域110~190、1100、1110以及1120可具有相同或不相同的尺寸。Please refer to FIG. 1 and FIG. 3B at the same time below. FIG. 3B is the result of analyzing the layout information. In FIG. 3B , a plurality of blank areas 110 - 190 , 1100 , 1110 , and 1120 in integrated circuit 100 are identified. The identified blank areas 110˜190, 1100, 1110, and 1120 may be framed in the form of a rectangle. The blank areas 110˜190, 1100, 1110, and 1120 may have the same or different sizes.
接着,在步骤S120中,则进行多个虚拟区块的预设动作,在此请同步参照图1以及图2A至图2C,在图2A中,虚拟区块210可以包括第一密度区块DA1。第一密度区块DA1可以通过集成电路的主动区元件来形成。在本实施方式中,除包括第一密度区块DA1,虚拟区块210可包括一定尺寸的空白区BA1。Next, in step S120, a plurality of virtual block preset actions are performed. Please refer to FIG. 1 and FIG. 2A to FIG. 2C synchronously. In FIG. . The first density block DA1 may be formed by active area components of an integrated circuit. In this embodiment, in addition to the block DA1 of the first density, the virtual block 210 may include a blank area BA1 of a certain size.
在图2B中,虚拟区块220包括第一密度区块DA1、第二密度区块DA2以及空白区BA1。第二密度区块DA2设置在第一密度区块DA1的周围,并环绕第一密度区块DA1。值得一提的,虚拟区块220的尺寸大于虚拟区块210的尺寸。第二密度区块DA2例如可由集成电路中的多晶硅层来形成。In FIG. 2B , the virtual block 220 includes a first density block DA1 , a second density block DA2 and a blank area BA1 . The second density block DA2 is disposed around the first density block DA1 and surrounds the first density block DA1. It is worth mentioning that the size of the virtual block 220 is larger than that of the virtual block 210 . The second density block DA2 can be formed by, for example, a polysilicon layer in an integrated circuit.
在图2C中,虚拟区块230包括第一密度区块DA1、第二密度区块DA2、多个第三密度区块DA31~DA33以及空白区BA1。第二密度区块DA2设置在第一密度区块DA1的边缘。第三密度区块DA31~DA33则被插入至第二密度区块DA2中。第一密度区块DA1以及第三密度区块DA31~DA33可具有相同的布局密度,并可以通过集成电路的主动区元件来形成。第二密度区块DA2例如可由集成电路中的多晶硅层来形成。在本发明部分实施例中,虚拟区块230可以不具有第二密度区块DA2,或也可以不具有第三密度区块DA31~DA33。另外,在虚拟区块230包括第三密度区块DA31~DA33的情况下,第三密度区块DA31~DA33的数量可以是一个、两个或是三个以上,图2C示出的第三密度区块DA31~DA33的数量(3个)仅只是说明范例,不用以限缩本发明的范畴。值得一提的,虚拟区块230的尺寸大于虚拟区块220的尺寸,虚拟区块220的尺寸大于虚拟区块210的尺寸。In FIG. 2C , the virtual block 230 includes a first density block DA1 , a second density block DA2 , a plurality of third density blocks DA31 - DA33 and a blank area BA1 . The second density block DA2 is disposed on the edge of the first density block DA1. The blocks DA31 - DA33 of the third density are inserted into the block DA2 of the second density. The first density block DA1 and the third density blocks DA31 - DA33 may have the same layout density, and may be formed by active area components of an integrated circuit. The second density block DA2 can be formed by, for example, a polysilicon layer in an integrated circuit. In some embodiments of the present invention, the virtual block 230 may not have the second density block DA2, or may not have the third density blocks DA31˜DA33. In addition, in the case that the virtual block 230 includes the third density blocks DA31˜DA33, the number of the third density blocks DA31˜DA33 can be one, two or more than three. The third density shown in FIG. 2C The number of blocks DA31 - DA33 (3) is just an example for illustration, and is not intended to limit the scope of the present invention. It is worth mentioning that the size of the virtual block 230 is larger than that of the virtual block 220 , and the size of the virtual block 220 is larger than that of the virtual block 210 .
