CN111234708A - Wet-type CMP mirror polishing solution for stainless steel mobile phone middle frame and preparation method thereof - Google Patents
Wet-type CMP mirror polishing solution for stainless steel mobile phone middle frame and preparation method thereof Download PDFInfo
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- CN111234708A CN111234708A CN202010243139.4A CN202010243139A CN111234708A CN 111234708 A CN111234708 A CN 111234708A CN 202010243139 A CN202010243139 A CN 202010243139A CN 111234708 A CN111234708 A CN 111234708A
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- mirror polishing
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- stainless steel
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- 238000005498 polishing Methods 0.000 title claims abstract description 84
- 229910001220 stainless steel Inorganic materials 0.000 title claims abstract description 40
- 239000010935 stainless steel Substances 0.000 title claims abstract description 40
- 238000002360 preparation method Methods 0.000 title claims abstract description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000008367 deionised water Substances 0.000 claims abstract description 13
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 13
- 150000007524 organic acids Chemical class 0.000 claims abstract description 10
- 230000007797 corrosion Effects 0.000 claims abstract description 8
- 238000005260 corrosion Methods 0.000 claims abstract description 8
- 239000003995 emulsifying agent Substances 0.000 claims abstract description 8
- 239000000375 suspending agent Substances 0.000 claims abstract description 8
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 7
- 239000003112 inhibitor Substances 0.000 claims abstract description 7
- 239000003755 preservative agent Substances 0.000 claims abstract description 7
- 230000002335 preservative effect Effects 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims description 29
- 238000003756 stirring Methods 0.000 claims description 23
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 18
- 229960004418 trolamine Drugs 0.000 claims description 17
- 239000001993 wax Substances 0.000 claims description 17
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 claims description 16
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 claims description 16
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 claims description 16
- 239000005642 Oleic acid Substances 0.000 claims description 16
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 claims description 16
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 claims description 16
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 claims description 16
- 239000012188 paraffin wax Substances 0.000 claims description 15
- 238000002156 mixing Methods 0.000 claims description 14
- 239000003208 petroleum Substances 0.000 claims description 12
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 12
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 claims description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 11
- 235000021355 Stearic acid Nutrition 0.000 claims description 11
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 11
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 11
- 239000008117 stearic acid Substances 0.000 claims description 11
- 229910052788 barium Inorganic materials 0.000 claims description 10
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims description 10
- 101150096185 PAAS gene Proteins 0.000 claims description 8
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 8
- 239000012964 benzotriazole Substances 0.000 claims description 8
- GCLGEJMYGQKIIW-UHFFFAOYSA-H sodium hexametaphosphate Chemical compound [Na]OP1(=O)OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])O1 GCLGEJMYGQKIIW-UHFFFAOYSA-H 0.000 claims description 8
- 235000019982 sodium hexametaphosphate Nutrition 0.000 claims description 8
- CHHHXKFHOYLYRE-UHFFFAOYSA-M 2,4-Hexadienoic acid, potassium salt (1:1), (2E,4E)- Chemical compound [K+].CC=CC=CC([O-])=O CHHHXKFHOYLYRE-UHFFFAOYSA-M 0.000 claims description 7
- 235000013871 bee wax Nutrition 0.000 claims description 7
- 239000012166 beeswax Substances 0.000 claims description 7
- 239000004203 carnauba wax Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- -1 polyoxypropylene glycerol Polymers 0.000 claims description 7
- 239000004302 potassium sorbate Substances 0.000 claims description 7
- 235000010241 potassium sorbate Nutrition 0.000 claims description 7
- 229940069338 potassium sorbate Drugs 0.000 claims description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 6
- RBNPOMFGQQGHHO-UHFFFAOYSA-N glyceric acid Chemical compound OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 claims description 6
- BCZXFFBUYPCTSJ-UHFFFAOYSA-L Calcium propionate Chemical compound [Ca+2].CCC([O-])=O.CCC([O-])=O BCZXFFBUYPCTSJ-UHFFFAOYSA-L 0.000 claims description 5
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 5
