CN111128765B - Method for reducing fan-out type packaging stress and plastic packaging mold applied by same - Google Patents
Method for reducing fan-out type packaging stress and plastic packaging mold applied by same Download PDFInfo
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- CN111128765B CN111128765B CN201911260003.8A CN201911260003A CN111128765B CN 111128765 B CN111128765 B CN 111128765B CN 201911260003 A CN201911260003 A CN 201911260003A CN 111128765 B CN111128765 B CN 111128765B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 56
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- 238000001816 cooling Methods 0.000 claims abstract description 116
- 239000000463 material Substances 0.000 claims description 25
- 238000000465 moulding Methods 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000001179 sorption measurement Methods 0.000 claims description 4
- 239000005022 packaging material Substances 0.000 abstract description 26
- 230000035882 stress Effects 0.000 description 23
- 238000010586 diagram Methods 0.000 description 11
- 229940125810 compound 20 Drugs 0.000 description 4
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- 239000011159 matrix material Substances 0.000 description 3
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- 238000001746 injection moulding Methods 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
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- 238000002347 injection Methods 0.000 description 1
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- 230000002452 interceptive effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses a method for reducing fan-out type packaging stress and a plastic packaging mold applied by the same, wherein the method for reducing fan-out type packaging stress comprises the following steps: providing a plastic package mold, convexly arranging a plurality of cooling pins at staggered positions of the bottom of a plastic package groove of the plastic package mold and a chip to be subjected to plastic package, enabling the length of the cooling pins to be smaller than the depth of the plastic package groove, and carrying out plastic package on the plurality of chips attached to the carrier plate by adopting the plastic package mold. According to the invention, the cooling needle is additionally arranged at the bottom of the plastic packaging groove of the plastic packaging mold, when the mold is closed and solidified, the cooling needle extends into the plastic packaging material, and in the cooling process of the plastic packaging material, the cooling needle can accelerate the cooling speed inside the plastic packaging material, so that the cooling speed inside and outside the plastic packaging material is balanced, the cooling speed of the whole plastic packaging material is basically kept consistent, the internal stress of the plastic packaging material is reduced, and the warping of the fan-out chip packaging structure is effectively reduced.
Description
Technical Field
The invention relates to the technical field of integrated circuit packaging, in particular to a method for reducing fan-out type packaging stress and a plastic packaging mold applied to the method.
Background
With the trend of miniaturization and integration of electronic products, the densification of microelectronic packaging technology has gradually become the mainstream of new generation of electronic products. In order to comply with the development of new generation electronic products, especially the development of products such as mobile phones, notebooks, intelligent wearable devices, etc., chips are developed in the direction of higher density, faster speed, smaller size, lower cost, etc.
In the packaging process, due to the difference of the thermal expansion coefficients of materials such as plastic, silicon and metal, the volume changes of the materials are asynchronous, so that stress is generated and warping is caused. The difference between the thermal expansion coefficients of the chip and the injection molding material enables the stress generated in the cooling process of the injection molding material to be the most main cause of the warpage generation in the packaging technology.
How to reduce package thermal stress becomes an important issue for current packages and high density integrated microelectronic systems, and improvements and research on fan-out packaging methods and techniques are needed.
Disclosure of Invention
The invention aims to provide a method for reducing fan-out type packaging stress and a plastic packaging mold applied by the method, which can balance the cooling speed inside and outside the mold during curing and cooling so as to reduce the internal stress of a plastic packaging body and reduce the warpage.
In order to achieve the purpose, the invention adopts the following technical scheme:
on one hand, the method for reducing fan-out type packaging stress is characterized by providing a plastic packaging mold, wherein a plurality of cooling pins are convexly arranged at staggered positions of the bottom of a plastic packaging groove of the plastic packaging mold and a chip to be subjected to plastic packaging in advance, the length of each cooling pin is smaller than the depth of the plastic packaging groove, and the plastic packaging mold is adopted for carrying out plastic packaging on the plurality of chips attached to a carrier plate.