在本实施例中,虚拟区块210、虚拟区块220以及虚拟区块230有不同的布局密度。In this embodiment, the virtual block 210 , the virtual block 220 and the virtual block 230 have different layout densities.
接着,请重新参照图1,在步骤S130中,则依据集成电路中,各空白区域的尺寸,选择虚拟区块的至少其中之一,以对各空白区域的中心位置进行填入动作,并产生更新后布局信息。在此请同步参照图1以及图4,在图4中,以空白区域140为范例,空白区域140中被填入多个相同尺寸的虚拟区块DB1。而以空白区域110为范例,空白区域110则被填入多个虚拟区块DB1以及多个虚拟区块DB2,其中的虚拟区块DB1以及虚拟区块DB2的尺寸不相同。Next, please refer to FIG. 1 again. In step S130, according to the size of each blank area in the integrated circuit, at least one of the virtual blocks is selected to fill in the center positions of each blank area, and generate Updated layout information. Please refer to FIG. 1 and FIG. 4 simultaneously. In FIG. 4 , taking the blank area 140 as an example, the blank area 140 is filled with a plurality of virtual blocks DB1 of the same size. Taking the blank area 110 as an example, the blank area 110 is filled with a plurality of virtual blocks DB1 and a plurality of virtual blocks DB2, wherein the sizes of the virtual blocks DB1 and the virtual blocks DB2 are different.
在此请注意,关于虚拟区块的填入动作,在本发明实施例中,可依据多个预设的虚拟区块来分别建立多个框架,其中,框架可依据分别对应的虚拟区块的边来建立。并且,在执行填入虚拟区块至空白区域时,可通过将被选中虚拟区块对应的框架填入空白区域即可。Please note here that regarding the filling action of the virtual block, in the embodiment of the present invention, multiple frames can be respectively established according to multiple preset virtual blocks, wherein the frames can be based on the respective corresponding virtual blocks. edge to build. Moreover, when filling the virtual block into the blank area, the frame corresponding to the selected virtual block can be filled into the blank area.
关于虚拟区块的填入动作的细节,可依据各空白区域的尺寸以及一第一框架的尺寸来计算出N个可容纳数量,针对各空白区域填入N个该第一框架,其中N为不小于0的整数。在细节上,先计算出为矩形的空白区域中的长边与短边尺寸,并计算出第一框架在长边的可容纳数量(=X)与第一框架在短边的可容纳数量(=Y),,并藉以决定最大的第一框架的数量(X*Y=N),并将最大框架数量置中的填入至矩形空白区域内。接着,各空白区域可产生一个或多个子空白区域,本发明实施例则可依据子空白区域的尺寸以及一第二框架的尺寸来计算出M个可容纳数量。再针对子空白区域依序填入M个具有较小尺寸的第二框架。Regarding the details of the filling action of the virtual block, N accommodating quantities can be calculated according to the size of each blank area and the size of a first frame, and N first frames are filled in each blank area, where N is An integer not less than 0. In detail, first calculate the long side and short side dimensions in the blank area of the rectangle, and calculate the accommodated quantity (=X) of the first frame on the long side and the accommodated quantity of the first frame on the short side ( =Y), and thereby determine the largest number of first frames (X*Y=N), and fill in the largest number of frames in the rectangular blank area. Next, each blank area can generate one or more sub-blank areas, and the embodiment of the present invention can calculate M accommodating quantities according to the size of the sub-blank areas and the size of a second frame. Then M second frames with smaller sizes are sequentially filled in the sub-blank areas.
通过针对集成电路中的各个空白区域,重复执行上述的填入动作,可使集成电路中的各个空白区域填入虚拟区块,完成步骤S130,并产生更新后布局数据。By repeatedly performing the filling operation above for each blank area in the integrated circuit, each blank area in the integrated circuit can be filled with a dummy block to complete step S130 and generate updated layout data.
