CN111208144B - Defect detection system and defect detection method - Google Patents
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Abstract
本发明公开了缺陷检测系统和缺陷检测方法,缺陷检测系统包括光源模块,用于出射第一检测光束;分束模块用于对第一检测光束进行分束,得到多束第二检测光束;多束第二检测光束入射至待检测样品表面的多个位置,经待检测样品反射后得到多束反射光束,多束反射光束携带待检测样品表面多个位置的表面信息;探测模块用于接收并探测多束反射光束,得到待检测样品的表面信息;表面信息包括表面平整度信息和表面倾斜度信息;成像模块与探测模块连接,用于接收表面信息,并根据表面信息对待检测样品的表面进行成像。通过获取待检测样品的表面信息,根据表面信息对待检测样品的表面进行一次或者多次成像,保证可以对待检测样品的整个表面均进行清晰成像。
The invention discloses a defect detection system and a defect detection method. The defect detection system includes a light source module for emitting a first detection beam; a beam splitting module for splitting the first detection beam to obtain multiple second detection beams; The second detection beam is incident on multiple positions on the surface of the sample to be detected, and multiple reflected beams are obtained after being reflected by the sample to be detected, and the multiple reflected beams carry surface information of multiple positions on the surface of the sample to be detected; the detection module is used to receive and Detect multiple reflected light beams to obtain the surface information of the sample to be tested; the surface information includes surface flatness information and surface inclination information; the imaging module is connected to the detection module to receive surface information, and according to the surface information, the surface of the sample to be tested is processed. imaging. By obtaining the surface information of the sample to be tested, one or more imaging is performed on the surface of the sample to be tested according to the surface information, so as to ensure that the entire surface of the sample to be tested can be clearly imaged.
Description
技术领域technical field
本发明实施例涉及缺陷检测技术领域,尤其涉及一种缺陷检测系统和缺陷检测方法。Embodiments of the present invention relate to the technical field of defect detection, and in particular, to a defect detection system and a defect detection method.
背景技术Background technique
对待测量表面进行缺陷检测时,往往受限于镜头有限的焦深,为实现高分辨率的亚微米缺陷成像,需要进行实时自动聚焦。镜头对焦用自动聚焦技术依据聚焦光束走向不同可以分为同轴落射光方案和离轴倾斜光方案。同轴落射光方案需要棱镜将调焦光束反射进入缺陷检测镜头,在高精度应用场合引入镜头之外的棱镜会导致严重的像散,得不偿失。离轴倾斜光方案其调焦光束无需复用缺陷检测镜头,因此适用于高精度缺陷检测场景。When performing defect detection on the surface to be measured, it is often limited by the limited focal depth of the lens. In order to achieve high-resolution sub-micron defect imaging, real-time automatic focusing is required. The autofocus technology used for lens focusing can be divided into coaxial epi-light scheme and off-axis oblique light scheme according to the direction of the focused beam. The coaxial epi-light solution requires a prism to reflect the focusing beam into the defect detection lens. In high-precision applications, the introduction of a prism outside the lens will cause serious astigmatism, which is not worth the candle. The off-axis tilted light solution does not need to multiplex the defect detection lens for its focusing beam, so it is suitable for high-precision defect detection scenarios.
现有技术可采用调焦调平传感器,其原理是基于倾斜光通过两组光栅形成的莫尔条纹进行调焦,但该方法所用宽带光源会对缺陷检测干扰,无法应用于缺陷检测技术中。或者基于三角法的激光位移传感器可以用于镜头的实时自动聚焦,且提供参考光束。但该这两种方法仅能测量单点焦面。Focusing and leveling sensors can be used in the existing technology. The principle is to adjust the focus based on moiré fringes formed by oblique light passing through two groups of gratings. However, the broadband light source used in this method will interfere with defect detection and cannot be applied to defect detection technology. Or a triangulation-based laser displacement sensor can be used for real-time autofocus of the lens and provide a reference beam. But these two methods can only measure single-point focal plane.
实际应用中,由于大靶面相机的较大靶面尺寸,因此测量视场也相应较大,一般有数十毫米。在整个测量视场内,被测样品的表面形貌起伏可能会远远超出镜头焦深。因此单点焦面测量无法准确表征镜头的最佳焦面,无法对整个测量表面进行清晰成像。In practical applications, due to the large target surface size of the large target surface camera, the measurement field of view is also relatively large, generally tens of millimeters. In the entire measurement field of view, the surface topography of the measured sample may fluctuate far beyond the focal depth of the lens. Therefore, single-point focal plane measurement cannot accurately characterize the best focal plane of the lens, and cannot clearly image the entire measurement surface.
发明内容Contents of the invention
有鉴于此,本发明实施例提供一种缺陷检测系统和缺陷检测方法,以解决现有技术中单点焦面测量无法准确表征镜头的最佳焦面,无法对整个测量表面进行清晰成像的技术问题。In view of this, an embodiment of the present invention provides a defect detection system and a defect detection method to solve the problem that the single-point focal plane measurement in the prior art cannot accurately characterize the best focal plane of the lens and cannot clearly image the entire measurement surface question.
第一方面,本发明实施例提供了一种缺陷检测系统,包括:In a first aspect, an embodiment of the present invention provides a defect detection system, including:
光源模块,用于出射第一检测光束;a light source module, configured to emit the first detection light beam;
分束模块,位于所述第一检测光束的传播路径上,用于对所述第一检测光束进行分束,得到多束第二检测光束;多束所述第二检测光束入射至待检测样品表面的多个位置,经所述待检测样品反射后得到多束反射光束,多束所述反射光束携带所述待检测样品表面多个位置的表面信息;A beam splitting module, located on the propagation path of the first detection beam, for splitting the first detection beam to obtain multiple second detection beams; multiple second detection beams are incident on the sample to be detected Multiple positions on the surface are reflected by the sample to be detected to obtain multiple reflected beams, and the multiple reflected beams carry surface information of multiple positions on the surface of the sample to be detected;
探测模块,位于多束所述反射光束的传播路径上,用于接收并探测多束所述反射光束,并通过分析多束反射光束在探测面上的光斑位置变化,得到所述待检测样品的表面信息;所述表面信息包括表面平整度信息和表面倾斜度信息;The detection module is located on the propagation path of the multiple reflected light beams, and is used to receive and detect the multiple reflected light beams, and obtain the position of the sample to be detected by analyzing the spot position changes of the multiple reflected light beams on the detection surface. Surface information; the surface information includes surface flatness information and surface inclination information;
成像模块,与所述探测模块连接,用于接收所述表面信息,并根据所述表面信息对所述待检测样品的表面进行至少一次对焦成像。An imaging module, connected to the detection module, is used to receive the surface information, and perform at least one focused imaging on the surface of the sample to be detected according to the surface information.