According to the invention, the cooling needle is additionally arranged at the bottom of the plastic packaging groove of the plastic packaging mold, when the mold is closed and solidified, the cooling needle extends into the plastic packaging material, and in the cooling process of the plastic packaging material, the cooling needle can accelerate the cooling speed inside the plastic packaging material, so that the cooling speed inside and outside the plastic packaging material is balanced, the cooling speed of the whole plastic packaging material is basically kept consistent, the internal stress of the plastic packaging material is reduced, and the warping of the fan-out chip packaging structure is effectively reduced.
Further, the method for reducing the fan-out package stress in the invention comprises the following steps:
s1, providing the plastic package mold, wherein the plastic package mold is provided with a first mold plate and a second mold plate which can be opened and closed, one side of the first mold plate, which is opposite to the second mold plate, is provided with a plastic package groove, and the bottom of the plastic package groove is additionally provided with a plurality of cooling needles; the cooling pin and the first template are of an integrally formed structure, the materials of the cooling pin and the first template are completely the same, and the specific arrangement position of the cooling pin is determined according to the mounting position of the chip on the carrier plate;
s2, providing the carrier plate and the chips, and mounting the chips on the carrier plate at intervals through temporary bonding glue to obtain a chip mounting structure; specifically, a temporary bonding adhesive is pasted on one side of the carrier plate, and then a plurality of chips are pasted on the temporary bonding adhesive at intervals so as to realize preliminary fixation on the carrier plate and facilitate subsequent plastic package;
s3, placing the chip mounting structure on the second template for adsorption and fixation, and uniformly scattering a plastic package material on the bottom of the chip mounting structure or the plastic package groove; specifically, when the second template is positioned above the first template, the opening of the plastic packaging groove faces upwards, and then the granular plastic packaging material is uniformly scattered in the plastic packaging groove; when the first template is positioned above the second template, the opening of the plastic packaging groove faces downwards, and then the granular plastic packaging materials are uniformly scattered on the chip and the carrier plate; optionally, the plastic packaging material is granular, flaky or liquid;
s4, heating to melt the plastic package material, closing the mold and curing, and then opening the mold; after the mold is opened, a plurality of second grooves which correspond to the positions of the cooling pins one by one exist on the plastic packaging layer formed after solidification.
The method can effectively reduce the internal stress of the package and reduce the warpage.
In the invention, when the die is closed, the cooling needle is positioned between two adjacent chips, so that the plastic package material part between the two adjacent chips can be rapidly cooled.
Further, during the compound die, the cooling needle is located adjacent two between the chip and the chip with between the lateral wall of plastic envelope groove to the realization is effectively dispelled the heat in order to reduce the internal stress at this position to the non-border position of plastic envelope material. The arrangement of the cooling pins is suitable for the condition that the distance between the chip and the side wall of the plastic packaging groove is large.
Further, be close to the lateral wall of plastic-sealed tank the cooling needle is nearest distance between the chip is 0.2 ~ 1.2mm, can dispel the heat fast to the plastic-sealed material of neighbouring chip to the realization is released away the internal stress of this position department fast.
Further, the height of the cooling pin is 80-90% of the solidified thickness of the molding compound, for example, 80%, 81%, 82%, 83%, 84%, 85%, 88%, or 90%, and the specific height depends on the solidified thickness of the molding compound.
Specifically, the cooling needle includes any one or two of a conical structure, a prismatic structure, a pyramidal structure or a rectangular parallelepiped structure, and the structure of the cooling needle is not limited to the structures described; when the cooling pins are in a conical structure, the conicity is 15-90 degrees, such as 15 degrees, 18 degrees, 19 degrees, 20 degrees, 22 degrees, 25 degrees, 30 degrees, 35 degrees, 40 degrees, 45 degrees, 50 degrees, 55 degrees, 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 85 degrees or 90 degrees, and the like, and when the cooling pins are in a conical structure, a plurality of cooling pins exist between two adjacent chips; when the cooling pins are in a rectangular parallelepiped structure, the length of the cooling pins is 80 to 110% of the length of the chip, for example, 80%, 81%, 82%, 83%, 85%, 88%, 90%, 92%, 95%, 98%, 100%, 102%, 103%, 105%, 107%, 109%, or 110%, and the specific length of the cooling pins depends on the length of the chip.
