CN111148370A - Semiconductor light emitting device and method for manufacturing the same - Google Patents

Abstract

The invention provides a semiconductor light-emitting device and a manufacturing method thereof. The light-emitting package is arranged on the circuit board and comprises a substrate, wherein the substrate is provided with an outer side surface and a glue containing groove, and the glue containing groove extends inwards from the outer side surface. The relative position between the circuit board and the glue containing groove is fixed by the fixing glue. In one embodiment, the fixing glue is limited in the glue accommodating groove, so that the fixing glue is prevented from overflowing to the peripheral conductive parts.

Description

Semiconductor light emitting device and method for manufacturing the same

Technical Field

The present invention relates to a semiconductor light emitting device and a method for manufacturing the same, and more particularly, to a semiconductor light emitting device with a fixing adhesive and a method for manufacturing the same.

Background

In order to fix the semiconductor device on the circuit board, a fixing adhesive is usually used to temporarily stabilize the relative position between the semiconductor device and the circuit board, and then the fixing step of the semiconductor device and the circuit board is performed. However, before the semiconductor element and the circuit board are fixed, the formed fixing glue has fluidity in an initial state, so that the fixing glue easily flows to the conductive member on the semiconductor element or the circuit board, and the conductive member is polluted, thereby negatively affecting the quality of the conductive member.

Disclosure of Invention

The invention relates to a semiconductor light-emitting device and a manufacturing method thereof, which can solve the problem that fixing glue pollutes conductive parts in the prior art.

According to an embodiment of the present invention, a semiconductor light emitting device is provided. The semiconductor light-emitting device comprises a circuit board, a light-emitting package and a fixing adhesive. The light-emitting package is arranged on the circuit board and comprises a substrate, wherein the substrate is provided with an outer side surface and a glue containing groove, and the glue containing groove extends inwards from the outer side surface. The fixing glue is arranged on the circuit board and used for fixing the relative position between the circuit board and the glue containing groove.

According to an embodiment of the present invention, the glue containing groove is in a closed ring shape.

According to an embodiment of the present invention, the substrate has a lower surface, and the glue receiving groove extends upward from the lower surface.

According to an embodiment of the present invention, the substrate has a thickness, and the glue receiving groove extends upward from the lower surface by a distance not greater than half of the thickness.

According to an embodiment of the present invention, the light emitting package further includes an electrode formed on a lower surface of the substrate and spaced apart from the glue receiving groove.

According to an embodiment of the present invention, the fixing glue portion is located in the glue containing groove.

According to an embodiment of the present invention, the semiconductor light emitting device further includes:

a solder between the electrode of the light emitting package and the pad of the circuit board;

wherein, the solder and the fixing glue are separated from each other by the glue containing groove.

According to another embodiment of the present invention, a method for manufacturing a semiconductor light emitting device is provided. The manufacturing method includes the following steps. Providing a light-emitting package which comprises a substrate, wherein the substrate is provided with an outer side surface and a glue containing groove, and the glue containing groove extends inwards from the outer side surface; forming a fixing glue on a circuit board; arranging a light-emitting package on the circuit board, and connecting the circuit board and the glue accommodating groove by using fixing glue; and heating the fixing glue to solidify the fixing glue so as to fix the relative position between the circuit board and the glue containing groove.

According to an embodiment of the present invention, the manufacturing method further includes:

forming a solder on a pad of the circuit board;

in the step of disposing the light emitting package on the circuit board, the solder and the fixing glue are spaced from each other by the glue accommodating groove.

The invention has the beneficial effects that:

the fixing glue can not contact the conductive piece on the luminous packaging piece, so that the components of the fixing glue can not be fused or infiltrated into the conductive piece in the heating process, and the quality of the conductive piece can be maintained. In the case of the conductive member as the solder, since the fixing glue is not melted or infiltrated into the solder, the solder can provide a stable and/or excellent soldering performance after being cured.

Drawings

Fig. 1A is a schematic view illustrating a semiconductor light emitting device according to an embodiment of the invention.

FIG. 1B shows a cross-sectional view of the semiconductor light emitting device of FIG. 1A along direction 1B-1B'.

Fig. 2A to 5B are diagrams illustrating a manufacturing process of the light emitting package of fig. 1A.

FIGS. 6 to 7 are diagrams illustrating a manufacturing process of the semiconductor light emitting device of FIG. 1A.