- 239000004283 Sodium sorbate Substances 0.000 claims description 5
- 239000004330 calcium propionate Substances 0.000 claims description 5
- 235000010331 calcium propionate Nutrition 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- WXMKPNITSTVMEF-UHFFFAOYSA-M sodium benzoate Chemical compound [Na+].[O-]C(=O)C1=CC=CC=C1 WXMKPNITSTVMEF-UHFFFAOYSA-M 0.000 claims description 5
- 239000004299 sodium benzoate Substances 0.000 claims description 5
- 235000010234 sodium benzoate Nutrition 0.000 claims description 5
- LROWVYNUWKVTCU-STWYSWDKSA-M sodium sorbate Chemical compound [Na+].C\C=C\C=C\C([O-])=O LROWVYNUWKVTCU-STWYSWDKSA-M 0.000 claims description 5
- 235000019250 sodium sorbate Nutrition 0.000 claims description 5
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 claims description 5
- IVKNZCBNXPYYKL-UHFFFAOYSA-N 2-[2-[2-[2-[2-[2-[2-[2-[2-[2-[4-(2,4,4-trimethylpentan-2-yl)phenoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethanol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(OCCOCCOCCOCCOCCOCCOCCOCCOCCOCCO)C=C1 IVKNZCBNXPYYKL-UHFFFAOYSA-N 0.000 claims description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 claims description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 4
- 229920001213 Polysorbate 20 Polymers 0.000 claims description 4
- NWGKJDSIEKMTRX-AAZCQSIUSA-N Sorbitan monooleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O NWGKJDSIEKMTRX-AAZCQSIUSA-N 0.000 claims description 4
- AMTWCFIAVKBGOD-UHFFFAOYSA-N dioxosilane;methoxy-dimethyl-trimethylsilyloxysilane Chemical compound O=[Si]=O.CO[Si](C)(C)O[Si](C)(C)C AMTWCFIAVKBGOD-UHFFFAOYSA-N 0.000 claims description 4
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 claims description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 239000000256 polyoxyethylene sorbitan monolaurate Substances 0.000 claims description 4
- 235000010486 polyoxyethylene sorbitan monolaurate Nutrition 0.000 claims description 4
- 229940083037 simethicone Drugs 0.000 claims description 4
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 claims description 4
- 229940048086 sodium pyrophosphate Drugs 0.000 claims description 4
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 4
- 235000019818 tetrasodium diphosphate Nutrition 0.000 claims description 4
- ICLYJLBTOGPLMC-KVVVOXFISA-N (z)-octadec-9-enoate;tris(2-hydroxyethyl)azanium Chemical compound OCCN(CCO)CCO.CCCCCCCC\C=C/CCCCCCCC(O)=O ICLYJLBTOGPLMC-KVVVOXFISA-N 0.000 claims description 2
- FJLUATLTXUNBOT-UHFFFAOYSA-N 1-Hexadecylamine Chemical compound CCCCCCCCCCCCCCCCN FJLUATLTXUNBOT-UHFFFAOYSA-N 0.000 claims description 2
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 claims description 2
- AYAUBWSUZRFVQO-UHFFFAOYSA-N 2-[2-(4-phenyl-5-sulfanylidene-1h-1,2,4-triazol-3-yl)ethyl]benzo[de]isoquinoline-1,3-dione Chemical compound O=C1C(C=23)=CC=CC3=CC=CC=2C(=O)N1CCC1=NNC(=S)N1C1=CC=CC=C1 AYAUBWSUZRFVQO-UHFFFAOYSA-N 0.000 claims description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 2
- BTJIUGUIPKRLHP-UHFFFAOYSA-N 4-nitrophenol Chemical compound OC1=CC=C([N+]([O-])=O)C=C1 BTJIUGUIPKRLHP-UHFFFAOYSA-N 0.000 claims description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 2
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- QFOHBWFCKVYLES-UHFFFAOYSA-N Butylparaben Chemical compound CCCCOC(=O)C1=CC=C(O)C=C1 QFOHBWFCKVYLES-UHFFFAOYSA-N 0.000 claims description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 2
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 claims description 2
- 229920000805 Polyaspartic acid Polymers 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- 229920001214 Polysorbate 60 Polymers 0.000 claims description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 2
- BCKXLBQYZLBQEK-KVVVOXFISA-M Sodium oleate Chemical compound [Na+].CCCCCCCC\C=C/CCCCCCCC([O-])=O BCKXLBQYZLBQEK-KVVVOXFISA-M 0.000 claims description 2
- 229920002125 Sokalan® Polymers 0.000 claims description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 2
- 235000011054 acetic acid Nutrition 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 2
- 235000015165 citric acid Nutrition 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- 239000010432 diamond Substances 0.000 claims description 2
- 235000019253 formic acid Nutrition 0.000 claims description 2
- 239000004312 hexamethylene tetramine Substances 0.000 claims description 2
- 235000010299 hexamethylene tetramine Nutrition 0.000 claims description 2
- 239000004200 microcrystalline wax Substances 0.000 claims description 2
- 235000019808 microcrystalline wax Nutrition 0.000 claims description 2
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 claims description 2
- 235000021313 oleic acid Nutrition 0.000 claims description 2
- 235000019809 paraffin wax Nutrition 0.000 claims description 2
- 235000019271 petrolatum Nutrition 0.000 claims description 2
- 239000004584 polyacrylic acid Substances 0.000 claims description 2
- 108010064470 polyaspartate Proteins 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 2