In the invention, the pressing and curing time of the plastic packaging material is 30-120 s, such as 30s, 31s, 32s, 35s, 38s, 40s, 45s, 50s, 55s, 60s, 65s, 70s, 75s, 80s, 85s or 90s, and the specific time is determined according to the thickness of the plastic packaging material, so that the plastic packaging material can be fully cured.
The invention also provides a plastic package mold which is applied to the method for reducing fan-out type packaging stress and comprises a first template and a second template which can be opened and closed, wherein one side of the first template, which is opposite to the second template, is provided with a plastic package groove, a plurality of cooling pins are arranged at intervals at the bottom of the plastic package groove, and the height of each cooling pin is smaller than the depth of the plastic package groove. When the injection mold is used for carrying out plastic package on a chip, the cooling needle penetrates into the plastic package material, so that the part of the plastic package material positioned in the middle of the chip and the part adjacent to the edge of the chip can be rapidly cooled, the internal stress of a chip plastic package structure can be released, and the warping is reduced.
The plastic packaging groove comprises a first groove and a step annularly arranged at the groove opening of the first groove, and the height of the cooling pin is smaller than the depth of the first groove, so that the phenomenon that the pressing of the plastic packaging material is affected due to the overlong cooling pin is prevented.
The plastic package mold further comprises a pull rod, wherein the pull rod is arranged on one side, away from the second template, of the first template and is positioned in the center of the plastic package groove. The first template and the second template can be quickly pressed together through the pull rod for curing.
The invention has the beneficial effects that: according to the invention, the cooling needle is additionally arranged at the bottom of the plastic packaging groove of the plastic packaging mold, when the mold is closed and solidified, the cooling needle extends into the plastic packaging material, and in the cooling process of the plastic packaging material, the cooling needle can accelerate the cooling speed inside the plastic packaging material, so that the cooling speed inside and outside the plastic packaging material is balanced, the cooling speed of the whole plastic packaging material is basically kept consistent, the internal stress of the plastic packaging material is reduced, and the warping of the fan-out chip packaging structure is effectively reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly described below. It is obvious that the drawings described below are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 is a flowchart of a method for reducing fan-out package stress according to a first embodiment of the present invention.
Fig. 2 is a schematic diagram of spreading the molding compound on the chip mounting structure corresponding to step S3 according to the first embodiment of the present invention.
Fig. 3 is a schematic diagram of the melted molding compound corresponding to step S4 in the first embodiment of the present invention.
Fig. 4 is a schematic diagram of mold clamping curing corresponding to step S4 according to the first embodiment of the present invention.
Fig. 5 is a schematic diagram of the opened mold corresponding to the step S4 in the first embodiment of the invention.
Fig. 6 is a schematic diagram of a fan-out chip package structure according to a first embodiment of the invention.
Fig. 7 is a schematic diagram of spreading the molding compound on the chip mounting structure in step S3 according to the second embodiment of the present invention.
Fig. 8 is a schematic diagram of the second embodiment of the present invention after the plastic package material corresponding to step S4 is melted.
Fig. 9 is a schematic diagram of mold clamping curing corresponding to step S4 in the second embodiment of the present invention.
Fig. 10 is a schematic diagram of the second embodiment of the present invention after the mold opening corresponding to step S4.
Fig. 11 is a schematic diagram of a fan-out chip package structure according to a second embodiment of the invention.
Fig. 12 is a schematic diagram of a fan-out chip package structure according to a third embodiment of the present invention.