请重新参照图1,步骤S140则针对更新后布局数据执行布局密度检查的动作,若检查结果指示集成电路的布局密度高于预设的一临界值时,则执行步骤S150,以依据检查结果以缩减在集成电路中的多个设定虚拟区块的尺寸,并产生输出布局信息。Please refer to FIG. 1 again. In step S140, the layout density check is performed on the updated layout data. If the check result indicates that the layout density of the integrated circuit is higher than a preset critical value, then step S150 is executed to determine the layout density according to the check result. Reducing the size of a plurality of set virtual blocks in the integrated circuit and generating output layout information.
关于步骤S150的实施细节,可同步参照图1、图5以及图6,在当检查结果指示集成电路的布局密度高于预设的一临界值时,可设定在集成电路中的虚拟区块中,相邻的多个虚拟区块的其中之一为设定虚拟区块。在图5中,相邻的二虚拟区块的其中之一被设定为设定虚拟区块。举例来说明,在集成电路100中,以空白区域140为范例,其中的虚拟区块DB1A以及虚拟区块DB1B在水平方向相邻。因此,可设定虚拟区块DB1A为设定虚拟区块,而设定虚拟区块DB1B为非设定虚拟区块。另外,虚拟区块DB1A以及虚拟区块DB1C在垂直方向相邻,且在虚拟区块DB1A已被设定为设定虚拟区块,因此,虚拟区块DB1C可被设定为非设定虚拟区块。依此类推,虚拟区块DB1D可被设定为设定虚拟区块。Regarding the implementation details of step S150, please refer to FIG. 1, FIG. 5 and FIG. Among them, one of the plurality of adjacent virtual blocks is a set virtual block. In FIG. 5 , one of the two adjacent virtual blocks is set as the set virtual block. For example, in the integrated circuit 100 , taking the blank area 140 as an example, the virtual block DB1A and the virtual block DB1B are adjacent in the horizontal direction. Therefore, the virtual block DB1A can be set as a set virtual block, and the set virtual block DB1B can be set as a non-set virtual block. In addition, the virtual block DB1A and the virtual block DB1C are adjacent in the vertical direction, and the virtual block DB1A has been set as a set virtual block, therefore, the virtual block DB1C can be set as a non-set virtual area piece. By analogy, the virtual block DB1D can be set as the set virtual block.
上述的临界值可以由集成电路生产工厂所提供的设计规范和/或布局规范来获得。The above critical value can be obtained from the design specification and/or layout specification provided by the integrated circuit production factory.
在图5中,以虚框形式表示的虚拟区块为设定虚拟区块,相对的,以实框形式表示的虚拟区块则为非设定虚拟区块。在实际的设定细节上,可分别针对设定虚拟区块以及非设定虚拟区块进行图形数据系统(GDS)号码的设定动作。其中,所有的设定虚拟区块的GDS号码可以为1,所有的非设定虚拟区块的GDS号码可以为0,并藉以识别虚拟区块的种类。In FIG. 5 , virtual blocks represented by dotted frames are set virtual blocks, while virtual blocks represented by solid frames are non-configured virtual blocks. In the actual setting details, the setting operation of the graphics data system (GDS) number can be performed for the set virtual block and the non-set virtual block respectively. Wherein, the GDS number of all configured virtual blocks can be 1, and the GDS number of all non-configured virtual blocks can be 0, so as to identify the type of virtual block.
附带一提的,设定虚拟区块的设定方式,也可通过使相邻的三个虚拟区块的其中之一或其中之二为设定虚拟区块,或使相邻的四个虚拟区块的其中之一、其中之二或其中之三为设定虚拟区块,没有特别的限制。Incidentally, the setting method of setting the virtual block can also be set by making one or two of the adjacent three virtual blocks a set virtual block, or making the adjacent four virtual blocks One, two or three of the blocks are set virtual blocks, and there is no special limitation.
附带一提的,关于上述的设定虚拟区块以及非设定虚拟区块的动作,在本发明其他实施例中,可以针对虚拟区块对应的框架来执行。其中,当空白区域中仅填入框架的相关信息时,则可设定相邻的多个框架的其中之一为设定框架,其中之另一为非设定框架。相对应的,上述的图形数据系统号码的设定动作则可针对设定框架以及非设定框架来进行。Incidentally, regarding the above-mentioned actions of setting virtual blocks and non-setting virtual blocks, in other embodiments of the present invention, it may be performed for the frame corresponding to the virtual blocks. Wherein, when only relevant information of frames is filled in the blank area, one of the multiple adjacent frames can be set as a set frame, and the other can be set as a non-set frame. Correspondingly, the above-mentioned setting operation of the graphic data system number can be performed for the set frame and the non-set frame.