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 2
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 claims description 2
- 239000000344 soap Substances 0.000 claims description 2
- 229910052708 sodium Inorganic materials 0.000 claims description 2
- 239000011734 sodium Substances 0.000 claims description 2
- 235000012207 sodium gluconate Nutrition 0.000 claims description 2
- 239000000176 sodium gluconate Substances 0.000 claims description 2
- 229940005574 sodium gluconate Drugs 0.000 claims description 2
- 239000001384 succinic acid Substances 0.000 claims description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 2
- 230000007704 transition Effects 0.000 claims description 2
- 229940117013 triethanolamine oleate Drugs 0.000 claims description 2
- 235000013869 carnauba wax Nutrition 0.000 claims 1
- 239000012182 japan wax Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 9
- 230000001050 lubricating effect Effects 0.000 abstract description 7
- 238000004140 cleaning Methods 0.000 abstract description 5
- 238000005054 agglomeration Methods 0.000 abstract description 3
- 230000002776 aggregation Effects 0.000 abstract description 3
- 238000012423 maintenance Methods 0.000 abstract description 3
- 238000004064 recycling Methods 0.000 abstract description 3
- 239000000725 suspension Substances 0.000 abstract description 3
- 230000032798 delamination Effects 0.000 abstract description 2
- 239000006185 dispersion Substances 0.000 abstract description 2
- 239000012535 impurity Substances 0.000 abstract description 2
- 238000001556 precipitation Methods 0.000 abstract description 2
- 239000003973 paint Substances 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 11
- 238000005303 weighing Methods 0.000 description 10
- 238000012545 processing Methods 0.000 description 6
- 229920002545 silicone oil Polymers 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 230000036541 health Effects 0.000 description 3
- 229920000136 polysorbate Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 230000006378 damage Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007127 saponification reaction Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 241000238631 Hexapoda Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 229940080117 triethanolamine sulfate Drugs 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a wet CMP mirror polishing solution for a stainless steel mobile phone middle frame and a preparation method thereof. The paint consists of A, B two components, wherein the component A is prepared from the following components in parts by weight: 5-30 parts of organic acid, 3-40 parts of wax, 4-20 parts of emulsifier and 30-100 parts of deionized water. The component B is prepared from the following components in parts by weight: 4-60 parts of abrasive, 5-10 parts of suspending agent, 1-5 parts of corrosion inhibitor, 1-5 parts of preservative, 1-10 parts of defoaming agent and 20-100 parts of deionized water. The polishing solution prepared by the invention has good dispersion and suspension properties, and can not generate the phenomena of precipitation, delamination and agglomeration after being placed for a long time; the lubricating property is good, and the surface scratch and the microcrack of the stainless steel are greatly reduced; the components are water-soluble, so that the cleaning is easy, and the adhesion of impurities and dirt is avoided; the light-emitting effect is good, and the polished stainless steel surface achieves a mirror surface effect; low cost, convenient maintenance and recycling.
Description
Technical Field
The invention relates to a mirror polishing solution for processing a stainless steel mobile phone middle frame CMP, in particular to a wet CMP mirror polishing solution for a stainless steel mobile phone middle frame and a preparation method thereof.
Background
Since the release of the iPhone 4 mobile phone, the beautiful appearance of the iPhone becomes the classic design, and the stainless steel middle frame design also becomes the model for the mobile phone world to imitate. Although the stainless steel has high strength, the stainless steel has the characteristics of high toughness, strong abrasive adhesion, poor thermal conductivity, difficult dissipation of frictional heat and the like, so that the stainless steel middle frame has higher processing difficulty. The traditional processing methods include electrolytic polishing, chemical polishing, mechanical polishing and the like. The polishing solution adopted by the electrolytic polishing and the chemical polishing mostly adopts strong acid solution, which has great pollution to the environment and damages the health of operators. The mechanical polishing mostly adopts abrasive paper consumables, the metal dust pollution is serious, and the working environment is severe. Most importantly, the stainless steel surface processed by the above methods is difficult to achieve the required mirror effect.