1. A first template; 2. a second template; 3. a plastic packaging groove; 31. a first groove; 32. a step; 4. cooling the needle; 5. a pull rod;
10. a carrier plate; 20. plastic packaging material; 30. a chip; 40. a temporary bonding glue; 50. a second groove.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
Wherein the showings are for the purpose of illustration only and are shown by way of illustration only and not in actual form, and are not to be construed as limiting the present patent; to better illustrate the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar components; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inner", "outer", etc. are used for indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not indicated or implied that the referred device or element must have a specific orientation, be constructed in a specific orientation and be operated, and therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and are not to be construed as limitations of the present patent, and the specific meanings of the terms may be understood by those skilled in the art according to specific situations.
In the description of the present invention, unless otherwise explicitly specified or limited, the term "connected" or the like, if appearing to indicate a connection relationship between the components, is to be understood broadly, for example, as being fixed or detachable or integral; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through one or more other components or may be in an interactive relationship with one another. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 2 to 5 and fig. 7 to 10, the present invention provides a plastic package mold, which includes a first mold plate 1 and a second mold plate 2 that can be opened and closed, wherein a plastic package groove 3 is formed on a side of the first mold plate 1 facing the second mold plate 2, a plurality of cooling pins 4 are arranged at intervals at the bottom of the plastic package groove 3, and the height of the cooling pins 4 is smaller than the depth of the plastic package groove 3.
The plastic package groove 3 comprises a first groove 31 and a step 32 annularly arranged at the notch of the first groove 31, and the height of the cooling pin 4 is smaller than the depth of the first groove 31. When the mold is closed, the step 32 contacts with the carrier plate 10, and the first groove 31 contacts with the surface of the solidified molding compound 20.
Specifically, the height of the cooling pin 4 is 80-90% of the solidified thickness of the molding compound 20.
Optionally, the cooling needle 4 comprises any one or two of a conical structure, a prismatic structure, a pyramidal structure or a rectangular structure, and when the cooling needle 4 is in a conical structure, the taper of the cooling needle is 15-90 degrees; when the cooling pin 4 is a rectangular structure, the length of the pin is 80-110% of the length of the chip 30.
The plastic package mold further comprises a pull rod 5, and the pull rod 5 is arranged on one side, away from the second template 2, of the first template 1 and is positioned in the center of the plastic package groove 3; the opening and closing of the plastic package mold is realized by pushing and pulling the pull rod 5.
The pull rod 5 is located at the center of the groove bottom plate of the first template 1, and the groove bottom plate can move relative to the side wall of the plastic package groove 3 of the first template 1 by pushing and pulling the pull rod 5 to realize opening and closing of the plastic package mold.
The embodiment also provides a method for reducing fan-out type packaging stress, the plastic packaging mold is provided, a plurality of cooling pins 4 are convexly arranged at staggered positions of the bottom of a plastic packaging groove 3 of the plastic packaging mold and a chip 30 which is pre-packaged, the length of each cooling pin 4 is smaller than the depth of the plastic packaging groove 3, and the plastic packaging mold is adopted to carry out plastic packaging on the plurality of chips 30 attached to the carrier plate 10.
In the embodiment, the cooling needle 4 is additionally arranged at the bottom of the plastic package groove 3 of the plastic package mold, when the mold is closed and solidified, the cooling needle 4 extends into the plastic package material 20, and in the cooling and solidifying process of the plastic package material 20, the cooling needle 4 can accelerate the cooling speed inside the plastic package material 20, so that the cooling speed inside and outside the plastic package material 20 is balanced, the overall cooling speed of the plastic package material 20 is basically kept consistent, the internal stress of the plastic package material 20 is reduced, and the warping of the fan-out chip packaging structure is effectively reduced.
Next, the application of the mold of the present invention will be described in detail by the following specific application examples.
Example one
In this embodiment, as shown in fig. 1, the method for reducing the fan-out package stress specifically includes the following steps:
s1, providing the plastic package mold of the above embodiment, where the plastic package mold has a first mold plate 1 and a second mold plate 2 that can be opened and closed, where the first mold plate 1 is located above the second mold plate 2, and one side of the first mold plate 1, which faces the second mold plate 2, is provided with a plastic package groove 3, and the bottom of the plastic package groove 3 is provided with a plurality of cooling pins 4 with conical structures;
s2, providing a carrier plate 10 and four chips 30, and mounting the four chips 30 on the carrier plate 10 at intervals through temporary bonding glue 40 to obtain a chip mounting structure;
s3, placing the chip mounting structure on the second template 2 for adsorption and fixation, and uniformly scattering granular plastic package materials 20 on the chip mounting structure, as shown in FIG. 2;
s4, heating to melt the molding compound 20 (fig. 3), and mold closing and curing for 60S (fig. 4), then opening the mold, and the fan-out chip package structure after opening the mold is shown in fig. 5.