可选的,所述缺陷检测系统还包括傅里叶透镜;Optionally, the defect detection system also includes a Fourier lens;
所述傅里叶透镜位于多束所述反射光束的传播路径上,用于对多束所述反射光束进行汇聚,得到多束汇聚光束;The Fourier lens is located on the propagation path of the multiple reflected beams, and is used to converge the multiple reflected beams to obtain multiple converged beams;
所述探测模块位于多束所述汇聚光束的传播路径上,用于接收并探测多束所述汇聚光束,并根据所述多束汇聚反射光束在探测面上的光斑位置变化得到所述待检测样品的表面信息。The detection module is located on the propagation path of the multiple converged light beams, and is used to receive and detect the multiple converged light beams, and obtain the to-be-detected surface information of the sample.
可选的,所述成像模块包括成像镜头、成像相机和处理单元;Optionally, the imaging module includes an imaging lens, an imaging camera and a processing unit;
所述成像镜头和所述成像相机连接;The imaging lens is connected to the imaging camera;
所述处理单元分别与所述探测模块和所述成像相机连接,用于接收所述表面信息,并根据所述表面信息控制所述成像相机和所述成像镜头对所述待检测样品的表面进行至少一次对焦成像。The processing unit is respectively connected with the detection module and the imaging camera, and is used to receive the surface information, and control the imaging camera and the imaging lens to perform detection on the surface of the sample to be detected according to the surface information. Focus imaging at least once.
可选的,所述分束模块包括衍射光栅,所述衍射光栅用于对所述第一检测光束进行分束,得到多束能量相同的第二检测光束。Optionally, the beam splitting module includes a diffraction grating, and the diffraction grating is used to split the first detection beam to obtain multiple second detection beams with the same energy.
第二方面,本发明实施例还提供了一种缺陷检测方法,采用上述所述的缺陷检测系统,包括:In the second aspect, the embodiment of the present invention also provides a defect detection method, using the above-mentioned defect detection system, including:
获取待检测样品的表面信息;所述表面信息包括表面平整度信息和表面倾斜度信息;Acquiring surface information of the sample to be tested; the surface information includes surface flatness information and surface inclination information;
根据所述表面信息对所述待检测样品的表面进行至少一次对焦成像。performing at least one focused imaging on the surface of the sample to be detected according to the surface information.
可选的,多束所述第二检测光束入射至待检测样品表面的多个位置,对应所述待检测样品表面的多个子表面;Optionally, multiple second detection light beams are incident on multiple positions on the surface of the sample to be detected, corresponding to multiple sub-surfaces on the surface of the sample to be detected;
根据所述表面信息对所述待检测样品的表面进行至少一次对焦成像,包括:Carrying out at least one focus imaging on the surface of the sample to be detected according to the surface information, including:
确定每个所述子表面中的子最高值信息和子最低值信息;determining sub-highest value information and sub-lowest value information in each of said sub-surfaces;
多个所述子最高值信息中的最大值信息为所述表面最高值信息,多个所述子最低值信息的最小值信息为所述表面最低值信息;The maximum value information among the plurality of sub-maximum value information is the surface maximum value information, and the minimum value information of the plurality of sub-minimum value information is the surface minimum value information;
当所述表面最高值信息和表面最低值信息之间的差值与所述成像模块的焦深满足第一预设关系时,计算所述待检测样品表面的最优焦面信息,根据所述最优焦面信息对所述待检测样品的表面进行最优焦面对焦成像;When the difference between the surface highest value information and the surface minimum value information and the focal depth of the imaging module satisfy a first preset relationship, calculate the optimal focal plane information of the surface of the sample to be detected, according to the The optimal focal plane information is used to perform optimal focal plane focusing imaging on the surface of the sample to be detected;
当所述表面最高值信息和表面最低值信息之间的差值与所述成像模块的焦深满足第二预设关系时,控制所述成像模块对所述待检测样品的表面进行多次对焦成像。When the difference between the surface highest value information and the surface minimum value information and the focal depth of the imaging module satisfy a second preset relationship, the imaging module is controlled to focus on the surface of the sample to be detected multiple times imaging.
可选的,计算所述待检测样品表面的最优焦面信息,包括:Optionally, calculating the optimal focal plane information of the surface of the sample to be detected includes:
根据所述表面最高值信息和所述表面最低值信息计算表面平均高度信息;calculating surface average height information according to the surface maximum value information and the surface minimum value information;
将所述表面平均高度信息对应的焦面作为最优焦面。The focal plane corresponding to the surface average height information is used as the optimal focal plane.
可选的,计算所述待检测样品表面的最优焦面信息,包括:Optionally, calculating the optimal focal plane information of the surface of the sample to be detected includes:
分别获取所述待检测样品表面中心区域对应的第一焦面信息和所述待检测样品表面边缘区域对应的第二焦面信息;Respectively acquiring the first focal plane information corresponding to the center area of the surface of the sample to be detected and the second focal plane information corresponding to the edge area of the surface of the sample to be detected;
根据所述第一焦面信息和所述第二焦面信息,采用不同的加权系数计算所述待检测样品表面的最优焦面信息,其中,所述第一焦面信息的加权系数大于所述第二焦面信息的加权系数。According to the first focal plane information and the second focal plane information, different weighting coefficients are used to calculate the optimal focal plane information of the surface of the sample to be detected, wherein the weighting coefficient of the first focal plane information is greater than the specified The weighting coefficient of the second focal plane information.
可选的,控制所述成像模块对所述待检测样品的表面进行多次对焦成像,包括:Optionally, controlling the imaging module to perform multiple focus imaging on the surface of the sample to be detected, including:
根据所述表面最高值信息和表面最低值信息之间的差值以及所述成像模块的焦深,确定对焦成像次数;Determine the number of in-focus imaging according to the difference between the surface highest value information and the surface minimum value information and the focal depth of the imaging module;
根据所述对焦成像次数,移动所述成像模块,控制所述成像模块对所述待检测样品的表面进行多次对焦成像;其中,每次对焦成像时,所述成像模块视野内的最高值与最低值之间的差值信息小于或者等于所述成像模块的焦深。According to the number of times of focus imaging, the imaging module is moved, and the imaging module is controlled to perform multiple focus imaging on the surface of the sample to be detected; wherein, during each focus imaging, the highest value in the field of view of the imaging module is the same as The difference information between the lowest values is less than or equal to the focal depth of the imaging module.
可选的,当所述表面最高值信息和表面最低值信息之间的差值H与所述成像模块的焦深DOF满足H<2*DOF时,所述表面最高值信息和表面最低值信息之间的差值与所述成像模块的焦深满足第一预设关系;Optionally, when the difference H between the surface maximum value information and the surface minimum value information and the focal depth DOF of the imaging module satisfy H<2*DOF, the surface maximum value information and the surface minimum value information The difference between and the focal depth of the imaging module satisfy a first preset relationship;
当所述表面最高值信息和表面最低值信息之间的差值H与所述成像模块的焦深DOF满足H≥2*DOF时,所述表面最高值信息和表面最低值信息之间的差值与所述成像模块的焦深满足第二预设关系。When the difference H between the surface highest value information and the surface minimum value information and the depth of focus DOF of the imaging module satisfy H≥2*DOF, the difference between the surface highest value information and the surface minimum value information The value and the focal depth of the imaging module satisfy a second preset relationship.