Wet CMP polishing: the polishing medium (such as polyurethane foaming leather strip/wool wheel, etc.) rotates at high speed, and the polishing liquid is sprayed on the surface of the polished stainless steel at extremely high pressure, so that the high temperature generated by the contact of the surface of the stainless steel middle frame and the polishing medium can be taken away, and the burning is avoided. The polishing solution has high cutting force and good surface effect due to the comprehensive action of various components, can prevent workers from sucking dust, and is beneficial to body health. The polishing solution is provided with the circulating system for recycling, and the polishing solution is added when the concentration is reduced, so that the polishing solution is more economical and convenient. The waste liquid treatment is simpler.
Disclosure of Invention
Aiming at the problems, the invention provides the wet-type CMP mirror polishing solution specially used for processing the middle frame of the stainless steel mobile phone and the preparation method thereof.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
a wet CMP mirror polishing solution for processing a stainless steel mobile phone middle frame is composed of A, B two components, wherein the component A is prepared from the following components in parts by weight: 5-30 parts of organic acid, 3-40 parts of wax, 4-20 parts of emulsifier and 30-100 parts of deionized water; the component B is prepared from the following components in parts by weight: 4-60 parts of abrasive, 1-10 parts of suspending agent, 1-5 parts of corrosion inhibitor, 1-5 parts of preservative, 1-10 parts of defoaming agent and 20-100 parts of deionized water.
Further, the organic acid is selected from one or more of formic acid, acetic acid, oleic acid, citric acid, stearic acid, glycolic acid, polyacrylic acid and succinic acid.
Further, the wax is selected from one or more of palm wax, paraffin wax, beeswax, microcrystalline wax, Japan wood wax, and insect wax.
Further, the emulsifier is selected from one or more of triethanolamine, triethanolamine oleate soap, sodium dodecyl sulfate, sodium oleate, OP-10, AEO, NPO, polyethylene glycol, nonylphenol polyoxyethylene ether, Tween-20, Tween-60 and Span-80.
Furthermore, the abrasive is selected from one or more of diamond, cubic boron nitride, α -aluminum oxide, chromium oxide and iron oxide, and the particle size of the abrasive is less than 1 mu m.
Further, the suspending agent is selected from one or more of sodium hexametaphosphate, sodium pyrophosphate and PAAS.
Further, the corrosion inhibitor is selected from one or more of hexamethylenetetramine, benzotriazole, hexadecylamine, polyaspartic acid, sodium gluconate, barium petroleum sulfonate, rosin and sodium petroleum sulfonate.
Further, the preservative is selected from one or more of sodium benzoate, sodium sorbate, potassium sorbate, calcium propionate and butyl p-hydroxybenzoate.
Further, the defoaming agent is selected from one or more of dimethyl silicone oil, tributyl phosphate, polyoxyethylene polyoxypropylene amine ether and polyoxypropylene glycerol ether.
The wet CMP mirror polishing solution for processing the middle frame of the stainless steel mobile phone comprises the following preparation methods:
1) the preparation method of the component A comprises the following steps: mixing organic acid, wax, emulsifier, etc. of component A by phase transition agent in oil, heating to 80-120 deg.C for complete melting, adding hot water of about 100 deg.C, and stirring at high speed until it becomes water-based;
2) the preparation method of the component B comprises the following steps: taking deionized water, sequentially adding a suspending agent, a corrosion inhibitor, a preservative and a defoaming agent, stirring uniformly and fully to dissolve, adding an abrasive, and stirring for 1h for later use;
3) and stirring and mixing the cooled component A and the cooled component B uniformly to obtain the wet CMP mirror polishing solution.
Compared with the prior polishing solution for polishing stainless steel, the polishing solution has the advantages that:
1. the components of the aqueous wax emulsion are optimally added in the formula, the compatibility of all the components is reasonable, and the emulsion is fine and uniform. The grinding material has good suspension property and dispersibility, can not agglomerate or block-shaped precipitate after being placed for half a year, and can be recovered to a homogeneous state after being slightly shaken. The production method has simple preparation process and low cost, is suitable for batch production, and can change the performance of the polishing solution by slightly adjusting the components to prepare a series of products.