接着,在图6中,则进行设定虚拟区块的尺寸缩减动作。其中,在集成电路100中,以空白区域140为范例,原设定虚拟区块DB1A以及DB1D的位置被置换为具有相对小尺寸的取代虚拟区块DB1A’以及DB1D’,而为非设定虚拟区块DB1B以及DB1C则维持不变更。在本实施例中,取代虚拟区块DB1A’以及DB1D’可以为图2B的虚拟区块220,虚拟区块DB1B以及DB1C可以为图2C的虚拟区块230。Next, in FIG. 6, the size reduction operation of setting the virtual block is performed. Wherein, in the integrated circuit 100, taking the blank area 140 as an example, the positions of the originally set virtual blocks DB1A and DB1D are replaced with relatively small-sized replaced virtual blocks DB1A' and DB1D', instead of non-set virtual blocks. Blocks DB1B and DB1C remain unchanged. In this embodiment, the virtual blocks DB1A' and DB1D' can be replaced by the virtual block 220 in FIG. 2B , and the virtual blocks DB1B and DB1C can be the virtual block 230 in FIG. 2C .
通过使设定虚拟区块DB1B以及DB1C进行区块置换的动作,原配置虚拟区块DB1B以及DB1C的位置可多出较多面积的空白区,也因此,集成电路100的布局密度可以自动被调降。By performing block replacement by setting the virtual blocks DB1B and DB1C, the positions of the originally configured virtual blocks DB1B and DB1C can have more blank areas, and therefore, the layout density of the integrated circuit 100 can be automatically adjusted. drop.
附带一提的,若当针对空白区域所进行的填入动作,是通过虚拟区块对应的框架来执行时,当进行虚拟区块的置换动作时,可针对所对应的框架进行置换即可。Incidentally, if the filling operation for the blank area is performed through the frame corresponding to the virtual block, when the replacement operation for the virtual block is performed, the replacement can be performed for the corresponding frame.
在步骤S150完成后,符合规范需求的输出布局信息可被有效产生。After the step S150 is completed, the output layout information meeting the specification requirements can be effectively generated.
附带一提的,在完成产出输出布局信息的步骤后,可依据输出布局信息产生集成电路的布局密度分布信息。布局密度分布信息可数据的方式呈现,并通过数据分析的方式,以提供布局工程师和/或设计工程师进行分析。Incidentally, after the step of generating the output layout information is completed, the layout density distribution information of the integrated circuit can be generated according to the output layout information. The layout density distribution information can be presented in the form of data, and through data analysis, it can be provided to layout engineers and/or design engineers for analysis.
此外,输出布局信息为可符合规范的信息。因此,输出布局信息可被提供以制作光罩,并由半导体制造工厂生产出实体的集成电路。Also, the output layout information is information that can conform to specifications. Thus, output layout information can be provided to fabricate photomasks and physical integrated circuits produced by semiconductor fabrication plants.
由上述说明不难得知,本发明实施例的布局方法,可通过自动化的方式,来针对集成电路的布局密度进行调整,使其符合规范。如此一来,可免去人工调整的麻烦,快速且准确的完成布局密度的调整动作。It is not difficult to know from the above description that the layout method of the embodiment of the present invention can adjust the layout density of the integrated circuit in an automatic way to make it conform to the specification. In this way, the trouble of manual adjustment can be avoided, and the adjustment of the layout density can be completed quickly and accurately.