本发明实施例提供的缺陷检测系统,通过设置分束模块对光源模块出射的第一检测光束进行分束,得到多束第二检测光束,多束第二检测光束入射至待检测样品表面的多个位置,经待检测样品反射后得到多束反射光束,多束反射光束携带待检测样品表面多个位置的表面信息;探测模块用于根据多束反射光束得到待检测样品的表面信息,成像模块用于根据表面信息对待检测样品的表面进行至少一次对焦成像。如此,当待检测样品的表面平整度满足设定平整度要求或者待检测样品的表面倾斜度较小时,可以仅对待检测样品表面进行一次对焦成像即可保证得到整个待成像表面的清晰图像,当待检测样品的表面平整度不满足设定的平整度要求或者待检测样品的表面倾斜度较大时,可以根据待检测样品的表面信息对待检测样品的表面进行多次对焦成像,保证得到整个待成像表面的清晰图像。基于待成像表面的清晰图像对待成像表面进行缺陷度检测,保证检测精度高;并且,本发明实施例提供的缺陷检测系统,通过多束第二检测光束对待成像表面进行检测,基于表面信息进行至少一次对焦成像,可以解决现有技术中单光束检测单焦面对焦成像带来的对焦检测效率低下,且无法区分离焦或者样品倾斜的问题。The defect detection system provided by the embodiment of the present invention splits the first detection beam emitted by the light source module by setting a beam splitting module to obtain multiple second detection beams, and the multiple second detection beams are incident on the surface of the sample to be detected. Multiple reflected beams are obtained after being reflected by the sample to be detected, and the multiple reflected beams carry surface information of multiple positions on the surface of the sample to be detected; the detection module is used to obtain the surface information of the sample to be detected according to the multiple reflected beams, and the imaging module It is used for performing at least one focus imaging on the surface of the sample to be detected according to the surface information. In this way, when the surface flatness of the sample to be tested meets the set flatness requirements or the surface inclination of the sample to be tested is small, only one focus imaging of the surface of the sample to be tested can ensure a clear image of the entire surface to be imaged. When the surface flatness of the sample to be tested does not meet the set flatness requirements or the surface of the sample to be tested has a large inclination, multiple focus imaging can be performed on the surface of the sample to be tested according to the surface information of the sample to be tested to ensure that the entire sample to be tested is obtained. Sharp images of imaging surfaces. Based on the clear image of the surface to be imaged, the defect degree of the surface to be imaged is detected to ensure high detection accuracy; moreover, the defect detection system provided by the embodiment of the present invention detects the surface to be imaged by multiple second detection beams, and at least based on the surface information One-time focus imaging can solve the problems of low focus detection efficiency caused by single-beam detection and single-focus plane focus imaging in the prior art, and the problem of inability to distinguish defocus or sample tilt.
附图说明Description of drawings
通过阅读参照以下附图所作的对非限制性实施例所作的详细描述,本发明的其它特征、目的和优点将会变得更明显:Other characteristics, objects and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:
图1是现有技术中一种缺陷检测系统的结构示意图Fig. 1 is a structural schematic diagram of a defect detection system in the prior art
图2是本发明实施例提供的一种缺陷检测系统的结构示意图;2 is a schematic structural diagram of a defect detection system provided by an embodiment of the present invention;
图3是本发明实施例提供的另一种缺陷检测系统的结构示意图;FIG. 3 is a schematic structural diagram of another defect detection system provided by an embodiment of the present invention;
图4是本发明实施例提供的一种缺陷检测方法的流程示意图;FIG. 4 is a schematic flowchart of a defect detection method provided by an embodiment of the present invention;
图5是本发明实施例提供的一种多束第二检测光束对待检测样品表面多个位置进行检测的示意图;Fig. 5 is a schematic diagram of a plurality of second detection beams provided by an embodiment of the present invention for detecting multiple positions on the surface of a sample to be detected;
图6是本发明实施例提供的另一种缺陷检测方法的流程示意图;FIG. 6 is a schematic flowchart of another defect detection method provided by an embodiment of the present invention;
图7是本发明实施例提供的一种多次对焦成像的示意图。FIG. 7 is a schematic diagram of a multi-focus imaging provided by an embodiment of the present invention.
具体实施方式Detailed ways
为使本发明的目的、技术方案和优点更加清楚,以下将结合本发明实施例中的附图,通过具体实施方式,完整地描述本发明的技术方案。显然,所描述的实施例是本发明的一部分实施例,而不是全部的实施例,基于本发明的实施例,本领域普通技术人员在没有做出创造性劳动的前提下获得的所有其他实施例,均落入本发明的保护范围之内。In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be fully described below through specific implementation in combination with the drawings in the embodiments of the present invention. Apparently, the described embodiments are some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts, All fall within the protection scope of the present invention.