2. The product of the invention has excellent polishing performance and dirt-removing power, the polished surface is fine and smooth, the finish degree is high, the cleaning after polishing is simple, and no special wax removal link is needed. The polishing solution can be recycled, the concentration can be reduced only by adding a proper amount of polishing solution, the polishing solution is suitable for a production mode with higher automation degree, the labor is saved, and special maintenance is not needed. The formula has no toxic and harmful components, and does not cause harm to the health of workers.
3. The invention discloses a wet CMP (mechanical chemical polishing) mirror polishing solution for processing a stainless steel mobile phone middle frame. The innovation point is the polishing mode and the raw material composition ratio. Compared with the traditional dry polishing, the wet polishing mode is adopted, so that the dust pollution and the stainless steel surface polishing temperature are greatly reduced, the workshop working environment is improved, the stainless steel surface burning is avoided, the surface brightness of the product is increased, and the PVD film layer in the later process is not easy to fall off. Compared with chemical polishing liquid, the polishing liquid is more environment-friendly, and the waste liquid is easy to treat.
4. The prepared A, B components are weighed and mixed evenly according to the requirement to prepare the stainless steel wet CMP mirror polishing solution. The polishing solution prepared by the invention has good dispersion and suspension properties, and can not generate the phenomena of precipitation, delamination and agglomeration after being placed for a long time; the lubricating property is good, and the surface scratch and the microcrack of the stainless steel are greatly reduced; the components are water-soluble, so that the cleaning is easy, and the adhesion of impurities and dirt is avoided; the light-emitting effect is good, and the polished stainless steel surface achieves a mirror surface effect; low cost, convenient maintenance and recycling.
Table 1 shows the comparison between commercially available stainless steel polishing solutions and the stainless steel polishing solution of the present invention
Detailed Description
The present invention will be further described with reference to the following examples. It is to be understood that the following examples are illustrative only and are not intended to limit the scope of the invention, which is to be given numerous insubstantial modifications and adaptations by those skilled in the art based on the teachings set forth above.
Example 1
The formula of the polishing solution of the embodiment is as follows:
the component A comprises: 5 parts of oleic acid, 10 parts of paraffin, 1 part of triethanolamine, OP-1010 parts and 80 parts of water;
the component B comprises α -alumina 10 parts, PAAS 2 parts, benzotriazole 3 parts, potassium sorbate 3 parts, silicone oil 4 parts and water 90 parts.
The preparation method of the polishing solution of the embodiment is as follows:
(1) the preparation method of the component A comprises the following steps: mixing weighed oleic acid, paraffin, triethanolamine and OP-10 together, heating to 110 ℃ for complete melting, and continuously stirring. Weighing 90 ℃ hot water, slowly adding the hot water into the mixed liquid, keeping the liquid temperature at 70-90 ℃, and converting the mixed liquid from oily to aqueous, wherein the conversion time is about 20-60 min;
(2) the preparation method of the component B comprises weighing 90 parts of deionized water, sequentially adding PAAS, benzotriazole, potassium sorbate and silicone oil under stirring, dissolving, adding α -aluminum oxide, and stirring for 1 h;
(3) and mixing the cooled A, B components uniformly to obtain the wet CMP mirror polishing solution.
Example 2
The formula of the polishing solution of the embodiment is as follows:
the component A comprises: 3 parts of stearic acid, 5 parts of oleic acid, 10 parts of paraffin, 5 parts of palm wax, 1 part of triethanolamine, OP-1010 parts and 70 parts of water;
the component B comprises α -aluminum oxide 10 parts, sodium hexametaphosphate 2 parts, benzotriazole 3 parts, sodium sorbate 10 parts, tributyl phosphate 2 parts and water 80 parts.
The preparation method of the polishing solution of the embodiment is as follows:
(1) the preparation method of the component A comprises the following steps: mixing weighed stearic acid, oleic acid, paraffin, palm wax, triethanolamine and OP-10 together, heating to 110 ℃ for complete melting, and stirring continuously. Weighing 90 ℃ hot water, slowly adding the hot water into the melted mixed liquid, keeping the temperature of the liquid at 70-90 ℃, and converting the mixed liquid from oily to aqueous, wherein the conversion time is about 20-60 min;
(2) the component B is prepared by weighing 80 parts of deionized water, sequentially adding sodium hexametaphosphate, benzotriazole, sodium sorbate and tributyl phosphate under stirring, dissolving, adding α -alumina, and stirring for 1 h;
(3) and uniformly mixing the cooled A, B components to obtain the wet-type fine polishing solution.