In this embodiment, four chips 30 are arranged in a 2 × 2 array, and when the mold is closed and cured, a plurality of cooling pins 4 with a conical structure are arranged between two adjacent chips 30 in each row and each column.
Further, when the mold is closed, the cooling pins 4 are positioned between two adjacent chips 30 and between the chips 30 and the side wall of the plastic package groove 3; specifically, the plurality of tapered cooling pins 4 are distributed in a matrix shape, and the number of the cooling pins 4 in the present embodiment is only for example, and the specific number depends on the size of the fan-out chip package structure.
As shown in fig. 6, the fan-out chip package structure after mold opening has a plurality of second grooves 50 with a tapered structure corresponding to the positions of the cooling pins 4 one by one.
Example two
The present embodiment is substantially the same as the above-described embodiments, except for the relative positions of the first template 1 and the second template 2.
Specifically, the method for reducing the fan-out package stress specifically comprises the following steps:
s1, providing the plastic package mold of the above embodiment, where the plastic package mold has a first mold plate 1 and a second mold plate 2 that can be opened and closed, where the second mold plate 2 is located above the first mold plate 1, and one side of the first mold plate 1 facing the second mold plate 2 is provided with a plastic package groove 3, and the bottom of the plastic package groove 3 is provided with a plurality of cooling pins 4 with conical structures;
s2, providing a carrier plate 10 and four chips 30, and mounting the four chips 30 on the carrier plate 10 at intervals through temporary bonding glue 40 to obtain a chip mounting structure;
s3, placing the chip mounting structure on the second template 2 for adsorption and fixation, and uniformly scattering granular plastic package materials 20 at the bottom of the plastic package groove 3, as shown in FIG. 7;
s4, heating to melt the molding compound 20 (fig. 8), and mold closing and curing for 60S (fig. 9), then opening the mold, and the fan-out chip package structure after opening the mold is shown in fig. 10.
In this embodiment, four chips 30 are arranged in a 2 × 2 array, and when the mold is closed and cured, a plurality of cooling pins 4 with a conical structure are arranged between two adjacent chips 30 in each row and each column.
Further, when the mold is closed, the cooling pins 4 are positioned between two adjacent chips 30 and between the chips 30 and the side wall of the plastic package groove 3; specifically, the plurality of tapered cooling pins 4 are distributed in a matrix shape, and the number of the cooling pins 4 in the present embodiment is only for example, and the specific number depends on the size of the fan-out chip package structure.
The fan-out chip package structure after mold opening has a plurality of second grooves 50 with conical structures corresponding to the positions of the cooling pins 4 one by one.
EXAMPLE III
The steps of the method for reducing the fan-out package stress in this embodiment are substantially the same as those in the first embodiment (refer to the drawings of the first embodiment, and the same component names follow the same reference numerals in the first embodiment), except that the cooling pin 4 has a rectangular parallelepiped structure, and detailed description is omitted.
In this embodiment, four chips are arranged in 2 × 2 array, when the dies are closed and cured, a cooling pin 4 having a rectangular parallelepiped structure is respectively disposed between two adjacent chips 30 in each row and each column, the four cooling pins 4 are arranged in a cross shape, and the length of the cooling pin 4 is consistent with the length of the chip 30.
Further, when the mold is closed, a cooling needle 4 is respectively arranged between two adjacent chips 30 of the cooling needle 4 and between the chip 30 and the side wall of the plastic package groove 3; specifically, 12 cooling pins 4 with a rectangular parallelepiped structure are distributed in a matrix shape.