Wherein, the reference numbers:

circular saw 10

Semiconductor light emitting device 100

Circuit board 110

Contact pad 111

Light emitting package 120

Light emitting packaging structure 120'

Substrate 121

Substrate 121'

Lower surface 121b

Outer side 121s

Glue containing groove 121r

Inner side wall 121w

Light emitting die 122

Bonding wire 123

Package 124

Upper surface 124u

Packaging body 124'

Electrode 125

Fixing glue 130

Fixed glue 130'

Solder 140

First distance D1

Second distance D2

Third distance D3

Thickness T1

First cutting path P1

Second cutting path P2

Third cutting lane P3

Fourth cutting lane P4

Width W1

Width W2

Width W3

Width W4

Defining a region R1

Detailed Description

Referring to fig. 1A and 1B, fig. 1A is a schematic diagram illustrating a semiconductor light emitting device 100 according to an embodiment of the invention, and fig. 1B is a cross-sectional view of the semiconductor light emitting device 100 of fig. 1A along a direction 1B-1B'.

The semiconductor light emitting device 100 includes a circuit board 110, a light emitting package 120, a fixing glue 130 and at least one solder 140. The circuit board 110 includes at least one pad 111.

The light emitting package 120 is disposed on the pad 111 of the circuit board 110. The light emitting package 120 includes a substrate 121, at least one light emitting die 122, at least one bonding wire 123, a package body 124, and at least one electrode 125.

In one embodiment, the substrate 121 is, for example, a ceramic substrate, but not limited thereto. As shown in fig. 1B, the light emitting die 122 is disposed on the substrate 121 and electrically connected to the substrate 121 through the bonding wire 123. In another embodiment, the light emitting die 122 may also be a flip-chip die. The package body 124 is, for example, a molding compound (molding compound), which encapsulates the light emitting die 122 and the bonding wires 123 to protect these devices. The electrode 125 is disposed on the lower surface 121b of the substrate 121 and electrically connected to the pad 111 of the circuit board 110. The solder 140 is located between the electrode 125 and the pad 111, and bonds the electrode 125 and the pad 111. The light emitting die 122 is, for example, a light emitting diode die, and the light emitting package 120 is a light emitting diode package. However, the embodiment of the invention is not limited to the structure of the light emitting package 120, and any light emitting die can be used as the light emitting package of the embodiment of the invention, wherein the type of the light emitting die 122 is not limited to the light emitting diode.

As shown in fig. 1B, the substrate 121 has an outer side surface 121s, a lower surface 121B, and a glue accommodating groove 121r, wherein the glue accommodating groove 121r extends inward (e.g., toward the light emitting die 122) from the outer side surface 121s and upward (e.g., toward the light emitting die 122) from the lower surface 121B. The fixing glue 130 is disposed on the circuit board, and is adhered to the inner sidewall 121w of the glue receiving groove 121r and the circuit board 110 to fix a relative position between the circuit board 110 and the light emitting package 120. At least a portion of the inner sidewall 121w may be planar, curved, or a combination thereof. The contour of the inner sidewall 121w may depend on the contour of the tool used in the cutting process, and the embodiment of the invention is not limited thereto. Since the glue containing groove 121r provides a glue containing space, the flowing fixing glue 130 is limited to flow in the glue containing groove 121r during the manufacturing process of the semiconductor light emitting device 100, so that the fixing glue 130 can be prevented from overflowing to the conductive members, such as the solder 140, the electrode 125 and/or the pad 111, and the fixing glue 130 can be prevented from contacting or contaminating the conductive members.

As shown in fig. 1B, the fixing glue 130 and the conductive member are spaced from each other by the glue accommodating groove 121r, so that a distance between the conductive member and the fixing glue 130 is maintained, and the probability of overflow of the fixing glue 130 to the conductive member is further reduced. As shown in fig. 1A, the glue container 121r is in a closed ring shape, but may be in an open ring shape. Since the glue accommodating groove 121r is in a closed ring shape, a large glue accommodating space is provided, and the probability of the fixing glue 130 overflowing to the conductive member is further reduced.

As shown in fig. 1B, the glue containing groove 121r extends inward a first distance D1 from the outer side surface 121 s. In addition, the glue receiving groove 121r extends upward from the lower surface 121b by a second distance D2. The second distance D2 is less than the thickness T1 of the substrate 121. For example, the second distance D2 is not greater than half the thickness T1. The glue container 121r is disposed so as not to damage the electrode 125. The edge of the glue container 121r has a third distance D3 from the electrode 125, wherein the third distance D3 is not less than 0.5 millimeters (mm). Therefore, the dual technical effects of "the substrate 121 has a certain strength" and "prevent the conductive member from being contaminated by the overflowing glue" can be considered.

In one embodiment, the fixing glue 130 is red glue, for example. In addition, the embodiment of the invention does not limit the position and/or the number of the fixing glue 130. The position of the fixing glue 130 may correspond to any position of the glue receiving groove 121r and/or the number of the fixing glue 130 may be one or more than one, as long as the fixing glue 130 is prevented from overflowing to the conductive member.