Example 3
The formula of the polishing solution of the embodiment is as follows:
the component A comprises: 10 parts of oleic acid, 5 parts of paraffin, 10 parts of beeswax, 2 parts of triethanolamine, 803 parts of Span, 2010 parts of Tween and 100 parts of water;
the component B comprises α -alumina 20 parts, sodium hexametaphosphate 2 parts, barium petroleum sulfonate 3 parts, sodium benzoate 5 parts, silicone oil 2 parts and water 90 parts.
The preparation method of the polishing solution of the embodiment is as follows:
(1) the preparation method of the component A comprises the following steps: mixing weighed oleic acid, paraffin, beeswax, triethanolamine, Span 80 and Tween20, heating to 90 ℃ for complete melting, weighing 80 ℃ hot water, slowly adding the hot water into the melted mixed liquid, keeping the liquid temperature at 70-85 ℃, and continuously stirring until the mixed liquid is changed from oily to aqueous, wherein the change time is about 20-50 min.
(2) The preparation method of the component B comprises weighing 90 parts of deionized water, sequentially adding sodium hexametaphosphate, barium petroleum sulfonate, sodium benzoate and simethicone under stirring, dissolving, adding α -aluminum oxide, and stirring for 1 h.
(3) And uniformly mixing the cooled A, B components to obtain the wet-type fine polishing solution.
Example 4
The formula of the polishing solution of the embodiment is as follows:
the component A comprises: 5 parts of oleic acid, 5 parts of stearic acid, 5 parts of paraffin, 10 parts of beeswax, 2 parts of triethanolamine, 805 parts of Span, 2015 parts of Tween and 100 parts of water;
the component B comprises α -alumina 20 parts, PAAS 2 parts, barium petroleum sulfonate 2 parts, calcium propionate 4 parts, polyoxypropylene glycerol ether 2 parts and water 80 parts.
The preparation method of the polishing solution of the embodiment is as follows:
(1) the preparation method of the component A comprises the following steps: mixing weighed oleic acid, stearic acid, paraffin, beeswax, triethanolamine, Span 80 and Tween20, and heating to 100 ℃ for complete melting; weighing 90 ℃ hot water, slowly adding the hot water into the melted mixed liquid, keeping the temperature of the liquid at 85 ℃ and continuously stirring until the mixed liquid is changed from oily to aqueous, wherein the change time is about 30-50 min;
(2) the preparation method of the component B comprises the steps of weighing 80 parts of deionized water, sequentially adding PAAS, barium petroleum sulfonate, calcium propionate and polyoxypropylene glycerol ether under the condition of stirring continuously, adding α -alumina after dissolving, and stirring for 1 hour.
(3) And uniformly mixing the cooled A, B components to obtain the wet-type fine polishing solution.
Example 5
The formula of the polishing solution of the embodiment is as follows:
the component A comprises: 5 parts of stearic acid, 5 parts of paraffin, 10 parts of palm wax, 5 parts of triethanolamine, 7 parts of sodium dodecyl sulfate and 100 parts of water;
the component B comprises α -alumina 15 parts, sodium pyrophosphate 3 parts, barium petroleum sulfonate 2 parts, potassium sorbate 6 parts, simethicone 5 parts and water 100 parts.
The preparation method of the polishing solution of the embodiment is as follows:
(1) the preparation method of the component A comprises the following steps: mixing weighed stearic acid, palm wax, paraffin, triethanolamine and sodium dodecyl sulfate, and heating to 100 ℃ for complete melting. Weighing 90 deg.C hot water, slowly adding into melted mixed liquid, keeping the liquid temperature at 90 deg.C, and stirring continuously until the mixed liquid is converted from oily to aqueous, wherein the conversion time is about 30-50 min.
(2) The preparation method of the component B comprises weighing 100 parts of deionized water, sequentially adding sodium pyrophosphate and polyoxypropylene glycerol ether under stirring, dissolving, adding α -aluminum oxide, and stirring for 1 hr.
(3) And uniformly mixing the cooled A, B components to obtain the wet-type fine polishing solution.
Comparative example 1
The formula is as follows: the component A comprises: 10 parts of paraffin, 1 part of triethanolamine, OP-1010 parts and 80 parts of water.
The component B comprises α -alumina 10 parts, PAAS 2 parts, benzotriazole 3 parts, potassium sorbate 3 parts, silicone oil 4 parts and water 90 parts.