As shown in fig. 11, the fan-out chip package structure after mold opening has a plurality of second grooves 50 with rectangular parallelepiped structures corresponding to the positions of the cooling pins 4 one by one.
Example four
The steps of the method for reducing the fan-out package stress in this embodiment are substantially the same as those in the first embodiment (refer to the drawings of the first embodiment, and the same component names follow the same reference numerals in the first embodiment), except that the cooling pins 4 having a rectangular parallelepiped structure and a tapered structure are added at the bottom of the plastic package groove 3, and detailed description is omitted.
In this embodiment, four chips are arranged in 2 × 2 array, when the dies are closed and cured, a cooling pin 4 having a rectangular parallelepiped structure is respectively disposed between two adjacent chips 30 in each row and each column, the four cooling pins 4 are arranged in a cross shape, and the length of the cooling pin 4 is consistent with the length of the chip 30.
Further, when the mold is closed, cooling pins 4 of a cuboid structure are respectively arranged between two adjacent chips 30 and between the chips 30 and the side wall of the plastic packaging groove 3, that is, the cooling pins 4 of 12 cuboid structures are distributed in a shape like a Chinese character tian, and 1 cooling pin 4 of a conical structure is further arranged at the central position of the cooling pin 4 distributed in the shape like a Chinese character tian.
In the embodiment, the cooling needles 4 of the cuboid structure and the cooling needles 4 of the conical structure are arranged at the bottom of the plastic package groove 3 in a mixed manner, and the cooling needles 4 of the two structures are combined to fully dissipate heat of the middle position of the plastic package material 20, so that the middle position of the plastic package material 20 is rapidly cooled to reduce internal stress and reduce warpage.
As shown in fig. 12, the fan-out chip package structure after mold opening has a plurality of second grooves 50 corresponding to the positions of the cooling pins 4 one by one.
It should be understood that the above-described embodiments are merely preferred embodiments of the invention and the technical principles applied thereto. It will be understood by those skilled in the art that various modifications, equivalents, changes, and the like can be made to the present invention. However, such variations are within the scope of the invention as long as they do not depart from the spirit of the invention. In addition, certain terms used in the specification and claims of the present application are not limiting, but are used merely for convenience of description.
Claims (9)
1. A method for reducing fan-out type packaging stress is characterized in that a plastic packaging mold is provided, a plurality of cooling pins are convexly arranged at staggered positions of the bottom of a plastic packaging groove of the plastic packaging mold and a chip to be subjected to plastic packaging in advance, the length of each cooling pin is smaller than the depth of the corresponding plastic packaging groove, and the plastic packaging mold is adopted to carry out plastic packaging on the plurality of chips attached to a carrier plate, and the method comprises the following steps:
s1, providing the plastic package mold, wherein the plastic package mold is provided with a first mold plate and a second mold plate which can be opened and closed, one side of the first mold plate, which is opposite to the second mold plate, is provided with a plastic package groove, and the bottom of the plastic package groove is additionally provided with a plurality of cooling needles;
s2, providing the carrier plate and the chips, and mounting the chips on the carrier plate at intervals through temporary bonding glue to obtain a chip mounting structure;
s3, placing the chip mounting structure on the second template for adsorption and fixation, and uniformly scattering a plastic package material on the bottom of the chip mounting structure or the plastic package groove;
and S4, heating to melt the plastic package material, combining the plastic package material with the mould and solidifying the plastic package material, and then opening the mould.
2. The method of reducing fan-out package stress of claim 1, wherein the cooling pins are positioned between two adjacent chips when the dies are closed.
3. The method for reducing the stress of the fan-out package according to claim 1, wherein the cooling pins are located between two adjacent chips and between the chips and the side wall of the plastic groove when the mold is closed, and the distance between the cooling pin adjacent to the side wall of the plastic groove and the chip closest to the cooling pin is 0.2-1.2 mm.
4. The method for reducing the fan-out package stress of claim 1, wherein the height of the cooling pins is 80-90% of the cured thickness of the molding compound.