Referring to fig. 2A to 5B, a manufacturing process of the light emitting package 120 of fig. 1A is illustrated. Fig. 2B, 3B, 4B and 5B illustrate bottom views of the structures of fig. 2A, 3A, 4A and 5A, respectively.

First, as shown in fig. 2A and 2B, a light emitting package structure 120' is provided. The light emitting package structure 120 ' includes a substrate 121 ', at least one light emitting die 122, at least one bonding wire 123 and a package body 124 '. The light emitting die 122 is disposed on the substrate 121 'and electrically connected to the substrate 121' through the bonding wire 123. The package 124 'is formed on the upper surface of the substrate 121' and covers the light emitting die 122 and the bonding wires 123, so as to protect these elements.

Then, as shown in fig. 3A and 3B, a plurality of first scribe lines P1 may be formed by, for example, a cutting method such as a circular saw 10, wherein the first scribe lines P1 extend from the lower surface 121B of the substrate 121 ' toward the package body 124 ', but do not penetrate through the substrate 121 '. In the actual cutting, the substrate 121 'of fig. 3A is facing upward, and the circular saw 10 can cut above the substrate 121'. As shown in fig. 3B, the first scribe lines P1 surround a defined region R1 of at least one light emitting package 120. First cut P1 has a width W1 that is about equal to or slightly greater than width W2 of circular saw 10. In addition, the feeding direction of the circular saw 10 is, for example, from the outer side surface (not shown) of the base plate 121'. Compared with the circular saw 10 feeding from the lower surface 121b, the circular saw 10 feeding from the outer side surface of the base plate 121' can avoid the possibility of damage to the circular saw 10. After the cutting, the path of the first scribe line P1 extends linearly from one outer side surface of the substrate 121' to the other opposite outer side surface. Because of the straight path, the cutting speed can be accelerated. In addition, the blade shape of the circular saw 10 is not limited in the embodiments of the present invention, and may have a polygonal cross section, such as a rectangular cross section, a triangular cross section, or a curved cross section, so that the receiving groove 121r has a corresponding cross-sectional shape.

Then, as shown in fig. 4A and 4B, a plurality of second scribe lines P2 may be formed by, for example, a cutting method using a cutter, such as a circular saw 10, wherein the second scribe lines P2 extend from the lower surface 121B of the substrate 121 ' toward the package body 124 ', but do not penetrate through the substrate 121 '. As shown in fig. 4B, the second scribe lines P2 surround a defined region R1 of at least one light emitting package 120. The first cutting lane P1 is connected to the second cutting lane P2 to form a third cutting lane P3. Third street P3 has a width W3, and a width W3 that is greater than the width W2 of cutter 10 or approximately equal to twice the width W2. In another embodiment, a different blade than the circular saw 10 may be used to form the second street P2. In another embodiment, the circular saw 10 with a larger width may be used to directly cut the third street P3 in one cutting, i.e., the third street P3 is formed in one cutting, not multiple times (e.g., the first street P1 and the second street P2).

Then, as shown in fig. 5A and 5B, a plurality of fourth scribe lines P4 may be formed by, for example, a cutting tool, such as a circular saw 10, wherein the fourth scribe lines P4 extend from the lower surface 121B of the substrate 121 ' to the upper surface 124u of the package 124 ' (the package 124 ' is shown in fig. 4A) to cut off the structure of fig. 4A. As shown in fig. 5B, the extending path of the fourth scribe lines P4 passes through the third scribe line P3 to form at least one light emitting package 120. The width W4 of the fourth scribe line P4 in fig. 5A is smaller than the width W3 of the third scribe line P3 in fig. 4A, so that the first scribe line P1 and the second scribe line P2 can be remained after the fourth scribe line P4 is formed, wherein the remaining first scribe line P1 and second scribe line P2 form the receiving groove 121 r. In an embodiment, the fourth cutting lane P4 may be aligned with the middle position of the third cutting lane P3, such that the widths (i.e., the first distance D1) of the glue receiving grooves 121r on the opposite sides of the fourth cutting lane P4 are substantially equal. In another embodiment, the fourth cutting path P4 may be formed by a different cutter than the circular saw 10, and the width of the different cutter may be larger or smaller than the width W2 of the circular saw 10.

In another embodiment, the third scribe line P3 can be completed after the substrate 121 ' is formed and before the light emitting die 122, the bonding wires 123 and the package body 124 ' are formed, and the fourth scribe line P4 is completed after the package body 124 ' is formed.

Referring to fig. 6 to 7, a process of manufacturing the semiconductor light emitting device 100 of fig. 1A is shown.