图1是现有技术中一种缺陷检测系统的结构示意图,如图1所示,现有的缺陷检测系统中,光源11发光的光束入射至待检测样品12的中心区域,经待检测样品12反射后入射至成像单元13,成像单元13仅可以对待检测样品12的中心区域进行单焦面成像,得到待检测样品12的中心区域的清晰图像。当待检测样品12表面较大,且待检测样品12的表面平整度较差,或者待检测样品12的表面倾斜程度较大,单焦面成像无法得到整个待检测样品表面的清晰图像,无法对待成像表面进行精确的缺陷检测。Fig. 1 is a schematic structural diagram of a defect detection system in the prior art. As shown in Fig. 1, in the existing defect detection system, the light beam emitted by the light source 11 is incident on the central area of the
基于上述技术问题,本发明实施例提供了一种缺陷检测系统,包括:光源模块,用于出射第一检测光束;分束模块,位于第一检测光束的传播路径上,用于对第一检测光束进行分束,得到多束第二检测光束;多束第二检测光束入射至待检测样品表面的多个位置,经待检测样品反射后得到多束反射光束,多束反射光束携带待检测样品表面多个位置的表面信息;探测模块,位于多束反射光束的传播路径上,用于接收并探测多束反射光束,并通过分析多束反射光束在探测面上的光斑位置变化,得到待检测样品的表面信息;表面信息包括表面平整度信息和表面倾斜度信息;成像模块,与探测模块连接,用于接收表面信息,并根据表面信息对待检测样品的表面进行至少一次对焦成像。采用上述技术方案,通过设置分束模块对光源模块出射的第一检测光束进行分束,得到多束第二检测光束,多束第二检测光束入射至待检测样品表面的多个位置,经待检测样品反射后得到多束反射光束,多束反射光束携带待检测样品表面多个位置的表面信息;探测模块用于根据多束反射光束在探测面上的光斑位置变化得到待检测样品的表面信息,成像模块用于根据表面信息对待检测样品的表面进行至少一次对焦成像。如此,当待检测样品的表面平整度满足设定平整度要求或者待检测样品的表面倾斜度较小时,可以仅对待检测样品表面进行一次对焦成像即可保证得到整个待成像表面的清晰图像,当待检测样品的表面平整度不满足设定的平整度要求或者待检测样品的表面倾斜度较大时,可以根据待检测样品的表面信息对待检测样品的表面进行多次对焦成像,保证得到整个待成像表面的清晰图像。基于待成像表面的清晰图像对待成像表面进行缺陷度检测,保证检测精度高;并且,本发明实施例提供的缺陷检测系统,通过多束第二检测光束对待成像表面进行检测,基于表面信息进行至少一次对焦成像,可以解决现有技术中单光束检测单焦面对焦成像带来的对焦检测效率低下,且无法区分离焦或者样品倾斜的问题。Based on the above technical problems, an embodiment of the present invention provides a defect detection system, including: a light source module, used to emit the first detection beam; a beam splitting module, located on the propagation path of the first detection beam, for detecting The beam is split to obtain multiple second detection beams; the multiple second detection beams are incident on multiple positions on the surface of the sample to be detected, and after being reflected by the sample to be detected, multiple reflected beams are obtained, and the multiple reflected beams carry the sample to be detected The surface information of multiple positions on the surface; the detection module is located on the propagation path of the multiple reflected beams, and is used to receive and detect the multiple reflected beams, and by analyzing the position changes of the multiple reflected beams on the detection surface, the detected The surface information of the sample; the surface information includes surface flatness information and surface inclination information; the imaging module is connected with the detection module to receive the surface information, and perform at least one focus imaging on the surface of the sample to be detected according to the surface information. By adopting the above-mentioned technical solution, by setting the beam splitting module to split the first detection beam emitted by the light source module, multiple second detection beams are obtained, and the multiple second detection beams are incident on multiple positions on the surface of the sample to be tested. After detecting the reflection of the sample, multiple reflected beams are obtained, and the multiple reflected beams carry the surface information of multiple positions on the surface of the sample to be tested; the detection module is used to obtain the surface information of the sample to be tested according to the spot position changes of the multiple reflected beams on the detection surface , the imaging module is used to perform at least one focused imaging on the surface of the sample to be detected according to the surface information. In this way, when the surface flatness of the sample to be tested meets the set flatness requirements or the surface inclination of the sample to be tested is small, only one focus imaging of the surface of the sample to be tested can ensure a clear image of the entire surface to be imaged. When the surface flatness of the sample to be tested does not meet the set flatness requirements or the surface of the sample to be tested has a large inclination, multiple focus imaging can be performed on the surface of the sample to be tested according to the surface information of the sample to be tested to ensure that the entire sample to be tested is obtained. Sharp images of imaging surfaces. Based on the clear image of the surface to be imaged, the defect degree of the surface to be imaged is detected to ensure high detection accuracy; moreover, the defect detection system provided by the embodiment of the present invention detects the surface to be imaged by multiple second detection beams, and at least based on the surface information One-time focus imaging can solve the problems of low focus detection efficiency caused by single-beam detection and single-focus plane focus imaging in the prior art, and the problem of inability to distinguish defocus or sample tilt.
以上是本发明的核心思想,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下,所获得的所有其他实施例,都属于本发明保护的范围。The above is the core idea of the present invention, and the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
图2是本发明实施例提供的一种缺陷检测系统的结构示意图,如图2所示,本发明实施例提供的缺陷检测系统包括光源模块21、分束模块22、探测模块23和成像模块24;光源模块21用于出射第一检测光束211;分束模块22位于第一检测光束211的传播路径上,用于对第一检测光束211进行分束,得到多束第二检测光束221;多束第二检测光束入射至待检测样品25表面的多个位置,经待检测样品25反射后得到多束反射光束222,多束反射光束222携带待检测样品25表面多个位置的表面信息;探测模块23位于多束反射光束222的传播路径上,用于接收并探测多束反射光束222,并通过分析多束反射光束222在探测面上的光斑位置变化,得到待检测样品的表面信息;表面信息包括表面平整度信息和表面倾斜度信息;成像模块24与探测模块23连接(图中未示出),用于接收表面信息,并根据表面信息对待检测样品的表面进行至少一次对焦成像。Fig. 2 is a schematic structural diagram of a defect detection system provided by an embodiment of the present invention. As shown in Fig. 2 , the defect detection system provided by an embodiment of the present invention includes a light source module 21, a beam splitting module 22, a detection module 23 and an imaging module 24 The light source module 21 is used to emit the first detection beam 211; the beam splitting module 22 is located on the propagation path of the first detection beam 211, and is used to split the first detection beam 211 to obtain multiple second detection beams 221; A second detection beam is incident on multiple positions on the surface of the sample 25 to be detected, and multiple reflected beams 222 are obtained after being reflected by the sample 25 to be detected, and the multiple reflected beams 222 carry surface information of multiple positions on the surface of the sample 25 to be detected; The module 23 is located on the propagation path of the multiple reflected beams 222, and is used to receive and detect the multiple reflected beams 222, and obtain the surface information of the sample to be detected by analyzing the position changes of the multiple reflected beams 222 on the detection surface; The information includes surface flatness information and surface inclination information; the imaging module 24 is connected to the detection module 23 (not shown in the figure) for receiving surface information and performing at least one focus imaging on the surface of the sample to be inspected according to the surface information.