Comparative example 2
The formula is as follows: the component A comprises: 3 parts of stearic acid, 5 parts of oleic acid, 1 part of triethanolamine, OP-1010 parts and 70 parts of water;
the component B comprises α -aluminum oxide 10 parts, sodium hexametaphosphate 2 parts, benzotriazole 3 parts, sodium sorbate 10 parts, tributyl phosphate 2 parts and water 80 parts.
Comparative example 3
The formula is as follows: the component A comprises: 10 parts of oleic acid, 5 parts of paraffin, 10 parts of beeswax and 100 parts of water;
the component B comprises α -alumina 20 parts, sodium hexametaphosphate 2 parts, barium petroleum sulfonate 3 parts, sodium benzoate 5 parts, silicone oil 2 parts and water 90 parts.
Comparative example 4
The formula is as follows: the component A comprises: 2 parts of triethanolamine, 805 parts of Span, 2015 parts of Tween and 100 parts of water;
the component B comprises α -alumina 20 parts, PAAS 2 parts, barium petroleum sulfonate 2 parts, calcium propionate 4 parts, polyoxypropylene glycerol ether 2 parts and water 80 parts.
Comparative example 5
The formula is as follows: the component A comprises: 5 parts of stearic acid, 5 parts of paraffin, 10 parts of palm wax, 5 parts of triethanolamine, 7 parts of sodium dodecyl sulfate and 100 parts of water;
the component B comprises 15 parts of α -alumina, 2 parts of barium petroleum sulfonate, 6 parts of potassium sorbate, 5 parts of simethicone and 100 parts of water.
And (3) performing finish polishing on 900 medium-grinded stainless steel sheets by using the 10 polishing solutions, wherein the 900 medium-grinded stainless steel sheets have no other defects except polishing grains after medium grinding. The stainless steel sheet was finish polished by a double-side grinder with black damping cloth, divided into 10 groups and polished 3 times, and the effects after polishing are shown in table 2.
TABLE 2
From table 2 it can be found that: the yields and surface roughness were high for examples 1-5 and low for comparative examples 1-5. Comparative example 1 is lower than example 1, and the difference is that the lubricating additive, oleic acid, can play a certain lubricating role, the surface temperature of stainless steel in the polishing process is higher, and the substance generated by the saponification reaction of oleic acid and triethanolamine has cleaning and lubricating effects. The lubricity is poor, and the surface of stainless steel is easily scratched to increase the roughness. Comparative example 2 is lower than example 2, and mainly lacks wax components, and various waxes are added mainly for increasing the oily and greasy feeling of the polishing liquid and enhancing the brightness of the stainless steel surface. Comparative example 3 in example 3, the emulsifier was removed, the grease and various waxes could not be emulsified, many small particles were formed after cooling, some of the grease was adsorbed to the stainless steel surface during polishing, and the unemulsified wax particles resulted in scratching of the stainless steel surface, resulting in a decrease in the gloss of the stainless steel surface. Comparative example 4 organic acid and various wax components were removed from the polishing slurry of example 4, resulting in poor lubricity and "whitening" due to the formation of fine cracks on the surface of stainless steel. Examples 4 organic acids are: the oleic acid and the stearic acid have better lubricating property and also have good antirust and increment effects. Various waxes are emulsified into small liquid drops to be adsorbed on the surface of the stainless steel, fine cracks on the surface of the stainless steel can be repaired, substances generated by saponification reaction of oleic acid and triethanolamine have cleaning and lubricating effects, and dirt on the surface of the stainless steel can be removed in time. It can be seen that: the organic acid and various waxes have the coordination function in brightening and rust prevention. Comparative example 5 no suspending agent was added based on example 5, and the polishing slurry exhibited a certain degree of abrasive agglomeration, resulting in fine scratches and a decrease in gloss.
The polishing solution disclosed by the invention is reasonable in components, simple to prepare, safe in added components, alkalescent, free of corrosion and convenient for large-scale production and preparation. And a higher surface quality effect can be obtained by adopting a reasonable polishing mode and polishing consumables.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A wet CMP mirror polishing solution for polishing a stainless steel mobile phone middle frame is characterized by consisting of A, B components, wherein the component A is prepared from the following components in parts by weight: 5-30 parts of organic acid, 3-40 parts of wax, 4-20 parts of emulsifier and 30-100 parts of deionized water; the component B is prepared from the following components in parts by weight: 4-60 parts of abrasive, 1-10 parts of suspending agent, 1-5 parts of corrosion inhibitor, 1-5 parts of preservative, 1-10 parts of defoaming agent and 20-100 parts of deionized water.