5. The method for reducing the fan-out package stress according to claim 4, wherein the cooling pin comprises any one or two of a conical structure, a prismatic structure, a pyramidal structure or a rectangular parallelepiped structure, and when the cooling pin is in the conical structure, the taper angle is 15-90 degrees; when the cooling pin is of a cuboid structure, the length of the cooling pin is 80-110% of the length of the chip.
6. The method for reducing the fan-out package stress as claimed in claim 1, wherein the time for the press curing of the molding compound is 30-120 s.
7. A plastic package mold applied to the method for reducing fan-out package stress of any one of claims 1 to 6, comprising a first mold plate and a second mold plate which can be opened and closed, wherein a plastic package groove is formed in one side, opposite to the second mold plate, of the first mold plate, and a plurality of cooling pins are arranged at intervals at the bottom of the plastic package groove, and the height of each cooling pin is smaller than the depth of the plastic package groove.
8. The plastic package mold according to claim 7, wherein the plastic package groove comprises a first groove and a step annularly arranged at a notch of the first groove, and the height of the cooling pin is smaller than the depth of the first groove.
9. The plastic package mold according to claim 7, further comprising a pull rod disposed on a side of the first mold plate away from the second mold plate and located at a center of the plastic package groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911260003.8A CN111128765B (en) | 2019-12-10 | 2019-12-10 | Method for reducing fan-out type packaging stress and plastic packaging mold applied by same |
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| CN114171507B (en) * | 2021-11-16 | 2025-03-04 | 甬矽电子(宁波)股份有限公司 | Wafer-level fan-out packaging method and wafer-level fan-out packaging structure |
| CN114055711B (en) * | 2021-11-18 | 2024-05-28 | 江苏芯德半导体科技有限公司 | Chip plastic package mold and secondary plastic package process method thereof |
| CN114683495B (en) * | 2022-04-02 | 2025-04-15 | 广东台进半导体科技有限公司 | A plastic sealing mold and its opening and closing structure and use method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8148803B2 (en) * | 2002-02-15 | 2012-04-03 | Micron Technology, Inc. | Molded stiffener for thin substrates |
| CN105321894A (en) * | 2014-07-08 | 2016-02-10 | 矽品精密工业股份有限公司 | Semiconductor package and fabrication method thereof |
| CN108257882A (en) * | 2018-01-17 | 2018-07-06 | 中芯集成电路（宁波）有限公司 | The method of stress release in device encapsulation structure and encapsulation process |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8148803B2 (en) * | 2002-02-15 | 2012-04-03 | Micron Technology, Inc. | Molded stiffener for thin substrates |
| CN105321894A (en) * | 2014-07-08 | 2016-02-10 | 矽品精密工业股份有限公司 | Semiconductor package and fabrication method thereof |
| CN108257882A (en) * | 2018-01-17 | 2018-07-06 | 中芯集成电路（宁波）有限公司 | The method of stress release in device encapsulation structure and encapsulation process |
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Denomination of invention: A method for reducing fan out packaging stress and its applied plastic packaging die Effective date of registration: 20211229 Granted publication date: 20211029 Pledgee: Guangdong Shunde Rural Commercial Bank Co.,Ltd. science and technology innovation sub branch Pledgor: Guangdong fozhixin microelectronics technology research Co.,Ltd.|Guangdong Xinhua Microelectronics Technology Co.,Ltd. Registration number: Y2021980016930 |
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Effective date of registration: 20230813 Address after: Room A107, scientific research building, block a, neifo high tech think tank center, Nanhai Software Science Park, Shishan town, Nanhai District, Foshan City, Guangdong Province, 528225 Patentee after: Guangdong fozhixin microelectronics technology research Co.,Ltd. Address before: Room A107, scientific research building, block a, neifo high tech think tank center, Nanhai Software Science Park, Shishan town, Nanhai District, Foshan City, Guangdong Province, 528225 Patentee before: Guangdong fozhixin microelectronics technology research Co.,Ltd. Patentee before: Guangdong Xinhua Microelectronics Technology Co.,Ltd. |