示例性的,如图2所示,分束模块22位于第一检测光束211的传播路径上,用于对第一检测光束211进行分束,得到多束第二检测光束221,如此多束第二检测光束可以入射至待检测样品25表面的多个位置,经待检测样品25反射后得到多束反射光束222,多束反射光束222携带待检测样品25表面多个位置的表面信息,这里所述的表面信息可以包括表面平整度信息和表面倾斜度信息,表面平整度信息可以理解为待检测样品25的表面各点与设定表面之间的高度差;表面倾斜度信息可以理解为待检测样品25表面的倾角信息,这里的倾角可以理解为待检测样品25表面与设定表面的夹角,设定表面可以为水平面或者铅垂面,本发明实施例对此不进行限定。Exemplarily, as shown in FIG. 2, the
进一步的,探测模块23接收并探测多束反射光束222,并根据多束反射光束222在探测面上的光斑位置变化得到待检测样品的表面信息,探测模块23可以为CCD或者CMOS探测器,本发明实施例对此不进行限定。Further, the
进一步的,成像模块24与探测模块23连接(图中未示出),接收待检测样品25的表面信息,并根据表面信息对待检测样品25的表面进行至少一次对焦成像。具体的,当待检测样品25的表面平整度良好满足设定平整度要求,或者待检测样品的表面倾斜度较小时,可以仅对待检测样品25表面进行一次对焦成像即可保证得到整个待检测样品表面的清晰图像;当待检测样品的表面平整度较差不满足设定的平整度要求,或者待检测样品的表面倾斜度较大时,可以根据待检测样品的表面信息对待检测样品的表面的不同位置进行多次对焦成像,保证得到整个待成像表面的清晰图像。如此通过对待检测样品25的成像表面进行平整度检测,基于平整度信息采用不同的对焦成像策略,保证得到待检测样品25的表面清晰成像图像,如此基于待成像表面的清晰图像对待成像表面进行缺陷度检测,保证检测精度高。Further, the
综上,本发明实施例提供的缺陷检测系统,通过设置分束模块对光源模块出射的第一检测光束进行分束,得到多束第二检测光束,多束第二检测光束入射至待检测样品表面的多个位置,经待检测样品反射后得到多束反射光束,多束反射光束携带待检测样品表面多个位置的表面信息;探测模块用于根据多束反射光束在探测面上的光斑位置变化得到待检测样品的表面信息,成像模块用于根据表面信息对待检测样品的表面进行至少一次对焦成像。如此,当待检测样品的表面平整度满足设定平整度要求或者待检测样品的表面倾斜度较小时,可以仅对待检测样品表面进行一次对焦成像即可保证得到整个待成像表面的清晰图像,当待检测样品的表面平整度不满足设定的平整度要求或者待检测样品的表面倾斜度较大时,可以根据待检测样品的表面信息对待检测样品的表面进行多次对焦成像,保证得到整个待成像表面的清晰图像。基于待成像表面的清晰图像对待成像表面进行缺陷度检测,保证检测精度高;并且,本发明实施例提供的缺陷检测系统,通过多束第二检测光束对待成像表面进行检测,基于表面信息进行至少一次对焦成像,可以解决现有技术中单光束检测单焦面对焦成像带来的对焦检测效率低下,且无法区分离焦或者样品倾斜的问题。To sum up, the defect detection system provided by the embodiment of the present invention splits the first detection beam emitted by the light source module by setting a beam splitting module to obtain multiple second detection beams, and the multiple second detection beams are incident on the sample to be tested Multiple positions on the surface are reflected by the sample to be detected to obtain multiple reflected beams, and the multiple reflected beams carry surface information of multiple positions on the surface of the sample to be detected; The surface information of the sample to be detected is obtained by changing, and the imaging module is used to perform at least one focus imaging on the surface of the sample to be detected according to the surface information. In this way, when the surface flatness of the sample to be tested meets the set flatness requirements or the surface inclination of the sample to be tested is small, only one focus imaging of the surface of the sample to be tested can ensure a clear image of the entire surface to be imaged. When the surface flatness of the sample to be tested does not meet the set flatness requirements or the surface of the sample to be tested has a large inclination, multiple focus imaging can be performed on the surface of the sample to be tested according to the surface information of the sample to be tested to ensure that the entire sample to be tested is obtained. Sharp images of imaging surfaces. Based on the clear image of the surface to be imaged, the defect degree of the surface to be imaged is detected to ensure high detection accuracy; moreover, the defect detection system provided by the embodiment of the present invention detects the surface to be imaged by multiple second detection beams, and at least based on the surface information One-time focus imaging can solve the problems of low focus detection efficiency caused by single-beam detection and single-focus plane focus imaging in the prior art, and the problem of inability to distinguish defocus or sample tilt.
可选的,图3是本发明实施例提供的另一种缺陷检测系统的结构示意图,如图3所示,本发明实施例提供的缺陷检测系统还可以包括傅里叶透镜26,傅里叶透镜26位于多束反射光束222的传播路径上,用于对多束反射光束222进行汇聚,得到多束汇聚光束261;探测模块23位于多束汇聚光束261的传播路径上,用于接收并探测多束汇聚光束261,并根据多束汇聚反射光束261在探测面上的光斑位置变化得到待检测样品25的表面信息。Optionally, FIG. 3 is a schematic structural diagram of another defect detection system provided by an embodiment of the present invention. As shown in FIG. The
示例性的,对比图2和图3可以知道,通过增设傅里叶透镜26,通过傅里叶透镜26对多束反射光束222进行汇聚得到多束汇聚光束261,此时多束汇聚光束261的光斑覆盖的面积小于多束反射光束222的光斑覆盖的面积,此时可以采用较小面积的探测模块23接收多束汇聚光束261,一方面有利于节省探测模块23的成本,进而减少整个缺陷检测系统的成本;另一方面可以减小整个缺陷检测系统的体积,有利于实现小型化高集成度的缺陷检测系统,符合缺陷检测系统小型化高集成化的发展趋势。Exemplarily, by comparing Fig. 2 and Fig. 3, it can be known that by adding a
进一步,由于反射光束222携带待检测样品25表面的倾角信息,反射光束222经过傅里叶透镜26后进行傅里叶变换,此时并不会产生额外的位移误差,保证探测模块23可以准确探测待检测样品25的表面信息,不会因增加透镜产生额外的位移误差,保证探测准确度高。Further, since the reflected
可选的,继续参考图2和图3所示,本发明实施例提供的缺陷检测系统中,成像模块24可以包括成像镜头241、成像相机242和处理单元243;其中,成像镜头241和成像相机242连接;处理单元243分别与探测模块23和成像相机242连接,用于接收表面信息,并根据表面信息控制成像相机242和成像镜头241对待检测样品25的表面进行至少一次对焦成像。Optionally, continue to refer to Fig. 2 and Fig. 3, in the defect detection system provided by the embodiment of the present invention, the
具体的,成像模块24可以包括成像镜头241、成像相机242和处理单元243;成像镜头241可以为高倍率高数值孔径的成像镜头,保证可以对待检测样品25的表面进行清晰成像;成像相机242可以为大靶面成像相机,保证可以实现对较大面积的待检测样品25的表面进行成像;处理单元243分别与探测模块23和成像相机242连接,用于根据表面信息调整成像相机242和成像镜头241的成像角度或者成像位置,对待检测样品25的表面进行至少一次对焦成像,实现对带探测样品25表面的清晰成像。Specifically, the
进一步的,多束第二检测光束221可以位于同一平面上;成像相机242可以为线阵成像相机;探测模块23可以为线阵探测器。Further, multiple second detection light beams 221 may be located on the same plane; the
示例性的,经分束模块22分束得到的多束第二检测光束221可以位于同一平面上,相对应的,成像相机242可以为线阵成像相机;探测模块23可以为线阵探测器,一方面可以减小因非共面光束造成的光束发散角较大,较大的发散角进一步带来较大的位移误差,影响平整度检测的精确度;另一方面线阵成像相机的成像清晰度较高,线阵探测器的探测灵敏度较大,进一步提供待检测样品的表面平整度检测精度。Exemplarily, the multiple second detection beams 221 split by the
进一步的,成像镜头241可以为高倍率高数值孔径的成像镜头,其成像倍率为a,数值孔径为NA,其中,a≥3,NA≥0.18;线阵成像相机可以为大靶面线阵成像相机,其靶面尺寸为L,其中,L≥60mm。合理设置成像镜头241的成像倍率和数值孔径,保证可以对待检测样品25的表面进行清晰成像;合理设置线阵成像先机的靶面尺寸,保证可以实现对较大面积的待检测样品25的表面进行成像。Further, the
可选的,本发明实施例提供的分束模块22包括衍射光栅,衍射光栅用于对第一检测光束211进行分束,得到多束第二检测光束221。采用衍射光栅作为分束模块22,保证分束模块结构简单。进一步的,通过衍射光栅的表面微结构优化进而实现对第一检测光束211的相位调整,保证可以得到多束能量相同的第二检测光束221,通过多束能量相同的第二检测光束221对待检测样品25进行平整度检测,保证检测精度高;并且,本发明实施例提供的缺陷检测系统,通过多束第二检测光束对待成像表面进行检测,基于表面信息进行至少一次对焦成像,可以解决现有技术中单光束检测单焦面对焦成像带来的对焦检测效率低下,且无法区分离焦或者样品倾斜的问题。Optionally, the
基于同样的发明构思,本发明实施例还提供了一种缺陷检测方法。如图4所示,图4是本发明实施例提供的一种缺陷检测方法的流程示意图,如图4所示,本发明实施例提供的缺陷检测方法包括:Based on the same inventive concept, an embodiment of the present invention also provides a defect detection method. As shown in FIG. 4, FIG. 4 is a schematic flowchart of a defect detection method provided by an embodiment of the present invention. As shown in FIG. 4, the defect detection method provided by an embodiment of the present invention includes:
S110、获取待检测样品的表面信息;所述表面信息包括表面平整度信息和表面倾斜度信息。S110. Acquire surface information of the sample to be detected; the surface information includes surface flatness information and surface inclination information.