以下请参照图7,图7示出本发明另一实施例的布局方法的流程图。其中,步骤S810识别集成电路中的空白区域,接着,步骤S820依据各个空白区域的中心位置,来执行虚拟区块的填入动作。步骤S820可先针对空白区域以依据虚拟区块的框架来进行填入动作,并在步骤S820完成后,再执行步骤S830使虚拟区块的框架与其对应的布局信息进行映射动作,以将虚拟区块实际的布局内容填入至空白区域中。在完成所有的虚拟区块的框架以及布局信息的映射动作后,可产生更新后布局信息(步骤S840)。Referring to FIG. 7 below, FIG. 7 shows a flowchart of a layout method according to another embodiment of the present invention. Wherein, step S810 identifies blank areas in the integrated circuit, and then, step S820 performs a virtual block filling operation according to the center positions of each blank area. Step S820 can first fill in the blank area according to the frame of the virtual block, and after step S820 is completed, then execute step S830 to make the frame of the virtual block and its corresponding layout information perform a mapping operation, so that the virtual area The actual layout content of the block fills in the empty space. After completing the mapping operations of the frame and layout information of all the virtual blocks, the updated layout information can be generated (step S840 ).
步骤S850可执行布局密度的检查,并检查集成电路的布局密度是否过高,当集成电路的布局密度过高时,执行步骤S860以进行虚拟区块的置换动作。通过将密度相对大的虚拟区块,置换为密度相对小的取代虚拟区块,可有效降低集成电路的布局密度。通过重复的布局密度的检查动作,并在当集成电路的布局密度符合规范时,结束本实施例的布局动作。Step S850 may perform a layout density check, and check whether the layout density of the integrated circuit is too high, and if the layout density of the integrated circuit is too high, perform step S860 to replace the virtual block. The layout density of the integrated circuit can be effectively reduced by replacing the dummy block with a relatively high density with a replacement dummy block with a relatively low density. After repeating the layout density checking operations, and when the layout density of the integrated circuit meets the specification, the layout operation of this embodiment ends.
关于上述步骤的多个细节,在前述的实施例已有详细的说明,在此恕不多赘述。The details of the above steps have been described in detail in the foregoing embodiments, and will not be repeated here.
以下请参照图8,图8示出本发明实施例的电子装置的示意图。电子装置900包括处理器910以及存储器920。处理器910以及存储器920相互耦接。存储器920用以储存布局信息IGDS,以及预先设定的多个虚拟区块DBN的信息,其中,虚拟区块DBN具有不同的尺寸。处理器910由存储器920接收布局信息IGDS以及虚拟区块DBN的信息,并执行如前述多个实施例的布局方法,并藉以调整集成电路的布局密度。Please refer to FIG. 8 below. FIG. 8 is a schematic diagram of an electronic device according to an embodiment of the present invention. The electronic device 900 includes a processor 910 and a memory 920 . The processor 910 and the memory 920 are coupled to each other. The memory 920 is used for storing the layout information IGDS and information of a plurality of preset virtual blocks DBN, wherein the virtual blocks DBN have different sizes. The processor 910 receives the layout information IGDS and the information of the virtual block DBN from the memory 920, and executes the layout methods as in the above-mentioned multiple embodiments, thereby adjusting the layout density of the integrated circuit.
关于布局方法的多个实施细节,在前述的实施例已有详细的说明,在此恕不多赘述。Multiple implementation details of the layout method have been described in detail in the foregoing embodiments, and will not be repeated here.
综上所述,本发明预设多个虚拟区块,并使虚拟区块依据空白区域的中心位置进行填入动作,再通过置换虚拟区块以调整集成电路的布局密度。如此一来,集成电路的布局密度的停整动作不需通过人工的方式来执行,而可以自动化的被执行,提升布局工作的效率。To sum up, the present invention presets a plurality of virtual blocks, and makes the virtual blocks fill in according to the central position of the blank area, and then adjusts the layout density of the integrated circuit by replacing the virtual blocks. In this way, the stop operation of the layout density of the integrated circuit does not need to be performed manually, but can be performed automatically, thereby improving the efficiency of the layout work.
虽然本发明已以实施例揭示如上,然其并非用以限定本发明,任何所属技术领域中技术人员,在不脱离本发明的精神和范围内,当可作些许的更改与润饰,故本发明的保护范围当视权利要求所界定的为准。Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection shall prevail as defined by the claims.
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