As shown in fig. 6, a light emitting package 120 is provided, where the light emitting package 120 includes a substrate 121, and the substrate 121 has an outer side surface 121s and a glue receiving groove 121 r. The glue accommodating groove 121r extends inward from the outer side surface 121s of the substrate 121 and extends upward from the lower surface 121b of the substrate 121.

Then, as shown in fig. 6, at least one solder 140 may be formed on the pads 111 of the circuit board 110 by printing or coating.

Then, as shown in fig. 6, at least one fixing glue 130' may be formed on the circuit board 110 by a dispensing method. The fixing glue 130' of this step is in a flowing state.

Then, as shown in fig. 7, the light emitting package 120 is disposed on the circuit board 110, and the fixing glue 130' is connected to the circuit board 110 and the glue containing groove 121r to stabilize the relative position between the circuit board 110 and the light emitting package 120. The fixing glue 130' at this stage is in a flowing state, so that the relative position between the light emitting package 120 and the circuit board 110 can be conveniently adjusted until the positioning is correct.

In addition, in the process of butting the light emitting package 120 and the circuit board 110, although the light emitting package 120 is extruded to the fixing glue 130 ', since the glue accommodating groove 121r provides a glue accommodating space, the fixing glue 130 ' can flow in the glue accommodating groove 121r (limited by flowing in the glue accommodating groove 121 r), so that the fixing glue 130 ' can be prevented from overflowing to the conductive member. In other words, due to the design of the glue accommodating groove 121r, the dual technical effects of "the fixing glue 130 'stabilizes the relative position between the circuit board 110 and the light emitting package 120" and "preventing the fixing glue 130' from overflowing to the conductive member" can be considered.

Then, the structure of fig. 7 may be heated by, for example, reflow (reflow) to solidify the solder 140 and the fixing glue 130', thereby fixing the relative position between the circuit board 110 and the glue containing groove 121 r. In this step, although the fixing glue 130 'is still in a flowing state at the initial stage of heating, since the glue accommodating groove 121r provides a glue accommodating space, the fixing glue 130' is prevented from overflowing to the conductive member. After the heating is continued, the fixing glue 130' and the solder 140 start to solidify to fix the relative position between the circuit board 110 and the light emitting package 120.

Since the fixing glue 130 'does not contact the conductive member on the light emitting package 120, the components of the fixing glue 130' do not melt or permeate into the conductive member during the heating process, and thus the quality of the conductive member can be maintained. In the case of the conductive member being the solder 140, the fixing glue 130' does not melt or infiltrate into the solder 140, so that the solder 140 can provide a stable and/or excellent soldering performance after being cured.

The present invention is capable of other embodiments, and various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (9)

1. A semiconductor light emitting device, comprising:

a circuit board;

the light-emitting packaging piece is arranged on the circuit board and comprises a substrate, wherein the substrate is provided with an outer side surface and a glue containing groove, and the glue containing groove extends inwards from the outer side surface; and

and the fixing glue is arranged on the circuit board and used for fixing the relative position between the circuit board and the glue containing groove.

2. The semiconductor light emitting device according to claim 1, wherein the glue-receiving groove has a closed ring shape.

3. The semiconductor light emitting device of claim 1, wherein the substrate has a lower surface, and the glue receiving groove extends upward from the lower surface.

4. The semiconductor light emitting device of claim 3, wherein the substrate has a thickness, and the glue receiving groove extends upward from the lower surface by a distance that is no greater than half the thickness.

5. The semiconductor light emitting device of claim 1, wherein the light emitting package further comprises an electrode formed on a lower surface of the substrate and spaced apart from the glue receiving groove.

6. The semiconductor light emitting device of claim 1, wherein the fixing glue portion is located in the glue receiving groove.

7. The semiconductor light emitting device according to claim 1, further comprising:

a solder between the electrode of the light emitting package and the pad of the circuit board;

wherein, the solder and the fixing glue are separated from each other by the glue containing groove.

8. A method of manufacturing a semiconductor light emitting device, comprising:

providing a light-emitting package which comprises a substrate, wherein the substrate is provided with an outer side surface and a glue containing groove, and the glue containing groove extends inwards from the outer side surface;

forming a fixing glue on a circuit board;

arranging the light-emitting packaging piece on the circuit board to enable the fixing glue to connect the circuit board and the glue accommodating groove; and

and heating the fixing glue to solidify the fixing glue so as to fix the relative position between the circuit board and the glue containing groove.

9. The method of manufacturing of claim 8, further comprising:

forming a solder on a pad of the circuit board;

in the step of disposing the light emitting package on the circuit board, the solder and the fixing glue are spaced from each other by the glue accommodating groove.

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