示例性的,表面信息可以包括表面平整度信息和表面倾斜度信息,表面平整度信息可以理解为待检测样品的表面各点与设定表面之间的高度差;表面倾斜度信息可以理解为待检测样品表面的倾角信息,这里的倾角可以理解为待检测样品表面与设定表面的夹角,设定表面可以为水平面或者铅垂面,本发明实施例对此不进行限定。Exemplarily, the surface information can include surface flatness information and surface inclination information, and the surface flatness information can be understood as the height difference between each point on the surface of the sample to be detected and the set surface; the surface inclination information can be understood as Detect the inclination angle information of the sample surface. The inclination angle here can be understood as the angle between the surface of the sample to be detected and the set surface. The set surface can be a horizontal plane or a vertical plane, which is not limited in the embodiment of the present invention.
S120、根据所述表面信息对所述待检测样品的表面进行至少一次对焦成像。S120. Perform at least one focus imaging on the surface of the sample to be detected according to the surface information.
示例性的,通过首先获取待检测样品的表面信息,表面信息可以包括表面平整度信息或者表面倾斜度信息,当待检测样品的表面平整度满足设定平整度要求或者待检测样品的表面倾斜度<100urad时,可以仅对待检测样品表面进行一次对焦成像即可保证得到整个待成像表面的清晰图像;当待检测样品的表面平整度不满足设定的平整度要求或者待检测样品的表面倾斜度>100urad时,可以根据待检测样品的表面信息对待检测样品的表面进行多次对焦成像,保证得到整个待成像表面的清晰图像。基于待成像表面的清晰图像对待成像表面进行缺陷度检测,保证检测精度高;并且,本发明实施例提供的缺陷检测方法,通过多束第二检测光束对待成像表面进行检测,基于表面信息进行至少一次对焦成像,可以解决现有技术中单光束检测单焦面对焦成像带来的对焦检测效率低下,且无法区分离焦或者样品倾斜的问题。Exemplarily, by first acquiring the surface information of the sample to be tested, the surface information may include surface flatness information or surface inclination information, when the surface flatness of the sample to be tested meets the set flatness requirements or the surface inclination of the sample to be tested When <100urad, only one focus imaging on the surface of the sample to be tested can ensure a clear image of the entire surface to be imaged; when the surface flatness of the sample to be tested does not meet the set flatness requirements or the surface inclination of the sample to be tested When >100urad, multiple focus imaging can be performed on the surface of the sample to be tested according to the surface information of the sample to be tested to ensure a clear image of the entire surface to be imaged. Based on the clear image of the surface to be imaged, the defect degree of the surface to be imaged is detected to ensure high detection accuracy; and, the defect detection method provided in the embodiment of the present invention uses multiple second detection beams to detect the surface to be imaged, and based on the surface information, at least One-time focus imaging can solve the problems of low focus detection efficiency caused by single-beam detection and single-focus plane focus imaging in the prior art, and the problem of inability to distinguish defocus or sample tilt.
示例性的,图5是本发明实施例提供的一种多束第二检测光束对待检测样品表面多个位置进行检测的示意图,如图5所示,多束第二检测光束221入射至待检测样品25表面的多个位置,图中示例性地示出了位置A、位置B和位置C,分别对应所示待检测样品表面的多个子表面aa’、bb’和cc’。其中每个子表面可以理解为一束第二检测光束221入射至待检测样品25表面的位置,位置A可以为子表面aa’的对焦点,位置B可以为子表面bb’的对焦点,位置C可以为子表面cc’的对焦点,其中位置B为成像镜头中心视场对焦点,DOF为成像镜头中心视场焦深范围,244为成像镜头光轴。在上述实施例的基础上,图6是本发明实施例提供的另一种缺陷检测方法的流程示意图,如图6所示,本发明实施例提供的缺陷检测方法包括:Exemplarily, FIG. 5 is a schematic diagram of a plurality of second detection beams provided by an embodiment of the present invention for detecting multiple positions on the surface of the sample to be detected. As shown in FIG. 5 , multiple second detection beams 221 are incident on the Multiple positions on the surface of the
S210、获取待检测样品的表面信息;所述表面信息包括表面平整度信息和表面倾斜度信息。S210. Obtain surface information of the sample to be detected; the surface information includes surface flatness information and surface inclination information.
S220、确定每个所述子表面中的子最高值信息和子最低值信息。S220. Determine sub-highest value information and sub-lowest value information in each of the sub-surfaces.
S230、多个所述子最高值信息中的最大值信息为所述表面最高值信息,多个所述子最低值信息的最小值信息为所述表面最低值信息。S230. The maximum value information among the plurality of sub-maximum value information is the surface maximum value information, and the minimum value information of the plurality of sub-minimum value information is the surface minimum value information.