2. The wet CMP mirror polishing liquid according to claim 1, wherein: the organic acid is selected from one or more of formic acid, acetic acid, oleic acid, citric acid, stearic acid, glycolic acid, polyacrylic acid and succinic acid.
3. The wet CMP mirror polishing liquid according to claim 1, wherein: the wax is selected from one or more of carnauba wax, paraffin wax, beeswax, microcrystalline wax, Japan wax, and Cera chinensis.
4. The wet CMP mirror polishing liquid according to claim 1, wherein: the emulsifier is selected from one or more of triethanolamine, triethanolamine oleate soap, sodium dodecyl sulfate, sodium oleate, OP-10, AEO, NPO, polyethylene glycol, nonylphenol polyoxyethylene ether, tween-20, tween-60 and Span-80.
5. The wet CMP mirror polishing solution according to claim 1, wherein the abrasive is one or more selected from diamond, cubic boron nitride, α -alumina, chromium oxide, and iron oxide, and has an abrasive particle size of 1 μm or less.
6. The wet CMP mirror polishing liquid according to claim 1, wherein: the suspending agent is selected from one or more of sodium hexametaphosphate, sodium pyrophosphate and PAAS.
7. The wet CMP mirror polishing liquid according to claim 1, wherein: the corrosion inhibitor is selected from one or more of hexamethylenetetramine, benzotriazole, hexadecylamine, polyaspartic acid, sodium gluconate, barium petroleum sulfonate, rosin and sodium petroleum sulfonate.
8. The wet CMP mirror polishing liquid according to claim 1, wherein: the preservative is selected from one or more of sodium benzoate, sodium sorbate, potassium sorbate, calcium propionate and butyl p-hydroxybenzoate.
9. The wet CMP mirror polishing liquid according to claim 1, wherein: the defoaming agent is selected from one or more of simethicone, tributyl phosphate, polyoxyethylene polyoxypropylene amine ether and polyoxypropylene glycerol ether.
10. The method for preparing a wet CMP mirror polishing solution according to claim 1, characterized by comprising the steps of:
1) the preparation method of the component A comprises the following steps: mixing organic acid, wax and emulsifier of component A together by phase transition agent in oil method, heating to 80-120 deg.C for complete melting, adding 100 deg.C hot water, and stirring at high speed until it becomes water-based;
2) the preparation method of the component B comprises the following steps: taking deionized water, sequentially adding a suspending agent, a corrosion inhibitor, a preservative and a defoaming agent, stirring uniformly and fully to dissolve, adding an abrasive, and stirring for 1h for later use;
3) and stirring and mixing the cooled component A and the cooled component B uniformly to obtain the wet CMP mirror polishing solution.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113667408A (en) * | 2021-09-23 | 2021-11-19 | 东莞市岩奥新材料有限公司 | Multifunctional liquid wax and preparation method thereof |
| CN116640517A (en) * | 2023-05-18 | 2023-08-25 | 太原钢铁(集团)有限公司 | Polishing abrasive for composite steel plate and preparation method thereof |
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|---|---|---|---|---|
| CN102199400A (en) * | 2011-03-25 | 2011-09-28 | 江南大学 | Copper polishing slurry for use in fine atomized CMP process |
| WO2018120812A1 (en) * | 2016-12-28 | 2018-07-05 | 安集微电子科技（上海）股份有限公司 | Chemical mechanical polishing liquid used for planarizing barrier layer |
| CN110591564A (en) * | 2019-09-17 | 2019-12-20 | 昆山纳诺新材料科技有限公司 | Wet CMP mirror polishing solution and preparation method thereof |
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2020
- 2020-03-31 CN CN202010243139.4A patent/CN111234708A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102199400A (en) * | 2011-03-25 | 2011-09-28 | 江南大学 | Copper polishing slurry for use in fine atomized CMP process |
| WO2018120812A1 (en) * | 2016-12-28 | 2018-07-05 | 安集微电子科技（上海）股份有限公司 | Chemical mechanical polishing liquid used for planarizing barrier layer |
| CN110591564A (en) * | 2019-09-17 | 2019-12-20 | 昆山纳诺新材料科技有限公司 | Wet CMP mirror polishing solution and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113667408A (en) * | 2021-09-23 | 2021-11-19 | 东莞市岩奥新材料有限公司 | Multifunctional liquid wax and preparation method thereof |
| CN116640517A (en) * | 2023-05-18 | 2023-08-25 | 太原钢铁(集团)有限公司 | Polishing abrasive for composite steel plate and preparation method thereof |
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