示例性的,如图5所示,当待检测样品的表面是表面起伏较大的曲面时,多束第二检测光束221打到待检测样品的表面的三个位置上,分别为位置A、位置B和位置C,通过多束第二检测光束221对子表面aa’、bb’和cc’进行测量,可以得到每个子表面的面型信息,进而确定每个子表面的子最高值信息和子最低值信息。以图5为例,设定成像镜头的相机靶面为参考面(图中未示出),每个子表面中距离参考面最近的点的高度值为该子表面的子最高值信息,每个子表面中距离参考面最远的点的高度值为该子表面的子最低值信息。根据每个子表面的子最高值信息和子最低值信息,可以确定整个待成像物体的表面最高值信息和表面最低值信息,其中,表面最高值信息可以理解为多个子最高值信息中的最大值信息,表面最低值信息可以理解为多个子最低值信息的最小值信息。Exemplarily, as shown in FIG. 5 , when the surface of the sample to be tested is a curved surface with large surface undulations, multiple second detection beams 221 hit three positions on the surface of the sample to be tested, respectively position A, At position B and position C, the sub-surfaces aa', bb' and cc' are measured by multiple second detection beams 221, the surface information of each sub-surface can be obtained, and the sub-highest value information and sub-lowest value information of each sub-surface can be determined. value information. Taking Figure 5 as an example, the camera target surface of the imaging lens is set as the reference surface (not shown in the figure), and the height value of the point closest to the reference surface in each subsurface is the sub-highest value information of the subsurface, and each subsurface The height value of the point farthest from the reference surface in the surface is the sub-minimum information of the sub-surface. According to the sub-maximum value information and sub-minimum value information of each sub-surface, the surface maximum value information and surface minimum value information of the entire object to be imaged can be determined, wherein the surface maximum value information can be understood as the maximum value information among multiple sub-maximum value information , the surface minimum value information can be understood as the minimum value information of multiple sub-minimum value information.
S240、当所述表面最高值信息和表面最低值信息之间的差值与所述成像模块的焦深满足第一预设关系时,计算所述待检测样品表面的最优焦面信息,根据所述最优焦面信息对所述待检测样品的表面进行最优焦面对焦成像。S240. When the difference between the surface highest value information and the surface minimum value information and the focal depth of the imaging module satisfy a first preset relationship, calculate the optimal focal plane information of the surface of the sample to be detected, according to The optimal focal plane information performs optimal focal plane focused imaging on the surface of the sample to be detected.
示例性的,当表面最高值信息和表面最低值信息之间的差值H与成像模块的焦深DOF满足H<2*DOF时,表面最高值信息和表面最低值信息之间的差值与成像模块的焦深满足第一预设关系;此时可以通过一次对焦便可以实现对整个待检测样品的表面进行清晰成像。Exemplarily, when the difference H between the surface highest value information and the surface minimum value information and the depth of focus DOF of the imaging module satisfy H<2*DOF, the difference between the surface highest value information and the surface minimum value information and The depth of focus of the imaging module satisfies the first preset relationship; at this time, a clear image of the entire surface of the sample to be tested can be achieved by focusing once.
进一步的,由于待检测样品表面的不同拓扑结构,中心视场的焦面位置不一定是整个待检测样品表面的最优焦面位置,相对于传统的单点测焦方案,本发明实施例通过多束第二检测光束测量多个位置的高度信息,基于多个高度信息可以有效评估整个待检测样品表面的全局最优焦面,进一步通过最优焦面对待检测样品的表面进行最优焦面对焦成像,可以进一步提升成像清晰度,便于对待检测样品的表面进行缺陷检测,提升检测精度。Furthermore, due to the different topological structures of the surface of the sample to be detected, the focal plane position of the central field of view is not necessarily the optimal focal plane position of the entire surface of the sample to be detected. Compared with the traditional single-point focusing scheme, the embodiment of the present invention adopts Multiple second detection beams measure the height information of multiple positions. Based on multiple height information, the global optimal focal plane of the entire surface of the sample to be detected can be effectively evaluated, and the optimal focal plane of the surface of the sample to be detected can be further optimized through the optimal focal plane. Focus imaging can further improve the imaging clarity, facilitate defect detection on the surface of the sample to be tested, and improve detection accuracy.
可选的,确定待检测样品表面的最优焦面信息可以包括多种可行的实施方式,下面对两种可行的实施方式进行说明:Optionally, determining the optimal focal plane information on the surface of the sample to be detected may include multiple feasible implementations, and two feasible implementations are described below:
可选的,计算待检测样品表面的最优焦面信息,可以包括:Optionally, calculating the optimal focal plane information of the surface of the sample to be detected may include:
根据表面最高值信息和表面最低值信息计算表面平均高度信息;Calculate surface average height information according to surface maximum value information and surface minimum value information;
将表面平均高度信息对应的焦面作为最优焦面。The focal plane corresponding to the surface average height information is taken as the optimal focal plane.
示例性的,可以根据上述实施例确定待检测样品的表面最高值信息和表面最低值信息,根据表面最高值信息和表面最低值信息计算表面平均高度信息,将表面平均高度所在的平面作为待检测样品的对焦平面进行对焦,得到的焦面即为待检测样品的最优焦面。Exemplarily, the surface maximum value information and the surface minimum value information of the sample to be detected can be determined according to the above-mentioned embodiment, the surface average height information is calculated according to the surface maximum value information and the surface minimum value information, and the plane where the surface average height is located is used as the plane to be detected Focus on the focal plane of the sample, and the obtained focal plane is the optimal focal plane of the sample to be tested.
可选的,计算待检测样品表面的最优焦面信息,可以包括:Optionally, calculating the optimal focal plane information of the surface of the sample to be detected may include:
分别获取待检测样品表面中心区域对应的第一焦面信息和待检测样品表面边缘区域对应的第二焦面信息;Respectively acquiring the first focal plane information corresponding to the center area of the surface of the sample to be detected and the second focal plane information corresponding to the edge area of the surface of the sample to be detected;
根据第一焦面信息和第二焦面信息,采用不同的加权系数计算待检测样品表面的最优焦面信息,其中,第一焦面信息的加权系数大于第二焦面信息的加权系数。According to the first focal plane information and the second focal plane information, different weighting coefficients are used to calculate the optimal focal plane information of the surface of the sample to be detected, wherein the weighting coefficient of the first focal plane information is greater than the weighting coefficient of the second focal plane information.
示例性的,分别获取待检测样品表面中心区域对应的第一焦面信息和待检测样品表面边缘区域对应的第二焦面信息,其中第一焦面信息可以为待检测样品表面中心区域对应的第一焦面的高度信息,其中第二焦面信息可以为待检测样品表面边缘区域对应的第二焦面的高度信息。进一步对第一焦面信息和第二焦面信息采用不同的加权系数计算待检测样品表面的最优焦面信息,其中,第一焦面信息的加权系数大于第二焦面信息的加权系数,例如,第一焦面信息的加权系数可以为70%,第二焦面信息的加权系数可以为30%,以第一焦面对应的高度信息乘以70%,第二焦面对应的高度信息乘以30%计算得到最优焦面对应的高度信息,然后将最优焦面对应的高度信息所在的平面作为待检测样品的对焦平面进行对焦,得到的焦面即为待检测样品的最优焦面。Exemplarily, the first focal plane information corresponding to the central area of the surface of the sample to be tested and the second focal plane information corresponding to the edge area of the surface of the sample to be tested are obtained respectively, wherein the first focal plane information can be the information corresponding to the central area of the sample surface to be tested The height information of the first focal plane, wherein the second focal plane information may be the height information of the second focal plane corresponding to the edge region of the surface of the sample to be detected. Further, using different weighting coefficients for the first focal plane information and the second focal plane information to calculate the optimal focal plane information on the surface of the sample to be detected, wherein the weighting coefficient of the first focal plane information is greater than the weighting coefficient of the second focal plane information, For example, the weighting coefficient of the first focal plane information can be 70%, and the weighting coefficient of the second focal plane information can be 30%. The height information corresponding to the first focal plane is multiplied by 70%, and the weighting coefficient corresponding to the second focal plane The height information is multiplied by 30% to calculate the height information corresponding to the optimal focal plane, and then the plane where the height information corresponding to the optimal focal plane is located is used as the focal plane of the sample to be tested for focusing, and the obtained focal plane is the Optimal focal plane for the sample.
S250、当所述表面最高值信息和表面最低值信息之间的差值与所述成像模块的焦深满足第二预设关系时,控制所述成像模块对所述待检测样品的表面进行多次对焦成像。S250. When the difference between the highest value information on the surface and the lowest value information on the surface and the focal depth of the imaging module meet a second preset relationship, control the imaging module to perform multiple measurements on the surface of the sample to be detected. secondary focus imaging.
示例性的,当表面最高值信息和表面最低值信息之间的差值H与成像模块的焦深DOF满足H≥2*DOF时,表面最高值信息和表面最低值信息之间的差值与成像模块的焦深满足第二预设关系。此时需要通过多次对焦成像实现对整个待检测样品的表面进行清晰成像。Exemplarily, when the difference H between the surface highest value information and the surface minimum value information and the depth of focus DOF of the imaging module satisfy H≥2*DOF, the difference between the surface maximum value information and the surface minimum value information is equal to The depth of focus of the imaging module satisfies the second preset relationship. At this time, it is necessary to realize clear imaging of the entire surface of the sample to be tested through multiple focusing imaging.
进一步的,控制成像模块对待检测样品的表面进行多次对焦成像,可以包括:Further, controlling the imaging module to perform multiple focus imaging on the surface of the sample to be detected may include:
根据表面最高值信息和表面最低值信息之间的差值以及成像模块的焦深,确定对焦成像次数;Determine the number of in-focus imaging according to the difference between the surface maximum value information and the surface minimum value information and the focal depth of the imaging module;
根据对焦成像次数,移动成像模块,控制成像模块对待检测样品的表面进行多次对焦成像;其中,每次对焦成像时,成像模块视野内的最高值与最低值之间的差值信息小于或者等于成像模块的焦深。According to the number of focus imaging, the imaging module is moved, and the imaging module is controlled to perform multiple focus imaging on the surface of the sample to be detected; wherein, during each focus imaging, the difference information between the highest value and the lowest value in the field of view of the imaging module is less than or equal to Depth of focus of the imaging module.
示例性的,图7是本发明实施例提供的一种多次对焦成像的示意图,如图7所示,251为待检测样品25的倾斜表面,D1-D5所示的5个矩形区域为5束第二检测光束对应的样品局部表面所对应的成像镜头清晰成像焦深范围;244为成像镜头241的光轴,245为成像镜头241的测量视场范围FOV。Exemplarily, FIG. 7 is a schematic diagram of a multiple focusing imaging provided by an embodiment of the present invention. As shown in FIG. The focal depth range of the imaging lens corresponding to the partial surface of the sample corresponding to the second detection beam; 244 is the optical axis of the
在多次对焦成像之前,依据镜头FOV内的表面最高值信息H1和表面最低值信息H2之间的差值(H1-H2)以及成像模块的焦深DOF,确定对焦成像次数n,其中,n=ceil((H1-H2)/DOF),其中,ceil()表示向上取整,例如当(H1-H2)/DOF=4.1时,n=5。确定对焦成像次数之后,移动成像模块24,进而可以指导成像模块24进行多次对焦,每次对焦测量的区域均不同,通过多次对焦遍历检测,并且每次对焦成像时,成像模块清晰区域视野内的最高值与最低值之间的差值信息小于或者等于成像模块的焦深,可以实现表面倾斜或曲率变化较大样品的全场清晰成像,便于后续对待检测样品的表面进行缺陷检测。Before focusing and imaging multiple times, according to the difference (H1-H2) between the surface maximum value information H1 and the surface minimum value information H2 in the lens FOV and the focal depth DOF of the imaging module, determine the number of focus imaging times n, where n =ceil((H1-H2)/DOF), wherein, ceil() means rounding up, for example, when (H1-H2)/DOF=4.1, n=5. After determining the number of times of focusing and imaging, move the
综上所述,本发明实施例提供的缺陷检测方法,通过表面信息确定待检测样品表面的表面最高值信息和表面最低值信息,根据表面最高值信息和表面最低值信息之间的差值与像模块的焦深满足不同的预设关系时采用不同的对焦成像策略,可以基于最优焦面单次对焦成像,也可以对待检测样品的表面进行多次对焦成像,可以实现陡峭及具备大深度缺陷样品的实时对焦成像,两种不同的对焦成像策略均可以保证对待检测样品进行清晰成像,对焦成像效率高,并且可以保证在后续的表面缺陷检测中缺陷检测效率高。To sum up, the defect detection method provided by the embodiment of the present invention determines the surface maximum value information and the surface minimum value information of the surface of the sample to be detected through the surface information, and according to the difference between the surface maximum value information and the surface minimum value information and When the focal depth of the image module satisfies different preset relationships, different focus imaging strategies can be adopted. Single focus imaging can be based on the optimal focal plane, or multiple focus imaging can be performed on the surface of the sample to be tested, which can achieve steepness and large depth For real-time focus imaging of defective samples, two different focus imaging strategies can ensure clear imaging of the sample to be tested, high focus imaging efficiency, and high defect detection efficiency in subsequent surface defect detection.
注意,上述仅为本发明的较佳实施例及所运用技术原理。本领域技术人员会理解,本发明不限于这里所述的特定实施例,本发明的各个实施方式的特征可以部分地或者全部地彼此耦合或组合,并且可以以各种方式彼此协作并在技术上被驱动。对本领域技术人员来说能够进行各种明显的变化、重新调整、相互结合和替代而不会脱离本发明的保护范围。因此,虽然通过以上实施例对本发明进行了较为详细的说明,但是本发明不仅仅限于以上实施例,在不脱离本发明构思的情况下,还可以包括更多其他等效实施例,而本发明的范围由所附的权利要求范围决定。Note that the above are only preferred embodiments of the present invention and applied technical principles. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described here, and that the features of the various embodiments of the present invention may be partially or fully coupled or combined with each other, and may cooperate with each other in various ways and technically driven. Various obvious changes, readjustments, mutual combinations and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and can also include more other equivalent embodiments without departing from the concept of the present invention, and the present invention The scope is determined by the scope of the appended claims.
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